JP2002128950A - Process for decomposition treatment of article containing thermosetting resin cured product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simple process for the decomposition treatment of an article containing a thermosetting resin cured product by suppressing the rise in the pressure of a decomposition vessel on the decomposition reaction in order to reutilize thermosetting resins and other constituting elements and make them into resources again. SOLUTION: The process for the decomposition treatment of an article containing a thermosetting resin cured product comprises a decomposition step of bringing the article 1 containing a thermosetting resin cured product into contact with a decomposer material 2 which decomposes the thermosetting resin cured product in a decomposition vessel 3 at a temperature of >=200 deg.C to decompose the thermosetting resin cured product, and conducts a water distilling step of distilling water by heating the article 1 prior to the decomposition step.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for decomposing a product using, as a binder, a thermosetting composition which is excellent in strength and heat resistance and widely used for industrial materials.

[0002]

2. Description of the Related Art Conventionally, thermosetting resins such as unsaturated polyester resins, epoxy resins and phenolic resins are easy to mix with fillers and additives such as inorganic substances, and are easily reinforced by fibers. It is applied to laminates, adhesives and paints. This thermosetting resin is cross-linked into a three-dimensional shape by a curing reaction, and generally becomes an insoluble and infusible solid. For this reason, it is difficult to decompose the cured thermosetting resin, and it has been discarded as unsuitable for regeneration treatment and reuse.

However, as the problem of waste has been attracting attention in recent years, it has become necessary to develop a technique for recycling and recycling thermoset resin cured products, and the use of raw materials by thermal decomposition has begun to be studied. For example, fiber-reinforced unsaturated polyester resins and the like are frequently used in the production of large products such as fishing boats, tanks, and housing equipment, and the waste problem is serious. However, there has been a problem that advantages such as hardness, strength, heat resistance, flame retardancy and chemical resistance of the cured thermosetting resin have made the disposal of waste difficult from a technical point of view.

[0004] Further, thermosetting resins are often used as structural materials because of their high strength, but are often found to further include materials such as metals. Since such metals and the like are more expensive than thermosetting resins, it can be said that their importance in recycling and reuse is great. But,
Despite their small size, copper-clad laminates and IC (integrated circuit) molds using epoxy resin and phenolic resin as binders contain noble metals such as copper, gold and silver, in addition to paper and fibers. I have. That is, separation of metal is required together with decomposition treatment of the thermosetting resin.

In such a situation, Japanese Patent Laid-Open No. 2000-2000
In 198877, a step of contacting a product containing a thermosetting resin with a decomposition solution containing a solvent capable of decomposing the thermosetting resin in a decomposition tank, wherein the decomposition solution is at least 250 ° C. and less than the critical temperature of the solvent. A decomposition treatment method including a step of heating to a temperature is disclosed. In this technique, a main chain and / or a three-dimensional crosslinked chain of a cured thermosetting resin is cut by bringing a product containing the cured thermosetting resin into contact with a decomposition solution containing the solvent. When the cured thermosetting resin is decomposed, the function of the thermosetting resin as a binder decreases and collapses. That is, the cured thermosetting resin cannot retain the filler, the base material, the additives, and the like bound by the curing, and the separation of the thermosetting resin component from other components becomes easy. This technology makes it possible to reduce the volume of products and to separate and recover metals.

[0006]

However, since these products are used products or products generated as defective products in the process, they often contain water in the process of being recovered, and the products often contain phenolic resin or the like. In some cases, water is produced during the pyrolysis process. In such a case, JP-A-2000-19
In the method disclosed in Japanese Patent No. 8877, 25
Since the method includes a step of heating at 0 ° C. or higher, there is a problem that the pressure in the decomposition tank rapidly increases due to the generated water, and the handling becomes difficult.

[0007] In view of the above facts, the present invention provides a method for reusing and recycling thermosetting resin and other components from a product containing a cured thermosetting resin. An object of the present invention is to provide a simple decomposition treatment method for a product containing a cured thermosetting resin by suppressing a pressure increase in a decomposition tank.

[0008]

According to the present invention, a product containing a cured thermosetting resin is brought into contact with a decomposition material for decomposing the cured thermosetting resin at a temperature of 200 ° C. or more in a decomposition tank. A decomposition treatment method comprising a decomposition step of decomposing the cured thermosetting resin, wherein a water distillation step of distilling water by heating the product to 100 ° C. or higher is performed before the decomposition step. The above object has been achieved by a method for decomposing a product containing a cured thermosetting resin.

Further, the present invention relates to a thermosetting resin, wherein a product containing a cured thermosetting resin is brought into contact with a decomposition material for decomposing the thermosetting resin at a temperature of 200 ° C. or more in a decomposition tank. A decomposition treatment method including a decomposition step of decomposing a resin cured product, characterized in that an azeotropic mixture-forming substance with water is added to the decomposition tank and water generated in the decomposition tank is distilled off. The object has been achieved by a method for decomposing a product containing a cured thermosetting resin.

[0010] The present invention also relates to a thermosetting resin, wherein a product containing a cured thermosetting resin is brought into contact with a decomposition material for decomposing the cured thermosetting resin at a temperature of 200 ° C or higher in a decomposition tank. A decomposition treatment method including a decomposition step of decomposing a resin cured product, wherein a moisture absorbent absorbs and removes moisture generated in the decomposition tank, wherein the product contains a thermosetting resin cured product. The above object was achieved by the method.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a product containing a cured thermosetting resin which is an object of the present invention will be described. The product containing the cured thermosetting resin to be subjected to the decomposition treatment method of the present invention uses the thermosetting resin as a binder. That is, the thermosetting resin is compounded with the filler, the base material and the additives,
It is cured by a curing reaction of a thermosetting resin.

Examples of such a thermosetting resin include unsaturated polyester resin, phenol resin, epoxy resin, polyurethane resin, melamine resin, urea resin and the like. The production method and conditions for these thermosetting resins are not particularly limited. For example, the polymerization ratio of the monomer components is also arbitrary.

[0013] Examples of products using an unsaturated polyester resin as a binder include BMC (bulk molding compo- tor) containing a filler, a thickener, a release agent, a wax, a coloring agent, and the like.
und), molding products such as SMC (Sheet Molding Compound), lining materials including glass and other flakes and fibers, paints including wax, putty including fillers, aggregates, fillers, etc. Resin concrete,
Examples include artificial marble to which fillers and pigments are added, foams to which foaming agents are added, and adhesives to which curing accelerators, stabilizers and the like are added. Further, the thermosetting resin may be used as a bulk molding material, and a sheet-like SMC,
Or granular PMC (Pelletized typeMolding Compoun
d).

Products using a urea resin, a melamine resin, or a polyurethane resin as a binder include moldings, adhesives, paints, etc. to which fillers, base materials, additives, etc. are added in the same manner as the unsaturated polyester resin. can give.

Examples of products using a thermosetting resin such as a phenol resin, an epoxy resin, an unsaturated polyester resin, and polyimide as a binder include, in addition to the same products as the above-mentioned cured resin used as a binder, glass products. Resin laminates obtained by laminating prepregs obtained by impregnating each resin component with woven or non-woven fabric, cotton cloth, asbestos, etc. of fibers, polyamide fibers, aramid fibers, acrylic fibers or polyester fibers Can be
This resin laminate may be a copper-clad laminate if further laminated with a copper foil coated with an adhesive. Also,
It may be a printed wiring board on which a conductor pattern is formed, or a printed circuit board further mounted with electronic components on the printed wiring board (in the present invention, a copper-clad laminate, a printed wiring board,
The expression printed circuit board is used, including printed circuit boards.) In these cases, according to the decomposition treatment method of the present invention, not only the thermosetting resin in the laminated board portion but also the thermosetting resin used in the resist portion and components are similarly decomposed.

The products to be subjected to the decomposition treatment of the present invention include, for example, construction materials such as bathtubs, toilet tubs, water tanks and wash basins, household goods such as chairs, desks and furniture, tiles, artificial marbles and pipes. Civil engineering materials, ships, automobiles,
Examples include bodies and parts of transportation equipment such as railways and aircraft, housing equipment, decorative boards, and decorative articles. Also,
The form and shape of the thermosetting resin in these products are not limited, and may be used as paints, putties, adhesives and the like. In addition, used home appliances such as televisions, stereos, microwave ovens, and facsimile machines, and parts include printed circuit boards, molded motors including metal members such as windings and cores made of copper and iron, molded transformers, semiconductor elements, The present invention can be widely applied to molded electronic components such as IC components in which a lead frame or the like is sealed with a thermosetting resin. In particular, since various types of components are mounted on the printed circuit board and contain various types of metal components and resin components, and also contain heavy metals such as lead, which is an environmentally harmful substance, it is possible to efficiently separate metal materials. The application of the invention is effective. In this case, a target includes a device including a printed circuit board, a printed circuit board extracted from the device, a printed circuit board generated in a manufacturing process, and the like. The copper clad laminate in which copper foil is clad in a resin laminate, a printed wiring board in which printed wiring is applied to a copper clad laminate, and a printed circuit board in which components are mounted on a printed wiring board are all of the present invention. The subject.

The decomposition material is not particularly limited as long as it is a material that decomposes the thermosetting resin, and the decomposition parameter (Polymer Engen) indicated by Fedors is used.
eering Science Vol.14 p.147 p.1
(974) is not less than 18 (MJ / m ³ ) ^1/2, which is preferable because the effect of decomposing the thermosetting resin is large. For example, hydrocarbons, alcohols, ketones, ethers, esters, carbonates, phenols, organic acids, or acid anhydrides are used. When incineration is considered as a method of disposing of the decomposed material after use, it is preferable that the decomposed material is composed of only carbon, hydrogen, and oxygen from the viewpoint of reducing the burden of exhaust gas treatment in the incineration process. Further, in consideration of increasing the vapor pressure of the decomposition material in the decomposition step, a material having a low vapor pressure of 140 ° C. or higher is preferable.

The decomposed material preferably contains an antioxidant or a reducing agent, in addition to the above-mentioned materials, in order to more reliably prevent the oxidative deterioration of the decomposed material and the metal contained in the product. As such an antioxidant or a reducing agent, for example, hydroquinone, methoquinone, benzoquinone, and the like are preferable because they have good solubility in decomposed materials and a high effect of preventing oxidation (deterioration) of decomposed materials and metals. Examples include at least one selected from the group consisting of naphthoquinone, butylcatechol, butylhydroquinone, sodium hypophosphite, sodium thiosulfate, and ascorbic acid. Also, among these,
Hydroquinone and methoquinone are preferred because of their excellent antioxidant ability. These antioxidants or reducing agents are
In terms of exhibiting antioxidant and reducing functions,
The amount may be 0.2 to 10 parts by weight with respect to 100 parts by weight of the solvent in the decomposed material, but is preferably 1 to 5 parts by weight from the viewpoint of the dissolution stability of the decomposed material.

In the present invention, the contact between the product containing the cured thermosetting resin and the decomposed material is performed at a temperature of 200 ° C. or higher. The higher the temperature at the time of contact, the higher the decomposition reaction rate is obtained, but if the temperature is too high, the pressure will be too high and a high pressure resistance is required for the decomposition tank, and the amount of gas generated by decomposition will increase. The temperature of the decomposed material is preferably lower than the critical temperature of the decomposed material because its recovery becomes difficult and decomposition of the decomposed material can occur.

The product containing the cured thermosetting resin and the decomposed material may be brought into contact with each other in either a case where the decomposed material is brought into contact in a liquid phase or a case where the decomposed material is brought into contact in a gas phase. When the contact is made in the liquid phase, the product is directly immersed in the liquid phase of the decomposition material, or a liquid of the decomposition material is sprayed on the product. On the other hand, when contacting in the gaseous phase, the product is separated from the liquid phase of the decomposition material and the product is exposed to an atmosphere containing the decomposition material vapor, or the decomposition material vapor is sprayed on the product. I do.

The decomposition material of the present invention has high stability at high temperatures and rarely generates oxygen by its own decomposition and induces oxidation of metals and the like contained in the cured resin. However, a pretreatment step such as oxygen elimination is not necessarily required. However, in cases where slight oxidation of metals or the like contained in the cured resin becomes a problem, or in order to prolong the life of the decomposed material, a pretreatment step such as oxygen exclusion may be provided. That is, it is preferable to eliminate oxygen in the decomposition tank before bringing the product containing the cured thermosetting resin into contact with the decomposition material. This step can be performed by a conventional method. For example, a gas introduction pipe and an exhaust valve may be provided in a decomposition tank charged with the product and the decomposition material, and the gas may be directly supplied from a nitrogen gas cylinder. Further, the gas in the decomposition tank may be exhausted by reducing the pressure. To reduce the pressure, for example, an exhaust valve is provided in a decomposition tank charged with the product and the decomposition solution,
What is necessary is just to pipe | connect a vacuum pump. The degree of pressure reduction at this time is preferably as close to vacuum as possible. Preferably 0.
001 MPa or less. Furthermore, in any of the methods, the efficiency of oxygen exclusion can be increased by stirring the decomposition material or heating it appropriately. Preferably, both of these methods are employed, and any method may be used as long as oxygen in the decomposition tank can be exhausted.For example, the gas in the decomposition tank is replaced with nitrogen gas.
Next, the inside of the decomposition tank is preferably depressurized by exhausting nitrogen gas. As described above, by performing the decomposition treatment after the pretreatment for removing oxygen, oxidation, which is the main cause of degradation of the decomposition liquid during the high-temperature reaction treatment, is prevented, the life of the decomposition liquid is extended, and the reusability is improved. Further, it is possible to prevent the deterioration of metals contained in the product by oxidation and the like, and to improve the quality of materials separated and recovered.

(Embodiment 1) Embodiment 1 of the present invention will be described.

In the first embodiment of the present invention, the product contains moisture in the recovery process of the target product or the like, or contains a material (such as a phenol resin) that generates water by a dehydration reaction in the pyrolysis process. It is especially effective when you do. Since the decomposition step is performed at a temperature of 200 ° C. or higher, the vapor pressure of water becomes considerably high. When a closed vessel is used as the decomposition tank, the pressure in the decomposition tank is rapidly increased in the decomposition step performed at a temperature of 200 ° C. or higher. Because of the rise, it was not preferable in handling. In addition, by providing a reflux tower in the decomposition tank, the water is refluxed in the reflux tower and the pressure rise in the decomposition tank is suppressed, but the boiling point of water is 100 ° C. and the decomposition step is sufficiently lower than the temperature of 200 ° C. However, water condensed and dropped in the reflux tower evaporates locally in the heated decomposition tank, and the state in the decomposition tank becomes unstable, which is not preferable.

In the configuration of the first embodiment of the present invention, the moisture contained in the product evaporates in a short time from 100 ° C. or higher, while
In view of the fact that water generated by thermal decomposition is also generated up to 300 ° C. in a short time, a water distilling step of heating the product to 100 ° C. or more to distill water is performed before the decomposing step.
While the decomposition tank is heated to 100 ° C. or higher, the water is discharged to the atmosphere without condensing the water to perform a water distillation step. When the temperature at which water is discharged in the water removal step is lower than the boiling point of the decomposition material, the decomposition material can be charged together with the product into the decomposition tank to perform the water removal step. On the other hand, if the temperature at which water is discharged in the water distillation step is higher than the boiling point of the decomposition material, only the product is put into the decomposition tank to perform the water distillation step, and then the decomposition material is charged to decompose. It is desirable to perform a step.

In FIG. 1, the decomposition tank 3 becomes a closed vessel by closing the valve 9. However, a configuration in which a reflux tower is provided in the decomposition tank 3 is also applicable.

The embodiment was performed with the configuration as shown in FIG.
As a product 1 containing a cured thermosetting resin, a printed circuit board in which electronic components were mounted on a printed wiring board on which a conductive pattern was formed by laminating and curing a phenol resin and a copper foil using paper as a base material was used. As the decomposition material 2, triethylbiphenyl (boiling point: 340 ° C.) was used. In the water removing step, only the product 1 was put into the decomposition tank 3, and the temperature of the product 1 was kept at 280 ° C. by the heating means 4 for 10 minutes. At this time, the valve 6 was opened, and the water generated by thermal decomposition from the phenol resin could be discharged from the decomposition tank 3 to the outside of the system. When the water removal process is completed, the decomposition tank 3
The decomposition material 2 was supplied. Thereafter, the valve 6 was closed, the decomposition material 2 was heated by the heating means 4 so that the temperature of the decomposition material 2 became 300 ° C., and the temperature was maintained for 1 hour to perform the decomposition step. During the decomposition process, there was no generation of water due to the decomposition, so that the pressure in the decomposition tank 3 did not rise rapidly. After that, the decomposition tank was cooled and the treated printed wiring board was taken out. As a result, most of the phenol resin was decomposed from the printed circuit board, and the wiring copper and electronic components could be recovered.

(Embodiment 2) Embodiment 2 of the present invention will be described.

In the second embodiment, as in the first embodiment, a material containing water in a product recovery process or the like, or a material (such as a phenol resin) that generates water by a dehydration reaction in a thermal decomposition process, as in the first embodiment. ) Is particularly effective when included in products. Therefore, in the first embodiment, a product containing a cured thermosetting resin and a decomposition material that decomposes the cured thermosetting resin are brought into contact in a decomposition tank at a temperature of 200 ° C. or more to cure the thermosetting resin. A decomposition treatment method comprising a decomposition step of decomposing a substance, wherein an azeotropic mixture-forming substance with water is added to the decomposition tank to distill off water generated in the decomposition tank. The generated water can be efficiently removed by the decomposition method.

It is desirable to add a substance forming an azeotrope with water into the decomposition tank and reduce the boiling point of the water generated in the decomposition tank to distill off the generated water. The substance forming an azeotrope with water is not particularly limited, and examples thereof include ethanol, methyl ethyl ketone, ethyl acetate, 1,4-dioxane, 2,5-dimethylfuran, toluene, hexane, and benzene.

The embodiment was performed with the configuration as shown in FIG. As the product 1, a printed circuit board having electronic components mounted on a printed wiring board on which a conductive pattern was formed by laminating and curing a phenol resin and a copper foil using paper as a base material was used. Ethyl biphenyl (boiling point 286 ° C.) was used as decomposition material 2. The product 1 and the decomposition material 2 were put into the decomposition tank 3 and maintained for 1 hour while the temperature of the product 1 was heated to 300 ° C. by the heating means 4. During this time, when the water generated by the decomposition of the phenolic resin in the product 1 is cooled and condensed in the reflux pipe 5 and returns to the high-temperature decomposition tank 3 again, the rapidly condensed water vaporizes and the inside of the decomposition tank 3 becomes unstable. The situation had continued. Then, by supplying toluene as an azeotrope-forming substance with water from the azeotrope-forming substance supply means 7, the water was distilled off together with the toluene, and the state in the decomposition tank 3 was stabilized. Thereafter, the decomposition bath was cooled and the treated printed wiring board was taken out. As a result, most of the phenolic resin was decomposed and removed from the printed circuit board, and the wiring copper and electronic components could be recovered.

(Embodiment 3) Embodiment 3 of the present invention will be described.

In the third embodiment, similarly to the second embodiment, a material (such as phenolic resin) that contains water in a product in a recovery process of a target product or generates water by a dehydration reaction in a pyrolysis process. ) Is particularly effective when included in products. Therefore, in the third embodiment, a product containing a cured thermosetting resin and a decomposition material that decomposes the cured thermosetting resin are brought into contact with each other at a temperature of 200 ° C. or more in a decomposition tank to form the thermosetting resin. A decomposition treatment method including a decomposition step of decomposing a cured resin, wherein the water generated in the decomposition tank is absorbed and removed by a water absorbent, whereby the generated water is efficiently removed. Can be removed.

As shown in FIG. 3, by providing a water removing means 8 containing a substance for absorbing and removing moisture, moisture generated in the decomposition tank 3 can be absorbed and removed. Substances that absorb and remove water include calcium oxide, calcium chloride,
Sodium sulfate, magnesium sulfate, calcium sulfate,
Examples include sodium carbonate, activated alumina, silica gel, and molecular sieve. Although the reflux tower 5 is used in FIG. 3, when a closed vessel without the reflux tower 5 is used as the decomposition tank 3, the water removing means 8 is provided in the decomposition tank 3.
Is provided.

The embodiment was performed with the configuration as shown in FIG. As a product 1 containing a cured thermosetting resin, a printed circuit board in which electronic components were mounted on a printed wiring board on which a conductive pattern was formed by laminating and curing a phenol resin and a copper foil using paper as a base material was used. As the decomposition material 2, tetralin (boiling point: 208 ° C.) was used. The water removing means 8 was filled with calcium oxide. After the whole product 1 is put into the decomposition tank 3 while being in contact with the liquid of the decomposition material 2, the decomposition material 2 is heated to 400 ° C. by the heater as the heating means 4 and maintained at that temperature for 1 hour. To perform a decomposition step.
The temperature of the calcium oxide in the water removing means 8 is 110
° C. During the decomposition step, the water generated by thermal decomposition from the phenolic resin was absorbed by the water removing means 8 and no water was condensed and dropped into the decomposition tank 3, so that the water did not evaporate locally in the decomposition tank 3. The state was stable. Thereafter, the decomposition bath was cooled and the treated printed wiring board was taken out. As a result, most of the phenolic resin was decomposed and removed from the printed circuit board, and the wiring copper and electronic components could be recovered.

In the present invention, when the decomposed material is refluxed using the reflux tower, the non-condensable gas discharged from the decomposition tank 3 is discharged from the decomposition tank through the reflux tower. It is desirable to have exhaust gas purifying means for purifying.

As the exhaust gas treatment means, means conventionally used as appropriate according to the components of the exhaust gas is used. There are a scrubber for absorbing the exhaust gas into the spray liquid, an adsorption tank for adsorbing the gas to an adsorbent such as activated carbon, and a violent tank for ejecting and absorbing the exhaust gas into the liquid, and these can be used repeatedly. Decomposition reactors that can perform gas decomposition reactions can be used, and there are combustion reactors that use flame combustion or catalytic combustion, and catalytic reaction furnaces that fill a decomposition catalyst and also react lean gas. It can be arbitrarily selected and used according to the convenience.

In the present invention, the amount of the non-condensable gas discharged from the decomposition tank varies according to the progress of the decomposition reaction of the cured thermosetting resin contained in the product, and the amount of the generated gas itself is also compared. It is a very small amount. For this reason, by using a gas combustion reactor as the exhaust gas treatment means and providing a gas adsorption means and a heating means for heating it between the reflux tower and the exhaust gas treatment means, the generated non-condensable gas is once adsorbed by the gas. After a predetermined amount of non-condensable gas is adsorbed and concentrated by the means, the desorption reaction is performed by the heating means, and the non-condensable gas is combusted and purified by the exhaust gas treatment means, thereby efficiently purifying the exhaust gas.
As the gas adsorption means, a general adsorbent such as activated carbon or zeolite is used.

[0038]

As described above, by using the decomposition method and the decomposition apparatus according to the present invention, it is possible to easily decompose the product containing the cured thermosetting resin while suppressing the pressure rise in the decomposition tank during the decomposition reaction. it can.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing the configuration of a device for decomposing a product containing a thermosetting resin cured product of the present invention.

FIG. 2 is a schematic diagram showing another configuration of a device for decomposing a product containing a cured thermosetting resin of the present invention.

FIG. 3 is a schematic view showing another configuration of a device for decomposing a product containing a cured thermosetting resin of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Product 2 Decomposition material 3 Decomposition tank 4 Heating means 5 Reflux tower 6 Valve 7 Supply means of azeotrope-forming substance with water 8 Water removal means

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takahiko Terada 1006 Kadoma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. 72) Inventor Hiroshi Onishi 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term (reference) 4D052 AA00 CE00 HA00 HA01 HA02 HA05 HA07 HA08 HA11 HA12 4D076 AA14 AA24 BB08 BC03 EA04Z EA12Z FA03 FA12 FA15 GA03 HA03 JA02 4F301 AA22 AA23 AA24 AA25 AA29 CA09 CA23 CA41 CA52 CA61 CA72

Claims (3)

[Claims] 1. A product containing a cured thermosetting resin and a decomposition material for decomposing the cured thermosetting resin are separated in a decomposition tank in a decomposition tank.
A decomposition treatment method comprising a decomposition step of decomposing the cured thermosetting resin by contacting at a temperature of 00 ° C. or higher, wherein the water distilling step of distilling water by heating the product to 100 ° C. or higher. A method for decomposing a product containing a cured thermosetting resin, which is performed before the decomposing step. 2. A product containing a thermosetting resin cured product and a decomposition material for decomposing the thermosetting resin cured product are separated in a decomposition tank.
A decomposition treatment method comprising a decomposition step of decomposing the cured thermosetting resin by contacting at a temperature of 00 ° C. or more, wherein an azeotrope-forming substance with water is added to the decomposition tank, A method for decomposing a product containing a cured thermosetting resin, wherein water generated in the product is distilled off. 3. A product containing a cured thermosetting resin and a decomposition material for decomposing the cured thermosetting resin are separated into two in a decomposition tank.
A decomposition treatment method comprising a decomposition step of decomposing the cured thermosetting resin by contacting at a temperature of 00 ° C. or higher, wherein water generated in the decomposition tank is absorbed and removed by a water absorbent. Of a product containing a cured thermosetting resin.