JP2002048725A - Chip appearance inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To properly photograph a chip part in a photographing space by means of a camera stably at a high speed. SOLUTION: This chip appearance inspection device A is constructed of an upstream side flow passage 11 matching the cross sectional shape of the chip part, a downstream side flow passage 12 facing the upstream side flow passage 11 via the photographing space R and allowing passage of the chip part, a pressure differential transferring means (suction pipe 31) transferring the chip part from the upstream side flow passage 11 to the downstream side flow passage 12 via the photographing space R by means of a pressure difference, the camera 13c arranged in accordance with the photographing space R for taking a picture of the chip part just when it popped out from the upstream side flow passage 11 to the photographing space R, and a selection mechanism A2 selecting the chip part based on the photographic result by means of the camera 13c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip appearance inspection apparatus for inspecting the appearance of chip parts and selecting chip parts according to the result.

[0002]

2. Description of the Related Art A conventional chip appearance inspection apparatus is, for example,
JP-A-8-247740 or JP-A-11-13
No. 2,758, the chip component is placed on a rotating table or a linearly moving belt table and moved, and is imaged with a camera. A mechanism for selecting chip components is employed.

[0003]

In the above-described conventional chip appearance inspection apparatus, since the chip component is mounted on the table and the image is taken, the interface between the chip component and the table affects the image taking. Further, since the mechanism for selecting chip components is complicated, troubles are likely to occur, and stable inspection and selection may not be performed.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a chip appearance inspection apparatus which includes an upstream flow path adapted to a cross-sectional shape of a chip component, and an upstream flow path. A downstream flow path opposed to the imaging space through which the chip component can flow, and a pressure difference for transferring the chip component from the upstream flow path to the downstream flow path through the imaging space to the downstream flow path using a pressure difference. A transfer unit, a camera arranged corresponding to the imaging space and imaging the chip component at the moment when the chip component jumps out of the upstream channel into the imaging space, and selecting the chip component based on an imaging result by the camera. A configuration having a sorting mechanism (the invention according to claim 1)
There is a feature.

In this case, the sorting mechanism includes a supply station provided corresponding to the outflow side of the downstream flow path and a plurality of supply stations sequentially provided at a predetermined circumferential pitch with respect to the supply station. Having a sorting station, the chip component is rotated by one pitch after being loaded at the supply station, and the chip component is unloaded at a corresponding sorting station according to an inspection result based on an image captured by the camera. (The invention according to claim 2).

[0006]

In the chip appearance inspection apparatus according to the present invention (the invention according to claim 1), a chip component whose moving direction and posture are determined by the upstream flow path is projected from the upstream flow path into the imaging space. An image is taken with a camera at the moment when the chip component has a stable posture at that time, so that the chip component can be imaged in a stable posture. In addition, since the chip components that are flying in the imaging space are imaged by the camera, the effects of the surrounding environment and the background (the effects of the interface) can be excluded, and the chip components can be accurately imaged. Can be. Further, the configuration of the imaging unit is such that the upstream flow path conforming to the cross-sectional shape of the chip component, the downstream flow path facing the flow path through the imaging space, and the downstream flow path from the upstream flow path through the imaging space. Since it has a simple configuration including a pressure difference transfer unit that transfers a chip component to a road by utilizing a pressure difference, high-speed and stable imaging can be performed.

Further, in the chip appearance inspection apparatus according to the present invention (the invention according to claim 2), a selection mechanism for selecting chip components includes a supply station provided corresponding to the outflow side of the downstream flow path, The supply station has a plurality of sorting stations sequentially provided at a predetermined circumferential pitch. After one chip component is carried in at the supply station, the chip part rotates one pitch, and the chip component is rotated based on a result of imaging by a camera. Since the mechanism is a mechanism that unloads chip components at a sorting station corresponding to the inspection result, the stations can be arranged on the same circumference, and the sorting mechanism can be made compact. Further, by providing the above-described pressure difference transfer means in the supply station, the chip components transferred from the upstream flow path to the downstream flow path through the imaging space can be transferred to the supply station, and the imaging timing of the camera can be improved. , The pitch rotation timing in the selection mechanism can be set.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. The chip appearance inspection apparatus A according to the present invention shown in FIGS. 1 and 2 is mounted on a base C together with a well-known vibrating parts feeder B. In addition, the chip appearance inspection device A is provided with
, And the imaging unit A1 and the sorting mechanism A2
It has. Note that chip components W of 0.5 mm square and 1.0 mm length are sequentially conveyed to the carry-out exit Ba of the parts feeder B in a state of being aligned in a line (see FIG. 4).

As shown in FIGS. 1 to 3, the imaging unit A1 includes an upstream flow path 11, a downstream flow path 12,
CCD cameras 13a, 13b, 13c, 13d,
Four illuminations (strobes) 14a, 14b, 14c, 14
d, a pair of photoelectric sensors 15a and 15b, and a suction pipe 31 as a pressure difference transfer means also serving as a pressure difference transfer means in the sorting mechanism A2. In addition,
The CCD cameras 13a, 13b, 13c, and 13d, the illuminations (strobes) 14a, 14b, 14c, and 14d, and the photoelectric sensors 15a and 15b are connected to a control device (not shown) and operate in cooperation. ing.

As shown in FIGS. 3, 4 and 5, the upstream flow path 11 is formed in a shape (rectangular shape slightly larger than 0.5 mm square) corresponding to the cross-sectional shape of the chip component W. At the inflow side end, the outlet Ba of the parts feeder B
At a small gap S. The gap S is also an air intake port, and is a gap of about 0.5 mm at 1.0 mm or less (less than the length of the chip component W), and the chip component W sent from the outlet Ba of the parts feeder B is upstream. It is automatically carried into the side channel 11.

The downstream flow path 12 is opposed to the upstream flow path 11 with the imaging space R interposed therebetween. The downstream flow path 12 is formed in a tapered hole shape in which one half of the inflow side expands toward the inflow side. The side half is formed in a straight hole shape, and the chip component W can be distributed. The imaging space R is a closed space, and the air flow from the upstream flow path 11 to the downstream flow path 12 caused by the suction of air into the suction pipe 31 is linear in the imaging space R, In, a laminar flow is formed. The air flow to the upstream flow path 11 is generated by the air being sucked into the inlet of the upstream flow path 11 through the gap S, and the air flows into the inlet of the upstream flow path 11 from the outlet Ba of the parts feeder B to the chip. When the component W is being fed, the chip component W is transferred to the upstream channel 1.
Transfer to the 1 outlet.

Each of the CCD cameras 13a, 13b, 13c,
13d is a pair of photoelectric sensors 1 arranged at a cross corresponding to the imaging space R and provided at the exit of the upstream side flow path 11 so as to simultaneously image the four external appearances in the longitudinal direction of the chip component W.
Triggering the detection of the passage of the chip component W by the reference numerals 5a and 15b triggers four illuminations (strobes) 14a, 14b and 1
By irradiating the chips 4c and 14d simultaneously, an image of the chip component W at the moment when the chip component W jumps into the imaging space R from the upstream channel 11 is taken. In addition, each CCD camera 13
The imaging results obtained by a, 13b, 13c, and 13d are sent to a control device (not shown), and are processed by the control device (not shown). Product.

As shown in FIGS. 3, 6, and 7, the sorting mechanism A2 includes CCD cameras 13a, 13b, 13c, 1
The operation is controlled by a control device (not shown) based on the imaging result by 3d to select the chip components W. The rotor 21 and the rotor 21 are arranged at a predetermined pitch (specifically, 45 degrees per pitch). 3 includes a driving device 22 that rotates in the counterclockwise direction in FIG. 3, one suction pipe 31, and three discharge pipes 32, 33, and 34, and has eight stations ST1 to ST8. I have.

As shown in FIG. 6, the rotor 21 is rotatably mounted on the support 23 in a sealed state, is provided at equal intervals in the circumferential direction, opens radially outward, and Eight receiving recesses 21a selectively communicating with the inner peripheral portion of the flow channel 12, eight radial vent holes 21b respectively communicating with the inner peripheral portions of the respective receiving concave portions 21a, and The inner peripheral portion has eight axial ventilation holes 21c communicating with each other at the upper end, and allows air to flow between each housing recess 21a and each radial ventilation hole 21b to allow passage of the chip component W. A fine mesh (not shown) for blocking and receiving is provided.

As shown in FIG. 3, the stations ST1 to ST8 are provided at equal intervals (45 ° intervals) in the circumferential direction, and are provided corresponding to the outflow side of the downstream flow path 12. The station ST1 is a supply station, and three stations ST3 (90 degrees counterclockwise from the supply station ST1) are sequentially provided with respect to the supply station ST1 at intervals of 90 degrees in the counterclockwise direction in FIG. Positions), ST5 (position 180 degrees counterclockwise from supply station ST1), ST7 (position 270 degrees counterclockwise from supply station ST1) are acceptable product sorting station, indistinguishable product sorting station, rejected product It is a sorting station.

In the supply station ST1, as shown in FIG. 3, the axial ventilation holes 21c provided in the rotor 21 coincide with and communicate with the vertical ventilation holes 23a provided in the support 23 at the lower end. I have. In the accepted product selection station ST3, the axial vent 21c provided in the rotor 21
At the lower end thereof correspond to and communicate with the vertical ventilation holes 23b provided in the support 23. In the indistinguishable product sorting station ST5, the axial ventilation holes 21c provided in the rotor 21 coincide with and communicate with the vertical ventilation holes 23c provided in the support 23 at the lower end. In the rejected product selection station ST7, the axial ventilation holes 21c provided in the rotor 21 coincide with and communicate with the vertical ventilation holes 23d provided in the support 23 at the lower end.

As shown in FIGS. 6 and 7, the vertical ventilation hole 23a of the support 23 communicates with the horizontal ventilation hole 23e provided in the support 23 at the lower end. The suction pipe 31 is connected. As shown in FIG. 7, the vertical ventilation holes 23b of the support 23 communicate with the horizontal ventilation holes 23f provided in the support 23 at the lower end, and the discharge pipe 32 is connected to the horizontal ventilation holes 23f. ing. The vertical ventilation hole 23c of the support 23 is
As shown in FIG. 7, the lower end communicates with the lateral ventilation hole 23g provided in the support 23, and the lateral ventilation hole 23g
Is connected to a discharge pipe 33. As shown in FIG. 7, the vertical ventilation hole 23d of the support 23 communicates with a horizontal ventilation hole 23h provided in the support 23 at the lower end, and a discharge pipe 34 is connected to the horizontal ventilation hole 23h. ing.

The suction pipe 31 is a pressure reducing device (not shown).
, And is always sucked at a negative pressure (a negative pressure that can be appropriately adjusted) set by a pressure reducing device (not shown). Each of the discharge pipes 32, 33, and 34 is connected to a pressurizing device (not shown) via a switching valve (not shown), and has a positive pressure (appropriately adjustable) set by the pressurizing device (not shown). (Positive pressure) air (pressurized air) is selectively supplied via each switching valve (not shown).

Each switching valve (not shown) is a CCD camera 1
The operation is controlled by a control device (not shown) to which the imaging results by 3a, 13b, 13c, 13d are sent, and the CCD cameras 13a, 13b, 13c, 1
The following operations are obtained according to the inspection result of the chip component W imaged in 3d. CCD
When it is determined that the chip component W imaged by the cameras 13a, 13b, 13c, and 13d is a pass product, the discharge pipe 32 is pressurized when the chip component W is transported to the pass product selection station ST3. The air is supplied, and the chip component W is carried out toward the OK position in FIG.

The CCD cameras 13a, 13b, 13
If it is determined that the chip component W imaged by c and 13d is an indistinguishable product, pressurized air is supplied to the discharge pipe 33 when the chip component W is transported to the indistinguishable product sorting station ST5. Then, the chip component W is carried out toward the GRAY position in FIG. Also, CCD
When it is determined that the chip component W imaged by the cameras 13a, 13b, 13c, 13d is a rejected product, the chip component W is rejected product selection station ST7.
When conveyed, the pressurized air is supplied to the discharge pipe 34, and the chip component W is carried out toward the NG position in FIG. Note that the OK position in FIG.
A tray (not shown) is provided at each of the Y position and the NG position.
Is installed and used.

Further, in the sorting mechanism A2, after the pair of photoelectric sensors 15a and 15b detect the passage of the chip component W, a set time (the chip component W passing between the photoelectric sensors 15a and 15b moves to the imaging space R and the downstream side). After passing through the side flow path 12 and reaching the housing recess 21 a of the rotor 21, the housing recess 21 a
The operation is controlled by a control device (not shown) at a point in time when a time slightly longer than the time required to be received by the net at a is passed (after one chip component W is carried in at the supply station ST1). The driving device 22 rotates the rotor 21 by one pitch (rotates 45 degrees).

In the chip appearance inspection apparatus A of this embodiment configured as described above, one chip component W is received from the carry-out port Ba of the parts feeder B by the accommodation recess of the rotor 21 at the supply station ST1 of the selection mechanism A2. At the same time when the chip component W is suctioned and transferred to the storage space 21a, the chip component W is imaged by the CCD cameras 13a, 13b, 13c, and 13d in the imaging space R. The operation in which the rotor 21 is rotated 45 degrees by the driving device 22 in a state where one chip component W is accommodated in 21a is continuously repeated, and the CCD cameras 13a, 13b, 1
According to the inspection result of the chip parts W imaged by 3c and 13d, an operation is obtained in which the chip parts W are discharged at the accepted goods sorting station ST3, the unidentifiable goods sorting station ST5, or the rejected goods sorting station ST7. Can be

In the chip appearance inspection apparatus A of this embodiment, the CCD component W whose moving direction and orientation is determined by the upstream flow path 11 jumps out of the upstream flow path 11 into the imaging space R at the moment when the CCD Cameras 13a, 13b,
Images are taken at 13c and 13d. At that time, since the attitude of the chip component W is stable, it is possible to image the chip component W in a state where the attitude is stable.

Since the chip components W flying in the imaging space R are imaged by the CCD cameras 13a, 13b, 13c and 13d, the influence of the surrounding environment and the influence of the background (the influence of the interface) are excluded. Can be a chip component W
Can be accurately imaged. Further, the configuration of the imaging unit A1 is such that the upstream-side flow path 1 conforms to the cross-sectional shape of the chip component W.
1, a downstream flow path 12 opposed thereto with an imaging space R interposed therebetween, and a pressure difference transfer means for sucking and transferring chip components from the upstream flow path 11 to the downstream flow path 12 through the imaging space R. Since the suction pipe 31 has a simple configuration, high-speed and stable imaging can be performed.

Further, the chip appearance inspection apparatus A of this embodiment
In, the sorting mechanism A2 for sorting chip components W
A supply station ST1 provided corresponding to the outflow side of the downstream flow path 12, and a plurality of sorting stations ST2 to ST8 sequentially provided at a predetermined circumferential pitch with respect to the supply station ST1, After one chip component W is carried in at the supply station ST1, the chip component W is rotated by one pitch, and the CCD cameras 13a, 13b, 13c, and 13d are rotated.
Is a mechanism for unloading the chip component W at the corresponding sorting station ST3, ST5 or ST7 according to the inspection result based on the imaging result of each station ST1.
To ST8 can be arranged on the same circumference, and the sorting mechanism A2 can be made compact.

The supply station ST1 is provided with the above-mentioned suction pipe 31 as a pressure difference transfer means, and the chip component W sucked and transferred from the upstream flow path 11 to the downstream flow path 12 through the imaging space R. The suction transfer can be performed to the supply station ST1, and the pitch rotation timing in the selection mechanism A2 can be set based on the imaging timing of the CCD cameras 13a, 13b, 13c, and 13d. Therefore, there is no need to detect that the chip component W has been transferred to the supply station ST1.

In the above embodiment, the four CCD cameras 13a, 13b, 13c, and 13d are used to simultaneously image the four external appearances of the chip component W in the longitudinal direction. It is also possible to implement at least one surface with a camera. In the above embodiment, the pressure difference is generated by sucking air, and the chip component W is suction-transferred by using the pressure difference. However, the pressure difference is generated by increasing the pressure on the sending side. Then, the chip component W may be discharged and transferred using the pressure difference.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a chip appearance inspection apparatus according to the present invention.

FIG. 2 is a front view showing an imaging unit of the chip appearance inspection device shown in FIG.

FIG. 3 is an enlarged plan view of a main part of the chip appearance inspection device shown in FIG. 1;

FIG. 4 is an enlarged cross-sectional view showing a relationship between an upstream side flow path shown in FIGS. 1 and 3 and an outlet of a parts feeder.

FIG. 5 is an outflow side end view of an upstream side flow path shown in FIG. 4;

FIG. 6 is a vertical sectional side view of a sorting mechanism in the chip appearance inspection device shown in FIGS. 1 and 3.

FIG. 7 is a cross-sectional plan view taken along line 7-7 of FIG. 6;

[Explanation of symbols]

11: Upstream flow path, 12: Downstream flow path, 13a, 13
b, 13c, 13d ... CCD camera, 14a, 14b,
14c, 14d ... lighting (strobe), 15a, 15b ...
Photoelectric sensor, 21 ... rotor, 21a ... accommodation recess, 21b
... radial vent, 21c ... axial vent, 22 ... drive, 23 ... support, 23a to 23h ... vent, 31 ...
Suction pipe, 32, 33, 34 ... discharge pipe, ST1 ...
Supply station, ST3 ... Successful goods sorting station,
ST5: Unidentifiable product sorting station, ST7: Rejected product sorting station, R: Imaging space, A: Chip visual inspection device, A1: Imaging unit, A2: Sorting mechanism, B: Parts feeder, Ba: Loading exit of parts feeder , W ... chip parts.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuhiro Umino 283 Aoyamachi, Aoyacho, Hamamatsu City, Shizuoka Prefecture Inside (72) Inventor Yasuaki Mizuno 283 Aoyamachi, Hamamatsu City, Shizuoka Prefecture Inside Yamaha Fine Tech Co., Ltd. 72) Inventor Hiroyuki Murakami 283 Aoyacho, Hamamatsu-shi, Shizuoka Prefecture Inside Yamaha Fine Tech Co., Ltd. (72) Inventor Shinobu Kawase 283 Aoyacho, Hamamatsu-shi, Shizuoka Prefecture Yamaha Fine Tech Co., Ltd. F-term (reference) 2F065 AA49 CC25 DD06 DD11 DD12 FF04 GG03 GG08 JJ03 JJ05 JJ26 PP11 QQ31 TT03 2G051 AA61 AB20 BB02 BC02 CA04 CA08 CB01 CD01 CD06 CD07 DA01 DA13

Claims (2)

[Claims] An upstream flow path adapted to a cross-sectional shape of the chip component; a downstream flow path opposed to the upstream flow path via an imaging space and through which the chip component can flow; A pressure difference transfer unit that transfers the chip component using a pressure difference from the flow path to the downstream flow path through the imaging space, and a pressure difference transfer unit that is disposed corresponding to the imaging space and from the upstream flow path to the imaging space; A chip visual inspection device comprising: a camera for imaging the chip component at the moment when the chip component pops out; and a selection mechanism for selecting the chip component based on an imaging result of the camera. 2. The chip visual inspection device according to claim 1, wherein said sorting mechanism is provided at a supply station corresponding to an outflow side of said downstream flow path, and a predetermined circumferential direction with respect to said supply station. It has a plurality of sorting stations sequentially provided at a pitch, rotates one pitch after the chip component is carried in one at the supply station, and corresponds to an inspection result based on an imaging result by the camera. A chip appearance inspection device, which is a mechanism for carrying out the chip component at a sorting station.