JP2002035972A - Laser beam cutting machine for extra-thin metal plate - Google Patents
Laser beam cutting machine for extra-thin metal plateInfo
- Publication number
- JP2002035972A JP2002035972A JP2000217608A JP2000217608A JP2002035972A JP 2002035972 A JP2002035972 A JP 2002035972A JP 2000217608 A JP2000217608 A JP 2000217608A JP 2000217608 A JP2000217608 A JP 2000217608A JP 2002035972 A JP2002035972 A JP 2002035972A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- metal plate
- thin metal
- laser beam
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、レーザ切断加工に
関し、特にレーザによる極薄金属板の微細切断加工を行
う装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting process, and more particularly to an apparatus for performing a fine cutting process on an ultra-thin metal plate using a laser.
【0002】[0002]
【従来の技術】例えば、実装基板製作時に使用されるメ
タルマスクの加工では、極薄金属板(0.1〜0.5m
m)をレーザによって高精度・高品質に微細切断するこ
とが要求されている。このような加工においては、レー
ザ光をできるだけ小さく集光させ、焦点位置の変動がな
いようにするとともにアシストガスを加工部に効果的に
噴射する必要がある。2. Description of the Related Art For example, in processing a metal mask used for manufacturing a mounting board, an extremely thin metal plate (0.1 to 0.5 m) is used.
m) is required to be finely cut with high precision and high quality by a laser. In such processing, it is necessary to condense the laser beam as small as possible so that the focal position does not fluctuate, and to inject the assist gas to the processing portion effectively.
【0003】しかしながら、レーザ光による切断加工
は、被加工物に対して瞬間的かつ局所的に入熱して溶融
し、それをレーザ光同軸上から噴射されるアシストガス
圧によって除去することによっているので、アシストガ
スの噴射圧によって加工部に局所的な撓み(波打ち現象
と称している)が生じ、レーザ光の集光点が変動すると
いう問題がある。However, cutting by laser light is performed by instantaneously and locally inputting heat to a workpiece and melting it, and removing it by an assist gas pressure injected from the laser beam coaxial. In addition, there is a problem that local bending (referred to as a waving phenomenon) occurs in the processing portion due to the injection pressure of the assist gas, and the focal point of the laser beam fluctuates.
【0004】従来、これを解決したものとして、例えば
特開平10−328867号公報がある。これは、図3
に示すように、被加工物台24に被加工物Wを張力を与
えて緊張保持し、加工ヘッド25とノズル6の間にベロ
ーズを設け、ノズル6と一体の上部押さえ部材20と、
被加工物の下部に固定配置された下部固定定盤21の高
潤滑板22とによって被加工物Wを上下から挟み込み、
レーザ集光点A付近の狭い領域で被加工物Wを拘束する
ようにしている。Conventionally, as a solution to this problem, there is, for example, Japanese Patent Application Laid-Open No. 10-328867. This is shown in FIG.
As shown in FIG. 2, the workpiece W is tensioned and held on the workpiece base 24, a bellows is provided between the processing head 25 and the nozzle 6, and an upper pressing member 20 integrated with the nozzle 6,
The work W is sandwiched from above and below by the high lubrication plate 22 of the lower fixed surface plate 21 fixedly arranged at the lower part of the work,
The workpiece W is constrained in a narrow area near the laser focus point A.
【0005】そして、レーザ光の焦点合わせのため、加
工ヘッド25の左右両側に接触式変位計32を設け、こ
れを連結板31で連結している。なお、上部押さえ部材
20は連結板31に固設されている。図3において、4
は集光レンズ、27はX軸駆動軸、28はY軸駆動軸で
あり、26は接触式変位計32の検知情報を記憶し、ま
た、X軸駆動軸27およびY軸駆動軸28を作動させる
NC制御装置である。[0005] For the purpose of focusing the laser beam, contact type displacement meters 32 are provided on both left and right sides of the processing head 25, and these are connected by a connecting plate 31. The upper holding member 20 is fixed to the connection plate 31. In FIG. 3, 4
Is a condenser lens, 27 is an X-axis drive axis, 28 is a Y-axis drive axis, 26 stores detection information of the contact type displacement meter 32, and operates the X-axis drive axis 27 and the Y-axis drive axis 28 This is the NC control device to be operated.
【0006】[0006]
【発明が解決しようとする課題】上記のレーザ切断加工
装置では、被加工物のレーザ光加工位置付近を上部押さ
え部材20と下部固定定盤21とで挟んでいるので、極
薄板の被加工物でもアシストガスの圧力による被加工物
の撓みを抑制することができる。In the above-mentioned laser cutting apparatus, the vicinity of the laser beam processing position of the workpiece is sandwiched between the upper holding member 20 and the lower fixed surface plate 21. However, the bending of the workpiece due to the pressure of the assist gas can be suppressed.
【0007】しかしながら、この方法による場合は、加
工ヘッド25に取付けられた上部押さえ部材20と下部
固定定盤21と被加工物台24の3要素の平行度が高く
なければならない。平行度が悪いと被加工物は、下部固
定定盤21に無理矢理押し付けられるので、その部分が
局部的に変形し易い。また、被加工物は上部押さえ部材
20と下部固定定盤21の間で摺動するので、上部押さ
え部材20は下部固定定盤21に対して常に同程度の圧
力で押さえる必要があり、このためには接触式変位計な
どによって調整しなければならず、このため、装置が複
雑で大型化するばかりでなく、切断加工における被加工
物の装着に時間を要するといった問題がある。However, in the case of this method, the parallelism of the three elements of the upper holding member 20, the lower fixed platen 21, and the work table 24 attached to the processing head 25 must be high. If the degree of parallelism is poor, the workpiece is forcibly pressed against the lower fixed platen 21, so that the portion is easily deformed locally. In addition, since the workpiece slides between the upper holding member 20 and the lower fixed platen 21, the upper holding member 20 must always be pressed against the lower fixed platen 21 by the same pressure. Must be adjusted by a contact type displacement meter or the like. Therefore, not only is the device complicated and large, but also it takes time to mount a workpiece in the cutting process.
【0008】そこで、本発明は、簡素な構成でアシスト
ガスによる集光点の位置変動を抑制するようにした極薄
金属板のレーザ切断加工装置を提供することを目的とす
るものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a laser cutting apparatus for an ultra-thin metal plate, which has a simple configuration and suppresses a change in the position of a focal point due to an assist gas.
【0009】[0009]
【課題を解決するための手段】上記目的を達成するた
め、本発明では次の手段を採った。即ち、集光レンズを
備えた加工ヘッドのノズルからレーザ光を照射するとと
もにアシストガスを噴射して切断加工する極薄金属板の
レーザ切断加工装置において、該ノズルの直下に球の上
部を平面状に切り取った形状で内部に空洞のある押当具
を固定配置し、該押当具で被加工物を裏面から集光点の
周囲を局部的に押し当てて、集光レンズから被加工物表
面までの距離を一定にするようにしたことを特徴として
いる。In order to achieve the above object, the present invention employs the following means. That is, in a laser cutting apparatus for an ultra-thin metal plate that cuts by irradiating a laser beam from a nozzle of a processing head equipped with a condensing lens and injecting an assist gas, the upper part of a sphere is formed in a planar shape immediately below the nozzle. A pressing tool with a hollow inside is fixedly arranged in the shape cut out, and the workpiece is pressed locally from the back surface around the condensing point with the pressing tool, and the condensing lens is moved to the surface of the processing object. The feature is that the distance to is fixed.
【0010】本発明は、被加工物裏面から球の上部を平
面状に切り取った形状の押当具で集光点の周囲を押し上
げることで、集光点付近の狭い範囲で被加工物を拘束
し、集光点の位置を被加工物上に一定に保持するように
したものである。ここで、「球の上部を平面状に切り取
った形状」の意味は厳密な球を意味するものではなく、
垂直断面において曲線であるものを含むものである。According to the present invention, the workpiece is restrained in a narrow range near the focal point by pushing up the periphery of the focal point with a pressing tool having a shape obtained by cutting the upper part of the sphere in a plane from the back surface of the workpiece. Then, the position of the condensing point is kept constant on the workpiece. Here, the meaning of "a shape obtained by cutting the top of the sphere into a plane" does not mean an exact sphere,
This includes those that are curved in the vertical cross section.
【0011】本発明では押当具により被加工物を裏面よ
り押し上げて、ノズルから噴射されるアシストガスの圧
力に対抗させることにより、加工部周辺に発生する被加
工物の波打ち現象、すなわち集光点の位置の変動を抑制
するように作用する。押当具の材質は被加工物の材質よ
りも若干柔らかめの材質(例えばアルミ材)を使用し、
被加工物に傷を与えないようにするのが良い。In the present invention, the workpiece is pushed up from the back surface by the pressing tool so as to oppose the pressure of the assist gas injected from the nozzle, so that the workpiece undulates around the processing portion, ie, condenses. It acts to suppress the fluctuation of the position of the point. The material of the pressing tool should be slightly softer than the material of the workpiece (for example, aluminum).
It is good not to damage the workpiece.
【0012】また、被加工物は引張して把持するのが望
ましい。なお、引張力が若干弱く均一でなくとも、レー
ザ加工部周辺に限って見れば、加工中は押当具で集光点
の周囲が押し上げられることで、常時均一な引張力が付
与されたと同じ状態を保つことができる。It is desirable that the workpiece is pulled and gripped. In addition, even if the tensile force is slightly weak and not uniform, when viewed only around the laser processing part, during processing, the periphery of the focal point is pushed up by the pressing tool, which is the same as the case where the uniform tensile force is always applied. State can be maintained.
【0013】押当具の中央部の空洞は、吸引装置に接続
して、アシストガスおよび溶融物を吸引できるようにす
るのがよい。[0013] The cavity at the center of the pressing tool is preferably connected to a suction device so that the assist gas and the melt can be sucked.
【0014】[0014]
【発明の実施の形態】以下、本発明の極薄金属板のレー
ザ切断加工装置の実施形態例を図面に基づいて説明す
る。図1に示すように、加工ヘッド3にはレーザ発振器
1から反射ミラー2を介して入射されるレーザ光Lを集
光する集光レンズ4が内装され、下端にはノズル6が設
けられている。また、集光レンズ4の下部にはアシスト
ガスAGの噴射圧力から集光レンズ4を保護するための
保護ガラス5が設けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a laser cutting apparatus for an ultra-thin metal plate according to the present invention will be described below with reference to the drawings. As shown in FIG. 1, the processing head 3 is provided with a condensing lens 4 for condensing a laser beam L incident from the laser oscillator 1 via the reflection mirror 2, and a nozzle 6 is provided at a lower end. . Further, a protective glass 5 for protecting the condenser lens 4 from the injection pressure of the assist gas AG is provided below the condenser lens 4.
【0015】なお、加工ヘッド3はZ軸方向に移動可能
に構成されており、また、ノズル6はアシストガスAG
を被加工物Wの加工部位に集中的に流れ込むような径
(1.0mm以下)としている。また、アシストガスA
Gは通常のレーザ加工の場合より高圧にしている。The working head 3 is configured to be movable in the Z-axis direction, and the nozzle 6 is provided with an assist gas AG.
Is set to a diameter (1.0 mm or less) so as to intensively flow into a processing portion of the workpiece W. Also, assist gas A
G is at a higher pressure than in normal laser processing.
【0016】被加工物WはX方向とY方向に移動可能な
XYステージ9上に設けた把持装置8に把持され、NC
制御装置10により、予め設定してある切断データに基
づいて制御され、所定の形状にならって移動するように
構成されている。なお、12はX軸駆動装置、13はY
軸駆動装置である。The workpiece W is gripped by a gripping device 8 provided on an XY stage 9 movable in the X and Y directions.
The control device 10 is controlled based on cutting data set in advance, and is configured to move according to a predetermined shape. In addition, 12 is an X-axis driving device, 13 is Y
It is a shaft drive.
【0017】加工ヘッド3の直下にはノズル6と対向し
て押当具7が固定配置されている。押当具7は固定され
た受金7bにアルミ材からなる押当金具7aがネジ7f
で上下方向に調整可能に取り付けられている。そして、
押当金具7aの頭部は図2に示すように、半球状の上部
を水平面で切り取った形状をしており、上面には直径B
の穴が明いている。この穴の端部7dは断面が円弧形状
に形成されている。Immediately below the processing head 3, a pressing tool 7 is fixedly arranged to face the nozzle 6. The holding member 7a is made of an aluminum material and a screw 7f is attached to the fixed receiving member 7b.
It is mounted so that it can be adjusted vertically. And
As shown in FIG. 2, the head of the pressing member 7a has a shape in which a hemispherical upper portion is cut off in a horizontal plane, and the upper surface has a diameter B
The hole is clear. The end 7d of this hole is formed in an arc-shaped cross section.
【0018】また、押当金具7aの内部は空洞7cとな
っており、下部には吸引装置11に連通する孔7eが設
けられている。次に、このように構成された極薄金属板
のレーザ切断加工装置の作用について説明する。The inside of the holding member 7a is a cavity 7c, and a hole 7e communicating with the suction device 11 is provided in the lower part. Next, the operation of the laser cutting apparatus for an ultra-thin metal plate configured as described above will be described.
【0019】被加工物Wを切断加工するに当たっては、
予め、レーザ発振器1から出射されたレーザ光Lが、反
射ミラー2を介して集光レンズ4によって被加工物Wの
表面に集光点Aがくるように焦点合わせを行う。そし
て、被加工物Wの厚さに合わせ、被加工物Wの表面が集
光点Aになるように押当具7の押当金具7aの高さを調
整する。なお、集光点Aは被加工物Wを把持装置8に把
持したときの表面より僅かに高い位置に設定する。In cutting the workpiece W,
The laser beam L emitted from the laser oscillator 1 is previously focused by the condenser lens 4 via the reflection mirror 2 so that the focal point A comes to the surface of the workpiece W. Then, according to the thickness of the workpiece W, the height of the pressing metal 7a of the pressing tool 7 is adjusted so that the surface of the workpiece W is at the converging point A. Note that the focal point A is set at a position slightly higher than the surface when the workpiece W is gripped by the gripping device 8.
【0020】この調整は、集光レンズ4、ノズル6は加
工ヘッド3に固定配置されており、集光点Aの変動はな
く、また、ノズルと被加工物の距離の変動もないので、
最初に1度行うだけで以後は不要である。加工ヘッド3
を上昇させて、被加工物Wを把持装置8に若干の張力を
与えて取り付け、加工ヘッド3を下降させる。In this adjustment, since the condenser lens 4 and the nozzle 6 are fixedly arranged on the processing head 3, there is no change in the focal point A, and there is no change in the distance between the nozzle and the workpiece.
It only needs to be performed once at the beginning and is unnecessary thereafter. Processing head 3
Is raised, the workpiece W is attached to the gripping device 8 with a slight tension, and the processing head 3 is lowered.
【0021】下降して停止させる位置は、上記予め設定
された位置であり、NC制御装置10により指令させ自
動的に停止するようにしている。切断加工時には被加工
物Wはレーザ光の入熱により局部的かつ瞬間的に溶融
し、被加工物WはNC制御装置10により、予め設定し
てある切断データに基づいて制御されて移動する。この
とき、アシストガスAGは、レーザ光Lと同軸上に配置
されたノズル6から被加工物Wに向けて高圧力で噴射さ
れ、溶融物をともなって、負圧状態となっている押当具
7の空洞7cから孔7eを通って吸引装置11へ吸引さ
れる。The position for descending and stopping is a position set in advance as described above, and is instructed by the NC control device 10 to stop automatically. At the time of cutting, the workpiece W is locally and instantaneously melted by the heat input of the laser beam, and the workpiece W is controlled by the NC controller 10 based on preset cutting data and moves. At this time, the assist gas AG is jetted at a high pressure from the nozzle 6 arranged coaxially with the laser beam L toward the workpiece W, and the pressing tool that is in a negative pressure state with the molten material. The air is sucked into the suction device 11 from the cavity 7c through the hole 7e.
【0022】そして、このとき被加工物Wは押当具7の
押当金具7aの上端である穴の端部7dで円環状に押し
上げられており、押し上げられた局所的領域において
は、適度な引張力が付与された状態となっているので、
集光点Aは常に被加工物Wの表面に保持される。At this time, the workpiece W is pushed up in an annular shape at the end 7d of the hole, which is the upper end of the holding member 7a of the holding member 7, and in the local region pushed up, an appropriate amount is obtained. Since it is in a state where a tensile force is applied,
The focal point A is always held on the surface of the workpiece W.
【0023】なお、ノズルから噴射されるアシストガス
による圧力によっては、若干集光点Aがズレることがあ
るが、この場合においても、そのズレた位置に静止して
いるので、少なくとも波打ち現象のような集光点Aの変
動は起こらない。また、押当金具7aの被加工物Wとの
接触部分は断面が円弧形状であるので、押し上げ部は塑
性変形することもなく、切断完了時の製品の平面度が損
なわれることもない。さらには、端部7dのナイフエッ
ジ形状によって、被加工物Wの裏面へ付着しようとする
ドロスの除去にも効果がある。Note that, depending on the pressure of the assist gas ejected from the nozzle, the light-converging point A may be slightly displaced. No significant change in the focal point A occurs. Further, since the cross-section of the contact portion of the pressing metal 7a with the workpiece W has an arc shape, the pushed-up portion is not plastically deformed, and the flatness of the product at the time of completion of cutting is not impaired. Furthermore, the knife edge shape of the end portion 7d is also effective in removing dross that tends to adhere to the back surface of the workpiece W.
【0024】[0024]
【発明の効果】以上説明したように、本発明のレーザ切
断加工装置は、ノズルの直下に球の上部を平面状に切り
取った形状で内部に空洞のある押当具を固定配置し、該
押当具で被加工物を裏面から集光点の周囲を局部的に押
し当てて、集光レンズから被加工物表面までの距離を一
定にするようにしたので、集光レンズと被加工物間の距
離(焦点位置)を切断加工中常時一定に保つことがで
き、その結果、切断幅に変動のない安定した切断性能が
得られる。また、被加工物のセット時に従来のような接
触変位計などによる調整も必要とせず、多種の板厚に対
しても、段取り時間が必要なく、簡素な構成であるので
取り扱い易いという効果がある。As described above, in the laser cutting apparatus of the present invention, a pressing tool having a hollow inside in a shape obtained by cutting the upper part of a sphere into a flat shape immediately below a nozzle is fixedly arranged. The workpiece is pressed locally from the back side around the focal point with the tool to keep the distance from the condenser lens to the surface of the workpiece constant. Can be kept constant during the cutting process, and as a result, a stable cutting performance without variation in the cutting width can be obtained. In addition, there is no need for conventional adjustment using a contact displacement meter or the like when setting a work piece, and there is an effect that a setup time is not required for a variety of plate thicknesses and the structure is simple, so that it is easy to handle. .
【図1】本発明の極薄金属板のレーザ切断加工装置の一
実施形態例の全体構成を示す正面図である。FIG. 1 is a front view showing the overall configuration of an embodiment of a laser cutting machine for ultra-thin metal plates of the present invention.
【図2】同 押当具7の詳細図である。FIG. 2 is a detailed view of the pressing tool 7;
【図3】従来の極薄金属板のレーザ切断加工装置の一実
施形態例の全体構成を示す正面図である。FIG. 3 is a front view showing the overall configuration of one embodiment of a conventional laser cutting apparatus for an ultrathin metal plate.
1…レーザ発振器 2…反射ミラー 3…加工ヘッド 4…集光レンズ 5…保護ガラス 6…ノズル 7…押当具 7a…押当金具 7b…受金 7c…空洞 7d…端部 7e…孔 7f…ネジ 8…把持装置 9…XYステージ 10…NC制御装置 11…吸引装置 20…上部押さえ部材 21…下部固定定盤 22…高滑性板 24…被加工物台 25…加工ヘッド 26…NC制御装置 27…X軸駆動台 28…Y軸駆動台 30…ベローズ L…レーザ光 A…集光点 W…被加工物 AG…アシストガス DESCRIPTION OF SYMBOLS 1 ... Laser oscillator 2 ... Reflection mirror 3 ... Processing head 4 ... Condensing lens 5 ... Protective glass 6 ... Nozzle 7 ... Pressing tool 7a ... Pressing tool 7b ... Receiving 7c ... Cavity 7d ... End 7e ... Hole 7f ... Screw 8 ... Grip device 9 ... XY stage 10 ... NC control device 11 ... Suction device 20 ... Upper holding member 21 ... Lower fixed platen 22 ... High lubricity plate 24 ... Workpiece table 25 ... Working head 26 ... NC control device 27 ... X-axis drive base 28 ... Y-axis drive base 30 ... Bellows L ... Laser light A ... Condensing point W ... Workpiece AG ... Assist gas
Claims (1)
らレーザ光を照射するとともにアシストガスを噴射して
切断加工する極薄金属板のレーザ切断加工装置におい
て、該ノズルの直下に球の上部を平面状に切り取った形
状で内部に空洞のある押当具を固定配置し、該押当具で
被加工物を裏面から集光点の周囲を局部的に押し当て
て、集光レンズから被加工物表面までの距離を一定にす
るようにしたことを特徴とする極薄金属板のレーザ切断
加工装置。1. A laser cutting apparatus for an ultra-thin metal plate, which irradiates a laser beam from a nozzle of a processing head provided with a condensing lens and injects an assist gas to perform a cutting process. A pressing tool with a cavity inside is cut and fixed in a planar shape, and the workpiece is pressed locally from the back surface around the light collecting point by the pressing tool, so that it is covered from the condensing lens. A laser cutting apparatus for an ultra-thin metal plate, wherein a distance to a workpiece surface is made constant.
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JP2000217608A JP3910008B2 (en) | 2000-07-18 | 2000-07-18 | Laser cutting machine for ultra-thin metal plates |
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JP2000217608A JP3910008B2 (en) | 2000-07-18 | 2000-07-18 | Laser cutting machine for ultra-thin metal plates |
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JP2002035972A true JP2002035972A (en) | 2002-02-05 |
JP3910008B2 JP3910008B2 (en) | 2007-04-25 |
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JP2000217608A Expired - Fee Related JP3910008B2 (en) | 2000-07-18 | 2000-07-18 | Laser cutting machine for ultra-thin metal plates |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009120541A2 (en) * | 2008-03-26 | 2009-10-01 | Electro Scientific Industries, Inc. | Laser micromachining through a sacrificial protective member |
CN113751864A (en) * | 2021-09-18 | 2021-12-07 | 深圳市华丰泽电子有限公司 | Titanium alloy plate laser cutting device for aerospace |
CN113843501A (en) * | 2021-11-06 | 2021-12-28 | 武汉领创智能激光科技有限公司 | Novel laser cutting machine cuts connection structure for box |
-
2000
- 2000-07-18 JP JP2000217608A patent/JP3910008B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009120541A2 (en) * | 2008-03-26 | 2009-10-01 | Electro Scientific Industries, Inc. | Laser micromachining through a sacrificial protective member |
WO2009120541A3 (en) * | 2008-03-26 | 2009-12-17 | Electro Scientific Industries, Inc. | Laser micromachining through a sacrificial protective member |
CN113751864A (en) * | 2021-09-18 | 2021-12-07 | 深圳市华丰泽电子有限公司 | Titanium alloy plate laser cutting device for aerospace |
CN113843501A (en) * | 2021-11-06 | 2021-12-28 | 武汉领创智能激光科技有限公司 | Novel laser cutting machine cuts connection structure for box |
CN113843501B (en) * | 2021-11-06 | 2023-10-10 | 武汉领创智能激光科技有限公司 | Novel connection structure for cutting box body of laser cutting machine |
Also Published As
Publication number | Publication date |
---|---|
JP3910008B2 (en) | 2007-04-25 |
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