JP2002111036A - Solar battery module and its execution method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solar battery module that is highly reliable for a long time and is easy to install, and to provide a method for installing the module. SOLUTION: The solar battery module where a photovoltaic element 104 is sealed by a surface covering material 112 and a rear covering material 111 has the most rear layer 107 that is made of a thermoplastic resin with a lower melting temperature than the component materials of the photovoltaic element 104, the surface covering material 112, and other rear covering materials 105 and 106 on a surface opposite to a surface in contact with the photovoltaic element 104 of the rear covering material 111.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solar cell module which can be easily bonded to a substrate having a desired shape, and a method for installing the same.

[0002]

2. Description of the Related Art Conventionally, various methods have been adopted for installing a solar cell module. For example, as a method of installing a solar cell module on a roof of a house, a method of installing a gantry on the roof and installing the solar cell module on the gantry, or a method of integrating a roof material in which a photovoltaic element is bonded in advance. And a method of installing the same solar cell module in the same manner as an existing roof.

[0003] Japanese Patent No. 2586865 discloses an installation method for attaching a solar cell to a roofing material with a double-sided tape. With this method, there is no need to install a gantry,
It is possible to simply install the solar cell module on the roof. The method disclosed here does not attach the entire back surface of the solar cell module to the roof material.
The cost is reduced by partially applying the double-sided tape, and a flow path for rainwater to flow between the roofing material and the solar cell module is created by a method of applying the double-sided tape.

Japanese Patent Application Laid-Open No. 9-83000 discloses an installation method in which a small-sized solar cell module is attached to a large-sized glass by using a double-sided adhesive or magic tape (registered trademark). Due to the manufacturing process of the solar cell module, it is not possible to produce a solar cell module having a large glass size used for a large building. Therefore, a method of bonding a small solar cell module to a large glass is adopted.

Further, JP-A-8-88391 discloses a construction method in which solar roofing is spread on a roof and a surface protective material such as tempered glass is bonded with an adhesive or a thermoplastic resin which is a component of the solar roofing. Is disclosed. The method of pasting a solar roofing on a field board and pasting a surface protection plate can be installed relatively easily.

[0006]

The technique disclosed in the above publication has the following problems.

That is, the method disclosed in Japanese Patent No. 2586865 has a problem that it flows into the gap between the roof material and the solar cell module. When the wind flows between the material and the solar cell module, the solar cell module may be peeled off.

In the method disclosed in Japanese Patent Application Laid-Open No. 9-83000, the selection of a double-sided adhesive is an important point, but there is no disclosure regarding the adhesive. When bonding to a vertical surface such as glass, the load applied to the double-sided adhesive becomes very large. Therefore, high adhesive strength and creep resistance are required for the double-sided adhesive. Further, since the double-sided adhesive is exposed to light, high weather resistance is required. In addition, in order to enable replacement and the like, it is necessary to cope with the adhesive residue of the double-sided adhesive.

[0009] In order to satisfy the above characteristics, a very expensive double-sided adhesive is required, which increases the cost. Also,
A similar problem occurs when using a magic tape.
Furthermore, when bonding a solar cell module using a glass substrate as a substrate and glass, both have poor air permeability and relatively large surface bonding, so both sides generate gas by moisture curing or curing. The adhesive is likely to cause poor curing and is not suitable for use.

Furthermore, in the method disclosed in Japanese Patent Application Laid-Open No. 8-88391, the air permeability of the solar roofing and the glass of the surface protective material is poor, and as described above, poor adhesion is likely to occur. In addition, when bonding with a thermoplastic resin that is a constituent member of the solar roofing, for example, when EVA is used as the thermoplastic resin, when the solar cell module is heated to a high temperature such as heavy glass such as tempered glass, creep occurs, and the tempered glass becomes It may slip down.

In view of the above problems, an object of the present invention is to provide a solar cell module having high long-term reliability and excellent workability, and a method of working the same.

[0012]

In order to achieve the above object, a solar cell module according to the present invention is a solar cell module in which a photovoltaic element is sealed with a surface coating material and a back surface coating material. On the surface opposite to the surface in contact with the photovoltaic element, there is provided a rearmost layer made of a thermoplastic resin having a lower melting temperature than the constituent materials of the photovoltaic element, the surface coating material, and the other backing material.

In the above solar cell module, it is preferable that the rearmost layer is an olefin-based resin.

The olefin resin is preferably a copolymer of ethylene and a vinyl monomer having a polarity.

Further, it is preferable that the above-mentioned rearmost layer contains a filler.

Preferably, the photovoltaic element has flexibility.

Further, it is preferable that the uppermost backside layer is heated to be bonded on a desired support substrate.

Further, it is preferable that the support substrate is formed as a building material.

On the other hand, the method for mounting a solar cell module according to the present invention is a method for mounting a solar cell module in which a photovoltaic element is sealed with a surface coating material and a back surface coating material and bonded on a supporting substrate. On the surface opposite to the surface in contact with the photovoltaic element, a module having a rearmost layer made of a thermoplastic resin having a lower melting temperature than the constituent materials of the photovoltaic element, the surface coating material, and the other backing material is created. Then, the rearmost layer is heated and bonded to the supporting substrate.

[0020] In the above method for constructing a solar cell module, it is preferable that the rearmost layer is an olefin-based resin.

Further, it is preferable that the olefin resin is a copolymer of ethylene and a vinyl monomer having polarity.

Further, it is preferable that the above-mentioned rearmost layer contains a filler.

It is preferable that the photovoltaic element has flexibility.

It is preferable to heat the above-mentioned rearmost layer and bond it to a desired supporting substrate.

Further, it is preferable that the support substrate is formed as a building material.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of a solar cell module and a method for installing the same according to the present invention will be described in detail.
The present invention is not limited to this embodiment.

FIG. 1 is a sectional view showing a solar cell module according to the present invention. In FIG. 1, reference numeral 104 denotes a photovoltaic element. Reference numeral 111 denotes a back surface covering material, 101 denotes a back surface layer, 102 denotes a back surface insulating material, and 103 denotes a back surface sealing material. Reference numeral 112 denotes a surface coating material, each of which has 105
Is a surface protection reinforcing material, 106 is a surface sealing material, and 107 is a surface member.

Hereinafter, each component of the solar cell module of the present embodiment will be described.

(Back Coating Material) In the present embodiment, the back coating material 111 includes the rearmost layer 101, the back insulating material 102,
It is made of a back surface sealing material 103. The back surface covering material 111 is not particularly limited as long as it is disposed on the back surface of the photovoltaic element 104 and has a function of further ensuring insulation between the photovoltaic element 104 and the outside.

In the present invention, the back surface covering material 111 preferably has a three-layer structure of the outermost surface layer 101 / back surface insulating material 102 / back surface sealing material 103. Further, in order to increase the working efficiency of lamination during the coating step, it is preferable that the film is a laminated film.

(Backmost Layer) In the present invention, the rearmost layer 10
1 is made of a thermoplastic resin having a lower melting temperature than the constituent materials of the photovoltaic element 104, the surface coating material 112, and the other back surface coating materials 102 and 103. The melting temperature of the present invention,
This is the temperature at which the resin melts and flows, and may be different from the melting point of the resin itself. For example, even if the temperature considered to be the melting point is measured by TMA measurement, if the displacement due to the load has a gentle slope, the melting temperature of the present invention is not considered. Specifically, such behavior may be observed due to crosslinking. Since the melting temperature is low, it is softened by heating and can be bonded without affecting other members.

In the present invention, the thermoplastic resin is used as the adhesive layer to the base material because the thermoplastic resin improves the wettability, which is a necessary element for adhesion, by heating. For example, in the case of polyethylene, the surface tension is 3 at 20 ° C.
5.3 mN / m, whereas at 150 ° C.
6 mN / m. This also makes it possible to wet polypropylene (surface energy 29 mN / m), which is said to be relatively difficult to adhere. That is, it is possible to wet many types of substrates. In addition, by softening and flowing by heating, it is possible to fill unevenness.

Examples of the thermoplastic resin suitably used in the present invention include those used for so-called hot melt adhesives. Particularly, polyethylene and ethylene copolymer are preferably used. When bonding to a metal, a highly polar ethylene copolymer is more preferable. In the case of bonding to a resin substrate, it is preferable to have the same polarity as the resin of the substrate.

Further, it is preferable that these rearmost layers have excellent creep resistance. In order to improve the creep resistance of the resin, a method of forming hydrogen bonds between molecules by using a highly polar copolymer as described above, or copolymerization of acid as a copolymer and intermolecular cross-linking with metal ions There is a way to do that. When the creep resistance of the resin itself is low, a method of adding a filler is also effective. The method of cross-linking the resin at the time of bonding with the base material is preferable because primary bonding may be formed between the base material and the rearmost layer in some cases, and the adhesive strength can be improved. The method of crosslinking is not particularly limited.

When a filler is added, a method using a resin to which the filler is added, a method of attaching a filler during the coating step, and the like can be mentioned. Examples of the filler include a powder, a flat plate, a needle, a sphere, a fiber, a woven fabric, and a nonwoven fabric, but are not particularly limited. For example, when a filler is mixed during the coating step, a fiber woven fabric or a nonwoven fabric is preferably used.

The material of the filler is not particularly limited unless it is chemically very active. Specific examples include metal powder, silicic acid, silicate, clay, calcareous, clay silicic acid, mafic silicic acid, carbon, carbide and the like.
Alternatively, a resinous filler may be used.

The filler is effective not only to increase the heat resistance because it becomes a binding point of the resin molecules of the outermost layer, but also to prevent a decrease in adhesive force caused by the orientation of the resin molecules during long-term use. A coupling agent may be added to improve the adhesiveness of the rearmost layer.

(Back surface insulating material) The back surface insulating material 102 is to further enhance the insulation from the outside of the photovoltaic element. Generally, non-woven fabrics of biaxially stretched polyethylene terephthalate, polyethylene naphthalate, nylon, polyphenylene sulfide, polyimide, polycarbonate, acrylic, fluororesin, glass fiber, and plastic fiber can be used. When bonding the solar cell module to an insulating base material such as plastic, the back film may not be used in some cases.

(Back Sealing Material) The back sealing material 103 is made of weather resistance, heat resistance, back insulating material 102 and photovoltaic element 104.
There is no particular limitation as long as it has an excellent adhesive force with the adhesive. When the resin itself does not satisfy the above-mentioned properties, it is preferable to add an additive. For example, it is preferable to add an ultraviolet inhibitor, a light stabilizer, an antioxidant, a secondary antioxidant, etc. for improving the weather resistance. The ultraviolet absorber prevents light deterioration of the sealing material. In order to prevent thermal oxidation of the resin, it is preferable to add an antioxidant.

In the case of a solar cell module installed on a roof, the operating temperature of the solar module is two times lower than the ambient temperature.
Since the temperature is high at 0 to 40 ° C., it is preferable that the resin is a resin having high heat resistance. When the heat resistance of the resin itself is low, the heat resistance can be increased by crosslinking. The method of crosslinking is not particularly limited, but a method of adding an organic peroxide to the resin in advance and heating the resin is preferred.
The organic peroxide is not particularly limited as long as it has a high crosslinking efficiency of the sealing material and does not adversely affect the weather resistance of the sealing material. Further, it is preferable to add a coupling agent in order to improve the adhesive strength with the photovoltaic element.

As a specific material of the back surface sealing material, EV
A, ethylene-methyl acrylate copolymer (EMA),
Examples thereof include a polyolefin resin such as an ethylene-ethyl acrylate copolymer (EEA) and a butyral resin, a urethane resin, and a silicone resin.

It is preferable that the back surface sealing material is subjected to a treatment for increasing the deaeration during lamination. If the back surface sealing material and the back surface insulating material are not integrally laminated, treatment is performed on both surfaces. When the back surface sealing material and the back surface insulating material are integrally laminated, the photovoltaic element side may be treated. For example, embossing is considered, and the height difference between the peak and the valley is 1
It is preferably from 0 to 30 μm.

(Photovoltaic element) Subsequently, the photovoltaic element 1
04 is laminated on the back surface sealing material 111. The photovoltaic element used in the present invention is not particularly limited. Although any type of photovoltaic element can be used, it is preferred that it be flexible. A photovoltaic element in which a light conversion member is formed on a conductive substrate will be described below as an example of a flexible photovoltaic element.

In this photovoltaic element, at least a semiconductor photoactive layer as a light conversion member is formed on a conductive substrate. FIG. 2 shows a schematic configuration diagram as an example, in which 201 is a conductive substrate, 202 is a back reflection layer, 203 is a semiconductor photoactive layer, 204 is a transparent conductive layer, and 205 is a current collecting electrode. is there.

The conductive substrate 201 serves as a base for the photovoltaic element and also serves as a lower electrode. Materials for the conductive substrate include silicon, tantalum, molybdenum, tungsten, stainless steel, aluminum, copper, titanium,
Examples include a carbon sheet, a lead-plated steel sheet, a resin film and a ceramic on which a conductive layer is formed.

On the conductive substrate 201, the back reflection layer 2
As 02, a metal layer, a metal oxide layer, or a metal layer and a metal oxide layer may be formed. In the metal layer,
For example, Ti, Cr, Mo, W, Al, Ag, Ni, and the like are used, and ZnO, T
iO ₂ , SnO ₂ or the like is used. Examples of a method for forming the metal layer and the metal oxide layer include a resistance heating evaporation method, an electron beam evaporation method, and a sputtering method.

The semiconductor photoactive layer 203 is a portion that performs photoelectric conversion, and specific materials include pn junction type polycrystalline silicon, pin junction type amorphous silicon, and Cu.
InSe ₂ , CuInS ₂ , GaAs, CdS / Cu
₂ S, CdS / CdTe, CdS / InP, CdTe /
And a compound semiconductor such as Cu ₂ Te.

The method for forming the semiconductor photoactive layer is as follows.
In the case of polycrystalline silicon, a sheet of molten silicon or heat treatment of amorphous silicon, in the case of amorphous silicon, plasma CVD using silane gas as a raw material, in the case of compound semiconductor, ion plating, ion beam deposition, vacuum evaporation , Sputtering and electrodeposition.

The transparent conductive layer 204 functions as the upper electrode of the photovoltaic device. As a material used for the transparent conductive layer, for example, In ₂ O ₃ , SnO ₂ , In ₂ O ₃ —SnO ₂
(ITO), ZnO, TiO ₂ , Cd ₂ SnO ₄ , and a crystalline semiconductor layer doped with a high concentration of impurities.

Examples of the forming method include resistance heating evaporation, sputtering, spraying, CVD, and impurity diffusion.

A grid-like current collecting electrode 205 (grid) may be provided on the transparent conductive layer in order to efficiently collect current. As a specific material of the current collecting electrode 205, for example, a conductive paste in which silver, gold, copper, nickel, carbon, or the like in the form of fine powder is dispersed in a binder polymer may be used. Examples of the binder polymer include resins such as polyester, epoxy, acrylic, alkyd, polypinyl acetate, rubber, urethane, and phenol.

In addition to the conductive paste, the current-collecting electrode 205 may be formed by sputtering using a mask pattern, resistance heating, CVD, or by depositing a metal film on the entire surface and then removing unnecessary portions by etching. Examples include a method of patterning, a method of directly forming a grid electrode pattern by photo-CVD, and a method of plating after forming a negative pattern mask of the grid electrode pattern.

Finally, the output terminal 2 is used to extract the electromotive force.
06 is attached to the conductive substrate and the current collecting electrode. A method of joining a metal body such as a copper tab to the conductive base by spot welding or soldering is employed, and a method of electrically connecting the metal body to the current collecting electrode by a conductive adhesive or solder 207 is employed. .
When attaching to the current collecting electrode, an insulator 20 is used to prevent the output terminal from coming into contact with the conductive substrate or the semiconductor layer to cause a short circuit.
8 is desirably provided. The photovoltaic elements produced by the above method are connected in series or in parallel according to a desired voltage or current. Further, a desired voltage or current can be obtained by integrating a photovoltaic element on an insulated substrate.

(Surface Coating Material) The surface coating material 112 is not particularly limited as long as it has excellent transparency, weather resistance, and adhesion to the photovoltaic element 104. For example, a two-layer structure of the surface member 107 and the surface sealing material 106, the surface member 1
07, a surface sealing material 106, and a surface protection reinforcing material 105. These surface coating materials are more preferably members integrally laminated. In this embodiment, a three-layer structure including a surface member 107, a surface sealing material 106, and a surface protection reinforcing material 105 will be described.

(Surface Member) It is important that the surface member 107 has excellent weather resistance. In a preferred embodiment, the surface member 107 is made of glass or a resin film. When flexibility is required for the solar cell module, a resin film is preferable. More preferably, it is a fluororesin film. Examples of the fluororesin include tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-perfluoroalkylpinyl ether copolymer, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, and ethylene-tetrafluoroethylene copolymer. And a copolymer of ethylene and chlorotrifluoroethylene.

The surfaces of these films may be subjected to functional treatment. For example, an antireflection layer and an antifouling layer are formed. Further, it is preferable that the surface member made of these resins is subjected to a treatment for securing the adhesive strength to the surface sealing material. For example, corona discharge treatment,
It is preferable to perform plasma discharge treatment, ozone treatment, or primer coating. Further, it is preferable to perform a treatment for enhancing the adhesive force also on the end of the surface member around which the sealing material is wrapped.

(Surface Sealing Material) It is preferable to use the same material as the back surface sealing material 103 as the surface sealing material 106.

(Surface protection reinforcement) Surface protection reinforcement 105
Has a function of improving the strength of the surface sealing material 106.
As the surface protection reinforcing material, known materials such as glass fiber and glass beads can be used. The filler suitably used in the present invention includes a glass fiber nonwoven fabric.
It is more preferable that the glass fiber nonwoven fabric is previously formed into a film integrally laminated with the surface member and the surface sealing material.

The mixing amount of the filler used in the present invention is 5 to 50 parts by weight based on 100 parts by weight of the sealing material. If the amount is less than 5 parts by weight, the scratch resistance is reduced in the case of a module whose surface member is made of a film. If the amount is more than 50 parts by weight, a filling failure of the surface sealing material may occur.

(Lamination to Substrate) In the present invention, the lamination to the substrate is performed by heating. Heating includes heating the solar cell module and heating the substrate. As a heating method, a method using a hot plate,
Examples thereof include a method using hot air from an electric heater such as a dryer, a method using far infrared rays, and a method using electromagnetic waves.

[0061]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the solar cell module and the method of constructing the same according to the present invention will be described below, but the present invention is not limited to the following embodiments.

Example 1 In this example, a solar cell module having the structure shown in FIG. 4 was prepared as an evaluation module.

As shown in FIG. 4, the solar cell module was prepared by first preparing a laminated film 411 of a back surface covering material, a photovoltaic element 404, and a laminated member 412 of a surface covering material.

(Laminated Film of Back Coating Material) As a laminated film of the back coating material 411, a biaxially stretched polyethylene terephthalate film (100 μm width, melting temperature 264) having a double-sided corona treatment as the back insulating material 402 was used.
° C) using ethylene-vinyl acetate copolymer (EVA)
(Vinyl acetate content 28% by weight, melting temperature 43 ° C) 10
0 parts by weight, 1.5 parts by weight of t-butyl peroxy 2-ethylhexyl carbonate as a crosslinking agent, 0.3 parts by weight of 2-hydroxy-4-n-octoxybenzophenone as an ultraviolet absorber, and tris ( 0.2 parts by weight of (mono-nonylphenyl) phosphite and 0.1 parts by weight of (2,2,6,6-tetramethyl-4-piperidyl) sebacate as a light stabilizer were mixed, and an extruder and a T-die were mixed. Backing sealing material 403 having a thickness of 200 μm using
Was laminated on one side of the film. One side of the laminated film was embossed with a 15 μm embossing roll. Subsequently, 100 parts by weight of an ethylene-methacrylic acid copolymer (methacrylic acid content: 10%, melting temperature: 88 ° C.) and glass beads (center particle diameter: 45
μm), 20 parts by weight were mixed, similarly laminated, and embossed. In addition, ethylene-vinyl acetate copolymer (EV
A) (vinyl acetate content 28% by weight, melting temperature 43 ° C.)
The melting temperature became 120 ° C. or higher due to crosslinking.

(Photovoltaic Element) In the present invention, the photovoltaic element is not particularly limited. In this embodiment, an amorphous silicon photovoltaic element is described.
The photovoltaic element 404 having the structure shown in FIG. 5 was prepared as follows. That is, first, a washed belt-shaped stainless steel substrate was prepared, and an Al layer (thickness 5000 °) and a ZnO layer (5000 ° thickness) were sequentially formed as a back reflection layer on the substrate by sputtering. Then, by plasma CVD, an n-type amorphous silicon layer is formed using a mixed gas of SiH ₄ , PH ₃ and H ₂ , an i-type amorphous silicon layer is formed using a mixed gas of SiH ₄ and H ₂ , and SiH ₄ is formed. Using a mixed gas of BF ₃ and H ₂ , p-type microcrystal μ
By the method of forming a c-Si layer, the thickness of the n-layer is 150Å / the thickness of the i-layer 4000Å / the thickness of the p-layer 100Å / the thickness of the n-layer 100Å
A tandem type amorphous silicon photoelectric conversion semiconductor layer having a layer structure of / i layer thickness 800 ° / p layer thickness 100 ° was formed. Next, an In ₂ O ₃ thin film (film thickness 70
0 °) was formed by vapor deposition of In by a resistance heating method in an O ₂ atmosphere. 356m of the result
The resultant was cut into mx 239 mm to obtain a stainless steel substrate 500 on which a photoelectric conversion semiconductor layer and a transparent conductive layer were laminated.

(Preparation of current collecting electrode) The current collecting electrode 502 was formed as follows. As the metal wire, a copper wire having a diameter of 100 μm was used. A carbon paste for forming the conductive resin of the coating layer was prepared as follows. First, a mixed solvent of 2.5 g of ethyl acetate and 2.5 g of isopropyl alcohol as a solvent was put into a shaker bottle for dispersion. Next, 22.0 g of a urethane resin as a main agent was added to the shake bottle, and sufficiently stirred by a ball mill. Next, 1.1 g of blocked isocyanate as a curing agent and 10 g of glass beads for dispersion were added to the solution. Next, 2.5 g of carbon black having an average primary particle size of 0.05 μm as conductive particles was added to the solution. The shake bottle into which the above-mentioned materials were charged was dispersed by a paint shaker for 10 hours.
Then, when the average particle size of the paste was measured,
μm.

Next, a coating layer was formed using a vertical wire coater as follows. First, a reel around which a copper wire was wound was set on a delivery reel, and the copper wire was stretched toward a take-up reel. Next, the following coating is performed by a coater. Coating speed is 40m / min and residence time is 2s
ec, the temperature of the drying furnace was set to 120 ° C., and coating was performed five times.
The diameter of the enamel coating dies used was 110 μm to 200 μm. Under these conditions, the paste is present in an uncured state due to evaporation of the solvent. The thickness of the coating layer is
The average was 20 μm.

(Preparation of Photovoltaic Element) On the surface side of a stainless steel substrate 500 on which a photoelectric conversion semiconductor layer and a transparent conductive layer are laminated, an etching paste containing ferric chloride as a main component and a commercially available printing machine are used to generate electric power. The area is 80
A part of the transparent conductive layer was removed so as to be 0 cm ² , and a power generation region and a non-power generation region (not shown) were formed on the transparent conductive layer.

Hard copper (thickness: 100 μm, width: 7 mm) was provided as a negative electrode terminal member 504 on the back surface of the stainless steel substrate 500 by soldering.

An insulating adhesive 501 (silicone adhesive (melting temperature of 150 ° C. or more),
Thickness 50μm / polyimide (not melt) thickness, 25μm
/ Silicone pressure-sensitive adhesive, thickness 25 μm / polyethylene terephthalate (melting temperature: 264 ° C.), thickness 75 μm / silicone pressure-sensitive adhesive, thickness 50 μm) so that the polyimide was arranged in the non-power-generating region on the surface side.

The collecting electrodes 502 were arranged at intervals of 5.5 mm, and the ends were fixed with the insulating adhesive 501.

A silver-plated hard copper (thickness: 100 μm, width: 5.5 mm) was used as the positive electrode terminal member 503 for the current collecting electrode 5.
02 and the insulating adhesive 501.

In order to adhere the current collecting electrode 502 to the transparent conductive layer, heat compression was performed at 200 ° C. under a pressure of 1 kg / cm ² for 1 minute.

In order to make the current collecting electrode 502 and the positive electrode terminal member 503 more adhere to each other, the positive electrode terminal member was heated and pressed at 200 ° C. under a pressure of 5 kg / cm ² for 15 seconds.

On the positive electrode terminal member 503, an insulating tape 505 (black polyethylene terephthalate (melting temperature: 264 ° C.), thickness: 100 μm / acrylic adhesive (melting temperature: 100 ° C. or more), thickness: 30 μm, width: 9 mm) was provided.

Thus, a desired photovoltaic element 404 was obtained.

The above steps were repeated to produce 70 photovoltaic elements having a power generation area of 800 cm ² .

(Preparation of Photovoltaic Element Group) Ten photovoltaic elements having a power generation area of 800 cm ² are arranged on a jig face-down at equal intervals so that the interval between the photovoltaic elements is 2 mm. Was. Next, the positive electrode terminal member was electrically connected to the negative electrode terminal member of one of the photovoltaic elements by soldering.

(Extraction of Back Electrode) An operation of extracting electrodes from the elements at both ends of the ten photovoltaic elements to the back was performed. The method of taking out the positive electrode is as follows. FIG. 6 (a)
In (b), an insulating tape 601 (polyimide, thickness 25 μm / acrylic adhesive, thickness 25 μm, width 40 m)
m) to prevent internal short circuit, double-sided tape (acrylic adhesive,
Soft copper foil 602 (thickness of 100 μm)
m, width 25 mm) was attached to the back surface of the photovoltaic element 603. Both ends of the soft copper foil are the positive electrode terminal members 60 on the surface side.
4 and soldered 605.

In order to solder the flexible copper foil 602 at the center of the element on the back surface and the lead wire serving as the output terminal, a glass cloth 60 is provided between the photovoltaic element 603 and the flexible copper foil 602.
6 (thickness: 100 μm, length and width: 30 mm) to provide a heat-resistant structure.

The method of taking out the negative electrode is as follows. 6 (a) and 6 (c), a soft copper foil 602 (thickness: 100 μm) is applied via a double-sided tape (acrylic adhesive, thickness: 40 μm).
μm, width 25 mm) was attached to the back surface of the photovoltaic element 603. Both ends of the soft copper foil were soldered 605 to the negative electrode terminal member 607 on the back side.

A glass cloth 606 is provided between the photovoltaic element 603 and the soft copper foil 602 in order to solder the soft copper foil 602 at the center of the element on the back side and the lead wire serving as an output terminal similarly to the positive electrode side. (Thickness 100μm, 30m both vertically and horizontally)
m) to provide a heat-resistant structure.

(Preparation of Laminated Member of Surface Coating Material) A laminated member of the surface coating material 412 was prepared by the following method. As the surface member 407, an ethylene-tetrafluoroethylene copolymer (ETFE) (thickness 50 μm, width 1000 mm, melting temperature 260 ° C.) was used. One side was subjected to plasma treatment, and the same material as the back surface sealing material was laminated on the surface using an extruder and a T-die, using a surface sealing material 406 (460 μm thick, melting temperature 43 ° C.). Subsequently, the surface protection reinforcing material 40
A glass fiber nonwoven fabric (acrylic binder, wire diameter 10 μm, fiber length 13 mm, basis weight 40 g / m ² ) was prepared as 5, and a heat roll was used on the sealing material side of the laminate of the surface member 407 and the surface sealing material 406. And stuck together.

(Coating Step) An embodiment using a single vacuum laminating apparatus will be described. The vacuum laminating equipment used is
This is an apparatus proposed in Japanese Patent Application Laid-Open No. 9-51111.
Details of the device will not be described here. PFA film (thickness 50μ)
m), the laminated film 411 of the back surface covering material thus prepared, the photovoltaic element 404, and the laminated member 412 of the surface covering material were laminated. A sheet (thickness: 3 mm) of a heat-resistant silicon rubber was placed on the laminate, and the lid was closed. The pressure inside the laminate was reduced to 1333 Pa (10 mmHg) by a vacuum pump. After the pressure was sufficiently reduced, it was put into a hot air drying oven at 175 ° C. while continuing evacuation, and was taken out after 40 minutes. Thereafter, the system was cooled to room temperature while continuing evacuation.

Thus, a plurality of photovoltaic element modules were obtained.

(Lamination to Base Material) As shown in FIG. 3, a galvanized steel plate (0.4 mm thick) 30 as a roof steel plate was used as a base material for bonding the solar cell module.
1 was prepared.

The rearmost surface of the solar cell module 302 was gradually adhered to the prepared roof steel plate while being heated from the end of the solar cell module by hot air 303 of a dryer.

The obtained solar cell module was evaluated by the following method.

(Durability to Temperature and Humidity Changes) With respect to the steel sheet bonded with the solar cell module,
A temperature / humidity cycle test of 85 minutes / 85% RH / 22 hours for 30 minutes was repeated 50 times. The test was performed by tilting the steel plate to which the solar cell module was attached at 45 °.
The appearance of the solar cell module was visually evaluated.
The evaluation results are shown in Table 1 based on the following evaluation criteria. ○: No change in appearance ×: Peeling occurred (the state is shown in the table) (High temperature and high humidity test) It was exposed to high temperature and high humidity for 2000 hours. As with the durability test against temperature and temperature change, the steel plate with the
The test was performed at an angle of °. The change in appearance of the solar cell module was evaluated.

The evaluation results are shown in Table 1 based on the following evaluation criteria. ○: no change in appearance ×: peeling or the like (the state is shown in the table)

(Weather Resistance Test) A part of the solar cell module cut into a square of 100 mm was put into a sunshine weather meter, and 2,000 cycles were performed with 48 minutes of light irradiation and 12 minutes of rainfall as one cycle. The change in the appearance of the solar cell module of the sample was evaluated. The evaluation results are shown in Table 1 based on the following evaluation criteria. ○: no change in appearance ×: peeling or the like (the state is shown in the table)

(Dynamic load test) IEEE standard draft9
A dynamic load test in accordance with. Although the number of cycles of the dynamic load specified in the standard is 10,000 cycles, in this experiment, 200,000 cycles were performed for each module. The appearance was observed every 10,000 cycles. Table 1 shows the test results.

Example 2 Example 1 was followed except that the outermost layer was changed to an ethylene-methacrylic acid copolymer (Zn ion crosslinking, melting temperature 98 ° C.). The evaluation results are shown in Table 1.

Example 3 Example 1 was followed except that the outermost layer was changed to a polyamide resin (melting temperature 100 ° C.). The evaluation results are shown in Table 1.

Example 4 Example 1 was followed, except that the surface member was changed to glass (white sheet glass, 3.2 mm in thickness), and the surface coating material was not laminated but coated in a superposed manner. The evaluation results are shown in Table 1.

Comparative Example 1 The procedure of Example 1 was followed up to the covering step without laminating the outermost layer. Double sided tape (acrylic adhesive / acrylic foam 2mm) on the long side of the solar cell module
/ Acrylic adhesive, 20mm width)
A solar cell module was attached to the same substrate as that described above. The evaluation results are shown in Table 1.

Comparative Example 2 Comparative Example 1 was followed except that a one-part silicone adhesive was used instead of the double-sided tape.
That is, a silicone adhesive was applied to the back surface of the solar cell module and bonded to the substrate. Left for a week,
The evaluation was not performed because the curing of the adhesive did not proceed.

Comparative Example 3 The procedure of Comparative Example 1 was followed except that a two-pack type epoxy adhesive was used instead of the double-sided tape. That is, the main agent of the epoxy adhesive was applied to the back surface of the solar cell module, the curing agent of the epoxy adhesive was applied to the base material, and both were bonded.

[0099]

[Table 1]

As is clear from Table 1, in the solar cell module in which the photovoltaic element was sealed with the surface covering material and the back surface covering material, the photovoltaic device was provided on the surface of the back surface covering material opposite to the surface in contact with the photovoltaic element. Having a rearmost layer made of a thermoplastic resin whose melting temperature is lower than the constituent materials of the power element, surface covering material, and other backing material makes it possible to easily attach the solar cell module to the desired base material. Become. Further, it is extremely excellent in durability against changes in temperature and humidity, durability against high temperature and high humidity, and weather resistance.

Incidentally, the solar cell module according to the present invention is not limited to the above-mentioned embodiment at all, and can be variously modified within the scope of the gist.

[0102]

As described above, according to the present invention,
A solar cell module that can be easily installed can be obtained.
That is, by heating the rearmost layer, it can be bonded to a desired supporting substrate, and the reliability of the solar cell module does not deteriorate even by the heating.

By heating the rearmost layer, it can be stuck on various supporting substrates, and can be applied to existing roofing materials.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a solar cell module of the present invention.

FIG. 2 is a schematic configuration diagram illustrating an example of a photovoltaic element of the solar cell module of the present invention.

FIG. 3 is a schematic configuration diagram illustrating an example of a method for installing a solar cell module according to the present invention.

FIG. 4 is a schematic configuration diagram of a solar cell module in an example.

FIG. 5 is a schematic configuration diagram of a photovoltaic element in an example.

FIG. 6 is a schematic configuration diagram of a back electrode extraction of a photovoltaic element in an example.

[Explanation of symbols]

REFERENCE SIGNS LIST 101 Backmost layer 102 Backside insulating material 103 Backside sealing material 104 Photovoltaic element 105 Surface protection reinforcing material 106 Surface sealing material 107 Surface member 111 Backside covering material 112 Surface covering material 201 Conductive substrate 202 Backside reflecting layer 203 Semiconductor light Active layer 204 Transparent conductive layer 205 Current collecting electrode 206 Output terminal 207 Soldering 208 Insulator 301 Support substrate 302 Solar cell module 303 Hot air 401 Backmost layer 402 Backside insulating material 403 Backside sealing material 404 Photovoltaic element 405 Surface protection enhancement Material 406 Surface sealing material 407 Surface member 411 Back covering material 412 Surface covering material 500 Stainless steel substrate on which photoelectric conversion semiconductor layer and transparent conductive layer are laminated 501 Insulating adhesive 502 Current collecting electrode 503 Positive terminal member 504 Negative terminal member 505 Insulating tape 601 Insulation tape 02 soft copper foil 603 a photovoltaic element 604 positive terminal member 605 soldered 606 glass cloth 607 negative terminal member

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hidetoshi Zenko 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Hidenori Shiozuka 3-30-2 Shimomaruko, Ota-ku, Tokyo Non-corp. F term (reference) 2E108 BB01 BN01 CV06 ER05 GG09 GG16 KK04 LL01 NN07 5F051 AA02 AA05 AA09 AA10 BA03 BA11 BA18 CA15 CB15 DA03 DA04 FA02 FA03 FA04 GA02 GA05 JA02 JA04 JA05 JA09

Claims (14)

[Claims] 1. A photovoltaic module in which a photovoltaic element is sealed with a surface covering material and a back surface covering material, wherein the back surface covering material has a photovoltaic element and a surface covering material on a surface opposite to a surface in contact with the photovoltaic device. And a solar cell module having a rearmost layer made of a thermoplastic resin having a lower melting temperature than the constituent material of the other backing material. 2. The solar cell module according to claim 1, wherein the rearmost layer is an olefin-based resin. 3. The solar cell module according to claim 2, wherein the olefin-based resin is obtained by copolymerizing ethylene and a vinyl monomer having polarity. 4. The solar cell module according to claim 1, wherein the rearmost layer contains a filler. 5. The solar cell module according to claim 1, wherein the photovoltaic element has flexibility. 6. The solar cell module according to claim 1, wherein the rearmost layer is heated and bonded to a desired support substrate. 7. The solar cell module according to claim 6, wherein the support substrate is formed as a building material. 8. A method for constructing a solar cell module in which a photovoltaic element is sealed with a surface covering material and a back surface covering material and bonded on a support substrate, wherein the back surface covering material is in contact with the surface facing the photovoltaic element. In addition, a module having a rearmost layer made of a thermoplastic resin having a lower melting temperature than the constituent materials of the photovoltaic element, the surface coating material, and the other rear surface coating material is created, and then the topmost layer is heated and supported. A method for constructing a solar cell module, comprising attaching the module to a substrate. 9. The method according to claim 8, wherein the rearmost layer is an olefin-based resin. 10. The method according to claim 9, wherein the olefin resin is a copolymer of ethylene and a vinyl monomer having a polarity. 11. The method for constructing a solar cell module according to claim 8, wherein the rearmost layer contains a filler. 12. The method according to claim 8, wherein the photovoltaic element has flexibility. 13. The method for constructing a solar cell module according to claim 8, wherein the backmost layer is heated and bonded to a desired support substrate. 14. The method according to claim 8, wherein the supporting substrate is formed as a building material.