JP2002055211A - Method for manufacturing microprism and optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a microprism and an optical device which can be easily manufactured in a reduced number of manufacturing processes so that the cost can be reduced. SOLUTION: A softened glass material is supplied to press molding dies (Ma, Mb) and press-formed to obtain a prism preform 30 having microprisms each having an upper face 20a and a lower face 20b parallel to each other and spectral faces 20c oblique to the upper face, as integrated with side faces almost perpendicular to the above faces. In the press forming process, V- or U-shape grooves G are formed in the position to divide the prism preform into each microprism 20. Then the preform 30 is cut along the grooves G to obtain each microprism 20. Or, the preform is laminated with a photodiode integrated circuit board and both are cut at a time to obtain an optical device having the photodiode integrated circuit board laminated with the microprism.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a microprism and an optical element, and more particularly to a method for manufacturing a microprism and an optical element used as a constituent member of a laser coupler mounted on an optical disk device.

[0002]

2. Description of the Related Art Generally, CDs (compact discs),
Reading (reproducing) information recorded on an optical recording medium (hereinafter also referred to as an optical disk) for optically recording information such as DVD (digital versatile disc) or MD (mini disc), or writing (writing) information to these. The recording (recording) device (hereinafter also referred to as an optical disk device) includes an optical pickup device.

In the above-mentioned optical disk device and optical pickup device, for example, 780n is used for reproducing a CD.
650n for laser light of m-band wavelength, DVD playback, etc.
In general, a semiconductor laser device that emits laser light having a different wavelength for each optical disk (optical disk system), such as laser light having an m-band wavelength, is used.

In the above-mentioned optical disk apparatus, for example, the above-mentioned semiconductor laser, light receiving element (photodiode), and laser light from the semiconductor laser element are emitted toward an object to be irradiated such as an optical disk, and the laser beam is emitted from the optical disk. An optical composite element called a laser coupler suitable for constituting the optical pickup device is provided, which comprises an optical member for coupling the return light to the light receiving element. The laser coupler allows the optical pickup device to be configured with a reduced number of parts to simplify the configuration of the optical system, and can be easily assembled, reduced in size, and reduced in cost.

FIG. 4A is a perspective view showing a schematic configuration of the laser coupler 1 described above. The laser coupler 1 is mounted in a concave portion of the first package member 2 and is sealed by a transparent second package member 3 such as glass.

FIG. 4B is a side view of a main part of the laser coupler 1 described above. For example, a semiconductor block 13 on which a PIN diode 12 as a photodetection element for monitoring is formed is disposed on an integrated circuit substrate 11 which is a substrate obtained by cutting out a single crystal of silicon. A laser diode 14 is provided as a light emitting element.

On the other hand, for example, the first
Photodiode 16 and second photodiode 17
Are formed, and a microprism 20 is mounted on the photodiode 18 at a predetermined interval from the laser diode 14.

The laser light L emitted from the laser diode 14 is partially reflected by the light-splitting surface 20 c of the microprism 20 and bent in the traveling direction, and emitted from the emission window formed in the second package member 3 in the emission direction. Then, the light is irradiated to an irradiation target object such as an optical disk (CD) via a reflection mirror or an objective lens (not shown). The reflected light from the irradiation target proceeds in a direction opposite to the incident direction on the irradiation target, and enters the spectral surface 20c of the microprism 20 from the emission direction from the laser coupler 1. While focusing on the upper surface 20 a of the microprism 20, the light enters the first photodiode 16 and the second photodiode 17 formed on the integrated circuit substrate 11 below the lower surface 20 b of the microprism 20.

The PIN diode 12 formed on the semiconductor block 13 senses the laser light emitted to the rear side of the laser diode 14, measures the intensity of the laser light, and determines that the intensity of the laser light is constant. APC (Automatic Po) that controls the drive current of the laser diode 14
wer Control) control is performed.

FIG. 5 shows an example in which an optical pickup device is constructed using the above laser coupler. Laser light L emitted from a laser diode built in laser coupler 1
Is a CD or DV through a collimator C, a mirror M, a CD aperture limiting aperture R and an objective lens OL.
D and the like. The reflected light from the optical disk D follows the same path as the incident light, returns to the laser coupler, and is received by the first and second photodiodes built in the laser coupler.

FIG. 6A is a perspective view of the microprism 20 mounted on the integrated circuit substrate 11, and FIG.
FIG. 6B is a side view when viewed from the direction A in FIG.
FIG. 6C is a side view when viewed from the direction B in FIG. 6A. The microprism 20 has a shape having a parallel upper surface 20a and a lower surface 20b facing each other, and a spectral surface 20c obliquely intersecting the upper surface 20a. The upper surface 20
On the a, the lower surface 20b, and the spectral surface 20c, an optical functional film such as a reflective film, a semi-transmissive film, or a non-reflective film is formed as needed by a vapor deposition method or the like. The upper surface 20a, the lower surface 20b, and the spectral surface 20c of the microprism 20 described above.
On the side surfaces S substantially perpendicular to each other, a step DF is formed for reasons of the manufacturing process.

The above-mentioned microprism 20 is arranged on a pair of photodiodes 18 formed on the integrated circuit substrate 11 and composed of a first photodiode 16 and a second photodiode 17.

A method for manufacturing the above-described microprism and a method for manufacturing an optical element having a photodiode integrated circuit substrate to which the microprism is bonded are described below.
This will be described with reference to the schematic diagrams of FIGS. First, FIG.
As shown in (a), the polishing surface P of the polishing apparatus is rotated while pressing it against the glass substrate 40, and the glass substrate 40 is polished until it has a predetermined thickness. Next, as shown in FIG. 7B, a plurality of sheets having a predetermined thickness (4 in the drawing)
The glass substrates 40 are bonded at an angle of 45 °, the corners of the glass substrate 40 are ground by a grinding device (not shown), and further polished on the polishing surface P of the polishing device. As a result, as shown in FIG. 7C, an inclined surface 40b in which the angle θ in the figure is inclined to about 45 ° with respect to the surface 40a of the glass substrate 40 is obtained.

Next, as shown in FIG.
The substrates are tilted by 5 °, unbonded, the substrates are erected and bonded again, and the top 40c ′, which is formed by the surface 40a of the glass substrate 40 and the inclined surface 40b and forms an angle of 45 °, is attached to a grinding device (not shown). And polished on the polishing surface P of the polishing apparatus. As a result, as shown in FIG. 8E, a surface 40c substantially orthogonal to the surface 40a of the glass substrate 40 is obtained. Next, as shown in FIG. 8F, the bonding in the upright state is released, and the surface 40a is removed.
Is cut by the cutter CT at a predetermined length from the surface 40c side substantially perpendicular to the surface. As a result, a plurality of microprisms having opposing parallel upper and lower surfaces 20a and 20b and a spectral surface 20c obliquely intersecting with the upper surface 20a are integrated via one side surface into a prism base material 30 having a shape. Is obtained. Next, or in the middle of the steps up to the above step, the upper surface 20 a and the lower surface 20 a
An optical functional film such as a reflective film, a semi-transmissive film, or a non-reflective film is formed on the b and the spectral surface 20c by an evaporation method or the like, if necessary.

Next, as shown in FIGS. 9 (g1) and 9 (g2), a set of photodiodes formed in a separate step and composed of the first photodiode 16 and the second photodiode 17 at a predetermined pitch. The prism base material 30 is adhered to the integrated circuit board 11a on which the photodiode 18 has been formed, using an adhesive in accordance with the position where the photodiode 18 is to be formed. FIG. 9 (g1) is a side view when viewed from the above-described slope 20c side, and FIG. 9 (g2) is a side view when viewed from a side surface orthogonal to FIG. 9 (g1). Next, as shown in FIG. 9H, for example, the prism base material 3 corresponding to an intermediate point of each set of the photodiodes 18 is formed.
In cutting position 0 and the integrated circuit board 11, by cutting the amount of using a cutter CT _W of width-thickness, corresponding to the thickness from the upper surface 20a side of the prism base material 30 to the middle of the prism base material 30, the grooves G To form Next, as shown in FIG. 9 (i), in the groove G unit is a cutting position of the prism base material 30 and the integrated circuit board 11, with a cutter CT _N wide thin prism prism base material 30 side The base material 30 and the integrated circuit board 11a are cut at the same time. As a result, the optical element is divided into individual optical elements having the photodiode integrated circuit substrate 11 to which the microprisms 20 are attached. As described above, the upper surface 20a of the microprism 20 is cut by cutting the prism base material 30 and the integrated circuit substrate 11a in two steps using cutters having different widths.
A step DF is formed on a side surface S that is substantially perpendicular to the lower surface 20b and the spectral surface 20c.

As described above, an optical element having a microprism and a photodiode integrated circuit substrate to which the microprism is bonded can be manufactured. An optical element having a photodiode integrated circuit substrate to which the above-described microprism is bonded is a semiconductor in which a PIN diode 12 is formed at a predetermined distance from the microprism and a laser diode 14 is mounted on the integrated circuit substrate. The block 13 is mounted, leads for supplying a drive voltage to the PIN diode 12, the laser diode 14, and the photodiode 18 formed on the integrated circuit board 11 and the like are wired, housed in a package member, and the optical pickup device is mounted. A laser coupler suitable for the configuration can be obtained.

[0017]

However, in the above-described method for manufacturing a microprism, a step of polishing a glass substrate or a step of polishing a slope having an angle of about 45 ° in the figure with respect to the surface of the glass substrate is performed. However, there are problems in that the number of steps is large, the steps are complicated, and the manufacturing cost is high.

Further, in the method of manufacturing an optical element having a photodiode integrated circuit substrate to which a microprism is bonded, a step of cutting the integrated circuit substrate to which a prism base material is bonded into individual optical elements is performed. It is difficult to cut the base material and the integrated circuit board at the same time, and it is necessary to cut the base material and the integrated circuit board in two steps with two types of cutters having different widths. there were.

The present invention has been made in view of the above situation, and accordingly, the present invention provides a method of manufacturing a microprism which can be easily manufactured with a reduced number of manufacturing steps and can reduce manufacturing costs. An object of the present invention is to provide a method for manufacturing an optical element having a photodiode integrated circuit substrate to which a prism is attached.

[0020]

In order to achieve the above object, a method of manufacturing a microprism according to the present invention comprises: introducing a softened glass material into a press die; Forming a prism base material having a shape integrated through at least one side surface and having a groove formed at a position separating the micro prisms; and forming the prism base material along the groove. To form individual microprisms.

In the method for manufacturing a microprism according to the present invention, preferably, the groove is a V-shaped or U-shaped groove.

In the method of manufacturing a microprism according to the present invention, preferably, the microprism has a shape having a parallel upper surface and a lower surface facing each other, and a spectral surface obliquely intersecting the upper surface. The material is integrated via side surfaces substantially perpendicular to the upper surface, the lower surface, and the spectral surface of the microprism.

In the method of manufacturing a microprism according to the present invention, a softened glass material is charged into a press mold and press-molded to form a shape in which at least a plurality of microprisms are integrated via at least one side surface. Is formed. For example, the microprism has a shape having a parallel upper surface and a lower surface facing each other, and a spectral surface obliquely intersecting the upper surface, and the upper surface, the lower surface, and the side surface substantially perpendicular to the spectral surface of the microprism, respectively. The integrated prism base material. Here, in the press molding step, a V-shaped or U-shaped groove is formed at a position separating each microprism of the prism base material. Next, the prism base material is cut along the grooves to form individual microprisms. Therefore, the microprism can be manufactured by a press forming process and a single cutting process, and the manufacturing process can be reduced, the manufacturing can be simplified, and the manufacturing cost can be reduced.

In order to achieve the above object, a method of manufacturing an optical element according to the present invention is a method of manufacturing an optical element having a photodiode integrated circuit substrate to which a microprism is bonded, wherein The formed glass material is charged and press-formed, and at least a plurality of microprisms have a shape integrated through at least one side surface, and a groove is formed at a position separating each of the microprisms. Forming a prism base material; forming photodiodes at a predetermined pitch on a semiconductor substrate to form a photodiode integrated circuit substrate; and forming the prism on the photodiode formation surface of the photodiode integrated circuit substrate. Paste the prism base material so that each microprism part of the base material corresponds to the photodiode. A step to I, the prism base material along the groove and then cutting the photodiode integrated circuit substrate, and a step of the individual optical elements having a photodiode integrated circuit board microprisms is bonded.

In the method of manufacturing an optical element according to the present invention, preferably, the groove is a V-shaped or U-shaped groove.

Preferably, in the method of manufacturing an optical element according to the present invention, the microprism has a shape having parallel upper and lower surfaces facing each other and a spectral surface obliquely intersecting the upper surface. Are integrated via side surfaces substantially perpendicular to the upper surface, the lower surface, and the spectral surface of the microprism.

According to the method of manufacturing an optical element of the present invention, a softened glass material is put into a press mold, press-molded, and has a shape in which at least a plurality of microprisms are integrated via at least one side surface. A prism base material is formed. For example, the microprism has a shape having a parallel upper surface and a lower surface facing each other, and a spectral surface obliquely intersecting the upper surface, and the upper surface, the lower surface, and the side surface substantially perpendicular to the spectral surface of the microprism, respectively. The integrated prism base material. Here, in the press molding step, a V-shaped or U-shaped groove is formed at a position separating each microprism of the prism base material. Next, a prism base material is attached on the photodiode formation surface of the photodiode integrated circuit substrate on which photodiodes are formed at a predetermined pitch such that individual microprism portions of the prism base material correspond to the photodiodes. Match. Next, the prism base material and the photodiode integrated circuit substrate are cut along the grooves to obtain individual optical elements having the photodiode integrated circuit substrate to which the microprisms are bonded. Accordingly, an optical element having a photodiode integrated circuit substrate to which a microprism is bonded can be manufactured in a press molding step, a photodiode integrated circuit substrate forming step, a bonding step, and a single cutting step. In addition, the number of manufacturing steps can be reduced, the manufacturing can be simplified, and the manufacturing cost can be reduced.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the method for manufacturing a microprism of the present invention and the method for manufacturing an optical element having a photodiode integrated circuit substrate to which a microprism is bonded will be described below with reference to the drawings. I do.

FIG. 1A shows a micro prism 2 mounted on an integrated circuit board 11 manufactured in this embodiment.
1 (b) is a side view when viewed from a direction A in FIG. 1 (a), and FIG. 1 (c) is a side view when viewed in a direction B in FIG. 1 (a).
It is a side view when seen from the direction. Micro prism 2
0 is an opposing parallel upper surface 20a and lower surface 20b;
This is a shape having a spectral surface 20c obliquely intersecting the upper surface 20a. The light splitting surface 20c is a surface that intersects the upper surface 20a and the lower surface 20b at an angle of 45 °, for example. The upper surface 20a, the lower surface 20b, and the spectral surface 20
On c, an optical functional film such as a reflective film, a semi-transmissive film, or a non-reflective film is formed as necessary by a vapor deposition method or the like. The upper surface 20a and the lower surface 2 of the micro prism 20
An inclined surface 20d is formed on each of the side surfaces S substantially perpendicular to 0b and the spectral surface 20c for reasons of the manufacturing process.

The above-described microprism 20 is arranged on a pair of photodiodes 18 formed on the integrated circuit substrate 11 and composed of the first photodiode 16 and the second photodiode 17.

A method for manufacturing the above-described microprism and a method for manufacturing an optical element having a photodiode integrated circuit substrate to which the microprism is attached are described.
This will be described with reference to the schematic diagrams of FIGS. First, as shown in FIG. 2 (a), a softened glass material is put into a cavity CV composed of a press mold (Ma, Mb), and pressed in the direction of the arrow in the figure to perform press molding. A prism base material 30 having a shape in which at least a plurality of microprisms are integrated via at least one side surface, and a groove is formed at a position separating each microprism.
To form

FIG. 2B is a perspective view of the prism base material 30 formed by the above-described press forming step. The prism base material 30 includes, for example, a plurality of (three in the drawing) microprisms 20 each having a parallel upper surface 20a and a lower surface 20b facing each other and a spectral surface 20c obliquely intersecting the upper surface 20a. 20 upper surface 20
a, a lower surface 20b and a spectral surface 20c are integrated via side surfaces substantially perpendicular to each other, and a V-shaped or U-shaped groove G is formed at a position for partitioning between the microprisms 20. Have been. That is, for example, 45 ° with respect to the opposed parallel upper surface 20a, lower surface 20b, and upper surface 20a and lower surface 20b of the microprism 20.
The light-splitting surface 20c intersecting at an angle of? Is a surface defined by the inner wall surfaces of the press dies (Ma, Mb) used in the press forming step.

Next, if necessary, the upper surface 20a, the lower surface 20b, and the spectral surface 20c of the obtained prism base material 30 may be polished. If necessary, an optical functional film such as a reflective film, a semi-transmissive film, or a non-reflective film is formed on the upper surface 20a, the lower surface 20b, and the spectral surface 20c of the prism base material 30 by an evaporation method or the like. In this case, as a method for forming the optical function film, a conventionally used general method can be appropriately selected and used.

By cutting the above-mentioned prism base material 30 with a cutter or the like along the above-mentioned grooves, individually divided microprisms can be manufactured. A method for forming an optical element having a photodiode integrated circuit substrate to which a microprism is bonded by simultaneously cutting a prism base material and a photodiode integrated circuit substrate by being bonded to a diode integrated circuit substrate will be described.

As shown in FIGS. 3 (c1) and 3 (c2), a set of photodiodes 18 formed in a separate step and composed of the first photodiode 16 and the second photodiode 17 are formed at a predetermined pitch. The prism base material 30 is adhered to the integrated circuit board 11a with an adhesive in accordance with the position where the photodiode 18 is formed. FIG. 3 (c1) is a side view when viewed from the above-described slope 20c side, and FIG. 3 (c2) is a side view when viewed from a side surface orthogonal to FIG. 3 (c1).

Next, as shown in FIG.
In a groove G portion corresponding to a cutting position between the prism base material 30 and the integrated circuit board 11, which is an intermediate point of the set of the photodiodes 18, the prism base material 30 and the prism base material 30 Integrated circuit board 11
a is cut at the same time. Thereby, as shown in FIG. 1, the optical element is divided into individual optical elements having the photodiode integrated circuit substrate 11 to which the microprism 20 is attached. As described above, the prism base material 30 and the integrated circuit board 11a are formed in the groove G where the prism base material 30 is formed.
By cutting the upper surface 2 of the microprism 20
An inclined surface 20d which forms a part of the groove G is formed on a side surface S substantially perpendicular to the lower surface 20a, the lower surface 20b, and the spectral surface 20c.

As described above, an optical element having a microprism and a photodiode integrated circuit substrate to which the microprism is bonded can be manufactured.

According to the above-described method for manufacturing a microprism, a microprism can be manufactured by a press forming step and a single cutting step, so that the number of manufacturing steps can be reduced, the manufacturing can be simplified, and the manufacturing cost can be reduced. be able to.

According to the method for manufacturing an optical element having the photodiode integrated circuit substrate to which the microprisms are bonded, the press forming step, the photodiode integrated circuit substrate forming step, and the bonding step include the following steps. In a single cutting step, an optical element having a photodiode integrated circuit substrate to which a microprism is bonded can be manufactured, and the manufacturing steps can be reduced and the manufacturing can be simplified.
Manufacturing costs can be reduced.

On an integrated circuit board of an optical element having a photodiode integrated circuit board to which the above-mentioned microprism is bonded, a PIN diode 12 is formed at a predetermined distance from the microprism, and a laser diode 14 is mounted. The semiconductor block 13 is mounted, leads for supplying a drive voltage to the PIN diode 12, the laser diode 14, the photodiode 18 formed on the integrated circuit board 11 and the like are wired, and are housed in a package member. It is possible to configure a laser coupler suitable for configuring an optical pickup device such as described above.

FIG. 4A is a perspective view showing a schematic structure of the laser coupler 1 described above. The laser coupler 1 is mounted in a concave portion of the first package member 2 and is sealed by a transparent second package member 3 such as glass.

FIG. 4B is a side view of a main part of the laser coupler 1 described above. Micro prism 20 according to the present embodiment
A semiconductor block 13 on which a PIN diode 12 as a photodetection element for monitoring is formed is disposed on the integrated circuit substrate 11 of the optical element having the photodiode integrated circuit substrate 11 to which is adhered. A laser diode 14 is arranged on 13 as a light emitting element.

On the other hand, on the integrated circuit substrate 11, as described above, a set of photodiodes 18 composed of, for example, the first photodiode 16 and the second photodiode 17 is formed. A microprism 20 is mounted at a predetermined distance from the laser diode 14.

The laser light L emitted from the laser diode 14 is partially reflected by the light-splitting surface 20c of the microprism 20 and bent in the traveling direction, and emitted from the emission window formed in the second package member 3 in the emission direction. Then, the light is irradiated to an irradiation target object such as an optical disk (CD) via a reflection mirror or an objective lens (not shown). The reflected light from the irradiation target proceeds in a direction opposite to the incident direction on the irradiation target, and enters the spectral surface 20c of the microprism 20 from the emission direction from the laser coupler 1. While focusing on the upper surface 20 a of the microprism 20, the light enters the first photodiode 16 and the second photodiode 17 formed on the integrated circuit substrate 11 below the lower surface 20 b of the microprism 20.

The PIN diode 12 formed on the semiconductor block 13 senses the laser light emitted to the rear side of the laser diode 14, measures the intensity of the laser light, and determines that the intensity of the laser light is constant. APC (Automatic Po) that controls the drive current of the laser diode 14
wer Control) control is performed.

FIG. 5 shows an example in which an optical pickup device is constructed using the above laser coupler. Laser light L emitted from a laser diode built in laser coupler 1
Is a CD or DV through a collimator C, a mirror M, a CD aperture limiting aperture R and an objective lens OL.
D and the like. The reflected light from the optical disk D follows the same path as the incident light, returns to the laser coupler, and is received by the first and second photodiodes built in the laser coupler. As described above, a laser coupler can be configured by incorporating an optical element having the photodiode integrated circuit substrate 11 to which the microprisms 20 manufactured according to the present embodiment are bonded.

Although the present invention has been described with reference to the embodiments, the present invention is not limited to these embodiments. For example, the shape of the microprism can be applied to a shape other than the above. Further, the laser diode elements and package members constituting the laser coupler are merely examples, and for example, a two-wavelength laser diode in which two laser diodes are monolithically formed can be used. Alternatively, for the two monolithically configured laser diodes, in addition to elements having different emission wavelengths, elements having the same emission wavelength but different emission intensities, or elements having the same element characteristics can be used. It is also possible to configure a laser coupler having three or more laser diodes. Others
Various changes can be made without departing from the spirit of the present invention.

[0048]

According to the method for manufacturing a microprism of the present invention, a microprism can be manufactured by a press forming step and a single cutting step, and the manufacturing steps can be reduced, the manufacturing can be simplified, and the manufacturing cost can be reduced. Can be reduced.

According to the method for manufacturing an optical element of the present invention, the press-molding step, the step of forming the photodiode integrated circuit substrate, the bonding step, and the single-step cutting step allow the photodiode having the microprisms bonded thereto. An optical element having an integrated circuit substrate can be manufactured, the number of manufacturing steps can be reduced, the manufacturing can be simplified, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1A is a perspective view of a microprism and an optical element according to the present embodiment, and FIG. 1B is a perspective view of FIG.
1A is a side view when viewed from a direction A, and FIG. 1C is a side view when viewed from a direction B in FIG.

FIG. 2A is a schematic view showing a manufacturing process of a manufacturing method of a microprism and an optical element according to the present embodiment up to a press molding process, and FIG. It is a perspective view of the prism base material which was done.

3 (c1) and (c2) are schematic views showing a step following the step shown in FIG. 2 in which a prism base material is bonded to a photodiode integrated circuit substrate, and FIG. 3 (c1)
3 (c2) is FIG. 3 (c1) when viewed from one side.
FIG. 3 is a schematic diagram when viewed from a side surface orthogonal to FIG.
FIG. 3D is a schematic view showing a process up to the step of cutting the photodiode integrated circuit substrate from the prism base material into individual optical elements.

FIG. 4A is a perspective view showing a schematic configuration of a laser coupler according to an embodiment and a conventional example, and FIG. 4B is a side view of a main part of the laser coupler shown in FIG. 4A. is there.

FIG. 5 is a schematic configuration diagram when an optical pickup device is configured using the laser coupler according to the embodiment and the conventional example.

FIG. 6A is a perspective view of a microprism and an optical element according to a conventional example, and FIG. 6B is a perspective view of FIG.
FIG. 6C is a side view when viewed from the direction A in FIG. 6A, and FIG. 6C is a side view when viewed from the direction B in FIG. 6A.

FIG. 7A is a schematic diagram showing a process of manufacturing a micro-prism and an optical element according to a conventional example up to a polishing process of a glass substrate in a manufacturing process, and FIG. FIG. 7C is a schematic view showing a process up to a step of grinding and polishing a corner portion by bonding together, and FIG. 7C is a schematic view showing a slope formed by the grinding and polishing processing of FIG. 7B.

FIG. 8D is a schematic view showing a step following the step of FIG. 2 in which the glass substrate is erected and bonded again, and the top of the glass substrate is ground and polished.
FIG. 9E is a schematic diagram illustrating a slope formed by the grinding and polishing processes of FIG. FIG. 8 (f) is a schematic view showing the process up to the step of cutting a predetermined length from the polished surface.

9 (g1) and 9 (g2) are schematic views showing a step following the step shown in FIG. 8 in which the prism base material is bonded to the photodiode integrated circuit substrate, and FIG. 9 (g1)
9 (g2) is FIG. 9 (g1) when viewed from one side.
FIG. 3 is a schematic diagram when viewed from a side surface orthogonal to FIG.
FIG. 9H is a schematic diagram showing a process up to a step of forming a groove, and FIG. 9I is a schematic diagram showing a process up to a process of cutting a photodiode integrated circuit substrate from a prism base material into individual optical elements.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laser coupler, 2 ... 2nd package member, 3 ... 2nd
Package members, 11, 11a: photodiode integrated circuit board, 12: PIN diode, 13: semiconductor block, 14: laser diode, 16: first photodiode, 17: second photodiode, 18: photodiode, 20: micro Prism, 20a ... upper surface, 2
0b: lower surface, 20c: spectral surface, 20d: inclined surface, 30:
Prism base material, C: collimator, CT: cutter, CV
... cavity, D ... optical disk, DF ... step, G ... groove,
M: mirror, Ma, Mb: press mold, OL: objective lens, R: aperture limiting aperture for CD, S: side surface.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01L 31/10 H01L 31/12 G 31/12 H01S 5/026 H01S 5/026 H01L 31/10 A F term (reference) 2H042 CA01 CA07 CA10 CA15 CA17 4G015 FA01 FB01 FC02 5F049 MA01 NA18 NA20 NB08 RA02 RA06 SS02 TA03 TA11 5F073 AB21 AB25 AB27 BA05 FA13 5F089 BA04 BB01 BC02 BC11 CA20 CA21 GA01

Claims (6)

[Claims] 1. A softened glass material is charged into a press mold and press-molded, and at least a plurality of microprisms have a shape integrated through at least one side surface, and a space between the microprisms is provided. A method for manufacturing a microprism, comprising: a step of forming a prism base material having a groove formed at a sectioning position; and a step of cutting the prism base material along the groove to form individual microprisms. 2. The method according to claim 1, wherein the groove is a V-shaped or U-shaped groove. 3. The microprism has a shape having a parallel upper surface and a lower surface facing each other, and a spectral surface obliquely intersecting the upper surface, and the prism base material includes the upper surface, the lower surface, and the spectral surface of the microprism. 2. The method of manufacturing a microprism according to claim 1, wherein the microprisms are integrated via side surfaces substantially perpendicular to the surfaces. 4. A method of manufacturing an optical element having a photodiode integrated circuit substrate to which a microprism is bonded, wherein a softened glass material is charged into a press mold and press-molded to form at least a plurality of microprisms. Forming a prism base material having a shape integrated through at least one side surface and having a groove formed at a position for partitioning the microprisms; Forming a diode to form a photodiode integrated circuit board; and, on the photodiode formation surface of the photodiode integrated circuit board, so that each microprism portion of the prism base material corresponds to the photodiode.
Bonding the prism base material and cutting the prism base material and the photodiode integrated circuit board along the groove to form individual optical elements having a photodiode integrated circuit substrate to which microprisms are bonded. A method for producing an optical element comprising: 5. The method according to claim 4, wherein the groove is a V-shaped or U-shaped groove. 6. The microprism has a shape having parallel upper and lower surfaces facing each other and a spectral surface obliquely intersecting with the upper surface, and the prism base material includes the upper surface, the lower surface, and the spectral surface of the microprism. The method for manufacturing an optical element according to claim 4, wherein the optical elements are integrated via side surfaces substantially perpendicular to the surfaces.