JP2002026211A - Heat conduction control mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide heat conduction control mechanism capable of suppressing fluctuation in the consumption power of a variety of electronic apparatuses or temperature fluctuation in an electronic apparatus which is caused by temperature fluctuation of installation environment. SOLUTION: In the heat conduction control mechanism, heat generated from a heat generating part of an apparatus is conducted to a heat dissipating part via a heat conducting path and dissipated from the heat dissipating part. A first and a second radiating surface which face each other are arranged in the heat conducting path. Material whose emissivity has positive temperature characteristic to a temperature is stuck on the first and the second radiating surfaces, or the radiating surfaces are subjected to surface treatment using the material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat transfer control mechanism, and more particularly to a heat transfer control mechanism capable of reducing temperature fluctuations of various electronic devices or communication devices due to fluctuations in power consumption (heat generation) or fluctuations in installation environment temperature. It relates to a heat transfer control mechanism.

[0002]

2. Description of the Related Art In recent years, as electronic equipment such as information equipment, mobile communication equipment, and broadcasting equipment has been digitized, expanded in bandwidth, and increased in capacity, electronic circuits constituting the electronic equipment have been highly integrated and signal amplifiers have been reduced. Distortion is required. In order to meet these demands, it is required to mount a large number of semiconductor elements at a high power signal portion at a high density.

[0003] More recently, mobile communication satellites or stratospheric mobile platforms that relay signals from portable terminals have been planned. These mobile communication satellites or stratospheric mobile platforms are required to have higher power with the miniaturization of mobile terminals on the ground slave station side, increase in access points and increase in the amount of communication information.

As a means for responding to such a reduction in signal distortion and an increase in power, a phased array antenna that performs spatial synthesis of signals using a large number of semiconductor amplifiers is expected.

[0005] Many semiconductor amplifiers mounted on a phased array antenna are densely mounted because the mounting interval of the amplifiers is limited by the signal frequency, and the power consumption of the amplifiers (changes in the number of signal access channels). (Heat generation amount) greatly fluctuates, and accordingly, the temperature of the amplifier also fluctuates greatly.

[0006] In the case of a mobile communication satellite, it is subjected to large radiation cooling before being put into a predetermined orbit such as the eclipse of the earth or a geosynchronous orbit. On the other hand, in the case of a stratospheric mobile platform, the radiation cooling varies depending on the sunshine or sunset.
It is necessary to perform heat control to reduce the influence of the fluctuation in the calorific value of the device itself and the environmental change.

Conventionally, the exhaust heat of a power amplifier or the like in a mobile communication satellite is provided by providing a heat radiating panel having a desired exhaust heat area on a dark field surface in outer space and connecting the heat amplifier connected to the power amplifier requiring the exhaust heat. The pipe and the heat pipe connected to the heat dissipating panel are fastened so as to be in contact with each other, thereby achieving heat balance between the heat generated by the power amplifier and the area of the heat dissipating panel.

[0008]

The thermal equilibrium between the heat generating portion such as a power amplifier and the heat radiating panel is set to be linear with respect to the fluctuation of the heat generating portion and to be able to cope with the maximum allowable temperature of the heat generation.

Therefore, when the communication channel is less used, when the satellite enters the eclipse of the earth and the power must be limited, or in a so-called transfer orbit before the satellite is put into a predetermined orbit, the radiation from the heat radiating panel is reduced. The heat radiation may advance and the equipment may swing out of the allowable range to a lower temperature.

[0010] In order to prevent this, a heater is attached to a solar cell panel on which the equipment is mounted, and the temperature is controlled. The power used for such temperature control is
This leads to an increase in solar cell panels or storage batteries, which adversely affects the payload and reliability of the satellite. Also, a control circuit or the like for correcting a large temperature fluctuation width is required on the device side.

[0011] Also, in the stratospheric mobile platform, communication equipment and the like mounted on the shadow side of the mobile platform are always exposed to a low temperature environment, similarly to the radiation panel of the mobile communication satellite.

For this reason, there is a problem that the power consumption fluctuates greatly depending on the amount of communication signals, and the temperature of the apparatus fluctuates accordingly. In order to control the temperature fluctuation, control power is required, and there is a problem that the payload and the reliability are adversely affected as in the case of the satellite.

The present invention has been made in view of the above points, and an object of the present invention is to reduce fluctuations in power consumption of electronic equipment or fluctuations in equipment temperature due to fluctuations in the installation environment temperature. To provide a possible heat transfer control mechanism.

[0014]

FIG. 1 is a diagram illustrating the principle of the present invention. A heat radiation connection part 4 is interposed in a heat conduction path 3 connecting the heat generation part 1 and the heat radiation part 2. The heat radiating connection portion 4 has a radiating surface 9 formed on a facing surface of the pair of heat transfer blocks 5 and 7.
have.

The heat generating section 1 and the heat transfer block 5 are connected by a heat pipe 6, and the heat radiating section 2 and the heat transfer block 7 are connected by a heat pipe 8. The radiation surface 9 has a temperature characteristic in which the emissivity increases with an increase in temperature (that is, when the emissivity ε is regarded as a function of temperature f (T) = ε, the characteristic that the function f (T) becomes a monotonically increasing function is obtained. ) Is affixed or surface-treated.

The amount of heat Q transferred at the heat radiation connection portion 4 is:
Assuming that the temperature difference between the heat radiating portion 1 and the heat generating portion 2 is ΔT, Q = αΔT ⁴
Becomes By providing the heat radiation connection portion 4 in the heat conduction path 3 as described above, the temperature difference ΔT between the heat generating portion 1 and the heat radiating portion 2 can be greatly reduced.

Since a member having a temperature characteristic whose emissivity increases with an increase in temperature is attached to the radiating surface 9 or is subjected to a surface treatment, the temperature difference ΔT between the heat generating portion 1 and the heat radiating portion 2 is obtained. Is larger, the emissivity is higher, and a large amount of heat can be transmitted through the heat radiation connection portion 4.

Preferably, the heat transfer blocks 5 and 7 have a comb tooth shape, and the radiation surface 9 is provided on the bottom surface of the comb teeth. It is desirable to provide a heat-sensitive movable mechanism that moves the heat transfer block 5 with respect to the heat transfer block 7 according to a temperature change of the heat generating unit 1. In this case, heat pipe 6
Consists of a flexible heat pipe.

As an alternative, a radiant heat shield plate having a plurality of openings is provided between the heat transfer blocks 5 and 7, and the radiant heat shield plate is moved by a heat-sensitive movable mechanism in accordance with a temperature change of the heat generating portion 1. May be.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 2, a conceptual diagram of a mobile communication satellite 10 is shown. An antenna feed unit 14 having a plurality of antenna radiators 16 is mounted on a main body 12 of the mobile communication satellite 10.

The mobile communication satellite 10 further includes a pair of large-diameter parabolic antennas 18 that combine signals from the plurality of antenna radiators 16 in space, a pair of heat radiation panels 20,
It has a pair of solar cell panels 22.

The mobile communication satellite 10 is required to have high power transmission capability in order to reduce the load on mobile terminals where portability is important. In digital communication such as CDMA, high linearity is required for a transmission power amplifier.

Accordingly, a power amplifier using a semiconductor element having relatively excellent linearity is connected to each antenna radiator 16,
A large-diameter parabolic antenna 18 combines signals from the antenna radiator 16 in space, and uses a phased array antenna system that can obtain signal linearity and large power.

Most of the heat generated by the mobile communication satellite 10 is a power amplifier densely mounted on the antenna feed unit 14. Hereinafter, embodiments of the heat transfer control mechanism of the present invention capable of effectively radiating the heat generated by these power amplifiers will be described with reference to FIGS.

Referring to FIG. 3, there is shown a schematic configuration diagram of the first embodiment of the present invention. Antenna feeding unit 14
A plurality of antenna radiators 16 and a plurality of power amplifiers 26 connected to each of the antenna radiators 16 are mounted on the base 24.

The base 24 of the antenna feed unit 14 is connected to a first heat transfer block 28 by a first heat pipe 30. The first heat transfer block 28 is made of, for example, aluminum or an aluminum alloy, and has a comb shape as shown. First on the bottom of each comb
A radiation surface 32 is provided.

The heat radiating panel 20 is connected to a second heat transfer block 34 by a second heat pipe 36. The second heat transfer block 34 is also formed of aluminum or an aluminum alloy and has a comb shape. A second radiation surface 38 is provided on the bottom surface of each comb tooth.

The first and second heat transfer blocks 28 and 34 are arranged such that the first and second radiation surfaces 32 and 38 face each other. A member having a temperature characteristic whose emissivity increases with an increase in temperature is attached to the first and second radiation surfaces 32 and 38, or a surface treatment is performed.

For example, as shown in FIG. 4, the first and second radiating surfaces 32 and 38 are coated with a black lacquer having a temperature characteristic in which the emissivity increases as the temperature increases. Alternatively, the first and second radiating surfaces 32, 38 have 25 μm.
UPILEX-S / AL (trade name), which is an aluminum vapor-deposited polymer film having a thickness of m.

According to the present embodiment, since the heat radiation connection portion including the first and second heat transfer blocks 28 and 34 is provided in the heat conduction path between the antenna feeding unit 14 and the heat dissipation panel 20, It is possible to greatly reduce the temperature fluctuation with respect to the heat value fluctuation of the power amplifier 26.

Further, a member having a temperature characteristic whose emissivity increases with an increase in temperature is attached to the first and second radiation surfaces 32 and 38, or a surface treatment is applied to the first and second radiation surfaces 32 and 38. As the temperature difference ΔT between the power supply unit 14 and the radiating panel 20 increases, the first and second radiation surfaces 3
The emissivity of 2,38 increases, and a large amount of heat can be transmitted by thermal radiation.

On the contrary, when the temperature difference ΔT between the antenna feeding unit 14 and the heat radiating panel 20 is small, the emissivity of the first and second radiating surfaces 32 and 38 becomes small, and a small amount of heat is transmitted by heat radiation. You. Thereby, the temperature of the antenna feeding unit 14 on which the plurality of power amplifiers 26 are mounted can be controlled within a predetermined temperature range.

It is to be noted that a member having a temperature characteristic whose emissivity increases with an increase in temperature is attached or surface-treated on one of the first and second radiation surfaces 32 and 38. Is also good.

Further, the first and second heat transfer blocks 28, 3
4 has a comb-tooth shape, but the first and second heat transfer blocks 28 and 34 are not limited to the comb-tooth shape.
Any shape may be used as long as it can form a pair of radiation surfaces.

Referring to FIG. 5, there is shown a schematic configuration diagram of a second embodiment of the present invention. In the following description of each embodiment, the same components as those of the above-described first embodiment are denoted by the same reference numerals, and the description thereof will be omitted to avoid duplication.

In this embodiment, the radiation surface 3 is provided on the bottom surface of each comb tooth of the first and second heat transfer blocks 28 and 34.
2 and 38 are provided, and reflection surfaces 33 and 39 are provided on the top surface of each comb tooth.
Is provided. The base 24 and the first heat transfer block 28 of the antenna feed unit 14 are
Connected by

Reference numeral 42 denotes a heat-sensitive movable mechanism for moving the first heat transfer block 28 in the direction of arrow A in accordance with the temperature of the antenna feed unit 14. As the heat-sensitive movable mechanism 42, for example, a bimetal or a shape memory alloy that is deformed according to the temperature of the antenna feeding unit 14, or the temperature of the antenna feeding unit 14 is detected by a temperature sensor, and an actuator such as a linear motor is Can be adopted.

By sliding the first heat transfer block 28 in parallel with the second heat transfer block 34 by the heat-sensitive movable mechanism 42, it is possible to change the facing heat transfer area.

That is, the radiation surfaces 32, 38 and the reflection surfaces 33,
By changing the facing area of the antenna 39, it is possible to control the temperature of the antenna feeding unit 14, which is a heat generating unit, without using a heater or the like that consumes a large amount of power.

Referring to FIG. 6, there is shown a schematic configuration diagram of a third embodiment of the present invention. In the present embodiment, a shielding plate 44 having a number of openings or slits 46 is interposed between the first and second heat transfer blocks 28 and 34, and the shielding plate 44 is moved by the heat-sensitive movable mechanism 42.

The heat-sensitive movable mechanism 42 can have the same configuration as that of the above-described second embodiment. Further, in the present embodiment, since the first heat transfer block 28 does not move,
It is not necessary to use a flexible heat pipe as the first heat pipe 30.

By interlocking the shielding plate 44 with the heat-sensitive movable mechanism 42, the area of the radiation surfaces 32 and 38 facing each other is changed to control the temperature of the antenna feeding unit 14 without using a heater or the like that consumes a large amount of power. Is possible.

As an example of the shielding plate 44, a slit-shaped one as shown in FIG. 7 can be used. It is preferable that L4 = L1, L5 = L2, and L6 = L3, but it is not always necessary to make them coincide with each other, and the movement of the slit (X1 or X2 as an example of movement in a plane parallel to the opposing surface).
The opening (slit) may be formed so that the area of the portion of the radiation surface facing the heat transfer block that is blocked by the blocking portion changes due to the movement in the direction.

That is, as shown in FIG. 8, the shape of the shielding plate 44 'and the radiation surface do not have to match each other, but the shape of the opening is a general shape such as a circle, a rectangle, or a square for easy control. It is preferable that Of course, the number of slits and the like may be appropriately set.

Referring to FIG. 9, there is shown a schematic configuration diagram of a fourth embodiment of the present invention. In the present embodiment, in addition to the configuration of the third embodiment, the shielding plate 44 is connected to the third heat pipe 50.
Connected to a heat absorbing panel 48 that absorbs solar energy.

The heat absorbing panel 48 can function as a heat absorbing panel by directing the heat radiating panel 20 toward the sun. A radiation surface 46 is formed on the surface of the shielding plate 44 facing the first heat transfer block 28.

Thus, in the transfer orbit before the satellite is put into a predetermined orbit, the solar energy is absorbed by the heat absorbing panel 48 and the absorbed heat is converted into the first heat by heat radiation.
By transmitting the heat to the heat transfer block 28, it is possible to control to increase the temperature of the antenna power supply unit 14 without using a heater or the like.

The present invention includes the following supplementary notes.

(Supplementary Note 1) In a heat transfer control mechanism for transmitting heat generated from a heat generating portion of a device to a heat radiating portion via a heat conductive path and radiating heat from the heat radiating portion, a first heat transfer mechanism opposed to the heat conductive path. A radiating surface and a second radiating surface are provided, and at least one of the first radiating surface and the second radiating surface is constituted by a member having a temperature characteristic in which the emissivity increases with an increase in temperature. Or a heat transfer control mechanism, wherein at least one of the surfaces has been subjected to a temperature characteristic surface treatment in which the emissivity increases with an increase in temperature.

(Supplementary Note 2) In a heat transfer control mechanism for transmitting heat generated from a heat generating portion of a device to a heat radiating portion through a heat conductive path and radiating heat from the heat radiating portion, a first heat transfer control mechanism opposed to the heat conductive path. A heat transfer block and a second heat transfer block are provided, and at least one pair of radiation surfaces forming at least a pair is formed in a predetermined region of each of the first heat transfer block and the second heat transfer block. Forming a reflection surface in an area other than the surface, providing a movable mechanism for moving the first heat transfer block relative to the second heat transfer block, wherein the first heat transfer block comprises: A heat transfer control mechanism, wherein the heat transfer control mechanism is inserted into the heat conduction path while being connected to a flexible heat pipe.

(Supplementary Note 3) In a heat transfer control mechanism for transmitting heat generated from a heat generating portion of a device to a heat radiating portion through a heat conductive path and radiating heat from the heat radiating portion, a first heat transfer control mechanism opposed to the heat conductive path. A heat transfer block and a second heat transfer block are provided, and the opposing surfaces of the first heat transfer block and the second heat transfer block have a comb shape, and the bottom surface of the comb shape has a radiation surface,
A top surface of the comb teeth is used as a reflection surface, and a movable mechanism is provided for moving the first heat transfer block relative to the second heat transfer block, wherein the first heat transfer block is flexible. A conduction control mechanism which is inserted into the heat conduction path while being connected to the conductive heat pipe.

(Supplementary Note 4) In a heat transfer control mechanism for transmitting heat generated from a heat generating portion of an apparatus to a heat radiating portion via a heat conductive path and radiating heat from the heat radiating portion, a first heat transfer control mechanism opposed to the heat conductive path. A heat transfer block and a second heat transfer block are provided, and the opposing surfaces of the first heat transfer block and the second heat transfer block are paired in a comb shape, and the bottom surface of the comb shape is a radiation surface. A radiant heat shielding plate having a top surface of the comb teeth as a reflecting surface and having a plurality of openings between the first heat transfer block and the second heat transfer block; A heat transfer control mechanism provided with a movable mechanism for moving the heat transfer mechanism in a simple plane.

(Supplementary Note 5) A heat-absorbing panel that absorbs solar energy and a third heat pipe that connects the heat-absorbing panel and the radiant heat shield plate, wherein the radiant heat shield plate faces the first radiation surface. 4. The heat transfer control mechanism according to claim 4, wherein the heat transfer surface has a third radiation surface.

(Supplementary Note 6) The heating unit includes a plurality of antenna radiators and a plurality of power amplifiers connected to the antenna radiators, and the radiating unit includes a radiating panel. 6. The conduction control mechanism according to any one of supplementary notes 1 to 5, wherein

[0055]

According to the present invention, the provision of the heat radiation connection portion in the heat conduction path between the heat generating portion and the heat radiating portion allows the power consumption (heat generation amount) of various electronic devices such as a communication device to be varied. It is possible to reduce the temperature fluctuation of the electronic device due to the fluctuation of the installation environment temperature within a predetermined range, and a great effect can be exhibited by adopting it to a mobile communication satellite having a large payload limitation.

[Brief description of the drawings]

FIG. 1 is a principle diagram of the present invention.

FIG. 2 is a conceptual diagram of a mobile communication satellite.

FIG. 3 is a schematic configuration diagram of a first embodiment of the present invention.

FIG. 4 is a diagram showing a positive temperature characteristic of the emissivity.

FIG. 5 is a schematic configuration diagram of a second embodiment of the present invention.

FIG. 6 is a schematic configuration diagram of a third embodiment of the present invention.

FIG. 7 is a diagram showing a relationship between a shielding plate and a heat transfer block.

FIG. 8 is a diagram showing a general relationship between a shielding plate and a radiation surface.

FIG. 9 is a schematic configuration diagram of a fourth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Mobile communication satellite 14 Antenna feeding unit 16 Antenna radiator 18 Parabolic antenna 20 Heat dissipation panel 22 Solar panel 26 Power amplifier 28 First heat transfer block 30 First heat pipe 32, 38 Radiation surface 34 Second heat transfer block 36 First 2 heat pipe 42 heat-sensitive movable mechanism 44 shielding plate

Claims (4)

[Claims] 1. A heat transfer control mechanism for transmitting heat from a heat generating portion of a device to a heat radiating portion via a heat conductive path and radiating heat from the heat radiating portion, wherein a first radiating surface opposed to the inside of the heat conductive path. And a second radiation surface is provided, and at least one of the first radiation surface and the second radiation surface is constituted by a member having a temperature characteristic in which the emissivity increases with an increase in temperature, or A heat transfer control mechanism, wherein at least one of the surfaces is subjected to a temperature characteristic surface treatment whose emissivity increases with an increase in temperature. 2. A heat transfer control mechanism for transmitting heat generated from a heat generating portion of a device to a heat radiating portion via a heat conductive path and radiating heat from the heat radiating portion, wherein the first heat transfer mechanism opposing the heat conductive path. Providing a block and a second heat transfer block, forming at least one pair of radiating surfaces in a predetermined region of each of the opposing surfaces of the first heat transferring block and the second heat transferring block, and forming a radiating surface. A reflecting surface is formed in the other area except for the first heat transfer block, and a movable mechanism for moving the first heat transfer block relative to the second heat transfer block is provided; A heat transfer control mechanism, wherein the heat transfer control mechanism is inserted into the heat conduction path while being connected to the conductive heat pipe. 3. A heat transfer control mechanism for transmitting heat generated from a heat generating portion of a device to a heat radiating portion via a heat conductive path and radiating heat from the heat radiating portion, wherein the first heat transfer mechanism opposing the heat conductive path. A first heat transfer block and a second heat transfer block, the opposing surfaces of the first heat transfer block and the second heat transfer block are formed in a comb shape, and the bottom surface of the comb shape is a radiation surface; A top surface is a reflection surface, and a movable mechanism for moving the first heat transfer block relatively to the second heat transfer block is provided, wherein the first heat transfer block includes a flexible heat pipe. The conduction control mechanism, being connected and being inserted into the heat conduction path. 4. A heat transfer control mechanism for transmitting heat from a heat generating portion of a device to a heat radiating portion via a heat conductive path and radiating heat from the heat radiating portion, wherein the first heat transfer mechanism opposing the heat conductive path. A block and a second heat transfer block are provided, and the opposing surfaces of the first heat transfer block and the second heat transfer block are paired in a comb shape, and the bottom surface of the comb shape is a radiation surface. A radiant heat shield plate having a plurality of openings between the first heat transfer block and the second heat transfer block, wherein the top surface of the comb teeth is a reflection surface, and a plane parallel to the opposing surface. A heat transfer control mechanism, comprising: a movable mechanism for moving the inside of the heat transfer mechanism.