JP2002043378A - Electron beam tester and testing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electron beam tester that can measure a sample with accuracy by suppressing the electrostatic charge of the sample caused by an electron beam. SOLUTION: This electron beam tester is provided with an electron gun 114 which emits an electron beam against electric component, a deflector which deflects the electron beam to a desired position on the electric component, and a position correcting data storing section 150 which stores position correcting data used for correcting the emitting position of the electron beam. The tester is also provided with a deflection control section 148 which reads out the position correcting data from the storing section 150 and controls the deflector 120 synchronously to a test signal based on the read out position correcting data, and a detector 124 which detects electrons radiated from the electric component and outputs the detect signal corresponding to the quantity of the electrons. The deflection control section 148 preferably controls the deflector 120 synchronously to the sampling timing of the detect signal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an electron beam tester and a test method. In particular, the present invention relates to an electron beam tester that can perform accurate measurement without increasing the measurement time.

[0002]

2. Description of the Related Art FIG. 1 shows a conventional electron beam tester 300.
Is shown. The electron beam tester 300 includes an electron beam irradiation system 310 that irradiates an electronic component with an electron beam, and a control system 36.
0.

The electron beam irradiation system 310 includes a housing 312
, An electron gun 314 for generating an electron beam, and an aperture section 318 having an aperture through which the electron beam passes
A blanking electrode 316 for controlling whether or not the electron beam is irradiated on the electric component by deflecting the electron beam and controlling whether or not the electron beam passes through the aperture; A deflector 320 for deflecting the component to a desired position and a stage 32 on which the electric component is placed
6 and a detector 324 that detects electrons emitted from the electric component and outputs a detection signal corresponding to the amount of electrons.

The control system 360 includes a blanking electrode 316
352, a deflection control section 348 for controlling the deflector 320, a delay data storage section 336 for storing delay data, and a delay circuit section for generating a sampling pulse based on the trigger signal and the delay data. 334
A detection signal processing unit 332 for sampling based on a sampling pulse; counters (340 and 342) for supplying a count value to a delay data storage unit 336; and a scan image of an electric component based on the sampled detection signal. And a waveform processing unit 34 for obtaining a waveform corresponding to the test signal based on the detection signal.
And 4.

FIG. 2 shows a timing chart of the operation of the conventional electron beam tester 300, a waveform of a test signal, and a measured waveform. The operation of the conventional electron beam tester 300 will be described with reference to FIG. FIG. 2A shows a timing chart of an operation of acquiring a scanned image. Based on the trigger signal indicating the measurement phase of the test signal, the delay circuit unit 334 generates a sampling pulse indicating the timing for sampling the detection signal. Detection signal processing unit 33
2 samples the detection signal based on the sampling pulse and supplies it to the image processing unit 346. Also, after the sampling pulse is supplied, in synchronization with the clock,
The delay data corresponding to the next measurement phase is
2 is supplied.

[0006] The image processing section 346 acquires a scanned image of the electric component based on the supplied detection signal. further,
The image processing unit 346 performs image processing on the acquired scanned image,
Position correction data for correcting the irradiation position of the electron beam on the electric component is obtained for each phase of the test signal.

FIG. 2B shows a timing of an operation for acquiring a waveform. The irradiation position of the electron beam is corrected using the obtained position correction data, and a waveform of the test signal corresponding to the phase of the test signal is obtained at a predetermined position of the electric component. The conventional electron beam tester 300 controls the timing for changing the delay data and the position correction data corresponding to the measurement phase by software. Then, the detection signal processing unit 332 performs a large number of samplings based on the sampling pulse in the corresponding measurement phase of the position correction data, and supplies the detection signal to the waveform processing unit 344. The waveform processing unit 334 generates a waveform based on the average value of the detection signal corresponding to each phase of the test signal.

[0008]

The conventional electron beam tester 300 changes the position correction data by software. Therefore, for example, immediately after changing the position correction data, when the electron beam passes through the deflector 320,
Since the settling time of the deflector 320 is insufficient, the electron beam cannot be deflected to an appropriate position and irradiated. As a result, it is very difficult to acquire a scanned image again using the acquired position correction data. It has been difficult to change the position correction data for each sampling and check whether the acquired position correction data is appropriate.

Also, the conventional electron beam tester 300 is
In an operation of acquiring a waveform, a large number of samplings are performed for one measurement phase of a test signal, so that an insulating member included in an electric component is charged by being irradiated with an electron beam many times. Then, secondary electrons corresponding to the charged potential of the insulating member are added and emitted, and the detector 3
To affect the amount of electrons detected at 24,
It was very difficult to obtain an appropriate measurement waveform. In particular, when the electric component is a semiconductor device covered with an insulating film, the distortion of the measured waveform due to the charging of the insulating film is remarkable.

Accordingly, an object of the present invention is to provide an electron beam tester and a test method that can solve the above-mentioned problems. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous embodiments of the present invention.

[0011]

According to a first aspect of the present invention, there is provided an electron beam tester for testing an electric component to which a test signal is periodically supplied by using an electron beam. An electron gun that irradiates the electron beam to the electron beam, a deflector that deflects the electron beam to a desired position on the electric component,
A position correction data storage unit for storing position correction data for correcting the irradiation position of the electron beam; and a position correction data read from the position correction data storage unit, and based on the read position correction data, synchronized with the test signal. An electron beam tester includes: a deflection control unit that controls a deflector; and a detector that detects electrons emitted from an electric component and outputs a detection signal corresponding to the amount of electrons.

[0012] Further, a delay data storage unit for storing delay data indicating a timing of sampling the detection signal for each phase of the test signal, a delay data read from the delay data storage unit, and based on the read delay data, It is preferable to include a delay circuit unit that supplies timing in synchronization with the test signal, and a detection signal processing unit that samples the detection signal at the timing supplied from the delay circuit unit. Accordingly, it is preferable that the position correction data is read from the position correction data storage unit, and the deflector is controlled based on the read position correction data.

A predetermined position of the electric component is irradiated with an electron beam, and a scan image of the electric component corresponding to the phase of the test signal and the predetermined position, which is acquired based on the detection signal, and an electron beam are used for the test. It is preferable to further include a processing unit that obtains position correction data based on an expected image obtained when the electric component is irradiated without being affected by the signal. Get it again,
It is preferable that the processing unit obtains the position correction data again based on the reacquired scanned image.

A counter for supplying a count value obtained by counting a timing from a predetermined phase to a measurement phase of the test signal to the delay data storage section and the position correction data storage section in synchronization with the test signal; Indicates, based on the count value, the address of the delay data storage unit storing the delay data corresponding to the measurement phase and the address of the position correction data storage unit storing the position correction data corresponding to the measurement phase. You may.

According to a second aspect of the present invention, there is provided a test method for testing an electric component using an electron beam, the method comprising: storing position correction data for correcting an irradiation position of an electron beam on the electric component; A control method for controlling an irradiation position of an electron beam in synchronization with a test signal periodically supplied to an electric component based on the method, and a step of acquiring a waveform corresponding to the test signal. I will provide a.

Furthermore, a step of irradiating a predetermined position of the electric component with an electron beam to obtain a scan image corresponding to the phase of the test signal and the predetermined position; And a step of obtaining position correction data for correcting the irradiation position of the electron beam based on an expected image obtained when the electronic component is irradiated without being affected by Acquiring, and acquiring position correction data;
The step of storing the position correction data is preferably repeated a plurality of times.

The step of obtaining a waveform includes irradiating the electric component with an electron beam, detecting electrons emitted from the electric component, and obtaining a detection signal corresponding to the amount of electrons. The method may include a step of sampling at a predetermined timing, a step of generating timing in synchronization with a test signal based on delay data indicating the timing, and a step of acquiring a waveform based on the detection signal.

The above summary of the present invention does not enumerate all of the necessary features of the present invention, and sub-combinations of these features may also constitute the present invention.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described through embodiments of the present invention. However, the following embodiments do not limit the claimed invention and have the features described in the embodiments. Not all combinations are essential to the solution of the invention.

FIG. 3 shows an electron beam tester 100 according to one embodiment of the present invention. The electron beam tester 100
Electron beam irradiation system 11 for irradiating electric parts with electron beam
0 and a control system 160.

The electron beam irradiation system 110 includes a housing 112
, An electron gun 114 for generating an electron beam, and an aperture section 118 having an aperture through which the electron beam passes
A blanking electrode 116 for controlling whether or not the electron beam is irradiated on the electric component by deflecting the electron beam and controlling whether or not the electron beam passes through the aperture; A deflector 120 for deflecting the component to a desired position, and a stage 12 on which the electric component is placed
6 and a detector 124 that detects electrons emitted from the electric component and outputs a detection signal corresponding to the amount of electrons.

The control system 160 includes a blanking electrode 116
, A position correction data storage unit 150 for storing position correction data for correcting the irradiation position of the electron beam, and a position correction data read from the position correction data storage unit 150. A deflection control unit 148 that controls the deflector 120 in synchronization with the test signal based on the correction data, a delay data storage unit 136 that stores delay data indicating the timing of sampling the detection signal for each phase of the test signal, Delay data storage unit 136
And a delay circuit unit that supplies timing in synchronization with a test signal based on the read delay data, and a detection signal process that samples a detection signal at the timing supplied from the delay circuit unit. A delay data storage unit 1 stores a count value obtained by counting a timing of sampling a detection signal from a predetermined phase to a measurement phase of the test signal in synchronization with the test signal.
36, a counter (140, 142) supplied to the position correction data storage unit 150, an image processing unit 146 which is a processing unit for acquiring a scanned image of the electric component based on the sampled detection signal, and And a waveform processing unit 1 for acquiring a waveform corresponding to the test signal.
44. In another embodiment, the electron beam tester 100 may include a test signal generator 138.
The test signal generator 138 only needs to be able to supply a test signal to the electric component and supply a trigger signal corresponding to a predetermined phase of the test signal to the delay circuit unit 134.

Next, the operation of the electron beam tester 100 will be described. First, an operation of irradiating a predetermined position of an electric component with an electron beam to obtain a scan image corresponding to the phase of a test signal and the predetermined position will be described.

First, the test signal generator 138 periodically supplies a test signal to the electric component. Further, the test signal generator 138 supplies a trigger signal corresponding to a predetermined phase of the test signal to the delay circuit unit 134. The predetermined phase may be a measurement phase of a test signal, and the trigger signal may be a pulse signal corresponding to the predetermined phase. Then, a control unit (not shown) supplies the counter 142 with a clock that is a pulse signal generated in synchronization with the timing of sampling the detection signal.

The counter 142 synchronizes with the clock,
The count value obtained by counting the timing of sampling the detection signal from the predetermined phase to the measurement phase of the test signal is supplied to the delay data storage unit 136. At this time, the predetermined phase may be a start phase of a test signal generated periodically in the test signal generator 138. It is preferable that the counter 142 indicates the address of the delay data storage unit 136 in which the delay data corresponding to the measurement phase is stored, based on the count value. Further, it is preferable that the counter 142 supplies a count value corresponding to each measurement phase of the test signal based on an instruction from a control unit (not shown).

The counter 142 may also supply the count value to the position correction data storage unit 150. At this time, the position correction data may not be stored in the position correction data storage unit 150, or a predetermined value may be stored. The predetermined value may be a zero value that does not affect the amount of deflection of the electron beam.

The delay circuit 134 supplies a delay trigger signal obtained by delaying the trigger signal supplied from the test signal generator 138 by a predetermined time based on the delay data to the pulse generator 152 in synchronization with the trigger signal. . Further, the delay circuit unit 134 supplies a sampling pulse indicating a timing of sampling the detection signal output from the detector to the detection signal processing unit 132 based on the delay data.
The delay data preferably has data corresponding to each measurement phase of the test signal and indicating timing for generating the delay trigger signal and the sampling pulse.

The pulse generator 152 controls the blanking electrode 116 based on the received delay trigger signal to determine whether or not to irradiate the electron beam generated by the electron gun 114 to the electric components provided on the wafer 130. Control. Specifically, when irradiating the electronic component with the electron beam, the electron beam is allowed to pass through the aperture provided in the aperture section 118 without being deflected. The beam is deflected to irradiate the aperture section 118, and the aperture section 118
The electron beam is prevented from being irradiated further downstream. The deflection control unit 148 controls the deflector 120 to irradiate a predetermined position of the electric component with an electron beam. It is preferable that the deflection control unit controls the deflector 120 so that the position specified by the control unit is irradiated with the electron beam.

The detector 124 detects electrons such as reflected electrons and secondary electrons emitted by irradiating the electric parts with the electron beam, and outputs a detection signal corresponding to the amount of the electrons. The detection signal processing unit 132 receives the detection signal, and outputs the received detection signal according to the sampling pulse supplied from the delay circuit unit 134.

Next, the operation of acquiring a scanned image of an electric component and acquiring position correction data based on the acquired scanned image will be described. The image processing unit 146 receives the detection signal output from the detection signal processing unit 132, and acquires a scan image of the electric component corresponding to the phase of the test signal and the predetermined position based on the detection signal. The operation of acquiring the scan image is repeated for each measurement phase of the test signal to acquire the scan image of the electric component. It is preferable that the image processing unit 146 repeats the above-described operation for all the phases to be measured of the test signal, and obtains a scan image of the electric component corresponding to all the phases to be measured.

Subsequently, the image processing section 146 obtains position correction data for correcting the irradiation position of the electron beam based on the acquired scanned image. For example, when the electric component is a semiconductor device, and there is a wiring or a lead to which a large current is supplied in the vicinity of the predetermined position, the electron beam is affected by the large current and the landing of the electron beam occurs. The position shifts. The displacement of the landing position corresponds to the phase of the test signal supplied to the semiconductor device. Specifically, for example, at the predetermined position of the semiconductor device, the timing at which the test signal of the predetermined phase is supplied, and the large current is supplied near the predetermined position to be irradiated with the electron beam. This is a case in which the timings are substantially the same. The predetermined phase may be a measurement phase of the test signal.

The image processing unit 146 includes an expected image, which is an image obtained when the electron beam is irradiated on the electric component without being affected by the test signal, at the predetermined position to be irradiated with the electron beam, Position correction data is obtained based on the acquired scanned image. In the present embodiment, the image processing unit 146 performs image processing on the scanned image and the expected image,
At each phase, position correction data is obtained based on the difference between the electron beam irradiation positions of the scanned image and the expected image.
Subsequently, the image processing unit 146 writes the obtained position correction data to the position correction data storage unit 150.

The electron beam tester 100 according to the present invention
It is desirable to re-acquire a scanned image of the electrical component using the acquired position correction data. By re-acquiring the scanned image of the electric component using the acquired position correction data, it is possible to confirm whether the landing position of the electron beam has been corrected based on the acquired position correction data.

In the operation of acquiring the scanned image again, the counter 142 stores the count value obtained by counting the timing of sampling the detection signal from the predetermined phase to the measurement phase of the test signal in synchronization with the clock in the delay data storage unit. 136 and the position correction data storage unit 150. At this time, the predetermined phase is determined by the test signal generator 1
At 38, it may be the starting phase of a periodically occurring test signal. Based on the count value, the counter 142 stores an address of the delay data storage unit 136 storing the delay data corresponding to the measurement phase, and a position correction data storage unit 150 storing the position correction data corresponding to the measurement phase.
It is preferable to indicate the address of the device. Further, the counter 142 is controlled based on an instruction from a control unit (not shown).
Preferably, a count value corresponding to each measured phase of the test signal is provided.

The deflection control section 148 reads out position correction data corresponding to the measurement phase from the position correction data storage section 150 based on the address specified by the counter 142. Then, based on the read position correction data, the electron beam passing through the aperture provided in the aperture section 118 is deflected to correct the irradiation position of the electron beam on the electric component. The deflection control unit 148 reads and reads the position correction data corresponding to the next measurement phase from the position correction data storage unit 150 in accordance with the sampling pulse indicating the timing at which the detection signal processing unit 132 samples the detection signal. It is preferable to control the deflector 120 based on the obtained position correction data.

The detector 124 detects electrons emitted by irradiating the corrected position with the electron beam,
A detection signal corresponding to the amount of the electrons is output. The detection signal processing unit 132 receives the detection signal, and
The received detection signal is output according to the sampling pulse supplied from 4.

The image processing unit 146 includes the detection signal processing unit 13
A scanned image is acquired again based on the detection signal output from the second. The image processing unit 146 performs image processing on the reacquired scanned image and the scanned image and / or the expected image,
Whether the landing position of the electron beam has been corrected based on the position correction data obtained by acquiring the scanned image or the corrected scanned image by comparing the reacquired scanned image with the scanned image and / or the expected image. Is preferably confirmed. Further, the re-acquired scanned image may be displayed on a display unit (not shown) to confirm whether the landing position of the electron beam has been corrected.

Next, an operation of obtaining a waveform corresponding to a test signal supplied to an electric component using the position correction data obtained by obtaining a scanned image will be described. The operation of acquiring the waveform samples the detection signal in the same manner as the operation of acquiring the scanned image again.

First, the test signal generator 138 periodically supplies a test signal to the electric component. Further, the test signal generator 138 supplies a trigger signal corresponding to a predetermined phase of the test signal to the delay circuit unit 134. The predetermined phase may be a measurement phase of a test signal, and the trigger signal may be a pulse signal corresponding to the predetermined phase. Then, a control unit (not shown) supplies the counter 140 with a clock that is a pulse signal generated in synchronization with the timing of sampling the detection signal.

The counter 140 synchronizes with the clock,
The count value obtained by counting the timing of sampling the detection signal from the predetermined phase to the measurement phase of the test signal is supplied to the delay data storage unit 136 and the position correction data storage unit 150. At this time, the predetermined phase may be a start phase of a test signal generated periodically in the test signal generator 138. Based on the count value, the counter 140 stores an address of the delay data storage unit 136 storing the delay data corresponding to the measurement phase and an address of the position correction data storage unit 150 storing the position correction data corresponding to the measurement phase. Is preferably indicated. Further, it is preferable that the counter 140 supplies a count value corresponding to each measurement phase of the test signal based on an instruction from a control unit (not shown).

The delay circuit section 134 supplies a sampling pulse to the detection signal processing section 132. Further, the delay circuit unit 134 supplies a delay trigger signal to the pulse generation unit 152. The pulse generation unit 152 controls the blanking electrode 116 based on the received delay trigger signal, and outputs the electron beam generated by the electron gun 114 to the wafer 130.
To control whether or not to irradiate the electric components provided in the. The detector 124 detects electrons such as reflected electrons and secondary electrons emitted by irradiating the electronic component with the electron beam, and outputs a detection signal corresponding to the amount of the electrons. The detection signal processing unit 132 receives the detection signal, and outputs the received detection signal according to the sampling pulse supplied from the delay circuit unit 134.

Next, based on the detection signal output from the detection signal processing unit 132, the waveform processing unit 144 acquires a waveform corresponding to the potential of the test signal and the measured phase. Then, the obtained waveform is compared with an expected waveform which should be obtained when the electric component operates normally, and the quality of the electric component is determined.

FIG. 4 is a timing chart of the operation for acquiring the above-described scanned image. FIG. 4A shows a timing chart when a scanned image is obtained. Referring to FIG. 1, in synchronization with a trigger signal output from test signal generator 138, delay circuit section 134 outputs a sampling pulse obtained by delaying the trigger signal by a predetermined time. After the sampling pulse is output from the delay circuit unit 134, in synchronization with the clock generated in the control unit (not shown), the counter 142 stores the delay data corresponding to the next measurement phase of the test signal. 134
Specify the address of

FIG. 4B shows a timing chart when a scanned image is obtained again. Referring to FIG. 1, in synchronization with a trigger signal output from test signal generator 138, delay circuit section 134 outputs a sampling pulse obtained by delaying the trigger signal by a predetermined time. Delay circuit section 13
After the sampling pulse is output from the counter 4, in synchronization with the clock generated in the control unit (not shown), the counter 142 stores the address of the delay data storage unit 134 in which the delay data corresponding to the next measurement phase is stored, and And the address of the position correction data storage unit 150 in which the position correction data corresponding to the measurement phase is stored.

FIG. 4C shows a timing chart when acquiring a waveform. Referring to FIG. 1, in synchronization with a trigger signal output from test signal generator 138, delay circuit section 134 outputs a sampling pulse obtained by delaying the trigger signal by a predetermined time. After the sampling pulse is output from the delay circuit unit 134, the counter 140 is synchronized with a clock generated in a control unit (not shown).
Indicates the address of the delay data storage unit 134 storing the delay data corresponding to the next measurement phase and the address of the position correction data storage unit 150 storing the position correction data corresponding to the next measurement phase. .

The electron beam tester 100 according to the present invention
The deflection control unit 148 uses the position correction data corresponding to the measurement phase of the test signal, and synchronizes the deflector 12 with the test signal.
0 can be controlled to correct the irradiation position of the electron beam. Therefore, by using the position correction data corresponding to each phase of the test signal and correcting the irradiation position of the electron beam in synchronization with the test signal and acquiring the scan image again, the position correction data is appropriate. You can check whether there is. Further, the position correction data confirmed to be appropriate can be used as it is in the operation of acquiring the waveform.

FIG. 5 shows an example of a waveform of a test signal supplied to an electric component and a waveform at a measurement position of the electric component obtained by using the electron beam tester 100 according to the present invention. The electron beam tester 100 according to the present invention can change the measurement phase in synchronization with the test signal every sampling. Further, in response to the sampling pulse output from the delay circuit unit 134, the deflection control unit 148 reads the position correction data and controls the deflector 120 based on the read position correction data. A sufficient settling time, which is a time required until the operation, can be obtained. Therefore, the irradiation position of the electron beam can be corrected by using the appropriate position correction data for each sampling, and even when the surface of the electric component is covered with a film such as an insulating film, the electric component can be corrected. Can be prevented from being charged. As a result, as shown in FIG. 5, the distortion of the measured waveform can be reduced without increasing the measurement time.

Although the present invention has been described with reference to the embodiment, the technical scope of the present invention is not limited to the scope described in the above embodiment. Various changes or improvements can be added to the above embodiment. It should be noted that such modified or improved embodiments may be included in the technical scope of the present invention.
It is clear from the description of the claims.

[0049]

As is apparent from the above description, according to the present invention, a waveform can be acquired with high accuracy without increasing the measurement time.

[Brief description of the drawings]

FIG. 1 shows a conventional electron beam tester 300.

FIG. 2 shows a timing chart of the operation of a conventional electron beam tester 300, a waveform of a test signal, and a measured waveform.

FIG. 3 is an electron beam tester 1 according to one embodiment of the present invention.
00 is shown.

FIG. 4 shows a timing chart of an operation of acquiring a scanned image.

FIG. 5 shows an example of a waveform of a test signal supplied to an electric component and a waveform at a measurement position of the electric component obtained by using the electron beam tester 100 according to the present invention.

[Explanation of symbols]

100: electron beam tester, 110: electron beam irradiation system, 112: housing, 114: electron gun, 1
16 ... blanking electrode, 118 ... aperture part, 120 ... deflector, 124 ... detector, 126
... Stage, 130 ... Wafer, 132 ... Detection signal processing unit, 134 ... Delay circuit unit, 136 ...
Delay data storage unit, 138: test signal generator, 1
40 ... counter, 142 ... counter, 144
..Waveform processing unit, 146... Image processing unit, 148.
Deflection control unit, 150: position correction data storage unit, 1
52: pulse generator, 160: control system

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Claims (10)

[Claims] An electron beam tester for testing an electrical component to which a test signal is periodically supplied by using an electron beam, comprising: an electron gun that irradiates the electrical component with the electron beam; A deflector that deflects the electronic component to a desired position; a position correction data storage unit that stores position correction data for correcting the irradiation position of the electron beam; and the position correction data from the position correction data storage unit. Read, based on the read position correction data,
A deflection control unit that controls the deflector in synchronization with the test signal, and a detector that detects electrons emitted from the electrical component and outputs a detection signal corresponding to the amount of the electrons. Characterized electron beam tester. 2. A delay data storage unit for storing delay data indicating a timing of sampling the detection signal for each phase of the test signal; and reading the delay data from the delay data storage unit.
A delay circuit unit that supplies the timing in synchronization with the test signal based on the read delay data; and a detection signal processing unit that samples the detection signal at the timing supplied from the delay circuit unit. The electron beam tester according to claim 1, further comprising: 3. The deflection control unit reads the position correction data from the position correction data storage unit according to the timing, and controls the deflector based on the read position correction data. 3. The method according to claim 2, wherein
An electron beam tester as described. 4. A scanning image of the electric component corresponding to the phase of the test signal and the predetermined position, which is obtained based on the detection signal, by irradiating the predetermined position of the electric component with the electron beam. And a processing unit for obtaining the position correction data based on an expected image obtained when the electron beam is irradiated on the electric component without being affected by the test signal. Item 2. An electron beam tester according to Item 2. 5. The method according to claim 1, wherein the scan image is obtained again using the position correction data, and the processing unit obtains the position correction data again based on the scan image obtained again. 4. The electron beam tester according to 4. 6. A counter which supplies a count value obtained by counting the timing from a predetermined phase to a measurement phase of the test signal to the delay data storage unit and the position correction data storage unit in synchronization with the test signal. The counter further includes an address of the delay data storage unit in which the delay data corresponding to the measurement phase is stored, and the position correction data corresponding to the measurement phase, based on the count value. 6. The electron beam tester according to claim 2, wherein an address of the position correction data storage unit is specified. 7. A test method for testing an electric component using an electron beam, comprising: storing position correction data for correcting an irradiation position of the electron beam on the electric component; A test method comprising: controlling an irradiation position of the electron beam in synchronization with a test signal periodically supplied to a component; and acquiring a waveform corresponding to the test signal. 8. A step of irradiating a predetermined position of the electric component with the electron beam to acquire a scan image corresponding to a phase of the test signal and the predetermined position; Obtaining position correction data for correcting the irradiation position of the electron beam based on an expected image obtained when the electron beam is irradiated on the electric component without being affected by the test signal. The test method according to claim 7, wherein the test method is provided. 9. The test method according to claim 8, wherein the step of acquiring the scanned image, the step of acquiring the position correction data, and the step of storing the position correction data are repeated a plurality of times. . 10. The step of acquiring the waveform includes irradiating the electronic component with the electron beam, detecting electrons emitted from the electrical component, and obtaining a detection signal corresponding to the amount of the electrons. Sampling the detection signal at a predetermined timing; generating the timing in synchronization with the test signal based on delay data indicating the timing; and generating the waveform based on the detection signal. The test method according to any one of claims 7 to 9, comprising a step of acquiring.