JP2002071666A - Degradation life diagnostic method for electronic circuit board by degradation degree measuring kit - Google Patents

Degradation life diagnostic method for electronic circuit board by degradation degree measuring kit

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Publication number
JP2002071666A
JP2002071666A JP2000255957A JP2000255957A JP2002071666A JP 2002071666 A JP2002071666 A JP 2002071666A JP 2000255957 A JP2000255957 A JP 2000255957A JP 2000255957 A JP2000255957 A JP 2000255957A JP 2002071666 A JP2002071666 A JP 2002071666A
Authority
JP
Japan
Prior art keywords
electronic circuit
deterioration
circuit board
degree
index value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000255957A
Other languages
Japanese (ja)
Other versions
JP3602782B2 (en
Inventor
Yoko Todo
洋子 藤堂
Akira Sawada
彰 澤田
Keiichi Sasaki
恵一 佐々木
Katsumi Kanehira
勝己 兼平
Kenji Adachi
健二 安達
Masaaki Okubo
正明 大久保
Kazunari Kimura
和成 木村
Hiromi Imai
博美 今井
Tadayoshi Murayama
忠義 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000255957A priority Critical patent/JP3602782B2/en
Publication of JP2002071666A publication Critical patent/JP2002071666A/en
Application granted granted Critical
Publication of JP3602782B2 publication Critical patent/JP3602782B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To diagnose the degradation life of an electronic circuit board taking account of influence on the degradation of an environmental factor, at a low cost without the recovery and destructive test of the electronic circuit board. SOLUTION: A diagnostician supplies a user free of charge with a degradation degree measuring kit 1 enclosing a measuring sample for measuring environmental deleterious degree. The user exposes the measuring sample into atmospheric environment for a specified period and then returns it to the diagnostician. The diagnostician analyzes the returned measuring sample to obtain an index value indicating the environmental deleterious degree, diagnoses the degraded state of an electronic circuit board on the basis of the index value and presents a diagnosis result and a prescription 6 to the user for payment.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、大気環境で使用さ
れる電子回路基板の使用中に進行する劣化を診断する劣
化度測定キットによる電子回路基板の劣化寿命診断法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for diagnosing the deterioration life of an electronic circuit board using a deterioration degree measuring kit for diagnosing deterioration progressing during use of an electronic circuit board used in an atmospheric environment.

【０００２】[0002]

【従来の技術】一般に、大気環境で使用される電子回路
基板は、環境中の腐食性ガスや浮遊塵埃や温・湿度等の
複合的な影響で劣化が進行する。例えば、配線導体材料
の銅の腐食による導体パターンの断線や、コネクタの金
めっき下地金属である銅やニッケルの腐食による接触障
害が発生し、寿命に到る。また、電子回路基板表面に塵
埃や腐食性ガスが推積すると、絶縁距離が小さい部品や
コネクタのリード間で絶縁低下が発生し、装置誤動作の
原因となる。2. Description of the Related Art Generally, an electronic circuit board used in an atmospheric environment deteriorates due to a combined influence of corrosive gas, floating dust, temperature and humidity in the environment. For example, disconnection of a conductor pattern due to corrosion of copper of a wiring conductor material and contact failure due to corrosion of copper or nickel which is a gold plating base metal of a connector occur, and the life is extended. Further, when dust or corrosive gas is deposited on the surface of the electronic circuit board, insulation is reduced between components having a short insulation distance and between leads of the connector, which causes a malfunction of the device.

【０００３】従来、電子回路基板の劣化による装置の停
止を防止するために、ある時期に製品として機能してい
る電子回路基板を引取り、現状の劣化状態を調査する方
法がとられている。例えば、導体の断線寿命を予測する
ためには、その電子回路基板の導体部分を切断し、導体
の断面観察により、残存する導体厚さから余寿命を予測
する。また、絶縁劣化状態を定量的に判定するために
は、導体を切断して、測定箇所を電気的に独立させて測
定する必要があった。そのためには、製品として機能し
ている電子回路基板を引取り破壊調査をするため、引取
り基板の代わりに新たな電子回路基板を調整し、納品し
なければならなかった。Conventionally, in order to prevent the device from stopping due to deterioration of the electronic circuit board, a method has been adopted in which an electronic circuit board functioning as a product is picked up at a certain time and the current state of deterioration is investigated. For example, in order to predict the disconnection life of a conductor, the conductor portion of the electronic circuit board is cut, and the remaining life is predicted from the remaining conductor thickness by observing the cross section of the conductor. In addition, in order to quantitatively determine the insulation deterioration state, it was necessary to cut the conductor and measure the measurement points independently electrically. For that purpose, a new electronic circuit board had to be prepared and delivered in place of the take-up board in order to carry out a destructive inspection of the electronic circuit board functioning as a product.

【０００４】そこで、非破壊で電子回路基板における腐
食やマイグレーションに起因する短絡等の劣化をモニタ
リングし、早期に診断する方法として、特開平７−２４
９８４０号公報「プリント基板及び劣化診断方法」が提
案されている。この従来技術は、劣化検出用の１対の電
極導体をプリント基板に予め印刷し、電極導体相互間に
おける低周波領域での誘電正接を測定し、この誘電正接
の値に基づいて電極導体相互間における短絡に到るまで
の時間を予測する劣化診断方法である。この方法は、劣
化の進行をモニタリングできるという利点があるが、電
極導体を予め製品である電子回路基板に印刷する必要が
あり、既納品の劣化診断には向いていない。Therefore, as a method of nondestructively monitoring the deterioration of a short circuit or the like caused by corrosion or migration in an electronic circuit board and diagnosing the deterioration at an early stage, Japanese Patent Laid-Open Publication No.
No. 9840, “Printed circuit board and deterioration diagnosis method” has been proposed. According to this conventional technique, a pair of electrode conductors for deterioration detection is printed in advance on a printed circuit board, a dielectric loss tangent between the electrode conductors in a low frequency region is measured, and the distance between the electrode conductors is determined based on the value of the dielectric loss tangent. This is a deterioration diagnosis method for estimating a time until a short circuit occurs in the above. Although this method has an advantage that the progress of deterioration can be monitored, it is necessary to print electrode conductors on an electronic circuit board which is a product in advance, and is not suitable for deterioration diagnosis of delivered products.

【０００５】また、電子回路基板のコネクタは、大気環
境の影響を受けて接触ピン表面に腐食皮膜が形成されて
接触抵抗が増大し接触不良を起こすので、劣化状態を調
査するためには、コネクタを電子回路基板から取り外し
て接触抵抗を測定することで、劣化状態を判定してい
る。また、コネクタの余寿命を予測するために、加速劣
化試験を実施する場合もある。いずれも製品として機能
している電子回路基板を引取り、破壊検査や劣化試験を
実施するため、代わりの基板を用意する必要があった。[0005] Further, the connector of the electronic circuit board is affected by the atmospheric environment, and a corrosion film is formed on the surface of the contact pin to increase the contact resistance and cause a contact failure. Is removed from the electronic circuit board and the contact resistance is measured to determine the deterioration state. In some cases, an accelerated deterioration test is performed to predict the remaining life of the connector. In each case, an electronic circuit board functioning as a product was taken over, and a replacement board had to be prepared in order to perform a destructive inspection and a deterioration test.

【０００６】以上の劣化診断方法は、電子回路基板の劣
化要因が大気環境因子であっても、大気環境の有害度を
測定して、その結果を劣化判定に反映するものでない。
あくまでも電気特性値を測定して劣化程度を判定する方
法である。大気環境因子が原因で劣化する機器のメンテ
ナンス周期を、大気環境因子を測定することで予測する
方法が特開平７−２２５７７７号公報「点検周期の決定
方法及び装置」で提案されている。この従来故障は、種
々の電子式機器について、保守点検周期を左右する最も
重要な環境因子を測定して、それらの測定結果から最適
な保守点検周期を決定する、或いは保守点検周期を延長
するために必要な設置環境の改善策を決定する方法であ
る。しかし、この方法は、機器の劣化を定量的に判定す
る方法ではない。The above-described deterioration diagnosis method does not measure the harmfulness of the atmospheric environment and reflect the result in the deterioration judgment even if the deterioration factor of the electronic circuit board is the atmospheric environmental factor.
This is a method of determining the degree of deterioration by measuring electric characteristic values. Japanese Patent Application Laid-Open No. 7-225777 proposes a method of predicting a maintenance cycle of a device that deteriorates due to an atmospheric environment factor by measuring an atmospheric environment factor. This conventional failure is to measure the most important environmental factors that affect the maintenance and inspection cycle of various electronic devices and determine the optimal maintenance and inspection cycle from those measurement results, or to extend the maintenance and inspection cycle. This is a method to determine the necessary improvement measures for the installation environment. However, this method is not a method for quantitatively determining the deterioration of the device.

【０００７】大気環境で使用される電子回路基板の劣化
の進行を予測するためには、その環境状態を把握する必
要があるが、一般に機器の劣化診断は環境測定と別のメ
ニューになっており、環境測定に基づく機器の劣化診
断、寿命診断を実施しようとすると、使用している機器
を引取り破壊調査により定量的に劣化状態を判定した
り、使用環境を考慮した長期の加速劣化試験により余寿
命を推定したりすることになり、費用は膨大なものにな
る。[0007] In order to predict the progress of deterioration of an electronic circuit board used in an atmospheric environment, it is necessary to grasp its environmental state. However, in general, deterioration diagnosis of equipment is a separate menu from environmental measurement. In order to perform equipment deterioration diagnosis and life diagnosis based on environmental measurements, the equipment used is determined quantitatively by taking destruction investigations to determine the state of deterioration, or by performing a long-term accelerated deterioration test that considers the usage environment. Estimating the remaining life, the cost is enormous.

【０００８】[0008]

【発明が解決しようとする課題】従来技術では、大気環
境中で使用される電子機器を構成する電子回路基板の腐
食状態や絶縁劣化状態等の診断は、電子回路基板を回収
し破壊試験や加速劣化試験によって特性を調査する方法
がとられている。しかし、複数の環境因子の影響を考慮
に入れた診断を実施するのは技術的に難しく、実施した
としても費用が非常に高かった。使用環境の影響を考慮
に入れた診断方法として電子回路基板の一部に劣化判定
用の電極導体を印刷する診断があるが、既設の電子回路
基板にこの診断方法は適用できなかった。In the prior art, diagnosis of the corrosion state or insulation deterioration state of an electronic circuit board constituting an electronic device used in an atmospheric environment is performed by recovering the electronic circuit board and performing a destructive test or acceleration. A method of investigating characteristics by a deterioration test has been adopted. However, it was technically difficult to make a diagnosis that takes into account the effects of multiple environmental factors, and even if it was done, the cost was very high. As a diagnostic method taking the influence of the use environment into consideration, there is a diagnostic method of printing a deterioration determination electrode conductor on a part of an electronic circuit board, but this diagnostic method cannot be applied to an existing electronic circuit board.

【０００９】本発明は、上記に鑑みてなされたもので、
電子回路基板の回収や破壊試験を行うことなく、環境因
子の劣化に及ぼす影響を考慮に入れた電子回路基板の劣
化寿命の診断を低コストで行うことができ、また環境有
害度の指標値を、電子回路基板の劣化指標値により環境
評価点、簡易環境評価点、汚損度と使い分けることで、
より精度の高い劣化寿命診断を行うことができる劣化度
測定キットによる電子回路基板の劣化寿命診断法を提供
することを目的とする。[0009] The present invention has been made in view of the above,
It is possible to diagnose the deterioration life of electronic circuit boards at low cost, taking into account the effects on environmental factors, without collecting and destructive testing of electronic circuit boards. By using the environmental evaluation point, the simple environmental evaluation point, and the pollution degree according to the deterioration index value of the electronic circuit board,
It is an object of the present invention to provide a method for diagnosing deterioration life of an electronic circuit board using a deterioration degree measurement kit capable of performing more accurate deterioration life diagnosis.

【００１０】[0010]

【課題を解決するための手段】上記課題を解決するため
に、請求項１記載の発明は、診断者は、診断対象となる
電子回路基板のユーザに当該電子回路基板が使用されて
いる大気環境の有害度測定用の測定試料を含む所定の試
料が収納された劣化度測定キットを無償供与し、前記ユ
ーザは、前記測定試料を前記大気環境に所定期間暴露し
た後、当該測定試料を前記診断者に返送し、前記診断者
は、この返送された測定試料を分析して前記大気環境の
有害度を表す指標値を求め、この指標値を基に前記電子
回路基板の劣化状態を診断し、その診断結果及び処方箋
を前記ユーザに有償提示することを要旨とする。この構
成により、ユーザは、無償供与された劣化度測定キット
内の測定試料を任意の時期に大気環境に所定期間暴露し
た後、診断者に返送する。診断者は、その測定試料を分
析して環境有害度を表す指標値を求め、この指標値を基
に電子回路基板の劣化寿命を診断する。そして、診断結
果及び対策等を盛り込んだ処方箋がユーザに有償提示さ
れる。According to a first aspect of the present invention, there is provided a diagnostic device, wherein a user of an electronic circuit board to be diagnosed uses an atmospheric environment in which the electronic circuit board is used. A degradation measurement kit containing a predetermined sample containing a measurement sample for measuring the degree of harm is provided free of charge, and the user exposes the measurement sample to the atmospheric environment for a predetermined period, and then diagnoses the measurement sample. The diagnostician analyzes the returned measurement sample to determine an index value indicating the degree of harm of the atmospheric environment, and diagnoses the deterioration state of the electronic circuit board based on the index value, The gist is to present the diagnosis result and the prescription to the user for a fee. According to this configuration, the user exposes the measurement sample in the degradation degree measurement kit provided free of charge to the atmospheric environment at an arbitrary time for a predetermined period of time, and then returns it to the diagnostician. The diagnostician analyzes the measurement sample to obtain an index value representing the degree of environmental harm, and diagnoses the deterioration life of the electronic circuit board based on the index value. Then, a prescription including the diagnosis result and the countermeasure is presented to the user for a fee.

【００１１】請求項２記載の発明は、請求項１記載の劣
化度測定キットによる電子回路基板の劣化寿命診断法に
おいて、前記大気環境の有害度を表す指標値は、大気環
境中の温度、湿度、酸性ガス及びアルカリ性ガスを含む
腐食性ガス、並びに海塩粒子を含む複数の環境因子の各
々の量を測定し、その量によって割り付けた各因子別評
価点と各因子別重み係数の積の和から算出した環境評価
点であることを要旨とする。この構成により、電子回路
基板が使用されている大気環境中の温度、湿度、腐食性
ガス及び海塩粒子を含む複数の環境因子が電子回路基板
の劣化に及ぼす影響を環境評価点として定量化すること
が可能となる。According to a second aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the degradation degree measuring kit according to the first aspect, the index value indicating the harmfulness of the atmospheric environment is a temperature and a humidity in the atmospheric environment. , Measuring the amount of each of a plurality of environmental factors including corrosive gases including acid gas and alkaline gas, and sea salt particles, and summing the products of the evaluation points for each factor and the weighting factors for each factor, which are assigned according to the amounts. It should be an environmental evaluation point calculated from the above. With this configuration, the influence of a plurality of environmental factors including the temperature, humidity, corrosive gas, and sea salt particles in the air environment in which the electronic circuit board is used on the deterioration of the electronic circuit board is quantified as an environmental evaluation point. It becomes possible.

【００１２】請求項３記載の発明は、請求項１記載の劣
化度測定キットによる電子回路基板の劣化寿命診断法に
おいて、前記大気環境の有害度を表す指標値は、大気環
境中の温度、湿度、及び汚損速度を含む複数の環境因子
の各々の量を測定し、その量によって割り付けた各因子
別評価点と各因子別重み係数の積の和から算出した簡易
環境評価点であることを要旨とする。この構成により、
電子回路基板が使用されている大気環境中の温度、湿度
及び汚損速度を含む複数の環境因子が電子回路基板の劣
化に及ぼす影響を簡易環境評価点として定量化すること
が可能となる。制御盤等内に配置された電子回路基板の
中で、例えば冷却風が当たり局部的に塵埃が推積するよ
うな部分は環境の影響が濃縮された状態になっており、
このような部分で導体金属の腐食断線や絶縁低下が早期
に発生する。局部的な環境有害度を判定するのに適した
汚損速度を含む環境因子から求めた簡易環境評価点から
電子回路基板の劣化状態を判定することで、より精度の
高い劣化寿命診断を行うことが可能となる。According to a third aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to the first aspect, the index value indicating the harmfulness of the atmospheric environment is a temperature and a humidity in the atmospheric environment. , And the amount of each of a plurality of environmental factors including the rate of fouling is measured, and it is a simple environmental evaluation point calculated from the sum of the product of the evaluation point for each factor and the weighting factor for each factor, which is assigned by the amount. And With this configuration,
It is possible to quantify the influence of a plurality of environmental factors including the temperature, humidity, and fouling rate in the atmospheric environment in which the electronic circuit board is used on the deterioration of the electronic circuit board as a simple environmental evaluation point. Among the electronic circuit boards arranged in the control panel and the like, for example, a portion where dust is locally accumulated when the cooling wind hits is in a state where the influence of the environment is concentrated,
In such a portion, corrosion disconnection of the conductor metal and deterioration of insulation occur early. By determining the deterioration state of the electronic circuit board from the simple environmental evaluation points obtained from the environmental factors including the contamination rate suitable for determining the local environmental harm degree, a more accurate deterioration life diagnosis can be performed. It becomes possible.

【００１３】請求項４記載の発明は、請求項１又は２記
載の劣化度測定キットによる電子回路基板の劣化寿命診
断法において、前記指標値を求めるための温度及び湿度
の各データは、前記電子回路基板が使用されている地域
の地域気象情報、又は前記電子回路基板が使用されてい
る場所が空調管理されている場合は温度、湿度の管理値
で代替し、前記海塩粒子のデータは、前記電子回路基板
が使用されている場所から地図上で測定できる海岸まで
の直線距離で代替してなることを要旨とする。この構成
により、実際の環境測定データを用いて求めた指標値
（環境評価点）に基づく劣化診断より精度が若干落ちる
のみで、温・湿度のデータ解析や海塩粒子の分析が省略
されて短時間で診断結果が得られる。According to a fourth aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to the first or second aspect, each of the temperature and humidity data for obtaining the index value is the electronic data. Regional weather information of the area where the circuit board is used, or if the place where the electronic circuit board is used is air-conditioned, substitute with the management value of temperature and humidity, and the data of the sea salt particles, The gist of the present invention is to substitute a straight-line distance from a place where the electronic circuit board is used to a coast which can be measured on a map. With this configuration, the accuracy is slightly lower than the deterioration diagnosis based on the index value (environmental evaluation point) obtained using the actual environmental measurement data, but the data analysis of temperature and humidity and the analysis of sea salt particles are omitted, and the accuracy is shortened. Diagnosis results can be obtained in time.

【００１４】請求項５記載の発明は、請求項１，２，３
又は４記載の劣化度測定キットによる電子回路基板の劣
化寿命診断法において、前記指標値の関数として定式化
した電子回路基板の劣化指標値の経時変化式に、前記指
標値を当てはめて前記電子回路基板の劣化状態を判定す
ることを要旨とする。この構成により、環境有害度を環
境評価点又は簡易環境評価点等の指標値として定量化
し、電子回路基板の劣化指標値の経時変化を、この指標
値の関数として定式化したことで、あらゆる環境におけ
る電子回路基板の劣化寿命診断を行うことが可能とな
る。[0014] The invention according to claim 5 is the invention according to claims 1, 2, and 3.
Or, in the method of diagnosing deterioration life of an electronic circuit board using the deterioration degree measurement kit according to 4, the index value is applied to a time-dependent change equation of the deterioration index value of the electronic circuit board formulated as a function of the index value. The gist of the present invention is to determine the deterioration state of the substrate. With this configuration, the environmental harmfulness is quantified as an index value such as an environmental evaluation point or a simple environmental evaluation point, and the change over time of the deterioration index value of the electronic circuit board is formulated as a function of this index value, so that it can be used in any environment. It is possible to diagnose the deterioration life of the electronic circuit board in the above.

【００１５】請求項６記載の発明は、請求項１乃至５の
何れかに記載の劣化度測定キットによる電子回路基板の
劣化寿命診断法において、前記劣化度測定キット内に
は、前記診断者が回収して分析する測定試料、この測定
試料を支持する治具、前記測定試料を保管する試料保管
ケース、測定マニュアル及び調査票が収納され、これら
の収納品のうちの前記測定試料は、温度記録計、湿度記
録計、酸性ガス測定用のアルカリろ紙、アルカリ性ガス
測定用の酸性ろ紙、海塩粒子測定布、前記電子回路基板
の導体金属と同等の金属からなる金属板、汚損度測定布
及び汚損速度測定暴露基板を含むことを要旨とする。こ
の構成により、ユーザが環境評価点による劣化診断を希
望する場合には、温度記録計、湿度記録計、アルカリろ
紙、酸性ろ紙、海塩粒子測定布及び金属板を大気環境に
所定期間暴露した後、診断者に返送する。また、局部的
に塵埃が推積した箇所の劣化診断を希望する場合には、
簡易環境評価点を求めるために、大気環境に所定期間暴
露した汚損速度測定暴露基板及び塵埃推積箇所を拭き取
った汚損度測定布を診断者に返送する。これにより、ユ
ーザは、電子回路基板が使用されている大気環境の環境
因子の劣化に及ぼす影響を適切に考慮に入れた診断結果
及び処方箋を得ることが可能となる。According to a sixth aspect of the present invention, there is provided a method for diagnosing deterioration life of an electronic circuit board using the degradation degree measuring kit according to any one of the first to fifth aspects. A measurement sample to be collected and analyzed, a jig supporting the measurement sample, a sample storage case for storing the measurement sample, a measurement manual, and a survey form are stored, and the measurement sample among these storage items is a temperature record. Meter, humidity recorder, alkaline filter paper for acidic gas measurement, acidic filter paper for alkaline gas measurement, sea salt particle measurement cloth, metal plate made of metal equivalent to conductive metal of the electronic circuit board, contamination degree measurement cloth and contamination It is essential to include the speed measurement exposure substrate. With this configuration, when the user desires the deterioration diagnosis based on the environmental evaluation points, after exposing the temperature recorder, the humidity recorder, the alkali filter paper, the acid filter paper, the sea salt particle measurement cloth and the metal plate to the atmospheric environment for a predetermined period, , Return to diagnostician. Also, if you want to diagnose the deterioration of the location where dust is locally accumulated,
In order to obtain a simplified environmental evaluation point, the contamination rate measurement exposure substrate exposed to the air environment for a predetermined period and the contamination degree measurement cloth wiped off the dust accumulation point are returned to the diagnostician. As a result, the user can obtain a diagnosis result and a prescription that appropriately take into account the influence of the electronic circuit board on the deterioration of environmental factors in the atmospheric environment.

【００１６】請求項７記載の発明は、請求項１乃至６の
何れかに記載の劣化度測定キットによる電子回路基板の
劣化寿命診断法において、前記劣化度測定キット内の測
定マニュアルには、前記測定試料一覧、前記測定試料の
選択方法、前記測定試料の取扱方法、及び導体の腐食断
線寿命診断に必要な電子回路基板導体表面に印刷されて
いるソルダレジストの厚さレベルを判定するための色見
本が掲載されていることを要旨とする。この構成によ
り、測定試料の選択方法では、ユーザが環境評価点に基
づく劣化診断か又は簡易環境評価点に基づく劣化診断か
の何れかを希望する場合の測定試料の選択が容易にな
る。導体の腐食特性は導体表面に印刷されているソルダ
レジストの膜厚に左右されるので、劣化診断にはソルダ
レジストの厚さ情報が不可欠である。色見本をユーザに
提示することで、導体表面に印刷されているソルダレジ
ストの厚さレベル判定が容易になる。According to a seventh aspect of the present invention, there is provided a method for diagnosing the deterioration life of an electronic circuit board using the deterioration degree measuring kit according to any one of the first to sixth aspects. A list of measurement samples, a method for selecting the measurement sample, a method for handling the measurement sample, and a color for judging the thickness level of the solder resist printed on the conductor surface of the electronic circuit board necessary for diagnosing the corrosion and disconnection life of the conductor. The gist is that a sample is posted. With this configuration, in the method for selecting a measurement sample, it is easy to select the measurement sample when the user desires either the degradation diagnosis based on the environmental evaluation points or the degradation diagnosis based on the simple environmental evaluation points. Since the corrosion characteristics of the conductor depend on the thickness of the solder resist printed on the conductor surface, information on the thickness of the solder resist is indispensable for deterioration diagnosis. By presenting the color sample to the user, it becomes easy to determine the thickness level of the solder resist printed on the conductor surface.

【００１７】請求項８記載の発明は、請求項５記載の劣
化度測定キットによる電子回路基板の劣化寿命診断法に
おいて、前記劣化指標値が前記電子回路基板の導体金属
の腐食厚さである場合は、前記指標値は前記環境評価点
とし、この環境評価点の関数として定式化した暴露期間
に対する前記電子回路基板の導体金属の腐食厚さの関係
式に、前記環境評価点を当てはめて当該電子回路基板の
導体の腐食劣化状態を判定することを要旨とする。この
構成により、劣化指標値が導体金属の腐食厚さである場
合、環境評価点を求めることで電子回路基板の劣化寿命
診断を行うことが可能となる。According to an eighth aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to the fifth aspect, the deterioration index value is a corrosion thickness of a conductive metal of the electronic circuit board. The index value is the environmental evaluation point, and the electronic evaluation is performed by applying the environmental evaluation point to a relational expression of the corrosion thickness of the conductive metal of the electronic circuit board with respect to the exposure period formulated as a function of the environmental evaluation point. The gist of the present invention is to determine the state of corrosion deterioration of a conductor of a circuit board. With this configuration, when the deterioration index value is the corrosion thickness of the conductive metal, the deterioration life diagnosis of the electronic circuit board can be performed by obtaining the environmental evaluation point.

【００１８】請求項９記載の発明は、請求項８記載の劣
化度測定キットによる電子回路基板の劣化寿命診断法に
おいて、前記環境評価点の関数として定式化した暴露期
間に対する導体金属の腐食厚さの関係曲線が導体金属表
面に印刷されたソルダレジストの厚さレベル毎に用意さ
れていることを要旨とする。この構成により、導体金属
の腐食速度は、環境評価点が同じでもソルダレジストの
厚さレベルによって異なることから、暴露期間に対する
導体金属の腐食厚さの関係曲線をソルダレジストの厚さ
レベル毎に設けることで、導体表面にソルダレジストが
印刷されていても電子回路基板の劣化寿命を精度良く診
断することが可能となる。According to a ninth aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measurement kit according to the eighth aspect, the corrosion thickness of the conductive metal with respect to the exposure period formulated as a function of the environmental evaluation point. The point is that the relationship curve is prepared for each thickness level of the solder resist printed on the conductive metal surface. With this configuration, the corrosion rate of the conductor metal differs depending on the thickness level of the solder resist even if the environmental evaluation point is the same. Therefore, a relationship curve of the corrosion thickness of the conductor metal with respect to the exposure period is provided for each solder resist thickness level. This makes it possible to accurately diagnose the deterioration life of the electronic circuit board even if the solder resist is printed on the conductor surface.

【００１９】請求項１０記載の発明は、請求項５記載の
劣化度測定キットによる電子回路基板の劣化寿命診断法
において、前記劣化指標値が前記電子回路基板のコネク
タの接触抵抗である場合は、前記指標値は前記環境評価
点とし、この環境評価点の関数として定式化した暴露期
間に対する前記コネクタの接触抵抗変化の関係式に、前
記環境評価点を当てはめて、当該コネクタの劣化状態を
判定することを要旨とする。この構成により、劣化指標
値が電子回路基板のコネクタの接触抵抗である場合、環
境評価点を求めることでコネクタの劣化状態を診断する
ことが可能となる。According to a tenth aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to the fifth aspect, when the deterioration index value is a contact resistance of a connector of the electronic circuit board, The index value is the environmental evaluation point, and the environmental evaluation point is applied to the relational expression of the change in the contact resistance of the connector with respect to the exposure period formulated as a function of the environmental evaluation point to determine the deterioration state of the connector. That is the gist. With this configuration, when the deterioration index value is the contact resistance of the connector on the electronic circuit board, the deterioration state of the connector can be diagnosed by obtaining the environmental evaluation point.

【００２０】請求項１１記載の発明は、請求項５記載の
劣化度測定キットによる電子回路基板の劣化寿命診断法
において、前記劣化指標値が前記電子回路基板の導体金
属の腐食厚さである場合は、前記指標値は前記簡易環境
評価点とし、この簡易環境評価点の関数として定式化し
た暴露期間に対する前記電子回路基板の導体金属の腐食
厚さの関係式に、前記簡易環境評価点を当てはめて当該
電子回路基板の導体の腐食劣化状態を判定することを要
旨とする。この構成により、劣化指標値が導体金属の腐
食厚さである場合、指標値として簡易環境評価点を用い
ることで、局部的な腐食劣化状態を精度良く診断するこ
とが可能となる。According to an eleventh aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to the fifth aspect, the deterioration index value is a corrosion thickness of a conductive metal of the electronic circuit board. The index value is the simple environment evaluation point, and the simple environment evaluation point is applied to a relational expression of the corrosion thickness of the conductive metal of the electronic circuit board with respect to the exposure period formulated as a function of the simple environment evaluation point. Accordingly, the gist of the present invention is to judge the corrosion deterioration state of the conductor of the electronic circuit board. With this configuration, when the deterioration index value is the corrosion thickness of the conductive metal, it is possible to accurately diagnose the local corrosion deterioration state by using the simple environmental evaluation point as the index value.

【００２１】請求項１２記載の発明は、請求項１１記載
の劣化度測定キットによる電子回路基板の劣化寿命診断
法において、前記簡易環境評価点の関数として定式化し
た暴露期間に対する導体金属の腐食厚さの関係曲線が導
体金属表面に印刷されたソルダレジストの厚さレベル毎
に用意されていることを要旨とする。この構成により、
指標値として簡易環境評価点を用いた場合において、請
求項９記載の発明の作用と略同様の作用が生じる。According to a twelfth aspect of the present invention, in the method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measurement kit according to the eleventh aspect, the corrosion thickness of the conductive metal with respect to the exposure period formulated as a function of the simplified environmental evaluation point is provided. The point is that a relationship curve of the thickness is prepared for each thickness level of the solder resist printed on the conductive metal surface. With this configuration,
When the simple environment evaluation point is used as the index value, substantially the same operation as the operation according to the ninth aspect of the present invention occurs.

【００２２】請求項１３記載の発明は、請求項５記載の
劣化度測定キットによる電子回路基板の劣化寿命診断法
において、前記劣化指標値が前記電子回路基板の導体間
の絶縁抵抗である場合は、前記指標値は前記電子回路基
板表面の汚損度とし、この汚損度の経時変化を予め求め
るとともに温度・湿度の組み合わせ毎の汚損度と絶縁抵
抗の関係式に前記汚損度を当てはめて当該電子回路基板
の導体間の絶縁劣化状態を判定することを要旨とする。
この構成により、電子回路基板表面の絶縁劣化は、直接
には、イオン性物質の付着に起因する。また、汚損度と
絶縁抵抗の関係は温度・湿度により異なる。劣化指標値
が導体間の絶縁抵抗である場合、指標値としてイオン性
物質の付着量に相当する汚損度を用い、また汚損度と絶
縁抵抗の関係式を温度・湿度の組み合わせ毎に用意する
ことで、電子回路基板の使用環境に応じた精度の良い絶
縁劣化診断を行うことが可能となる。According to a thirteenth aspect of the present invention, in the method for diagnosing the deterioration life of an electronic circuit board using the deterioration degree measuring kit according to the fifth aspect, it is preferable that the deterioration index value is an insulation resistance between conductors of the electronic circuit board. The index value is the degree of contamination of the surface of the electronic circuit board, and the change with time of the degree of contamination is determined in advance, and the degree of contamination is applied to a relational expression of the degree of contamination and insulation resistance for each combination of temperature and humidity, and the degree of contamination is applied to the electronic circuit board. The gist of the present invention is to determine the state of insulation deterioration between conductors of a substrate.
With this configuration, the insulation deterioration on the surface of the electronic circuit board is directly caused by the attachment of the ionic substance. The relationship between the degree of contamination and the insulation resistance differs depending on the temperature and humidity. If the deterioration index value is the insulation resistance between conductors, use the degree of contamination corresponding to the amount of ionic substance attached as the index value, and prepare a relational expression between the degree of contamination and insulation resistance for each combination of temperature and humidity. Thus, it is possible to perform an accurate insulation deterioration diagnosis according to the use environment of the electronic circuit board.

【００２３】[0023]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.

【００２４】図１乃至図５は、本発明の第１の実施の形
態を示す図である。まず、図１を用いて、本実施の形態
における診断業務のフローを説明する。診断者はユーザ
に劣化度測定キット１を無償で供与する。劣化度測定キ
ット１内には、診断者が回収して分析する測定試料、測
定試料を支持する治具、測定試料を保管する試料保管ケ
ース、測定マニュアル及び調査票が収納されている。上
記の測定試料は、温度記録計、湿度記録計、酸性ガス測
定用のアルカリろ紙、アルカリ性ガス測定用の酸性ろ
紙、海塩粒子測定布、電子回路基板の導体金属と同等の
金属からなる金属板、汚損度測定布及び汚損速度測定暴
露基板からなっている。また、測定マニュアルには、測
定試料一覧、測定試料の選択方法、測定試料の取扱方
法、及び導体の腐食断線寿命診断に必要な電子回路基板
導体表面に印刷されているソルダレジストの厚さレベル
を判定するための色見本が掲載されている。測定試料の
選択方法により、ユーザは、環境評価点に基づく劣化診
断か又は簡易環境評価点に基づく劣化診断かの何れかを
希望する場合の測定試料の選択が容易になる。ユーザ
は、この劣化度測定キット１内から選択した測定試料を
電気機器が設置されている大気環境に１〜３ヶ月暴露
し、環境測定２を行う。暴露終了後、温度、湿度を測定
した記録、腐食性ガスを捕捉した酸性ろ紙、アルカリ性
ろ紙、海塩粒子を捕捉した海塩粒子測定布を診断者に送
付する。ユーザが短時間で診断結果を知りたいときは、
温度、湿度は保有するデータか設置地域の気象データで
代替し、電子回路基板が使用されている場所が空調管理
されている場合は温度、湿度の管理値で代替することが
できる。また、海塩粒子のデータは、電子回路基板が使
用されている場所から地図上で測定できる海岸までの直
線距離で代替することができる。診断者はユーザから送
付された測定試料を分析及びデータ処理し、その結果を
環境評価点算出部４に送り当該環境の環境評価点を算出
する。環境評価点を、劣化診断部５に格納されている環
境評価点の関数として定式化した電子回路基板の劣化指
標値の経時変化式に代入して、現状の劣化程度及び今後
の劣化進行程度を判定３し、診断結果と対策案を盛り込
んだ処方箋６をユーザに有償で提供する。診断者は、劣
化度測定キット１内の使用してしまった測定試料を無償
で補充し、次回診断に備える。FIG. 1 to FIG. 5 are views showing a first embodiment of the present invention. First, the flow of a diagnostic operation according to the present embodiment will be described with reference to FIG. The diagnostician provides the user with the deterioration degree measurement kit 1 free of charge. The degradation degree measurement kit 1 contains a measurement sample to be collected and analyzed by a diagnostician, a jig for supporting the measurement sample, a sample storage case for storing the measurement sample, a measurement manual, and a survey form. The above measurement samples are a temperature recorder, a humidity recorder, an alkaline filter paper for measuring an acidic gas, an acidic filter paper for measuring an alkaline gas, a sea salt particle measuring cloth, and a metal plate made of a metal equivalent to a conductive metal of an electronic circuit board. , A contamination degree measurement cloth and a contamination rate measurement exposure substrate. In addition, the measurement manual includes the list of measurement samples, the selection method of the measurement sample, the handling method of the measurement sample, and the thickness level of the solder resist printed on the conductor surface of the electronic circuit board conductor required for diagnosing the corrosion and disconnection life of the conductor. A color sample for judgment is posted. According to the method of selecting a measurement sample, the user can easily select a measurement sample when the user desires either the deterioration diagnosis based on the environmental evaluation points or the deterioration diagnosis based on the simple environmental evaluation points. The user exposes the measurement sample selected from the deterioration degree measurement kit 1 to the atmospheric environment in which the electric equipment is installed for 1 to 3 months, and performs the environment measurement 2. After the exposure is completed, a record of measuring the temperature and humidity, an acid filter paper, an alkaline filter paper capturing the corrosive gas, and a sea salt particle measuring cloth capturing the sea salt particles are sent to the diagnostician. When the user wants to know the diagnosis result in a short time,
The temperature and humidity can be substituted by the stored data or the weather data of the installation area, and when the place where the electronic circuit board is used is controlled by air conditioning, it can be substituted by the management values of temperature and humidity. In addition, the data of the sea salt particles can be replaced with the linear distance from the place where the electronic circuit board is used to the coast which can be measured on a map. The diagnostician analyzes and processes the measurement sample sent from the user, sends the result to the environment evaluation point calculation unit 4, and calculates the environment evaluation point of the environment. By substituting the environmental evaluation points into a time-varying equation of the deterioration index value of the electronic circuit board formulated as a function of the environmental evaluation points stored in the deterioration diagnosis unit 5, the present deterioration degree and the future deterioration progress degree are determined. Judgment 3 is made, and a prescription 6 containing a diagnosis result and a measure is provided to the user for a fee. The diagnostician refills the used measurement sample in the deterioration degree measurement kit 1 free of charge and prepares for the next diagnosis.

【００２５】環境評価点算出部４と劣化診断部５の構成
について図２を用いて説明する。まず、環境評価点算出
部４の構成から説明する。ユーザから送付された測定試
料の分析結果は環境因子入力装置１１により入力され、
因子別評価点演算部１２に送られる。因子別評価点演算
部１２は因子別評価点データベース１３により、環境因
子の量と因子別評価点との関係を示すデータを読取り、
因子別評価点を算出する。因子別評価点データベース１
３には、図３に示すようなクラス分けされた環境因子の
量による因子別評価点のテーブルが格納されている。テ
ーブル中の腐食性ガスの中で酸性ガスであるＳＯ2 ，Ｈ
2Ｓ，ＮＯ2 ，Ｃｌ- の量はアルカリろ紙の分析値であ
り、アルカリ性ガスであるＮＨ3 の量は酸性ろ紙の分析
値である。Ｃｌ- としてアルカリろ紙に検出される腐食
性ガスはＣｌ2 ，ＨＣｌ等の塩化物ガスである。The configurations of the environmental evaluation point calculation section 4 and the deterioration diagnosis section 5 will be described with reference to FIG. First, the configuration of the environmental evaluation point calculation unit 4 will be described. The analysis result of the measurement sample sent from the user is input by the environmental factor input device 11,
It is sent to the factor-based evaluation point calculation unit 12. The factor-by-factor evaluation point calculation unit 12 reads, from the factor-by-factor evaluation point database 13, data indicating the relationship between the amount of environmental factors and the factor-by-factor evaluation points,
Calculate the evaluation points for each factor. Factor-based evaluation score database 1
3 stores a table of evaluation points by factor based on the amount of environmental factors classified as shown in FIG. Among the corrosive gases in the table, acid gases such as SO 2 and H
The amounts of 2 S, NO 2 , and Cl − are analytical values of alkaline filter paper, and the amount of NH 3 as an alkaline gas is an analytical value of acidic filter paper. Cl - as corrosive gas detected in an alkaline filter paper is chloride gas such as Cl 2, HCl.

【００２６】環境評価点演算部１４では、因子別評価点
演算部１２にて算出された各因子別の評価点ｅに対して
因子別重み係数データベース１５から因子別重み係数ｋ
を読み出し、式（１）により環境評価点Ｅを算出する。In the environmental evaluation point calculating section 14, the factor-specific weighting coefficient k is stored in the factor-specific weighting coefficient database 15 for the factor-specific evaluation point e calculated by the factor-specific evaluation point calculating section 12.
Is read, and the environmental evaluation point E is calculated by the equation (1).

【００２７】[0027]

【数１】 因子別重み係数データベース１５には、診断対象部位の
構成金属と当該環境の支配的な腐食性ガスの組み合わせ
により予め決められた重み係数のテーブルが格納されて
いる。因子別評価点データベース１３に格納されている
因子別評価点は、銅、銀、アルミニウム、鉄、ニッケ
ル、クロム、亜鉛等の金属全般の腐食劣化の予測に適用
することができるが、例えば、地熱発電所や下水処理場
等の硫化水素ガスが支配的な環境では銅の腐食速度が非
常に大きいため、因子別評価点データベース１３に格納
された因子別評価点による診断では、銅を構成金属とす
る部位の診断精度が低下する。例えば、電子回路基板の
場合、銅で構成される導体の腐食診断の場合、硫化水素
ガス因子別評価点に乗ずる重み係数は適切な数値に、他
の因子別評価点の重み係数は１に設定されている。同様
に、金属と環境因子の組み合わせ毎に設定された各因子
別の重み係数が因子別重み係数データベース１５に格納
されている。(Equation 1) The factor-specific weighting factor database 15 stores a table of weighting factors determined in advance by a combination of a constituent metal of a diagnosis target site and a corrosive gas that is dominant in the environment. The factor-based evaluation points stored in the factor-based evaluation point database 13 can be applied to the prediction of corrosion deterioration of metals such as copper, silver, aluminum, iron, nickel, chromium, and zinc. In an environment where hydrogen sulfide gas is dominant, such as in a power plant or a sewage treatment plant, the corrosion rate of copper is extremely high. Therefore, in the diagnosis based on the factor-specific evaluation points stored in the factor-specific evaluation point database 13, copper is regarded as a constituent metal. The accuracy of diagnosis of the site to be deteriorated. For example, in the case of an electronic circuit board, in the case of a corrosion diagnosis of a conductor made of copper, the weighting factor for multiplying the evaluation point by hydrogen sulfide gas factor is set to an appropriate value, and the weighting factor of other evaluation points by factor is set to 1. Have been. Similarly, the weighting factor for each factor set for each combination of metal and environmental factor is stored in the weighting factor database 15 for each factor.

【００２８】次に、劣化診断部５の構成を説明する。環
境評価点演算部１４で算出された環境評価点Ｅは、劣化
指標値算出部１６に送られる。劣化指標値算出部１６で
は、劣化寿命診断関数データベース１７に格納されてい
る環境評価点Ｅと暴露された期間ｄ（日数）の関数であ
る劣化指標値の経時変化式（２）に、環境評価点Ｅと暴
露期間ｄを代入して現状の劣化指標値Ｆを算出し、診断
結果表示部１８に診断結果を表示する。劣化寿命診断関
数の概念を図４に示す。Next, the configuration of the deterioration diagnosis section 5 will be described. The environmental evaluation point E calculated by the environmental evaluation point calculator 14 is sent to the deterioration index value calculator 16. The deterioration index value calculation unit 16 calculates the environmental evaluation point E stored in the deterioration life diagnosis function database 17 and the deterioration index value as a function of the exposure period d (number of days) as a function of the time-dependent change expression (2). The current deterioration index value F is calculated by substituting the point E and the exposure period d, and the diagnosis result is displayed on the diagnosis result display unit 18. FIG. 4 shows the concept of the deterioration life diagnosis function.

【００２９】 Ｆ＝ｆ（Ｅ，ｄ） …（２） 電子回路基板の導体金属の腐食断線診断の劣化指標値は
腐食厚さである。したがって、劣化寿命診断関数データ
ベース１７に格納されている導体の腐食厚さの劣化寿命
診断関数を用いて診断を行う。腐食厚さの腐食診断関数
は暴露された時間ｄの平方根で一次式として表され、一
次式の各係数は環境評価点の多項式として表される。つ
まり、一次式の係数をαとβとした場合、導体の腐食厚
さＦは、（３）式で示される。F = f (E, d) (2) The deterioration index value of the corrosion breakage diagnosis of the conductor metal of the electronic circuit board is the corrosion thickness. Therefore, the diagnosis is performed using the deterioration life diagnosis function of the corrosion thickness of the conductor stored in the deterioration life diagnosis function database 17. The corrosion diagnostic function of the corrosion thickness is expressed as a linear expression by the square root of the exposure time d, and each coefficient of the linear expression is expressed as a polynomial of the environmental evaluation point. That is, assuming that the coefficients of the linear equation are α and β, the corrosion thickness F of the conductor is expressed by equation (3).

【００３０】 Ｆ＝α（Ｅ）・√ｄ＋β（Ｅ） …（３） 図５に、劣化指標値が導体腐食厚さである場合の導体の
劣化寿命診断関数の概念図を示した。導体パターンの厚
さは電子回路基板により１８μｍ，３５μｍ等様々であ
るが、（３）式のＦに寿命と判定する腐食厚さ限界値Ｆ
L を代入すると、当該環境で寿命と判定する腐食厚さに
到る期間ｄL を予測することができる。また、電子回路
基板の導体表面にはソルダレジストが印刷されている
が、ソルダレジストの厚さのレベルによって環境評価点
が同じでも導体の腐食速度が異なるため、図５に示すよ
うに、ソルダレジストの厚さレベル別に複数の関数が格
納されている。例えば、ソルダレジストが２μｍ以下の
場合は関数Ｆ1＝ｆ1（Ｅ，ｄ）を、厚くなるにつれて関
数をＦ2＝ｆ2（Ｅ，ｄ），Ｆ3＝ｆ3（Ｅ，ｄ）と使い分
けて診断する。F = α (E) · √d + β (E) (3) FIG. 5 shows a conceptual diagram of a function for diagnosing the deterioration life of the conductor when the deterioration index value is the conductor corrosion thickness. The thickness of the conductor pattern varies depending on the electronic circuit board, such as 18 μm and 35 μm.
By substituting L , it is possible to predict a period d L which reaches a corrosion thickness determined to be a life in the environment. Solder resist is printed on the conductor surface of the electronic circuit board. However, the corrosion rate of the conductor is different depending on the thickness of the solder resist even if the environmental evaluation point is the same. Therefore, as shown in FIG. A plurality of functions are stored for each thickness level. For example, when the thickness of the solder resist is 2 μm or less, the function is expressed as F 1 = f 1 (E, d), and as the thickness increases, the functions are expressed as F 2 = f 2 (E, d) and F 3 = f 3 (E, d). Diagnose properly.

【００３１】診断対象電子回路基板のソルダレジスト厚
さの判定は、劣化度測定キット１内の測定マニュアルに
掲載されたソルダレジスト厚さレベル判定色見本により
ユーザが判定する。ソルダレジストの厚さは、パターン
幅、パターン配線により異なるが、一般にパターン幅が
小さい程薄く、連続パターンより孤立パターンの方が薄
く印刷される。したがって、ソルダレジスト厚さレベル
は最も薄い部分で判定する。色見本は緑色のソルダレジ
ストから導体金属である銅の色が透過する程度を、ソル
ダレジストの厚さレベル別に表示してある。The determination of the solder resist thickness of the electronic circuit board to be diagnosed is made by the user based on the solder resist thickness level determination color sample described in the measurement manual in the deterioration degree measurement kit 1. The thickness of the solder resist varies depending on the pattern width and the pattern wiring. In general, the smaller the pattern width is, the thinner the printed pattern is. Therefore, the solder resist thickness level is determined based on the thinnest part. The color sample shows the degree to which the color of copper as a conductive metal is transmitted from the green solder resist for each solder resist thickness level.

【００３２】次に、電子回路基板のコネクタの劣化寿命
診断関数について説明する。劣化指標値は接触抵抗であ
る。したがって、劣化寿命診断関数データベース１７に
格納されている劣化寿命診断関数は、環境評価点Ｅと暴
露期間ｄを代入することで接触抵抗が算出できる関数で
ある。この関数もコネクタの材質（金めっき、錫めっき
等）、接触圧別に複数の関数が格納されている。Next, a function for diagnosing the deterioration life of the connector of the electronic circuit board will be described. The deterioration index value is a contact resistance. Therefore, the deterioration life diagnosis function stored in the deterioration life diagnosis function database 17 is a function that can calculate the contact resistance by substituting the environmental evaluation point E and the exposure period d. This function also stores a plurality of functions for each connector material (gold plating, tin plating, etc.) and contact pressure.

【００３３】以上のように、本実施の形態によれば、ユ
ーザが任意の時期に診断者から無償供与されている劣化
度測定キット１を使用して環境測定を実施するだけで、
診断者は測定結果から得られた環境評価点と期間を、予
め求めておいた劣化寿命診断関数に代入することにより
電子回路基板の劣化寿命診断ができる。これによりユー
ザは安い料金で、かつ製品基板を破壊することなく診断
結果を得ることができ、診断者もユーザが環境調査を実
施することで、低コストの診断を提供でき、劣化度測定
キットを無償供与することで診断ビジネスの拡販が容易
になる。As described above, according to the present embodiment, the user simply performs the environmental measurement at any time using the deterioration degree measurement kit 1 provided free of charge by the diagnostician.
The diagnostician can diagnose the deterioration life of the electronic circuit board by substituting the environmental evaluation points and the period obtained from the measurement results into the previously determined deterioration life diagnosis function. As a result, the user can obtain a diagnosis result at a low cost and without breaking the product board, and the diagnostician can provide a low-cost diagnosis by performing the environmental investigation by the user. Providing it free of charge facilitates sales expansion of the diagnostic business.

【００３４】本発明の第２の実施の形態を図６乃至図８
を用いて説明する。本実施の形態は、環境有害度を定量
化した指標値として簡易環境評価点を用いた劣化診断方
法である。劣化度測定キットにより大気環境因子である
温度、湿度、汚損速度の各々の量を測定し、その量によ
って割り付けた各因子別評価点と各因子別重み係数の積
の和から求めた値が簡易環境評価点である。汚損度は表
面に付着している汚損物質中のイオン性成分の塩化ナト
リウムの量に換算した値で、付着している総イオン量に
相当する値である。電子回路表面に環境中の腐食性ガス
や海塩粒子が吸着した塵埃が推積し、腐食や絶縁劣化の
原因となる。本実施の形態は、電子回路表面の汚損度を
測定することで、腐食性ガスと海塩粒子の影響程度を推
定する診断方法である。特に汚損度が環境有害度の指標
として有効な場合を説明する。制御盤内に収納された電
子回路基板の中で、例えば冷却風が当たり局部的に塵埃
が推積するような部分は環境が濃縮した状態になってお
り、このような部分で導体金属の腐食断線や絶縁低下が
早期に発生する。局部的な環境有害度を判定するのに適
した汚損度から求めた簡易環境評価点により、電子回路
基板の劣化状態を推定することで、より精度が高い電子
回路基板の劣化診断ができる。FIGS. 6 to 8 show a second embodiment of the present invention.
This will be described with reference to FIG. The present embodiment is a deterioration diagnosis method using a simple environmental evaluation point as an index value quantifying the degree of environmental harm. The amount of temperature, humidity, and fouling rate, which are the atmospheric environmental factors, are measured using the Deterioration Degree Measurement Kit, and the value obtained from the sum of the product of the evaluation points for each factor and the weighting factor for each factor assigned according to the amount is simplified. It is an environmental evaluation point. The degree of fouling is a value converted into the amount of sodium chloride as an ionic component in the fouling substance adhering to the surface, and is a value corresponding to the total amount of adhering ions. Dust adsorbed by corrosive gas or sea salt particles in the environment on the electronic circuit surface accumulates, causing corrosion and insulation deterioration. The present embodiment is a diagnostic method for estimating the degree of influence of corrosive gas and sea salt particles by measuring the degree of contamination on the surface of an electronic circuit. In particular, a case where the pollution degree is effective as an index of environmental harmfulness will be described. In the electronic circuit board housed in the control panel, for example, the area where dust is locally accumulated when the cooling air hits is in a state where the environment is concentrated. Disconnection or insulation deterioration occurs early. By estimating the deterioration state of the electronic circuit board from the simple environmental evaluation points obtained from the pollution degree suitable for determining the local environmental harm degree, the deterioration diagnosis of the electronic circuit board can be performed with higher accuracy.

【００３５】本実施の形態による診断フローは、第１の
実施の形態の図１と同様である。環境評価点（簡易環境
評価点）算出部４Ａと劣化診断部５Ａの構成を図６に示
す。ユーザは無償供与された劣化度測定キット１内の測
定試料で１〜３ヶ月測定した温度、湿度記録と、やはり
１〜３ヶ月当該環境に暴露した汚損速度測定暴露基板
と、現状の汚損度を測定した汚損度測定布を診断者に送
付する。ユーザが短時間で診断結果を知りたいときは、
温度、湿度は保有するデータ又は設置地域の気象データ
で代替し、汚損速度は現状の汚損度を機器の稼働年数で
割った数値で代替することができる。この方法で汚損速
度を算出するときは、メンテナンスによる清掃の有無及
び時期を考慮し、できるだけ正確な汚損速度を算出す
る。The diagnosis flow according to this embodiment is the same as that of the first embodiment shown in FIG. FIG. 6 shows the configurations of the environment evaluation point (simple environment evaluation point) calculation unit 4A and the deterioration diagnosis unit 5A. The user records the temperature and humidity records measured for 1 to 3 months with the measurement sample in the degradation degree measurement kit 1 provided free of charge, the contamination rate measurement exposed substrate also exposed to the environment for 1 to 3 months, and the current contamination degree. Send the measured contamination measurement cloth to the diagnostician. When the user wants to know the diagnosis result in a short time,
The temperature and humidity can be replaced by the stored data or the weather data of the installation area, and the fouling rate can be replaced by a value obtained by dividing the current degree of fouling by the operating years of the equipment. When calculating the fouling speed by this method, the fouling speed is calculated as accurately as possible in consideration of the presence / absence and timing of cleaning by maintenance.

【００３６】ユーザから送付された測定試料の分析結果
は環境因子入力装置２１により入力され、簡易環境評価
点演算部２２に送られる。簡易環境評価点演算部２２は
因子別評価点データベース２３により、環境因子量と因
子別評価点との関係データを読取る。因子別評価点デー
タベース２３には、図７に示すようなクラス分けされた
環境因子の量による因子別評価点のテーブルが格納され
ており、簡易環境評価点演算部２２では、入力された環
境因子量に対応する因子別評価点から、式（４）により
簡易環境評価点Ｅs を算出する。The analysis result of the measurement sample sent from the user is input by the environmental factor input device 21 and sent to the simplified environmental evaluation point calculation unit 22. The simple environment evaluation point calculation unit 22 reads the relation data between the environmental factor amount and the evaluation score for each factor from the evaluation score database for each factor 23. The factor-specific evaluation point database 23 stores a table of factor-specific evaluation points based on the amount of environmental factors classified into classes as shown in FIG. 7. from factor based evaluation points corresponding to the amount, and calculates the simple environmental evaluation points E s by equation (4).

【００３７】[0037]

【数２】 次に、劣化診断部５Ａの構成を説明する。簡易環境評価
点演算部２２で算出された簡易環境評価点Ｅs は劣化指
標値算出部２４に送られる。劣化指標値算出部２４で
は、劣化寿命診断関数データベース２５に格納されてい
る簡易環境評価点Ｅs と暴露された期間ｄ（日数）の関
数である劣化指標値の経時変化式（５）に、簡易環境評
価点Ｅs と暴露期間ｄを代入して現状の劣化指標値Ｆを
算出し、診断結果表示部２６に診断結果を表示する。(Equation 2) Next, the configuration of the deterioration diagnosis unit 5A will be described. Simple environmental evaluation points E s calculated in simple environmental evaluation point calculation unit 22 is sent to the degradation index value calculating unit 24. In degradation index value calculating unit 24, the deterioration life diagnosis function database 25 periods exposed simplified environmental evaluation points E s stored in d aging type function is a degradation index value of the number of days (5), by substituting a simple environmental evaluation points E s and exposure period d to calculate the degradation index value F the current, and displays diagnostic results to the diagnostic result display unit 26.

【００３８】 Ｆ＝ｇ（Ｅ，ｄ） …（５） 電子回路基板の導体金属の腐食断線診断の劣化指標値は
腐食厚さである。したがって、劣化寿命診断関数データ
ベース２５に格納されている導体の腐食厚さの劣化寿命
診断関数を用いて診断を行う。（５）式のＦに寿命と判
定する腐食厚さ限界値ＦL を代入すると、当該環境で寿
命と判定する腐食厚さに到る期間ｄL を予測することが
できる。また、第１の実施の形態で述べたように、電子
回路基板の導体表面にはソルダレジストが印刷されてい
る。したがって、電子回路基板表面の汚損度が同じでも
腐食断線寿命は異なる。ソルダレジストの膜厚が薄くな
ると汚損物質中のイオン成分が導体に達する速度が加速
度的に大きくなり、腐食を加速する。したがって、図８
に示すように、ソルダレジストの厚さレベル別に複数の
関数が格納されている。例えば、ソルダレジストが２μ
ｍ以下の場合は関数Ｆ1＝ｇ1（Ｅs ，ｄ）を、厚くなる
につれて関数をＦ2＝ｇ2（Ｅs ，ｄ），Ｆ3＝ｇ
3（Ｅs ，ｄ）と使い分けて診断する。F = g (E, d) (5) The deterioration index value of the corrosion breakage diagnosis of the conductor metal of the electronic circuit board is the corrosion thickness. Therefore, the diagnosis is performed using the deterioration life diagnosis function of the corrosion thickness of the conductor stored in the deterioration life diagnosis function database 25. (5) Substituting determining corrosion thickness limit value F L and lifetime F of equation can predict the period d L leading to life and determines corrosion thickness in the environment. Further, as described in the first embodiment, a solder resist is printed on the conductor surface of the electronic circuit board. Therefore, even if the degree of contamination on the surface of the electronic circuit board is the same, the life of the corrosion breakage differs. When the thickness of the solder resist is reduced, the speed at which the ionic components in the fouling substance reach the conductor increases at an accelerated rate, accelerating corrosion. Therefore, FIG.
As shown in FIG. 5, a plurality of functions are stored for each solder resist thickness level. For example, if the solder resist is 2μ
m, the function is expressed as F 1 = g 1 (E s , d), and as the thickness increases, the function is expressed as F 2 = g 2 (E s , d) and F 3 = g
Diagnose using 3 (E s , d).

【００３９】診断対象電子回路基板のソルダレジスト厚
さの判定は、劣化度測定キット１内の測定マニュアルに
掲載されたソルダレジスト厚さレベル判定色見本により
ユーザが判定する。The determination of the solder resist thickness of the electronic circuit board to be diagnosed is made by the user based on the solder resist thickness level determination color sample described in the measurement manual in the deterioration degree measuring kit 1.

【００４０】以上のように、本実施の形態によれば、ユ
ーザが任意の時期に診断者から無償供与されている劣化
度測定キット１を使用して環境測定を実施するだけで、
診断者は測定結果から得られた簡易環境評価点と期間
を、予め求めておいた劣化寿命診断関数に代入すること
により電子回路基板の劣化寿命診断ができる。冷却ファ
ンにより風を外部から取り込んでいる盤内に収納され、
冷却風が直接当たり、環境中の塵埃が推積するような使
用環境の場合は、汚損度をベースにした簡易環境評価点
により環境有害度を判定し、簡易環境評価点により腐食
寿命を診断することで、精度の良い診断ができる。ま
た、汚損度は分析コストが安いため、非常に安い料金で
診断が可能である。汚損度自動測定装置をユーザに無償
供与すれば、インターネット等によるデータのやりとり
だけで、診断者が保有する診断データベースにより非常
に安価な診断ができる。As described above, according to the present embodiment, the user simply performs the environmental measurement at any time using the deterioration degree measurement kit 1 provided free of charge by the diagnostician.
The diagnostician can diagnose the deterioration life of the electronic circuit board by substituting the simplified environment evaluation points and the period obtained from the measurement results into a previously determined deterioration life diagnosis function. It is stored in the panel that takes in the wind from the outside by the cooling fan,
In the use environment where the cooling air hits directly and dust in the environment accumulates, determine the environmental harmfulness based on the simple environmental evaluation point based on the pollution degree, and diagnose the corrosion life based on the simple environmental evaluation point. Thus, accurate diagnosis can be made. In addition, since the analysis cost of the pollution degree is low, diagnosis can be performed at a very low rate. If the pollution degree automatic measurement device is provided to the user free of charge, diagnosis can be performed at very low cost by the diagnosis database held by the diagnostician only by exchanging data via the Internet or the like.

【００４１】本発明の第３の実施の形態を図９乃至図１
１を用いて説明する。本実施の形態は、環境有害度の指
標値を電子回路基板表面の汚損度とし、汚損度により電
子回路基板の導体間の絶縁抵抗を推定する劣化診断方法
である。劣化度測定キットにより大気環境因子である温
度、湿度、汚損度、汚損速度の各々の量を測定する。汚
損度は表面に付着している汚損物質中のイオン性成分を
塩化ナトリウムの量に換算した値で、付着している総イ
オン量に相当する値である。電子回路表面に環境中の腐
食性ガスや海塩粒子が吸着した塵埃が推積し、絶縁劣化
の原因となる。FIGS. 9 to 1 show a third embodiment of the present invention.
1 will be described. The present embodiment is a deterioration diagnosis method in which an index value of environmental harmfulness is used as the degree of contamination of the surface of an electronic circuit board, and the insulation resistance between conductors of the electronic circuit board is estimated based on the degree of contamination. Using the deterioration degree measurement kit, the amounts of temperature, humidity, pollution degree, and pollution rate, which are atmospheric environmental factors, are measured. The degree of fouling is a value obtained by converting an ionic component in a fouling substance adhering to the surface into an amount of sodium chloride, and is a value corresponding to the total amount of adhering ions. Dust adsorbed by corrosive gas or sea salt particles in the environment on the electronic circuit surface accumulates and causes insulation deterioration.

【００４２】本実施の形態による診断フローは、第１の
実施の形態の図１と同様であるが、環境評価点（簡易環
境評価点）算出部は必要ない。劣化診断部５Ｂの構成を
図９に示す。ユーザは無償供与された劣化度測定キット
１内の測定試料で１〜３ヶ月測定した温度、湿度記録
と、やはり１〜３ヶ月当該環境に暴露した汚損速度測定
暴露基板と、現状の汚損度を測定した汚損度測定布を診
断者に送付する。ユーザが短時間で診断結果を知りたい
ときは、温度、湿度は保有するデータ又は設置地域の気
象データで代替し、汚損速度は現状の汚損度を機器の稼
働年数で割った数値で代替することができる。この方法
で汚損速度を算出するときは、メンテナンスによる清掃
の有無及び時期を考慮し、できるだけ正確な汚損速度を
算出する。The diagnosis flow according to the present embodiment is the same as that of FIG. 1 of the first embodiment, but does not require an environment evaluation point (simple environment evaluation point) calculation unit. FIG. 9 shows the configuration of the deterioration diagnosis unit 5B. The user records the temperature and humidity records measured for 1 to 3 months with the measurement sample in the degradation degree measurement kit 1 provided free of charge, the contamination rate measurement exposed substrate also exposed to the environment for 1 to 3 months, and the current contamination degree. Send the measured contamination measurement cloth to the diagnostician. If the user wants to know the diagnosis result in a short time, replace the temperature and humidity with the stored data or the meteorological data of the installation area, and replace the fouling rate with the value obtained by dividing the current degree of pollution by the operating years of the equipment. Can be. When calculating the fouling speed by this method, the fouling speed is calculated as accurately as possible in consideration of the presence / absence and timing of cleaning by maintenance.

【００４３】ユーザから送付された測定試料の分析結果
は環境因子入力装置３１により入力され、劣化指標値算
出部３２に送られる。劣化指標値算出部３２は劣化寿命
診断関数データベース３３により、汚損度と劣化指標値
つまり絶縁抵抗値との関係データを読取る。劣化寿命診
断関数データベース３３には、電子回路基板上に所定間
隔で配線された所定の長さの電極間の汚損度Ｃと絶縁抵
抗Ｉの関係関数である劣化寿命診断関数Ｉ＝ｍ（Ｃ）が
格納されている。関係関数の模式図を図１０に示す。こ
の関数は、温・湿度により異なるので、温・湿度の組み
合わせ別の複数の劣化寿命診断関数Ｉ1＝ｍ1（Ｃ），Ｉ
2＝ｍ2（Ｃ），Ｉ3＝ｍ3（Ｃ）…が格納されている。当
該環境がなり得る最悪の温・湿度の組み合わせ条件での
劣化寿命診断関数に現状の電子回路基板表面の汚損度Ｃ
ａを代入して絶縁抵抗値Ｉａを算出し、劣化診断結果表
示部３４で現状の絶縁抵抗値Ｉａを表示する。The analysis result of the measurement sample sent from the user is input by the environmental factor input device 31 and sent to the deterioration index value calculation unit 32. The deterioration index value calculation unit 32 reads the relationship data between the degree of contamination and the deterioration index value, that is, the insulation resistance value, from the deterioration life diagnosis function database 33. The deterioration life diagnosis function database 33 includes a deterioration life diagnosis function I = m (C), which is a relational function between the degree of contamination C and insulation resistance I between electrodes of a predetermined length wired at predetermined intervals on the electronic circuit board. Is stored. FIG. 10 shows a schematic diagram of the relational function. Since this function varies depending on temperature and humidity, a plurality of deterioration life diagnosis functions I 1 = m 1 (C), I for each combination of temperature and humidity
2 = m 2 (C), I 3 = m 3 (C)... The deterioration degree C of the present electronic circuit board surface is calculated based on the deterioration life diagnosis function under the worst possible combination of temperature and humidity that the environment can be.
The insulation resistance value Ia is calculated by substituting “a”, and the current insulation resistance value Ia is displayed on the deterioration diagnosis result display section 34.

【００４４】次に、寿命診断を行う。電子回路基板の絶
縁抵抗値の寿命しきい値が格納されている寿命データベ
ース３６から寿命しきい値Ｉｃを読み出して、寿命判定
汚損度算出部３５に送る。劣化指標値算出部３２で使用
した劣化寿命診断関数データベース３３内の所定温・湿
度条件での汚損度と絶縁抵抗値の相関関数Ｉ＝ｍ
1（Ｃ）に寿命しきい値Ｉｃを代入して寿命判定汚損度
Ｃｃを算出し、差分汚損度算出手段としての差分汚損度
算出部３７に送る。劣化指標値算出部３２には、劣化寿
命診断関数データベース３３内に格納されている温・湿
度条件の異なる関数を選択する時に、温度、湿度が一致
する関数が無い場合には、温度より湿度による絶縁抵抗
の依存性が大きいことから、湿度の値ができるだけ一致
した条件で作成した関数を選択する機能が含まれてい
る。差分汚損度算出部３７では、環境因子入力装置３１
から送られた汚損度と寿命判定汚損度算出部３５から送
られた寿命判定汚損度との差を算出し、余寿命算出手段
としての余寿命算出部３８に送る。余寿命算出部３８で
は差分汚損度算出部３７から送られた差分汚損度を、環
境因子入力装置３１から送られた汚損速度で割って余寿
命を算出し、算出結果を診断結果表示部３９に表示す
る。図１１に汚損度の経時変化の図を示し、余寿命の算
出概念を示した。Next, a life diagnosis is performed. The life threshold value Ic is read from the life database 36 in which the life threshold value of the insulation resistance value of the electronic circuit board is stored, and is sent to the life judgment contamination degree calculation unit 35. Correlation function I = m between the degree of contamination and the insulation resistance value under predetermined temperature and humidity conditions in the deterioration life diagnosis function database 33 used in the deterioration index value calculation unit 32
1 The life threshold value Ic is substituted for (C) to calculate the life determination contamination degree Cc, and sends it to the differential contamination degree calculation unit 37 as the differential contamination degree calculation means. When selecting a function having different temperature and humidity conditions stored in the deterioration life diagnosis function database 33, the deterioration index value calculation unit 32 uses the humidity rather than the temperature if there is no function having the same temperature and humidity. Since the insulation resistance is highly dependent, a function for selecting a function created under conditions where the humidity values match as much as possible is included. In the differential pollution degree calculating unit 37, the environmental factor input device 31
The difference between the contamination degree sent from the controller and the life determination contamination degree sent from the life determination contamination degree calculator 35 is calculated and sent to the remaining life calculator 38 as a remaining life calculator. The remaining life calculating unit 38 calculates the remaining life by dividing the differential pollution degree sent from the differential pollution degree calculating unit 37 by the contamination speed sent from the environmental factor input device 31, and displays the calculation result in the diagnosis result display unit 39. indicate. FIG. 11 shows a diagram of the change over time in the degree of contamination, and illustrates the concept of calculating the remaining life.

【００４５】以上のように、本実施の形態によれば、ユ
ーザが任意の時期に診断者から無償供与されている劣化
度測定キットを使用して環境測定（温度、湿度、汚損
度、汚損速度測定）を実施するだけで、診断者は予め求
めておいた汚損度と絶縁抵抗の相関関数である劣化寿命
診断関数を用いて電子回路基板の絶縁劣化寿命診断がで
きる。温度・湿度の条件が異なる条件で作成した劣化寿
命診断関数により診断することから、ユーザの使用環境
に応じた精度の良い診断ができる。ユーザが絶縁感度の
高い部分の診断を希望する場合には、当該箇所の汚損度
及び汚損速度を測定することで局所的な絶縁診断が可能
になる。また、汚損度は分析コストが安いため、非常に
安い料金で診断ができ、さらに汚損度自動測定装置をユ
ーザに無償供与すれば、インターネット等によるデータ
のやりとりだけで、診断者が保有する診断データベース
により非常に安価な診断ができる。As described above, according to the present embodiment, the user can measure the environment (temperature, humidity, contamination degree, contamination rate, etc.) Only by performing the measurement), the diagnostician can diagnose the insulation deterioration life of the electronic circuit board by using the deterioration life diagnosis function which is a correlation function between the contamination degree and the insulation resistance which is obtained in advance. Since the diagnosis is performed using the deterioration life diagnosis function created under the condition of different temperature and humidity, accurate diagnosis according to the use environment of the user can be performed. If the user wants to diagnose a portion having a high insulation sensitivity, local insulation diagnosis can be performed by measuring the degree of contamination and the contamination speed of the portion. In addition, because the analysis cost of the pollution degree is low, diagnosis can be performed at a very low rate, and if the automatic pollution degree measurement device is provided to the user free of charge, the diagnosis database held by the diagnostician can be obtained simply by exchanging data via the Internet etc. Thus, a very inexpensive diagnosis can be made.

【００４６】[0046]

【発明の効果】以上説明したように、請求項１記載の発
明によれば、診断者は、診断対象となる電子回路基板の
ユーザに当該電子回路基板が使用されている大気環境の
有害度測定用の測定試料を含む所定の試料が収納された
劣化度測定キットを無償供与し、前記ユーザは、前記測
定試料を前記大気環境に所定期間暴露した後、当該測定
試料を前記診断者に返送し、前記診断者は、この返送さ
れた測定試料を分析して前記大気環境の有害度を表す指
標値を求め、この指標値を基に前記電子回路基板の劣化
状態を診断し、その診断結果及び処方箋を前記ユーザに
有償提示するようにしたため、ユーザが、無償供与され
た測定試料を任意の時期に大気環境に所定期間暴露した
後、診断者に返送するだけで、劣化寿命の診断が行われ
るので、電子回路基板の回収や破壊試験を行うことな
く、環境因子の劣化に及ぼす影響を考慮に入れた電子回
路基板の劣化寿命の診断を低コストで行うことができ
る。As described above, according to the first aspect of the present invention, the diagnostician can measure the harmfulness of the air environment in which the electronic circuit board is used by the user of the electronic circuit board to be diagnosed. A free degradation measurement kit containing a predetermined sample including a measurement sample for use is provided, and the user returns the measurement sample to the diagnostician after exposing the measurement sample to the atmospheric environment for a predetermined period. The diagnostician analyzes the returned measurement sample to obtain an index value indicating the degree of harmfulness of the atmospheric environment, diagnoses the deterioration state of the electronic circuit board based on the index value, Since the prescription is presented to the user for a fee, the user can expose the measurement sample provided free of charge to the atmospheric environment at any time for a predetermined period of time, and then return it to the diagnostician, thereby performing a diagnosis of the deterioration life. So the electronic circuit Without the collection and destruction test plate, it is possible to diagnose deterioration life of the electronic circuit board that takes into account the effect on the degradation of the environment factors at a low cost.

【００４７】請求項２記載の発明によれば、前記大気環
境の有害度を表す指標値は、大気環境中の温度、湿度、
酸性ガス及びアルカリ性ガスを含む腐食性ガス、並びに
海塩粒子を含む複数の環境因子の各々の量を測定し、そ
の量によって割り付けた各因子別評価点と各因子別重み
係数の積の和から算出した環境評価点としたため、温
度、湿度、腐食性ガス及び海塩粒子を含む複数の環境因
子が電子回路基板の劣化に及ぼす影響が、環境評価点と
して定量化されて、診断処理が容易となる。According to the second aspect of the present invention, the index value indicating the harmfulness of the atmospheric environment is the temperature, humidity,
Measure the amount of each of a plurality of environmental factors including corrosive gases including acid gas and alkaline gas, and sea salt particles, and calculate the sum of the products of the evaluation points for each factor and the weighting factors for each factor, which are assigned by the amount. Because the calculated environmental evaluation points were used, the effects of multiple environmental factors, including temperature, humidity, corrosive gas, and sea salt particles, on the deterioration of electronic circuit boards were quantified as environmental evaluation points, facilitating diagnostic processing. Become.

【００４８】請求項３記載の発明によれば、前記大気環
境の有害度を表す指標値は、大気環境中の温度、湿度、
及び汚損速度を含む複数の環境因子の各々の量を測定
し、その量によって割り付けた各因子別評価点と各因子
別重み係数の積の和から算出した簡易環境評価点とした
ため、上記請求項２記載の発明の効果と略同様の効果に
加えてさらに、局部的な環境有害度を判定するのに適し
た汚損速度を含む環境因子から求めた簡易環境評価点か
ら電子回路基板の劣化状態を判定することで、より精度
の高い劣化寿命診断を行うことができる。According to the third aspect of the present invention, the index value indicating the harmfulness of the atmospheric environment is the temperature, humidity,
And measuring the amount of each of a plurality of environmental factors including the rate of fouling, and as a simple environmental evaluation point calculated from the sum of the product of the evaluation points for each factor and the weighting factor for each factor assigned by the amount. In addition to the effects substantially similar to the effects of the invention described in 2, the deterioration state of the electronic circuit board is determined from a simple environmental evaluation point obtained from environmental factors including a contamination rate suitable for determining a local environmental harm degree. By making the determination, a more accurate deterioration life diagnosis can be performed.

【００４９】請求項４記載の発明によれば、前記指標値
を求めるための温度及び湿度の各データは、前記電子回
路基板が使用されている地域の地域気象情報、又は前記
電子回路基板が使用されている場所が空調管理されてい
る場合は温度、湿度の管理値で代替し、前記海塩粒子の
データは、前記電子回路基板が使用されている場所から
地図上で測定できる海岸までの直線距離で代替するよう
にしたため、実際の環境測定データを用いて求めた指標
値（環境評価点）に基づく劣化診断より精度が若干落ち
るのみで、温・湿度のデータ解析や海塩粒子の分析を省
略することができて、ユーザが診断料金をコントロール
することができる。According to the fourth aspect of the present invention, the temperature and humidity data for obtaining the index value may be regional weather information of a region where the electronic circuit board is used, or may be used by the electronic circuit board. If the place is air-conditioned, substitute temperature and humidity control values, and the sea salt particle data is a straight line from the place where the electronic circuit board is used to the coast that can be measured on a map. Because the distance is substituted, the accuracy is slightly lower than the deterioration diagnosis based on the index value (environmental evaluation point) obtained using the actual environmental measurement data. It can be omitted and the user can control the diagnostic fee.

【００５０】請求項５記載の発明によれば、前記指標値
の関数として定式化した電子回路基板の劣化指標値の経
時変化式に、前記指標値を当てはめて前記電子回路基板
の劣化状態を判定するようにしたため、環境有害度を環
境評価点又は簡易環境評価点等の指標値として定量化
し、電子回路基板の劣化指標値の経時変化を、この指標
値の関数として定式化したことで、あらゆる環境におけ
る電子回路基板の劣化寿命診断を行うことができる。According to the fifth aspect of the present invention, the deterioration state of the electronic circuit board is determined by applying the index value to a temporal change equation of the deterioration index value of the electronic circuit board formulated as a function of the index value. Therefore, by quantifying the degree of environmental harm as an index value such as an environmental evaluation point or a simple environmental evaluation point, and formulating the change over time of the deterioration index value of the electronic circuit board as a function of this index value, The deterioration life diagnosis of the electronic circuit board in the environment can be performed.

【００５１】請求項６記載の発明によれば、前記劣化度
測定キット内には、前記診断者が回収して分析する測定
試料、この測定試料を支持する治具、前記測定試料を保
管する試料保管ケース、測定マニュアル及び調査票が収
納され、これらの収納品のうちの前記測定試料は、温度
記録計、湿度記録計、酸性ガス測定用のアルカリろ紙、
アルカリ性ガス測定用の酸性ろ紙、海塩粒子測定布、前
記電子回路基板の導体金属と同等の金属からなる金属
板、汚損度測定布及び汚損速度測定暴露基板を含むよう
にしたため、ユーザは、複数の測定試料から希望する指
標値に応じた測定試料を選択することで、電子回路基板
が使用されている大気環境の環境因子の劣化に及ぼす影
響を適切に考慮に入れた診断結果及び処方箋を得ること
ができる。According to the sixth aspect of the present invention, the degradation degree measurement kit includes a measurement sample to be collected and analyzed by the diagnostician, a jig supporting the measurement sample, and a sample for storing the measurement sample. A storage case, a measurement manual and a survey form are stored, and the measurement sample among these storage items is a temperature recorder, a humidity recorder, an alkaline filter paper for acid gas measurement,
Acid filter paper for measuring alkaline gas, sea salt particle measurement cloth, a metal plate made of a metal equivalent to the conductive metal of the electronic circuit board, a pollution degree measurement cloth and a contamination rate measurement exposure substrate to include the exposure substrate, the user, By selecting a measurement sample according to a desired index value from the measurement samples of the above, a diagnosis result and a prescription are obtained in which the influence of the electronic circuit board on the deterioration of environmental factors of the atmospheric environment is appropriately taken into consideration. be able to.

【００５２】請求項７記載の発明によれば、前記劣化度
測定キット内の測定マニュアルには、前記測定試料一
覧、前記測定試料の選択方法、前記測定試料の取扱方
法、及び導体の腐食断線寿命診断に必要な電子回路基板
導体表面に印刷されているソルダレジストの厚さレベル
を判定するための色見本が掲載されているため、ユーザ
による希望する指標値に応じた測定試料の選択が容易に
なり、また、導体表面に印刷されているソルダレジスト
の厚さレベルの判定が容易になる。According to the invention described in claim 7, the measurement manual in the deterioration degree measurement kit includes the list of measurement samples, the method of selecting the measurement sample, the method of handling the measurement sample, and the corrosion breakage life of the conductor. Color samples to determine the thickness level of the solder resist printed on the conductor surface of the electronic circuit board required for diagnosis are posted, making it easy for the user to select the measurement sample according to the desired index value In addition, the thickness level of the solder resist printed on the conductor surface can be easily determined.

【００５３】請求項８記載の発明によれば、前記劣化指
標値が前記電子回路基板の導体金属の腐食厚さである場
合は、前記指標値は前記環境評価点とし、この環境評価
点の関数として定式化した暴露期間に対する前記電子回
路基板の導体金属の腐食厚さの関係式に、前記環境評価
点を当てはめて当該電子回路基板の導体の腐食劣化状態
を判定するようにしたため、劣化指標値が導体金属の腐
食厚さである場合、環境評価点を求めることで電子回路
基板の劣化寿命診断を行うことができる。According to the present invention, when the deterioration index value is the corrosion thickness of the conductive metal of the electronic circuit board, the index value is the environmental evaluation point, and a function of the environmental evaluation point is used. By applying the environmental evaluation point to the relational expression of the corrosion thickness of the conductor metal of the electronic circuit board with respect to the exposure period formulated as the exposure period to determine the corrosion deterioration state of the conductor of the electronic circuit board, the deterioration index value Is the corrosion thickness of the conductive metal, it is possible to diagnose the deterioration life of the electronic circuit board by obtaining the environmental evaluation point.

【００５４】請求項９記載の発明によれば、前記環境評
価点の関数として定式化した暴露期間に対する導体金属
の腐食厚さの関係曲線が導体金属表面に印刷されたソル
ダレジストの厚さレベル毎に用意したため、導体表面に
ソルダレジストが印刷されていても電子回路基板の劣化
寿命を精度良く診断することができる。According to the ninth aspect of the present invention, the relationship curve of the corrosion thickness of the conductor metal with respect to the exposure period formulated as a function of the environmental evaluation point is obtained for each thickness level of the solder resist printed on the conductor metal surface. Therefore, even if a solder resist is printed on the conductor surface, the deterioration life of the electronic circuit board can be accurately diagnosed.

【００５５】請求項１０記載の発明によれば、前記劣化
指標値が前記電子回路基板のコネクタの接触抵抗である
場合は、前記指標値は前記環境評価点とし、この環境評
価点の関数として定式化した暴露期間に対する前記コネ
クタの接触抵抗変化の関係式に、前記環境評価点を当て
はめて、当該コネクタの劣化状態を判定するようにした
ため、劣化指標値が電子回路基板のコネクタの接触抵抗
である場合、環境評価点を求めることでコネクタの劣化
状態を診断することができる。According to the tenth aspect of the present invention, when the deterioration index value is the contact resistance of the connector of the electronic circuit board, the index value is the environmental evaluation point, and a formula is set as a function of the environmental evaluation point. By applying the environmental evaluation point to the relational expression of the change in the contact resistance of the connector with respect to the exposure period, the deterioration state of the connector is determined, so that the deterioration index value is the contact resistance of the connector of the electronic circuit board. In this case, the deterioration state of the connector can be diagnosed by obtaining the environmental evaluation points.

【００５６】請求項１１記載の発明によれば、前記劣化
指標値が前記電子回路基板の導体金属の腐食厚さである
場合は、前記指標値は前記簡易環境評価点とし、この簡
易環境評価点の関数として定式化した暴露期間に対する
前記電子回路基板の導体金属の腐食厚さの関係式に、前
記簡易環境評価点を当てはめて当該電子回路基板の導体
の腐食劣化状態を判定するようにしたため、劣化指標値
が導体金属の腐食厚さである場合、指標値として簡易環
境評価点を用いることで、局部的な腐食劣化状態を精度
良く診断することができる。According to the eleventh aspect of the present invention, when the deterioration index value is the corrosion thickness of the conductor metal of the electronic circuit board, the index value is the simple environment evaluation point. To determine the corrosion degradation state of the conductor of the electronic circuit board by applying the simple environmental evaluation point to the relational expression of the corrosion thickness of the conductor metal of the electronic circuit board for the exposure period formulated as a function of When the deterioration index value is the corrosion thickness of the conductive metal, a local corrosion deterioration state can be accurately diagnosed by using the simple environmental evaluation point as the index value.

【００５７】請求項１２記載の発明によれば、前記簡易
環境評価点の関数として定式化した暴露期間に対する導
体金属の腐食厚さの関係曲線が導体金属表面に印刷され
たソルダレジストの厚さレベル毎に用意したため、指標
値として簡易環境評価点を用いた場合において、請求項
９記載の発明の効果と略同様の効果がある。According to the twelfth aspect of the present invention, the relation curve of the corrosion thickness of the conductive metal with respect to the exposure period formulated as a function of the simplified environmental evaluation point is a thickness level of the solder resist printed on the conductive metal surface. Since the simple environment evaluation point is used as the index value, there is substantially the same effect as the effect of the ninth aspect of the present invention.

【００５８】請求項１３記載の発明によれば、前記劣化
指標値が前記電子回路基板の導体間の絶縁抵抗である場
合は、前記指標値は前記電子回路基板表面の汚損度と
し、この汚損度の経時変化を予め求めるとともに温度・
湿度の組み合わせ毎の汚損度と絶縁抵抗の関係式に前記
汚損度を当てはめて当該電子回路基板の導体間の絶縁劣
化状態を判定するようにしたため、劣化指標値が導体間
の絶縁抵抗である場合、指標値としてイオン性物質の付
着量に相当する汚損度を用い、また汚損度と絶縁抵抗の
関係式を温度・湿度の組み合わせ毎に用意することで、
電子回路基板の使用環境に応じた精度の良い絶縁劣化診
断を行うことができる。According to the thirteenth aspect of the present invention, when the deterioration index value is an insulation resistance between conductors of the electronic circuit board, the index value is a degree of contamination on the surface of the electronic circuit board. Change with time and temperature /
Since the degree of insulation degradation between conductors of the electronic circuit board is determined by applying the degree of contamination to the relational expression between the degree of contamination and insulation resistance for each combination of humidity, the deterioration index value is the insulation resistance between conductors. By using the degree of pollution corresponding to the amount of ionic substance attached as an index value, and preparing a relational expression between the degree of pollution and insulation resistance for each combination of temperature and humidity,
It is possible to perform an accurate insulation deterioration diagnosis according to the use environment of the electronic circuit board.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施の形態である劣化度測定キ
ットによる電子回路基板の劣化寿命診断法における診断
業務の流れを説明するための図である。FIG. 1 is a diagram for explaining a flow of a diagnosis job in a method of diagnosing deterioration life of an electronic circuit board using a deterioration degree measurement kit according to a first embodiment of the present invention.

【図２】第１の実施の形態における環境評価点算出部及
び劣化診断部の構成を示すブロック図である。FIG. 2 is a block diagram illustrating a configuration of an environment evaluation point calculation unit and a deterioration diagnosis unit according to the first embodiment.

【図３】第１の実施の形態においてクラス分けされた環
境因子の量による因子別評価点のテーブルである。FIG. 3 is a table of factor-based evaluation points based on the amounts of environmental factors classified in the first embodiment.

【図４】第１の実施の形態において暴露期間と劣化指標
値の関係を示す図である。FIG. 4 is a diagram showing a relationship between an exposure period and a deterioration index value in the first embodiment.

【図５】第１の実施の形態においてソルダレジストの厚
さレベル毎に設けた暴露期間に対する導体腐食厚さの関
係曲線を示す図である。FIG. 5 is a diagram showing a relation curve of a conductor corrosion thickness with respect to an exposure period provided for each solder resist thickness level in the first embodiment.

【図６】本発明の第２の実施の形態における簡易環境評
価点算出部及び劣化診断部の構成を示すブロック図であ
る。FIG. 6 is a block diagram illustrating a configuration of a simplified environment evaluation point calculation unit and a deterioration diagnosis unit according to a second embodiment of the present invention.

【図７】第２の実施の形態においてクラス分けされた環
境因子の量による因子別評価点のテーブルである。FIG. 7 is a table of factor-based evaluation points based on the amounts of environmental factors classified in the second embodiment.

【図８】第２の実施の形態においてソルダレジストの厚
さレベル毎に設けた暴露期間に対する導体腐食厚さの関
係曲線を示す図である。FIG. 8 is a diagram showing a relation curve of a conductor corrosion thickness with respect to an exposure period provided for each solder resist thickness level in the second embodiment.

【図９】本発明の第３の実施の形態における劣化診断部
の構成を示すブロック図である。FIG. 9 is a block diagram illustrating a configuration of a deterioration diagnosis unit according to a third embodiment of the present invention.

【図１０】第３の実施の形態において温・湿度の組み合
わせ毎に設けた汚損度と絶縁抵抗値の関係曲線を示す図
である。FIG. 10 is a diagram illustrating a relationship curve between a degree of contamination and an insulation resistance value provided for each combination of temperature and humidity in the third embodiment.

【図１１】第３の実施の形態において汚損度の経時変化
を示す図である。FIG. 11 is a diagram showing a change with time in the degree of fouling in the third embodiment.

【符号の説明】[Explanation of symbols]

１ 劣化度測定キット ４ 環境評価点算出部 ４Ａ 簡易環境評価点算出部 ５，５Ａ，５Ｂ 劣化診断部 ６ 報告書（診断結果・処方箋） Reference Signs List 1 Deterioration degree measurement kit 4 Environmental evaluation point calculation unit 4A Simple environmental evaluation point calculation unit 5, 5A, 5B Deterioration diagnosis unit 6 Report (diagnosis result / prescription)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐々木 恵一 東京都府中市東芝町１番地 株式会社東芝 府中事業所内 (72)発明者 兼平 勝己 東京都府中市東芝町１番地 株式会社東芝 府中事業所内 (72)発明者 安達 健二 東京都府中市東芝町１番地 株式会社東芝 府中事業所内 (72)発明者 大久保 正明 東京都府中市東芝町１番地 株式会社東芝 府中事業所内 (72)発明者 木村 和成 神奈川県横浜市鶴見区末広町２丁目４番地 株式会社東芝京浜事業所内 (72)発明者 今井 博美 東京都府中市東芝町１番地 株式会社東芝 府中事業所内 (72)発明者 村山 忠義 東京都港区芝浦一丁目１番１号 株式会社 東芝本社事務所内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Keiichi Sasaki 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation Fuchu Works (72) Inventor Katsumi Kanehira 1-Toshiba-cho, Fuchu-shi Tokyo, Toshiba Fuchu Works ( 72) Inventor Kenji Adachi 1 Toshiba-cho, Fuchu-city, Tokyo (72) Inside Toshiba Fuchu Office, Inc. 2-4 Suehiro-cho, Tsurumi-ku, Yokohama-shi, Japan Inside the Toshiba Keihin Works Co., Ltd. (72) Inventor Hiromi Imai 1 Toshiba-cho, Fuchu-shi, Tokyo Inside the Fuchu Works Toshiba Co., Ltd. 1-1-1 Chome Toshiba Corporation Head Office

Claims (13)

【特許請求の範囲】[Claims] 【請求項１】 診断者は、診断対象となる電子回路基板
のユーザに当該電子回路基板が使用されている大気環境
の有害度測定用の測定試料を含む所定の試料が収納され
た劣化度測定キットを無償供与し、前記ユーザは、前記
測定試料を前記大気環境に所定期間暴露した後、当該測
定試料を前記診断者に返送し、前記診断者は、この返送
された測定試料を分析して前記大気環境の有害度を表す
指標値を求め、この指標値を基に前記電子回路基板の劣
化状態を診断し、その診断結果及び処方箋を前記ユーザ
に有償提示することを特徴とする劣化度測定キットによ
る電子回路基板の劣化寿命診断法。A diagnostician measures a deterioration degree in which a user of an electronic circuit board to be diagnosed stores a predetermined sample including a measurement sample for measuring the harmfulness of an atmospheric environment in which the electronic circuit board is used. A kit is provided free of charge, and the user returns the measurement sample to the diagnostician after exposing the measurement sample to the atmospheric environment for a predetermined period, and the diagnostician analyzes the returned measurement sample. Obtaining an index value representing the degree of harmfulness of the atmospheric environment, diagnosing a deterioration state of the electronic circuit board based on the index value, and presenting the diagnosis result and a prescription to the user for a fee, the deterioration degree measurement. A method for diagnosing deterioration life of electronic circuit boards using a kit 【請求項２】 前記大気環境の有害度を表す指標値は、
大気環境中の温度、湿度、酸性ガス及びアルカリ性ガス
を含む腐食性ガス、並びに海塩粒子を含む複数の環境因
子の各々の量を測定し、その量によって割り付けた各因
子別評価点と各因子別重み係数の積の和から算出した環
境評価点であることを特徴とする請求項１記載の劣化度
測定キットによる電子回路基板の劣化寿命診断法。2. An index value indicating the degree of harm of the atmospheric environment is:
Measure the temperature, humidity, corrosive gas including acid gas and alkaline gas in the air environment, and the amount of each of a plurality of environmental factors including sea salt particles. 2. The method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measurement kit according to claim 1, wherein the environmental evaluation point is calculated from the sum of the products of the different weight coefficients. 【請求項３】 前記大気環境の有害度を表す指標値は、
大気環境中の温度、湿度、及び汚損速度を含む複数の環
境因子の各々の量を測定し、その量によって割り付けた
各因子別評価点と各因子別重み係数の積の和から算出し
た簡易環境評価点であることを特徴とする請求項１記載
の劣化度測定キットによる電子回路基板の劣化寿命診断
法。3. An index value indicating the degree of harm of the atmospheric environment is:
Simple environment calculated by measuring the amount of each of a plurality of environmental factors including temperature, humidity, and fouling rate in the atmospheric environment, and calculating from the sum of the product of the evaluation points for each factor and the weighting factor for each factor, which are assigned according to the amount A method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measurement kit according to claim 1, wherein the evaluation point is an evaluation point. 【請求項４】 前記指標値を求めるための温度及び湿度
の各データは、前記電子回路基板が使用されている地域
の地域気象情報、又は前記電子回路基板が使用されてい
る場所が空調管理されている場合は温度、湿度の管理値
で代替し、前記海塩粒子のデータは、前記電子回路基板
が使用されている場所から地図上で測定できる海岸まで
の直線距離で代替してなることを特徴とする請求項１又
は２記載の劣化度測定キットによる電子回路基板の劣化
寿命診断法。4. The data of temperature and humidity for obtaining the index value may be regional weather information of a region where the electronic circuit board is used, or air-conditioning management of a place where the electronic circuit board is used. If it is, it is replaced with the control value of temperature and humidity, and the data of the sea salt particles is replaced with the straight line distance from the place where the electronic circuit board is used to the coast which can be measured on the map. A method for diagnosing the deterioration life of an electronic circuit board using the deterioration degree measuring kit according to claim 1 or 2. 【請求項５】 前記指標値の関数として定式化した電子
回路基板の劣化指標値の経時変化式に、前記指標値を当
てはめて前記電子回路基板の劣化状態を判定することを
特徴とする請求項１，２，３又は４記載の劣化度測定キ
ットによる電子回路基板の劣化寿命診断法。5. The deterioration state of the electronic circuit board is determined by applying the index value to a temporal change equation of the deterioration index value of the electronic circuit board formulated as a function of the index value. A method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measurement kit according to 1, 2, 3 or 4. 【請求項６】 前記劣化度測定キット内には、前記診断
者が回収して分析する測定試料、この測定試料を支持す
る治具、前記測定試料を保管する試料保管ケース、測定
マニュアル及び調査票が収納され、これらの収納品のう
ちの前記測定試料は、温度記録計、湿度記録計、酸性ガ
ス測定用のアルカリろ紙、アルカリ性ガス測定用の酸性
ろ紙、海塩粒子測定布、前記電子回路基板の導体金属と
同等の金属からなる金属板、汚損度測定布及び汚損速度
測定暴露基板を含むことを特徴とする請求項１乃至５の
何れかに記載の劣化度測定キットによる電子回路基板の
劣化寿命診断法。6. The deterioration degree measurement kit includes a measurement sample to be collected and analyzed by the diagnostician, a jig for supporting the measurement sample, a sample storage case for storing the measurement sample, a measurement manual, and a survey form. Is stored, the measurement sample is a temperature recorder, a humidity recorder, an alkaline filter paper for measuring an acidic gas, an acidic filter paper for measuring an alkaline gas, a sea salt particle measuring cloth, the electronic circuit board The deterioration of the electronic circuit board by the deterioration degree measurement kit according to any one of claims 1 to 5, comprising a metal plate made of a metal equivalent to the conductive metal of (1), a pollution degree measurement cloth, and a contamination rate measurement exposure board. Lifetime diagnostics. 【請求項７】 前記劣化度測定キット内の測定マニュア
ルには、前記測定試料一覧、前記測定試料の選択方法、
前記測定試料の取扱方法、及び導体の腐食断線寿命診断
に必要な電子回路基板導体表面に印刷されているソルダ
レジストの厚さレベルを判定するための色見本が掲載さ
れていることを特徴とする請求項１乃至６の何れかに記
載の劣化度測定キットによる電子回路基板の劣化寿命診
断法。7. The measurement manual in the deterioration degree measurement kit includes a list of the measurement samples, a method of selecting the measurement samples,
The method of handling the measurement sample, and a color sample for determining the thickness level of the solder resist printed on the conductor surface of the electronic circuit board necessary for the corrosion breaking life diagnosis of the conductor are described. A method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to any one of claims 1 to 6. 【請求項８】 前記劣化指標値が前記電子回路基板の導
体金属の腐食厚さである場合は、前記指標値は前記環境
評価点とし、この環境評価点の関数として定式化した暴
露期間に対する前記電子回路基板の導体金属の腐食厚さ
の関係式に、前記環境評価点を当てはめて当該電子回路
基板の導体の腐食劣化状態を判定することを特徴とする
請求項５記載の劣化度測定キットによる電子回路基板の
劣化寿命診断法。8. When the deterioration index value is the corrosion thickness of the conductor metal of the electronic circuit board, the index value is the environmental evaluation point, and the index value for the exposure period formulated as a function of the environmental evaluation point. The deterioration degree measurement kit according to claim 5, wherein the environmental evaluation point is applied to a relational expression of the corrosion thickness of the conductor metal of the electronic circuit board to determine a corrosion deterioration state of the conductor of the electronic circuit board. Degradation life diagnosis method for electronic circuit boards. 【請求項９】 前記環境評価点の関数として定式化した
暴露期間に対する導体金属の腐食厚さの関係曲線が導体
金属表面に印刷されたソルダレジストの厚さレベル毎に
用意されていることを特徴とする請求項８記載の劣化度
測定キットによる電子回路基板の劣化寿命診断法。9. A characteristic curve of the corrosion thickness of the conductive metal with respect to the exposure period formulated as a function of the environmental evaluation point is prepared for each thickness level of the solder resist printed on the conductive metal surface. A method for diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to claim 8. 【請求項１０】 前記劣化指標値が前記電子回路基板の
コネクタの接触抵抗である場合は、前記指標値は前記環
境評価点とし、この環境評価点の関数として定式化した
暴露期間に対する前記コネクタの接触抵抗変化の関係式
に、前記環境評価点を当てはめて、当該コネクタの劣化
状態を判定することを特徴とする請求項５記載の劣化度
測定キットによる電子回路基板の劣化寿命診断法。10. When the deterioration index value is the contact resistance of the connector of the electronic circuit board, the index value is the environmental evaluation point, and the connector is exposed to an exposure period formulated as a function of the environmental evaluation point. 6. The method of diagnosing deterioration life of an electronic circuit board using the deterioration degree measuring kit according to claim 5, wherein the deterioration state of the connector is determined by applying the environmental evaluation point to a relational expression of a change in contact resistance. 【請求項１１】 前記劣化指標値が前記電子回路基板の
導体金属の腐食厚さである場合は、前記指標値は前記簡
易環境評価点とし、この簡易環境評価点の関数として定
式化した暴露期間に対する前記電子回路基板の導体金属
の腐食厚さの関係式に、前記簡易環境評価点を当てはめ
て当該電子回路基板の導体の腐食劣化状態を判定するこ
とを特徴とする請求項５記載の劣化度測定キットによる
電子回路基板の劣化寿命診断法。11. When the deterioration index value is the corrosion thickness of the conductive metal of the electronic circuit board, the index value is the simple environment evaluation point, and the exposure period is formulated as a function of the simple environment evaluation point. 6. The degree of deterioration according to claim 5, wherein the simple environmental evaluation point is applied to a relational expression of the corrosion thickness of the conductor metal of the electronic circuit board with respect to the electronic circuit board to determine the corrosion deterioration state of the conductor of the electronic circuit board. Diagnosis method for deterioration life of electronic circuit boards using a measurement kit. 【請求項１２】 前記簡易環境評価点の関数として定式
化した暴露期間に対する導体金属の腐食厚さの関係曲線
が導体金属表面に印刷されたソルダレジストの厚さレベ
ル毎に用意されていることを特徴とする請求項１１記載
の劣化度測定キットによる電子回路基板の劣化寿命診断
法。12. A curve representing the relationship between the exposure period and the corrosion thickness of the conductive metal formulated as a function of the simplified environmental evaluation point is prepared for each thickness level of the solder resist printed on the conductive metal surface. A method for diagnosing the deterioration life of an electronic circuit board using the deterioration degree measuring kit according to claim 11. 【請求項１３】 前記劣化指標値が前記電子回路基板の
導体間の絶縁抵抗である場合は、前記指標値は前記電子
回路基板表面の汚損度とし、この汚損度の経時変化を予
め求めるとともに温度・湿度の組み合わせ毎の汚損度と
絶縁抵抗の関係式に前記汚損度を当てはめて当該電子回
路基板の導体間の絶縁劣化状態を判定することを特徴と
する請求項５記載の劣化度測定キットによる電子回路基
板の劣化寿命診断法。13. When the deterioration index value is an insulation resistance between conductors of the electronic circuit board, the index value is a degree of contamination of the surface of the electronic circuit board, and a time-dependent change in the degree of contamination is determined in advance and the temperature is determined. The deterioration degree measurement kit according to claim 5, wherein the degree of insulation deterioration between conductors of the electronic circuit board is determined by applying the degree of contamination to a relational expression between the degree of contamination and insulation resistance for each combination of humidity. Degradation life diagnosis method for electronic circuit boards.
JP2000255957A 2000-08-25 2000-08-25 Degradation degree measuring kit and method for diagnosing deterioration life of electronic circuit board using this deterioration degree measuring kit Expired - Fee Related JP3602782B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003281671A (en) * 2002-03-20 2003-10-03 Nippon Telegr & Teleph Corp <Ntt> Multi-sensing atmospheric environment monitoring system device and monitoring method
JP2013195226A (en) * 2012-03-19 2013-09-30 Toshiba Corp Deterioration diagnosis device and deterioration diagnosis method
KR101421008B1 (en) 2013-02-13 2014-07-28 한국화학연구원 Weathering test method and apparatus
JP2017181200A (en) * 2016-03-29 2017-10-05 Ｊｘ金属株式会社 Terminal characteristic evaluation method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003281671A (en) * 2002-03-20 2003-10-03 Nippon Telegr & Teleph Corp <Ntt> Multi-sensing atmospheric environment monitoring system device and monitoring method
JP2013195226A (en) * 2012-03-19 2013-09-30 Toshiba Corp Deterioration diagnosis device and deterioration diagnosis method
KR101421008B1 (en) 2013-02-13 2014-07-28 한국화학연구원 Weathering test method and apparatus
JP2017181200A (en) * 2016-03-29 2017-10-05 Ｊｘ金属株式会社 Terminal characteristic evaluation method

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