JP2002077699A - Solid state image pickup device, support/optical axis tilt adjustment element for solid state image pickup device, image forming position adjustment element for solid state image pickup device and image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device wherein an image forming position and an optical axis tilt can be adjusted independently, further sufficient cooling/heat dissipation effect is obtained regardless of the image forming position or the position/attitude of the optical axis tilt. SOLUTION: In a convexity-shaped hemispherical surface 5a of an optical axis tilt adjustment plate 5 supporting a solid image pickup element and a concavity-shaped hemispherical surface 12a of a screw portion 12 for an image forming position adjustment having a side face 12SS engaged threadedly to a main opening 11MH of a heat exchanger plate 11 whose one end is fixed to a front case, both of them have the same radius of curvature and are curved surfaces having the center of curvature in the image pickup surface center. Both surfaces 5a, 12a always make contact with their surfaces. The image forming position can be adjusted by the rotation and the displacement in the Z direction of a female screw portion 12 and the optical tilt can be adjusted without displacing the image forming position by rotating an adjustment plate 5 around the X axis so that the image pickup surface center is to be the rotation center. Moreover both portions 5, 12 also serve as a heat dissipation structure portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
(Charge-coupled device) and a solid-state imaging device having a solid-state imaging device typified by an artificial retinal chip, and having a holding function, an imaging position adjustment function, an optical axis tilt angle adjustment function, and a heat radiation function of the solid-state imaging device. It is about. The present invention also relates to an imaging device having the solid-state imaging device (for example, a digital still camera or a video camera).

[0002]

2. Description of the Related Art In general, a solid-state image pickup device is often used as a device for converting an optical signal of an original reading device such as a facsimile, a copying machine, a scanner, etc. into an electric signal.
It is very difficult to reduce the dimensional accuracy of the package outer shape of the solid-state imaging device to 0.1 mm or less due to device fabrication.

However, when a solid-state image sensor is incorporated into a product, the reading line of the solid-state image sensor is set to 0.01 m in the Z direction (optical axis direction) from the viewpoint of optical characteristics.
It is necessary to position and fix at a predetermined position with a positional accuracy of m.

In addition, the inclination (optical axis tilt angle) of the imaging surface of the solid-state image sensor with respect to the Z direction (optical axis direction) includes a first optical axis tilt angle α (rotation around the X axis direction) and a second optical axis tilt angle. For each of β (rotation around the Y-axis direction), it is necessary to position and fix the imaging surface or reading line of the solid-state imaging device at a predetermined position with a positional accuracy of the order of several minutes or less.

However, as described above, since the external dimensional accuracy of the package of the solid-state imaging device is lower by one digit or more than the assembly accuracy of the product, it is difficult to simply perform the positioning.
The required accuracy cannot be ensured. Therefore, in order to properly form a subject image on the imaging surface of the solid-state imaging device, the solid-state imaging device must be mounted in the front package of the imaging device, and then the position of the solid-state imaging device in the optical axis direction must be changed. In addition, it is necessary to perform a work of positioning and fixing while adjusting the optical axis inclination angles α and β mutually.

(Prior Art 1) As an example of a conventional mounting technique of a solid-state imaging device, there is one proposed in, for example, JP-A-6-148488. Here, FIGS. 10 and 11 are drawings showing a mounting structure of a conventional solid-state imaging device proposed in the above-mentioned publication, and FIG. 10 is an exploded perspective view showing an entire configuration of the mounting structure. FIG. 11 is a view showing the relationship between the mounting portion of the solid-state imaging device holder and the locking groove on the mounting means side.

First, referring to FIG. 10, a mounting configuration of a solid-state imaging device according to Prior Art 1 will be described. As shown in FIG. 10, a mounting member 102 for mounting the solid-state imaging device 101 by performing a predetermined adjustment has an L-shape. A horizontal base portion 102a as a portion and an imaging lens 103
And a vertical base 102b on which the solid-state imaging device 101 is positioned. The vertical base portion 102b has an image forming lens 1
The solid-state imaging device 101 includes an opening 104 for guiding the light focused by the light-emitting element 03 to a pixel line of the solid-state imaging device 101. In addition, the imaging lens 103 is located on the horizontal base 102a.
The position of the imaging lens 103 is adjusted so that the optical axis of the imaging lens 103 coincides with the optical axis of the solid-state imaging device 101, and
a. Here, Z indicates the optical axis. or,
101a is a connection terminal attached to the solid-state imaging device 101.

In the prior art 1, the solid-state imaging device 101
Is attached to the vertical base portion 102b of the attachment member 102 using a holder 105. Therefore, hereinafter, referring to FIG. 11 in addition to FIG.
The relationship between the mounting portion 105b of No. 5 and the locking groove 106 provided around the opening 104 in the vertical base 102b will be described.

[0009] As shown in FIGS.
The mounting portions 105b formed at the four corners of the mounting member 102
Is inserted and locked in a locking groove 106 provided around the opening 104 in the vertical base portion 102b. The locking groove portion 106 is formed from one end position close to each corner of the opening 104 in the rear surface of the vertical base portion 102b to another end position which passes through the side surface of the vertical base portion 102b. The locking groove 106 is formed by making a notch 107 having a vertex at each corner 102c of the rear surface of the vertical base portion 102b in the rear surface and the adjacent side surface of the vertical base portion 102b.

As shown in FIG. 11, the locking groove 106 has projections 106a arranged in a staggered manner, and these projections 106a allow a linear mounting portion 105b made of a compression coil spring to be locked. When it is inserted into the inside 106, it is bent and held in a pressed state. For this reason, the holder 105
When positioning the solid-state imaging device 101 supported by the above, in a state where the mounting portion 105b of the holder 105 is locked in the locking groove 106 having the staggered projection 106a,
The locking position is adjusted according to the positioning of the solid-state imaging device 101. When the solid-state imaging device 101 is positioned at an appropriate position, the mounting portion 105b is fixed by the locking groove 106 at the locking position.

Next, the solid-state image sensor 1 is mounted on the vertical base 102b of the mounting member 102 on which the imaging lens 103 is mounted.
In order to mount 01, first, the frame 1 of the holder 105 made of a compression coil spring formed by a coiling machine is used.
The solid-state imaging device 101 is fitted and fixed to 05a. Then, each mounting portion 105b formed on the holder 105 is inserted into the locking groove portion 106 from the cutout portion 107 formed at each corner portion 102c of the vertical base portion 102b,
The staggered protrusion 106a of the locking groove 106 is locked.

In this state, the solid-state image sensing device 101 captures an image projected on an optical position detecting device (not shown) or a normal position by the solid-state image sensing device 101.
Adjust the position of 1. During this adjustment, each mounting portion 105b of the holder 105 can slide inside the locking groove 106 while having a certain resistance.

When the position adjustment of the solid-state imaging device 101 is completed, a member (not shown) that supports and adjusts the solid-state imaging device 101 for positioning is separated from the solid-state imaging device 101, and the solid-state imaging device 101 In the adjustment position, the locking groove 106 is inserted through each mounting portion 105b of the holder 105.
Is locked and fixed.

In the above configuration, as shown in FIG.
The attachment portion 105b having a spring property is a staggered protrusion 106
When the solid-state imaging device 101 is locked by the locking groove 106, displacement due to positioning of the solid-state imaging device 101 is given to any of the four mounting portions 105b. A small amount of entry and exit is possible while abutting on the staggered protrusion 106a of the stop groove 106. Then, the solid-state image sensor 1
01 can be held in place.

(Prior Art 2) On the other hand, a solid-state image pickup device in a general image pickup apparatus has a characteristic that a dark current increases with a rise in temperature, and the image quality is remarkably increased by such an increase in the dark current. Will deteriorate. Conversely, when the solid-state imaging device is cooled, dark current can be suppressed.
In view of the above, various types of cooling configurations of solid-state imaging devices and heat radiation configurations accompanying cooling have been conventionally proposed. An example of such a conventional cooling / radiating structure is disclosed in Japanese Patent Application Laid-Open No.
There is one disclosed in Japanese Patent Application Laid-Open No. 11-111. FIG. 12 is a side view showing a heat radiation structure of the solid-state imaging device proposed in the above publication. Hereinafter, the heat dissipation structure of the solid-state imaging device illustrated in FIG. 12 will be described.

As shown in FIG. 12, the color separation prism 201
Is attached to the housing 202, and the color separation prism 2
The solid-state imaging device 203 is attached to the light exit surface of the light emitting device 01. A peripheral circuit board 204 is mounted on the solid-state imaging device 203. Further, on the peripheral circuit board 204, one surface of the cooling side of the Peltier device 206 is mounted, and on the other surface of the Peltier device 206 on the heat radiation side. Is fixed to the heat transfer plate 207. And this heat transfer plate 20
7 is connected to the housing 202 via a heat conducting member 205 having a meandering portion 205a meandering in the vertical direction.

According to the heat dissipation structure of the solid-state imaging device having such a configuration, the heat generated in the solid-state imaging device 203 and the peripheral circuit board 204 is forcibly transmitted to the heat transfer plate 207 by the Peltier effect of the Peltier device 206. The solid-state imaging device 203 can be cooled, and the Peltier device 2 can be cooled.
06 is generated by the heat transfer plate 207 and the heat conducting member 20.
5 and is radiated to the outside from the housing 202.

[0018]

(Problem 1) According to the prior art 1 described above, there are the following problems. That is, in the prior art 1, since the spring lines at the four corners forming the mounting portion of the holder are held in the engaging groove portion in a pressed state, the image forming position of the imaging surface of the solid-state imaging device, the first optical axis tilt angle When adjusting the tilt angle of the second optical axis, the image forming position, the tilt angle of the first optical axis and the tilt angle of the first optical axis are adjusted while adjusting the press-fit amounts of the respective spring wires at the four corners with an accuracy of 0.01 mm against the frictional force of the pressure contact. It is necessary to adjust the second optical axis tilt angle to a desired position and each desired angle. Therefore, each of the spring lines at the four corners changes the imaging position, the first optical axis tilt angle, and the second optical axis tilt angle. as a result,
Even if the imaging position is determined and then both or one of the first optical axis tilt angle and the second optical axis tilt angle is adjusted, if a certain spring line is adjusted, the fixed image forming position is also adjusted. Therefore, there is a problem that the adjustment is difficult to converge and the adjustment takes time.

(Problem 2) Although the above-mentioned prior art 1 has the above-mentioned problem 1, the image forming position, the first optical axis tilt angle, and the second optical axis tilt angle of the imaging surface of the solid-state image pickup device. It has a function to adjust. However, the prior art 1 does not disclose or propose any effective cooling / radiating configuration of the solid-state imaging device. For this reason, in addition to the respective adjustment functions of the imaging position, the first optical axis tilt angle, and the second optical axis tilt angle, a solid-state imaging device and an imaging device having a cooling / radiating function of a solid-state imaging element as a dark current suppression measure Is required.

Therefore, as a measure for realizing such a demand, it is first conceivable to combine the above two prior arts 1 and 2. However, Prior Art 1 only proposes an adjusting function without considering any cooling / radiating function, while Prior Art 2 merely proposes a cooling / radiating function without considering any adjusting function. Therefore, there is no opportunity to think about how to combine the two conventional technologies to realize the imaging position / optical axis tilt adjustment function and the cooling / radiating function at the same time. Absent.

Even if the prior art 1 and the prior art 2 are combined to realize an imaging apparatus having both the function of adjusting the imaging position / optical axis tilt angle and the function of cooling and radiating heat, A heat radiation structure member as proposed in the technology 2 and an imaging position / optical axis tilt adjustment member as proposed in the prior art 1 are required, respectively, and the number of components increases. This raises a new problem that the image pickup apparatus including the image pickup apparatus is rather large.

(Problem 3) In the case where a solid-state imaging device larger than the cooling device is cooled by the cooling device, if the cooling device is directly adhered to the solid-state imaging device, the surface of the solid-state imaging device may be cooled. Since the solid-state imaging device is not cooled in the portion where the cooling element is not attached, temperature unevenness or cooling unevenness occurs between the cooled portion of the solid-state imaging device and the uncooled portion of the solid-state imaging device. In addition, there is a problem that the cooling unevenness adversely affects the characteristics of the solid-state imaging device.

In the case of cooling a solid-state imaging device larger than a cooling device, when cooling the solid-state imaging device by directly attaching a plurality of cooling devices to the solid-state imaging device, the individual cooling devices may be cooled. Temperature unevenness or cooling unevenness may occur in the cooling portion of the solid-state imaging device due to the variation in the characteristics of the solid-state imaging device. Occurs.

The present invention has been made to solve the above-mentioned problems, and has the following objects.

(1) The imaging position of the imaging surface of the solid-state imaging device in the Z direction (optical axis direction), the first optical axis tilt angle α with respect to the Z direction (optical axis direction) (rotation around the X axis direction) And the second
To realize a solid-state imaging device and an imaging device including the solid-state imaging device that can adjust the optical axis inclination β (rotation around the Y-axis direction) independently of each other.

(2) The adjustment part which can be performed independently of the above (1) also has a cooling / radiation structure part of the solid-state image sensor at the same time, and the adjustment posture of the imaging surface of the solid-state image sensor. A solid-state imaging device and an imaging device that always have stable heat dissipation performance are realized.

(3) To realize a solid-state imaging device and an imaging device having the features of (1) and (2) with a compact configuration.

(4) To provide a solid-state imaging device and an imaging device that do not cause temperature unevenness even when a solid-state imaging device larger than a Peltier device is cooled, or when a solid-state imaging device is cooled using a plurality of Peltier devices. To do.

[0029]

According to a first aspect of the present invention, there is provided a solid-state imaging device having a first main surface including an imaging surface and a second main surface facing the first main surface; An optical axis such that the center of the surface corresponds to the intersection of a first direction and a second direction orthogonal to the first direction, and the center of the imaging surface is orthogonal to the first direction and the second direction. Holding the solid-state imaging device so as to be located on a third direction as a direction, and having a first curvature surface located behind the second main surface as viewed from the solid-state imaging device, a holding / optical axis tilt angle An adjusting portion, and a second curvature surface in surface contact with the first curvature surface, along the third direction while maintaining a surface contact state and a contact area between the first curvature surface and the second curvature surface. And an imaging position adjustment unit which can be translated.The holding / optical axis tilt adjustment unit adjusts the surface contact state. And presses the imaging position adjustment unit in the third direction, and unless the imaging position adjustment unit itself performs the translational movement, the imaging position adjustment unit receives the pressure from the holding / optical axis tilt adjustment unit. In a stationary state against the pressing, the first radius of curvature of the first curvature surface and the second radius of curvature of the second curvature surface are equal to each other, and the first radius of curvature of the first curvature surface is equal to the first radius of curvature.
Both the center of curvature and the second center of curvature of the second curvature surface correspond to the center of the imaging surface.

According to a second aspect of the present invention, there is provided a solid-state imaging device according to the first aspect.
4. The solid-state imaging device according to claim 1, wherein the holding / optical axis tilt angle adjustment unit rotates around the first direction around the center of the imaging surface while maintaining the surface contact state and the contact area. It is characterized by being possible.

According to a third aspect of the present invention, there is provided a solid-state imaging device according to the second aspect.
4. The solid-state imaging device according to claim 1, wherein the holding / optical axis tilt adjustment unit is configured to control the imaging surface while maintaining the surface contact state and the contact area independently of the rotational movement about the first direction. Is further rotatable around the second direction with the center of rotation being the rotation center.

According to a fourth aspect of the present invention, there is provided a solid-state imaging device according to the third aspect.
4. The solid-state imaging device according to claim 1, wherein the holding / optical axis tilt adjustment unit includes a first surface having a step as a positioning unit of the solid-state imaging device, and a first curvature facing the first surface and the first curvature A middle member that is not a thermoelectric cooling element and has a second surface located on a side facing the second curvature surface and is coupled to a peripheral portion of the first surface of the middle member excluding the step portion And a claw that projects toward the step portion side of the intermediate member and presses the second main surface of the solid-state imaging device against the bottom surface of the step portion to fix the solid-state imaging device to the intermediate member. A cover member having a first portion and a peripheral portion connected to the peripheral portion of the intermediate member so as to face the second surface of the intermediate member and maintain a predetermined distance between the cover member and the intermediate member. A first surface facing the first surface and the first curvature surface; And an optical axis tilt adjustment plate that is independently rotatable around each of the first direction and the second direction while maintaining the surface contact state and the contact area. And the bottom surface of the step portion is, before the optical axis tilt angle adjustment, parallel to a plane that includes the first direction and the second direction and is orthogonal to the third direction. The predetermined interval formed between the vicinity of the periphery and the vicinity of the periphery of the first surface of the optical axis tilt adjustment plate is such that both the first center of curvature and the second center of curvature are the same. The first radius of curvature and the second radius of curvature are set to values that correspond to the center of the imaging surface and are equal to each other.

According to a fifth aspect of the present invention, there is provided a solid-state imaging device according to the fourth aspect.
5. The solid-state imaging device according to claim 1, wherein the holding / optical axis tilt adjustment unit further includes a thermoelectric cooling element, and a part of the second surface of the intermediate member excluding a peripheral edge thereof cools the thermoelectric cooling element. And a portion of the first surface of the optical axis tilt adjustment plate other than the peripheral portion is in contact with a surface on the heat radiation side of the thermoelectric cooling element.

According to a sixth aspect of the present invention, there is provided a solid-state imaging device according to the fourth aspect.
Or the solid-state imaging device according to 5, wherein the imaging position adjustment unit has a first surface having the second curvature surface and a second surface facing the first surface, and the third direction A translation unit that is capable of translation along the body, a main body having a hole screwed to a side surface of the translation unit, and extends along each of the at least two side surfaces of the main body along the third direction. And a heat transfer plate having at least two extending portions.

According to a seventh aspect of the present invention, there is provided an imaging device comprising a front case and the solid-state imaging device according to the sixth aspect, wherein the end portions of the at least two extending portions of the heat transfer plate of the solid-state imaging device are provided. It is characterized by being fixed to the inner wall of the front case.

The solid-state image pickup device holding / optical axis tilt adjusting section according to claim 8 is used in the solid-state image pickup device according to any one of claims 1 to 6.

According to a ninth aspect of the present invention, an imaging position adjusting unit for a solid-state imaging device is used in the solid-state imaging device according to any one of the first to sixth aspects.

[0038]

(Embodiment 1) FIGS. 1 to 3
1 is a diagram illustrating a configuration of a solid-state imaging device 100 according to the present embodiment. Among these drawings, FIG. 1 is a front view of the solid-state imaging device 100, and FIG. 2 is A1-A2 shown in FIG.
FIG. 2 is a longitudinal sectional view of the solid-state imaging device 100 regarding a line. or,
FIG. 3 shows a state in which the solid-state imaging device 100 is mounted inside the front case 7 of the imaging device 200 and the Z
Position in the direction (optical axis direction), first optical axis tilt angle α
(Rotation around the X-axis direction) and the second optical axis inclination β (rotation around the Y-axis direction) before the adjustment of the solid-state imaging device 100 is performed.
FIG. 3 is a perspective view showing the optical axis tilt angle adjustment unit and the imaging position adjustment unit divided into two parts.

Here, the holding / optical axis tilt adjusting portion is a portion having the respective portions 2, 3, 4a, 4b, and 5 in FIGS. 1 to 3 as main portions, and (i) the center of the imaging surface 1S1. PC is the first
Intersection (X = 0, Y = Y) of a direction X (also called X direction) and a second direction Y (also called Y direction) orthogonal to the first direction X
0) and the center PC of the imaging surface 1S1 is located in a third direction Z (also referred to as a Z direction) as an optical axis direction orthogonal to the first direction X and the second direction Y. A function of holding the solid-state imaging device 1, and (ii) a first curvature surface 5a and a second curvature surface 12a to be described later before adjusting the optical axis tilt angle.
Imaging surface 1S while maintaining the surface contact state and contact area with
A first optical axis tilt adjustment function rotatable around the first direction X about the first center PC as a center of rotation; and (iii) an optical axis tilt adjustment independently of the rotation motion about the first direction X. While maintaining the surface contact state and the contact area between the first curvature surface 5a and the second curvature surface 12a, the imaging surface 1S1
And a second optical axis tilt adjustment function that can be further rotated around the second direction Y about the center PC as a rotation center.

In the present embodiment, the X-axis direction and the Y-axis direction are defined as a first direction and a second direction, respectively.
Conversely, the Y-axis direction and the X-axis direction are referred to as a first direction and a second direction, respectively.
It may be called a direction.

Also, the image forming position adjusting unit is shown in FIGS.
The main portions 12 and 11 are the main portions, and translate along the third direction Z while maintaining the surface contact state and the contact area between the first curvature surface 5a and the second curvature surface 12a. Thereby, the position of the imaging surface 1S1 is changed to the image forming position (Z =
0), more precisely, the imaging surface 1S1
Has a function of adjusting the position of the center PC in the Z direction such that the position of the center PC in the Z direction comes to the imaging position (Z = 0).
In addition, the imaging position adjustment unit receives pressure from the holding / optical axis inclination adjustment unit in the third direction Z via the surface contact state, but the imaging position adjustment unit does not perform the translational movement by itself. Is in a stationary state against the above-mentioned pressing from the holding / optical axis tilt adjusting section. Here, the portion 12 has a first surface 12S1 having a second curvature surface 12a and a planar second surface 12S2 opposed to the first surface 12S1, and is capable of translating along the third direction Z. It is a translation unit or an image forming position adjusting screw unit. The portion 11 has a main opening 11 screwed with the side surface 12SS of the image position adjusting screw portion 12.
The heat transfer plate includes a main body having MH and at least two extending portions extending along at least two side surfaces of the main body along the negative third direction -Z.

FIG. 4 shows a state in which the solid-state imaging device 100 is mounted inside the front case 7 (here, it is assumed that the adjustment of the image forming position and the tilt angles α and β of the optical axes performed after the mounting are completed). FIG. 2 is a longitudinal sectional view showing an internal structure of the imaging device 200 formed by connecting and fixing the front case 7 and the rear case 14 to each other via the O-ring 13. FIG. 5 is a front view of the imaging device 200, and shows the imaging device 200 with respect to the line B1-B2 shown in FIG.
Corresponds to FIG. 4.

FIGS. 6 and 7 show the solid-state imaging device 100 mounted inside the front case 7 (however, the illustration of the mounting state inside the front case 7 is omitted). A1-A in FIG. 1 showing an adjustment process when the first optical axis tilt angle adjustment of the imaging surface 1S1 is performed.
FIG. 3 is a vertical sectional view of the solid-state imaging device 100 regarding two lines.

As described above, the position of the point having the coordinates of X = 0 and Y = 0 (the intersection point between the X direction and the Y direction) is the center PC of the imaging surface 1S1 of the solid-state imaging device 1, and Z = 0
The position of the surface corresponds to the position of the imaging surface 1S1 of the solid-state imaging device 1 after the adjustment of the imaging position. Therefore, the position coordinates of the center PC of the imaging surface 1S1 after the adjustment of the imaging position are (0, 0, 0).

Hereinafter, the configuration of each part of the solid-state imaging device 100 will be described by mainly referring to FIGS. 1 and 2 and also to FIGS. 3 and 4 as appropriate.

First, the solid-state imaging device 1 has a first main surface composed of a peripheral portion forming a step and an imaging surface 1S1 which is a surface of a convex portion surrounded by the peripheral portion, and an entire surface of the first main surface. The second main surface 1S2 opposes the first main surface, and four side surfaces sandwiched between the two main surfaces. As shown in FIGS. 1 and 2, the solid-state imaging device 1 has a step portion formed at the center of the first surface 2S1 of the intermediate member 2 by the intermediate member 2 and the cover member 3. Alternatively, it is positioned at a predetermined position in the positioning portion 2B, and is fixed in that state. That is,
The tips of the seven claw portions 3P1 to 3P7 of the cover member 3 are in contact with the peripheral portion of the first main surface of the solid-state imaging device 1 (the bottom surface of the step portion), and the cover member 3 added via this contact is provided.
The second main surface 1S2 of the solid-state imaging device 1 is pressed against the bottom surface 2BS of the positioning portion 2B without being shifted by the spring force of the claw portions 3P1 to 3P7. At that time, the bottom 2B
S is formed with a machining accuracy that is substantially parallel to the XY plane, but as described above, since the accuracy of the package dimensions of the solid-state imaging device 1 is not always good, the stepped portion 2B is formed. Image sensor 1 positioned and fixed inside
Is not a plane parallel to the XY plane. Therefore, it is necessary to adjust the optical axis tilt angle described later. However,
The center PC of the imaging surface 1S1 is on the intersection (X = 0, Y = 0) between the X direction and the Y direction.

Here, the intermediate member 2 is formed of a member that is not a thermoelectric cooling element, and is made of a material having good heat conductivity such as ceramic, aluminum, a silicon sheet, silicon grease, or plastic (compared with a general substance). In other words, it is formed of a material that can conduct while uniformly dispersing the heat generated by the solid-state imaging device 1 without causing the cooling unevenness already pointed out as (Problem 3). I have.

The cover member 3 is formed of a springy material such as stainless steel for spring or phosphor bronze.

The detailed structure of the intermediate member 2 and the cover member 3 and the pressing and fixing of the solid-state imaging device 1 will be described below in detail.

The portion of the intermediate member 2 on the first surface 2S1 side is
(1) The first direction X and the second direction Y about the center portion
(Groove) 2B which spreads out in the step (2) and the step 2
B and a peripheral portion entirely surrounding the periphery of B. Among these, the dimensions of the bottom surface 2BS of the step portion 2B and the cross-sectional shape parallel to the XY plane of the step portion 2B in the first direction X and the second direction Y are both the first direction X and the second direction of the solid-state imaging device 1. As described above, the bottom surface 2BS before the optical axis tilt angle adjustment is larger than the dimension of Y and is a surface parallel to the XY plane.

On the other hand, the structure of the peripheral portion of the first surface 2S1 is as follows. That is, the same peripheral portion before the optical axis tilt angle adjustment is also a surface parallel to the XY plane. And the first surface 2S
In a part of the outer peripheral part in the peripheral part of the first part and a part of the peripheral part 2S2E of the second surface 2S2 facing the part,
Four first outer protrusions to fourth outer protrusions 2E1, 2E2 locally extending along the second direction Y from both portions;
2E3 and 2E4 are provided. Moreover, each projection 2
E1, 2E2, 2E3, and 2E4 are (A) drilled from the center of each protruding portion, and have corresponding inner diameters (the head has a cutout in which a driver can be fitted, and the head has a cutout). Male screw is formed only at the tip of the shaft part extending from the part, and the other part of the shaft part is merely a pin part)
A first hole 6a, 6b, 6c, and 6d has a first hole having substantially the same diameter as the pin portion, and (b) a second hole having the same diameter as the first hole of (a). Peripheral part 2 of surface 2S2
Each protrusion 2E1, 2E2, 2E3, 2E4 corresponding to S2E
, 2E3P,..., 2E3P,.

Further, in a part of the peripheral edge of the first surface 2S1 near the step 2B, four first inward projections projecting above the bottom surface 2BS near the side surface of the step 2B. To fourth inner protruding portions 2D1, 2D2, 2D3, 2
D4 is provided. These inner protrusions 2D1, 2D
Among the D2, 2D3, and 2D4, the first inner protruding portion 2D1 and the second inner protruding portion 2D2 are solid-state imaging devices between a third sub-claw portion 3D3 and a fourth sub-claw portion 3D4, which will be described later. 1 to each other, the solid-state image pickup device 1 fitted in the step 2B
Are defined in the first direction X. On the other hand, the third
The inner protruding portion 2D3 and the fourth inner protruding portion 2D4 are respectively opposed to a second sub-claw portion 3D2 and a first sub-claw portion 3 described later.
By exerting a pressing force on the solid-state imaging device 1 and the D1 via the solid-state imaging device 1, the position in the second direction Y of the solid-state imaging device 1 fitted in the step 2B is defined.

On the other hand, the cover member 3 is a plate-like member having an opening having a size larger than that of the solid-state image pickup device 1 and the stepped portion 2B at the center thereof. In a part of the portion, seven first to seventh claw portions 3 projecting to the upper side of the bottom surface 2BS near the side surface of the stepped portion 2B while being bent obliquely upward from the part.
P1, 3P2, 3P3, 3P4, 3P5, 3P6, 3P
7 are formed.

Further, at the other portion of the peripheral portion of the opening,
The four first sub-claws as described above, which extend obliquely downward from the other portion or toward the bottom surface 2BS while projecting (dropping) up to the vicinity of the bottom surface 2BS near the side surface of the stepped portion 2B. Part to the fourth sub-claw part 3D1,
3D2, 3D3, and 3D4 are formed.

In addition, a part of the upper side portion and the lower side portion of the outer peripheral portion of the cover member 3 is provided with a corresponding projection 2E.
First to fourth protrusions 3E1, 3E having substantially the same size and shape as those of 1, 2E2, 2E3 and 2E4.
E2, 3E3, and 3E4 are formed. In addition, the center of each of the projections 3E1, 3E2, 3E3, and 3E4 has a central axis corresponding to each of the projections 2E1, 2E2, and 2E3.
A hole (not shown) that matches the central axis of the first hole and the second hole of (A) and (B) of 2E4, and has the same diameter as the diameter of the first hole and the second hole. Is formed. Then, the pins of the corresponding male screw among the first male screw to the fourth male screw 6a, 6b, 6c, 6d are inserted into each of these holes without play in the Z direction, and further, each male screw 6a , 6b, 6c, and 6d are inserted into the first and second holes (a) and (b) of the corresponding protrusions 2E1, 2E2, 2E3, and 2E4 without play in the Z direction. By doing so (each male screw 6a, 6b, 6c, 6
The pin portion d is rotatable around the axis of the male screw), and the cover member 3 is fixed to the first surface 2S1 of the intermediate member 2.

The method of positioning and fixing the solid-state image pickup device 1 in the step portion 2B is performed by the following method, as understood from the description of the configuration described above. That is, the solid-state imaging device 1 is disposed in the step portion 2B, and the cover member 3 is disposed as described above.
Is attached to the intermediate member 2. At this time, the first inner protrusion 2
D1 and the third sub-claw portion 3D3, and the second inner protruding portion 2D2 and the fourth sub-claw portion 3D4 press both side surfaces of the solid-state imaging device 1 parallel to the second direction Y, and the first solid-state imaging device 1 Direction X
Determine the position in. At the same time, the third inner protrusion 2
D3 and the second sub-claw portion 3D2, and the fourth inner protruding portion 2D4 and the first sub-claw portion 3D1 press both side surfaces of the solid-state imaging device 1 parallel to the first direction X, and the second Direction Y
Determine the position in. Furthermore, each claw part 3P1, 3P
The tip of 2, 3P3, 3P4, 3P5, 3P6, 3P7 is located at the peripheral portion of the first main surface of the solid-state imaging device 1 (that is, the second edge).
Each claw portion 3 is brought into contact with the main surface 1S2 side and lower than the imaging surface 1S1 to form a step, and presses the peripheral portion from the positive Z direction by its spring force.
P1, 3P2, 3P3, 3P4, 3P5, 3P6, 3P
7 determines the position of the solid-state imaging device 1 in the third direction Z. In this state, although the center PC of the imaging surface 1S1 is located on a point (0, 0, Z) in the XY plane,
S1 itself is not a plane substantially parallel to the XY plane.

The structure of the portion of the intermediate member 2 on the second surface 2S2 side facing the first surface 2S1 is as follows. That is,
(1) A portion extending from the center of the second surface 2S2 in the first direction X and the second direction Y is a convex surface extending along the negative third direction Z (the surface is substantially parallel to the XY plane). And a part of each of the left region and the right region (see FIG. 1) when the convex surface is viewed from the positive third direction Z in the convex surface. ) Are the cooling-side surfaces (4) of the first Peltier element 4a and the second Peltier element 4b, respectively.
aS1). Also, (2) a peripheral portion 2S that entirely surrounds the convex surface in the second surface 2S2.
2E (the surface is machined so as to be substantially parallel to the XY plane) corresponds to the bottom surface of the step portion for forming the convex portion, and a part thereof is the first surface described above. Outer protrusion to fourth outer protrusion 2E1, 2E2, 2E3, 2E4
Of the back.

Reference numeral 1T denotes an output terminal of the solid-state imaging device 1. The intermediate member 2 has a portion between the bottom surface 2BS of the first surface 2S1 of the intermediate member 2 and the peripheral portion 2S2E of the second surface 2S2. A hole (not shown) for passing the output terminal 1T is formed.

Here, the Peltier elements (the first Peltier element 4a and the second Peltier element 4b) are thermoelectric cooling elements utilizing the Peltier effect, and the Peltier effect means
When a current flows through the thermoelectric cooling element through the contact surface of different kinds of metals, a heat flow flows along with the current, and the heat flow between the two metals is not equal. Absorption occurs and the other contact surface (positive side)
The effect is that heat is generated. In the present embodiment, an arrangement is adopted in which a current flows from the optical axis tilt adjustment plate 5 described later to the intermediate member 2 via the Peltier element.

The optical axis tilt adjustment plate 5, which is one of the core parts of the solid-state imaging device 100, is provided with an optical path through which an object image is formed on the solid-state imaging device 1 with respect to the optical axis direction of the imaging surface 1 S 1. This is a plate provided to adjust the inclination within a desired accuracy. In other words, the optical axis tilt adjustment plate 5 is a plate having a function of making the imaging surface 1S1 of the solid-state imaging device 1 a surface parallel to the XY plane within desired accuracy. The optical axis tilt adjusting plate 5 is made of a material having good thermal conductivity such as ceramics or aluminum, like the intermediate member 2.

The optical axis tilt adjusting plate 5 has the following construction. That is, the plate 5 is (1) a peripheral portion which is opposed to the second surface 2S2 of the intermediate member 2 and is connected to the peripheral portion of the intermediate member 2 while keeping a predetermined distance D between the plate and the intermediate member 2. And a first surface 5S1 that is in contact with the heat radiation side surface of each of the first Peltier element 4a and the second Peltier element 4b.
And (2) a second surface 5S that faces the first surface 5S1 and has a first curvature surface 5a that forms a convex hemisphere at the center thereof.
And 2. More specifically, it is as follows.

That is, a part of each of two parts parallel to the first direction X in the outer peripheral edge of the optical axis tilt adjusting plate 5 is opposed to the back surface of each of the protrusions 2E1, 2E2, 2E3, 2E4. The first to fourth protrusions 5E1, 5E2, and 5E having substantially the same shape as the protrusions 2E1, 2E2, 2E3, and 2E4.
Each of 3, 5E4 is formed to extend in the second direction Y. And each protrusion 5E1, 5E2, 5E3,
On the surface corresponding to the first surface 5S1 side of 5E4, Z-direction side convex portions 2E1P,..., 2E3P,.
5E1P,..., 5E3P,. Moreover, each projection 5E1P,..., 5E3
Each of the P,... Has a non-through hole having an internally threaded inner wall formed from the surface to the inside, and the central axis of each non-through hole corresponds to the corresponding Z-direction side convex portion 2E1.
P,..., 2E3P,.
5E3P,..., 5E3P,.

In the outer peripheral edge portion of the optical axis tilt adjusting plate 5, a central portion of an upper portion parallel to the first direction X is provided in the second direction Y.
First optical axis inclination adjusting protrusion 5a extending in parallel along
1 is formed. Moreover, a hole 5aH having an inner diameter larger than the outer diameter of the first shaft 8a (see FIGS. 3 and 4) is formed in the center of the same portion 5a1. Then, the center axis of the hole 5aH is parallel to the third direction Z and is included in the plane of X = 0, in other words, Y = 0.
Formation position of the first optical axis inclination adjusting protrusion 5a1 such that the center axis of the hole 5aH is arranged at a position where the first shaft 8a can be inserted with play into the hole 5aH when viewed from the side of FIG. Is set.

In the outer peripheral portion of the optical axis tilt adjusting plate 5, a substantially central portion of a left side portion (as viewed from the solid-state imaging device 1) parallel to the second direction Y is provided along the first direction X. And a second optical axis tilt adjusting protrusion 5b extending in parallel with the first optical axis.
In addition, the second shaft 8a
A hole (not shown) having an inner diameter larger than the outer diameter of (see FIG. 3) is formed. Then, the center axis of the hole is parallel to the third direction Z and is included in the plane of Y = 0, in other words, the second shaft 8 as viewed from the plane of X = 0.
The formation position of the second optical axis tilt adjusting protrusion 5b is set such that the center axis of the hole is arranged at a position where the hole a can be inserted with play into the hole.

As described above, the operation point of the first optical axis inclination adjustment of the optical axis inclination adjustment plate 5, that is, the holding / optical axis inclination adjustment unit, and the second
The action point of the optical axis tilt adjustment is the center P of the imaging surface 1S1.
It is set at a position extended from C along the Y axis and a position extended along the X axis.

The first surface 5S1 of the optical axis tilt adjusting plate 5 is also machined so as to be substantially parallel to the XY plane.

On the other hand, the second surface 5S2 of the optical axis tilt adjustment plate 5
A convex hemispherical portion is provided on the upper side, and a first curvature surface 5a which is a surface of the convex hemispherical portion (the surface also forms a part of the second surface 5S2) has a first radius of curvature. . Moreover, as described later, the center of the first curvature of the first curvature surface 5a is always the center PC (0, 0, 0) of the image area of the imaging surface 1S1.
The value of the distance D is adjusted during connection and assembly of the optical axis tilt adjustment plate 5 and the intermediate member 2 so as to match Z).

Instead of adjusting the value of the distance D after fixing the values of the first radius of curvature of the first curvature surface 5a and the second radius of curvature of the second curvature surface 12a, which will be described later, Is set to a fixed value, and by adjusting the values of the first radius of curvature and the second radius of curvature, the first center of curvature of the first curvature surface 5a and the second center of curvature of the second curvature surface 12a are adjusted. Together with the imaging surface 1S
The center PC (0, 0, Z) of one image area may always be matched.

Next, a method of assembling the holding / optical axis tilt adjusting section, that is, a method of attaching or integrating the intermediate member 2, the first and second Peltier elements 4a and 4b, and the optical axis tilt adjusting plate 5 will be described. The method will be described with reference to FIGS.

Here, the solid-state imaging device 1 receives the spring force of the cover member 3 to press the solid-state imaging device 1 in the negative Z direction on a predetermined positioning portion in the step portion 2B of the intermediate member 2 by the fixing method as described above. It is already installed in a state where it can be installed. In this state, after the screw fastening described below, both the radiating surfaces (4aS2) of the two Peltier elements 4a, 4b are in contact with the first surface 5S1 of the optical axis tilt adjustment plate 5, and the two Peltier elements 4a, The second surface 2 of the intermediate member 2 is formed such that both surfaces (4aS1) on the cooling side of 4b come into contact with the convex surface (substantially the center portion) of the second surface 2S2 of the intermediate member 2.
The two Peltier devices 4a and 4b are arranged between the convex surface of S2 and the optical axis tilt adjustment plate 5. Then, each Z of the intermediate member 2
2E3P,..., 2E3P,... Protruding from the surface of each of the male screws 6a, 6b, 6c, 6d. , 5E3P,... Are aligned with the female screw holes of the convex portions 5E1P,..., 5E3P,.
1 until the space D between the outer peripheral portion (flat portion) and the outer peripheral portion (plane portion) becomes a predetermined appropriate value.
c, 6d correspond to the respective protruding portions 5E.
, 5E3P,... Are screwed together, and the two parts 2, 5 are fastened and fixed to each other. At this time, as described above, the adjustment of the interval D is performed by the first curvature surface 5a of the first curvature surface 5a.
The center of curvature is the center PC (0, 0) of the image area of the imaging surface 1S1.
(0, Z). By this screw fastening, the two Peltier elements 4a and 4b are sandwiched by the intermediate member 2 and the optical axis tilt adjusting plate 5.

Next, a specific configuration of the image forming position adjusting sections (11, 12) will be described with reference to FIGS. 1, 2, and 3. FIG. Here, the image forming position adjusting units (11, 12)
This portion adjusts the imaging position (Z = 0) in the Z direction in order to form a subject image on the imaging surface 1S1 of the solid-state imaging device 1. In other words, the part (11, 12) is a holding / optical axis tilt adjusting part to adjust the center PC (0, 0, Z) of the image area of the imaging surface 1S1 to the position (0, 0, 0). Is moved in the Z direction. The main part of the imaging position adjustment function is the imaging position adjustment screw portion 12 which is the other core part of the solid-state imaging device 100.
Hereinafter, the configurations of the heat transfer plate 11 and the imaging position adjusting screw portion 12 will be described in detail. The heat transfer plate 11 and the imaging position adjusting screw portion 12 are both formed of a material having good heat conductivity such as ceramic or aluminum, like the intermediate member 2.

First, the heat transfer plate 11 is a plate material whose four corners are cut in parallel with the XY plane, and the central portion of the heat transfer plate 11 is provided with an optical axis of the heat transfer plate 11 so as to penetrate the same portion. A main opening 11MH extending in the X and Y directions from the center of the first surface 11M to be opposed to the inclination adjusting plate 5 is formed. The diameter of the main opening 11MH is substantially the same as the diameter of the side surface 12SS (an external thread is formed on the side surface 12SS) of the cylindrical imaging position adjusting screw portion 12, and the main opening 11MH is also provided. A female screw that can be screwed with the male screw on the side surface 12SS is cut on the wall surface of the.

In the peripheral portion 11MU of the heat transfer plate 11 surrounding the main opening 11MH, one hole 11H1 and two cut portions 11H2, 11H3 are formed. Among these, the hole 11H1 is used to connect the solid-state imaging device 100 to the imaging device 20.
0 in the front case 7
The heat transfer plate 11 is formed at a predetermined position in the peripheral portion 11MU so that the center axis of 1H1 coincides with the center axis of the hole 5aH of the optical axis tilt adjustment plate 5 and the center axis of the first shaft 8a. . That is, the center axis of the hole 11H1 is parallel to the Z direction and is located in the plane of X = 0, and the height of the center axis of the hole 11H1 from the plane of Y = 0 is the center axis of the first shaft 8a. Of Y
= 0 equal to the height from the plane. In addition, the diameter of the hole 11H1 is larger than any of the diameter of the first shaft 8a, the diameter of the hole 5aH, and the outer diameter of the first optical axis inclination adjusting female screw portion 10a described later.

When the solid-state imaging device 100 is mounted in the front case 7, the notch 11H2 has an axis parallel to the Z direction at the center of curvature of the curvature wall surface of the notch 11H2 (hereinafter referred to as a central axis). Of the heat transfer plate 11 so that the center axis of the hole of the second optical axis tilt adjusting projection 5b of the optical axis tilt adjusting plate 5 coincides with the central axis of the second shaft 8b. Is formed at a predetermined position. That is, the central axis of the notch 11H2 is parallel to the Z direction and located in the plane of Y = 0,
The height of the central axis of 1H2 from the plane of X = 0 is equal to the height of the central axis of the second shaft 8b from the plane of X = 0. Moreover, the radius of curvature of the curvature wall surface of the notch 11H2 is the second radius.
It is larger than the diameter of the shaft 8b, the diameter of the hole of the second optical axis tilt adjusting projection 5b, and the outer diameter of the second optical axis tilt adjusting female screw 10b described later.

Further, on the right side of the first side surface portion 11S1 of the heat transfer plate 11 as viewed from the solid-state imaging device 1, a heat radiating flange portion 11b is provided. This heat dissipation flange 1
1b, a second extending portion 11b2 extending a predetermined second distance in the negative Z direction from a connection portion of the first side surface portion 11S1 with the right side portion, and a heat dissipation flange portion 11b having an L-shape. Extended portion 11b extended by a predetermined first distance from the end of second extended portion 11b2 in the positive Y direction as described above
And 1.

Further, in the first side surface portion 11S1, a heat dissipating flange portion 11c is provided near an end on the left side when viewed from the solid-state imaging device 1 side. The heat radiating flange portion 11c also extends from the connection portion of the first side surface portion 11S1 with the left side portion by a predetermined second distance in the negative Z direction.
The extending portion 11c2 and the first extending portion 11c1 extending from the end of the second extending portion 11c2 in the positive Y direction by a predetermined first distance so that the heat dissipation flange portion 11c has an L-shape.
And

In the second side surface portion 11S2 of the heat transfer plate 11, except for both peripheral portions, a heat radiation flange portion 11S2 is provided.
a is provided. The heat dissipating flange 11a also has a second extending portion 11a2 extending a predetermined second distance in the negative Z direction from the connection portion of the second side surface portion 11S2 with the central portion, and the heat dissipating flange 11a has a length L. The first extending portion 11a1 extends from the end of the second extending portion 11a2 toward the positive X direction by a predetermined first distance so as to have a character shape. The first extending portion 11a1 has an opening inclined surface 7RG in the inner surface of the rear portion 7R of the front case 7.
The first step is provided on the bottom surface 7RS of the step or groove 7RD connected to
Four holes 11aH1, 11aH2, 11aH3, 11 for passing the male screw used when fixing the extension 11a1
aH4 is formed. Moreover, the first extending portion 11a1
When fixing to the bottom surface 7RS, the holes 11aH1, 11a
The central axis of H2, 11aH3, 11aH4 is the bottom surface 7RS
Corresponding female screw holes 7RH1, 7RH2,
Each hole 11 is aligned with the center axis of 7RH3 and 7RH4.
The formation positions of aH1, 11aH2, 11aH3, and 11aH4 are set.

In the third side surface portion 11S3, a heat dissipating flange portion 11g is provided at a portion near the cutout portion 11H3 on the right side as viewed from the solid-state imaging device 1 side. The heat dissipating flange 11g has a second extending portion 11 extending a predetermined second distance in the negative Z direction from a connection portion of the third side surface portion 11S3 with the right cut portion 11H3.
g2, and a first extending portion 11g1 which extends from the end of the second extending portion 11g2 in the negative Y direction by a predetermined first distance so that the heat radiating flange 11g has an L-shape.

Similarly, a heat-dissipating flange 11f is provided in a portion of the third side surface portion 11S3 near the cutout portion 11H3 on the left side when viewed from the solid-state imaging device 1 side.
The heat dissipating flange portion 11f includes a second extending portion 11f2 extending a predetermined second distance in the negative Z direction from a connection portion between the third side surface portion 11S3 and the portion near the left cutout 11H3, and a heat dissipating flange portion. The first extending portion 11f1 extends from the end of the second extending portion 11f2 in the negative Y direction by a predetermined first distance so that 11f has an L-shape.

Further, in the fourth side surface portion 11S4, the cut portion 11
In a substantially intermediate portion between H2 and the end of the fourth side surface portion 11S4,
A heat dissipating flange 11d is provided. The heat dissipating flange 11d also includes a second extending portion 11d2 extending a predetermined second distance in the negative Z direction from a connection portion of the fourth side surface portion 11S4 with the substantially central portion, and a heat dissipating flange 1d.
The first extending portion 11d1 extends from the end of the second extending portion 11d2 in the negative X direction by a predetermined first distance so that 1d has an L-shape. Then, the first extending portion 11
One hole 11dH for passing a male screw used for fixing the first extension 11d1 to the bottom surface 7RS of the front case 7 is formed in d1. Moreover, the first stretching section 1
When fixing 1d1 to bottom surface 7RS, the formation position of hole 11dH is such that the central axis of hole 11dH coincides with the central axis of one corresponding female screw hole (not shown) formed in bottom surface 7RS. Is set.

Similarly, the lower side portion of the fourth side surface portion 11S4 when viewed from the solid-state imaging device 1 side and the cutout portion 1S4
At a substantially intermediate portion between 1H2 and the other end of the fourth side surface portion 11S4, a heat radiating flange portion 11e is provided. The heat dissipating flange 11e also includes a second extending portion 11e2 extending a predetermined second distance in the negative Z direction from a connection portion of the fourth side surface 11S4 with the substantially central portion, and a heat dissipating flange 11e. The second extending portion 11e has an L-shape.
And a first extending portion 11e1 extending from the end of the second portion by a predetermined first distance in the negative X direction. The first extension 11e1 has one hole 11e for passing a male screw used for fixing the first extension 11e1 to the bottom surface 7RS.
H is formed. In addition, when the first extending portion 11e1 is fixed to the bottom surface 7RS, the center axis of the hole 11eH coincides with the center axis of one corresponding female screw hole (not shown) formed in the bottom surface 7RS. , Holes 11eH are set.

On the other hand, the side surface 1 of the imaging position adjusting screw portion 12
2SS is screwed into the main opening 11MH of the heat transfer plate 11 and has a circular second surface (X
As shown in FIG. 3, two grooves 12H1 and 12H2 are formed on the peripheral edge of the bottom surface 12S2 parallel to the Y plane. Therefore, by inserting the tip of a driver into these grooves 12H1 and 12H2 and rotating the imaging position adjusting screw 12 around the Z direction, the imaging position adjusting screw 12 is moved along the Z direction. It can translate. The groove 12H
1, 12H2, the fingertip of the hand is placed on the second surface 12S2.
To rotate the imaging position adjusting screw 12.

On the other hand, the imaging position adjusting screw 12
A concave hemispherical portion is formed at the center of the first surface 12S1 of the first surface 12S1.
The concave hemispherical portion is formed such that the second radius of curvature of 2a is equal to the first radius of curvature of the first curvature surface 5a described above.

Next, an intermediate member 2 to which the solid-state image pickup device 1 is attached, a holding / optical axis tilt adjusting section formed by connecting an optical axis tilt adjusting plate 5 and an image forming position adjusting screw section 12 are transmitted. The solid-state imaging device 100 is assembled by attaching an imaging position adjustment unit, which is screwed to the main opening 11MH of the hot plate 11, to the inner wall of the front case 7 of the imaging device 200. The procedure for disposing the casing 7 in the case 7 will be described with reference to FIGS. 2, 3, 4, and 5. FIG.

First, a front case 7 having the structure shown in FIGS. 3, 4 and 5 is prepared. Here, the front case 7 includes a front part 7F and side parts 7S1, 7S2, 7S.
3, 7S4 and a back surface 7R. Among these, a window 7FH that defines a frame of the image area 1SR of the imaging surface 1S1 of the solid-state imaging device 1 is formed on the front side of the front surface 7F of the front case 7. On the other hand, on the back surface side of the front surface portion 7F, there is a terminal end portion 8aEE fixed to the upper portion of the back surface as viewed from the window portion 7FH side, and extends substantially in the -Z direction. 1 shaft 8a and window 7F
A substantially cylindrical second shaft 8b having a terminal end (not shown) fixed to the left side of the back surface as viewed from the H side and extending or protruding parallel to the -Z direction is formed. I have. In addition, the lengths of the shafts 8a and 8b in the longitudinal direction (-Z direction) are both equal and set to a constant value. In addition, both the distal end 8aE of the first shaft 8a and the vicinity thereof (both are generally referred to as distal ends) and the distal end of the second shaft 8b and the vicinity thereof (both are generally referred to as distal ends) are both externally threaded. Have been. In FIG. 2, the first threaded male thread is shown.
The tip of the shaft 8a is drawn with a thick line.

Next, the first compression coil spring 9a and the second compression coil spring 9b are fitted into the first shaft 8a and the second shaft 8b, respectively. In this state, the first compression coil spring 9a and the second compression coil spring 9a are respectively provided in the hole 5aH of the first optical axis inclination adjusting protrusion 5a1 and the hole of the second optical axis inclination adjusting protrusion 5b of the optical axis inclination adjusting plate 5. The first shaft 8a and the second shaft 8b are inserted with play through the coil spring 9b. At this time, a part of the distal end of the first shaft 8a and a part of the distal end of the second shaft 8b, which are externally threaded, have the same amount of the hole 5aH of the protrusion 5a1.
And both shafts 8 so that they can protrude from the holes of the protruding portions 5b.
The lengths of a and 8b in the longitudinal direction are set. FIG.
Symbols AX1 and AX2 in the first shaft 8a
And the insertion direction or center axis of the second shaft 8b.

Further, the first and second convex curvature surfaces 5a of the optical axis tilt adjusting plate 5 and the second concave curvature surface 12a of the image position adjusting screw portion 12 are in close contact with each other. While pressing the screw portion 12 against the optical axis tilt adjustment plate 5 (a predetermined gap is formed between the two portions 5 and 12), the distal end of the first shaft 8a and the distal end of the second shaft 8b are Each of the heat transfer plates 11 is inserted (slowly inserted) into the hole 11H1 and the cutout 11H2 of the heat transfer plate 11 with play.

Further, in this state, the first female screw portion 10a for adjusting the tilt of the optical axis, which has a hole 10aH formed with a female screw on the wall surface on the rear surface side, and the tip of the first shaft 8a are screwed together. The second female screw 10b for adjusting the tilt of the optical axis, which has a female threaded hole (not shown) on the back side, is also screwed into the tip of the second shaft 8b. Here, the both female screw portions 10a and 10b are cylindrical bodies having outer diameters smaller than the hole 11H1 and the cut portion 11H2, respectively.
Moreover, for example, a flat-blade screwdriver is inserted into the surface of each of the female screw portions 10a and 10b to
Grooves are formed to allow a and 10b to rotate around the Z direction (see FIG. 3).

Next, each heat radiation flange 11 of the heat transfer plate 11
a, 11d, and 11e are screwed and fixed to the bottom surface 7RS of the rear portion 7R of the front case 7 with the male screw 20 (FIG. 4). As a result, all the heat dissipating flange portions 11a, 11b, 11c, 11d, 11e, 11f, 1
1 g is in surface contact with the bottom surface 7RS of the front case 7, and the heat transfer plate 11 is immovable by the attachment to the front case 7. Also, both shafts 8a, 8b are also immobile. As a result, one end of the first compression coil spring 9a comes into contact with the back surface of the front portion 7F of the front case 7 in a state of being pressed, and the other end of the first compression coil spring 9a faces the first optical axis inclination adjusting protrusion 5a1. 5a1
In the −Z direction. Similarly, one end of the second compression coil spring 9b is connected to the front portion 7F of the front case 7.
The other end of the second compression coil spring 9b contacts the surface of the second optical axis tilt adjusting projection 5b to urge the same 5b in the -Z direction. I do. In response to these biases, the first curvature surface 5a of the optical axis tilt adjustment plate 5 has the same surface 12a as the second curvature surface 12a of the imaging position adjusting screw portion 12 through the surface contact portion. Energize to push in the -Z direction. However, in this state, since the imaging position adjusting screw portion 12 is immobile, the first curvature surface 5a and the second curvature surface 12a come into further close contact with each other. As a result, the center of curvature of the first curvature surface 5a and the center of curvature of the second curvature surface 12a are both the center PC of the image area 1SR of the imaging surface 1S1 of the solid-state imaging device 1.
(0, 0, Z (≠ 0)).

Further, as shown in FIG. 1, the center axis of the first shaft 8a protruding from the front case 7 is aligned with the center of the image area in the X direction of the imaging surface 1S1 of the solid-state imaging device 1 (X =
0), and the center axis position of the first shaft 8a in the Y direction is at a position other than the imaging surface center PC of the solid-state imaging device 1 (Y ≠ 0). On the other hand, the second shaft 8b is located at the center of the image area (Y
= 0), and the center axis position of the second shaft 8b in the X direction is at a position other than the imaging surface center PC of the solid-state imaging device 1 (X ≠ 0).

As described above, the convex hemispheric surface 5a provided on the optical axis tilt adjustment plate 5 and the concave hemisphere provided on the imaging position adjusting screw 12 screwed to the heat transfer plate 11 12a is a curvature surface having the same radius of curvature, and both surfaces 5a,
12a is in surface contact. The contact area at that time is equal to the area of the hemisphere 12a. In addition, as will be described later, both before and after the adjustment of the imaging position and the two optical axis tilt angles,
a and 12a are always in surface contact, and the contact area is always equal to the area of the concave hemisphere 12a. For this reason,
Path 1 for dissipating the heat of the solid-state imaging device 1 absorbed and emitted by the first Peltier device 4a and the second Peltier device 4b to the outside when the solid-state imaging device 100 is in operation →
2 → 4a, 4b → 5 → 12 → 11 → 7 means that the imaging position is 2
It is immovable before and after each adjustment with the two optical axis tilt angles.

After the solid-state imaging device 100 is mounted in the front case 7 as described above, the adjustment of the imaging position of the solid-state imaging device 1, the first optical axis tilt angle adjustment, and the second optical axis tilt angle adjustment are performed. In the following, with reference to FIG. 2, a method of adjusting the image forming position will be described first, and then a method of adjusting the tilt angles of both optical axes will be described. In the following description, for the sake of convenience, the adjustment of the second optical axis tilt angle is performed after the first optical axis tilt angle is adjusted. Alternatively, the second optical axis tilt angle may be adjusted after the second optical axis tilt angle is adjusted. The adjustment of the tilt angle of one optical axis may be performed. This is because, as will be described later, each optical axis tilt angle adjustment can be performed independently without shifting the adjusted imaging position as described later.

First, the adjustment of the imaging position of the solid-state imaging device 1 is performed as follows.
This is performed by a push-pull operation along the Z direction of the image-position adjusting screw portion 12 screwed to the heat transfer plate 11. More specifically, it is as follows. As described above, since the heat transfer plate 11 is screwed to the front case 7, it is in an immobile state. Therefore, when only the imaging position adjusting screw portion 12 is rotated with respect to the heat transfer plate 11 and the same portion 12 is moved in parallel along the + Z direction, the optical axis tilt adjusting plate 5 becomes The first curvature surface 5a is received by pressing from the screw portion 12.
Similarly, it moves in parallel along the + Z direction while maintaining surface contact with the second curvature surface 12a of the imaging position adjusting screw portion 12. At this time, the diameter of the hole 5aH and the diameter of the hole of the second optical axis tilt adjusting projection 5b are larger than the diameter of the first shaft 8a and the diameter of the second shaft 8b, respectively. First optical axis inclination adjusting protrusion 5a1 and second
The optical axis inclination adjusting protrusion 5b translates in the + Z direction while compressing the first compression coil spring 9a and the second compression coil spring 9b in the + Z direction. Accordingly, the imaging surface 1S1 of the solid-state imaging device 1 also moves in parallel along the + Z direction. At this time, the positions of the central axis of the hole 5aH and the central axis of the hole of the second optical axis tilt adjusting projection 5b in the X and Y directions are fixed. Conversely, when only the imaging position adjusting screw portion 12 is reversely rotated with respect to the heat transfer plate 11 and the same portion 12 is moved in parallel along the -Z direction,
In this case, the optical axis tilt adjustment plate 5 receives the pressing in the −Z direction from the first compression coil spring 9a and the second compression coil spring 9b, and makes a surface contact between the first curvature surface 5a and the second curvature surface 12a. While maintaining the state, it moves in parallel along the -Z direction in conjunction with the translational movement of the imaging position adjusting screw portion 12. Accordingly, the imaging surface 1S1 of the solid-state imaging device 1 also has -Z
Move in parallel along the direction.

As described above, the imaging surface 1S1 of the solid-state imaging device 1
Only by appropriately rotating the imaging position adjusting screw 12 clockwise or counterclockwise in accordance with the current position in the Z direction, the imaging position (Z = 0), and thus the image forming position can be optimally adjusted such that the coordinates of the center PC of the imaging surface 1S1 become (0, 0, 0,). It should be noted here that the surface contact state and the contact area between the first curvature surface 5a and the second curvature surface 12a remain unchanged before and after the adjustment of the imaging position.

Next, referring to FIGS. 2, 6 and 7,
A method for adjusting the first optical axis tilt angle α will be described. The first optical axis tilt adjusting projection 5a1 of the optical axis tilt adjusting plate 5 having the image pickup device 1 fixed to the intermediate member 2 is constantly pressed by the first compression coil spring 9a. Therefore, when only the first female screw portion 10a for adjusting the tilt angle of the optical axis is rotated to tighten the female screw portion 10a (at this time, the hole 10aH
Is + Z toward the tip 8aE of the first shaft 8a.
Direction), the first shaft 8a is fixed and immovable, so that the first female screw portion 10a for adjusting the tilt angle of the optical axis is + Z
The first optical axis tilt adjustment protrusion 5a1 is moved to the first direction.
It is pressed in the + Z direction from the female screw portion 10a for adjusting the tilt of the optical axis. At this time, the center axis of the first shaft 8a is located at the center of the image area of the solid-state imaging device 1 in the X direction (X = 0), and the position in the Y direction is the imaging surface center PC of the solid-state imaging device 1. 6, the diameter of the hole 5aH is larger than the diameter of the first shaft 8a. Therefore, as shown in FIG. Is rotated counterclockwise around the X-axis (α) around the center of curvature (coordinates: X = 0, Y = 0, Z = 0), and the first compression coil spring 9a contracts in accordance with this rotation. Moreover,
In this case, the imaging position adjusting screw portion 12 and the second curvature surface 12a are stationary, and as described above, the first curvature surface 5a
And the radius of curvature of the second curvature surface 12a are equal to each other, and the center of curvature of the first curvature surface 5a and the second curvature surface 1a are equal to each other.
Both the center of curvature of 2a and the center PC of the imaging surface (coordinate: X =
0, Y = 0, Z = 0), the optical axis inclination adjusting plate 5 is kept in a state where the first curvature surface 5a is always in surface contact with the second curvature surface 12a and in a state where the contact area is maintained. , Rotate around the X axis in a counterclockwise direction.

Conversely, the first optical axis inclination adjusting female screw portion 10a
When the female screw portion 10a is loosened by rotating only
The first optical axis inclination adjusting female screw portion 10a moves in the -Z direction, and the first optical axis inclination adjusting protrusion 5a1 moves in the -Z direction from the first compression coil spring 9a that is about to extend in the -Z direction. Receives pressure. At this time, the center axis of the first shaft 8a is the center of the image area of the solid-state imaging device 1 in the X direction (X = 0).
And the position in the Y direction is at a position (Y 中心 0) other than the imaging surface center PC of the solid-state imaging device 1, and the diameter of the hole 5aH is larger than the diameter of the first shaft 8a. Therefore, as shown in FIG. 7, the optical axis tilt adjustment plate 5 is
Center of curvature of the first curvature surface 5a (coordinates: X = 0, Y = 0, Z
= 0) around the X axis clockwise. Moreover, in this case as well, the image forming position adjusting screw 12 is used.
And the second curvature surface 12a is immobile, and the first curvature surface 5a
And the radius of curvature of the second curvature surface 12a are equal to each other, and the center of curvature of the first curvature surface 5a and the second curvature surface 1a are equal to each other.
Both the center of curvature of 2a and the center PC of the imaging surface (coordinate: X =
0, Y = 0, Z = 0), the first curvature surface 5a always keeps the surface contact state and the contact area with the second curvature surface 12a before the adjustment, and the optical axis inclination adjustment plate 5 rotates clockwise around the X axis.

As described above, the first optical axis tilt angle α can be adjusted within a predetermined accuracy while keeping the first curvature surface 5a in contact with the second curvature surface 12a while keeping the contact area unchanged. This means that the heat radiation path can be kept in the same state as before the adjustment after the first optical axis tilt angle adjustment. Moreover,
Since the imaging position adjusting screw portion 12 and the second curvature surface 12a are not moved, the adjustment of the first optical axis tilt angle does not affect the adjusted imaging position at all. In addition, during the first optical axis tilt adjustment, the optical axis tilt adjustment plate 5 is moved to the center PC.
Since it only rotates around the X axis with (0, 0, 0) as the center of rotation, the center position of the hole of the second optical axis tilt adjustment projection 5b located on the X axis is invariable. Adjustment of the first optical axis tilt angle does not affect the adjustment of the second optical axis tilt angle at all.

Next, a method of adjusting the second optical axis tilt angle β will be described. The principle of this adjustment method is basically the same as that of the above-described first optical axis tilt adjustment method. That is, the second optical axis tilt adjusting projection 5b of the optical axis tilt adjusting plate 5 is
Pressing is always given by the compression coil spring 9b. The second shaft 8b is fixed when the female screw 10b is tightened by rotating only the female screw 10b for adjusting the tilt angle of the second optical axis, or when the female screw 10b is loosened by rotating it in the reverse direction. Since it is immobile, the second optical axis tilt adjusting female screw portion 10b moves in the + Z direction (when tightening) or moves in the -Z direction (when loosening), and the second optical axis tilt adjusting protrusion 5b. Is pressed in the + Z direction from the second female screw portion 10b for adjusting the tilt of the optical axis (when tightened), or is pressed in the -Z direction from the second compression coil spring 9b (when loosened). At this time, the center axis of the second shaft 8b is located at the center of the image area in the Y direction of the solid-state imaging device 1 (Y = 0), and the position in the X direction is the imaging surface center PC of the solid-state imaging device 1. (X ≠
0) and the diameter of the hole of the second optical axis tilt adjusting projection 5b is larger than the diameter of the second shaft 8b.
The optical axis tilt adjustment plate 5 rotates around the Y axis about the center of curvature (coordinates: X = 0, Y = 0, Z = 0) of the first curvature surface 5a. Moreover, also in this case, similarly, the imaging position adjusting screw portion 12 and the second curvature surface 12a are stationary, and the radius of curvature of the first curvature surface 5a and the radius of curvature of the second curvature surface 12a are equal to each other. The center of curvature of the first curvature surface 5a and the second
Since both the curvature center of the curvature surface 12a and the imaging surface center PC (coordinates: X = 0, Y = 0, Z = 0) coincide with each other, the first curvature surface 5a always matches the second curvature surface 12a before adjustment. The optical axis tilt angle adjustment plate 5 rotates around the Y axis in a state where the surface contact state and the contact area are maintained. Therefore, the second optical axis tilt angle β can be adjusted within a predetermined accuracy while keeping the first curvature surface 5a in contact with the second curvature surface 12a while keeping the contact area unchanged. This means that the heat radiation path can be maintained in the same state as before the adjustment even after the second optical axis tilt angle adjustment.
Moreover, the imaging position adjusting screw portion 12 and the second curvature surface 12
Since a is also stationary in this case, the adjustment of the tilt angle of the second optical axis does not affect the adjusted imaging position at all. In addition, during the second optical axis tilt angle adjustment, the optical axis tilt angle adjustment plate 5 moves the center PC (0, 0, 0) as the center of rotation for Y.
Since it only rotates around the axis, the center of the hole 5aH of the first optical axis tilt adjusting projection 5a1 located on the Y axis is invariable, and even if the second optical axis tilt is adjusted, There is no effect on the adjustment of the tilt angle of one optical axis.

As described above, since the optical axis tilt adjustments can be performed independently of each other without shifting the adjusted image forming position, the image forming position adjustment and the two optical axis tilt adjustments can be performed as compared with the prior art. It is possible to converge in a remarkably short time.

Upon completion of the two optical axis tilt adjustments, the imaging surface 1S1 of the solid-state image sensor 1 has a predetermined accuracy determined by the predetermined accuracy at the time of the first optical axis tilt adjustment and the predetermined accuracy at the time of the second optical axis tilt adjustment. Is a plane parallel to the XY plane.

Finally, the front case 7 and the rear case 1
4 will be described with reference to FIGS. 3, 4, and 5. FIG. First, the inside of the front case 7 is filled with air having a dew point sufficiently lower than the cooling specification temperature of the solid-state imaging device 1 for the purpose of preventing dew condensation on the solid-state imaging device 1.
In this air atmosphere, an O-ring 13 is disposed between the inclined surface 7RG of the front case 7 and the wall surface 14FD of the step provided on the front surface 14F side of the rear case 14. Through the external threads 15a, 15
The front case 7 and the rear case 14 are fastened by b, 15c, and 15d. The symbol 14R in FIG. 3 is the rear surface of the rear case 14.

Next, a description will be given of heat radiation during the operation of the imaging device 200 or the solid-state imaging device 100 configured according to the above procedure. That is, the two Peltier elements 4a and 4b are arranged so that the surface in contact with the intermediate member 2 is the surface on the cooling side (FIGS. 1 and 4).
Heat is generated at the contact surface between the optical axis a and the optical axis tilt adjustment plate 5. Therefore, the heat generated from the two Peltier elements 4a and 4b is transmitted to the optical axis tilt adjusting plate 5, and further, through the second curvature surface 12a that is in surface contact with the first curvature surface 5a, the image position adjustment screw is formed. It is transmitted to the unit 12. Further, the heat is transmitted to the heat transfer plate 11 screwed with the imaging position adjusting screw portion 12,
The radiation flange portions 11a, 11b, 11c, 11d,
The heat is transmitted to the front case 7 and the rear case 14 from 11e, 11f, and 11g, and the two cases 7, 14 are naturally cooled by heat exchange with air.

As described above, the image forming position adjusting screw portion 12 and the optical axis tilt adjusting plate 5 are not only parts that perform the functions of adjusting the image forming position and the optical axis tilt of the solid-state imaging device 100, but also perform the functions of imaging. This is a portion that simultaneously plays a role as a heat dissipation path or a heat dissipation structure of the solid-state imaging device 1 during operation of the device 200.

Based on the above description, the device 10
The advantages of 0 and 200 are as follows.

(1) In the process of adjusting the imaging position Z, the position of the optical axis tilt adjustment plate 5 or the imaging surface 1S1 in the Z direction is simply a push-pull operation of the imaging position adjusting screw portion 12 (Z direction). (Translational movement along). For this reason, the first curvature surface 5a provided on the optical axis tilt adjustment plate 5
Can be adjusted while maintaining a constant contact with the second curvature surface 12a. Moreover, the contact area between the two curvature surfaces 5a and 12a does not change due to the adjustment of the imaging position. Therefore, there is a characteristic that a stable heat radiation effect can be always obtained during the actual operation of the present apparatuses 100 and 200.

(2) In the process of adjusting the optical axis inclination angles α and β,
The adjustment of the optical axis inclination angles α and β is performed independently of each other by the push-pull operation of the female screw portions 10a and 10b. During the adjustment of the optical axis tilt angles α and β, the first curvature surface 5a and the second curvature
The curvature surface 12a is always in contact with each other,
The first curvature surface 5a moves along the immovable second curvature surface 12a. In addition, both centers of the first curvature surface 5a and the second curvature surface 12a after the adjustment of the imaging position are in the X and Y directions with respect to the imaging surface center PC of the solid-state imaging device 1 (X = 0,
Y = 0), and the solid-state imaging device 1
(Z = 0), the imaging position is not shifted even during the adjustment process of each optical axis tilt angle. In this manner, each adjustment of the imaging position adjustment, the first optical axis tilt angle adjustment, and the second optical axis tilt angle adjustment can be performed independently of each other, and after each adjustment, the first curvature surface 5a and the second curvature surface 12 can be adjusted.
a is always in the same surface contact state as before the adjustment. Therefore, each adjustment can be quickly converged, and the first curvature surface 5a is always maintained regardless of the imaging position and the attitude of each optical axis tilt angle.
And the second curvature surface 12a are in contact with each other, and there is no change in the contact area. Therefore, when the devices 100 and 200 are actually operated, a stable heat radiation effect is always obtained.

(3) As described above, since the intermediate member 2 having good thermal conductivity is interposed between the solid-state imaging device 1 and the Peltier devices 4a and 4b, in other words, the Peltier devices 4
a, 4b indirectly via the intermediate member 2
Is cooled, the cooling temperature of the two Peltier devices 4a and 4b becomes constant in the intermediate member 2, and as a result, the solid-state imaging device 1
Is characterized in that temperature non-uniformity does not occur when cooling.

(4) In addition, since a part of the optical axis tilt adjusting plate 5 and the image forming position adjusting screw portion 12 are used as a portion functioning as a heat radiating plate, it is necessary to separately attach a heat radiating plate structure. There is a feature that the adjustment of the imaging position and the optical axis tilt angle and the effect of heat radiation can be obtained with a compact configuration without the property.

(Modification of First Embodiment) (1) In the first embodiment, the thermoelectric cooling element is composed of two Peltier elements 4
However, the present invention is not limited to the number of Peltier elements. For example, the thermoelectric cooling element 4 may be constituted by only one Peltier element, and an example of such a modification 1 is shown in FIG.

FIG. 8 is a drawing corresponding to FIG. 1, and the other configuration is the same as that described in the first embodiment except that thermoelectric cooling element 4 is formed by one Peltier element. is there. Also in this modification, the first embodiment described above is used.
All of the advantages (1) to (4) in the above are obtained.

Further, if necessary, the number of Peltier elements constituting the thermoelectric cooling element may be three or more. The point is that the number of Peltier elements is arbitrary.

(2) Although the thermoelectric cooling element is used in the first embodiment, for example, a CCD such as an artificial retinal chip is used.
When an object having a smaller number of pixels is used as a solid-state imaging device as compared with the above, it may not be necessary to cool the solid-state imaging device using a thermoelectric cooling device. In such a case,
Except that a thermoelectric cooling element is used, the characteristic configuration of the present invention can be applied. One such example is shown in the cross-sectional view of FIG.

FIG. 9 is a drawing corresponding to FIG. 2. In this modification, the heat radiation paths are 1 → 2 → 5 → 12 → 11 → 7.
Also in this modification, the advantages (1), (2), and (4) of the first embodiment described above are of course obtained.

(3) In the first embodiment, the optical axis tilt adjusting section is constituted by one adjusting mechanism for the first optical axis tilt α and one adjusting mechanism for the second optical axis tilt β. . However, the present invention is not limited to the number of optical axis tilt adjustment mechanisms. That is, if the convex hemisphere 5a provided on the optical axis tilt adjustment plate 5 is always in surface contact with the concave hemisphere 12a of the imaging position adjusting screw portion 12,
If necessary (on a case-by-case basis), the optical axis tilt adjusting section may be configured with only one adjusting mechanism, or the optical axis tilt adjusting section may be configured with three or more adjusting mechanisms. It is good. Even if such a modification is made, it goes without saying that the advantages (1) to (4) of the first embodiment described above can be obtained.

For example, when a plurality of optical axis tilt adjustment mechanisms are provided in each of the first direction and the second direction,
By changing the cut size of the female screw of the optical axis tilt adjusting female screw portion in each of the plurality of optical axis tilt adjusting mechanisms in the respective axial directions (accordingly, the size of the male screw at the tip of the corresponding shaft can also be reduced). Change), and coarse adjustment and fine adjustment of the optical axis tilt angle can be performed in each axis direction.

(4) In the first embodiment, the pressing force is applied to the optical axis tilt adjusting plate 5 using the urging force of the compression coil springs 9a and 9b.
Instead of 9b, a tension coil spring, a leaf spring, a torsion spring, or the like may be used. The point is that any spring having elasticity capable of giving a biasing force to the optical axis tilt adjusting plate 5 is sufficient, and is not limited to the type of spring.

(5) In the first embodiment, seven radiating flanges are used. However, the number of radiating flanges may be six or less, or eight or more. It is not limited to the number of flange portions.

(6) In the first embodiment, the shape of the first curvature surface 5a provided on the optical axis tilt adjustment plate 5 is a convex hemisphere, and the first curvature surface 5a is provided on the imaging position adjusting screw portion 12. The shape of the second curvature surface 12a was a concave hemisphere. However, the present invention is not limited to such a shape setting. Conversely, the shape of the first curvature surface 5a may be a concave hemisphere, and the shape of the second curvature surface 12a may be a convex hemisphere. Of course, in this modified example, the same effect as in the first embodiment can be obtained.

(7) First curvature surface 5a and second curvature surface 12
The shape of a need not necessarily be a hemisphere. That is, both the curvatures or radii of curvature of the first curvature surface 5a and the second curvature surface 12a are equal to each other, and the two curvature surfaces 5a,
As long as the center of curvature of 12a is located at the center of the imaging surface, and the two surfaces of curvature 5a and 12a can be in surface contact with each other before and after each adjustment while maintaining a constant contact area, the first surface of curvature 5a and Each shape of the second curvature surface 12a is arbitrary.

For example, under the condition that the above condition is satisfied, one or both of the first curvature surface 5a and the second curvature surface 12a make the hemisphere uniform or non-uniform by N (N is 2
It may be composed of at least one of a plurality of curved surfaces that can be divided by the above (integer). Also in this case, it is needless to say that the same effect as in the first embodiment can be obtained.

(Supplementary Note) Various modifications and improvements other than those described in the first embodiment and its modifications can be made without departing from the technical scope of the present invention.

[0122]

Since the present invention is configured as described above, it has the following effects.

According to the first, seventh, eighth, and ninth aspects of the present invention, when the image forming position adjusting unit translates along the third direction while pushing or pulling the holding / optical axis tilt adjusting unit. In conjunction with this translation, the holding / optical axis tilt adjusting unit also performs the third contact while maintaining the surface contact state and the contact area of both parts.
Since the translation is performed along the direction, the image formation position can be surely and quickly adjusted without affecting the optical axis tilt angle. In addition, since the surface contact state between the first curvature surface and the second curvature surface is maintained before and after the adjustment of the imaging position, the holding / optical axis tilt adjusting unit and the imaging position adjustment are maintained even after the adjustment of the imaging position. The effect is obtained that the unit can provide a heat radiation path for the heat generated by the solid-state imaging device.

According to the second, seventh, eighth, and ninth aspects of the invention, the adjustment of the optical axis tilt angle can be performed reliably and promptly independently of the imaging position adjustment without shifting the adjusted imaging position. (There is no need to readjust the imaging position after adjusting the optical axis tilt angle).
The optical axis tilt adjustment unit and the imaging position adjustment unit have the effect of providing a heat radiation path for the heat generated by the solid-state imaging device.

According to the third, seventh, eighth, and ninth aspects of the present invention, the adjusted imaging position is not shifted, and independently of the adjustment of the imaging position and the adjustment of the tilt angle of one optical axis. The adjustment of the optical axis tilt angle can be performed reliably and promptly. For this reason, there is no need to adjust the imaging position again after the adjustment of the tilt angles of the two optical axes, and all necessary adjustments can be quickly converged. In addition, the holding / optical axis tilt angle adjustment unit and the imaging position adjustment unit after the adjustment convergence can function as a heat radiating plate for the heat generated by the solid-state imaging device. The necessity of providing a heat sink can be eliminated. This can lead to a compact structure of the imaging device.

According to the fourth, seventh, eighth, and ninth aspects of the present invention, the holding / optical axis tilt adjusting section can be realized with a simple structure.

According to the fifth, seventh, eighth, and ninth aspects of the present invention, the thermoelectric cooling element cools the solid-state imaging device indirectly via the intermediate member. Even when the size of the imaging device is different or when a plurality of thermoelectric cooling devices are used, it is possible to make the heat conduction as uniform as possible and to suppress the occurrence of temperature unevenness as compared with the related art.

According to the sixth, seventh, eighth, and ninth aspects of the present invention, the imaging position adjusting section can be realized with a simple structure.

[Brief description of the drawings]

FIG. 1 is a front view showing a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing the solid-state imaging device according to Embodiment 1 of the present invention.

FIG. 3 is a perspective view showing an exploded configuration of the imaging apparatus according to Embodiment 1 of the present invention.

FIG. 4 is a longitudinal sectional view showing the imaging device according to the first embodiment of the present invention.

FIG. 5 is a front view showing the imaging device according to the first embodiment of the present invention.

FIG. 6 is a longitudinal sectional view showing a process of adjusting a first optical axis tilt angle in the solid-state imaging device according to Embodiment 1 of the present invention;

FIG. 7 is a longitudinal sectional view illustrating a process of adjusting a first optical axis tilt angle in the solid-state imaging device according to Embodiment 1 of the present invention;

FIG. 8 is a front view showing a solid-state imaging device according to a first modification of the present invention.

FIG. 9 is a longitudinal sectional view showing a solid-state imaging device according to Modification 2 of the present invention.

FIG. 10 is a perspective view showing a conventional solid-state imaging device mounting structure.

FIG. 11 is a cross-sectional view showing a mounting member of a conventional solid-state imaging device.

FIG. 12 is a side view showing a heat dissipation structure of a conventional solid-state imaging device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Solid-state image sensor, 1S1 imaging surface, 1S2 2nd main surface, PC imaging surface center, 2 intermediate members, 2B step part,
2BS bottom surface, 2S1 first surface, 2S2 second surface,
3 Cover member, 4a, 4b Peltier element, 5 optical axis tilt adjustment plate, 5a first curvature surface (convex hemispheric surface), 5S1
First surface, 5S2 Second surface, 6a, 6b, 6c, 6
d male screw, 7 front case, 8a, 8b shaft, 9a, 9b compression coil spring, 10a, 10b female screw for adjusting optical axis inclination angle, 11 heat transfer plate, 11a, 11
b, 11c, 11d, 11e, 11f, 11g Heat dissipating flange, 12 Image position adjusting screw, 12a Second
Curvature surface (concave hemisphere), 12S1 First surface, 12S
2 Second surface, 12SS side surface, 13 O-ring, 1
4 Rear case, 15a, 15b, 15c, 15d Male screw for housing fastening, 100 solid-state imaging device, 200 imaging device.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Junichiro Hayashi 2-5-1, Inaji, Amagasaki-shi, Hyogo Mitsubishi Electric Microcomputer Software Co., Ltd. (72) Inventor Yoshinori Tsunoda 2-chome, Marunouchi, Chiyoda-ku, Tokyo No. 3 Mitsubishi Electric Corporation F-term (reference) 2H054 AA01 2H100 BB01 5C022 AA13 AB44 AB45 AB46 AC42 AC54 AC78 5C024 CY49 EX22 EX26

Claims (9)

[Claims] 1. A solid-state imaging device having a first main surface including an imaging surface and a second main surface facing the first main surface, wherein a center of the imaging surface is orthogonal to a first direction and the first direction. So that the center of the imaging surface is located in a third direction as an optical axis direction orthogonal to the first direction and the second direction. Holding and holding the solid-state imaging device and having a first curvature surface located behind the second main surface when viewed from the solid-state imaging device.
An optical axis tilt adjustment unit, a second curvature surface in surface contact with the first curvature surface, the third curvature while maintaining a surface contact state and a contact area between the first curvature surface and the second curvature surface. An imaging position adjustment unit that is capable of translating along the direction. The holding / optical axis tilt adjustment unit applies a pressure in the third direction to the imaging position adjustment unit via the surface contact state. The imaging position adjustment unit is in an immobile state against the pressing from the holding / optical axis tilt adjustment unit unless the translational movement is performed by itself, and the first position of the first curvature surface is Radius of curvature and the second of the second curvature surface
The curvature radii are equal to each other, and the first curvature center of the first curvature surface and the second curvature center of the second curvature surface
A solid-state imaging device, wherein both the center of curvature corresponds to the center of the imaging surface. 2. The solid-state imaging device according to claim 1, wherein the holding / optical axis tilt adjustment unit uses the center of the imaging surface as a rotation center while maintaining the surface contact state and the contact area. The solid-state imaging device is rotatable around the first direction. 3. The solid-state imaging device according to claim 2, wherein the holding / optical axis tilt adjustment unit is configured to control the surface contact state and the contact independently of the rotational movement about the first direction. A solid-state imaging device, characterized in that the solid-state imaging device is further rotatable around the second direction with the center of the imaging surface as the rotation center while maintaining an area. 4. The solid-state imaging device according to claim 3, wherein the holding / optical axis tilt adjusting unit includes a first surface having a step as a positioning unit of the solid-state imaging device, and the first surface. And an intermediate member that is not a thermoelectric cooling element, and has a second surface located on a side facing the first curvature surface and the second curvature surface, and the intermediate member excluding the step portion. A peripheral portion coupled to a peripheral portion of the first surface; and a second main surface of the solid-state imaging device that projects toward the step portion side of the intermediate member and is pressed against a bottom surface of the step portion to form the solid-state imaging device. A cover member having a claw portion for fixing the intermediate member to the intermediate member, and a cover member facing the second surface of the intermediate member and connected to a peripheral portion of the intermediate member so as to keep a predetermined distance between the intermediate member and the intermediate member. A first surface having a defined peripheral portion and facing the first surface And a second surface partially having the first curvature surface, and independently rotatable around the first direction and the second direction while maintaining the surface contact state and the contact area. And a bottom surface of the step portion includes the first direction and the second direction and is orthogonal to the third direction in a state before the adjustment of the optical axis tilt angle. The predetermined interval that is parallel to a plane and that is formed between the vicinity of the periphery of the intermediate member and the vicinity of the periphery of the first surface of the optical axis tilt adjustment plate is equal to the first center of curvature. A solid-state imaging device, wherein both the second center of curvature corresponds to the center of the imaging surface and the first radius of curvature and the second radius of curvature are set to be equal to each other. 5. The solid-state imaging device according to claim 4, wherein the holding / optical axis tilt adjustment unit further includes a thermoelectric cooling element, and a peripheral portion of the second surface of the intermediate member is excluded. The portion is in contact with the surface on the cooling side of the thermoelectric cooling element, and the portion of the first surface of the optical axis tilt adjustment plate except the peripheral portion is in contact with the surface on the heat radiation side of the thermoelectric cooling element. A solid-state imaging device. 6. The solid-state imaging device according to claim 4, wherein the imaging position adjustment unit includes: a first surface having the second curvature surface; and a second surface facing the first surface. And a translation unit that is capable of translation along the third direction; a main unit having a hole screwed to a side surface of the translation unit; and at least two side portions of the main unit. A heat transfer plate having at least two extending portions extending along the third direction. 7. A solid-state imaging device comprising: a front case; and the solid-state imaging device according to claim 6, wherein ends of the at least two extending portions of the heat transfer plate of the solid-state imaging device are fixed to an inner wall of the front case. An imaging device characterized in that: 8. A holding / optical axis tilt adjusting unit for a solid-state imaging device, which is used in the solid-state imaging device according to claim 1. Description: 9. An imaging position adjustment unit for a solid-state imaging device, which is used in the solid-state imaging device according to claim 1. Description: