JP2002117516A - Structure for connecting and packaging magnetic head slider, and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package structure and a manufacturing method by which high package density, cost reduction and high throughput are realized, and to provide a low-temperature connecting structure and method for the future. SOLUTION: The assembling man-hours are reduced by tape feeding, and the throughput is improved by the simultaneous connection of slider units. Reliability is secured by flexible connection made by a connecting structure using a tape. Microfabrication is achieved by the technology of forming a circuit pattern on the tape, and recognition accuracy is improved by a transparent tape. A connection temperature is reduced by connection made by using ultraviolet rays or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a magnetic head used in a magnetic recording apparatus, and more particularly to a fine and highly efficient assembly of a slider integrated with a slider element for input / output of a disk signal and a wiring. And a method for manufacturing the same.

[0002]

2. Description of the Related Art With the miniaturization and high functionality of information devices represented by personal computers and the like, magnetic disk devices are in a situation where miniaturization, high recording density and low cost are essential.

FIG. 1 shows an image diagram of a disk device. A disk-shaped disk has a structure in which a slider element for sensing reading and writing and a suspension for supporting the slider element are projected.

FIG. 2 is an enlarged view of the suspension portion. The suspension has a leaf spring structure, and a slider element is mounted on a tip portion. The reason for adopting such a structure is that it is necessary to control the distance between the disk and the slider to a micrometer level for sensing, and it is necessary to stably float against the wind pressure of the disk rotating at a high speed. .

[0005] However, in recent years, as the recording density has been improved, this interval tends to be further narrowed, and a method of inputting / outputting a signal from a slider has become a problem. In other words, as shown in FIG. 2, conventionally, wire bonding was directly performed on the slider element using a thin insulated wire, but the rigidity and weight of the wire affect the spring characteristics of the entire slider. And, consequently, adversely affect the flying characteristics. Therefore, as shown in FIG.
A so-called wiring-integrated suspension has appeared, in which a suspension is insulated with a polyimide resin or the like, a circuit pattern is formed thereon, and an insulating protective film is provided except for a connection electrode portion. Therefore, it was necessary to newly develop a connection structure and a method thereof.

On the other hand, FIGS. 4, 5 and 6 have been proposed and some of them have been put to practical use. However, each method has advantages and disadvantages as described below.

FIG. 4 shows an Au wire bonding method. This is a method in which the slider element electrode side is ball-bonded with an Au wire as used for connection of a general semiconductor element, the work is rotated by 90 degrees, and the suspension side is stitch-bonded. Except for a certain point, the method is basically the same as the method frequently used in semiconductors and the like, and it is expected that connection reliability is high. However, since the bonding directions are different by 90 degrees, there are problems in cost such as complexity of the apparatus and increase in throughput.

The method shown in FIG. 5 uses the same Au wire bonding as that shown in FIG. 4, but uses a method in which a ball is bonded from a 45 ° direction and both the slider and the suspension are connected by a single bonding. Yes, FIG. 4
The throughput is much better than that of the above method.
However, simultaneous connection from a 45-degree direction to a surface inclined at 90 degrees results in a difference in the cleanliness of both electrode surfaces and the need for uniform addition of ultrasonic output, making it difficult to ensure bonding reliability. There is a point.

On the other hand, the method shown in FIG. 6 is a method in which the tip of the pattern on the suspension side is made to float in a cantilever shape, and the slider is pressed and raised 90 degrees to perform lead bonding.
This is an application of the technology of A. Carrier package.

Although this method is considered to be good in both throughput and reliability, there is a practical problem that the processing cost of the suspension is greatly increased and the cost is increased.

As described above, all the methods have problems, and there has been a demand for a new joint structure and method which can solve these problems comprehensively.

[0012]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a mounting structure and a manufacturing method for realizing the above-mentioned high-density mounting, low cost and high throughput, and a low temperature connection structure and a method for the future. And

[0013]

A connecting pattern using a conductive polymer, a low-melting metal, or an anisotropic conductive material is formed on a transparent tape, and the sliders are collectively connected and automatically supplied in a tape form. Based on the premise of achieving low-temperature connection and high-throughput, tape manufacturing is based on flexible printed wiring and simple application of TCP technology.
A high-density, low-cost connection structure and process and a magnetic disk drive using the same are provided.

[0014]

<Embodiment 1> FIG. 7 shows an embodiment of the present invention. A pattern was formed on one surface of a transparent tape made of polypropylene having a thickness of 50 μm using a copper foil having a thickness of 18 μm so as to connect the electrode on the slider element side and the electrode on the suspension side. An adhesive layer having a thickness of about 20 μm and containing polyaniline as a main material was provided on the same surface.

FIG. 8 shows a process flow of the mounting. First, this tape is punched out to the width of the electrode forming surface of the slider (1.5 mm in this case), and the pattern forming surface is aligned with the electrode side as shown in FIG. At about 100 ° C., it was pressed against the slider and the suspension. Thereby, the tape is temporarily bonded. Subsequently, the connection was completed by irradiating with an ultraviolet lamp from a 45 degree direction for about 20 seconds. If left as it is for about one day, curing occurs at room temperature, and sufficient connection strength can be obtained.

It was confirmed that the sample had a life of 1000 cycles or more at a temperature cycle of -50 ° C. to 125 ° C., and that the sample had sufficient reliability. In addition, if it is within 8 hours after the connection, the tape and the slider are replaced because the curing is insufficient, so-called replacement (rework) of a defective product is possible.

The tape can be supplied in the form of a reel and is similar to the conventional tape carrier package connection process, so that automation is easy and high throughput can be realized. As the tape material, it is possible to use polyethylene or the like which is less expensive than a general tape carrier made of polyimide. If you use the transparent tape,
Positioning can be performed via a tape, the cost of the recognition system can be kept low, and overall cost can be reduced.

The maximum bonding temperature is 100 ° C. in the present embodiment. However, if the material is improved, the temperature can be further reduced, and the connection can be made according to the heat resistance of the element.

<Embodiment 2> FIG. 9 shows an embodiment of the present invention. A pattern was formed on one surface of a transparent tape made of polypropylene having a thickness of 50 μm using a copper foil having a thickness of 18 μm so as to connect the electrode on the slider element side and the electrode on the suspension side. Further, an anisotropic conductive sheet having a thickness of 15 μm was attached to the same surface. The anisotropic conductive sheet used was a commercially available tape in which conductive particles were dispersed. FIG. 10 shows the mounting process. After alignment in the same manner as in Example 1,
A tool heated to 150 ° C. was pressed and connected.

The conductive particles were pressed by the convex electrode portions, and a connection was obtained.

In this embodiment, a reliability test similar to that of the first embodiment was performed, and sufficient reliability was confirmed. Although the maximum temperature in this example is 150 ° C., the development of anisotropic conductive sheets is progressing at a rapid pace, and it is considered that a lower temperature process can be constructed in the future depending on the progress.

<Embodiment 3> FIG. 11 shows an embodiment of the present invention. A pattern was formed on one surface of a transparent tape made of polypropylene having a thickness of 50 μm using a copper foil having a thickness of 18 μm so as to connect the electrode on the slider element side and the electrode on the suspension side. Further, a Sn-Bi solder (melting point: 136 [deg.] C.) was formed on this pattern by plating to a thickness of 5 [mu] m. FIG. 12 shows the mounting process. After the alignment was performed in the same manner as in Example 1, a tool heated to 150 ° C. was pressed and connected.

The connection is a connection between the Au electrode and the solder, there is no need to use a flux, and no cleaning is required.

In this embodiment, a reliability test similar to that of the first embodiment was performed, and sufficient reliability was confirmed. Although the maximum temperature of the present embodiment is 150 ° C.,
C.) can be used to construct a lower temperature process. However, it is necessary to select a method in consideration of the operating temperature and reliability.

<Embodiment 4> FIG. 13 shows an embodiment different from the above connection structure. 50 made of polypropylene
A pattern is formed on one surface of a transparent tape having a thickness of 18 μm with a copper foil having a thickness of 18 μm so as to connect the electrode on the slider element side and the electrode on the suspension side.
A μm anisotropic conductive sheet was attached.

FIG. 14 shows the connection process. First, after alignment with the suspension, connection is made. This connection method is the same as in the second embodiment. In this state, the slider element is mounted and fixed. Further, the tape is bent and connected to the slider element side electrode by the same process. In this structure, although the connection process is performed in two stages, there is an advantage that the degree of freedom in wiring design on the suspension side is further increased.

In this embodiment, a reliability test similar to that of the first embodiment was performed, and sufficient reliability was confirmed.

[0028]

According to the present invention, the use of the connecting tape facilitates automation and improves the throughput.
Further, the connection temperature can be set lower than that of the conventional wire bonding method, and it is possible to cope with the tendency of the heat resistance of the element to decrease. The connection pitch can be connected within the range of the tape manufacturing capability, and it can sufficiently cope with a narrow pitch. Furthermore, the tape is basically flexible, and has high reliability after connection, especially in a temperature cycle.

[Brief description of the drawings]

FIG. 1 is a simple conceptual diagram of a magnetic disk drive to which the present invention is applied.

FIG. 2 is a structural view centering on a conventional slider.

FIG. 3 is a diagram showing a structural example of a wiring-integrated suspension to which the present invention is applied.

FIG. 4 is a diagram illustrating a conventional 90-degree wire bonding method.

FIG. 5 is a diagram illustrating a simultaneous connection method (ball bond method) from a 45-degree direction according to the related art.

FIG. 6 is a view for explaining a conventional pattern read start-up method.

FIG. 7 shows an example of a connection structure according to the present invention (conductive polymer method).
FIG.

FIG. 8 is a diagram illustrating an example of a connection process using a conductive polymer method.

FIG. 9 is a diagram showing a connection structure example (anisotropic conductive sheet system) according to the present invention.

FIG. 10 is a diagram illustrating an example of a connection process using an anisotropic conductive sheet method.

FIG. 11 is an example of a connection structure according to the present invention (low-melting metal method).
FIG.

FIG. 12 is a view for explaining an example of a connection process using a low melting point metal method.

FIG. 13 is a diagram showing an example of a connection structure from the back surface of the suspension according to the present invention.

FIG. 14 is a diagram illustrating an example of a connection process from the back surface of the suspension.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Magnetic disk, 2 ... Actuator, 3 ... Magnetic head, 4 ... Slider, 5 ... Suspension, 6 ... Wire,
7 ... Coated tube, 8 ... Wiring integrated suspension, 9
... Slider side electrode, 10 ... Suspension side electrode, 11
... Au wire, 12 ... Au ball, 13 ... Suspension side electrode pattern, 14 ... Transparent tape, 15 ... Tape side pattern, 16 ... Conductive polymer, 17 ... Adhesive, 18 ...
Anisotropic conductive sheet, 19 ... tool, 20 ... Au, 21 ...
Cu-Ni, 22 Cu, 23 Sn-Bi, 24 resist.

Continued on the front page (72) Inventor Ichiro Miyano 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd.Production Technology Laboratory (72) Inventor Masaaki Matsumoto 2880 Kozu, Kozuhara, Odawara-shi, Kanagawa Hitachi, Ltd. Within the Storage System Division (72) Inventor Yukimori Magoshi 2880 Kozu, Odawara-shi, Kanagawa Prefecture Within the Hitachi Storage Systems Division (72) Inventor Kazuma Miura 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. 5D042 NA02 PA01 QA01 TA04 TA05 TA06 TA10

Claims (12)

[Claims] In a structure for connecting a wiring-integrated suspension formed by forming a wiring and a connection electrode to a leaf spring and an electrode of a slider element, the connection is made via a connection pattern formed on a transparent tape. Characteristic mounting structure. 2. The mounting structure according to claim 1, wherein:
A mounting structure wherein an electrode surface of a slider element and an electrode on a suspension side are perpendicular to each other, and a transparent tape connecting the electrodes is bent at 90 degrees and connected. 3. The mounting structure according to claim 2, wherein
An electrode on the suspension side is formed on the same surface as the suspension surface on which the slider element is mounted, and a connection pattern on the tape is formed in opposition to the electrode, with the tape surface having no connection pattern on the center side, A mounting structure characterized by being bent at 90 degrees and connected. 4. The mounting structure according to claim 2, wherein
A mounting structure characterized in that a suspension-side electrode is formed on a surface opposite to a suspension surface on which a slider element is mounted, and the connection is made by bending the tape surface having a connection pattern to the center side by 90 degrees. 5. The transparent tape used for mounting according to claim 1, wherein an adhesive layer containing, for example, polyaniline, which has conductivity and is made into an insulator by ultraviolet rays, is provided on one surface of the transparent tape. A tape structure, wherein a pattern for blocking ultraviolet light is formed below the adhesive layer or on the opposite surface of the tape. 6. A method for mounting using a tape according to claim 5, wherein the tool processed into a bent shape is pressed and adhered to the slider element and the suspension via the tape, and then irradiated with ultraviolet rays via the tape. A mounting method characterized by being cured and insulated. 7. A transparent tape used for mounting according to any one of claims 1 to 4, wherein a metal pattern for connection is provided on a tape surface opposed to a slider element electrode and an electrode of a suspension, and further, on this tape surface. A tape structure having an ultraviolet-curable adhesive layer formed thereon. 8. A method for mounting using a tape according to claim 7, wherein the tool processed into a bent shape is pressed and adhered to the slider element and the suspension via the tape, and then irradiated with ultraviolet rays via the tape. , A mounting method characterized by being cured. 9. The transparent tape used for mounting according to claim 1, wherein a metal pattern for connection is provided on a tape surface opposing the slider element electrode and the electrode of the suspension, and further on the tape surface. A tape structure characterized by forming an anisotropic conductive film. 10. The transparent tape used for mounting according to any one of claims 1 to 4, wherein a metal pattern for connection is provided on a tape surface opposing the slider element electrode and the electrode of the suspension, and all or all of the metal pattern on the pattern is provided. For example, when the melting point is 150 ° C. or less, for example, Sn and Bi, I
A tape structure, wherein an alloy layer with n or the like is formed at 2 to 15 μm. 11. A method for mounting using a tape according to claim 9 or 10, wherein the tool processed into a bent structure is pressed against the slider element and the suspension via the tape and connected by heating and pressing. Characteristic mounting method. 12. The tape according to claim 5, 7, 9 or 10, wherein a pattern corresponding to one slider is used as a basic unit on the tape, and the basic unit is repeated.
Tape structure characterized by forming a plurality of patterns.