JP2002111218A5 - - Google Patents
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- Publication number
- JP2002111218A5 JP2002111218A5 JP2001168059A JP2001168059A JP2002111218A5 JP 2002111218 A5 JP2002111218 A5 JP 2002111218A5 JP 2001168059 A JP2001168059 A JP 2001168059A JP 2001168059 A JP2001168059 A JP 2001168059A JP 2002111218 A5 JP2002111218 A5 JP 2002111218A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001168059A JP2002111218A (en) | 2000-06-27 | 2001-06-04 | Laminated ceramic device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-192265 | 2000-06-27 | ||
JP2000192265 | 2000-06-27 | ||
JP2001168059A JP2002111218A (en) | 2000-06-27 | 2001-06-04 | Laminated ceramic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002111218A JP2002111218A (en) | 2002-04-12 |
JP2002111218A5 true JP2002111218A5 (en) | 2008-03-13 |
Family
ID=26594733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001168059A Withdrawn JP2002111218A (en) | 2000-06-27 | 2001-06-04 | Laminated ceramic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002111218A (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6985712B2 (en) | 2001-08-27 | 2006-01-10 | Matsushita Electric Industrial Co., Ltd. | RF device and communication apparatus using the same |
KR100850879B1 (en) * | 2002-05-15 | 2008-08-07 | 엘지이노텍 주식회사 | Antenna switch using low temperature co-fired ceramic |
DE10228328A1 (en) * | 2002-06-25 | 2004-01-22 | Epcos Ag | Electronic component with a multilayer substrate and manufacturing process |
JP2004055965A (en) | 2002-07-23 | 2004-02-19 | Seiko Epson Corp | Wiring board, semiconductor device, manufacturing method of them, circuit board, and electronic apparatus |
KR20040100395A (en) * | 2003-05-22 | 2004-12-02 | 주식회사 에이엔티 | The fbar bandpass filter and duplexer using ltcc layer coupling |
JP2005158770A (en) * | 2003-11-20 | 2005-06-16 | Matsushita Electric Ind Co Ltd | Laminated substrate and manufacturing method thereof, manufacturing method and apparatus of module using the laminated substrate |
JP2008130618A (en) * | 2006-11-16 | 2008-06-05 | Murata Mfg Co Ltd | Multilayer wiring board |
JP2008186962A (en) * | 2007-01-29 | 2008-08-14 | Murata Mfg Co Ltd | Multilayer interconnection board |
JP5273861B2 (en) * | 2009-04-22 | 2013-08-28 | 太陽誘電株式会社 | Communication module |
JP4947156B2 (en) * | 2010-01-20 | 2012-06-06 | 株式会社村田製作所 | Elastic wave duplexer |
JP5029704B2 (en) * | 2010-01-20 | 2012-09-19 | 株式会社村田製作所 | Elastic wave duplexer |
JP2011216635A (en) * | 2010-03-31 | 2011-10-27 | Murata Mfg Co Ltd | Substrate with built-in electronic component, electronic circuit module, and method for manufacturing of substrate with built-in electronic component |
US8558637B2 (en) * | 2010-05-12 | 2013-10-15 | Mediatek Inc. | Circuit device with signal line transition element |
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2001
- 2001-06-04 JP JP2001168059A patent/JP2002111218A/en not_active Withdrawn