JP2002075489A - Anisotropic electroconductive sheet and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic electroconductive sheet and its manufacturing method wherein an electric conductor to constitute the anisotropic electroconductive sheet is orderly penetrated and exposed on both front and rear faces of an insulating material sheet, and because the electric conductor itself is given elasticity, by the fact that this electric conductor intervenes between a device and a wiring substrate, wherein an electrical connection between the both is elastically and surely made. SOLUTION: In the anistropic electroconductive sheet existing between mutually opposing electric members and electrically connecting the both electric members, it consists of an insulating material sheet 4' and the electric conductors 30 having a hollow stereoscopic structure made of a thin film and penetrating the insulating material sheet 4' to expose both top and bottom end parts, and the electric conductors 30 having the hollow stereoscopie structure are arranged and formed by being distributed in the insulating material sheet 4'.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive sheet and a method of manufacturing the same, and more particularly, to a method for manufacturing an anisotropic conductive sheet. Elasticity is imparted to the device, and the conductor is interposed between the device and the wiring board, whereby the two are elastically and surely electrically connected to each other. It relates to the manufacturing method.

[0002]

2. Description of the Related Art Devices such as a land grid array (LGA) obtained by further increasing the density of a ball grid array (BGA) and a chip-size package (CSP) in which terminals at minute intervals are formed on the back surface are electrically connected to a wiring board. For connection, the device and the wiring board are connected to each other by interposing a socket as a dedicated connection member only for the electromechanical connection. However, sockets are generally complicated in structure and difficult to miniaturize.

Then, instead of the socket, an anisotropic conductive sheet in which conductive fine particles or conductive fine short needles are dispersed in an insulating material sheet is manufactured, and this is interposed between the device and the wiring board, so that the device is different. By forming a conductive path between the device and the wiring board by strongly pressing against the anisotropic conductive sheet, a device having terminals formed on the back surface can be electrically connected to the wiring board. However, this anisotropic conductive sheet can connect terminals of a plurality of devices electrically connected to the wiring board at a narrow pitch of about 100 μm. Can not respond. Since the anisotropic conductive sheet forms a conductive path via conductive fine particles or conductive fine short needles dispersed in the insulating material sheet, the conductive path itself has a large hardness, Electric contact cannot be realized.

[0004] Previously, devices have been electromechanically connected to wiring boards by flow soldering. This is a connection method applied to a connection between a relatively large device and a wiring board. Further, there is known an anisotropic conductive sheet in which a conductor penetrates and is integrated with an insulating material sheet by applying a photolithography technique and an etching technique to the conductive sheet (see Japanese Patent Publication No. 7-36350).
This manufacturing process consists of a very large number of processes in total,
It is not always a simple and easy manufacturing process.

[0005]

In the above-mentioned conventional examples, however, the structure is generally complicated and it is difficult to reduce the size, or the distance between a plurality of devices electrically connected to the wiring board is reduced. Cannot be adapted to a narrow pitch of about 100 μm or less, or is not suitable for application to the connection between a small and small device and a wiring board, or the manufacturing process does not necessarily include an extremely large number of processes. It is hard to say that the manufacturing process is simple and easy.

According to the present invention, the conductor constituting the anisotropic conductive sheet is systematically penetrated and exposed on both the front and back surfaces of the insulating material sheet, and the conductor itself is given elasticity. It is an object of the present invention to provide an anisotropic conductive sheet which solves the above-mentioned problem in which an electric conductor is interposed and which reliably and elastically electrically connects the two, and a method for producing the same.

[0007]

The anisotropic conductive sheet interposed between the opposing electric members and electrically connecting the two electric members includes an insulating material sheet 4 'and an insulating material sheet 4'. ′, The conductor 30 having a three-dimensional structure having a thin film shape exposing the upper and lower ends thereof.
Constituted an anisotropic conductive sheet distributed and formed on the insulating material sheet 4 '.

Claim 2: The anisotropic conductive sheet according to claim 1, wherein the conductor 30 having a three-dimensional structure is a conical conductor that closes an upper end and opens a lower end. Was configured. Claim 3: In the anisotropic conductive sheet according to claim 1, the conductor 30 having a three-dimensional structure constitutes an anisotropic conductive sheet which is an arch-shaped conductor formed in an arch shape.

Claim 4: The anisotropic conductive sheet according to any one of claims 1 to 3, wherein the conductor 30 having a three-dimensional structure is formed by plating or vapor deposition. A conductive sheet was formed. Claim 5: A conductive block 7 ′ is formed independently on a conductive material sheet 7 made of a conductive material by photolithography and etching techniques, and an insulating material 4 is formed on the conductive material sheet 7 in an etched-off area. An anisotropic conductive sheet was formed by exposing the conductive block 7 'on the front and back surfaces of the filled and cured insulating material sheet 4'.

The thin film-shaped bowl-shaped portion 70 is formed independently on the surface of the conductive material sheet 7 made of a conductive material by photolithography and etching techniques. The anisotropic conductive sheet was formed by filling the insulating material 4 in the region to be etched away and exposing the bowl-shaped portion 70 as a bowl-shaped conductor 70 ′ on the front and back surfaces of the cured insulating material sheet 4 ′. Claim 7: A thin film-shaped bowl-shaped portion 70 is formed independently on the surface of the conductive material sheet 7 using a conductive material as a raw material by applying photolithography technology and etching technology, and the etched portion of the conductive material sheet 7 is removed. Is filled with an insulating material 4, and an anisotropic conductive sheet in which a bowl-shaped part 70 is exposed as a bowl-shaped conductor 70 'on the front and back surfaces of a cured insulating material sheet 4' is superposed and integrated with each other. Thus, an anisotropic conductive sheet was formed.

In another preferred embodiment, the semiconductor sheet 8 made of a semiconductor material is diced from the surface to form the conductor forming protrusions 82 independently having the remaining semiconductor sheet 8 '. 8 'and conductor forming protrusion 8
2, the insulating material layer 83 is applied and hardened, and the remaining semiconductor sheet 8 ′ is removed from the joint between the conductor forming protrusion 82 and the joint between the conductor forming protrusion 82 and the insulating material layer 83, An anisotropic conductive sheet was formed by exposing the conductor forming projections 82 as semiconductor terminals 82 ′ on the front and back surfaces of the cured insulating material sheet 83 ′.

In a ninth aspect, the semiconductor sheet 8 made of a semiconductor material is diced from the surface to form a semiconductor block 85 separately and independently.
Embedded in the insulating material layer 83 with its upper and lower ends exposed,
An anisotropic conductive sheet was formed by exposing the semiconductor block 85 on the front and back surfaces of the cured insulating material sheet 83 '. Claim 10: The anisotropic conductive sheet according to claim 9, wherein the circuit element 86 is formed on the surface of the semiconductor block 85.

In this case, a mold 1 having a large number of protrusions 11 formed on its surface is prepared, and a through hole 22 having a diameter larger than the diameter of the foot of the protrusion 11 of the mold 1 is formed in the sheet 21. A mask 2 made of a material is mounted on the surface of the mold 1, and the mold 1
The surface of the mold 1 is subjected to metal plating or vapor deposition, the mask 2 is removed from the surface of the mold 1, and a thin-film conductor 30 having a three-dimensional structure is formed on the entire surface of the protrusion 11 of the mold 1. Is applied, the conductor 30 is buried in the insulating material layer 4 to the top thereof, and the second mold 5 is pressed against the surface of the conductor 33 to wait for the insulating material layer 4 to harden. A method for producing an anisotropic conductive sheet to be released was constituted.

A twelfth aspect of the present invention is to prepare a conductive material sheet made of a conductive material as a raw material and affix it to a holding adhesive tape, and apply the photolithographic technique and the etching technique to the conductive material sheet to attach the conductive material sheet to the holding adhesive tape. The conductive block in the filled state is formed independently and independently, the insulating material region of the conductive material sheet is filled with an insulating material made of synthetic resin, and the surface of the filled insulating material layer is filled with a second material.
Pressing the mold to remove part of the insulating material layer surface,
A method for manufacturing an anisotropic conductive sheet exposing the upper end of the conductive block was constructed.

In a thirteenth aspect of the present invention, in the method for manufacturing an anisotropic conductive sheet according to the twelfth aspect, a conductive material sheet made of a conductive material is prepared, and a photolithography technique is applied to both front and back surfaces of the conductive material sheet. A large number of annular resists 71 and 71 ′ are applied to form a pattern, and the conductive material sheet 7 is subjected to an etching process. This etching process remains until the conductive material sheet 7 penetrates and separates from the front and back surfaces while leaving the bonding region 72. Then, the holding adhesive tape 73 is attached to the back surface of the conductive material sheet 7, the conductive material sheet 7 is further etched, and the conductive block 7 ′ is formed by forming the conductor separating groove 721 in the coupling region 72. The insulating material is filled in the region of the conductive material sheet 7 etched away, and the surface of the formed insulating material layer 76 is The pressure put, to constitute a method of manufacturing the anisotropic conductive sheet allowed to expose the conductive block 7 'peeled to the front and back surfaces of the insulating material sheet.

The thin film-shaped bowl-shaped portion 70 is formed independently on the surface of the conductive material sheet 7 using a conductive material by photolithography and etching techniques. A method for manufacturing an anisotropic conductive sheet in which the insulating material 4 was filled in the etching removal area and the bowl-shaped portion 70 was exposed as a bowl-shaped conductor 70 ′ on the front and back surfaces of the cured insulating material sheet 4 ′ was configured. Claim 15: In the method for manufacturing an anisotropic conductive sheet according to claim 14, a conductive material sheet 7 using a conductive material as a raw material is prepared, and the surface of the conductive material sheet 7 is circularly formed by applying a photolithography technique. A large number of regions C are exposed, and a resist 71 is patterned on the entire remaining surface, and the conductive material sheet 7 is subjected to an etching process to expose the exposed circular region C.
The holding adhesive tape 73 is stuck on the upper surface of the conductive material sheet 7 so that the holding adhesive tape 73 is on the lower side, and the bowl-shaped portion 7 of the conductive material sheet 7 is formed.
The resist 74 is patterned in a cross-shaped slit corresponding to the vertex of 0, the conductive material sheet 7 patterned in a cross shape is subjected to an etching process, a cross-shaped cut 701 is formed at the vertex of the bowl-shaped portion 70, and the conductor is separated. Groove 721
The bowl-shaped portion 70 is separated from each other by the conductor separating groove 721 in a state where the bowl-shaped portion 70 is stuck to the holding adhesive tape 73, and the second holding adhesive tape 75 is stuck on the upper side of the bowl-shaped portion 70. And peel off the holding adhesive tape 73,
With the holding adhesive tape 75 side facing down, an insulating material layer 76 is applied and formed on both front and back surfaces of the bowl-shaped part 70, and a third holding adhesive tape 75 ′ is stuck on the upper side of the bowl-shaped part 70, The holding adhesive tape 75 is peeled off, and the third holding adhesive tape 7 is removed.
With the 5 'side facing down, the third holding adhesive tape 75' is peeled off, and the conductive block 7 'is exposed on the front and back surfaces of the insulating material sheet 76' formed by curing the insulating material layer 76. The method for producing the conductive sheet was constituted.

The thin film-shaped bowl-shaped portion 70 is formed independently on the surface of the conductive material sheet 7 made of a conductive material by photolithography and etching techniques. An anisotropic conductive sheet in which the insulating material 4 is filled in the etching removal region and the bowl-shaped part 70 is exposed as a bowl-shaped conductor 70 ′ on the front and back surfaces of the cured insulating material sheet 4 ′ is placed facing each other. A method for producing an anisotropic conductive sheet that was integrated with the above was constituted.

In the method for producing an anisotropic conductive sheet according to claim 16, a conductive material sheet 7 made of a conductive material is prepared, and a photolithography technique is applied to the surface of the conductive material sheet 7. Then, a large number of circular regions C are exposed, the resist 71 is patterned on the entire remaining surface, and the conductive material sheet 7 is etched to form a thin-film bowl-shaped portion 70 corresponding to the exposed circular regions C.
The holding adhesive tape 73 is stuck on the upper surface of the conductive material sheet 7 so that the holding adhesive tape 73 side faces downward, and a resist 74 is patterned in a cross-shaped slit corresponding to the vertex of the bowl-shaped portion 70 of the conductive material sheet 7, The conductive material sheet 7 patterned in a cross shape is subjected to an etching process to form a bowl-shaped portion 7.
A cross-shaped cut 701 is formed at the vertex of 0, and a conductor separating groove 721 is formed. The conductor separating groove 721 is attached to the bowl-shaped portion 70 in a state of being attached to the holding adhesive tape 73.
To separate from each other, and a second
The holding adhesive tape 75 is adhered, and the holding adhesive tape 7
3 is peeled off, the second holding adhesive tape 75 side is turned down,
An insulating material layer 76 is applied and formed on both front and back surfaces of the bowl-shaped portion 70,
A third holding adhesive tape 75 ′ is attached to the upper side of the bowl-shaped part 70, the second holding adhesive tape 75 is peeled off, the third holding adhesive tape 75 ′ side is turned down, and a third holding adhesive tape is placed. The conductive blocks 7 ′ are formed on the front and back surfaces of the insulating material sheet 76 ′ formed by peeling the insulating material 75 ′ and curing the insulating material layer 76.
Was exposed to produce an anisotropic conductive sheet, and peripheral edges of the manufactured anisotropic conductive sheet were butted together to constitute a method for producing an anisotropic conductive sheet in which both were integrated.

In a preferred embodiment, the semiconductor sheet 8 made of a semiconductor material is subjected to dicing from the surface, and the conductor forming projections 82 are independently formed with the remaining semiconductor sheet 8 '. 'And the conductor forming protrusion 8
2, the insulating material layer 83 is applied and hardened, and the remaining semiconductor sheet 8 ′ is removed from the joint between the conductor forming protrusion 82 and the joint between the conductor forming protrusion 82 and the insulating material layer 83, A method of manufacturing an anisotropic conductive sheet was formed in which the conductor forming projections 82 were exposed as semiconductor terminals 82 'on the front and back surfaces of the cured insulating material sheet 83'.

In the method for manufacturing an anisotropic conductive sheet according to claim 18, a semiconductor sheet 8 made of a semiconductor material is prepared, and a holding adhesive tape 81 is attached to the lower surface of the semiconductor sheet 8. The semiconductor sheet 8 is diced from the surface to form a residual semiconductor sheet 8 '.
And the insulating material layer 83 is applied to the surface of the remaining semiconductor sheet 8 ′ and the surface of the semiconductor terminal formation protrusion 82, and the second surface is formed on the upper side of the semiconductor terminal formation protrusion 82. The holding adhesive tape 84 is adhered, the holding adhesive tape 81 is peeled off from the remaining semiconductor sheet 8 ′, and the second holding adhesive tape 84 is attached to the semiconductor terminal forming projection 8.
2, the holding adhesive tape 81 is attached to the end face of the semiconductor terminal forming projection 82, and the remaining semiconductor sheet 8 ′ is
A dicing process is performed to remove the semiconductor terminal formation protrusions 82 from the connection between the semiconductor terminal formation protrusions 82 and the connection portion between the semiconductor terminal formation protrusions 82 and the insulating material layer 83 so that the semiconductor terminal formation protrusions 82 are electrically and mechanically connected to each other. A method for producing an anisotropic conductive sheet to be separated was configured.

In a twentieth aspect, a dicing process is performed on the semiconductor sheet 8 made of a semiconductor material as a raw material to form semiconductor blocks 85 separately and independently.
5 was buried in the insulating material layer 83 with its upper and lower ends exposed, and a method of manufacturing an anisotropic conductive sheet was formed in which the semiconductor blocks 85 were exposed on the front and back surfaces of the cured insulating material sheet 83 ′. Claim 21: In the method for manufacturing an anisotropic conductive sheet according to claim 20, a semiconductor sheet 8 made of a semiconductor material is prepared, and a holding adhesive tape 81 is attached to the lower surface of the semiconductor sheet 8, 8 is diced from the surface to the surface of the holding adhesive tape 81 to form semiconductor blocks 85 separately and independently. The surface of the holding adhesive tape 81 on which the semiconductor blocks 85 are held separately and insulatively is provided. Applying the layer 83, the insulating material layer 83
A semiconductor block 85 is embedded in the semiconductor block 85.
A second holding pressure-sensitive adhesive tape 84 was stuck to the upper end of the sheet, and the method for manufacturing an anisotropic conductive sheet in which the holding pressure-sensitive adhesive tape 81 and the second holding pressure-sensitive adhesive tape 84 were separated was configured.

Claim 22: Claims 20 and 21
In the method for manufacturing an anisotropic conductive sheet according to any one of the above, when the semiconductor block 85 is formed separately and independently, a circuit element 86 is formed on the surface thereof by applying a semiconductor fine processing technique. A method for manufacturing an isotropic conductive sheet was configured.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the first embodiment shown in FIGS. FIG. 1 (a)
FIG. 1B is a partial cross-sectional perspective view of a mold, FIG. 1B is a view of a mask attached to the mold as viewed from above, and FIG. 1C is a partial cross-sectional perspective view of a manufactured anisotropic conductive sheet. It is. FIG. 2 is a diagram for explaining a manufacturing process of the anisotropic conductive sheet. Hereinafter, the manufacturing process of the anisotropic conductive sheet will be described.

(Step 1) A mold 1 is prepared. The mold 1 is made of a metal material such as stainless steel, which is easily peeled off by plating. On the surface of the mold 1, a large number of conical projections 11 are formed in a matrix, for example. (Step 2) The mask 2 is attached to the surface of the mold 1 and fixed. The mask 2 is formed of a sheet 21 in which a through hole 22 having a diameter larger than the diameter of the base of the conical protrusion 11 of the mold 1 is formed.

(Step 3) A plating layer 3 is formed on the surface of the mold 1 on which the mask 2 is attached and fixed, by plating a metal having a low adhesive force such as gold, contrary to the usual plating. Due to the presence of the mask 2, the conical projections 11 of the mold 1
A thin gold plating is formed on the surface of the mold 1 and between the bottom surface of the conical projection 11 and the periphery of the through hole 22. Alternatively, the gold thin film is formed by vapor deposition. If necessary, nickel plating is applied to the surface of the gold plating to give rigidity to the gold plating.

(Step 4) The mask 2 is removed from the surface of the mold 1. As a result, a hollow thin film-shaped three-dimensional conical conductor 30 remains on the entire surface of the conical protrusion 11 of the mold 1. (Step 5) An insulating material layer 4 made of a polyimide resin is applied to the surface of the mold 1 from which the mask 2 has been removed, and the conical conductor 30 is buried in the insulating material layer 4 up to the top.

(Step 6) Before the insulating material layer 4 is cured, a second mold 5 made of an elastic material such as a Teflon sheet or an adhesive tape is pressed or stuck on the surface of the conical conductor 30 to form a cone. The insulating material is removed from the upper end surface of the conductor 30, and the insulating material layer 4 is waited to be cured. 5
Reference numeral 1 denotes an adhesive layer formed on the surface of the adhesive tape 5. (Step 7) By removing the second mold 5, the surface layer of the insulating material layer 4 is removed and removed, and the upper end of the conical conductor 30 is exposed. Next, the anisotropic conductive sheet 6 of FIG. 1C in which the conical conductor 30 is exposed on the front and back surfaces of the insulating material sheet 4 ′ made of a polyimide resin is formed by releasing the mold.

As described above, the plating layer 3 is formed on the surface of the mold 1, and then the insulating material layer 4 is applied to the surface of the plating layer 3, and before the insulating material layer 4 is hardened, the second layer is formed on the surface. By pressing the mold 5 to remove a part of the surface, the anisotropic conductive sheet 6 exposed on the front and back surfaces of the insulating material sheet 4 'is formed. In particular, by using an adhesive tape as the second mold 5, the insulating material at the upper end of the conical conductor 30 is reliably removed and exposed.

Regarding the effect of the first embodiment, the pitch accuracy of the conical conductor for connecting the device to the wiring board depends on the pitch accuracy of the conical protrusions formed on the surface of the mold. By the way, since this mold can easily form a conical projection with high pitch accuracy by applying photolithography technology and etching technology to the surface of a metal material such as stainless steel, a high-precision narrow pitch of 100 μm or less can be obtained. It can be guaranteed reliably and easily. Then, before the insulating material layer is cured, a Teflon sheet or an adhesive tape is pressed or adhered to the plating surface as a second mold on the surface, and this is removed to remove and remove the insulating material layer surface layer. By exposing the upper end of the conical conductor on the surface of the insulating material sheet, the residual insulating material on the top surface of the conical conductor can be almost completely removed, and good conduction can be secured.

A second embodiment will be described with reference to FIGS. 3A is a perspective view of the mold, FIG. 3B is a side view of the mold, FIG. 3C is a top view of the mask, and FIG.
Is a perspective view of the manufactured anisotropic conductive sheet, and FIG. 3E is an enlarged perspective view of the arch-shaped conductor. FIG. 4 is a diagram for explaining a manufacturing process of the anisotropic conductive sheet. (Step 1) A mold 1 is prepared. On the surface of the mold 1, for example, an arch-shaped projection 1 having an arch-shaped cross section in a matrix shape
11 are formed in large numbers.

(Step 2) The mask 2 is attached to the surface of the mold 1 and fixed. The mask 2 is formed by forming through-holes 24 corresponding to the arrangement of the arch-shaped protrusions 111 of the mold 1 on the sheet 21. The length of the long side of the through-holes 24 is the same as the length of the arch-shaped protrusion 111. It is formed slightly larger than in comparison. (Step 3) A plating layer 3 is formed by plating a metal having a low adhesive force such as gold on the surface of the mold 1 on which the mask 2 is attached and fixed. Due to the presence of the mask 2, the mold 1
Surface of the arch-shaped protrusion 111 and the arch-shaped protrusion 111
Is formed on the surface of the mold 1 between the bottom of the mold and the short side of the through-hole 24. If necessary, nickel plating is applied to the surface of the gold plating to give rigidity to the gold plating.

(Step 4) The mask 2 is removed from the surface of the mold 1. As a result, the arch-shaped conductor 31 remains on the upper surface of the arch-shaped protrusion 111 of the mold 1. The lower end of the arch-shaped conductor 31 is in contact with the surface of the mold 1. (Step 5) An insulating material layer 4 made of a polyimide resin is applied to the plating surface of the mold 1 from which the mask 2 has been removed.

(Step 6) Before the insulating material layer 4 made of a polyimide resin is cured, a Teflon sheet or an adhesive tape is pressed or attached to the plating surface as a second mold 5 made of an elastic material, Wait for it to cure. Reference numeral 51 denotes an adhesive layer formed on the surface when the second mold is an adhesive tape. (Step 7) The second mold 5 made of a Teflon sheet or an adhesive tape is removed to remove and remove the surface layer of the insulating material layer 4, and the arch-shaped conductor 31 is formed on the surface of the insulating material sheet 4 '.
To expose the upper end of the

(Step 8) Next, the anisotropic conductive sheet 6 in which the arch-shaped conductor 31 is exposed on the front and back surfaces of the insulating material sheet 4 'is formed by releasing the mold. 3D and 3E show the anisotropic conductive sheet 6 in a perspective view.
It becomes as follows. Regarding the effect of the second embodiment, also in the second embodiment, the pitch accuracy of the arch-shaped conductor 31 is set to 100 μm.
It is possible to easily secure the following high-precision narrow pitch and to remove the residual insulating material on the top surface of the arch-shaped conductor almost completely to secure good conduction. in addition,
By making the shape of the conductor arch-shaped, great flexibility can be imparted to the conductor.

A metal embedded type anisotropic conductive sheet will be described as a third embodiment. In order to manufacture a metal-embedded anisotropic conductive sheet, a conductive material sheet made of a conductive material such as copper as a raw material is attached to a holding adhesive tape, and a photolithography technique and an etching technique are applied to the conductive material sheet. The conductive block attached to the holding pressure-sensitive adhesive tape is separated and formed independently, and an insulating material made of a synthetic resin is filled in an etching-removed area of the conductive material sheet. An adhesive tape is attached to the surface to remove and remove a part of the surface of the material layer to expose the upper end of the conductive block.

Hereinafter, the manufacturing process of the metal embedded type anisotropic conductive sheet will be specifically described with reference to FIG. (Step 1) A conductive material sheet 7 is prepared. The conductive material sheet 7 is made of a conductive material such as copper as a raw material. (Step 2) A rectangular or circular resist 7 is applied to the front and back surfaces of the conductive material sheet 7 by applying photolithography technology.
1, 71 'are patterned and formed in a matrix. The rectangular or circular resists 71 and 71 ′ formed on the front and back surfaces of the conductive material sheet 7 are formed to face each other in the thickness direction of the conductive material sheet 7.

(Step 3) Square or circular resist 7
An etching process is performed on the conductive material sheet 7 in which 1, 71 ′ are patterned on both front and back surfaces. The etching process is performed until the conductive material sheet 7 penetrates and separates from the front and back, leaving the bonding region 72. (Step 4) The resist 71 ′ formed on the back surface is removed. (Step 5) The holding adhesive tape 73 is attached to the back surface of the conductive material sheet 7 to mechanically reinforce the etched conductive material sheet 7. Reference numeral 731 denotes an adhesive layer formed on the surface of the holding adhesive tape 73.

(Step 6) The conductive material sheet 7 mechanically reinforced by the holding adhesive tape 73 is subjected to further etching. Further etching is performed, and finally, the conductor separating groove 721 is formed and the coupling region 72 disappears. By forming the conductor separating groove 721, the conductive blocks 7 'are formed independently of each other. Here, an insulating material made of a synthetic resin is filled in an etching-removed region of the conductive material sheet 7, and a second mold made of a Teflon sheet or an adhesive tape or another elastic material is pressed on the surface of the formed insulating material layer 76. Then, a part of the surface layer of the insulating material layer 76 is removed and removed, and the upper end of the conductive block 7 'is exposed on the surface of the formed insulating material sheet.

Next, the resist 71 and the holding adhesive tape 73 are peeled off to produce a metal-embedded anisotropic conductive sheet in which the conductive blocks 7 'are exposed on the front and back surfaces of the insulating material sheet. Regarding the effect of the third embodiment, a conductive material sheet using a conductive material such as copper as a raw material is used, and a photolithography technique is applied to the surface of the conductive block 7 '.
This constitutes a metal-embedded anisotropic conductive sheet with exposed portions, and can be said to be an example having particularly good workability in order to form conductive blocks 7 'in an orderly manner with a high-precision narrow pitch interval. The pitch accuracy between the conductive blocks 7 ′ connecting the device to the wiring board is set by the photolithographic pitch accuracy, and the anisotropy of the conductive blocks 7 ′ having a high-precision narrow pitch interval of 100 μm or less is set. An electrically conductive sheet can be formed. Then, by sticking the holding adhesive tape 73 on the back surface of the conductive material sheet 7 and temporarily fixing the same, the mutual positional relationship between the parts to be cut and separated in each processing step is held and secured to be constant. The mutual positional relationship between the parts is maintained and secured until the insulating material sheet finally cures, and is 100 μm.
The following high precision narrow pitch is guaranteed.

As a fourth embodiment, a further embedded metal anisotropic conductive sheet will be described with reference to FIGS. (Step 1) A conductive material sheet 7 made of a conductive material such as copper as a raw material is prepared, a photolithography technique is applied to the surface of the conductive material sheet 7, and a circular area C is exposed on the surface of the conductive material sheet 7 in a matrix. At least, the resist 71 is patterned on the entire remaining surface. The holding adhesive tape 73 is attached to the back surface of the conductive material sheet 7.

(Step 2) The conductive material sheet 7 on which the resist of Step 1 has been formed is subjected to etching to form a thin bowl-shaped portion 70 corresponding to the exposed circular region C. (Step 3) Conductive material sheet 7 on which bowl-shaped portion 70 is formed
The resist 71 is removed from the surface of. (Step 4) The holding adhesive tape 73 is peeled from the back surface of the conductive material sheet 7. (Step 5) The holding adhesive tape 73 is attached to the upper surface of the conductive material sheet 7 in step 4, and the holding adhesive tape 73 side is turned downward.

(Step 6) Bowl-shaped portion 7 of conductive material sheet 7
The resist 74 is patterned in the cross-shaped slit corresponding to the vertex of 0. (Step 7) The conductive material sheet 7 patterned in a cross shape is subjected to an etching process, and a cross-shaped cut 701 is formed at the vertex of the bowl-shaped portion 70 and a conductor separating groove 721 is formed. The bowl-shaped portions 70 are separated from each other by the conductor separating grooves 721 while being attached to the holding adhesive tape 73.

(Step 8) The resist 74 is removed. (Step 9) A second holding adhesive tape 75 is attached to the upper side of the bowl-shaped portion 70 from which the resist 74 has been removed. 751
Indicates an adhesive layer formed on the surface of the second holding adhesive tape 75. (Step 10) Following the step 9, the holding adhesive tape 73 is peeled off from the back side of the bowl-shaped portion 70, and the second holding adhesive tape 7 is removed.
Turn the 5 side down.

(Step 11) Subsequent to the step 10, the insulating material layers 7 made of polyimide resin are formed on both front and back surfaces of the bowl-shaped portion 70.
6 is applied and formed. Here, the insulating material layer 76 is bonded to the adhesive layer 751 of the second holding adhesive tape 75 in the surface of the bowl-like portion 70 in a state where the insulating material layer 76 is also filled in the cross-shaped cut 701 and the conductor separating groove 721. Except where it is, it is applied and formed on the entire front and back surfaces. (Step 12) Following step 11, a third holding adhesive tape 75 'is attached to the upper side of the bowl-shaped portion 70.

(Step 13) Following the step 12, the second holding adhesive tape 75 is peeled off and the third holding adhesive tape 7 is removed.
Turn the 5 'side down. By this peeling, the insulating material layer 76 formed on the upper end of the bowl-shaped portion 70 is removed and exposed. (Step 14) The third holding adhesive tape 75 'is peeled off. The peeling also exposes the peripheral end surface of the bowl-shaped portion 70.
Here, the upper end portion and the peripheral edge surface of the bowl-shaped portion 70 are exposed on the front and back surfaces of the insulating material sheet 76 ', and the insulating material sheet 7
A metal-embedded anisotropic conductive sheet having a conductive block 7 'exposed on the front and back surfaces of 6' is manufactured.

(Step 15) The metal-embedded anisotropic conductive sheet manufactured in step 14 is abutted with the peripheral end faces thereof and connected to each other to produce a metal-embedded anisotropic conductive sheet imparted with elasticity. You. Regarding the effects of the fourth embodiment, in the fourth embodiment, as in the third embodiment, the pitch accuracy of the conductive block 7 'that connects the device to the wiring board is set by the pitch accuracy of photolithography. At the same time, the mutual positional relationship between the parts to be cut and separated in each processing step can be maintained and secured constant, and the mutual positional relationship between the parts can be maintained and secured until the insulating material sheet is finally cured. On top of this, the peripheral edges of the metal-embedded anisotropic conductive sheet manufactured up to step 14 are abutted against each other and interconnected to give a large elasticity to the formed metal-embedded anisotropic conductive sheet. can do.

A semiconductor embedded type anisotropic conductive sheet will be described as a fifth embodiment with reference to FIGS. 9 and 10. FIG. (Step 1) A semiconductor sheet 8 is prepared. The semiconductor sheet 8 is made of a semiconductor material such as silicon as a raw material. (Step 2) Holding adhesive tape 8 on the lower surface of semiconductor sheet 8
Paste 1 together. Reference numeral 811 denotes an adhesive layer formed on the surface of the holding adhesive tape 81.

(Step 3) The semiconductor sheet 8 held by the holding adhesive tape 81 is diced from its surface, and the semiconductor terminal forming projections 82 are distributed in a matrix with the remaining semiconductor sheet 8 '. Formed. (Step 4) An insulating material layer 83 made of a synthetic resin material such as a polyimide resin is applied to the surfaces of the remaining semiconductor sheet 8 'and the semiconductor terminal forming projections. (Step 5) Subsequent to the step 4, the semiconductor terminal forming protrusions 82
The second holding adhesive tape 84 is stuck on the upper side of. Here, the insulating material applied to the upper end of the semiconductor terminal forming protrusion 82 is pushed away by the holding adhesive tape 81 around the semiconductor terminal forming protrusion 82.

(Step 6) The holding adhesive tape 81 is peeled off from the remaining semiconductor sheet 8 ', and the second holding adhesive tape 84 is peeled off from the semiconductor terminal forming projections 82. Here, the lower surface of the remaining semiconductor sheet 8 ′ is exposed by peeling off the holding adhesive tape 81, and the second holding adhesive tape 84 is removed.
As a result, the insulating material layer 83 is removed from the end surface of the semiconductor terminal forming projection 82 to expose it. (Step 7) The holding adhesive tape 81 is attached to the exposed end surface of the semiconductor terminal forming projection 82 in the step 6.

(Step 8) The remaining semiconductor sheet 8 ′ is removed by dicing from the joint with the semiconductor terminal forming projection 82 to the joint with the insulating material layer 83. . As a result, the semiconductor terminal forming protrusions 82
Are separated from each other electromechanically and made independent. (Step 9) The holding adhesive tape 81 is peeled off. This peeling also exposes the lower end of the semiconductor terminal forming projection 82. Here, the semiconductor terminal forming projection 82 has its upper end and lower end exposed on both the front and back surfaces of the insulating material sheet 83 ′, and the semiconductor embedded type anisotropically exposed semiconductor terminals 82 ′ on the front and back surfaces of the insulating material sheet 83 ′. The conductive sheet is manufactured.

Regarding the effect of the fifth embodiment, a semiconductor material such as silicon is used as a conductive material as a raw material, so that a pitch between devices to be connected to a wiring board by a semiconductor fine processing technique is set to 100 μm. The following narrow pitch can be set. The processing steps are also a combination of simple steps, and the number of steps is relatively small. A further embedded semiconductor anisotropic conductive sheet will be described as a sixth embodiment with reference to FIGS.

(Step 1) A semiconductor sheet 8 is prepared.
The semiconductor sheet 8 is made of a semiconductor material such as silicon as a raw material. (Step 2) Holding adhesive tape 8 on the lower surface of semiconductor sheet 8
Paste 1 together. Reference numeral 811 denotes an adhesive layer formed on the surface of the holding adhesive tape 81. (Step 3) The semiconductor sheet 8 held by the holding adhesive tape 81 is diced from the surface to the surface of the holding adhesive tape 81, and the semiconductor block 85 is diced.
Are formed separately and independently in a matrix. FIG. 11A is a perspective view showing a state in which the semiconductor blocks 85 are formed independently in a matrix form.

(Step 4) An insulating material layer 83 made of a synthetic resin material such as a polyimide resin is applied to the surface of the holding adhesive tape 81 on which the semiconductor blocks 85 are separated and held in a matrix form. The semiconductor block 85 is buried. (Step 5) A second holding adhesive tape 84 is attached to the upper end of the semiconductor block 85, and the insulating material applied to the upper end of the semiconductor block 85 is the second holding adhesive tape 84.
As a result, the insulating material layer 83 is pushed away to the periphery of the semiconductor block 85, and the insulating material layer 83 is hardened.

(Step 6) The holding adhesive tape 81 and the second holding adhesive tape 84 are peeled off. Here, the lower surface of the semiconductor block 85 is exposed by peeling off the holding adhesive tape 81, and the upper end of the semiconductor block 85 is exposed by removing the insulating material layer 83 by peeling off the second holding adhesive tape 84. A semiconductor embedded type anisotropic conductive sheet in which the semiconductor block 85 is exposed on the front and back surfaces of the sheet 83 'is manufactured. Regarding the effect of the sixth embodiment, the cutting of the semiconductor sheet 8 is performed by dicing the semiconductor sheet 8 held in the holding adhesive tape 81, and the semiconductor blocks 85 are separated and independent in a matrix. The pitch of the semiconductor blocks 85 can be set more precisely by the precise pitch accuracy of dicing. Anisotropic conductive sheet in which conductive fine particles are dispersed is 100 μm
Although it is possible to cope with a connection with a pitch as small as approximately, the pitch of the semiconductor blocks 85 in this embodiment is 10
It is possible to cope with a narrow pitch of 0 μm or less.

Here, a modification of the sixth embodiment is constituted by interposing (step 3 ') between (step 3) and (step 4). (Step 3 ′) In (Step 3), as shown in FIG. 11A, when the semiconductor blocks 85 are separated and formed independently in a matrix, the semiconductor blocks 85 are formed on the surface of the semiconductor blocks 85 as shown in FIG. Micro bridge contact, p
Circuit elements 8 such as n-junction and micro fuse
6 is formed by applying a semiconductor fine processing technique. FIG.
(C) shows a semiconductor block 85 on which a circuit element 86 is formed.
FIG. 4 is a diagram showing a cross section in the thickness direction of FIG. Semiconductor block 85
A pn junction is formed on the surface of the pn junction, and a microbridge contact is formed above the pn junction. Then, a micro fuse is formed on the back surface of the semiconductor block 85. Here, the device is connected to the microbridge contact from above, and via the pn junction, the semiconductor block 85 itself, and the microfuse,
Connect to the lower wiring board.

Regarding the effect of the modified example of the sixth embodiment, since the conductor of the conventional anisotropic conductive sheet is merely a current conducting member, it is natural that an improper direction is provided between the device and the wiring board. In addition to allowing the current to flow as it is, the overcurrent also flows as it is. However, between the device and the wiring board facing each other with respect to the semiconductor embedded type anisotropic conductive sheet, these circuit elements 86 and semiconductor blocks 85 formed in the semiconductor block 85 of the anisotropic conductive sheet are provided.
By adopting a configuration in which the anisotropic conductive sheet is connected to the anisotropic conductive sheet, an effect of controlling the direction and magnitude of the current can be imparted to the anisotropic conductive sheet. That is, the semiconductor block 85
The direction of the current flowing through the semiconductor block 85 can be controlled by forming a pn junction on the surface of the semiconductor device. Then, by forming a micro bridge contact and a micro fuse, the semiconductor block 85 is formed.
Current flowing through the power supply can be restricted.

[0057]

As described above, according to the present invention, in any of the embodiments, the conductor constituting the anisotropic conductive sheet is systematically exposed through the front and back surfaces of the insulating material sheet. Since the elastic member is provided with elasticity, the conductor is interposed between the device and the wiring board, so that the electrical connection therebetween can be reliably and reliably made. According to the first embodiment, the pitch accuracy of the conical conductor that connects the device to the wiring board depends on the pitch accuracy of the conical protrusions formed on the surface of the mold. By the way, this mold can easily form a conical projection with high pitch accuracy by applying photolithography technology and etching technology to the surface of a metal material such as stainless steel.
A high-precision narrow pitch of not more than 00 μm can be reliably and easily guaranteed. Then, before the insulating material layer is cured, a Teflon sheet or an adhesive tape is pressed or stuck on the surface of the plating surface as a second mold, and is removed to remove and remove the surface layer of the insulating material layer. By exposing the upper end of the conical conductor on the surface of the insulating material sheet, the residual insulating material on the top surface of the conical conductor can be almost completely removed, and good conduction can be secured.

Further, according to the second embodiment, the pitch accuracy of the arch-shaped conductor 31 can be easily secured to a high-precision narrow pitch of 100 μm or less, and the residual insulating material on the top surface of the arch-shaped conductor is almost completely eliminated. To ensure good conduction. In addition, by making the shape of the conductor an arch shape, great flexibility can be imparted to the conductor. Further, according to the third embodiment, a conductive material sheet made of a conductive material such as copper as a raw material is used, and a photolithography technique is applied to the surface of the conductive material sheet to expose a conductive block 7 ′. This embodiment constitutes a conductive sheet, and can be said to be an embodiment having particularly good workability in order to form the conductive blocks 7 'in an orderly and highly precise manner at narrow pitch intervals. The pitch accuracy between the conductive blocks 7 ′ connecting the device to the wiring board is set by the photolithographic pitch accuracy, and the anisotropy of the conductive blocks 7 ′ having a high-precision narrow pitch interval of 100 μm or less is set. An electrically conductive sheet can be formed.
Then, the holding adhesive tape 73 is provided on the back surface of the conductive material sheet 7.
By pasting and temporarily fixing, the mutual positional relationship between the parts to be cut and separated in each processing step is maintained and secured constant. The mutual positional relationship between the parts is maintained and secured until the insulating material sheet finally cures, and the
High precision narrow pitch of less than m is guaranteed.

According to the fourth embodiment, similarly to the third embodiment, the pitch accuracy of the conductive block 7 'for connecting the device to the wiring board is set by the photolithographic pitch accuracy. The mutual positional relationship between the parts to be cut and separated in each processing step can be maintained and secured constant, and the mutual positional relationship between the parts can be maintained and secured until the insulating material sheet is finally cured. In addition, step 14
By contacting the peripheral end surfaces of the metal-embedded anisotropic conductive sheet manufactured up to the above and interconnecting them, a large elasticity can be imparted to the formed metal-embedded anisotropic conductive sheet.

Here, according to the fifth embodiment, by using a semiconductor material such as silicon as a raw material as a conductive material, the semiconductor device can be connected to a wiring substrate by applying a semiconductor fine processing technique. The pitch can be set to a narrow pitch of 100 μm or less. The processing steps are also a combination of simple steps, and the number of steps is relatively small. Further, according to the sixth embodiment, the semiconductor sheet 8 is cut by performing dicing on the semiconductor sheet 8 held by the holding adhesive tape 81, and the semiconductor blocks 85 are separated in a matrix form. Therefore, the pitch of the semiconductor blocks 85 can be set more precisely by the precise pitch accuracy of dicing. Although the anisotropic conductive sheet in which the conductive fine particles are dispersed can correspond to a connection with a narrow pitch of about 100 μm, the pitch of the semiconductor blocks 85 in this embodiment also corresponds to a narrow pitch of 100 μm or less. be able to.

Further, according to the modification of the sixth embodiment, the conductor of the conventional anisotropic conductive sheet is merely a current conducting member, so that an inappropriate Direction current is passed as it is, and overcurrent is passed as it is. However, the device and the wiring board facing each other with respect to the semiconductor embedded type anisotropic conductive sheet are interconnected via the circuit element 86 and the semiconductor block 85 formed in the semiconductor block 85 of the anisotropic conductive sheet. By employing the configuration, an action of controlling the direction and magnitude of the current can be imparted to the anisotropic conductive sheet. That is, by forming a pn junction on the surface of the semiconductor block 85, the direction of the current flowing through the semiconductor block 85 can be controlled. By forming a microbridge contact and a microfuse, the current flowing through the semiconductor block 85 can be limited.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a first embodiment.

FIG. 2 is a diagram illustrating a manufacturing process of the first embodiment.

FIG. 3 is a diagram illustrating a second embodiment.

FIG. 4 is a diagram illustrating a manufacturing process according to a second embodiment.

FIG. 5 is a diagram illustrating a manufacturing process according to a third embodiment.

FIG. 6 is a diagram illustrating a manufacturing process according to a fourth embodiment.

FIG. 7 is a continuation of FIG. 6;

FIG. 8 is a continuation of FIG. 7;

FIG. 9 is a diagram illustrating a manufacturing process according to a fifth embodiment.

FIG. 10 is a continuation of FIG. 9;

FIG. 11 is a diagram illustrating a sixth embodiment.

FIG. 12 is a diagram illustrating a manufacturing process according to a sixth embodiment.

[Explanation of symbols]

 4 'insulating material sheet 30 conductor

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G01R 31/26 G01R 31/26 J H01B 5/16 H01B 5/16 13/00 501 13/00 501P H01R 13 / 03 H01R 13/03 A 43/00 43/00 HF term (reference) 2G003 AA10 AG07 AG12 AH05 2G011 AA01 AA15 AA16 AB06 AB08 AC11 AC14 AE03 5E051 CA04 CA10 5G307 HA02 HB06 HC01

Claims (22)

[Claims] 1. An anisotropic conductive sheet interposed between opposing electric members to electrically connect both electric members, comprising: an insulating material sheet; and a thin film penetrating the insulating material sheet and exposing upper and lower ends. An anisotropic conductive sheet, comprising a conductor having a three-dimensional structure, wherein the conductors having a three-dimensional structure are distributed and formed on an insulating material sheet. 2. The anisotropic conductive sheet according to claim 1, wherein the three-dimensionally structured conductor is a conical conductor that closes an upper end and opens a lower end. Conductive sheet. 3. The anisotropic conductive sheet according to claim 1, wherein the three-dimensionally structured conductor is an arch-shaped conductor formed in an arch shape. 4. The anisotropic conductive sheet according to claim 1, wherein the conductor having a three-dimensional structure is formed by plating or vapor deposition. Anisotropic conductive sheet. 5. A conductive material sheet using a conductive material as a raw material, a photolithography technique and an etching technique are applied to form a conductive block separately and independently, and an insulating material is filled in an etching-removed region of the conductive material sheet and cured. An anisotropic conductive sheet, wherein a conductive block is exposed on the front and back surfaces of the insulating material sheet. 6. A thin film-shaped bowl-shaped portion is formed independently on the surface of a conductive material sheet using a conductive material as a raw material by applying a photolithography technique and an etching technique, and an insulating portion is formed in an etching-removed region of the conductive material sheet. An anisotropic conductive sheet, characterized in that a bowl-shaped portion is exposed as a bowl-shaped conductor on the front and back surfaces of an insulating material sheet formed by filling and curing a material. 7. A thin film-shaped bowl-shaped portion is formed independently on the surface of a conductive material sheet using a conductive material as a raw material by applying a photolithography technique and an etching technique, and an insulating portion is formed in a region where the conductive material sheet is removed by etching. An anisotropic conductive sheet in which a bowl-shaped portion is exposed as a bowl-shaped conductor on the front and back surfaces of an insulating material sheet that is filled with a material and cured and formed, and is configured to be overlapped and integrated with one another. Anisotropic conductive sheet. 8. A semiconductor sheet made of a semiconductor material as a raw material is subjected to dicing from the surface to independently form the conductor-forming projections having the remaining semiconductor sheet, and to form the remaining semiconductor sheet and the conductor-forming projections. An insulating material layer is applied and cured on the surface, and the remaining semiconductor sheet is removed from the joint between the conductor forming protrusions and the joint between the insulating material layer and the cured semiconductor material sheet. An anisotropic conductive sheet, characterized in that the conductor-forming projections are exposed as semiconductor terminals on the front and back surfaces. 9. A semiconductor sheet using a semiconductor material as a raw material is subjected to dicing from the surface to form a semiconductor block separately and independently, and the semiconductor block is buried in an insulating material layer with its upper and lower ends exposed and cured. An anisotropic conductive sheet, wherein a semiconductor block is exposed on both sides of a formed insulating material sheet. 10. The anisotropic conductive sheet according to claim 9, wherein a circuit element is formed on a surface of the semiconductor block. 11. A mold having a large number of projections formed on a surface thereof is prepared, and a mask formed of a sheet having a through-hole having a diameter larger than the diameter of the foot of the projection of the mold is attached to the surface of the mold. Applying metal plating or vapor deposition to the surface of the mold, removing the mask from the surface of the mold, forming a thin-film solid conductor on the entire surface of the protrusion of the mold, and forming an insulating material on the surface of the mold Applying a second layer to the surface of the conductor to bury the conductor in the insulating material layer, pressing the second mold against the surface of the conductor, waiting for the insulating material layer to harden, and releasing the mold. Method for producing conductive sheet. 12. A conductive material sheet made of a conductive material as a raw material is prepared by affixing it to a holding adhesive tape, and the conductive material sheet is affixed to the holding adhesive tape by applying a photolithography technique and an etching technique. A conductive block in a state is formed separately and independently, an etching-removed region of the conductive material sheet is filled with an insulating material made of synthetic resin, and a second mold is pressed against the surface of the filled insulating material layer to form an insulating material. A method for producing an anisotropic conductive sheet, characterized in that a part of a layer surface is removed and an upper end portion of a conductive block is exposed. 13. The method for producing an anisotropic conductive sheet according to claim 12, wherein a conductive material sheet made of a conductive material is prepared, and a photolithography technique is applied to both front and back surfaces of the conductive material sheet to form a ring. A large number of resists are patterned and etched into the conductive material sheet, and this etching process is performed until the conductive material sheet passes through the front and back and separates, leaving the bonding area, and is held on the back surface of the conductive material sheet. The tape is attached, the conductive material sheet is further etched, and the conductive blocks are formed independently from each other by forming conductor separating grooves in the coupling area. Is filled, and the second mold is pressed on the surface of the formed insulating material layer. The anisotropic conductive sheet manufacturing method, characterized in that allowed to expose the click. 14. A thin film-shaped bowl-shaped portion is formed independently on the surface of a conductive material sheet using a conductive material as a raw material by applying a photolithography technique and an etching technique, and an insulating portion is formed in a region where the conductive material sheet is removed by etching. Fill the material,
A method for producing an anisotropic conductive sheet, wherein a bowl-shaped portion is exposed as a bowl-shaped conductor on both sides of a cured insulating material sheet. 15. The method for producing an anisotropic conductive sheet according to claim 14, wherein a conductive material sheet made of a conductive material is prepared, and a circular region is formed by applying photolithography to the surface of the conductive material sheet. The resist is patterned over the entire surface, and the conductive material sheet is etched to form a thin-walled bowl corresponding to the exposed circular area.The adhesive tape is held on the upper surface of the conductive material sheet. And holding the adhesive tape side down, patterning the resist in the cross-shaped slits corresponding to the apexes of the bowl-shaped portion of the conductive material sheet, etching the conductive material sheet patterned in a cross shape, A cross-shaped slit is formed at the vertex of the conductor, and a conductor separation groove is formed. Separated and independent from each other by the separation groove, a second holding adhesive tape is stuck on the upper side of the bowl-shaped part, the holding adhesive tape is peeled off, the second holding adhesive tape side is on the lower side, and the front and back sides of the bowl-shaped part A third holding adhesive tape is adhered on the upper side of the bowl-shaped portion, the second holding adhesive tape is peeled off, the third holding adhesive tape side is turned down, A method for producing an anisotropic conductive sheet, comprising: separating a holding pressure-sensitive adhesive tape and exposing conductive blocks on front and back surfaces of an insulating material sheet formed by curing an insulating material layer. 16. A thin film-shaped bowl-shaped portion is formed independently on the surface of a conductive material sheet using a conductive material as a raw material by applying a photolithography technique and an etching technique, and an insulating portion is formed in an etching-removed region of the conductive material sheet. Fill the material,
The production of an anisotropic conductive sheet, characterized in that anisotropic conductive sheets having a bowl-shaped part exposed as a bowl-shaped conductor on the front and back surfaces of a cured insulating material sheet are opposed to each other and integrated. Method. 17. The method for producing an anisotropic conductive sheet according to claim 16, wherein a conductive material sheet made of a conductive material is prepared, and a circular region is formed by applying photolithography to the surface of the conductive material sheet. The resist is patterned over the entire surface, and the conductive material sheet is etched to form a thin-walled bowl corresponding to the exposed circular area.The adhesive tape is held on the upper surface of the conductive material sheet. And holding the adhesive tape side down, patterning the resist in the cross-shaped slits corresponding to the apexes of the bowl-shaped portion of the conductive material sheet, etching the conductive material sheet patterned in a cross shape, A cross-shaped slit is formed at the vertex of the conductor, and a conductor separation groove is formed. Separated and independent from each other by the separation groove, a second holding adhesive tape is stuck on the upper side of the bowl-shaped part, the holding adhesive tape is peeled off, the second holding adhesive tape side is on the lower side, and the front and back sides of the bowl-shaped part A third holding adhesive tape is adhered on the upper side of the bowl-shaped portion, the second holding adhesive tape is peeled off, the third holding adhesive tape side is turned down, The holding adhesive tape is peeled off, and the conductive block is exposed on the front and back surfaces of the insulating material sheet formed by curing the insulating material layer to produce an anisotropic conductive sheet. A method for producing an anisotropic conductive sheet, characterized in that end faces are butted together and both are integrated. 18. A semiconductor sheet made of a semiconductor material as a raw material is subjected to dicing from the surface to independently form a conductor-forming projection having a remaining semiconductor sheet, and to form a conductor-forming projection of the remaining semiconductor sheet and the conductor-forming projection. An insulating material layer applied to the surface and cured, and the remaining semiconductor sheet is removed from the joint between the conductor forming protrusions to the joint between the insulating material layer and the cured semiconductor material. A method for producing an anisotropic conductive sheet, characterized in that the conductor forming projections are exposed as semiconductor terminals on the front and back surfaces of the sheet. 19. The method for producing an anisotropic conductive sheet according to claim 18, wherein a semiconductor sheet made of a semiconductor material is prepared, a holding adhesive tape is attached to a lower surface of the semiconductor sheet, and a front surface is attached to the semiconductor sheet. Dicing process from the above, having the remaining semiconductor sheet and forming the semiconductor terminal forming protrusions in a distributed manner, applying an insulating material layer on the surfaces of the remaining semiconductor sheet and the semiconductor terminal forming protrusions, Attach the second holding adhesive tape, peel off the holding adhesive tape from the remaining semiconductor sheet, peel off the second holding adhesive tape from the semiconductor terminal forming protrusion, and attach the holding adhesive tape to the end face of the semiconductor terminal forming protrusion. Dicing the remaining semiconductor sheet from the joint between the semiconductor terminal forming protrusion and the joint with the insulating material layer. The anisotropic conductive sheet manufacturing method, characterized by disconnecting the semiconductor terminal forming protrusions by removing subjected to engineering to each other electromechanically. 20. A semiconductor sheet made of a semiconductor material as a raw material is subjected to dicing from a surface to form a semiconductor block separately and independently, and the semiconductor block is embedded in an insulating material layer with its upper and lower ends exposed. A method for manufacturing an anisotropic conductive sheet, comprising exposing a semiconductor block on the front and back surfaces of a cured insulating material sheet. 21. The method for manufacturing an anisotropic conductive sheet according to claim 20, wherein a semiconductor sheet made of a semiconductor material is prepared, a holding adhesive tape is attached to a lower surface of the semiconductor sheet, and a front surface is formed on the semiconductor sheet. Dicing from the surface to the surface of the holding adhesive tape to separate and form semiconductor blocks independently. Apply an insulating material layer to the surface of the holding adhesive tape where the semiconductor blocks are held separately and independently. Manufacturing an anisotropic conductive sheet, wherein a semiconductor block is embedded in a layer, a second holding adhesive tape is attached to an upper end of the semiconductor block, and the holding adhesive tape and the second holding adhesive tape are peeled off. Method. 22. The method of manufacturing an anisotropic conductive sheet according to claim 20, wherein the semiconductor element is separated from the semiconductor block, and a circuit element is formed on the surface of the semiconductor block. A method for producing an anisotropic conductive sheet, which is formed by applying a fine processing technique.