JP2002127165A - Method for manufacturing polyimide molded object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for enhancing the toughness of a polyimide belt used in an electrophotographic apparatus such as a laser beam printer or a facsimile. SOLUTION: A tertiary amine compound is mixed with a solution of a polyimide precursor of which the resin characteristics after molding and imidation are controlled by introducing an inorganic powder such as a metal filler, carbon black or the like into polyimide, and the resulting mixture is molded into a belt shape to be dried and imidated to manufacture the polyimide belt. By this method, the toughness of the polyimide belt controlled in its resin characteristics can be enhanced in an extremely simple manner.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyimide molding, a belt made of a polyimide resin, and a method for producing the same.

[0002]

2. Description of the Related Art Polyimide resins have excellent heat resistance, dimensional stability, mechanical strength, and chemical stability, and are used in various applications such as flexible printed circuit boards and heat-resistant wire insulation materials. In addition, the belt-shaped molded product can be used in an electrophotographic apparatus such as a copying machine or a laser beam printer, an inkjet printer or a bubble jet (registered trademark).
Attention has been focused on its use as a printer component. For example, among belt-shaped molded products used in electrophotographic devices, high pressure is applied to belts for paper conveyance and toner transfer, and high temperature and pressure are applied to belts for toner fixing and the like. Can be Further, a high temperature is applied to the paper transport belt after the fixing step or the drying step. For this reason, since belts used in these apparatuses are required to have heat resistance and high mechanical properties, a polyimide resin is most preferable as the material of the belt.

[0003] When a formed product made of a polyimide resin is used for paper conveyance or toner transfer, it is essential to greatly reduce the resistance value of the resin. Further, when used for fixing a toner, it is necessary to have high thermal conductivity. In order to satisfy these requirements, a method of incorporating an inorganic powder in a resin according to desired properties is generally used.

[0004] However, it has heretofore been extremely difficult to produce an endless polyimide belt in which an inorganic powder is introduced into a resin. The reason is that when an inorganic powder is mixed into the polyimide resin, the toughness of the resin is significantly reduced. The polyimide belt is manufactured by applying a polyamic acid solution as a precursor in a belt shape, and then performing a drying / imide conversion reaction. Here, the inner diameter of the polyimide belt needs to be strictly defined from the specificity of use. Therefore, the polyamic acid solution or the polyimide belt in which the imide conversion reaction has not sufficiently proceeded is arranged so as to be in close contact with the outside of the mold having the specified outer diameter, and then the imide conversion reaction is performed by a method of raising the temperature to an arbitrary temperature. The almost complete technique is widely used. However, shrinkage of the resin in the imide conversion reaction is chemically unavoidable. Therefore, the polyimide resin having low toughness cannot withstand its own shrinkage force at the stage of the imide conversion reaction and is broken, and as a result, it has been a main cause of a decrease in yield in the production of a polyimide belt. In addition, when a polyimide belt having low resin toughness is incorporated into an apparatus, a period until breakage, such as breakage or cracking, occurs in the resin, that is, the component life is shortened. As a result, it is very problematic that belt replacement costs are incurred, which leads to an increase in the cost of the apparatus as a whole. Conventionally, in order to improve the toughness of the belt resin, a method of increasing the thickness of the polyimide belt has been generally used. However, this method has problems such as the need to increase the heat capacity of the heater at the time of thermal fixing and the increase in resin raw material cost. This is one of the hindering factors. Further, the surface of the molded article is treated with a coating having an ability to improve toughness. However, this method also has a problem in that the heat capacity of the heater increases, the coating material cost and the coating processing cost increase, and the cost of the entire apparatus increases. Further, JP-A-5-345369 and JP-A-Hei 1
As disclosed in Japanese Patent Application No. 0-198179, means for providing a reinforcing tape at the end of the belt for the purpose of preventing breakage has also been proposed. However, this method is unsuitable in that the process of attaching the tape is very complicated and difficult, and the cost required for this process is increased.

[0005]

The inventors of the present invention have conducted intensive studies to solve the above problems, and as a result, have greatly improved the toughness of a polyimide molded article very easily. They came up with a way to dramatically increase their lifespan.

[0006]

In order to achieve the above object, a method for producing a polyimide belt according to the present invention comprises applying a solution containing a tertiary amine compound as a main component and containing a polyamic acid as a main component, in a tubular form, It is characterized by performing a drying / imidation reaction. That is, the present invention relates to a method for producing a belt-shaped molded product made of a resin containing polyimide as a main component.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a step of drying and imidizing a solution containing (A) a tertiary amine compound and (B) a polyamic acid to obtain a polyimide molded body is carried out by a batch method.

[0008] 3 in the imidation reaction of polyamic acid
The use of a tertiary amine compound is known in a so-called chemical curing method in which a dehydrating agent and a tertiary amine compound are used in combination. For example, JP-A-06-207014
And so on. However, the use of a polyamic acid and a tertiary amine, which is a known technique, is for the case of continuously producing a polyimide film, and is different from the method of obtaining a polyimide molded article by a batch method in the present invention.

In addition, a chemical curing method, which is a well-known technique, involves mixing a dehydrating agent such as acetic anhydride and a tertiary amine compound having a catalytic action of a dehydration reaction with a polyamic acid solution which is a precursor of polyimide, and subjecting the mixture to a dehydration reaction. This is a technique for accelerating the imide conversion reaction. However, in the chemical curing method, an imide conversion reaction is induced immediately after the dehydrating agent and the tertiary amine are mixed in the polyamic acid solution, and the polyamic acid solution is solidified. Therefore, the method can be applied to the production of a polyimide film that can be performed continuously, but cannot be practically used for the production of a polyimide belt that must be performed in a batch system.

Therefore, when a molded product is obtained in a batch system, the imidization reaction is not conducted by introducing a dehydrating agent into a polyimide precursor solution, that is, a chemical curing method, but a method mainly using heat, which is generally called heat curing. Done in

In the present invention, the use of the component (A) can dramatically improve the toughness of a molded product. In addition, when the solution containing the component (A) and the polyamic acid (B) is dried and imidized, an imidization conversion reaction occurs at an early stage and the desired polyimide molded body can be obtained without solidification.

Therefore, in the method of the present invention, the imidization reaction proceeds mainly by heat, and the component (A) is different from the chemical curing method in that the spontaneous imidization reaction is carried out during the molding operation at room temperature. It is presumed that it does not bring about an excessive amount and acts as one that improves the toughness of the molded product.

The present invention can be applied to a molded product other than a belt shape as long as it is a batch type. For example, in the case of a thin film, application of the present technology to a film is very effective because toughness has a fatal effect on tear resistance. Furthermore, the lack of toughness in the belt manufacturing process is more important in adapting to a belt-like material because the stress generated in the process is concentrated at one point and causes the belt to break. The component (A) is not particularly limited as long as it is a tertiary amine compound. However, in order to effectively exhibit the effect of improving toughness in the present invention, imidazole, benzimidazole,
It is preferably a substituted or unsubstituted nitrogen-containing heterocyclic compound such as isoquinoline, quinoline or substituted pyridine.

The polyamic acid (B) is obtained, for example, by subjecting an aromatic tetracarboxylic acid component and a diamine component to a polymerization reaction in an organic polar solvent. There is no particular limitation on the aromatic tetracarboxylic acid component. For example, butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dimethyl-1,
2,3,4-cyclobutanetetracarboxylic acid, 1,2,2
3,4-cyclopentanetetracarboxylic dianhydride,
2,3,5-tricarboxycyclopentylacetic acid dianhydride, 3,5,6-tricarboxynorbonane-2-acetic acid dianhydride, 2,3,4,5-tetrahydrofurantetracarboxylic dianhydride, 5- (2,5-dioxotetrahydrofural) -3-methyl-3-cyclohexene-1,
2-dicarboxylic dianhydride, bicyclo [2,2,2]-
Aliphatic or alicyclic tetracarboxylic dianhydrides such as oct-7-ene-2,3,5,6-tetracarboxylic dianhydride; pyromellitic dianhydride, 3,3 ′, 4,4 '-
Benzophenone tetracarboxylic dianhydride, 3,3 ',
4,4′-biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3 ′ , 4,4'-biphenylethertetracarboxylic dianhydride, 3,3 ', 4,4'-dimethyldiphenylsilanetetracarboxylic dianhydride,
3 ', 4,4'-tetraphenylsilanetetracarboxylic dianhydride, 1,2,3,4-furantetracarboxylic dianhydride, 4,4'-bis (3,4-dicarboxyphenoxy) diphenyl Sulfide dianhydride, 4,4'-bis (3,4-dicarboxyphenoxy) diphenylsulfone dianhydride, 4,4'-bis (3,4-dicarboxyphenoxy) diphenylpropane dianhydride, 3,3 ',
4,4'-perfluoroisopropylidene diphthalic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, bis (phthalic acid) phenylphosphine oxide dianhydride, p-phenylene- Bis (triphenylphthalic acid) dianhydride, m-phenylene-bis (triphenylphthalic acid) dianhydride, bis (triphenylphthalic acid) -4,4'-diphenyl ether dianhydride, bis (triphenylphthalic acid) ) Aromatic tetracarboxylic dianhydrides such as -4,4'-diphenylmethane dianhydride;
3,3a, 4,5,9b-Hexahydro-2,5-dioxo-3-furanyl) -naphtho [1,2-c] furan-
1,3-dione, 1,3,3a, 4,5,9b-hexahydro-5-methyl-5- (tetrahydro-2,5-dioxo-3-furanyl) -naphtho [1,2-c] furan- 1,3-dione, 1,3,3a, 4,5,9b-hexahydro-8-methyl-5- (tetrahydro-2,5-
Examples thereof include aliphatic tetracarboxylic dianhydrides having an aromatic ring such as dioxo-3-furanyl) -naphtho [1,2-c] furan-1,3-dione. These tetracarboxylic dianhydrides can be used alone or in combination of two or more. The diamine to be used next is not particularly limited as long as it is a diamine.
-Phenylenediamine, m-phenylenediamine, 4,
4'-diaminodiphenylmethane, 4,4'-diaminophenylethane, 4,4'-diaminophenyl ether, 4,4'-didiaminophenyl sulfide, 4,
4'-didiaminophenylsulfone, 1,5-diaminonaphthalene, 3,3-dimethyl-4,4'-diaminobiphenyl, 5-amino-1- (4'-aminophenyl) -1,3,3-trimethyl Indane, 6-amino-
1- (4′-aminophenyl) -1,3,3-trimethylindane, 4,4′-diaminobenzanilide, 3,
5-diamino-3′-trifluoromethylbenzanilide, 3,5-diamino-4′-trifluoromethylbenzanilide, 3,4′-diaminodiphenylether,
2,7-diaminofluorene, 2,2-bis (4-aminophenyl) hexafluoropropane, 4,4′-methylene-bis (2-chloroaniline), 2,2 ′, 5,5
'-Tetrachloro-4,4'-diaminobiphenyl,
2,2'-dichloro-4,4'-diamino-5,5'-
Dimethoxybiphenyl, 3,3′-dimethoxy-4,
4'-diaminobiphenyl, 4,4'-diamino-2,
2'-bis (trifluoromethyl) biphenyl, 2,2
-Bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, 1,4-bis (4-
Aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) -biphenyl, 1,3'-bis (4-
Aminophenoxy) benzene, 9,9-bis (4-aminophenyl) fluorene, 4,4 ′-(p-phenyleneisopropylidene) bisaniline, 4,4 ′-(m-phenyleneisopropylidene) bisaniline, 2,2 ′ −
Bis [4- (4-amino-2-trifluoromethylphenoxy) phenyl] hexafluoropropane, 4,4 '
-Bis [4- (4-amino-2-trifluoromethyl)
Phenoxy] -aromatic diamines such as octafluorobiphenyl; aromatic diamines having two amino groups bonded to an aromatic ring such as diaminotetraphenylthiophene and a hetero atom other than a nitrogen atom of the amino group; Meta-xylylenediamine, 1,3-propanediamine, tetramethylenediamine, pentamethylenediamine, octamethylenediamine, nonamethylenediamine, 4,4-
Diaminoheptamethylenediamine, 1,4-diaminocyclohexane, isophoronediamine, tetrahydrodicyclopentadienylenediamine, hexahydro-4,
Aliphatic diamines such as 7-methanoindanylene dimethylene diamine, tricyclo [6,2,1,0 ^2.7 ] -undecylene dimethyl diamine, and 4,4′-methylene bis (cyclohexylamine) and alicyclic diamines may be mentioned. it can. These diamine compounds can be used alone or in combination of two or more. As the diamine, it is preferable to use an aromatic diamine, but it is not particularly limited. Here, examples of the organic polar solvent used in the reaction for forming the polyamic acid include sulfoxide-based solvents such as dimethyl sulfoxide and diethyl sulfoxide, N, N-dimethylformamide, N, N
-Formamide solvents such as diethylformamide,
Acetamide solvents such as N, N-dimethylacetamide, N, N-diethylacetamide, N-methyl-2-
Pyrrolidone-based solvents such as pyrrolidone and N-vinyl-2-pyrrolidone; phenol-based solvents such as phenol, o-, m-, or p-cresol, xylenol, halogenated phenols, and catechol; ether-based solvents such as tetrahydrofuran, dioxane, and dioxolane Solvents, alcohol solvents such as methanol, ethanol, butanol, etc., cellosolves such as butyl cellosolve or hexamethylphosphoramide, γ-butyrolactone, etc. can be mentioned, and it is desirable to use these alone or as a mixture, and more preferably xylene Aromatic hydrocarbons such as toluene can also be used. The solvent is not particularly limited as long as it dissolves the polyamic acid.

It is important that the main component of the resin layer in the present invention is a polyamic acid which is a precursor of polyimide. However, in order to control the resistance value, heat conductivity, UV resistance, moisture resistance, etc. A method generally used for improving the properties of an insulating resin can be applied. For example, in order for a polyimide belt to exhibit intermediate transfer capability, its volume resistance value should be 1 × 10 ⁶ to 10 ¹⁵ Ω · cm, preferably 1 × 1 Ω · cm.
0 ^7-10 but be controlled in the range of ¹⁰ Omega · cm is extremely important, as a specific method for realizing this,
The most effective method is to mix an appropriate amount of conductive inorganic powder such as carbon black in a resin. In addition to carbon black, small-diameter metal particles, metal oxide particles, titanium oxide, various inorganic particles, and whiskers formed of a conductive material such as metal oxide can provide the same effect. . Further, an ionic conductive substance such as LiCl can be added. Further, for example, by introducing a thermally conductive inorganic powder into the polyimide belt resin, its heat fixing ability can be improved. The thermal conductive inorganic powder is not particularly limited as long as it is an inorganic powder having a thermal conductive function, and examples thereof include aluminum nitride, boron nitride, alumina, silicon carbide, silicon, silica, and graphite. Among them, boron nitride is preferable because it has a high heat conduction function, exhibits a releasing effect, is chemically stable, and is harmless. The above-mentioned inorganic powder can be appropriately selected depending on the use of the polyimide belt by using a single or a plurality of mixed systems.

The tear propagation strength is a value obtained by dividing the load required for tearing a previously formed straight cut vertically by the thickness of the belt, and is a parameter most notably indicating toughness. That is, a high tear propagation strength is consistent with a high toughness. In the case where the polyimide molded article according to the present invention is a belt, in consideration of its use, the belt is constantly subjected to a certain degree of tension, and therefore it is essential that the belt has toughness that does not break under this tension. Similarly, it is obvious that the higher the life, the better the quality of the film-like molded product in consideration of handling and the like. From this point, the tear propagation strength of the polyimide belt is 200 g / m2.
m or more, preferably 300 g / mm or more. If the thickness of the polyimide molded body is too large, it is not preferable from the viewpoint of thermal conductivity and resistance value, and if it is too small, the toughness is too small, which is not preferable. Therefore, in consideration of the use of the belt, it is desirable that the thickness of the belt is 10 to 1000 μm, preferably 30 to 150 μm.

The method for molding the polyimide molded article in the present invention is not particularly limited. However, when the polyimide resin molded article finally obtained is a belt, for example, a polyimide precursor is applied to the inside or outside of a cylindrical mold. Examples include a method of performing an imide conversion reaction after application of a body solution, and a method of forming a film, bonding the ends by heating fusion, ultrasonic fusion, applying an adhesive, etc., and processing into a belt shape. This is not the case.

Next, an example of a specific method for producing a polyimide belt will be described.

A polyimide resin precursor acid solution obtained by polymerizing an aromatic tetracarboxylic acid component and a diamine component in an organic solvent is mixed with a solid content of polyamic acid resin of 100%.
5 to 200 g, preferably 10 to 100 g, of the tertiary amine are mixed per g. Next, the inorganic powder was added to the solution in an amount of 5 to 6 parts by weight based on 100 parts by weight of the dry weight of the polyamic acid resin.
0 parts by weight. As a method of incorporating the inorganic powder, a method of mixing the inorganic powder in an organic solvent and then polymerizing the monomer in the organic solvent, a step in the course of the polymerization reaction or after the completion of the reaction, the inorganic powder or its dispersion Is mixed. Further, from the viewpoint of preventing the dielectric breakdown phenomenon of the polyimide belt, the maximum width of the aggregate of the inorganic powder is preferably not more than the thickness of the polyimide belt finally obtained,
This is not the case when the aspect ratio of the maximum width to the minimum width of the inorganic powder used is 50 or more. Examples of techniques for dispersing the inorganic powder and reducing the size of the aggregates include physical techniques such as stirring with a mixer or stirrer, parallel rolls, ultrasonic dispersion, and chemical techniques such as introduction of a dispersant. However, the present invention is not limited to this. At this time, the inorganic powder to be contained in the resin can be arbitrarily selected from one or more inorganic powders according to the purpose. next,
This solution is applied to the inner or outer surface of a cylindrical mold.
At this time, it is preferable to apply a release agent to the cylindrical mold in order to improve the releasability after the belt is formed on the cylindrical mold, but it is not limited thereto. Further, by moving the mold for controlling the film thickness, the clearance of which has been adjusted with respect to the cylindrical mold, through the cylindrical mold, the excess solution is eliminated and the thickness of the solution on the cylindrical mold is made uniform. If uniform thickness control of the solution is performed at the stage of applying the solution onto the cylindrical mold, it is not necessary to use a mold for controlling the film thickness. Next, the cylindrical mold coated with the polyimide resin precursor solution is heated or placed in a vacuum environment to volatilize 30% or more, preferably 50% or more of the contained solvent. Further, the mold is heated to 200 ° C.
The mixture is heated at 450 ° C. to cause the imide conversion reaction to proceed. Thereafter, the resin is removed from the mold, and a desired polyimide belt can be obtained.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment according to the present invention is as follows.

(Example) Dimethylformamide (DMF) was placed in a vessel equipped with stirring blades, and 4,4 -diaminodiphenyl ether and pyromellitic dianhydride were added in equimolar amounts and stirred well. When the viscosity of the system reached about 3000 poise, stirring was stopped to obtain a polyimide precursor solution. Next, 60 g of titanium oxide-based spherical metal filler ET-300W manufactured by Otsuka Chemical Co., Ltd. and 300 g of DMF are placed in another container, stirred well, and further subjected to an ultrasonic disperser to uniformly disperse the metal filler in the dispersion. Was. Also,
In another container, carbon black 303 manufactured by Mitsubishi Chemical Corporation
OB (15 g) and DMF (300 g) were added, mixed well, and placed in an ultrasonic dispersing machine. In 200 g of the polyimide precursor solution obtained above, 66.6 g and 36.6 g of the metal filler dispersion and carbon black dispersion obtained above were respectively added.
0 g was mixed in. Further, 10 g of isoquinoline was mixed into the solution.

The polyamic acid thus obtained is
Isoquinoline-metal filler-carbon black mixed solution
The liquid is made of cylindrical SUS with an inner diameter of 90 mm and a length of 450 mm
By pouring into the mold, the entire inner surface of the cylindrical mold is
The solution was applied. The cylindrical mold has a flange on the inner surface.
By applying a fluorine-based release agent in advance,
The peelability was improved. Next, the center coincides with the cylindrical mold.
Insert a 30mmφ mandrel so that
Outer diameter 89.5mm, inner diameter 30mmφ, liquid contact part angle on mandrel
A SUS ring-shaped mold of 30 mm was installed. Next, d
The compressed air obtained by the A compressor is transferred inside the cylindrical mold.
The ring-shaped mold is moved in parallel by injecting
0.5mm thick polyimide resin precursor solution
A liquid film was formed. Apply polyimide resin precursor solution
Place the mold in a vacuum dryer and allow the solution to collect
While rotating the mold so that there is no^-33 o'clock in torr
While drying. Next, put the mold in the oven and let it
By raising the temperature to 380 ° C. in about 30 minutes,
The conversion reaction was allowed to proceed. Then, let the mold cool down at room temperature,
Remove the resin from the mold to obtain the desired polyimide belt
Was. This polyimide belt is 2.5cm x 7.5cm
Cut out a load cell that can measure a load of 100g
Parameter, which is the parameter that most clearly describes toughness.
The carrying strength was measured. As a result, the polyimide belt
Has a tear propagation strength of 370 ± 30 g / mm
Met. From the polyimide belt obtained by the above means
Cut out test specimens from 30 random places,
And tear propagation strength measurements. Thickness measurement is the smallest unit
Measured using a film thickness gauge that can measure up to 0.01μm
did. Autograph manufactured by Shimadzu Corporation for measurement of tear propagation strength
In S-100-C, load of maximum measured load 100gf
Using a cell, the tearing speed was 200 mm / sec. This
As a result, the thickness of the obtained polyimide belt was 70 ± 3 μm.
m, and the tear propagation strength was 340 ± 20 g / mm.
Was. Also, 10 × 10cm from this belt^TwoThe specimen
Start with Advantech's ultra-high resistance measuring device.
The volume resistivity of the sample was 1 × 10 ⁸Ω · cm
there were. (Comparative Example 1) Except not containing isoquinoline
Prepared in the same manner as the polyimide belt of Example 1,
I got Doberto. The obtained tear propagation strength is 150 ± 2
It was 0 g / mm. From this, it is a tertiary amine
By adding isoquinoline, the toughness of the polyimide belt
It is clear that has improved.

Although the method for producing a polyimide molded article according to the present invention has been described above, the present invention is not limited to the above-described embodiment. Needless to say, the present invention can be implemented in various modified forms within the described range.

[0024]

According to the method for producing a polyimide belt according to the present invention, a tertiary amine compound is mixed in a solution containing, as a main component, a polyamic acid which is a precursor of a polyimide belt, and then molded into a belt and dried. -By imidization, it is characterized by improving the toughness of the polyimide belt, by mixing inorganic powder,
This is a very effective method for improving the toughness of a polyimide belt whose resin properties are controlled, thereby improving the yield of polyimide belt production and extending the life of belt parts.
In particular, it is important to be able to solve the problem that the toughness of the polyimide belt had to be reduced by an extremely simple method in the current method of controlling the characteristics by introducing inorganic powder into polyimide. It is.

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Claims (9)

[Claims] 1. A process for producing a polyimide molded body, wherein a step of drying and imidizing a solution containing (A) a tertiary amine compound and (B) a polyamic acid to obtain a polyimide molded body is performed in a batch system. Method. 2. The method according to claim 1, wherein the polyimide molded body is a polyimide belt. 3. The polyimide molded body contains 5 to 60 inorganic substances.
3. The production method according to claim 1, wherein the amount is part by weight. 4. A polyimide molded article having a tear propagation strength of 20
4. The method according to claim 1, wherein the amount is from 0 to 500 g / mm. 5. The polyimide molded body has a thickness of 10 to 100.
5. The method according to claim 1, wherein the thickness is in the range of 0 [mu] m. 6. The method according to claim 1, wherein the resin layer containing polyimide has a volume resistivity of 1 × 10 ⁶ to 10 ¹⁵ Ω · cm. 7. The method according to claim 1, wherein the component (A) is a substituted or unsubstituted nitrogen-containing heterocyclic compound. 8. A tear propagation strength of 200 to 700 g / mm.
A polyimide molded body. 9. A tear propagation strength of 200 to 700 g / mm.
Is a polyimide belt.