JP2002121650A - Low thermal expansion alloy thin sheet and electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low thermal expansible alloy thin sheet excellent in the adhesion of a resist. SOLUTION: The invention has been made by finding the fact that there is extremely strong corelation between the content of carbon stuck to the surface of an alloy thin sheet and the defect in the shape of etching and is composed of an Fe-Ni based low thermal expansible alloy thin sheet containing, by mass, 30 to 52% Ni or an Fe-Ni-Co based low thermal expansible alloy thin sheet containing 26 to 38% Ni and 1 to 20% Co, and in which the content of carbon stuck to the surface of the thin sheet is <=2.0 mg/m2, preferably, <=1.0 mg/m2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an Fe--Ni or F
The present invention relates to an e-Ni-Co-based low thermal expansion alloy sheet and an electronic component using the same.

[0002]

2. Description of the Related Art Fe-Ni alloys and Fe-Ni-Co alloys are typical invar alloys having invar characteristics. Such an Invar alloy practically hardly causes thermal expansion near room temperature. Therefore, it is widely applied to fields such as precision measurement equipment and control equipment that dislike thermal expansion.

[0003] For example, electronic parts such as shadow masks for color picture tubes and lead frames for ICs made using alloys having low thermal expansion are subjected to very fine processing.
Blackened and commercialized. This fine processing is usually performed by a photo-etching technique. That is, a fine pattern is formed by applying a photoresist on the surface of the low thermal expansion alloy thin plate, performing exposure and development to form a resist pattern, and selectively etching the thin plate using the resist pattern as a mask.

[0004] The etching technique applied to the alloy thin plate is required to have a high etching rate, obtain a shape with high dimensional accuracy, and the like. As described above, electronic components such as shadow masks and lead frames require advanced etching techniques. To obtain an etched shape with high dimensional accuracy, the adhesion between the surface of the alloy thin plate and the resist is extremely important. In other words, depending on whether the resist pattern formed on the surface of the alloy sheet after coating, exposure and development steps maintains adhesion without peeling off from the surface of the alloy sheet, the shape of the product and its dimensional accuracy are greatly affected. This is because

[0005]

However, under the present circumstances, when a resist pattern is formed on a low thermal expansion alloy thin plate as described above, the resist pattern peels off frequently, so that etching with high dimensional accuracy is performed. There is a problem that you can not. In order to improve the adhesion between the surface of the alloy thin plate and the resist, for example, Japanese Patent Application Laid-Open No. 7-252601 proposes to control the surface roughness of the alloy thin plate and the thickness of the surface oxide film. Even on a controlled alloy thin plate surface, sufficient resist adhesion may not be obtained, which may cause an etching shape defect.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the problems of the prior art and to provide a low thermal expansion alloy thin plate excellent in resist adhesion and an electronic component using this alloy thin plate.

[0007]

Means for Solving the Problems The present inventors have proposed Fe-N
As a result of various studies on the etching properties of i-type or Fe-Ni-Co type low thermal expansion alloy thin plates, poor resist adhesion causing poor etching shape was strongly affected by carbon attached to the alloy thin plate surface. And found that there is a very strong correlation between the amount of carbon attached to the surface of the alloy sheet and the poor etching shape.

That is, the Fe—Ni-based alloy thin plate or the Fe—Ni—Co-based alloy thin plate applied to a shadow mask or the like can be obtained, for example, by melting molten steel refined in an electric furnace by VAD (vacuum-electrolytic degassing) and VOD ( (Vacuum-oxygen decarburization method), and after ingot rolling and hot rolling of the steel ingot obtained by casting it, cold rolling, annealing, cold finishing rolling, and alkaline electrolytic treatment (washing) are performed. Continuously casting the molten steel obtained by adjusting the components by successively or converter refining, and after hot rolling this slab, cold rolling, annealing, cold finish rolling,
It is manufactured by sequentially performing alkaline electrolytic treatment (washing). By controlling the amount of carbon adhering to the surface of the finally obtained alloy sheet to a certain level or less, the adhesiveness of the resist is remarkably improved, and the etching is performed. It has been found that shape defects can be effectively prevented.

The present invention has been made based on such findings, and the features thereof are as follows. [1] Ni: Fe-Ni-based low thermal expansion alloy thin plate containing 30 to 52 mass%, characterized in that the amount of carbon deposited on the surface of the thin plate is 2.0 mg / m ² or less. Alloy sheet. [2] Ni: 26 to 38 mass%, Co: 1 to 20 mass%
A Fe-Ni-Co-based low thermal expansion alloy sheet of containing, low thermal expansion alloy sheet adhesion amount of carbon sheet surface, characterized in that it is 2.0 mg / m ² or less.

[3] In the alloy thin plate of the above [1] or [2],
A low thermal expansion alloy thin plate, characterized in that the amount of carbon deposited on the surface of the thin plate is 1.0 mg / m ² or less. [4] In the alloy thin plate according to any one of the above [1] to [3], the amount of carbon deposited on the surface of the alloy thin plate is a waveform in the method for quantifying total carbon in a trace amount region in steel described in Appendix 5 of JIS G1211. A low-thermal-expansion alloy sheet characterized by having a carbon amount that can be quantified as carbon adhering to the surface of the alloy sheet when the separation method is used. [5] An electronic component characterized by using the alloy thin plate of the above [1] to [4] as a material.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention and the reasons for limitation will be described below. The present inventors firstly found that a portion where the resist pattern formed on the surface of the Fe-Ni-based alloy thin plate or the Fe-Ni-Co-based alloy thin plate was peeled off had another good resist adhesion. The difference from the site was examined in detail with a scanning electron microscope equipped with an elemental analysis function. As a result, it was confirmed that carbon was concentrated on the surface of the portion where the resist was stripped. It is considered that such a carbon enrichment phenomenon on the surface of the alloy thin plate is caused by, for example, oil and dust adhering to the surface of the alloy thin plate seizing during annealing. In this case, most of the oil and dust brought into the annealing furnace are burned and decomposed by being exposed to the high-temperature atmosphere during annealing, and are converted into gases such as CO, CO ₂ , and H ₂ O in the atmosphere gas. It is considered that some carbon remains on the surface of the alloy sheet and is observed as a concentration phenomenon. Therefore, based on this finding, the following investigation was conducted by focusing on the relationship between the amount of carbon adhering to the surface of the alloy thin plate and the etching shape defect rate caused by poor resist adhesion.

First, using a Fe—Ni alloy thin plate manufactured under various conditions, a photoresist is applied in a laboratory,
After performing exposure and development, perform photoetching,
The occurrence frequency of etching shape defects was investigated. In the case of photoetching in a laboratory, if the frequency of occurrence of shape defects is 1% or less, there is no problem in an actual photoetching line. The resist adhesion was also evaluated by a grid test based on JIS D0202. In the evaluation of the resist adhesion, the case where the resist film was not peeled was evaluated as good adhesion ("O"), and the case where the resist film was peeled was evaluated as poor adhesion ("x").

[0013] Next, the Fe-N
Several sheets having a sample weight of about 1 g were sampled from the i-type alloy sheet, and the amount of carbon attached to the alloy sheet surface was quantitatively analyzed by an electric resistance heating-infrared absorption method.

The carbon adhering to the surface of the alloy sheet is determined by JIS
G1211 can be quantified by conforming to the waveform separation method in the method for quantifying total carbon in a trace amount region of steel described in Appendix 5 of G1211. That is, the sample is heated to a high temperature in an oxygen stream, and all carbon is oxidized to carbon dioxide and / or carbon monoxide, which is sent to an infrared absorption detector together with oxygen to determine the amount of carbon. If the intensity of carbon dioxide and / or carbon monoxide is continuously measured by expanding the gas generated in the time axis, a specific waveform pattern is obtained depending on the source of carbon dioxide and / or carbon monoxide. In a normal sample, first, a peak (first peak) due to atmospheric carbon dioxide and / or carbon monoxide involved when the sample is inserted into the furnace, and then a carbon attached to (or adsorbed on) the sample surface. A peak due to carbon dioxide and / or carbon monoxide generated (second peak), and finally a peak due to carbon dioxide and / or carbon monoxide generated by burning carbon in the metal (third peak) are obtained. . Therefore, by separating and quantifying the waveform of the second peak, it is possible to determine the amount of carbon attached to the surface of the alloy thin plate.

FIG. 1 shows an example of the result of quantifying the amount of carbon by the above method. As shown in the figure, the three peaks were clearly separated, and the quantitative value of the third peak coincided with the carbon content of this material (alloy sheet), so that it adhered to the alloy sheet surface. It was confirmed that carbon could be quantitatively determined. FIG. 2 shows the relationship between the amount of carbon adhering to the surface of each test material measured by the above method and the frequency of occurrence of defective etching shapes. Table 1 shows the amount of carbon adhering to the surface and the resist adhesion of some of the test materials.

[0016]

[Table 1]

According to FIG. 2, the amount of carbon deposited on the surface of the alloy thin plate
Strong correlation between frequency and frequency of occurrence of etching shape defects
It can be confirmed that there is. Specifically, on the surface of the alloy sheet
2.0mg / m attached carbon²In the following areas,
The occurrence frequency of chin shape defects is suppressed to 1% or less.
1.0mg / m of carbon attached to the alloy sheet²Less than
No defective etching shape occurred at all in the region.
On the other hand, the amount of carbon adhering to the surface of the alloy sheet was 2.0%.
mg / m²In the area exceeding, etching shape defects frequently occur
Degree exceeds 1%.
There is a tendency that the frequency of occurrence of defective chins tends to increase.
Also, according to Table 1, the resist adhesion is the surface of the alloy sheet.
2.0mg / m of deposited carbon²The following areas are good
On the other hand, the amount of carbon adhering to the surface is 2.0 mg / m ²Beyond
Then, the resist film is peeled off.

Based on the above results, the present invention
The frequency of occurrence of etching shape defects due to poor adhesion
To a level that does not cause any problems in photo etching lines
From the viewpoint of the ability to reduce the amount of carbon adhering to the
mg / m²The following is assumed. In addition, it adhered to the alloy sheet surface
1.0mg / m carbon content²Below is completely etched shape
Since no defects occur, the charcoal adhering to the alloy sheet surface
Elementary quantity is 1.0mg / m ²More preferably
No. The smaller the amount of carbon attached to the surface is, the more preferable.
0.1mg / m²The lower limit is
preferable.

Here, the amount of deposited carbon on the surface of the alloy thin plate specified by the present invention is determined by using the waveform separation method in the method for quantifying total carbon in a trace amount of steel described in Appendix 5 of JIS G1211. The amount of carbon that can be quantified as carbon adhering to or adsorbing on the surface of an alloy thin plate is preferably defined. This is because the amount of carbon adhering (or adsorbed) on the surface of the alloy thin plate can be determined with the highest accuracy by the above method.

As described above, in this measuring method, a sample is heated to a high temperature in a stream of oxygen, and all carbon is oxidized to carbon dioxide and / or carbon monoxide, which is converted together with oxygen into an infrared absorption detector. Is a method of determining the amount of carbon dioxide by sending the gas to the timeline. If the intensity of carbon dioxide and / or carbon monoxide is continuously measured by expanding the gas generated by oxidation, the generation of carbon dioxide and / or carbon monoxide A particular waveform pattern is obtained depending on the source. For normal samples, the atmospheric carbon dioxide and / or
Or a peak due to carbon monoxide (first peak), then a peak due to carbon dioxide and / or carbon monoxide generated from carbon adhering (or adsorbing) to the sample surface (second peak), and finally a peak in the metal. Peak due to carbon dioxide and / or carbon monoxide generated by burning carbon (third peak)
Is obtained. Therefore, by separating and quantifying the waveform of the second peak, it is possible to determine the amount of carbon attached (or adsorbed) on the surface of the alloy thin plate.

The composition of the low thermal expansion alloy sheet of the present invention will be described below. The alloy thin plate of the present invention has a Ni: 3
It is a Fe-Ni-based alloy thin plate containing 0 to 52 mass% or an Fe-Ni-Co-based alloy thin plate containing 26 to 38 mass% of Ni and 1 to 20 mass% of Co. Fe-Ni
When the Ni content is less than 30 mass% or more than 52 mass% in the thin alloy sheet, the coefficient of thermal expansion becomes large, and the low thermal expansion performance characteristic of the present alloy cannot be obtained.

When the content of Co is less than 1% by mass, the low thermal expansion is not significantly affected. When the Fe—Ni—Co alloy thin sheet contains 1 to 20 mass% of Co, the range of Ni to satisfy the desired low thermal expansion performance is 26 to 3%.
8 mass%. Therefore, when Co is contained in an amount of 1 to 20% by mass, Ni is set in a range of 26 to 38% by mass. On the other hand, if Co exceeds 20% by mass, the low thermal expansion property is rather deteriorated. Therefore, the upper limit of Co is set to 20% by mass. An alloy having such a component composition has an excellent low thermal expansion property having an average coefficient of thermal expansion of 2.0 × 10 ⁻⁵ or less at a normal use temperature range of 0 ° C. to 100 ° C. The low thermal expansion performance required for various electronic components can be sufficiently satisfied.

The Fe—Ni-based alloy sheet of the present invention and Fe—
The Ni-Co alloy thin plate is made of a material other than Fe, Ni or Fe, N
The composition of the alloy other than i and Co is not particularly limited. For example, the following alloy compositions can be used. Fe-Ni alloy thin plate; Ni: 30 to 52 mass%,
C: 0.1 mass% or less, Si: 0 to 0.4 mass%, C
r: 0 to 0.1 mass%, Co: 0 to 0.05 mass%,
O: 0 to 0.01 mass%, S: 0 to 0.005 mass
%, N: 0 to 0.01 mass%, Al: 0 to 0.05 mass
s%, P: 0 to 0.01 mass%, Ca: 0 to 0.01 m
ass%, Mg: 0 to 0.01 mass%, Ti: 0 to 0.
1 mass%, Mo: 0 to 0.01 mass%, V: 0 to 0.
01 mass%, Nb: 0 to 0.01 mass% (when the lower limit is 0 mass%, all cases include no addition), and the balance is substantially Fe

Fe--Ni--Co alloy thin plate; Ni: 26
-38 mass%, Co: 1-20 mass%, C: 0.1 ma
ss% or less, Si: 0 to 0.4 mass%, Cr: 0 to 0.
1 mass%, O: 0 to 0.01 mass%, S: 0 to 0.0
05 mass%, N: 0 to 0.01 mass%, Al: 0
0.05 mass%, P: 0 to 0.01 mass%, Ca: 0
To 0.01 mass%, Mg: 0 to 0.01 mass%, T
i: 0 to 0.1 mass%, Mo: 0 to 0.01 mass%,
V: 0 to 0.01 mass%, Nb: 0 to 0.01 mass%
(When the lower limit is 0 mass%, the case where none is added is included), and the balance is substantially Fe

If necessary, alloy elements such as Mn of 0 to 1 mass% (including no addition) and B of 0 to 0.03 mass% (including no addition) may be contained. The operation and effect of the present invention are not impaired. These Mn and B are effective for improving hot workability. However, these Mn and B
, The total amount is preferably 1% by mass or less.

Therefore, the preferred forms of the component compositions of the Fe—Ni-based alloy thin plate and the Fe—Ni—Co-based alloy thin plate of the present invention are as follows. [1] Ni: a low thermal expansion alloy thin sheet containing 30 to 52 mass%, the balance being Fe and unavoidable impurities. [2] Ni: 26 to 38 mass%, Co: 1 to 20 mass%
And a low thermal expansion alloy sheet comprising the balance of Fe and unavoidable impurities.

[3] Ni: 30 to 52 mass%, C: 0.
1 mass% or less, Si: 0 to 0.4 mass%, Cr: 0
0.1 mass%, Co: 0 to 0.05 mass%, O: 0
0.01 mass%, S: 0 to 0.005 mass%, N: 0
-0.01 mass%, Al: 0-0.05 mass%, P:
0 to 0.01 mass%, Ca: 0 to 0.01 mass%, M
g: 0 to 0.01 mass%, Ti: 0 to 0.1 mass%,
Mo: 0 to 0.01 mass%, V: 0 to 0.01 mass%
%, Nb: 0 to 0.01 mass% (the lower limit is 0 mass
%, Including the case where none is added), and a low-thermal-expansion alloy sheet whose balance is substantially composed of Fe.

[4] Ni: 26 to 38 mass%, Co: 1
-20 mass%, C: 0.1 mass% or less, Si: 0
0.4 mass%, Cr: 0 to 0.1 mass%, O: 0
0.01 mass%, S: 0 to 0.005 mass%, N: 0
-0.01 mass%, Al: 0-0.05 mass%, P:
0 to 0.01 mass%, Ca: 0 to 0.01 mass%, M
g: 0 to 0.01 mass%, Ti: 0 to 0.1 mass%,
Mo: 0 to 0.01 mass%, V: 0 to 0.01 mass
%, Nb: 0 to 0.01 mass% (the lower limit is 0 mass
%, Including the case where none is added), and a low-thermal-expansion alloy sheet whose balance is substantially composed of Fe.

[5] In the alloy thin plate of the above [3] or [4],
Furthermore, M of 0 to 1 mass% (including the case of no addition)
n, 0 to 0.03 mass% (including no additive) B
A low thermal expansion alloy sheet containing:

Next, a method for producing an alloy sheet according to the present invention will be described. The alloy steel used as the rolling material may be a slab obtained by continuous casting or ingot casting and slab rolling of steel adjusted to a predetermined composition by converter refining and secondary refining, or refining in an electric furnace. After smelting steel refined by (vacuum-arc degassing method) and VOD (vacuum-oxygen decarburization method), the slab may be formed by slab rolling. The slab thus obtained is subjected to hot rolling, cold rolling, annealing, alkaline electrolytic treatment or the like in accordance with a conventional method, and a predetermined thickness of Fe-
It is a Ni-based or Fe-Ni-Co-based alloy thin plate. Specifically, for example, the slab is hot-rolled, pickled, cold-rolled, annealed, and cold finish-rolled, and then subjected to alkali electrolytic treatment to form a thin plate.

The amount of carbon adhering to the surface of the alloy thin plate is determined, for example, by the temperature, concentration,
It is possible to control by appropriately adjusting the charge density and the like, or by appropriately adjusting the hydrogen concentration and the annealing temperature in the atmosphere in the above-described annealing. Therefore, it is possible to control the carbon deposition amount by adjusting these. Can be.

For example, in the alkaline electrolysis treatment, generally, the higher the liquid temperature and the higher the concentration of the alkali component,
Furthermore, the higher the electrolytic density, the greater the effect of removing carbon adhering to the surface. However, when the concentration of the alkali component reaches a certain value, the action of removing surface-adhered carbon is saturated, and in some cases, the action of removing carbon is reduced. The concentration at which the action of removing surface-adhered carbon is maximized depends on the type of alkaline solution used. In addition, the temperature at which the carbon adhering to the surface can be most effectively removed differs depending on the type of the alkaline solution used. Therefore, by selecting the above alkaline electrolysis conditions in consideration of these factors and the component composition of the target alloy thin plate, the amount of carbon adhering to the surface of the alloy thin plate can be suppressed to a desired level or less. When the alloy thin plate obtained as described above is subjected to a photoetching process using a material as a material, electronic components such as a shadow mask for a color picture tube and a lead frame for an IC can be obtained.

[0033]

[Example 1] Ni: 36.0 mass%, C: 0.003 m by a series of refining by an electric furnace, VAD (vacuum-electrolytic degassing method) and VOD (vacuum-oxygen decarburizing method).
ass%, Si: 0.03 mass%, Mn: 0.4 mass
%, Cr: 0.03 mass%, O: 0.001 mass%,
S: 0.001 mass%, N: 0.02 mass%, Al:
0.03 mass%, P: 0.04 mass%, Co: 0.0
An Fe-Ni-based alloy consisting of 1 mass% and the balance substantially consisting of Fe was melted and cast to obtain a steel ingot. The steel ingot was subjected to hot rolling, pickling, cold rolling, annealing, cold finishing rolling, and alkaline electrolysis in this order to obtain a sheet thickness of 0.1%.
A 3 mm shadow mask alloy sheet was used.

In this embodiment, the annealing conditions (hydrogen concentration and annealing temperature in the annealing atmosphere) and / or alkaline electrolysis conditions (the temperature and concentration of the alkaline solution in the alkaline electrolysis, the charge density) and the like in the above manufacturing process are adjusted. Thus, the amount of carbon deposited on the surface of the alloy thin plate was variously changed. A sample for determining the amount of carbon attached to the surface was collected from the alloy thin plate, and the amount of carbon attached to the surface was quantified by a method based on Appendix 5 of JIS G1211 described above. At the same time, JIS D
A cross-cut test based on No. 0202 was performed to evaluate the resist adhesion. In the evaluation of the resist adhesion, the case where the resist film was not peeled was evaluated as good adhesion ("O"), and the case where the resist film was peeled was evaluated as poor adhesion ("x"). Further, a photo-resist was applied to each thin plate, exposed to light and developed, and then subjected to photo-etching, and the occurrence frequency of an etching shape defect at that time was investigated.

Table 2 shows the results. According to Table 2, Comparative Examples 1 to 4 had a carbon amount of 2.0 mg / m ^{2 on the} surface.
, The adhesiveness of the resist is poor, and the occurrence frequency of the etching shape defect also exceeds 1%. On the other hand, Examples 1 to 8 of the present invention, in which the amount of carbon adhering to the surface is within the range of the present invention, have good resist adhesion, and the occurrence frequency of etching shape defects is suppressed to 1% or less.
In particular, in Examples 1 to 4 of the present invention in which the amount of carbon adhering to the surface is 1.0 mg / m ² or less, the occurrence frequency of the etching shape defect is 0%.
It has become.

[0036]

[Table 2]

Example 2 Ni: 32.4 mass%, Co: 5.8 m by a series of refining using an electric furnace, VAD (vacuum-electrolytic degassing method) and VOD (vacuum-oxygen decarburizing method).
ass%, C: 0.003 mass%, Si: 0.03 mass
%, Mn: 0.3 mass%, Cr: 0.02 mass%,
O: 0.002 mass%, S: 0.002 mass%, N:
0.01 mass%, Al: 0.02 mass%, P: 0.0
Fe-Ni- consisting of 3 mass% and the balance substantially consisting of Fe
A Co-based alloy was melted and cast to obtain a steel ingot. The ingot was subjected to each of the steps of hot rolling, pickling, cold rolling, annealing, cold finish rolling, and alkaline electrolytic treatment to obtain a 0.13 mm-thick alloy thin sheet for a shadow mask.

Also in this embodiment, the annealing conditions (hydrogen concentration and annealing temperature in the annealing atmosphere) and / or alkaline electrolysis conditions (liquid temperature and concentration of alkaline solution in alkaline electrolysis, charge density) and the like in the above manufacturing process are adjusted. By doing
The amount of carbon deposited on the surface of the alloy sheet was varied. With respect to this alloy thin plate, the amount of carbon adhering to the surface, the evaluation of resist adhesion, and the frequency of occurrence of an etching shape defect when performing photoetching were examined in the same manner as in Example 1.

Table 3 shows the results. According to Table 3, Comparative Examples 1 to 3 had a surface attached carbon amount of 2.0 mg / m ^2.
, The adhesiveness of the resist is poor, and the occurrence frequency of the etching shape defect also exceeds 1%. On the other hand, the present invention example 1 in which the amount of carbon attached to the surface is within the range of the present invention.
No. 6 to No. 6 have good resist adhesion, and the occurrence frequency of etching shape defects is suppressed to 1% or less. Above all, Examples 1 to 3 of the present invention, in which the amount of carbon adhering to the surface is 1.0 mg / m ² or less, have an etching shape defect occurrence frequency of 0%.

[0040]

[Table 3]

[0041]

As described above, the low-thermal-expansion alloy thin plate of the present invention has excellent resist adhesion, and therefore, it is possible to obtain an electronic component free from a defective etching shape.

[Brief description of the drawings]

FIG. 1 is a graph showing a carbon extraction behavior of an alloy thin plate by an electric resistance heating-infrared absorption method.

FIG. 2 is a graph showing the relationship between the amount of carbon deposited on the surface of an alloy thin plate and the frequency of occurrence of defective etching shapes.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuya Kaneko 1-2-1, Marunouchi, Chiyoda-ku, Tokyo Inside Nihon Kokan Co., Ltd. (72) Inventor Akira Yamamoto 1-2-1, Marunouchi, Chiyoda-ku, Tokyo Nippon Kokan Co., Ltd. (72) Inventor Yasuhiro Morita 1-2-1 Marunouchi, Chiyoda-ku, Tokyo F-term in Nihon Kokan Co., Ltd. 5C027 HH02 5C031 EE05

Claims (5)

[Claims] 1. F containing Ni: 30 to 52 mass%.
An e-Ni-based low-thermal-expansion alloy sheet, wherein the amount of carbon deposited on the sheet surface is 2.0 mg / m ² or less. 2. Ni: 26 to 38 mass%, Co: 1 to 2
An Fe-Ni-Co-based low thermal expansion alloy sheet containing 20 mass%, the amount of carbon deposited on the sheet surface being 2.0 m
g / m ² or less. 3. The amount of carbon deposited on the surface of a thin plate is 1.0 mg / m.
The low thermal expansion alloy thin plate according to claim 1 or 2, wherein the thickness is ² or less. 4. The amount of carbon deposited on the surface of an alloy thin plate is determined according to JIS.
When the waveform separation method in the method for total carbon determination in a trace amount of steel described in Appendix 5 of G 1211 is used, the carbon amount can be quantified as carbon adhering to the surface of the alloy thin plate. The low thermal expansion alloy thin plate according to claim 1, 2 or 3, wherein: 5. An electronic component comprising the alloy thin plate according to claim 1, 2, 3 or 4.