JP2002109704A - Magnetic head for hard disk, its manufacturing method and magnetic disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic head for hard disk, its manufacturing method and a magnetic disk device having a track section, a coil section and a upper magnetic core section, etc., of which a coil dimension is reduced and of which a magnetic circuit is miniaturized. SOLUTION: In the magnetic head for hard disk comprising an laminar, of which the coil layer 16 insulated with the insulating material 14 between wiring and the magnetic core layers 4, 18 are insulated with the layer insulating materials 12, 15, at least one of the coil layers 16 consists of material such that the layer insulating materials 12, 15 of one side or both sides differ from the insulating material 14 between wiring. In at least one of the coil layers 16, the layer insulation materials 12, 15 of both sides are the same material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head used for writing magnetic recording on a hard disk and a method of manufacturing the same, and further relates to a magnetic disk drive using the magnetic head.

[0002]

2. Description of the Related Art As is well known, a magnetic disk drive includes a magnetic disk disk as a magnetic recording medium, a write magnetic head for writing and reading magnetic recording signals to and from the disk, and a magnetic head. The main components include a servo mechanism for accessing a predetermined position on the disk, an electric circuit for signal processing, and the like. One of the most important items of the performance of the magnetic disk drive is the areal recording density. In order to improve the areal recording density, it is necessary to increase the linear recording density and the track density.

Of these, it is essential to reduce the track width in the track portion of the write magnetic head in order to improve the track density, and it is necessary to reduce unnecessary leakage magnetic flux during writing. The technical problems required for such a write magnetic head are described in, for example, Nikkei Electronics No. 1997.6.16 (No. 691).
The details are described on pages 91 to 120, and an example of the structure of the track portion is described in US Pat. No. 5,285,340.

Further, high-speed transfer performance of recorded data is also one of the important performances of a magnetic disk drive, and as one method corresponding to this, the coil size of a write magnetic head is reduced and the magnetic circuit is miniaturized. Is required.

However, these prior arts have not been established as a specific manufacturing process of the entire head including a magnetic circuit and a coil for driving the magnetic circuit, and the structure of the magnetic head has been optimized. Therefore, there is a problem that it is not enough to actually manufacture a magnetic head and provide a high-performance hard disk drive at low cost.

In other words, it is not sufficient to manufacture only the tip of the track portion for manufacturing the write magnetic head, and the structure of the write head including the coil portion, the upper magnetic core portion and the like and a series of manufacturing processes are reasonable. In addition, there is a need to overcome the difficulty of designing a material optimized for satisfying the characteristics required for the magnetic head in the manufacturing process.

It can be said that a reasonable manufacturing method for manufacturing a write head having a narrow track width which overcomes such difficulties has not been provided so far.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the problems in the prior art, and has been made in consideration of the problems in the prior art.
An object of the present invention is to provide a magnetic head for a hard disk having an upper magnetic core, a method for manufacturing the same, and a magnetic disk device.

[0009]

According to the present invention, there is provided a magnetic head for a hard disk comprising a laminated body in which a coil layer insulated by an interwiring insulating material and a magnetic core layer are insulated by an interlayer insulating material. At least one of them is
This is a magnetic head for a hard disk in which the interlayer insulating material on one or both sides is made of a material different from the insulating material between wirings.

Further, the present invention is a magnetic head for a hard disk, wherein at least one of the coil layers has the same material for the interlayer insulating material on both sides.

According to the present invention, there is provided a magnetic head for a hard disk, wherein the interlayer insulating material is an inorganic insulating material, and the wiring insulating material is an organic insulating material.

Further, the present invention is a magnetic head for a hard disk, wherein the interlayer insulating material is alumina, silica or an inorganic insulating material containing these as a main component.

Further, the present invention is the magnetic head for a hard disk, wherein the coil layer has a minimum wiring pitch of the coil of 0.3 μm to 2 μm.

The present invention is a magnetic head for a hard disk, wherein the number of the coil layers is two.

Further, the present invention is a magnetic head for a hard disk having a coil in which the coil layer has a structure in which a magnetic body in a track portion and a coil upper surface are flattened.

Further, the present invention is a magnetic head for a hard disk having a track portion formed of three layers of a magnetic material, a non-magnetic material, and a magnetic material.

The present invention provides a step of forming a magnetic gap on a lower magnetic core, a step of simultaneously forming a track portion and a contact portion of a magnetic circuit, a step of forming a coil lower insulating layer made of an interlayer insulating material, A step of forming a coil of the first layer, a step of filling a predetermined portion including a space between the wires of the coil with an inter-wire insulating material, a step of flattening the magnetic body of the track portion and the upper surface of the coil, a coil made of an interlayer insulating material A method for manufacturing a hard disk magnetic head including a step of forming an upper insulating layer, a step of forming an upper magnetic core, and a step of forming a protective insulating material.

Further, the present invention is a magnetic disk drive on which the above-described magnetic head for a hard disk is mounted.

Further, the present invention is a magnetic disk drive having a recording density of 10 Gbit / square inch to 200 Gbit / square inch.

[0020]

Embodiments of the present invention will be described. Embodiments of a magnetic head for a hard disk, a method of manufacturing the same, and a magnetic disk device according to the present invention will be described with reference to FIGS. FIG. 1 is an explanatory cross-sectional view of the magnetic head according to the first embodiment. FIG. 2 is an explanatory plan view of a part of the structure of the magnetic head according to the first embodiment. FIG. 3 is an explanatory diagram of the structure of the track portion of the magnetic head according to the first embodiment. FIG. 4 is an explanatory sectional view of the manufacturing process 1 of the magnetic head of the first embodiment. FIG.
FIG. 3 is an explanatory cross-sectional view of the magnetic head manufacturing process 2 according to the first embodiment. FIG. 6 is an explanatory cross-sectional view of Step 3 of manufacturing the magnetic head of Example 1. FIG. 7 is an external view of a magnetic disk drive using the magnetic head of the first embodiment. FIG. 8 is an explanatory sectional view of the structure of the magnetic head according to the second embodiment. FIG.
FIG. 10 is an explanatory diagram of a structure of a track portion of the magnetic head according to the second embodiment.

Embodiment 1 will be described. The magnetic head for a hard disk according to the present embodiment is composed of a laminated body in which a coil layer and a magnetic core layer insulated by an insulating material between wirings are insulated by an interlayer insulating material, and has three layers of a magnetic material, a nonmagnetic material, and a magnetic material. It has a formed track portion. The coil layer has two layers, has a coil having a structure in which the magnetic body of the track portion and the upper surface of the coil are flattened, and the minimum wiring pitch of the coil is 0.3.
μm to 2 μm. The interlayer insulating material is a material different from the inter-wiring insulating material. The interlayer insulating material is, for example, alumina, silica or an inorganic insulating material containing these as a main component, while the inter-wiring insulating material is an organic insulating material. As shown in FIG. 1, the cross section of the magnetic head for a hard disk is a lower shield 1, an upper shield 2, a reading sensor 3, a lower magnetic core 4, a substrate 5, insulating materials 6, 7, 8, a magnetic gap film 9, a track. Part 10, contact part 11,
It comprises a coil lower insulating layer 12, a coil 13, an insulating material 14, an upper insulating layer 15, a coil 16, an insulating material 17, an upper magnetic core 18, and a protective insulating material 19. These are almost the same as the conventional example, but different in the interlayer insulating material and the inter-wiring insulating material. Advantages of the difference between the interlayer insulating material and the wiring insulating material will be described in the next manufacturing process. FIG. 2 is a plan structural view of the track and the upper magnetic core of the magnetic head.
FIG. 3 shows the structure of the track portion of the write head when the air bearing surface A of FIG. 2 is viewed from the X direction.

The manufacturing process of the hard disk magnetic head of the first embodiment will be described. (A) A lower magnetic shield 1 and an upper magnetic shield 2 are formed on a substrate 5 made of a wafer such as alumina titanium carbide, and a read sensor 3 is formed in a gap therebetween, and a lower magnetic core 4 for a write head is further formed thereon. Non-magnetic insulators 6 and 7 are formed to separate the layers of the shields 1 and 2, the sensor 3 and the lower magnetic core 4, and the other parts are covered with a non-magnetic insulator 8 (see FIG. 4A). ).

(B) A magnetic gap film 9 for writing is formed on a predetermined portion on the lower magnetic core 4. Specifically, a magnetic gap film 9 made of alumina is formed on a track portion by a lift-off method.
Is formed to a thickness of 0.2 μm by a sputtering method.
After forming a laminated film of oFe alloy and Cr as a plating base film on the entire surface of the substrate by a sputtering method, a photoresist pattern in which the track portion 10 and the contact portion 11 are opened is formed, and the track portion 10 is formed by a method such as electroplating. The magnetic material of the contact portion 11 is formed at the same time. The thickness of the magnetic body is, for example, 3.0 μm. Here, it is desirable that the magnetic gap film 9 is formed only in the track portion 10 and that no magnetic gap is formed in the contact portion 11. Such consideration has an effect of reducing the loss of the magnetic circuit. A series of steps for forming a photoresist pattern, plating, stripping a resist, and removing an exposed unnecessary base film are well known to those skilled in the art. As an example of such a magnetic material, NiCoFe alloy plating having a saturation magnetic flux density of 2 Tesla is adopted. Such soft magnetic alloys are well known to those skilled in the art for their properties and preparation methods. After the formation of the magnetic material, it is desirable to perform FIB (Focused Ion Beam) processing for reducing the track width of the track portion 10. For example, a write track width of 0.2 μm is obtained (see FIG. 4B).

(C) Track section 10 and contact section 11
The lower surface of the coil (interlayer insulating material) 12
An insulating material layer such as alumina is formed by means such as sputtering (see FIG. 4C). The thickness of the insulating layer is, for example, 1
μm.

(D) A laminated film of Cu and Cr serving as a coil plating base film is formed on the entire surface of the substrate on the coil lower insulating layer 12 by a sputtering method, and then a photoresist pattern in which the coil 13 is opened is formed. The Cu coil 13 is formed by the above method. Note that, also here, a series of steps of forming a photoresist pattern, plating, stripping a resist, and removing an exposed unnecessary base film are well known to those skilled in the art. Minimum coil pitch is 1μm, coil height is 2μm
Is selected as an example. The number of turns of the coil should be determined from the design of the magnetic head, and eight turns are selected as an example (see FIG. 4D).

(E) A predetermined portion including the space between the wires of the coil 13 is filled with an insulating material 14 such as an organic resist. Positive photoresist mainly composed of novolak resin is selected as the organic insulating material, and the resist filled between the coils is subjected to vacuum heating at 230 ° C. for 1 hour as an example to ensure sufficient insulation and mechanical strength (FIG. 5E). reference). The use of photoresist as the insulating material not only ensures the flowability suitable for filling the minute gaps between the coils, but also forms the organic insulating material only at predetermined positions including the coils by photolithography. There are possible manufacturing advantages.

(F) Track section 10 and contact section 11
Polishing is performed so that the upper end of the coil 13 is exposed (see FIG. 5F). In the polishing process of the present embodiment, the polishing process is performed so that the upper ends of the track portion 10, the contact portion 11, and the coil 13 are exposed. In such a polishing process, as an example, a CM in which a substrate surface is flattened using a slurry solution in which alumina abrasive grains having a diameter of 0.1 μm to 0.2 μm are dispersed.
The P method can be used. In this processing, the excess inter-wiring insulating material 14 is removed, and at the same time, the coil lower insulating layer 12 formed on the track portion 10 and the contact portion 11 is also removed.
The polishing is finished when the upper surface of the metal layer is exposed. By such polishing, a structure for flattening the top surface of the magnetic body and the coil of the track portion can be realized. In addition, since the thickness of the interlayer insulating material is reduced, the distance between the coil layer and the coil layer to be formed next can be reduced, and the thickness of the magnetic head made of the laminated body can be reduced. Further, conventionally, when the thickness of the interlayer insulating material was increased, it was necessary to increase the width of the interlayer insulating material filled in the coil in the coil radial direction in order to increase the strength. Since the thickness of the insulating material can be reduced, the width of the interlayer insulating material in the coil radial direction can be reduced, and the coil wiring pitch can be reduced. Therefore, the size of the magnetic head in the radial direction can be reduced.

(G) A coil upper insulating layer (interlayer insulating material) 15 is formed on the coil 13. Alumina is used as an example of the coil upper insulating layer 15, and its thickness is set to 1 μm as an example (see FIG. 5g). In order to form the coil upper insulating layer 15 only at a predetermined position, alumina is deposited on the entire surface of the substrate by a sputtering method, then a photoresist pattern in which only the predetermined position is masked is formed, and the exposed alumina is removed by ion milling. Techniques can be used.

(H) A second layer coil 16 is formed on the coil upper insulating layer 15 in the same manner as the first layer coil (see FIG. 5H). The number of turns of the coil in the second layer should also be determined from the design of the head. For example, the same eight turns as in the first layer are selected.

(I) An inter-wire insulating material 17 such as an organic resist is formed between the wires of the coil 16 and on the wires (see FIG. 6i).

(J) After forming a laminated film of NiCoFe alloy and Cr as a plating base film on the entire surface of the substrate by sputtering, the upper magnetic core 18 connected to the exposed upper surfaces of the track portion 10 and the contact portion 11 is subjected to frame plating or the like. (See FIG. 6j). Upper magnetic core 18
A pattern of photoresist having an opening is formed, and a magnetic material is formed by a technique such as electroplating. For example, a Co—Fe-based soft magnetic material is used for the magnetic material. Such a material is selected because it can be formed by electroplating, and a very large material having a saturation magnetic flux density of 2 Tesla can be obtained relatively easily. The thickness of the upper magnetic core 18 should be selected from the viewpoint necessary to generate a strong recording magnetic field in the magnetic gap at the tip of the head, and 3 μm is selected as an example. In order to ensure the magnetic anisotropy of the upper magnetic core 18, it is desirable to apply a magnetic field during plating. To ensure good magnetic anisotropy, a magnetic field of 0.1 T may be applied as an example.

(K) A protective insulating material 19 is formed so as to cover the entire head (see FIG. 6k).

By sequentially performing the above-described series of steps (a) to (k), at least the coil layer of Example 1 in which one or both interlayer insulating materials are different from the inter-wiring insulating material is formed. A magnetic head having one layer can be manufactured.

Since a large number of magnetic head elements can be simultaneously formed on the substrate through a series of rational manufacturing steps as described above, a plurality of magnetic head elements are included from a wafer on which a large number of magnetic head elements are formed. Cut out the block,
The magnetic head can be completed by polishing the flying surface, railing the flying surface, forming a head protection film, and dividing the magnetic head into a single magnetic head.

The magnetic head of the first embodiment can be manufactured by using a series of steps as described above, but there is a close relationship between each step and the relation before and after the steps and the materials used in the steps.

In the example shown in FIG. 1, the reading MR (Ma
Gneto Resistive) head (or G
MR (Giant Magneto Resistive)
e) shows a composite head in which a head) and a write head are separated, in which an upper magnetic shield 2 and a lower magnetic core 4 are separated. However, it is also possible to use a magnetic head having a structure in which these are also used by the same magnetic material, and it goes without saying that they are included in this embodiment.

In the first embodiment, after the magnetic gap film 9 is formed, it is desirable to form the track portion 10 and the contact portion 11 of the magnetic circuit at the same time. Specifically, after forming the magnetic gap film 9 on the track portion by a technique such as lift-off, a plating base film is formed on the entire surface of the substrate, and then a photoresist pattern in which the track portion 10 and the contact portion 11 are opened is formed. Track part 1 by a method such as electroplating
0 and the magnetic material of the contact portion 11 are simultaneously formed. An FIB (Focused Ion B) for reducing the track width of the track section 10 after forming such a magnetic body.
Eam) processing or ion milling is desirable for improving the performance of the magnetic head. By such a narrowing process, the track width can be reduced to 0.1 μm to 0.5 μm.

The track portion 10 and the contact portion 11
As the magnetic material, a single layer or multiple layers of Ni-Fe, Ni-Co-Fe, or Co-Fe soft magnetic material is used. Such a material is selected because it can be formed by electroplating and a very large material having a saturation magnetic flux density of 1 Tesla to 2.4 Tesla can be obtained relatively easily. Further, the thickness of the track portion 10 and the contact portion 11 is desirably 2 μm to 5 μm. The thickness is determined in consideration of the forming ability of the photoresist for plating and the removal amount when the upper portions of the track portion 10 and the contact portion 11 are polished and removed for flattening in a later step.

In this embodiment, an insulating material layer such as alumina, which becomes the coil lower insulating layer 12, is formed by means such as sputtering. Such an insulating material layer becomes a lower insulating layer of the coil, and in the subsequent steps, the track portion 10 and the contact portion 1 are formed.
It also has the purpose of avoiding problems such as chemical corrosion occurring in one magnetic body. Such a coil lower insulating layer 12
Alumina, silica, zirconia,
Although a sputtered film of an oxide such as titania is used, this does not mean that an insulating material such as a nitride or a carbide is not used.
Alumina or silica film or a mixed film thereof is preferable from the viewpoint of economical efficiency of head manufacturing and required properties such as insulation and thermal conductivity, and the thickness is 0.05 μm to 2 μm.
m, more preferably 0.01 μm to 1 μm.

In the first embodiment, the first coil 1 is formed on the coil lower insulating layer 12 by means of frame plating or the like.
Form 3 Specifically, Cr as a plating underlayer film
After forming a laminated film of Cu and Cu on the entire surface of the substrate, forming a photoresist pattern that opens in a coil shape, and forming a coil of a low-resistance metal such as copper by a method such as electroplating,
After removing the photoresist, the unnecessary underlayer is removed by a technique such as ion milling or wet etching. According to the method of this embodiment, a coil having a fine shape can be formed relatively easily, and a coil having a minimum coil pitch of 0.3 μm to 2 μm and a coil height of 1 μm to 3 μm can be obtained. .

In the first embodiment, a predetermined portion including the space between the wires of the coil 13 is filled with an insulating material 14 such as an organic resist. As such an organic insulating material, a heat-cured product of a positive photoresist containing a novolak resin as a main component is used. However, this does not mean that other organic materials cannot be used. Use of a photoresist has an advantage in manufacturing that an organic insulating material can be formed only at a predetermined position including a coil by a photolithographic technique.

In the first embodiment, polishing is performed so that the upper ends of the track portion 10, the contact portion 11, and the coil 13 are exposed. For such polishing, CMP (Chemical Me) is used to planarize the substrate surface using a slurry liquid in which fine powder particles such as alumina, silica, and ceria are dispersed.
It is preferable to use (chemical polishing).

In the first embodiment, the coil upper insulating layer 15 is formed on the coil 13.
Is to form an insulating material layer such as alumina by means such as sputtering. As the insulating material for forming the coil lower insulating layer 12, a sputtered film of an oxide such as alumina, silica, zirconia, or titania is used. However, it is not limited that an insulating material such as a nitride or a carbide is not used. From the economics of head manufacture and the required properties such as insulation and thermal conductivity, an alumina or silica film or a film obtained by mixing them is preferable, and the thickness is also 0.05 μm to 2 μm, more preferably 0.01 μm to 1 μm. It is.

The coil 16 of the second layer of the first embodiment
The second-layer coil 16 is formed on the coil upper insulating layer 15 by using a method such as frame plating. Specifically, C as a plating base film
After forming a laminated film of r and Cu on the entire surface of the substrate, forming a photoresist pattern that opens in a coil shape, forming a coil of a low-resistance metal such as copper by a method such as electroplating, and removing the photoresist. Unnecessary base films are removed by a technique such as ion milling or wet etching. According to the method of the present embodiment, it is possible to form a coil having a fine shape relatively easily. The minimum wiring pitch of the coil is 0.5 μm to 2.0 μm, and the coil height is 1 μm to 3 μm.
Is obtained.

The insulating material 17 such as an organic resist formed between the wires of the coil 16 and on the wires in the first embodiment uses an insulating material between wires such as an organic resist. As such an organic insulating material, a heat-cured product of a positive photoresist containing a novolak resin as a main component is used. However, this does not mean that other organic materials cannot be used. The use of a photoresist has an advantage in manufacturing that an organic insulating material can be formed only at a predetermined position including a coil by a photolithographic technique. According to this method, it is possible to manufacture a magnetic head including a coil in which the first layer coil has a different interlayer insulating material and a different wiring insulating material.

Further, in the first embodiment, an insulating material such as an organic resist is filled between the wirings of the second layer coil, the upper surface of the second layer coil is polished and flattened, and the upper insulating layer of the coil is made of an inorganic insulating material such as alumina. A material may be formed. With this method, it is possible to manufacture a magnetic head including a coil in which the first layer coil and the second layer coil have different interlayer insulating materials and different wiring insulating materials. As described above, whether the coil having the different interlayer insulating material and the inter-wiring insulating material, which is a feature of the present embodiment, is used only in the first layer or in the first layer and the second layer is determined in terms of both performance and economy. It is judged.

The upper magnetic core 18 of this embodiment is formed by using a means such as frame plating. In this magnetic core, a plating base film is formed on the entire surface of the substrate, then a photoresist pattern in which the upper magnetic core 18 is opened is formed, and the magnetic material of the upper magnetic core 18 is formed by a method such as electroplating. Such magnetic materials include Ni-Fe or Ni-
Co-Fe or a Co-Fe soft magnetic material is used. Such a material can be formed by electroplating,
It is selected because a very large material having a saturation magnetic flux density of 1 Tesla to 2.4 Tesla can be obtained relatively easily. The thickness of the upper magnetic core 18 should be selected from the viewpoint necessary to generate a strong recording magnetic field in the magnetic gap at the tip of the head. Although the thickness is affected by the saturation magnetic flux density of the magnetic material, it is usually 1 μm. ５5 μm.

As the protective insulating material 19 of this embodiment, a sputtered film of an oxide such as alumina, silica, zirconia, or titania is used. However, it is not limited that an insulating material such as nitride or carbide is not used. An alumina or silica film or a mixed film thereof is preferable because of the economics of head manufacture and the required properties such as insulation and thermal conductivity.

In the magnetic head of this embodiment, at least one
The coil pitch is 0.5 μm to 2.0 μm by appropriately selecting an inorganic insulating material as the interlayer insulating material and an organic insulating material as the insulating material between the wirings, with a structure including a coil having a different interlayer insulating material between layers and an insulating material between wirings. , Coil height 1μm ~ 3μ
Since a m-shaped coil can be easily formed, a fine magnetic circuit can be realized, and a magnetic head capable of high-speed data transfer can be provided. By mounting such a magnetic head, 10
G bits / square inch to 200 Gbits / square inch,
Preferably, a magnetic disk drive having a recording density of preferably 50 Gbit / square inch to 200 Gbit / square inch can be easily provided.

Further, the magnetic head of this embodiment has a structure in which at least one layer of an interlayer insulating material and a coil having different wiring insulating materials are provided, and a structure in which the magnetic material of the track portion and the upper surface of the coil are flattened. This has the advantage that the step of the upper magnetic core can be formed small.

According to this embodiment, the structure of the write head including the coil portion and the upper magnetic core portion and a series of manufacturing processes are rationally designed, and are optimal for satisfying the characteristics required for the magnetic head. This makes it possible to overcome the difficulty of adapting the converted material to the manufacturing process.

FIG. 7 shows an example of a method of incorporating the magnetic head 20 manufactured as described above into the magnetic disk drive 26. The magnetic head 20 according to the present embodiment is mounted on the tip of a suspension 21 in advance, and a voice coil motor 22 is mounted.
Drive structure. Magnetic disk 2 serving as a recording medium
3 rotates a plurality of sheets with the same cylinder. It is well known to those skilled in the art that usually two magnetic heads are mounted on one magnetic disk in order to use both sides of the disk as a recording medium. Driving semiconductor 24 and suspension 21 containing a circuit for controlling writing and reading of a recording signal
Is mounted, and the magnetic disk device 26 is completed.

The magnetic disk device 26 uses the magnetic head 20 of the present embodiment, and uses a magnetic disk 23 having a medium having a coercive force of 5000 Oe.
By using a rotation speed of 000 rpm, a track recording density of 22 kTPI (track per inch), a linear recording density of 230 kBPI (bit per inch) and a recording density of 5 G
Remarkably excellent recording performance of bits / square inch can be achieved.

The magnetic head which can be used for such high-performance magnetic recording can be provided by a simple manufacturing process due to the excellent head structure of the present embodiment and the manufacturing method for realizing this.

Embodiment 2 will be described with reference to FIG. The magnetic head of the present embodiment differs from the magnetic head of the first embodiment in that the corresponding track portion 10 and the contact portion 11 of the magnetic circuit shown in FIG.
6 to FIG. 6, which is shown in FIG.
In the formation of the track portion 10 and the contact portion 11 of the magnetic circuit in such a case, the magnetic gap film 9 for writing is formed, and then the track portion 10 and the contact portion 1 of the magnetic circuit are formed by means of frame plating using a photoresist.
The first magnetic body 30 and the magnetic gap film 9 are not formed at the same time, but after forming a photoresist frame.
The non-magnetic material 31 and the second magnetic material 32 having the function of (1) are continuously formed by the electroplating technique. As the frame width of the photoresist, for example, 0.15 μm is selected.

By using such a method, it is possible to make the dimensions of the photoresist coincide with the dimensions of the track portion, and it is possible to prevent the track width from being changed due to the process of narrowing the track size by ion milling or the like. It is more preferable for production.

The first magnetic body 30 and the second magnetic body 3
For example, a Co—Fe-based soft magnetic material is used for 2 and its thickness is selected to be 1.5 μm as an example. As the non-magnetic material 31, a non-magnetic metal or alloy such as palladium or nickel-copper or nickel-tin can be used. As an example, palladium having a thickness of 0.1 μm is selected.

After the track portion 10 and the contact portion 11 of the magnetic circuit are simultaneously formed, a magnetic head is manufactured in exactly the same steps as in FIGS. FIG. 8B is a completed view corresponding to FIG. FIG. 9 shows the structure of the track portion of the write head as viewed from the air bearing surface as in FIG.

[0059]

According to the present invention, the coil size can be reduced,
It is possible to obtain a hard disk magnetic head having a track portion, a coil portion, an upper magnetic core portion and the like in which a magnetic circuit is miniaturized, a method of manufacturing the same, and a magnetic disk device.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view of a magnetic head according to a first embodiment.

FIG. 2 is an explanatory plan view of a part of the structure of the magnetic head according to the first embodiment;

FIG. 3 is an explanatory diagram of a structure of a track portion of the magnetic head according to the first embodiment.

FIG. 4 is an explanatory sectional view of a manufacturing step 1 of the magnetic head according to the first embodiment;

FIG. 5 is an explanatory sectional view of a magnetic head manufacturing process 2 according to the first embodiment;

FIG. 6 is an explanatory sectional view of a manufacturing step 3 for the magnetic head of the first embodiment;

FIG. 7 is an explanatory view showing the appearance of a magnetic disk drive using the magnetic head of the first embodiment.

FIG. 8 is an explanatory sectional view of a structure of a magnetic head according to a second embodiment;

FIG. 9 is a structural explanatory view of a track portion of the magnetic head according to the second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower magnetic shield 2 Upper magnetic shield 3 Read sensor 4 Lower magnetic core 5 Substrate 6 Non-magnetic insulator 7 Non-magnetic insulator 8 Non-magnetic insulator 9 Magnetic gap film 10 Track part 11 Contact part 12 Coil lower insulating layer (interlayer insulation) 13) Coil 14 Insulating material between wirings 15 Coil upper insulating layer (interlayer insulating material) 16 Coil 17 Insulating material between wirings 18 Upper magnetic core 19 Protective insulating material 20 Magnetic head 21 Suspension 22 Voice coil motor 23 Magnetic disk 24 Driving semiconductor Reference Signs List 25 signal cable 26 magnetic disk device 30 first magnetic body 31 non-magnetic body 32 second magnetic body

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Noriyuki Saiki 2880 Kozu, Odawara City, Kanagawa Prefecture F-term in Storage Systems Division, Hitachi, Ltd. 5D033 BA36 BA42 CA05 DA03 DA04 DA07 DA31

Claims (11)

[Claims] 2. A magnetic head for a hard disk, comprising: a laminated body in which a coil layer insulated by an interwiring insulating material and a magnetic core layer are insulated by an interlayer insulating material, wherein at least one of the coil layers has one side. Alternatively, a magnetic head for a hard disk, wherein an interlayer insulating material on both sides is made of a material different from an insulating material between wirings. 2. The magnetic head for a hard disk according to claim 1, wherein at least one of the coil layers has the same interlayer insulating material on both sides. 3. The magnetic head for a hard disk according to claim 1, wherein the interlayer insulating material is an inorganic insulating material, and the inter-wiring insulating material is an organic insulating material. . 4. The magnetic head for a hard disk according to claim 3, wherein the interlayer insulating material is alumina, silica, or an inorganic insulating material containing these as a main component. 5. The magnetic head for a hard disk according to claim 1, wherein the coil layer has a coil having a minimum wiring pitch of 0.3 μm.
A magnetic head for a hard disk, characterized by having a thickness of about 2 μm. 6. The magnetic head for a hard disk according to claim 1, wherein the number of the coil layers is two. 7. The magnetic head for a hard disk according to claim 1, wherein the coil layer includes a coil having a structure in which a magnetic body of a track portion and a top surface of the coil are flattened. Hard disk magnetic head. 8. The magnetic head for a hard disk according to claim 1, further comprising a track portion formed of three layers of a magnetic material, a non-magnetic material, and a magnetic material. Magnetic head. 9. A step of forming a magnetic gap on the lower magnetic core, a step of simultaneously forming a track portion and a contact portion of a magnetic circuit, a step of forming a coil lower insulating layer made of an interlayer insulating material, a first layer Forming a coil of
A step of filling a predetermined portion including a space between the coil wires with an inter-wire insulating material, a step of flattening the magnetic body of the track portion and the upper surface of the coil, a step of forming a coil upper insulating layer made of an interlayer insulating material, an upper magnetic core Forming a protective insulating material, and a method of manufacturing a magnetic head for a hard disk. 10. A magnetic disk device comprising the magnetic head for a hard disk according to claim 1. 11. The magnetic disk drive according to claim 10, wherein the magnetic disk drive has a recording density of 10 Gbit / square inch to 200 Gbit / square inch.