JP2002122798A - Moving element position changeover device, optical switch and method of manufacturing moving element housing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a moving element position changeover device, which is small in size and may be easily manufactured, an optical switch, and to provide a method of manufacturing a moving element housing structure. SOLUTION: A moving mirror 16 consisting of a permanent magnet, such as a Co-Ni alloy, is arranged in a guide groove 14 disposed at a clad layer on a substrate. Electromagnetic coils 18 and 20 are arranged along the longitudinal direction of the groove 14, so as to face each other across the groove 14. In the coils 18 and 20, 18a and 20a are magnetic cores consisting of an Ni-Fe alloy, etc., and 18b and 20b are conductive layers consisting of Cu, etc. The conductive layers may be wound in multiple plies. A refractive index matching oil is loaded into the groove 14. When the mirror 16 is moved by the repulsion of the coil 18 to a position shown by a broken line, the input light from an optical waveguide 10a1 advances rectilinearly toward an optical waveguide 10a2. When the mirror 16 is moved by the repulsion of the coil 20 from the position, shown by the broken line to a position shown by a solid line, the input light from the optical waveguide 10a1 is reflected by the mirror 16 and advances toward an optical waveguide 12a2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mover position switching device and an optical switch suitable for use in optical path switching and the like.
The present invention relates to a method for manufacturing a mover accommodating structure suitable for use in manufacturing these devices.

[0002]

2. Description of the Related Art Conventionally, as an optical path switching device used for optical communication and the like, the one shown in FIGS. 51 and 52 is known (for example, see Japanese Patent Application Laid-Open No. 2000-98270).

The optical switching device shown in FIG.
The optical path substrate 2 is arranged on the substrate 1 provided with S. In the optical switch 1S, a permanent magnet B with a movable reflection plate 6b is arranged between a yoke 9a of an electromagnet 8a and a yoke 9c of an electromagnet 8c as shown in FIG. 52 in a cross section taken along line XX 'of FIG. At the same time, an electromagnetic linear actuator 7a is arranged below the moving path of the permanent magnet 6B to form one half, and the other half is also movable between the yoke 9b of the electromagnet 8b and the yoke 9c of the electromagnet 8c. Board 6
Permanent magnet with c and electromagnetic linear actuator 7b
Are arranged similarly to one half.

In the optical path board 2, optical fibers 3a to 3a
3d are provided in parallel, and lenses 4a to 4c are provided corresponding to the optical fibers 3a to 3d, respectively. On the substrate 1, fixed reflecting plates 5a to 5d are arranged corresponding to the lenses 4a to 4d, respectively.

The movable reflecting plates 6b, 6b are driven by the buoyancy of the electromagnetic linear actuators 7a, 7b and the repulsive force of the electromagnet 8c.
In a state where c is moved from the position shown by the solid line to the position shown by the broken line, the light incident from the optical fiber 3a is reflected by the fixed reflecting plates 5a and 5d and is led out from the optical fiber 3d,
Light incident from the optical fiber 3c is transmitted to the fixed reflectors 5c and 5c.
b and is led out of the optical fiber 3b.

The electromagnetic linear actuator 7a,
When the movable reflecting plates 6b and 6c are moved from the position shown by the broken line to the position shown by the solid line by the buoyancy of the electromagnets 8a and 8b and the repulsive force of the electromagnets 8a and 8b, the light incident from the optical fiber 3a receives The light reflected by the movable reflection plate 6b and derived from the optical fiber 3b, and incident from the optical fiber 3c, is reflected by the movable reflection plate 6c and the fixed reflection plate 5d and is derived from the optical fiber 3d.

[0007]

According to the above-mentioned prior art, since a permanent magnet with a movable reflector is guided by an electromagnetic linear actuator, the structure is complicated, and the form of an optical circuit or an optical integrated circuit is complicated. However, there is a problem that it is not easy to reduce the size.

SUMMARY OF THE INVENTION An object of the present invention is to provide a mover position switching device and an optical switch which are small and easy to manufacture, and a method of manufacturing a mover housing structure used for manufacturing these devices.

[0009]

A mover position switching device according to the present invention comprises a substrate having one main surface, a mover comprising a permanent magnet piece, and a guide member formed on one main surface of the substrate. A guide groove that guides the movement of the mover in a predetermined direction in a state where the mover is accommodated is formed on the substrate so as to face the guide groove along the predetermined direction. First and second electromagnetic coils formed on one main surface, each electromagnetic coil having a configuration in which a conductive layer is wound around a magnetic core along a longitudinal direction thereof, and at least the first electromagnetic coil is Controlling the movement of the mover from the first position to the second position in the guide groove, wherein at least the second electromagnetic coil moves from the second position of the mover to the first position in the guide groove; For controlling the movement of the object.

According to the mover position switching device of the present invention,
The mover can be moved from the first position to the second position in the guide groove by at least the first electromagnetic coil, and the mover can be moved from the second position in the guide groove by the at least second electromagnetic coil. 1 can be moved. When moving the mover, the first and second electromagnetic coils may be used together. The mover made of a permanent magnet piece attracts the magnetic core of the nearby electromagnetic coil at any of the first and second positions, and thus does not move even when the current of the electromagnetic coil is cut off, and is in a self-holding state. Therefore, power consumption can be reduced. Since the mover is guided by the guide groove, the structure is simple, the size can be easily reduced, and it can be easily manufactured using a thin film process or the like.

In the mover position switching device of the present invention, each electromagnetic coil may be formed by winding a conductive layer around a magnetic core in multiple layers. In this case, the length of the electromagnetic coil can be reduced, so that the size can be further reduced. In addition, it is desirable that a lid member that covers the guide groove be attached to the guide member so that the mover does not separate from the guide groove. By doing so, the stability of the operation can be ensured.

A first optical switch according to the present invention comprises a substrate having one main surface, a movable mirror composed of permanent magnet pieces, and a clad layer formed on one main surface of the substrate, wherein the movable mirror A guide groove for guiding the movement of the movable mirror in a predetermined direction in a state in which
A first optical waveguide comprising a first core layer formed in the cladding layer so that light is incident on the movable mirror when the movable mirror is at a first position in the guide groove; A second optical waveguide comprising a second core layer formed in the cladding layer to receive reflected light from the movable mirror when the movable mirror is at a first position in the guide groove; A third optical waveguide comprising a third core layer formed in the cladding layer to receive incident light from the first optical waveguide when the mirror is in a second position within the guide groove; A first and a second electromagnetic coil formed on one main surface of the substrate so as to face each other across the guide groove along the predetermined direction, wherein each of the electromagnetic coils extends along a longitudinal direction of the magnetic core. Having a configuration in which a conductive layer is wound, at least a Controls the movement of the movable mirror from the first position to the second position in the guide groove, and at least the second electromagnetic coil moves from the second position of the movable mirror in the guide groove. Controlling movement to the first position.

According to the first optical switch, when the movable mirror is moved to the first position by the second electromagnetic coil, the light incident from the first optical waveguide is reflected by the movable mirror, and the reflected light is reflected. Light is derived from the second optical waveguide. In a state where the movable mirror is moved to the second position by the first electromagnetic coil, light incident from the first optical waveguide is led out from the third optical waveguide.

The first optical switch is obtained by applying the above-described mover position switching device to optical switching, and provides the same operation and effect as described above for the mover position switching device. In addition, since the first to third optical waveguides are directly connected to the guide grooves, a very small optical switch can be realized.

In the first optical switch, it is desirable to load a refractive index matching oil for adjusting the refractive index between the inside of the guide groove and the first to third optical waveguides into the guide groove. In this way, light loss can be reduced. Further, as described above for the mover position switching device, multiple electromagnetic coils may be used as the respective electromagnetic coils, or a cover member that covers the guide groove may be provided.

According to a second optical switch of the present invention, a first and a second electromagnetic coil are disposed so as to face a substrate having one main surface at a predetermined distance from the first main surface of the substrate. Wherein each electromagnetic coil has a structure in which a conductive layer is wound around a magnetic core along a longitudinal direction thereof, and a planar surface between the first and second electromagnetic coils on one main surface of the substrate. A movable mirror comprising a permanent magnet piece movably disposed, a support arm for supporting the movable mirror, and a support arm disposed on one main surface of the substrate, wherein the support arm is disposed between the first and second electromagnetic coils; Holding means for rotatably holding the movable mirror, light incident means for incident light on the movable mirror when the movable mirror is at a first position between the first and second electromagnetic coils, Mirror is the first
And first light deriving means for receiving reflected light from the movable mirror when in a first position between the second electromagnetic coil and a second electromagnetic coil;
Second light deriving means for receiving incident light from the light incident means when the movable mirror is at a second position between the first and second electromagnetic coils, and at least the first electromagnetic coil Controls the movement of the movable mirror from the first position to the second position, and at least the second electromagnetic coil controls the movement of the movable mirror from the second position to the first position. According to the second optical switch, when the movable mirror is moved to the first position by the second electromagnetic coil, the light incident from the light incident means is reflected by the movable mirror, and the reflected light Is derived by the first light deriving means. In a state where the movable mirror is moved to the second position by the first electromagnetic coil, the light incident from the light incident means is led out by the second light leading means. When moving the movable mirror, the first and second electromagnetic coils may be used together. Since the movable mirror made of a permanent magnet piece is in a self-holding state at any of the first and second positions, power consumption can be reduced. Since the movable mirror is guided by the rotatable support arm, the configuration is simple, the size can be easily reduced, and it can be easily manufactured using a thin film process or the like. When multiple windings are used as each electromagnetic coil, further miniaturization is possible.

The third optical switch according to the present invention has a second optical switch.
In this optical switch, a flexible support arm is provided instead of the rotatable support arm to guide the movable mirror, and the same operation and effect as the second switch can be obtained.

The method for manufacturing the mover accommodating structure according to the present invention is as follows.
A step of forming a guide groove for guiding the movement of the mover on one main surface of the guide member, a step of forming a first sacrificial layer covering a bottom surface and an inner wall surface of the guide groove, and from one end of the guide groove Forming a second sacrificial layer so as to fill a predetermined section corresponding to the length of the mover toward the other end without filling the predetermined section and the other end of the guide groove; Forming a magnetic material layer made of a magnetic material for a permanent magnet so as to fill the predetermined section in the groove, and removing the first and second sacrificial layers by etching to remove the magnetic material layer from the guide groove And leaving the movable element inside the movable element.

According to the method for manufacturing the mover accommodating structure of the present invention, a minute mover accommodating structure can be manufactured by using a thin film process, so that the mover position switching device and the first optical switch described above are mass-produced. It is convenient for

In the method for manufacturing a mover accommodating structure according to the present invention, a step of forming a third sacrificial layer covering the magnetic material layer and the guide groove after forming the magnetic material layer; Forming a lid member on the guide member so as to cover most of the guide groove via a layer and expose a part of the third sacrificial layer corresponding to a small portion of the guide groove; And the third sacrifice layer may be removed together with the first and second sacrifice layers in the etching process so that the lid member remains. This way,
The movable member can be prevented from falling off by the lid member, and it is not necessary to use a falling-off prevention tool.

[0021]

DETAILED DESCRIPTION OF THE INVENTION Figure 1 and 2, shows the optical switch S ₁₁ according to an embodiment of the present invention, FIG. 1 is a perspective view, Figure 2 is a top view.

On one main surface of the optical switch substrate, a clad layer is formed as a guide member, and a mirror guide groove 14 for guiding the movement of a movable mirror 16 as a mover is formed in the clad layer. The movable mirror 16 is made of Co-
A rectangular shape made of a magnetic material for permanent magnets such as a Ni alloy, and has light reflectivity due to metallic luster. Movable mirror 16
As an example, the size along the mirror movement direction indicated by arrow a is 30 [μm], the length along the vertical direction perpendicular to the movement direction is 10 [μm], and the thickness is 4 [μm]. be able to. The size of the guide groove 14 is, for example, 60 [μm] along the direction of arrow a, 12 [μm] along the vertical direction perpendicular to the direction of arrow a, and the movable mirror 16.
Can be set to 5 [μm].

On one main surface of the optical switch substrate, two electromagnetic coils 18 and 20 are formed so as to face each other with the guide groove 14 therebetween along the mirror moving direction indicated by the arrow a. The electromagnetic coil 18 has a configuration (a toroidal coil configuration) in which a conductive layer 18b is wound around a long and thin magnetic core 18a made of a magnetic material such as a Ni—Fe alloy along its longitudinal direction. It has a configuration in which a conductive layer 20b is wound around a magnetic core 20a. Electromagnetic coils 18, 2
0 is a length of 50 [μm] and the number of turns is 5 as an example.
It can be set to 0.

Power is supplied to the electromagnetic coil 18 to move the movable mirror 16.
When the repulsive force is applied to the movable mirror 16, the movable mirror 16 moves from the position shown by the solid line (first position) to the position shown by the broken line (second position). At this time, the movable mirror 16 is
Since the magnetic core 20b of 0 is attracted, it does not move even when the energization of the electromagnetic coil 18 is stopped, and becomes a self-holding state.

When the movable mirror 16 is moved to the second position, the electromagnetic coil 20 is energized and the movable mirror 1 is moved.
A suction force may be applied to 6. Also in this case, the energization of the electromagnetic coil 20 is stopped at the second position, and the movable mirror 16 can be in a self-holding state.

On the other hand, when the electromagnetic coil 20 is energized to exert a repulsive force on the movable mirror 16, the movable mirror 16 moves from the second position to the first position. At this time, since the movable mirror 16 attracts the magnetic core 18a of the electromagnetic coil 18, the movable mirror 16 does not move even when the energization of the electromagnetic coil 20 is stopped, and is in a self-holding state.

When the movable mirror 16 is moved to the first position, the electromagnetic coil 18 is energized to move the movable mirror 1 to the first position.
A suction force may be applied to 6. Also in this case, the power supply to the electromagnetic coil 18 can be stopped at the first position, and the movable mirror 16 can be in a self-holding state.

In the cladding layer, the input optical waveguides 10a ₁ and 10a ₂ and the output optical waveguide 1 each comprising a core layer are provided.
2 a ₁ and 12 a ₂ are formed directly connected to the guide groove 14. Each of the core layers has a width and a thickness of 4 as an example.
[Μm].

Optical waveguide 10a₁And 12a₂Is a movable
When the light 16 is in the first position, the optical waveguide 10a₁Or
The light incident from the optical waveguide 1 is reflected by the movable mirror 16 and
2a ₂It is arranged so that it may enter. Optical waveguide 10a₁
And 10a₂Indicates that the movable mirror 16 is in the second position.
Optical waveguide 10a₁From the optical waveguide 10a
₂It is arranged so that it may enter. Optical waveguide 12a₁as well as
12a₂When the movable mirror 16 is in the second position
Optical waveguide 12a₁From the optical waveguide 12a₂To
It is arranged to be incident. The guide groove 14 has the guide groove 1
4 and the optical waveguide 10a₁, 10a₂, 12a₁, 1
2a₂The refractive index matching oil for matching the refractive index with
It is loaded. Paraffin as a refractive index matching oil
Oil or naphthalene oil can be used.
The use of an oil of the type described above increases the refractive index from 1.4 to 1.7.
Can be adjusted to the extent. Same refractive index as optical waveguide
By using (about 1.5) index matching oil
Low optical loss at the end face of the optical waveguide in contact with the guide groove 14
It is possible to reduce.

According to the above optical waveguide arrangement, the movable mirror
-16 is in the first position, the optical waveguide 10a₁Or
The light incident from the optical waveguide 1 is reflected by the movable mirror 16 and
2a ₂Is derived from Also, the movable mirror 16 is
When in the position, the optical waveguide 10a₁Light incident from
The optical waveguide 10a is provided via the guide groove 14.₂Is derived from
At this time, the optical waveguide 12a₁When light enters from
Wave path 12a₂Is derived from Note that the movable mirror 16 is
When in the first position, the optical waveguide 12a₁Incident from
The reflected light is reflected by a movable mirror 16 to form an optical waveguide 10a.₂Or
You may make it derive from it.

According to the optical switch S ₁₁ described above, since the guide groove 14 as well as guiding the movable mirror 16 in the guide groove 14 is a simple structure that is directly connected through the optical waveguide, it is easy to miniaturize, as described below It can be easily manufactured using a thin film process or the like. Further, since the self-holding action of the movable mirror 16 can be used, power consumption can be reduced.

FIG. 3 and FIG.
1 shows a × 3 matrix type optical path switching device. Input optical fibers 10A to 10C are provided on one end face of the flat package type housing 22, and output optical fibers 12A to 12C are provided on side faces adjacent to the end faces.
Is provided.

As shown in FIG. 4, an optical switch substrate 24 is disposed inside the housing 22, and the above-described refractive index matching oil is loaded therein. The optical switch board 24 includes
A clad layer is formed, and the optical waveguides 10a to 10c, 12a to
12c are arranged in a matrix. The input optical waveguides 10a to 10c are connected to the optical fibers 10A to 10C, respectively, and the output optical waveguides 12a to 12c are
They are connected to the optical fibers 12A to 12C, respectively.

The optical waveguides 10a to 10c and the optical waveguide 12a
The nine intersection with the ～12C, optical switches _S 11 _{to S 33} having the same structure as described in FIG. 1 and 2 are respectively provided. At the intersection in which a light switch _{S 11} is the optical waveguide 10a by mirror guide groove 14 shown in FIGS. 1 and 2
Or 12a is a reference numeral 10a ₁ , 10a ₂ or 12 respectively.
It is divided as shown by a ₁ and 12a ₂ . This is the same for the other intersections.

[0035] When setting the movable mirror to the first position in the optical switch S _11, the light incident from the optical waveguide 10a is reflected by the movable mirror to enter the optical waveguide 12a. Similarly when setting the movable mirror to the first position in the optical switch _{S 12} or _{S 13,} the optical waveguide 10b
Alternatively, the incident light from 10c enters the optical waveguide 12a.
Further, by setting the movable mirror to the second position in the optical switch S _11, the incident light from the optical waveguide 10a is straight through the optical switch S _11. Setting the movable mirror to the second position in the optical switch _{S 12} or _{S 13} in the same manner, the incident light from the optical waveguide 10b or 10c, respectively straight through the optical switch _{S 12} or _{S 1 3.} Such an optical path switching operation is performed by another optical switch S.
The same applies to the ₂₁ to S _{3 3.}

Next, a method of manufacturing the optical switch as shown in FIGS. 1 and 2 will be described with reference to FIGS. Figures 5 to 10
2 shows a cross section taken along line AA ′ in FIG. 2 and shows a process of forming an optical waveguide.

In the step of FIG. 5, the under cladding layer 32 and the core material layer 34 are
CVD (plasma chemical vapor deposition)
It is formed sequentially by a method or the like. Each of the cladding layer 32 and the core material layer 34 is made of doped silica, and the refractive index is set according to the doping amount of a dopant such as fluorine or boron. The refractive index of the core material layer 34 is set to be larger than that of the cladding layer 32. The thickness of the core material layer 34 can be, for example, 4 [μm].

In the step of FIG. 6, a Cr (chromium) layer 36 as a mask material layer is formed on the upper surface of the core material layer 34 by a sputtering method or the like. As the mask material layer, a WSi (tungsten silicide) layer may be used. Next, in the step of FIG. 7, after forming a resist layer 37 on the upper surface of the Cr layer 36, a part of the resist layer 37a is left by photolithography corresponding to a desired optical waveguide pattern.

Next, in the step of FIG. 8, the resist layer 37a
Layer 36 by ion milling or the like using
Is selectively removed to leave a part of the Cr layer 36a in a pattern corresponding to the resist layer 37a. After that, the resist layer 37a is removed.

In the step of FIG. 9, the core material layer 34 is selectively removed by RIE (Reactive Ion Etching) using the Cr layer 36a as a mask, and a part of the core material is patterned in a pattern corresponding to the Cr layer 36a. The layer 34a is left as a core layer.

In the step of FIG. 10, after removing the Cr layer 36a by wet etching or the like, the cladding layer 32a is removed.
Over the core layer 34a on the upper surface of the
Is formed by a PCVD method or the like. The cladding layer 38 is made of the same material as the cladding layer 32 and has a lower refractive index than the core layer 34a. The thickness of the cladding layer 38 can be, for example, 12 [μm].

According to the steps of FIGS. 5 to 10, the core layer 34a
Optical waveguide 10a ₁ consisting obtained. Similarly, other optical waveguides 10a ₂ , 12a ₁ , and 12a ₂ are obtained. At this stage, since the mirror guide groove (corresponding to 14 of FIGS. 1 and 2) do not exist, with a state where the optical waveguides 10a ₁ and 10a ₂ are connected, the optical waveguide 12a ₁ and 12a
₂ is in a connected state.

FIGS. 11 to 28 show the steps of forming the movable mirror (corresponding to 14) and the electromagnetic coil (corresponding to 20) as shown in FIGS. The right side corresponds to the section taken along the line BB 'in FIG.

In the step of FIG. 11, a Cr layer 40 is formed on the upper surface of the clad layer 38 by a sputtering method or the like, and then a resist layer 42 is formed on the upper surface of the Cr layer 40. Then, holes 42a corresponding to the mirror guide grooves and holes 42b corresponding to the coil arrangement holes are formed in the resist layer 42 by photolithography. At this time, the previously formed core layer exists in the cladding layer 38 below the hole 42a, but is not shown for simplicity.

Next, in the step of FIG.
A mirror guide groove 38a and a coil arrangement groove 38b are formed in the cladding layer 38 by ion milling or the like using the mask as a mask. These grooves 38a and 38b are formed in the cladding layer 32.
You may bite into it. The guide groove 38a is formed so as to divide the optical waveguide 12a ₁ and 12a ₂ with dividing the optical waveguide 10a ₁ and 10a ₂ as shown in FIGS.

In the step of FIG. 13, a Cu layer 44 as a sacrificial layer is formed in the groove 38a by a lift-off method. That is, after a resist layer is formed on the upper surface of the cladding layer 38, the resist layer is subjected to photolithography to form the grooves 3.
A hole corresponding to 8a is formed. Then, after a Cu layer is deposited on the upper surface of the resist layer and the inner surface (bottom surface and inner wall surface) of the groove 38a by a sputtering method or the like, the Cu layer on the resist layer is lifted off together with the resist layer to form a Cu layer on the inner surface of the groove 38a. 44 remain. FIG. 29 shows the Cu
The formation state of the layer 44 is shown in a top view.

In the step of FIG. 14, a Cu layer 48 is formed on the upper surface of the cladding layer 38 as a seed layer for plating by sputtering or the like. At this time, the exposed portion of the Cu layer 44 and the inner surface of the groove 38a are also covered with the Cu layer 48.

In the step of FIG. 15, a resist layer 50 is formed on the upper surface of the cladding layer 38. Then, the resist layer 50
Then, a plurality of holes corresponding to a plurality of portions to be plated are formed by photolithography. The holes formed at this time include a hole 50a exposing the right half of the groove 38a as shown in FIGS. 30 and 32A, and FIGS.
As shown in FIG. 3, there are holes 50p, 50q, 50r, etc. corresponding to the portions where the coil plating layer is to be formed in the grooves 38b. FIGS. 32 (A) and (B) show C- FIGS.
Corresponds to the cross section along line C ′. The left half of the groove 38a is covered with a resist layer 50 as shown in FIGS.

Next, in the step of FIG.
Is used as a mask to perform a Cu plating process. Then, after the resist layer 50 is removed, the Cu layer as a seed layer is removed in portions other than the plated portion by ion milling or the like. As a result, the right half of the groove 38a is
As shown in (B), the structure is filled with a stack of a Cu layer 48a as a seed layer and a plated Cu layer 52a. This stack is used as a sacrificial layer. FIG.
Corresponds to the cross section along line -E '.

In the groove 38b, as shown in FIGS. 16 and 34, a laminate of a Cu layer 48p as a seed layer and a Cu layer 52p as a coil plating layer is formed. C
The lamination of the u layers 48p and 52p is used as a coil conductive layer. The Cu layer 52p is formed by the hole 50p of the resist layer 50.
In addition to the Cu layer 52p, a large number of coil plating layers corresponding to the holes 50q, 50r, etc. of the resist layer 50 are formed, and under these plating layers, the same as the Cu layer 48p, respectively. Cu layer remains. Each coil plating layer and the remaining Cu layer thereunder constitute a coil conductive layer.

Next, in the step of FIG. 17, an alumina (aluminum oxide) layer 54 is formed to cover the inside of the groove 38b by the lift-off method as described with reference to FIG. The alumina layer 54 is used as an insulating layer for electrically insulating between the coil conductive layer and the magnetic core. Instead of the alumina layer 54, a resist layer formed, patterned and baked may be used.

In the step of FIG. 18, the grooves 38a,
38b as a seed layer for plating to cover the inside of Ni-38b.
The Fe alloy layer 56 is formed by a sputtering method or the like. Then, after forming a resist layer 58 covering the Ni-Fe alloy layer 56, holes 58b corresponding to a desired magnetic core pattern are formed in the grooves 38b by photolithography.
Formed.

In the step of FIG. 19, the Ni—Fe alloy layer 6 for the magnetic core is formed by plating using the resist layer 58 as a mask.
0 is formed. Then, after removing the resist layer 58,
Ni-F as a seed layer by ion milling or the like
The e-alloy layer 56 is removed at a portion other than the plating portion, and a portion of N
The i-Fe alloy layer 56b is left. A laminate of the Ni—Fe alloy layers 56b and 60 is used as a magnetic core.

In the step shown in FIG. 20, an alumina layer 62 is formed by a lift-off method or the like in the gap where the resist layer 58 has been removed in the groove 38b. The alumina layer 62 is made of the alumina layer 6.
It is used as an insulating layer similarly to 0.
For simplicity, the alumina layers 60 and 62 are referred to as alumina layers 64. Instead of the alumina layer 62, a resist layer formed, patterned and baked may be used.

In the step of FIG. 18, the hole 58b is formed in the groove 38b.
It may be formed with a width substantially equal to. This way,
Since no void is formed in the groove 38b, the formation of the alumina layer 62 can be omitted.

Next, in the step of FIG. 21, the groove 3 is formed on the upper surface of the substrate.
8a as a plating seed layer covering the inside of
The i-alloy layer 66 is formed by a sputtering method or the like. And
After forming a resist layer 68 on the Co-Ni alloy layer 66 so as to cover the groove 38a, the groove 3 is formed by photolithography.
Hole 68 exposing the left half of 8a (see 38a in FIG. 31)
a is formed on the resist layer 68.

In the step of FIG. 22, a Co—Ni alloy layer 70 for a movable mirror is formed by plating using the resist layer 68 as a mask. Then, after removing the resist layer 68, C as a seed layer is formed by ion milling or the like.
The o-Ni alloy layer 66 is removed in a portion other than the plating portion, and a part of the Co-Ni alloy layer 66a remains. Co-Ni
The movable mirror (14 in FIGS. 1 and 2) is formed by the alloy layers 66a and 70.
) Is configured.

In the step of FIG. 23, an alumina layer 72 is formed on the upper surface of the substrate so as to cover the groove 38b. The alumina layer 72
There are first and second holes 72p and 72q exposing one end and the other end of the coil conductive layers 48p and 52p, respectively. In FIG. 34, the first and second holes 72p and 72q correspond to the first and second contact portions 53p and 53q of the coil conductive layers 48p and 52p, respectively.

In the step of FIG. 24, the groove 38a is covered on the upper surface of the substrate, and C is formed as a sacrificial layer in a pattern as shown in FIG.
The u layer 74 is formed by a lift-off method.

In the step of FIG. 25, a Cu layer 76 is formed as a plating seed layer on the upper surface of the substrate by sputtering or the like. Then, after forming a resist layer 78 covering the Cu layer 76, a plurality of holes corresponding to a plurality of portions to be plated are formed in the resist layer 78 by photolithography. The holes formed at this time are shown in FIGS.
As shown in FIG. 5, there are holes 78p, 78q, 78r, etc. corresponding to portions where the coil plating layer is to be formed above the groove 38b. Here, the holes 78p, 78q, 78r correspond to the holes 50p, 50q, 50r of the resist layer 50 shown in FIG. 33 as shown in FIG. The sectional view on the right side of FIG. 25 corresponds to the section taken along line DD ′ of FIGS.

In the step of FIG. 26, the Cu layers 80p, 80q, etc. are formed in a pattern corresponding to the holes 78p, 78q, etc. by plating using the resist layer 78 as a mask. Then, after the resist layer 78 is removed, the Cu layer 76 as a seed layer is removed in a portion other than the plating portion by ion milling or the like, and the Cu layer 76 is formed only under the coil plating layers such as the Cu layers 80p and 80q. The corresponding part of remains. As a result, for example, the coil conductive layer composed of the Cu layer 80p and the remaining portion of the Cu layer 76 thereunder is connected to the contact portions 53p of the coil conductive layers 48p and 52p in FIG. The conductive layer for the coil, which is constituted by the portion and the remaining portion of the Cu layer 76 thereunder, is connected to the contact portion 53q of the conductive layers for the coils 48p and 52p in FIG. In this way, by connecting the lower coil conductive layer formed in the step of FIG. 16 with the upper coil conductive layer formed in the step of FIG. 26, the lower coil conductive layer is spirally connected to the magnetic core Ni—Fe alloy layer 60. An electromagnetic coil (corresponding to 20 in FIGS. 1 and 2) in which a conductive layer is wound is formed.

Next, in the step of FIG.
An alumina layer 82a as a cover member is formed by a lift-off method or the like so as to cover the groove 38a in a pattern as shown in FIG. In addition, using the processing at this time, the alumina layer 82b is formed to completely cover the electromagnetic coil formed in the groove 38b. The cross-sectional view on the left side of FIG. 27 corresponds to a cross-section taken along line BB ′ of FIG.

[0063] The alumina layer 82a is formed in a rectangular shape as lacking four corners corresponding to the four corners R ₁ to R ₄ of the groove 38a as shown in FIG. 36. As a result, four corners of the Cu layer 74 is exposed to correspond to the four corners _R 1 to R ₄ of the groove 38a. This is to enable distribution of the etchant in the next etching process.

In the step of FIG. 28, all the Cu layers 44, 74, 52a and 48a (see FIGS. 31 and 32B) as sacrificial layers are removed by wet etching using an etchant for dissolving Cu. As a result, the movable mirrors 66a and 70 can move within the groove 38a as shown by the arrow a in FIGS. In the etching process at this time, the alumina layer 82a covers most of the groove 38a, and prevents the movable mirrors 66a and 70 from separating from the groove 38a. The alumina layer 82b is
The electromagnetic coil provided in the groove 38b is protected from an etchant.

FIG. 37 shows an optical switch according to another embodiment of the present invention. The same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description is omitted.

A feature of the optical switch shown in FIG. 37 is that a rotatable support arm 90 is provided as guide means for guiding the movement of the movable mirror 16. That is, on one main surface of the optical switch substrate, a shaft member 92 that rotatably holds a support arm 90 that supports the movable mirror 16 between the electromagnetic coils 18 and 20 is provided. One end of the support arm 90 is connected to the upper part of the movable mirror 16, and the distal end of the shaft member 92 is inserted into a shaft hole provided near the other end of the support arm 90 to hold the support arm 90. Is moved between the electromagnetic coils 18 and 20 by an arrow a.
It is designed to be guided in the direction. The operation of moving the movable mirror 16 from the first position to the second position and the operation of moving the movable mirror 16 from the second position to the first position are the same as those described above with reference to FIGS.

FIG. 38 shows an optical switch according to still another embodiment of the present invention. The same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description is omitted.

A feature of the optical switch shown in FIG. 38 is that a flexible support arm 94 is provided as guide means for guiding the movement of the movable mirror 16. That is, on one main surface of the optical switch substrate, a fixing base 96 for fixing a flexible support arm 94 for supporting the movable mirror 16b between the electromagnetic coils 18 and 20 so as to be flexibly provided is provided. By connecting one end of the support arm 94 to the upper part of the movable mirror 16 and connecting the other end of the support arm 94 to the fixed base 96, the movement of the movable mirror 16 moves in the direction of arrow a between the electromagnetic coils 18 and 20. You will be guided.
The force required to bend the support arm 94 is applied to the electromagnetic coils 18 and 2.
0, the movable mirror 16 is moved from the first position to the second position,
The operation of moving from the position to the first position is shown in FIGS.
2 can be performed in the same manner as described above.

The optical switch shown in FIG. 37 or FIG. 38 has a simple structure in which the movable mirror 16 is guided by the rotatable support arm 90 or the deflectable support arm 94, so that miniaturization is easy. It can be easily manufactured using a thin film process or the like. In addition, since the self-holding action of the movable mirror 16 can be used, power consumption can be reduced.

The optical switch shown in FIG. 37 or FIG.
10a ₁ , 10a ₂ ,
It can be used in the air space by using an optical fiber or the like instead of the optical waveguide such as 12a ₁ and 12a ₂ , and is applicable to an optical path switching device as shown in FIGS. 51 and 52, for example.

FIG. 39 shows a schematic configuration of a multi-turn electromagnetic coil 100 used in the embodiment of the present invention.
The electromagnetic coil 100 has a long and thin magnetic core 102 made of a magnetic material such as a Ni-Fe alloy, for example.
Etc. are wound twice. The conductive layer is
The first conductive layer 104 wound on the inside and the second conductive layer 106 wound on the outside are connected at a point CP,
Power is supplied from the terminals T ₁ and T ₂ . FIG.
Although not shown, insulating layers are respectively disposed between the magnetic core 102 and the first conductive layer 104 and between the first conductive layer 104 and the second conductive layer.

According to the above-described electromagnetic coil 100, the length Lc can be reduced to half of that of the single-wound electromagnetic coil (for example, 18) shown in FIGS. The electromagnetic coil 100 is shown in FIGS.
The optical switch shown in FIG. 38 can be used instead of a single-wound electromagnetic coil. This makes it possible to reduce the size of the optical switch, which is advantageous when integrating a plurality of optical switches.

As an example, in the optical path switching device of FIG.
And the optical switch S₁₁~ S₃₃Of each optical switch
When the electromagnetic coil 100 is used as the electromagnetic coil, the optical switch
Switch S ₂₂, S₃₁Light switches adjacent as shown
Distance L between switches_SCan be set large,
The magnetic interference between optical switches can be reduced.
In the optical path switching device as shown in FIG.
Providing a magnetic shield to reduce magnetic interference
However, when the electromagnetic coil 100 is used,
The field can be lightened or omitted. What
The electromagnetic coil shown in FIG. 39 is multiplexed three times or more.
It is also possible.

Next, a method for manufacturing the above-described double-wound electromagnetic coil will be described with reference to FIGS. In this case, in the groove forming step as shown in FIGS. 11 and 12, a concave portion for arranging the double-wound electromagnetic coil is formed in the cladding layer 38. In FIGS. Will be described. Although not specifically mentioned, it is a matter of course that any process that can be shared between the formation of the movable mirror and the formation of the double-wound electromagnetic coil may be shared.

In the step shown in FIG. 40, a Cr—Cu alloy layer 110 is formed as a plating seed layer on the upper surface of the clad layer 32 (the bottom surface of the above-mentioned concave portion) covering one main surface of the silicon substrate 30 by sputtering or the like. I do.

In the step of FIG. 41, the Cr—Cu alloy layer 11
After the resist layer 112 is formed so as to cover 0, a plurality of holes corresponding to a plurality of portions to be plated on the resist layer 112 are formed by photolithography. Then, a Cu layer 114 is formed for each hole of the resist layer 112 by plating using the resist layer 112 as a mask.

In the step of FIG. 42, after the resist layer 112 is removed, the Cr—Cu alloy layer 110 as a seed layer is removed in portions other than the plating portion by ion milling or the like, and only under each Cu layer 114. Cr-Cu alloy layer 110
To remain. The stack of each Cu layer 114 and the Cr-Cu alloy layer 110 thereunder is used as a lower conductive layer of the outer coil (corresponding to 106 in FIG. 39). Thereafter, an insulating layer 116 of alumina or the like is formed on the upper surface of the cladding layer 32 so as to cover the Cu layers 114 by a lift-off method or the like. The insulating layer 116 is formed so as to have connection holes CN ₁ and CN ₂ corresponding to contact portions near both ends of each Cu layer 114.

Next, in the step of FIG. 43, a Cu layer 118 is formed on the insulating layer 116 by the same selective plating process as described with reference to FIGS. Although a plurality of Cu layers 118 are formed in parallel, FIG.
One showed. Each Cu layer 118 is used as a lower conductive layer of the inner coil (corresponding to 104 in FIG. 39).

In the step of FIG. 44, an insulating layer 120 of alumina or the like is formed on the insulating layer 116 so as to cover each Cu layer 118 by a lift-off method or the like. The insulating layer 120 has a connection hole C corresponding to a contact portion near both ends of each Cu layer 118.
It is formed to have N ₃ and CN ₄ .

In the step of FIG. 45, the Ni—Fe alloy layer 1 for the magnetic core is selectively plated by using the resist layer as a mask.
22 is formed on the insulating layer 120. The Ni—Fe alloy layer 122 is formed with a predetermined length so as to cross over each of the Cu layers 114 and each of the Cu layers 116 (in FIG. 45, along the direction penetrating the paper). In the selective plating process, a Ni—Fe alloy layer can be used as a plating seed layer.

In the step of FIG. 46, Cu plating is performed for each Cu layer 114 by selective plating similar to that described with reference to FIGS.
The layers 124 and 126 are formed, and the Cu layers 128 and 130 are formed for each Cu layer 118. In each Cu layer 114, the Cu layers 124 and 126 correspond to the connection holes CN shown in FIG.
₁ and CN ₂ are formed so as to be respectively connected to two contact portions corresponding to CN ₂ . In each Cu layer 118,
The Cu layers 128 and 130 correspond to the connection holes CN ₃ and CN shown in FIG.
₄ are formed so as to be connected to the two contact portions corresponding to ₄ respectively. The Cu layers 124 and 126 are used as side conductive layers of the outer coil. Also, the Cu layers 128, 13
0 is used as the side conductive layer of the inner coil.

Next, in the step of FIG. 47, after forming the resist layer 132 on the upper surface of the substrate, the remaining resist layer is removed by photolithography so as to leave the resist layer 132 at the electromagnetic coil disposing portion. After hardening the resist layer 132 by baking, the resist layer 132 is polished to expose the upper portions of the Cu layers 124 to 130.

In the step of FIG. 48, a Cu layer 134 is formed on the resist layer 132 by the same selective plating process as described with reference to FIGS. The Cu layer 134 is used as an upper conductive layer of the inner coil.
Cu in the conductive layer consisting of layers 118, 128 and 130
Connected to the upper end of layer 128. Cu layers 118, 12
A similar Cu layer adjacent to the Cu layer 134 is connected to the upper end of the Cu layer 130 in the conductive layer composed of 8, 130 (in FIG. 48, the Cu layer 134 is connected to the upper end of the Cu layer 130). The cross section of the Cu layer 134 is different in position from the cross section of the Cu layer 130). In this way, by connecting the inner coil conductive layer in the resist layer 132 with the upper conductive layer such as the Cu layer 134, the inner coil conductive layer is spirally wound around the magnetic core Ni-Fe alloy layer 122. be able to.

Next, in the step of FIG.
2 and an insulating layer 1 of alumina or the like covering each Cu layer 134.
36 is formed by a lift-off method or the like. Insulating layer 136
Is formed so as to have a hole exposing the upper end of each Cu layer 124 and each Cu layer 126.

In the step of FIG. 50, Cu plating is performed on the insulating layer 136 by selective plating similar to that described with reference to FIGS.
A layer 138 is formed. The Cu layer 138 is used as an upper conductive layer of the outer coil.
Cu layer 1 in the conductive layer composed of 14, 124, 126
24 is connected to the upper end. Cu layers 114, 124, 1
A similar Cu layer adjacent to the Cu layer 138 is connected to the upper end of the Cu layer 126 in the conductive layer made of 26 (in FIG. 50, whether the Cu layer 138 is connected to the upper end of the Cu layer 126). However, the cross section of the Cu layer 138 is different in position from the cross section of the Cu layer 126). By connecting the outer coil conductive layer in the resist layer 132 with the upper conductive layer such as the Cu layer 138 in this manner, the outer coil conductive layer is spirally wound around the Ni—Fe alloy 122 for the magnetic core. Can be.

The coil manufacturing method described with reference to FIGS. 40 to 50 can be applied to the manufacturing of the single-layer wound coil shown in FIGS. Further, the method for manufacturing the coil described with reference to FIGS. 11 to 28 can be applied to the manufacturing of the multiple-turn coil illustrated in FIG.

The present invention is not limited to the above embodiment, but can be implemented in various modified forms. For example, the mover position switching device is not limited to application to an optical path switching device, but may be applied to an electric switch, a display device, and the like.

An example of each of the electric switch and the display device is as follows. To configure the electric switch, the ends of the two conductors are short-circuited by the mover when the mover is in the first position, and a short-circuit such as when the mover is in the second position. What is necessary is just to make it the structure which cancels. In addition, in order to configure the display device, the tips of a large number of optical waveguides (or optical fibers) are arranged in a dot matrix on the display panel surface, and a movable element is provided for each optical waveguide (or optical fiber) by the first or second optical waveguide. It may be configured to drive to the position 2 to control the light on / off.

[0089]

As described above, according to the present invention, it is possible to realize a small-sized and easy-to-manufacture mover position switching device and an optical switch, and it is possible to easily produce a minute mover housing structure.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an optical switch according to a first embodiment of the present invention.

FIG. 2 is a top view showing the optical switch of FIG. 1;

FIG. 3 is a perspective view showing an external configuration of a matrix type optical path switching device using the optical switch of FIG.

FIG. 4 is a perspective view showing an internal configuration of the apparatus shown in FIG.

FIG. 5 is a cross-sectional view of a substrate showing a step of depositing an under cladding layer and a core material layer in a method of manufacturing an optical switch.

FIG. 6 is a sectional view of the substrate showing a Cr sputtering step following the step of FIG. 5;

FIG. 7 is a cross-sectional view of a substrate showing a resist layer forming step following the step of FIG. 6;

8 is a cross-sectional view of the substrate showing an ion milling step and a resist removing step subsequent to the step of FIG. 7;

FIG. 9 is a sectional view of the substrate showing an RIE step following the step of FIG. 8;

FIG. 10 is a cross-sectional view of the substrate showing an over cladding layer deposition step following the step of FIG. 9;

FIG. 11 is a substrate cross-sectional view showing a Cr sputtering step and a resist layer forming step following the step of FIG. 10;

FIG. 12 is a substrate cross-sectional view showing an ion milling step and an RIE step following the step of FIG. 11;

FIG. 13 is a cross-sectional view of the substrate showing a Cu layer forming step following the step of FIG. 12;

14 is a cross-sectional view of the substrate showing a Cu sputtering step following the step of FIG.

FIG. 15 is a cross-sectional view of the substrate showing a resist layer forming step following the step of FIG. 14;

16 is a cross-sectional view of the substrate showing a Cu plating step, a resist removing step, and an ion milling step subsequent to the step of FIG.

FIG. 17 is a sectional view of the substrate showing an alumina layer forming step following the step of FIG. 16;

FIG. 18 is a cross-sectional view of the substrate showing a Ni—Fe alloy sputtering step and a resist layer forming step following the step of FIG. 17;

FIG. 19 is a substrate cross-sectional view showing a Ni—Fe alloy plating step, a resist removing step, and an ion milling step subsequent to the step of FIG. 18;

20 is a cross-sectional view of the substrate, showing an alumina layer forming step following the step of FIG. 19;

FIG. 21 is a cross-sectional view of the substrate showing a Co—Ni alloy sputtering step and a resist layer forming step following the step of FIG. 20;

FIG. 22 is a substrate cross-sectional view showing a Co—Ni alloy plating step, a resist removing step, and an ion milling step subsequent to the step of FIG. 21.

FIG. 23 is a sectional view of the substrate showing an alumina layer forming step following the step of FIG. 22;

FIG. 24 is a substrate cross-sectional view showing a Cu layer forming step following the step of FIG. 23.

FIG. 25 is a cross-sectional view of the substrate showing a Cu sputtering step and a resist layer forming step following the step of FIG. 24;

26 is a cross-sectional view of the substrate showing a Cu plating step, a resist removing step, and an ion milling step following the step of FIG. 25.

FIG. 27 is a substrate sectional view showing an alumina layer forming step following the step of FIG. 26.

FIG. 28 is a substrate cross-sectional view showing a Cu etching step following the step in FIG. 27.

FIG. 29 is a top view showing a state of forming a Cu layer in the step of FIG. 13;

FIG. 30 is a top view showing a resist layer formation state relating to the mirror guide groove in the step of FIG. 15;

FIG. 31 shows C in the mirror guide groove in the step of FIG. 16;
It is a board | substrate sectional view which shows a u layer formation situation.

FIG. 32 is a cross-sectional view of a substrate showing a resist layer formation state of the mirror guide groove and a Cu layer formation state in the mirror guide groove.

FIG. 33 is a top view showing a state of forming a resist layer relating to a coil arrangement groove in the step of FIG. 15;

34 is a partial cross-sectional perspective view showing the state of formation of the coil Cu layer in the step of FIG. 16;

FIG. 35 is a top view showing a state of forming a resist layer relating to a coil arrangement groove in the step of FIG. 25;

FIG. 36 is a top view showing the state of forming an alumina layer on the mirror guide groove in the step of FIG. 27;

FIG. 37 is a perspective view showing an optical switch according to another embodiment of the present invention.

FIG. 38 is a perspective view showing an optical switch according to still another embodiment of the present invention.

FIG. 39 is a perspective view showing a multi-turn electromagnetic coil used in the embodiment of the present invention.

FIG. 40 shows a graph of Cr− in the method of manufacturing the electromagnetic coil of FIG. 39;
FIG. 3 is a cross-sectional view of a substrate illustrating a Cu alloy sputtering step.

FIG. 41 is a sectional view of the substrate showing a Cu plating step following the step of FIG. 40.

42 is a sectional view of the substrate showing a resist removing step and an insulating layer forming step following the step of FIG. 41;

FIG. 43 is a substrate cross-sectional view showing a Cu layer forming step following the step of FIG. 42.

FIG. 44 is a substrate cross-sectional view showing an insulating layer forming step following the step in FIG. 43.

FIG. 45 is a substrate cross-sectional view showing a Ni—Fe alloy layer forming step following the step of FIG. 44.

FIG. 46 is a substrate cross-sectional view showing a Cu layer forming step following the step in FIG. 45.

FIG. 47 is a substrate cross-sectional view showing a resist layer forming step and a polishing step following the step of FIG. 46.

FIG. 48 is a substrate cross-sectional view showing a Cu layer forming step following the step of FIG. 47.

FIG. 49 is a substrate cross-sectional view showing an insulating layer forming step following the step of FIG. 48.

FIG. 50 is a substrate cross-sectional view showing a Cu layer forming step following the step in FIG. 49.

FIG. 51 is a top view showing an optical path switching device using a conventional optical switch.

FIG. 52 is a cross-sectional view of FIG. 51 taken along the line X-X ′.

[Explanation of symbols]

10a ₁ , 10a ₂ : input optical waveguides, 12a ₁ , 12a
₂ : Output optical waveguide, 10a to 10c, 12a to 12c:
Optical waveguide, 10A to 10C, 12A to 12C: optical fiber, 14: mirror guide groove, 16: movable mirror, 18, 2
0: electromagnetic coil, 22: housing, 24: optical switch board,
S _{11 to} S ₃₃ : optical switch, 30: silicon substrate, 3
2: Under cladding layer, 34: core material layer, 36, 4
0: Cr layer, 34a: core layer, 37, 37a, 42, 5
0, 58, 68, 78: resist layer, 38: over cladding layer, 38a: mirror guide groove, 38b: coil arrangement groove, 44, 48, 52, 74, 76, 80p, 80q:
Cu layer, 54, 62, 64, 72, 82a, 82b: alumina layer, 56, 60: Ni—Fe alloy layer, 66, 7
0: Co-Ni alloy layer, 90: support arm, 92: shaft member, 94: flexible support arm, 96: fixed base, 100:
Multi-turn electromagnetic coil, 102: magnetic core, 104, 106:
Conductive layer, 110: Cr-Cu alloy layer, 112, 132:
Resist layer, 114, 118, 124 to 130, 13
4,138: Cu layer, 116, 120, 136: Insulating layer, 122: Ni-Fe alloy layer.

Claims (13)

[Claims] 1. A substrate having one main surface, a mover made of a permanent magnet piece, and a guide member formed on one main surface of the substrate, wherein the guide is formed in a state where the mover is accommodated. A guide groove for guiding movement in a predetermined direction; and first and second electromagnetic coils formed on one main surface of the substrate so as to face each other across the guide groove in the predetermined direction. Wherein each of the electromagnetic coils has a configuration in which a conductive layer is wound around a magnetic core along the longitudinal direction, and at least the first electromagnetic coil is moved from the first position of the movable element in the guide groove to the second position. At least a second position.
Of the mover in the guide groove
For controlling movement from the first position to the first position. 2. The mover position switching device according to claim 1, wherein a lid member that covers an opening of the guide groove is attached to the guide member so that the mover does not separate from the guide groove. 3. The mover position switching device according to claim 1, wherein each of the electromagnetic coils has a configuration in which the conductive layer is wound around the magnetic core in a multiplex manner. 4. A substrate having one main surface, a movable mirror made of a permanent magnet piece, and a clad layer formed on one main surface of the substrate,
A guide groove for guiding the movement of the movable mirror in a predetermined direction in a state where the movable mirror is accommodated; and a light guide for the movable mirror when the movable mirror is at a first position in the guide groove. A first optical waveguide formed of a first core layer formed in the cladding layer so that light is incident thereon, and reflected light from the movable mirror when the movable mirror is at a first position in the guide groove. A second optical waveguide consisting of a second core layer formed in the cladding layer to receive the movable mirror from the first optical waveguide when the movable mirror is in a second position in the guide groove A third optical waveguide formed of a third core layer formed in the cladding layer to receive incident light, and one main surface of the substrate facing the third optical waveguide along the predetermined direction with the guide groove interposed therebetween; The first and second electrodes formed in A magnetic coil, wherein each electromagnetic coil has a configuration in which a conductive layer is wound around a magnetic core along a longitudinal direction thereof, and at least a first electromagnetic coil is disposed at a first position of the movable mirror in the guide groove. An optical switch for controlling movement of the movable mirror from the second position to the first position in the guide groove. 5. The optical switch according to claim 4, wherein a refractive index matching oil for matching a refractive index between the inside of the guide groove and the first to third core layers is loaded in the guide groove. 6. The optical switch according to claim 4, wherein a lid member that covers an opening of the guide groove is attached to the cladding layer so that the movable mirror does not separate from the guide groove. 7. The optical switch according to claim 4, wherein each of the electromagnetic coils has a configuration in which the conductive layer is wound around the magnetic core in a multiplex manner. 8. A substrate having one main surface, and first and second electromagnetic coils disposed so as to face the main surface of the substrate at a predetermined distance from each other, wherein each of the electromagnetic coils is a magnetic core. And a permanent magnet piece disposed planarly movably between the first and second electromagnetic coils on one main surface of the substrate. And a support arm for supporting the movable mirror, and a holder disposed on one main surface of the substrate and rotatably holding the support arm between the first and second electromagnetic coils. And a light incident unit that impinges light on the movable mirror when the movable mirror is located at a first position between the first and second electromagnetic coils. When in the first position between the electromagnetic coils A first light deriving unit that receives reflected light from the movable mirror; and a second light receiving unit that receives incident light from the light incident unit when the movable mirror is at a second position between the first and second electromagnetic coils. At least the first electromagnetic coil controls the movement of the movable mirror from a first position to a second position, and at least the second electromagnetic coil controls the movement of the movable mirror. Second
An optical switch configured to control movement from a position to a first position. 9. The optical switch according to claim 8, wherein each of said electromagnetic coils has a configuration in which said conductive layer is wound around said magnetic core in a multiplex manner. 10. A substrate having one main surface, and first and second electromagnetic coils arranged so as to be opposed to one main surface of the substrate by a predetermined distance, wherein each of the electromagnetic coils is a magnetic core. And a permanent magnet piece disposed planarly movably between the first and second electromagnetic coils on one main surface of the substrate. And a flexible support arm that supports the movable mirror; and a flexible arm that is disposed on one main surface of the substrate and that flexibly fixes the support arm between the first and second electromagnetic coils. A light fixture that emits light to the movable mirror when the movable mirror is at a first position between the first and second electromagnetic coils; In the first position between the second electromagnetic coils First light deriving means for receiving reflected light from the movable mirror when the movable mirror is in a second position between the first and second electromagnetic coils; and incident light from the light incident means when the movable mirror is at a second position between the first and second electromagnetic coils. And second light deriving means for receiving the light, wherein at least the first electromagnetic coil controls the movement of the movable mirror from a first position to a second position, and The second of the movable mirror
An optical switch configured to control movement from a position to a first position. 11. The optical switch according to claim 10, wherein each of said electromagnetic coils has a configuration in which said conductive layer is wound around said magnetic core in a multiplex manner. 12. A step of forming a guide groove for guiding movement of the mover on one main surface of the guide member; a step of forming a first sacrificial layer covering a bottom surface and an inner wall surface of the guide groove; A second sacrifice layer is formed so as to fill a predetermined section corresponding to the length of the mover from one end of the guide groove to the other end without filling the predetermined section and the other end of the guide groove. Forming a magnetic material layer made of a magnetic material for a permanent magnet so as to fill the predetermined section in the guide groove; removing the first and second sacrificial layers by an etching process; Leaving a layer in the guide groove as the mover. 13. A step of forming a third sacrifice layer covering the magnetic material layer and the guide groove after the formation of the magnetic material layer, and most of the guide groove via the third sacrifice layer. And forming a lid member on the guide member so as to expose a part of the third sacrificial layer corresponding to a small portion of the guide groove. The method of manufacturing a mover housing structure according to claim 12, wherein the third sacrificial layer is removed together with the first and second sacrificial layers to leave the lid member.