JP2002134745A5 - - Google Patents

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Publication number
JP2002134745A5
JP2002134745A5 JP2000326143A JP2000326143A JP2002134745A5 JP 2002134745 A5 JP2002134745 A5 JP 2002134745A5 JP 2000326143 A JP2000326143 A JP 2000326143A JP 2000326143 A JP2000326143 A JP 2000326143A JP 2002134745 A5 JP2002134745 A5 JP 2002134745A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000326143A
Other languages
Japanese (ja)
Other versions
JP2002134745A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000326143A priority Critical patent/JP2002134745A/en
Priority claimed from JP2000326143A external-priority patent/JP2002134745A/en
Publication of JP2002134745A publication Critical patent/JP2002134745A/en
Publication of JP2002134745A5 publication Critical patent/JP2002134745A5/ja
Pending legal-status Critical Current

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JP2000326143A 2000-10-25 2000-10-25 Manufacturing method of semiconductor device Pending JP2002134745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000326143A JP2002134745A (en) 2000-10-25 2000-10-25 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000326143A JP2002134745A (en) 2000-10-25 2000-10-25 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JP2002134745A JP2002134745A (en) 2002-05-10
JP2002134745A5 true JP2002134745A5 (en) 2007-02-22

Family

ID=18803383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000326143A Pending JP2002134745A (en) 2000-10-25 2000-10-25 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JP2002134745A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100869340B1 (en) * 2002-07-19 2008-11-19 주식회사 하이닉스반도체 Method for fabricating dual gate electrode in semiconductor device
JP2004172259A (en) 2002-11-19 2004-06-17 Oki Electric Ind Co Ltd Method for manufacturing semiconductor element
KR100609942B1 (en) * 2004-01-09 2006-08-08 에스티마이크로일렉트로닉스 엔.브이. Method of manufacturing flash memory cell

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864808A (en) * 1994-08-19 1996-03-08 Toshiba Corp Semiconductor device and its manufacture
JP3543504B2 (en) * 1996-08-06 2004-07-14 ソニー株式会社 Method for manufacturing semiconductor device
JPH1098004A (en) * 1996-09-20 1998-04-14 Hitachi Ltd Semiconductor device and manufacture thereof
JP3564908B2 (en) * 1996-12-24 2004-09-15 ソニー株式会社 Method for manufacturing semiconductor device
JPH10261792A (en) * 1997-03-18 1998-09-29 Hitachi Ltd Semiconductor device and its manufacture
JP3191287B2 (en) * 1998-07-31 2001-07-23 日本電気株式会社 Semiconductor device and method of manufacturing the same
KR100329769B1 (en) * 1998-12-22 2002-07-18 박종섭 method for forming titanium polycide gate electrode
KR100327432B1 (en) * 1999-02-22 2002-03-13 박종섭 Method for forming metalline of semiconductor device

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