JP2002061854A - Underfloor heating device - Google Patents

Underfloor heating device

Info

Publication number
JP2002061854A
JP2002061854A JP2000250172A JP2000250172A JP2002061854A JP 2002061854 A JP2002061854 A JP 2002061854A JP 2000250172 A JP2000250172 A JP 2000250172A JP 2000250172 A JP2000250172 A JP 2000250172A JP 2002061854 A JP2002061854 A JP 2002061854A
Authority
JP
Japan
Prior art keywords
room
temperature
hot water
radiator
floor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000250172A
Other languages
Japanese (ja)
Inventor
Kosuke Niki
康介 仁木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunpot Co Ltd
Original Assignee
Sunpot Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunpot Co Ltd filed Critical Sunpot Co Ltd
Priority to JP2000250172A priority Critical patent/JP2002061854A/en
Publication of JP2002061854A publication Critical patent/JP2002061854A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide an underfloor heating device to set temperature at each of rooms even in a case of a so called one-pipe system where a plurality of radiators are interconnected in series. SOLUTION: The underfloor heating device 1 comprises a boiler 4 installed outside a building A; a first radiator 2 installed in an underfloor space 8 of a first floor; a second radiator 3 installed in an underfloor space C of a second floor; and a hot water pipe 5 through which each radiator is coupled to a boiler 4. The first and second radiators 2 and 3 and the boiler 4 are one-pipe system where the numbers are interconnected in series. First and second flow rate regulating valve 6 and 7 are situated at a connection part between the first and second radiators 2 and 3 and the hot water pipe 5, and first and second remote controllers 9 and 11 incorporating first and second temperature sensors 8 and 10 are situated on the inner wall surfaces of each room. By adjusting a radiation amount of each of the first and second radiators 2 and 3 by the first and second flow rate regulating valves 6 and 7, temperature is set at each of rooms.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術の分野】本発明は、床下空間を加熱
することにより室内を暖房する床下暖房装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an underfloor heating device for heating a room by heating an underfloor space.

【0002】[0002]

【従来の技術】従来の床下暖房装置は、建築物の床下空
間に複数の放熱器を設置し、この放熱器にボイラから温
水を循環させて床下空間を加熱するものであり、床材を
暖めて室内を床面から暖房している。また、床面には床
下空間と室内とを連通する通気口が設けられており、床
下空間において暖められた空気を該通気口から室内に進
入させて室内を直接暖房している。このように、床下暖
房装置では、床材と室内の空気を暖めることにより室内
の暖房を行っている。
2. Description of the Related Art In a conventional underfloor heating apparatus, a plurality of radiators are installed in an underfloor space of a building, and hot water is circulated from a boiler to the radiator to heat the underfloor space. The room is heated from the floor. Further, a ventilation hole is provided on the floor surface for communicating the underfloor space with the room, and air heated in the underfloor space enters the room through the ventilation hole to directly heat the room. As described above, in the underfloor heating device, the room is heated by warming the floor material and the room air.

【0003】また、この種の床下暖房装置は、床下空間
を加熱することで建築物全体を暖房するものであり、複
数の部屋を有する建築物においても各部屋毎に別個に暖
房を行うものではなかった。このため、複数の放熱器と
ボイラとの接続は、構造が簡単でコストが低く、設置作
業も容易であるいわゆる単管方式の配管が用いられてお
り、複数の放熱器はボイラと直列に接続されていた。
[0003] This type of underfloor heating apparatus heats the entire building by heating the underfloor space. Even in a building having a plurality of rooms, it does not separately heat each room. Did not. For this reason, the connection between a plurality of radiators and the boiler uses a so-called single-pipe type pipe that has a simple structure, low cost, and easy installation work, and the plurality of radiators are connected in series with the boiler. It had been.

【0004】しかしながら、最近では、建築物全体を暖
房しながら各部屋毎に温度を変更したいという要請が生
じている。ところが、単管方式の配管では、各放熱器は
ボイラに直列に接続されているため、それぞれ別個に放
熱量を調節することは困難であった。
However, recently, there has been a demand for changing the temperature of each room while heating the entire building. However, in the case of the single-pipe system, since each radiator is connected in series to the boiler, it has been difficult to separately adjust the amount of heat radiation.

【0005】[0005]

【発明が解決しようとする課題】本発明は、床下暖房装
置の改良を目的とし、さらに詳しくは、前記不都合を解
消するために、複数の放熱器が直列に接続されている場
合であっても、各部屋毎に温度の調節をすることができ
る床下暖房装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention aims at improving an underfloor heating device, and more specifically, even in the case where a plurality of radiators are connected in series to solve the above-mentioned inconvenience. It is another object of the present invention to provide an underfloor heating device capable of controlling the temperature of each room.

【0006】[0006]

【課題を解決するための手段】前記目的を達成するため
に、本発明の床下暖房装置は、複数の部屋を有する建築
物において、各部屋の床下空間を加熱して床材を暖める
と共に、前記床材に設けられ室内と前記床下空間とを連
通する通気口から温風を室内に供給して室内の暖房を行
う床下暖房装置であって、以下の特徴を備える。まず、
温水を加熱するボイラと、温水により各部屋の床下空間
を加熱し温水通路により前記ボイラに直列に接続される
複数の放熱器とを備える。また、前記温水通路は、前記
ボイラ側からの温水が供給される往路と、前記ボイラ側
に戻される復路と、前記往路と前記復路とを接続するバ
イパス通路とを有し、前記温水通路には前記バイパス通
路の流量を増減することにより前記放熱器に供給される
温水の流量を調節する流量調節弁と、各部屋の室内の温
度を検出し前記流量調節弁に電気的に接続される温度セ
ンサとが設けられている。そして、前記温度センサによ
り検出された各部屋の室内の温度に従って、該部屋の床
下空間に設けられた放熱器の放熱量を調節する。
In order to achieve the above-mentioned object, an underfloor heating device according to the present invention heats a floor material by heating an underfloor space of each room in a building having a plurality of rooms. An underfloor heating device for heating a room by supplying warm air into the room from a vent provided in the floor material and communicating the room and the underfloor space, and has the following features. First,
The boiler includes a boiler for heating hot water, and a plurality of radiators connected to the boiler in series by a hot water passage that heats an underfloor space of each room with the hot water. Further, the hot water passage has a forward path to which hot water is supplied from the boiler side, a return path returning to the boiler side, and a bypass path connecting the forward path and the return path. A flow rate control valve that controls the flow rate of hot water supplied to the radiator by increasing or decreasing the flow rate of the bypass passage; and a temperature sensor that detects a temperature in a room of each room and is electrically connected to the flow rate control valve. Are provided. Then, the heat radiation amount of the radiator provided in the underfloor space of the room is adjusted according to the room temperature of each room detected by the temperature sensor.

【0007】本発明の床下暖房装置によれば、複数の部
屋の各室内に温度センサが設けられており、該温度セン
サにより検出された部屋の温度に従って各部屋の床下空
間に設けられた放熱器の放熱量を調節するため、前記複
数の放熱器が直列に接続されている床下暖房装置であっ
ても、各部屋毎に別個に温度の調節をすることができ
る。
According to the underfloor heating device of the present invention, a temperature sensor is provided in each of a plurality of rooms, and a radiator provided in the underfloor space of each room according to the temperature of the room detected by the temperature sensors. Therefore, even if the underfloor heating device has the plurality of radiators connected in series, the temperature can be separately adjusted for each room.

【0008】また、床下暖房装置は、前記通気口から温
風を室内に供給することにより暖房しているため、室内
の温度を正確に制御するためには、前記通気口と前記温
度センサとの距離や前記温度センサの床面からの高さが
重要になる。本発明の床下暖房装置は、前記温度センサ
が前記流量調節弁に電気的に接続するものであり、室内
の設置個所から前記流量調節弁に接続することが容易で
あるため、室内の任意の箇所に容易に設置することがで
きる。このため、前記温度センサを室内の温度制御に適
した位置に容易に設置することができる。
In addition, since the underfloor heating device heats the room by supplying warm air from the vent to the room, in order to accurately control the temperature of the room, it is necessary to connect the vent to the temperature sensor. The distance and the height of the temperature sensor from the floor are important. In the underfloor heating device of the present invention, the temperature sensor is electrically connected to the flow rate control valve, and it is easy to connect to the flow rate control valve from an installation location in a room. Can be installed easily. For this reason, the temperature sensor can be easily installed at a position suitable for indoor temperature control.

【0009】尚、各放熱器に供給される温水の量の調節
は、前記流量調節弁の開度を増減することにより温水の
流量を調節してもよく、前記流量調節弁を開閉して各放
熱器に供給される温水の供給・遮断を行うことにより調
節してもよい。
The amount of hot water supplied to each radiator may be adjusted by adjusting the flow rate of the hot water by increasing or decreasing the opening of the flow control valve. It may be adjusted by supplying / cutting off the hot water supplied to the radiator.

【0010】[0010]

【発明の実施の形態】次に、本発明の床下暖房装置の実
施形態の一例について、図1及び図2を参照して説明す
る。図1は本実施形態の床下暖房装置を建築物に設置し
た状態を示す説明図、図2は放熱器及び流量調節弁の構
成を示す説明図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the underfloor heating apparatus according to the present invention will be described with reference to FIGS. FIG. 1 is an explanatory diagram showing a state in which the underfloor heating device of the present embodiment is installed in a building, and FIG. 2 is an explanatory diagram showing configurations of a radiator and a flow control valve.

【0011】本実施形態の床下暖房装置1は、図1に示
すように、複数の部屋を有する建築物Aの外部に設置さ
れたボイラ4と、建築物Aの1階の部屋の床下空間Bに
設置された第1放熱器2と、2階の部屋の床下空間Cに
設置された第2放熱器3と、第1放熱器2及び第2放熱
器3をボイラ4に連結する温水パイプ(温水通路)5と
を備えている。この第1放熱器2と第2放熱器3とボイ
ラ4とは、図1に示すように温水パイプ5によって直列
に接続されており、いわゆる単管方式の接続となってい
る。また、第1放熱器2は高さの高い1階の床下空間B
にあわせて縦置きに設置され、第2放熱器3は高さの低
い2階の床下空間Cにあわせて横置きに設置されてい
る。
As shown in FIG. 1, the underfloor heating apparatus 1 of this embodiment includes a boiler 4 installed outside a building A having a plurality of rooms, and a underfloor space B of a room on the first floor of the building A. , The second radiator 3 installed in the underfloor space C of the room on the second floor, and a hot water pipe (see FIG. 1) connecting the first radiator 2 and the second radiator 3 to the boiler 4 ( (A hot water passage) 5. The first radiator 2, the second radiator 3, and the boiler 4 are connected in series by a hot water pipe 5 as shown in FIG. In addition, the first radiator 2 is an underfloor space B on the first floor having a high height.
The second radiator 3 is installed horizontally in accordance with the low-floor underfloor space C on the second floor.

【0012】また、第1放熱器2と温水パイプ5との接
続部には第1流量調節弁6が設けられ、第2放熱器3と
温水パイプ5との接続部には第2流量調節弁7が設けら
れている。また、1階の室内の壁面には第1温度センサ
8を内蔵した第1リモコン9が設けられており、2階の
室内の壁面には第2温度センサ10を内蔵した第2リモ
コン11が設けられている。また、建築物Aの1階の床
材D及び2階の床材Eには室内と床下空間とを連通する
通気口Fが設けられており、通気口Fの上面には梯子状
に形成されたガラリGが設けられている。
A first flow control valve 6 is provided at a connection between the first radiator 2 and the hot water pipe 5, and a second flow control valve is provided at a connection between the second radiator 3 and the hot water pipe 5. 7 are provided. A first remote controller 9 having a first temperature sensor 8 is provided on the wall surface of the first floor room, and a second remote controller 11 having a second temperature sensor 10 is provided on the wall surface of the second floor room. Have been. Further, the floor material D on the first floor and the floor material E on the second floor of the building A are provided with a ventilation port F communicating between the room and the underfloor space, and are formed in a ladder shape on the upper surface of the ventilation port F. A rough gallery G is provided.

【0013】第1及び第2流量調節弁6,7は、図2に
示すように、ボイラ4から第1及び第2放熱器2,3へ
温水が供給される往路12と、第1及び第2放熱器2,
3からの温水が導出される復路13と、往路12と復路
13とを接続するバイパス通路14とを備えている。ま
た、往路12とバイパス通路14とが連通する箇所には
弁体15が設けられ、この弁体15は熱動弁16によっ
て図2において左右に移動される。また、熱動弁16は
第1及び第2リモコン9,11に内蔵された第1及び第
2温度センサ8,10に電気的に接続されている。この
ように、本実施形態の床下暖房装置1では、各部屋毎に
放熱器と温度センサが設けられている。
As shown in FIG. 2, the first and second flow rate control valves 6 and 7 include a forward path 12 through which hot water is supplied from the boiler 4 to the first and second radiators 2 and 3, and a first and second flow rate control valves. 2 radiator 2,
3 is provided with a return path 13 from which hot water is led out, and a bypass path 14 connecting the outward path 12 and the return path 13. A valve body 15 is provided at a location where the forward path 12 and the bypass passage 14 communicate with each other. The valve body 15 is moved right and left in FIG. Further, the thermal valve 16 is electrically connected to first and second temperature sensors 8 and 10 built in the first and second remote controllers 9 and 11. Thus, in the underfloor heating device 1 of the present embodiment, the radiator and the temperature sensor are provided for each room.

【0014】次に、本実施形態の床下暖房装置1の作動
について説明する。本実施形態の床下暖房装置1は、冬
季においては通常24時間稼働がなされており、使用者
によって運転停止の指示がなされるまでは連続して建築
物Aの暖房を行っている。ここで、使用者が設定する室
内の温度(設定温度)が高いときや外気温度が低いとき
は、熱動弁16によって弁体15が図2において左側に
移動されており、ボイラ4からの温水は第1流量調節弁
6の往路12を介して第1放熱器2に供給され、復路1
3を介して第2放熱器3に供給される。第2放熱器3に
おいても、第1流量調節弁6からの温水が第2流量調節
弁7の往路12を介して第2放熱器3に供給され、復路
13を介してボイラ4に戻される。
Next, the operation of the underfloor heating device 1 of the present embodiment will be described. The underfloor heating device 1 of the present embodiment is normally operated for 24 hours in winter, and continuously heats the building A until a user gives an instruction to stop the operation. Here, when the indoor temperature (set temperature) set by the user is high or the outside air temperature is low, the valve body 15 is moved to the left side in FIG. Is supplied to the first radiator 2 through the outward path 12 of the first flow control valve 6, and the return path 1
3 to the second radiator 3. Also in the second radiator 3, the hot water from the first flow control valve 6 is supplied to the second radiator 3 via the forward path 12 of the second flow control valve 7 and returned to the boiler 4 via the return path 13.

【0015】また、運転中は第1リモコン9に内蔵され
た第1温度センサ8によって1階の室内の温度が検出さ
れ、第1リモコン9内に設けられているコントローラ
(図示せず)によって実際の室内の温度と設定温度とが
比較されている。ここで、使用者が第1リモコン9によ
って1階の室内の設定温度を下げた場合や室内の温度が
設定温度に達して実際の室内の温度が設定温度以上にな
ったときは、コントローラから第1流量調節弁6に信号
が送信される。第1流量調節弁6では、コントローラか
らの信号によって熱動弁16が図2において右側に移動
される。これにより、バイパス通路14が開口してこの
バイパス通路14を介して復路13に温水が流れるた
め、第1放熱器2に供給される温水の量が減少し、第1
放熱器2の放熱量が減少する。このように、第1放熱器
2からの放熱量が減少すると、1階の床下空間B内の温
度が徐々に低下し、ガラリGから1階の室内に流れ込む
空気の温度も低下するため、1階の室内の温度が徐々に
低下する。これにより、1階の室内の温度は、使用者が
設定した設定温度に調節される。
During operation, the first temperature sensor 8 built in the first remote controller 9 detects the temperature in the room on the first floor, and the controller (not shown) provided in the first remote controller 9 actually detects the temperature. And the set temperature are compared. Here, when the user lowers the set temperature in the room on the first floor by the first remote controller 9 or when the room temperature reaches the set temperature and the actual room temperature becomes higher than the set temperature, the controller sends A signal is transmitted to one flow control valve 6. In the first flow control valve 6, the thermal valve 16 is moved to the right in FIG. 2 by a signal from the controller. As a result, the bypass passage 14 is opened, and the hot water flows into the return path 13 via the bypass passage 14, so that the amount of the hot water supplied to the first radiator 2 decreases,
The heat radiation amount of the radiator 2 is reduced. As described above, when the amount of heat radiation from the first radiator 2 decreases, the temperature in the underfloor space B on the first floor gradually decreases, and the temperature of the air flowing from the gallery G into the room on the first floor also decreases. The temperature in the room on the floor gradually decreases. Thereby, the temperature in the room on the first floor is adjusted to the set temperature set by the user.

【0016】また、この状態から使用者が第1リモコン
9によって1階の室内の設定温度を上げた場合、第1温
度センサ8によって1階の室内の温度が検出され、コン
トローラにより実際の室内の温度と設定温度とが比較さ
れる。実際の室内の温度が設定温度よりも低いときは、
コントローラから第1流量調節弁6に信号が送信され、
熱動弁16が図2において左側に移動される。これによ
り、バイパス通路14から復路13に流れる温水の量が
減少し、第1放熱器2に供給される温水の量が増加する
ため、第1放熱器2の放熱量が増加する。これにより、
1階の床下空間B内の温度が徐々に上昇し、ガラリGか
ら1階の室内に流れ込む空気の温度も上昇するため、1
階の室内の温度が徐々に上昇する。これにより、1階の
室内の温度は、使用者が設定した設定温度に調節され
る。
When the user raises the set temperature of the first floor room by the first remote controller 9 from this state, the temperature of the first floor room is detected by the first temperature sensor 8 and the actual room temperature is detected by the controller. The temperature and the set temperature are compared. When the actual room temperature is lower than the set temperature,
A signal is transmitted from the controller to the first flow control valve 6,
The thermal valve 16 is moved to the left in FIG. Thus, the amount of hot water flowing from the bypass passage 14 to the return path 13 decreases, and the amount of hot water supplied to the first radiator 2 increases, so that the amount of heat radiation of the first radiator 2 increases. This allows
The temperature in the underfloor space B on the first floor gradually increases, and the temperature of the air flowing from the gallery G into the room on the first floor also increases.
The room temperature on the floor gradually rises. Thereby, the temperature in the room on the first floor is adjusted to the set temperature set by the user.

【0017】また、2階においても、1階の場合と同様
に第2リモコン11によって設定された設定温度に従っ
て、コントローラが第2流量調節弁7の調節を行い、第
2放熱器3の放熱量を調節することにより2階の部屋の
温度を設定温度に調節する。
Also, on the second floor, the controller adjusts the second flow control valve 7 in accordance with the set temperature set by the second remote controller 11 as in the case of the first floor, and the heat radiation amount of the second radiator 3 is increased. To adjust the temperature of the room on the second floor to the set temperature.

【0018】このように、本実施形態の床下暖房装置1
によれば、複数の放熱器が直列に接続されているいわゆ
る単管方式であっても、建築物Aの全体を暖房しなが
ら、各部屋毎に温度設定を行うことができる。
As described above, the underfloor heating device 1 of the present embodiment
According to this, even in a so-called single tube system in which a plurality of radiators are connected in series, it is possible to set the temperature for each room while heating the entire building A.

【0019】また、熱動弁16は、電器ヒータの通電の
「入り」「切り」によりサーモワックスを膨張・収縮さ
せて弁体15を駆動するものであり、図2において弁体
15を右側に移動させて往路12を塞ぎ、温水をすべて
バイパス通路14へ流すことにより放熱器の放熱を停止
することができる。従って、本実施形態の床下暖房装置
1によれば、タイマー等により放熱器の使用時間を設定
することができるため、各部屋毎の温度設定のみなら
ず、各部屋毎に床下暖房の「入り」「切り」の設定も行
うことができる。
The thermal valve 16 drives the valve element 15 by expanding / contracting the thermowax by turning on / off the energization of the electric heater, and moves the valve element 15 to the right in FIG. The heat radiator can be stopped by moving it to close the outward path 12 and flowing all the hot water to the bypass passage 14. Therefore, according to the underfloor heating device 1 of the present embodiment, the use time of the radiator can be set by a timer or the like, so that not only the temperature setting for each room but also the “floor heating” for each room. "Cut" can also be set.

【0020】尚、本実施形態では、複数の放熱器を1階
と2階とに設置した場合について説明したが、1階の複
数の部屋のそれぞれの床下に設置した場合も、上記実施
形態と同様に各部屋毎に温度設定を行うことができる。
In this embodiment, the case where a plurality of radiators are installed on the first floor and the second floor has been described. Similarly, the temperature can be set for each room.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施形態の1例である床下暖房装置を
建築物に設置した状態を示す説明図。
FIG. 1 is an explanatory diagram showing a state in which an underfloor heating device, which is an example of an embodiment of the present invention, is installed in a building.

【図2】放熱器及び流量調節弁の構成を示す説明図。FIG. 2 is an explanatory diagram showing a configuration of a radiator and a flow control valve.

【符号の説明】[Explanation of symbols]

1…床下暖房装置、2…第1放熱器、3…第2放熱器、
4…ボイラ、5…温水パイプ(温水通路)、6…第1流
量調節弁、7…第2流量調節弁、12…往路、13…復
路、14…バイパス通路、A…建築物、B…1階の床下
空間、C…2階の床下空間、D…1階の床材、E…2階
の床材、F…通気口。
1: Underfloor heating device, 2: First radiator, 3: Second radiator,
4 boiler, 5 hot water pipe (hot water passage), 6 first flow control valve, 7 second flow control valve, 12 outbound path, 13 return path, 14 bypass path, A building, B 1 Underfloor space on the floor, C: Underfloor space on the second floor, D: Floor material on the first floor, E: Floor material on the second floor, F: Vent.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】複数の部屋を有する建築物において、各部
屋の床下空間を加熱して床材を暖めると共に、前記床材
に設けられ室内と前記床下空間とを連通する通気口から
温風を室内に供給して室内の暖房を行う床下暖房装置で
あって、 温水を加熱するボイラと、温水により各部屋の床下空間
を加熱し温水通路により前記ボイラに直列に接続される
複数の放熱器とを備え、 前記温水通路は、前記ボイラ側からの温水が供給される
往路と、前記ボイラ側に戻される復路と、前記往路と前
記復路とを接続するバイパス通路とを有し、前記温水通
路には前記バイパス通路の流量を増減することにより前
記放熱器に供給される温水の流量を調節する流量調節弁
と、各部屋の室内の温度を検出し前記流量調節弁に電気
的に接続される温度センサとが設けられ、 前記温度センサにより検出された各部屋の室内の温度に
従って、該部屋の床下空間に設けられた放熱器の放熱量
を調節することを特徴とする床下暖房装置。
In a building having a plurality of rooms, an underfloor space of each room is heated to heat a floor material, and warm air is blown from a vent provided in the floor material and communicating between the room and the underfloor space. An underfloor heating device that supplies the room and heats the room, comprising: a boiler for heating hot water; and a plurality of radiators connected in series to the boiler by a hot water passage that heats an underfloor space of each room with the hot water. The hot water passage has a forward path to which hot water is supplied from the boiler side, a return path returning to the boiler side, and a bypass path connecting the forward path and the return path. Is a flow control valve that controls the flow rate of hot water supplied to the radiator by increasing or decreasing the flow rate of the bypass passage, and a temperature that detects the temperature in the room of each room and is electrically connected to the flow control valve. Provided with a sensor The as the temperature of the room for each room detected by the temperature sensor, underfloor heating system, characterized in that to adjust the heat radiation amount of the radiator provided on the underfloor space 該部Ya.
JP2000250172A 2000-08-21 2000-08-21 Underfloor heating device Pending JP2002061854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000250172A JP2002061854A (en) 2000-08-21 2000-08-21 Underfloor heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000250172A JP2002061854A (en) 2000-08-21 2000-08-21 Underfloor heating device

Publications (1)

Publication Number Publication Date
JP2002061854A true JP2002061854A (en) 2002-02-28

Family

ID=18739793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000250172A Pending JP2002061854A (en) 2000-08-21 2000-08-21 Underfloor heating device

Country Status (1)

Country Link
JP (1) JP2002061854A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005188823A (en) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd Underfloor heating device and building
JP2018179409A (en) * 2017-04-13 2018-11-15 積水化学工業株式会社 Floor heating system, building, and unit building

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005188823A (en) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd Underfloor heating device and building
JP2018179409A (en) * 2017-04-13 2018-11-15 積水化学工業株式会社 Floor heating system, building, and unit building

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