JP2002117762A - Plasma display panel and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a plasma display panel having a stable discharge characteristic and capable of realizing excellent display quality. SOLUTION: Before a front plate is stuck to a back plate, the heat treatment of a protective layer is carried out at 150-300 deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel used for a display device and the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 1 is a perspective view of an essential part schematically showing an alternating current (AC) type plasma display panel.

In the plasma display panel shown in FIG. 1, a display electrode 12 is formed on a front glass substrate 11, and the entire surface thereof is covered with a dielectric layer 13 and a protective layer 14.

On the other hand, an address electrode 22 is formed on a rear glass substrate 21, the entire surface thereof is covered with a dielectric layer 23, and a partition 24 is formed thereon. Then, the phosphor layers (25, 26, 27) are formed by disposing each color phosphor paste including a red phosphor, a green phosphor, and a blue phosphor in each space sandwiched by the partition walls 24.

A discharge space 30 between the two glass substrates is filled with a gas mixture of Ne—Xe, and the phosphor layers (25, 26, 27) are irradiated with vacuum ultraviolet light (147 nm) having a short wavelength generated by the discharge. Are excited, and visible light of R, G, B is emitted from the front glass substrate side to perform color display.

[0006]

The discharge characteristics of the above-mentioned plasma display panel, such as the discharge voltage, vary within the panel surface, and the discharge voltage becomes high and there are places where light emission is unstable. Was. It is considered that this largely depends on the formation conditions, film quality, and the like of the protective layer 14 in contact with the discharge space 30, but the details are unknown.

However, the substrate on which the dielectric layer and the protective layer are formed is taken out into the air after the formation of the protective layer and is exposed to the air until the front and rear plates are assembled. (Especially H ₂ O) in addition to the adsorption and reaction taking place, for example Mg
When an O film is formed by a vacuum evaporation method, impurities such as H ₂ O which are taken into the film at the time of film formation and an impurity gas in the film forming apparatus are also adsorbed. Also contains impurities (especially H ₂ O). Therefore, when the panel is formed, the impurity gas is released from the protective layer to the discharge space, and such an impurity gas is considered to affect the discharge characteristics of the panel.

[0008]

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a method of manufacturing a plasma display panel which realizes excellent display quality with stable discharge characteristics.

In order to achieve the above object, a method of manufacturing a plasma display panel according to the present invention is directed to a front panel and a rear panel each having at least one of a dielectric layer and a protective layer and at least one of a phosphor layer formed thereon. A heat treatment of the protective layer at a temperature of 150 ° C. to 300 ° C. after forming the protective layer and before bonding the front plate and the rear plate. It is characterized by the following. In addition, after the heat treatment, a time period during which the heat-treated substrate is exposed to the air is three hours or less before the front plate and the back plate are bonded to each other.

According to the present invention, the heat treatment of the protective layer is performed at a temperature of 150 ° C. to 300 ° C. after the protective layer is formed and before the front plate and the back plate are bonded to each other. The substrate on which is formed is taken out to the atmosphere after the formation of the protective layer, and an impurity gas (especially H ₂ O) that is adsorbed and reacts with the protective layer when exposed to the atmosphere, Impurities can be largely removed.

[0011] Further, after the heat treatment, the time during which the protective layer is exposed to the air before bonding the front plate and the rear plate is set to within 3 hours. Adsorption and reaction of gas (particularly H ₂ O) can be suppressed. Therefore, it is possible to reduce the emission of the impurity gas from the protective layer to the discharge space when the panel is formed, and it is possible to prevent the discharge characteristics of the panel from deteriorating. Therefore, it is possible to manufacture a plasma display panel that realizes excellent display quality with stable discharge characteristics.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a plasma display panel according to the present invention will be described based on specific embodiments. However, such embodiments do not limit the technical scope of the present invention.

FIGS. 1 and 2 are a perspective view and a sectional view, respectively, showing a main part of an AC surface discharge type plasma display panel according to the present embodiment. In these figures, only three cells are shown for convenience. However, in actuality, a number of cells that emit red (R), green (G), and blue (B) light are arranged, and a plasma display panel is formed. It is configured. FIG. 3 shows a flowchart of a manufacturing process of front plate 10 and back plate 20 according to the present embodiment.

First, a method of manufacturing the front plate 10 will be described. After an ITO film is formed on the entire surface of the front glass substrate 11 by a sputtering method, patterning is performed by a photolithography method to form a transparent electrode of ITO. Next, after a photosensitive silver paste is formed on the entire surface, an Ag bus electrode pattern is formed on the ITO by the same photolithography method, and the display electrode 12 is formed by drying and baking Ag. However, an Ag electrode is provided as a bus electrode on a transparent electrode of ITO.) A dielectric glass paste is applied thereon by a screen printing method and then fired to form a dielectric glass layer 13. Then, an MgO film is formed by a sputtering method, a vacuum evaporation method, or the like, and a protective layer 14 is formed on the entire surface of the dielectric glass layer 13 to form the front plate 10.
Thereafter, as shown in FIG. 3, before assembling the front plate 10 and the rear plate 20, the front plate 10 is subjected to a heat treatment of the protective layer at a temperature of 150 ° C. to 300 ° C.

Next, a method of manufacturing the back plate 20 will be described. First, the address electrode 22 is formed on the rear glass substrate 21 by the same method as the method of forming the Ag electrode on the front plate. A dielectric glass layer 23 is formed thereon by a screen printing method as in the case of the front plate and the panel. Then, the partition walls 24 are formed by a screen printing method or a sand blast method. One of a red (R) phosphor, a green (G) phosphor, and a blue (B) phosphor is disposed in each space between the partition walls 24 by a screen printing method, and dried and fired. Thus, the phosphor layers 25, 26, 27 are formed. Each color R,
For example, the following phosphors are used as the G and B phosphors.

Red phosphor: Y ₂ O ₃ : Eu ³⁺ Green phosphor: Zn ₂ SiO ₄ : Mn Blue phosphor: BaMgAl ₁₀ O ₁₇ : Eu ²⁺ Then, a sealing material layer made of low softening point glass Is formed by a screen printing method or the like (not shown in the figure), and the back plate 20 is formed.

The front plate 10 and the back plate 20 manufactured as described above are bonded together for sealing. Note that, after the heat treatment, the time during which the heat-treated substrate is exposed to the air is set to 3 hours or less. Then, after evacuating the inside of the discharge space 30 partitioned by the partition wall 24, a discharge gas composed of Ne and Xe is filled in, and aging is performed to produce a plasma display panel.

At the time of driving the plasma display panel, as shown in FIG. 4, each driver and panel driving circuit 40 are connected to the plasma display panel to apply a voltage between the scanning electrode 41 and the address electrode 43 of the cell to be turned on. After the address discharge is performed, the display electrodes 41,
A sustain voltage is applied by applying a pulse voltage between 42. Then, the cell emits ultraviolet light in accordance with the discharge, and is converted into visible light by the phosphor layer. An image is displayed by lighting the cell in this manner.

The present embodiment is characterized in that after forming the protective layer and before bonding the front plate and the rear plate, the heat treatment of the protective layer is performed at a temperature of 150 ° C. to 300 ° C. It is to do. By performing the heat treatment, the substrate on which the dielectric layer and the protective layer are formed is taken out into the atmosphere after the formation of the protective layer, and when exposed to the atmosphere, the impurity gas adsorbed and reacted with the protective layer (particularly, H ₂ O). ) And the impurities contained in the protective layer before exposure to the atmosphere can be largely removed. Therefore, it is possible to reduce the emission of the impurity gas from the protective layer to the discharge space when the panel is formed, and it is possible to prevent the discharge characteristics of the panel from deteriorating.

The heat treatment can significantly remove the impurity gas contained in the protective layer. However, if the protective layer is exposed to the air for a long time after the heat treatment, adsorption and reaction of the impurity gas newly occur. In addition, the effect of removing the impurity gas by the heat treatment is impaired. Therefore, the impurity gas (especially H
_In order to suppress the adsorption and reaction of 2O), it is desirable that the time of exposure to the air after the heat treatment until the bonding of the front plate and the back plate is performed within 3 hours.

[0021]

As described above, according to the present invention, after forming the protective layer, the substrate on which the dielectric layer and the protective layer are formed is stored in a vacuum, a dry gas atmosphere, or an inert gas atmosphere. Thus, the impurity gas (especially H
It is possible to suppress the adsorption and reaction of the ₂ O). Therefore, it is possible to reduce the emission of the impurity gas from the protective layer to the discharge space when the panel is formed, and to prevent the deterioration of the discharge characteristics of the panel. A plasma display panel that can be realized can be manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a conventional AC surface discharge type plasma display panel.

FIG. 2 is a schematic sectional view of a conventional AC surface discharge type plasma display panel.

FIG. 3 is a flowchart of a manufacturing process of a front plate and a back plate according to the present invention.

FIG. 4 is a diagram showing a plasma display panel display device in which a driving circuit is connected to the PDP of the present embodiment.

[Explanation of symbols]

 Reference Signs List 10 front plate 11 front glass substrate 12 display electrode 13 dielectric layer 14 protective layer 20 back plate 21 back glass substrate 22 address electrode 23 dielectric layer 24 partition 25 red phosphor layer 26 green phosphor layer 27 blue phosphor layer 30 discharge Space 40 drive circuit 41 scan electrode 42 sustain electrode 43 address electrode

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masafumi Okawa 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5C012 AA09 BC05 5C040 FA01 FA04 GB03 GB14 HA04 JA22 JA23 JA28 MA19

Claims (5)

[Claims] 1. A method of manufacturing a plasma display panel comprising a front plate and a back plate having at least one of a dielectric layer and a protective layer formed thereon and at least one of them having a phosphor layer formed thereon, the method comprising: A method for manufacturing a plasma display panel, comprising: performing a heat treatment on the protective layer at a temperature of 150C to 300C before bonding the back plate. 2. The method according to claim 1, wherein after the heat treatment of the protective layer, the heat-treated substrate is exposed to the air within 3 hours before the front plate and the back plate are bonded to each other. A manufacturing method of the plasma display panel according to the above. 3. The method according to claim 1, wherein the protective layer is a film made of magnesium oxide (MgO). 4. Between a pair of parallelly arranged plates,
4. A plasma display panel in which an electrode and phosphor layers of a plurality of colors are provided and a gas medium is sealed, wherein the plasma display panel is manufactured by the manufacturing method according to claim 1. 5. A plasma display panel display device comprising a plasma display panel and a driving circuit for driving the plasma display panel, wherein the plasma display panel is the plasma display panel according to claim 4. Plasma display panel display device.