JP2002011654A - Method and device for taking work out of double polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily take out a machined work. SOLUTION: One work holding hole 16 is formed in an eccentric state in a carrier 14 engaged with a sun gear 10 and an internal gear 12 and a center Z of the carrier 14 is positioned in the work holding hole 16. The carrier 14 is positioned in a given position in a revolving direction and a suction head 23 of a pick-up member 22 of an unloading part 21 is positioned in the central part Z of the carrier 14. The work 25 in the work holding hole 16 is sucked at the suction head 23 and the work 25 is picked up by operating a pick-up member 22. Positioning of the carrier 14, positioning of the pick-up member 22, and separation of the work 25 from a lower platen are simplified and pick-up of the work 25 is easy to make.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor wafer,
The present invention relates to a method of taking out a work, such as an aluminum disk, from a carrier of a double-side polishing machine, and a disk-like work.

[0002]

2. Description of the Related Art There are various types of double-side polishing apparatuses for polishing the upper and lower surfaces of a disk-shaped work such as a semiconductor wafer and an aluminum disk, for example, a lower platen provided rotatably, A sun gear rotatably provided at the center of the lower surface plate, an upper surface plate rotatably and vertically movable above the lower surface plate, an internal gear rotatably provided on the outer peripheral side of the lower surface plate, and a sun gear. A grinding unit meshed and engaged with the internal gear and a carrier provided with a work holding hole, and a loading unit connected to the grinding unit and supplying an unprocessed work to the grinding unit. There is known an automatic machine provided with an unloading unit which is connected to a polishing unit and takes out a processed work from the polishing unit.

[0003] Then, the unprocessed work is supplied into the work holding hole of the carrier of the polishing unit by the supply member of the loading unit, and the upper platen is lowered to clamp the work between the upper platen and the lower platen. Then, in this state, lower platen, upper platen,
By rotating the sun gear and the internal gear to revolve and rotate the carrier between the upper and lower platens, the upper and lower surfaces of the work can be polished.

After the polishing is completed, the carrier is positioned at a fixed position in the revolving direction and the rotation direction, and the take-out member of the unloading portion is positioned at the center of the work holding hole of the carrier, and the work is attached to the suction head of the take-out member. By sucking out and removing the removal member from the polishing section,
The processed work can be taken out from the work holding hole of the carrier.

[0005] However, in the double-side polishing apparatus having the above structure, when the work is taken out from the work holding hole of the carrier after the polishing is completed, the sun gear and the internal gear are rotated a plurality of times, and the work holding hole of the carrier is removed. Must be positioned at a fixed position in the revolution direction and the rotation direction. For this reason, the amount of movement of each carrier after polishing is increased, and the upper and lower surfaces of the work are polished more than necessary, and the finished state of the work varies. In semiconductor wafers that undergo chemical polishing,
If the time from the end of processing to the removal is not as short as possible, there is a possibility that the quality may be deteriorated due to chemical attack.

In addition, since extra time is required for positioning the carrier at a fixed position in the revolving direction and the rotation direction, the production efficiency is reduced.

Further, in order to position the carrier at a fixed position in the revolution direction and the rotation direction, the position of the carrier in the revolution direction and the rotation direction are detected by a sensor, and the number of revolutions and the number of revolutions of the carrier are calculated. Since the rotation of the drive motor must be controlled, the control becomes complicated.

Further, if the central portion of the work is sucked by the unloading portion take-out member in the work holding hole of the carrier, a large force is required to separate the work from the lower platen. Must be enlarged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and can reduce the amount of movement of the carrier when positioning the carrier at a fixed position after finishing the work. Thus, it is possible to prevent the finished state of the work from being varied, and
The time required to position the carrier in a fixed position is short, the production efficiency can be increased, and the carrier can be positioned with high precision without requiring complicated control for positioning the carrier in a fixed position. It is an object of the present invention to provide a method for removing a work from a double-side polishing apparatus and a device for removing the work from a carrier, which need not be positioned at a fixed position, and which can remove the work with a small force when removing the work from a carrier. is there.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a method for removing a work from a carrier of a double-side polishing apparatus, wherein a single work holding hole is provided in the carrier. The center of the work holding hole is eccentric from the center of the carrier, and after polishing is completed, a take-out member is positioned at a substantially central portion of the carrier, and the work is sucked and taken out. is there. Also, a double-side polishing apparatus provided with a take-out member for taking out a work from a carrier, wherein the carrier is provided with one work holding hole, and the center of the work holding hole is eccentric from the center of the carrier, and after polishing is completed. Means is adopted in which a take-out member is positioned substantially at the center of the carrier to suck and take out the work.

[0011]

According to the present invention, by employing the above-mentioned means, the work is polished while holding the work in the work holding hole of the carrier meshingly engaged with the sun gear and the internal gear. The workpiece can be taken out by positioning the take-out member at a substantially predetermined position in the revolving direction, positioning the take-out member substantially at the center of the carrier, adsorbing the work part corresponding to that part, and operating the take-out member. become. At this time, the work need not be positioned in the rotation direction, and the work can be taken out immediately after stopping.

[0012]

Embodiments of the present invention shown in the drawings will be described below. 1 to 4 show an embodiment of a double-side polishing apparatus according to the present invention, which is used for carrying out a method for taking out a work according to the present invention. A lower surface plate 3 provided, a driver 5 rotatably provided at the center of the lower surface plate 3, an upper surface plate 7 rotatably and vertically movable above the lower surface plate 3, and an outer peripheral side of the driver 5 A sun gear 10 rotatably provided, an internal gear 12 rotatably provided on the outer peripheral side of the lower stool 3, and a sun gear 1
0 and an internal gear 12, the polishing section 2 including a carrier 14 having a work holding hole 16, a loading section 17 connected to the polishing section 2, and an unloading section 21. With

The lower platen 3 is formed in a disk shape having a hole penetrating in the vertical direction at the center, and a driver 5 is rotatably provided in the hole at the center.
A polishing pad 4 is adhered to the upper surface of the lower platen 3, and the work 2 held by the carrier 14 is mounted on the upper surface of the polishing pad 4.
The lower surface of 5 is in contact with it. Lower surface plate 3
It is connected to a drive source (not shown) located therebelow, and rotates in the horizontal direction when the drive source is activated.

The driver 5 is formed in a cylindrical shape, and is a driving source (not shown) located below the lower surface plate 3.
And rotate in the horizontal direction. The driver 5 is loosely fitted into the hole at the center of the upper stool 7 when the upper stool 7 is lowered, and the engaging groove 6 on the outer peripheral surface during the loose fitting.
The engaging pieces 9 of the upper stool 7 are engaged therein, whereby the upper stool 7 is integrally connected to the driver 5.

The upper surface plate 7 has a disk shape having a hole penetrating in the vertical direction at the center, and a polishing pad 8 is stuck on the lower surface side. The upper surface side of the work 25 held on the carrier 14 comes into contact with the work 25. The upper platen 7 rotates in the horizontal direction integrally with the driver 5 when the driver 5 rotates, and is connected to a vertical movement mechanism (not shown) composed of a vertical movement cylinder or the like, so as to rise or fall in the vertical direction. It is possible.

The sun gear 10 has a disk shape, and a predetermined gear 11 is provided on the outer peripheral surface. The sun gear 10 is rotatably provided in a hole at the center of the lower stool 3, and is connected to a drive source (not shown) located below the lower stool 3 so as to rotate in the horizontal direction. I have.

The internal gear 12 has a ring shape, and a predetermined gear 13 is provided on the inner peripheral surface. The internal gear 12 is rotatably provided on the outer peripheral side of the lower surface plate 3, and is connected to a drive source (not shown) located below the lower surface plate 3 so as to rotate in the horizontal direction.

The carrier 14 has a predetermined gear 15 on its outer peripheral surface.
Is formed in a thin disk shape, and a circular work holding hole 16 is provided eccentrically in one, and the center Z of the carrier 14 is located in the work holding hole 16. ing. Work holding hole 16 of carrier 14
Inside, a disk-shaped work 25 such as a semiconductor wafer is held.

The carrier 14 has a gear 15 on the outer peripheral surface and a gear 11 on the outer peripheral surface of the sun gear 10 and the internal gear 1.
2 is engaged with the gear 13 on the inner peripheral surface of the sun gear 1.
0 and the rotation of the internal gear 12
It revolves and rotates around 0. A plurality of carriers 14 are provided at predetermined intervals between the sun gear 10 and the internal gear 12 (4 in this embodiment).
Sheets). The carrier 14
Is required to be provided between the sun gear 10 and the internal gear 12.

The loading section 17 supplies the work to the carrier 14 by a known loading means.

The unloading section 21 is connected to a driving source (not shown), and has a take-out member 22 that can be turned and moved up and down. A suction head 23 is provided at a tip end of the take-out member 22, and a processed work 25 can be suctioned to a lower surface side of a suction portion 24 on a lower surface side of the suction head 23.

As the suction head 23, a type that sucks the work 25 by vacuum suction is effective. The suction head 23 of this type has a plurality of holes 20a in the suction portion 24 (see FIG. 5). The suction portion 24 is formed of an elastically deformable rubber material, and the rubber material is depressed during vacuum suction. There is one that adsorbs the work 25 (see FIGS. 6 and 7) and the like.
A float chuck manufactured by Solar Research Laboratory is used as the suction head 23.

In order to carry out the method of taking out a work according to the present invention by using the double-side polishing apparatus 1 having the above-described configuration, first, the driving source is operated, and the sun gear 10 and the internal gear 10 of the polishing section 2 are operated. Each of the carriers 14 is rotated by rotating the
Are rotated and rotated, and each carrier 14 is positioned at a predetermined position in the revolving direction and the rotating direction.

Then, the work 25 is supplied into the work holding hole 16 of the carrier 14 in the loading section 17.

Then, the sun gear 10 and the internal gear 12 are intermittently rotated by a predetermined angle to sequentially position each carrier 14 at a fixed position, and sequentially move the carriers 14 sequentially sent by the above method. Then, the unprocessed work 25 is supplied, and the unprocessed work 25 is supplied into the work holding holes 16 of all the carriers 14.

The upper platen 7 of the polishing section 2 is lowered to connect the upper platen 7 to the driver 5, and each work 25 is sandwiched between the lower platen 3 and the upper platen 7. By rotating the lower platen 3, the upper platen 7 (driver 5), the sun gear 10 and the internal gear 12, the carrier 14 revolves and rotates between the both platens 3 and 7, and the upper and lower surfaces of each work 25 are polished. Do.

After the polishing of the upper and lower surfaces of each work 25 is completed, the sun gear 10 and the internal gear 12 are polished.
Is rotated again to position each carrier 14 at a substantially predetermined position in the revolving direction.

Then, the take-out member 22 of the unloading section 21 is turned to rotate the suction head 23 to the polishing section 2.
While being positioned approximately at the center Z of the carrier 14 of
The take-out member 22 is lowered to bring the suction head 23 into contact with the upper surface of the processed work 25, and the work 25 is vacuum-sucked to the suction portion 24 of the suction head 23. In this case, the work 25 has a portion substantially corresponding to the center Z of the carrier 14,
That is, a portion of the work 25 that is shifted from the center O is attracted.

Then, the take-out member 22 is raised to peel off the processed work 25 from the lower surface plate 3, and the take-out member 22 is turned to return to the origin, and the take-out member 22 is lowered to unload the table (not shown). The processed work 25 is positioned on the work (not shown).

Then, the sun gear 10 and the internal gear 12 are intermittently rotated by a predetermined angle, and the processed workpieces 25 are sequentially taken out of the sequentially sent carriers 14 by the above-described method. Work 2 already processed from inside the work holding holes 16 of all carriers 14
Take 5 out.

In this way, the method of taking out a work according to the present invention can be carried out.

In the method and apparatus for taking out a work from the double-side polishing apparatus according to this embodiment having the above-described configuration, the processed work 25 is taken out from the work holding hole 16 of the carrier 14 of the polishing section 2. In this case, the carrier 14 may be positioned at a predetermined position in the revolving direction, and the suction head 23 of the take-out member 22 of the unloading unit 21 may be positioned at substantially the center Z of the carrier 14. There is no need to consider the position.

Therefore, each carrier 14 after polishing is completed.
When positioning is performed at a fixed position, the amount of movement of each carrier 14 can be reduced, so that the amount of work 25 to be polished after completion of polishing can be reduced, and the finished state of work 25 varies. This can be prevented.

Further, each carrier 14 may be positioned at a predetermined position in the revolving direction, and it is not necessary to consider the position in the rotation direction, so that the time required for positioning each carrier 14 can be shortened. , The production efficiency can be improved.

Further, since each carrier 14 may be positioned at a predetermined position in the revolving direction, a position of each carrier 14 in the revolving direction may be detected by a sensor (not shown). Since only the number of revolutions needs to be calculated to control the rotation of the drive motor, the control can be simplified.

Further, since the suction head 23 of the take-out member 22 of the unloading section 21 may be positioned substantially at the center Z of each carrier 14, the positioning of the suction head 23 does not require high precision, and rough positioning is possible. The work 25 can be sufficiently taken out even with high accuracy.

Further, in each work holding hole 16 of each carrier 14, the work 25 is
Since the portion of the work 25 deviated from the center O is suctioned by the suction head 23 of the take-out member 22, the force required to separate the work 25 from the lower surface plate 3 is small, and The loading unit 21 can be reduced in size.

In the above description, the gear 15 is provided on the outer peripheral surface between the sun gear 10 having the gear 11 on the outer peripheral surface and the internal gear 12 having the gear 13 on the inner peripheral surface.
Although a double-side polishing apparatus 1 in which a carrier 14 having meshing and engaging is used is used, although not shown, between a sun gear having pins erected on an outer peripheral part and an internal gear having pins erected on an inner peripheral part. The same effect can of course be obtained by using a double-side polishing apparatus in which a carrier having a gear on the outer peripheral surface is engaged.

[0039]

According to the present invention, the carrier is positioned at a predetermined position in the revolving direction when the machined work is taken out from the carrier.
What is necessary is just to position the take-out member at substantially the center of the carrier. Therefore, since the amount of moving the carrier after the polishing is completed is small, the amount of the work to be further polished after the polishing is completed can be reduced, and the finished state of the work can be prevented from being varied.

The carrier may be positioned at a predetermined position in the revolution direction, and it is not necessary to consider the position in the rotation direction. Therefore, the carrier can be positioned at a fixed position in a short time. Therefore, the time required for taking out the work is shortened, and the production efficiency can be improved.

Further, since only the position of the carrier in the revolving direction needs to be considered, only the position of the carrier in the revolving direction may be detected by a sensor. , The control can be simplified.

Further, since the take-out member need only be positioned substantially at the center of the carrier, a high precision is not required for positioning the take-out member, and the work can be sufficiently taken out even with rough accuracy.

Further, in each work holding hole of the carrier, the work is sucked at a position deviated from the center, so that a small force is required for peeling off the work from the lower platen. The size can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an embodiment of a double-side polishing apparatus according to the present invention.

FIG. 2 is an explanatory diagram showing a relationship between a carrier, a work, and a take-out member shown in FIG.

FIG. 3 is an explanatory view taken along line AA of FIG. 2;

FIG. 4 is an explanatory diagram showing a relationship between a polishing section, a loading section, and an unloading section.

FIG. 5 is a schematic view showing an example of a suction head.

FIG. 6 is a schematic view showing another example of the suction head.

FIG. 7 is a schematic diagram showing an adsorption state of the one shown in FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Double-side polishing apparatus 2 ... Polishing part 3 ... Lower surface plate 4, 8 ... Polishing pad 5 ... Driver 6 ... Engagement groove 7 ... Upper surface plate 9 ... Engagement piece 10 ... Sun gear 11 , 13, 15 ... Gear 12 ... Internal gear 14 ... Carrier 16 ... Work holding hole 17 ... Loading part 23 ... Suction head 24 ... Suction part 20a ... Hole 21 ... Unloading part 22 ... Take-out member 25: Workpiece Z, O: Center

Claims (2)

[Claims] 1. A method for removing a work from a carrier of a double-side polishing apparatus, wherein the carrier has one work holding hole, and the center of the work holding hole is eccentric from the center of the carrier. A work taking-out member is positioned substantially at the center of the carrier to suck and take out the work. 2. A double-side polishing apparatus provided with a take-out member for taking out a work from a carrier, wherein the carrier has one work holding hole, and the center of the work holding hole is eccentric from the center of the carrier. A double-side polishing apparatus characterized in that, after completion, a take-out member is positioned at a substantially central portion of the carrier to suck and take out a work.