JP2002008449A - Anisotropic conductive film and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive film at a low cost, preventing dirt on an electrode of an inspection device in a repetitive performance inspection, further capable of facilitating aligning when mounting on the inspection device, and to provide a preferable manufacturing method of the anisotropic conductive film. SOLUTION: The anisotropic conductive film 1 is provided with one or several anisotropic conductive areas, where in a film substrate 2 having insulation, several conduction paths 3 consisting of conductive material substantially penetrate along a thickness direction of the substrate 2, to expose both ends on the front and back surfaces of the substrate 2 and arranged so as to be insulated from one another, and provided with several insulation areas including the area having insulation and at least arranged in both ends of the film 1. The anisotropic conductive area and the insulation area are arranged in one line alternately without forming a step each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film, and more particularly to an anisotropic conductive film suitably used for testing the function of an electronic component, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become more sophisticated and smaller and lighter, electronic components such as ICs used in the electronic devices have also been required to have higher functions and higher reliability. With such higher integration and narrower pitch of input / output electrodes in such electronic components, the electronic components have become expensive, and therefore, before mounting the components on a circuit board, they have functions such as conduction. The need to inspect is increasing. That is, if the functional inspection is performed after mounting the electronic component, if the component is defective, the non-defective circuit board is also disposed of, and the yield of the circuit board is reduced meaninglessly. , The amount of money is also large.

As a method of inspecting the function of an electronic component, a method using a socket for inspecting an electronic component, a method of directly contacting a probe pin having a spring structure with an input / output electrode of the electronic component, and the like are known. From the viewpoints of narrowing the pitch of input / output electrodes (leads) of electronic components and simplifying the process, the input / output electrodes of the electronic components are brought into direct contact with the electrodes on the inspection board or the inspection using the inspection socket. Inspection methods are increasing.

In the case of these inspection devices, dirt such as solder oxide on the surface of the input / output electrodes of the electronic component may be contaminated by the surface of the electrodes on the inspection socket or the inspection substrate during repeated use. There is a problem of sticking to. The resistance of the electrode on the inspection socket or the inspection substrate to which the dirt has adhered when the input / output electrode is in contact with the electrode increases, and the inspection of the component cannot be performed normally. Further, if the inspection socket or the inspection substrate is washed or replaced before the contamination becomes severe, the cost for the function inspection increases.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems, prevent contamination on the electrodes of the inspection apparatus during repeated function inspections, and further reduce the time when the apparatus is mounted on the inspection apparatus. It is an object of the present invention to provide a low-cost anisotropic conductive film that can facilitate alignment, and to provide a preferable method of manufacturing the anisotropic conductive film.

[0006]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, by adopting a unique structure and / or a unique manufacturing method, the above problems can be solved. The present inventors have found that an anisotropic conductive film can be obtained, and have completed the present invention.

That is, the present invention is as follows. (1) A plurality of conductive paths made of a conductive material penetrate the insulating film substrate substantially along the thickness direction of the film substrate to expose both ends on the front and back surfaces of the film substrate. And one or more anisotropic conductive regions arranged in a state in which they are insulated from each other, and a plurality of insulating regions having an insulating property and including at least regions arranged at both ends of the film. An anisotropic conductive film, wherein an anisotropic conductive region and an insulating region are alternately arranged in a line without forming a step. (2) A plurality of conductive paths made of a conductive material penetrate the insulating film substrate substantially along the thickness direction of the film substrate to expose both ends on the front and back surfaces of the film substrate. And a plurality of anisotropic conductive regions including regions arranged at least at both ends of the film and arranged in an insulated state, and one or more insulating regions having an insulating property. An anisotropic conductive film, wherein anisotropic conductive regions and insulating regions are alternately arranged in a line without forming a step. (3) The anisotropic conductive film according to the above (1) or (2), which is obtained by a production method having at least the following steps: A winding coil forming step in which at least one or more coating layers made of an insulating material are provided on a wire made of a conductive material to form an insulated conductor, and the insulated conductor is wound in a roll shape around a core to form a wound coil. Heating and / or pressurizing the wound coil while winding in the above-mentioned step or after the above-mentioned step to fuse and / or press-bond the coated layers of the insulated insulated wires to integrate them. A winding coil block forming step of forming a coil block. A rectangular parallelepiped wire-containing material block containing no core material is formed from the wound coil block obtained in the above step, and the wire-containing material block and a rectangular parallelepiped resin block made of an insulating material are alternately laminated and heated. And a step of forming a composite block in which adjacent blocks are fused together under pressure to form an integrated composite block. From the composite block obtained in the above step, the portion of the wire as a conduction path,
The portion of the coating layer fused and / or pressed in the step is used as a film base, the portion of the wire-containing material block is used as an anisotropic conductive region, and the portion of the resin block is used as an insulating region. Film forming process to form. (4) In the function inspection of an electronic component for inspecting the continuity between the electrode of the inspection device and the input / output electrode of the electronic component using the inspection device, the function of the electrode of the inspection device and the input / output electrode of the electronic component is (1) to (3), which is used to be interposed between an electrode of the inspection device and an input / output electrode of the electronic component so that a contact portion of the electronic component becomes an anisotropic conductive region. Anisotropic conductive film. (5) The anisotropic conductive film according to (4), wherein at least one of the insulating regions is bent in the thickness direction of the film. (6) The anisotropic conductive film according to (5), wherein a cut is formed in at least one of the insulating regions, and the cut is formed at the cut. (7) In at least one of the insulating regions, a through hole serving as a reference for aligning the anisotropic conductive region of the film with a portion in contact with an electrode of an inspection device and an input / output electrode of an electronic component. The anisotropic conductive film according to the above (4), wherein a hole or a recess is formed. (8) The anisotropic conductive film according to the above (1), wherein the film has one region A1 as the anisotropic conductive region and two regions B1 and B2 as the insulating region. (9) Two regions A2 and A3 as the anisotropic conductive regions
And one region B <b> 3 as the insulating region. (10) The anisotropic conductive film according to (9), wherein the elastic modulus of the region B3 is 0.01 to 10 GPa. (11) Two regions A4 and A as the anisotropic conductive regions
5 and three regions B4, B5, B
6, a region B4 and a region B5 are respectively disposed at both ends of the film, a region A4 and a region A5 are disposed between the regions B4 and B5, and a region B6 is disposed between the regions A4 and A5.
Is disposed, the anisotropic conductive film according to the above (1). (12) The anisotropic conductive film according to (11), wherein the elastic modulus of at least the region B6 in the insulating region is 0.01 to 10 GPa. (13) A method for producing an anisotropic conductive film, comprising at least the following steps: A winding coil forming step in which at least one or more coating layers made of an insulating material are provided on a wire made of a conductive material to form an insulated conductor, and the insulated conductor is wound in a roll shape around a core to form a wound coil. Heating and / or pressurizing the wound coil while winding in the above-mentioned step or after the above-mentioned step to fuse and / or press-bond the coated layers of the insulated insulated wires to integrate them. A winding coil block forming step of forming a coil block. A rectangular parallelepiped wire-containing material block containing no core material is formed from the wound coil block obtained in the above step, and the wire-containing material block and a rectangular parallelepiped resin block made of an insulating material are alternately laminated and heated. And a step of forming a composite block in which adjacent blocks are fused together under pressure to form an integrated composite block. From the composite block obtained in the above step, the wire portion is used as a conductive path, the coating layer portion fused and / or crimped in the step is used as a film substrate, and the wire-containing block portion is used as an anisotropic conductive material. A film forming step of forming an anisotropic conductive film using the resin block as an insulating region and the resin block as an insulating region. (14) A method for producing an anisotropic conductive film, comprising at least the following steps: At least one coating layer made of an insulating material is provided on a wire made of a conductive material to form an insulated conductor, and the insulated wire is wound around a rectangular parallelepiped core made of an insulative material in a roll shape to form a winding coil. Winding coil forming step. After the above process, the winding coil and the rectangular parallelepiped resin block made of an insulating material are alternately laminated, and the coating layers of the insulated conductive wire wound around the core material by heating and / or pressing are fused and fused. A composite block forming step of forming a composite block by fusing and / or crimping a resin block and a core material made of an insulating material together with a core material made of an insulating material at the same time as crimping. From the composite block obtained in the above step, the wire portion is used as a conductive path, the coating layer portion fused and / or crimped in the step is used as a film substrate, and the insulated conductive wire portion is used as an anisotropic conductive region. And a film forming step of forming an anisotropic conductive film using the resin block portion and the core material portion as insulating regions.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the anisotropic conductive film of the present invention will be described in detail. The anisotropic conductive film of the present invention is broadly classified into the anisotropic conductive film belonging to the first group (1) and the anisotropic conductive film belonging to the second group (2). In addition, in this specification, the "anisotropic conductive film of the present invention" refers to all the anisotropic conductive films belonging to the present invention regardless of the first group and the second group.

FIG. 1 is a simplified view showing a preferred example of an anisotropic conductive film 1 of the first group of the present invention. FIG. 1 (a) is a top view, and FIG. It is sectional drawing seen from the cutting surface line Ib-Ib of a). In addition, the cut surface line Ib-Ib is parallel to the thickness direction Z of the anisotropic conductive film 1 (the direction perpendicular to the paper surface in FIG. It is a section line in FIG. The anisotropic conductive film of the first group of the present invention includes one or a plurality of anisotropic conductive regions (corresponding to one region A1 in FIG. 1) and at least regions arranged at both ends of the film. A plurality of insulating regions (see FIG. 1)
(Corresponding to two regions B1 and B2), and the anisotropic conductive region and the insulating region are alternately arranged in a line without forming a step. The shape of the anisotropic conductive film is not particularly limited, but preferably has a rectangular cross section perpendicular to the thickness direction Z like the anisotropic conductive film 1 in FIG. Note that anisotropic conductivity refers to a property having electrical conductivity only in a certain direction but being electrically insulated in other directions.

The anisotropic conductive film of the present invention is a particularly preferable anisotropic conductive film for inspecting the conduction function of electronic parts. In the case of the shape shown in FIG. (First width) D1 is preferably 3
６０60 mm, more preferably 10 to 30 mm, and the length (second width) D2 in the second width direction Y is preferably 3 to 70 mm, more preferably 10 to 40 mm, and the length in the thickness direction Z. (Thickness) D3 is preferably 0.03 to 1 mm, more preferably 0.05 to 0.5.
mm. The first width direction X refers to a direction substantially along one of the two sides that are perpendicular to each other in the rectangular cross section, and the second width direction Y refers to the two sides. A direction roughly along one of the other sides. The first width direction X, the second width direction Y and the thickness direction Z
Are directions along three axes perpendicular to each other.

The anisotropic conductive film 1 shown in FIG. 1 has one region A1 as an anisotropic conductive region and two regions B1 and B2 as insulating regions. In the anisotropic conductive film 1, a region B1 and a region B2 are respectively disposed at both ends of the film 1, and a region A1 is provided between the regions B1 and B2.
Are arranged and arranged in a line without forming a step. More specifically, the areas B1, B
2 are arranged such that the region B1 forms one end 1a of the film 1 in the first width direction X over the entire region in the second width direction Y, and the region B2 is
Is arranged so as to form the other end 1b in the first width direction X over the entire area in the second width direction Y. Area A1
Is a region that is disposed between the region B1 and the region B2 and that covers the entire region in the second width direction Y.
One end is in contact with the region B1, and the other end in the first width direction X is in contact with the region B2. The region A1 and the regions B1 and B2 are arranged in contact with each other as described above without forming a step in the second width direction Y and the thickness direction Z of the film 1, and are integrated.

The area A1 is composed of an insulating film substrate 2 and a plurality of conductive paths 3 arranged in the film substrate 2.
And a region having The conduction path 3 is made of a conductive material and penetrates generally along the thickness direction of the film substrate 2.
Both ends are exposed on the front and back surfaces of the film substrate 2. In order for the region A1 to exhibit anisotropic conductivity, both ends of the conductive path 3 are exposed on the front and back surfaces of the film substrate 2 while penetrating the film substrate 2 while being insulated from each other. It is necessary. Here, the “state insulated from each other”
It means a state in which the conductive paths 3 are independent of each other in the insulating film substrate 2 without being in contact with each other. Here, the first width direction, the second width direction, and the thickness direction of each of the anisotropic conductive film 1, the film substrate 2, the region A1, and the regions B1 and B2 all indicate the same direction, and are shown in FIG. The first width direction X, the second width direction Y, and the thickness direction Z as described above.

The size and number of each conductive path 3 are appropriately selected depending on the electronic components and the inspection apparatus used for testing using the anisotropic conductive film 1. For example, the shape of each conductive path 3 in FIG. As described above, when both are cylindrical, the diameter of the circle having a cross section perpendicular to the axis is preferably 10 to 200 μm, more preferably 15 to 100 μm, and the pitch is 30 to 100 μm.
Preferably, they are arranged at about 150 μm. When the shape of each of the conductive paths 3 is other than the columnar shape, it is preferable that the cross-sectional area is approximately the same as the cross-sectional area of the circle in the columnar shape. The shape of the conduction path 3 may be any shape as long as the above conditions are satisfied, and may be, for example, a polygonal column shape.
If each of the conductive paths 3 is too small or too small, it is not preferable because the conductivity is poor. On the other hand, if the conductive paths 3 are too large or too many, the strength of the film 1 is inferior and the pitch of the input / output electrodes of the electronic component to be inspected cannot be reduced.

The regions B1 and B2 are made of an insulating material,
There is no conduction path 3 in this area. Such an area B
Reference numerals 1 and B2 have the same thickness D3 as the region A1 and are in contact with the region A1 without forming a step as described above, and are disposed at both ends in the first width direction X of the film 1.

As described above, the anisotropic conductive film 1 has an anisotropic conductive film 1 in the order of the region B1, the region A1, and the region B2 from the one end 1a in the first width direction X toward the other end 1b in the first width direction X. It has a configuration in which conductive regions and insulating regions are alternately arranged. The regions B1 and B2 are formed so as to correspond to portions of the film 1 that are not related to the electrical contact between the input / output electrodes of the electronic component to be inspected and the electrodes of the inspection device in the function inspection of the electronic component. Therefore, the lengths D4 and D5 of the regions B1 and B2 in the first width direction X do not need to be the same and are not particularly limited, but preferably the length D4 is 1
The length D5 is 1 to 30 mm, more preferably the length D4 is 2 to 15 mm, and the length D5 is 2 to 15 mm.

FIG. 2 is a simplified diagram showing an anisotropic conductive film 6 of a preferred example of the second group of the present invention, wherein FIG. 2 (a) is a top view, and FIG. It is sectional drawing seen from the cutting surface line IIb-IIb of a). The cutting plane line IIb-IIb is a cutting plane line in an imaginary plane that is parallel to the thickness direction Z of the anisotropic conductive film 6 (the direction perpendicular to the paper surface in FIG. 2) and passes through the conduction path 3. is there. The anisotropic conductive film of the second group of the present invention comprises a plurality of anisotropic conductive regions (at least two regions A in FIG. 2) including regions arranged at least at both ends of the film.
2 and A3) and one or a plurality of insulating regions (corresponding to one region B3 in FIG. 2), and the anisotropic conductive region and the insulating region form a step with each other. It is configured to be alternately arranged in a line without performing. Thus, the anisotropic conductive film of the second group of the present invention,
It has a structure having anisotropically conductive regions at both ends thereof. Except for this structure, it is basically the same as the above-described anisotropically conductive film of the first group of the present invention. In the anisotropic conductive film 6 of the embodiment shown in FIG. 2, parts having the same configuration as the anisotropic conductive film 1 shown in FIG.

The anisotropic conductive film 6 has two regions A2 and A3 as anisotropic conductive regions and one region B3 as an insulating region. In the anisotropic conductive film 6, a region A2 and a region A3 are respectively provided at both ends of the film 6, and a region B3 is arranged between the regions A2 and A3, and arranged in a line without forming a step. Configuration. More specifically, the regions A2 and A3 are arranged so that the region A2 forms one end 6a of the film 6 in the first width direction X over the entire region in the second width direction Y, and the region A3 is The other end 6b in the first width direction X is disposed so as to form over the entire area in the second width direction Y. The area B3 is the area A
2 and the area across the entire area in the second width direction Y sandwiched between the area A3, the end of one side in the first width direction X contacts the area A2, and the other side in the first width direction X Is in contact with the area A3. Area A2, A3 and area B3
Are arranged in contact with each other as described above without forming a step in the second width direction Y and the thickness direction Z of the film 6, and are integrated.

As described above, the anisotropic conductive film 6 has an anisotropic conductive film 6 in the order of the region A2, the region B3 and the region A3 from the one end 6a in the first width direction X toward the other end 6b in the first width direction X. It has a configuration in which conductive regions and insulating regions are alternately arranged. The area B3 is the same as that of the above-described embodiment.
Are formed so as to correspond to portions not related to the electrical contact between the input / output electrodes of the electronic component and the electrodes of the inspection device. Therefore, the length D6 of the region B3 in the first width direction X is not particularly limited, but is preferably 1 to 30 mm, more preferably 2 to 15 mm.

In the anisotropic conductive film 6, the elastic modulus of at least the region B3 of the insulating region is preferably 0.01 to 10 GPa, more preferably 0.05 to 5 GPa.
Pa. If the elastic modulus is less than 0.01 GPa, it is not preferable because there is a problem that alignment and removal become difficult in a function test of an electronic component using a test device described later. Also, when at least one of the insulating regions is subjected to a bending process described below, the strength of a portion to be folded is insufficient, or a hole is formed to form a through hole or a recess described below. In addition, there is a disadvantage that the workability is poor and the alignment becomes unstable, which is not preferable. The elastic modulus is 10G
If the pressure exceeds Pa, in a functional inspection of an electronic component using an inspection device described later, it is not possible to tolerate a shift that spreads substantially along the first width direction X of the contact pin when a contact load is applied. Not preferred. In addition, it is difficult to perform the above-mentioned bending process, and if the above-described boring process is performed, a crack is generated.

FIG. 3 is a simplified view showing another preferred example of the anisotropic conductive film 11 of the first group of the present invention. FIG. 3 (a) is a top view and FIG. 3 (b) is a view. FIG. 3 (a) is a cross-sectional view taken along line IIIb-IIIb. The cutting plane line IIIb-IIIb is parallel to the thickness direction Z of the anisotropic conductive film 11 (in FIG. 3A, perpendicular to the plane of the drawing) and cut along a virtual plane passing through the conduction path 3. It is a surface line. Parts having the same configuration as the anisotropic conductive film 1 shown in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. The anisotropic conductive film 11 of the embodiment shown in FIG. 3 is an anisotropic conductive film belonging to the first group of the present invention, and has two regions A4 and A5 as anisotropic conductive regions and an insulating region. Three areas B
4, B5 and B6, two electronic components can be inspected simultaneously using the regions A4 and A5.

In the anisotropic conductive film 11, a region B4 and a region B5 are respectively disposed at both ends of the film, and regions A4 and A5 are disposed between the regions B4 and B5.
Regions B6 are arranged between the lines A4 and A5, and are arranged in a line without forming a step. More specifically, the regions B4 and B5 are arranged so as to form both ends 11a and 11b in the first width direction X of the film 11 over the entire region in the second width direction Y. Such an area B
Regions A4 and A5 are arranged between the regions A4 and B5. The regions A4 and A5 are both regions that cover the entire region of the film 11 in the second width direction Y. The region A4 has an end on one side in the first width direction X and the region B4, and the region A5 is in the first width direction. The other end on the X side is in contact with the region B5. The region B6 is a region which is disposed between the region A4 and the region A5 and covers the entire region in the second width direction Y, and one end of the first width direction X is in contact with the region A4. The end on the other side in the first width direction X contacts the region A5. Area A
4, A5 and regions B4, B5, B6 are arranged in contact with each other as described above without forming a step in the second width direction Y and the thickness direction Z of the film 11, and are integrated.

As described above, the anisotropic conductive film 11 is moved from the first width direction X end 11a side to the first width direction X other end 11a.
An anisotropic conductive region and an insulating region are arranged alternately in the order of the region B4, the region A4, the region B6, the region A5, and the region B5 toward the b side. Regions B4, B5, B
6 is formed so as to correspond to a portion of the film 11 which is not related to the electrical contact between the input / output electrodes of the electronic component and the electrodes of the inspection device, as in the above embodiment. Therefore, the lengths D7, D of the regions B4, B5, B6 in the first width direction X
8 and D9 need not be the same and are not particularly limited, but preferably have a length D7 of 1 to 30 mm and a length D8 of 1
~ 30mm, length D9 is 1 ~ 30mm, more preferably length D7 is 2 ~ 15mm, length D8 is 2 ~ 15m
m and the length D9 are 2 to 15 mm.

The anisotropic conductive film 11 preferably has an elastic modulus of at least the region B6 of the insulating region, preferably at least 0.01, similarly to the insulating region of the anisotropic conductive film 6 shown in FIG. -10 GPa, more preferably 0.05-
5 GPa.

The material of the anisotropic conductive region and the insulating region in the anisotropic conductive film of the present invention will be described later in connection with a preferred production method.

FIG. 4 is a cross-sectional view showing a state in which the regions B4 and B5 of the anisotropic conductive film 11 of the embodiment shown in FIG. 3 are bent. In the anisotropic conductive film of the present invention, at least one of the insulating regions may be bent in the thickness direction of the film. Since the insulating region does not have the conduction path 3 unlike the anisotropic conductive region, the electrode and the electronic device of the inspection device are used in the function inspection of an electronic component using the anisotropic conductive film of the present invention, which will be described later, such as bending. Various processes can be easily performed to facilitate alignment of the anisotropic conductive region with the input / output electrodes of the component. More specifically, in the case of an anisotropic conductive film belonging to the first group of the present invention, the insulating region necessarily having a region arranged at both ends of the film, at least the above-described region in the insulating region arranged at both ends of the insulating region Processing can be performed. Further, the anisotropic conductive region belonging to the second group of the present invention necessarily has a region arranged at both ends of the film, in other words, the insulating region necessarily has a region sandwiched between the anisotropic conductive regions. In the case of a film, at least processing can be performed on a region sandwiched between the anisotropic conductive regions. Regarding the anisotropic conductive film 11 belonging to the first group of the present invention shown in FIG. 3, the above processing may be applied to any of the regions B4, B5, and B6. In the case shown in FIG. 4, for example, the regions B4 and B5 arranged at both ends are bent.

In the anisotropic conductive film 11 shown in FIG. 4, the end portion 14 in the region B4 forms a fold 15 and is bent to one side in the thickness direction Z, and the end portion 16 in the region B5 forms the fold 17 It is formed and bent to one side in the thickness direction Z. Here, the end portion 14 is the film 1
One end 11a is the part on the one side in the first width direction X, and the end part 16 is the end 11b of the film 11 on the other side in the first width direction X. Creases 15, 17
Is not particularly limited, but is preferably formed substantially parallel to the second width direction Y. In FIG. 4, the second width direction Y is a direction perpendicular to the paper surface.

In FIG. 4, each end portion 14,
Although each of the end portions 14 and 16 is bent to the other side in the thickness direction Z, although each of the end portions 16 is shown to be bent to one side in the thickness direction Z. Further, depending on the type of the inspection device to which the film 11 is mounted and / or the form of the electronic component to be inspected, one of the end portions 14 and 16 is bent in one direction in the thickness direction Z, and the other is in the thickness direction Z. It may be configured to be bent to the other side.
Further, a through-hole or a recess described later may be further formed in any of the insulating regions.

The positions at which the folds 15 and 17 are formed can be set variously depending on the type of the inspection device on which the film 11 is mounted and / or the electronic component to be inspected. The positions of the folds 15 and 17 are not particularly limited as long as they are within the regions B4 and B5 arranged at both ends of the film 11, but for example, as shown in FIG. If the length D10 of the portion 18 between the folds 15 and 17 in the first width direction X is preferably 2 to 40 mm,
More preferably, it is 8 to 25 mm.

FIG. 5 is a diagram schematically showing an example of use of the bent anisotropic conductive film 11 of FIG. 4 for function inspection of an electronic component. In the function test shown in FIG. 5, the SOP (S
An IC 19 of a package of a mall outline package is used, and input / output electrodes for electrical connection to the outside of the IC 19 are to be contacted. Input and output electrodes are
It has a lead pin 20 which is a conductor portion extending toward the outside of the IC 19. As the inspection device, an IC inspection socket 21 of an SOP package is used. FIG. 5A shows a state in which the inspection socket 21 is opened, and FIG. 5B shows a state in which the inspection socket 21 is closed.

As shown in FIG. 5, in the IC 19, a plurality of the lead pins 20 regularly protrude from one side in the thickness direction W of the package 22. The package 22 is a substantially rectangular parallelepiped whose cross section perpendicular to the thickness direction W is substantially rectangular. The lead pins 20 protrude from the outer edges of the package 22 that form two long sides that are long sides of the substantially rectangular shape at an arbitrary interval along the long sides. In FIG.
The lead pins 20 are arranged at an arbitrary interval in a direction perpendicular to the paper surface.

The inspection socket 21 as an inspection device basically has a housing 23, an electrode portion 24, and a contact pin 25. The housing 23 includes a first housing portion 26 serving as an upper lid, and a box-shaped second housing portion 27 having an opening on the first housing portion 26 side. The first housing part 26 and the second housing part 27 can open and close the inspection socket 21 by the first housing part 26 being angularly displaced around the shaft 23a. The shaft 23a
Extends in a direction perpendicular to the plane of FIG.

For example, two electrode portions 24 are formed such that one end thereof protrudes from the vicinity of the center of the bottom wall 27a of the second housing portion 27 to the external space. The electrode portion 24
The other end penetrates the bottom wall 27 a and is exposed to the internal space of the second housing part 27. Thus, the electrode part 2
4 is formed so that electrical connection is possible via the bottom wall 27a of the second housing part 27.

The contact pin 25 is a conductive pin accommodated in the housing 23, and has a socket-side contact portion 28, a rising portion 29, and an electronic component-side contact portion 30. The socket-side contact portion 28 is disposed in the internal space of the second housing portion 27 from near the center of the bottom wall 27a to approach the side wall substantially along the bottom wall 27a, and is electrically connected to the electrode portion 24 and the rising portion 29. Connect so that connection is possible. The rising portions 29 rise from the vicinity of the bottom wall 27a of the second housing portion 27 toward the first housing portion 26, respectively, and near the opening of the second housing portion 27 substantially parallel to the bottom wall 27a near the center of the internal space. Head for. Each of the electronic component-side contact portions 30 is connected so that one end portion 30 a thereof can be electrically connected to the rising portion 29. The other end portion 30 b of the electronic component side contact portion 30 projects from the opening of the second housing portion 27.

Thus, when the inspection socket 21 shown in FIG. 5B is closed, the other end portions 3 of the electrode portion 24 and the electronic component side contact portion 30 of the contact pin 25 are closed.
0b can be electrically connected. In other words, each other end portion 30b of the electronic component side contact portion 30 corresponds to an electrode of the inspection device. In the function test of the IC 19 using the test socket 21 having the above-described structure, the anisotropic conductive film 11 is placed between each other end portion 30b of the electronic component side contact portion 30 and the lead pin 20 of the input / output electrode. Intervene. In the anisotropic conductive film 11, the region A4 and the region A5 as anisotropic conductive regions have the other end portions 3 as described above.
0b and the input / output electrodes.

With the anisotropic conductive film 11 interposed as described above, as shown in FIG. 5 (b), the first housing part 26 is pivoted about the shaft 23a to the second housing part 27.
The inspection socket 21 is closed by being angularly displaced in a direction approaching. As a result, all of the contact pins 25, the IC 19, and the anisotropic conductive film 11 must be accommodated in the housing 23. A contact load acts such that the contact resistance value can be measured to the extent that the contact resistance value can be measured via the film 11. In this state, the contact pins 25 are displaced and bent so as to spread substantially along the first width direction X of the film 11 to such an extent that the contact load is not lost, and the electronic component side contact portions 30 and I are bent.
Both C19 and anisotropic conductive film 11 allow it to fit within housing 23. In this manner, the electronic component-side contact portion 30 and the input / output electrode are electrically connected so that the function test can be performed.
Can be functionally tested.

As described above, by using the anisotropic conductive film 11 for the function inspection of the electronic component, the stain such as the solder oxide adhered to the electrode of the inspection apparatus during the conventional inspection is removed. It adheres to the surface of the conductive film 11. As a result, only the anisotropic conductive film 11 needs to be replaced before the increase in the resistance that affects the measurement due to the accumulation of the dirt, so that cleaning or replacement of the inspection device is not required. Therefore, it is possible to suppress the interruption time of the function inspection process of the electronic component and an increase in the inspection cost.

As described above, the anisotropic conductive film 11
Is that the elastic modulus of at least the region B6 of the insulating regions is
Preferably from 0.01 to 10 GPa, more preferably from 0.1 to 10 GPa.
05 to 5 GPa. As described above, the anisotropic conductive film 11 has a region B having a lower elastic modulus than the regions A4 and A5.
6 is disposed near the center thereof. Further, the region B6 is a region covering the entire region of the film 11 in the second width direction Y. As a result, when the contact pin 25 is subjected to the contact load as described above, the region B6 is easily extended substantially along the first width direction X, while the contact pin 25 is displaced substantially along the first width direction X. It is possible to adopt a configuration that can tolerate the displacement. Therefore, as compared with a configuration in which the region having the elastic modulus does not cover the entire region in the second width direction near the center of the film, the surface of the other end portion 30b of the electronic component side contact portion 30 of the contact pin 25 includes: Abrasion between the film 11 and the back surface of the film 11 that contacts the film 11 can be further suppressed. Thereby, generation of dirt due to abrasion of the back surface of the film 11 can be further suppressed.

As described above, the anisotropic conductive region according to the present invention is formed so that the electrode of the inspection apparatus and the input / output electrode of the electronic component can be electrically connected to each other. It needs to be placed in the contacting part. Conversely, the anisotropic conductive region may be disposed only in a portion of the film that requires electrical connection. That is, it is preferable to dispose an insulating region having more excellent bending workability and flexibility than the anisotropic conductive region in a portion that does not require electrical connection.

As described above, in the anisotropic conductive film of the present invention, the proportion of the anisotropic conductive region can be reduced as much as possible. The anisotropic conductive region is, for example, formed by a winding as described later, and is a portion that costs more than the insulating region. Therefore, the anisotropic conductive film of the present invention can be manufactured at lower cost as compared with the anisotropic conductive film in which the proportion of the anisotropic conductive region occupies a large amount.

In FIG. 5, the anisotropic conductive film 11 shown in FIG. 4 is interposed between the electrode of the inspection device and the input / output electrode of the electronic component. Specifically, the film 1
1 is mounted over the electrode of the inspection device so that the direction in which both end portions 14 and 16 are bent is on the bottom wall 27a side of the second housing portion 27. Here, the length D10 of the anisotropic conductive film 11 in FIG. It is formed to be slightly larger.

By using the anisotropic conductive film 11 that has been bent as described above for the function inspection of the electronic component, the anisotropic conductive region can be easily positioned on the electrode of the inspection device. As a result, as compared with an anisotropically conductive film that has not been bent, the anisotropically conductive region can be more easily and stably mounted on the inspection device without being shifted from the electrode of the electronic component. Accordingly, electrical connection failure is unlikely to occur, and the function test of the electronic component can be stably performed. In addition, the anisotropic conductive film 11 that has been subjected to the bending process as described above can be easily mounted on an inspection device and can be easily removed from the inspection device. Therefore, when dirt accumulates on the film due to repeated use as described above, the film can be replaced more easily than an anisotropic conductive film that has not been bent.

Here, the above-described inspection socket 21 is merely an example of an inspection device. Even if the anisotropic conductive film of the present invention is mounted on an inspection device other than the inspection socket, for example, an inspection substrate, the same applies. The effect of can be obtained. Further, the IC 19 is merely an example of an electronic component, and the anisotropic conductive film of the present invention can be suitably used for a function test of another electronic component.

FIG. 6 is a simplified top view showing another preferred example of the anisotropic conductive film 31 of the present invention. The anisotropic conductive film 31 has cuts 32 in regions B4 and B5.
Except for further having 33, it is the same as the anisotropic conductive film 11 of FIG. 3, and portions having the same configuration are denoted by the same reference numerals and description thereof is omitted. In the anisotropic conductive film of the present invention, in at least one of the insulating regions, a cut may be formed in advance to more easily perform the bending process. In the case shown in FIG. 6, for example, cuts 32 and 33 are formed in regions B4 and B5 arranged at both ends. When a bending process is performed along the cuts 32 and 33, the cuts are formed. Break 32
Is preferably formed over the entire region in the second width direction Y in the region B4, and similarly, the cut 33 is preferably formed over the entire region in the second width direction Y in the region B5.

As shown in FIG. 6, the cuts 32 and 33 may be intermittent linear so-called perforations or continuous linear so-called slits. However, when the cuts 32 and 33 are formed in a slit shape, it is necessary to form the cuts while leaving an appropriate thickness in the thickness direction Z.

FIG. 7 is a simplified view of an anisotropic conductive film 35 of still another preferred embodiment of the present invention. FIG. 7 (a) is a top view, and FIG. 7 (b) is a view showing FIG. 7) is a sectional view taken along line VIIb-VIIb of FIG. The cutting plane line VIIb-VIIb is parallel to the thickness direction Z of the anisotropic conductive film 35 (the direction perpendicular to the paper surface in FIG. 7A) and is a cut in a virtual plane passing through the conduction path 3. It is a surface line. In the anisotropic conductive film of the present invention, at least one of the insulating regions,
A through hole or recess may be formed. The through hole or the recess is used as a reference for aligning the anisotropic conductive region with the electrode of the inspection device and the input / output electrode of the electronic component in the function inspection of the electronic component using the anisotropic conductive film of the present invention. This facilitates the alignment. The anisotropic conductive film 35 has a region B4, B4
5, through-holes 36a, 36 substantially along the thickness direction Z.
Except for having b, 37a, and 37b, the configuration is the same as that of the anisotropic conductive film 11 in FIG. 3, and the portions having the same configuration are denoted by the same reference numerals and description thereof is omitted.

The through holes 36a, 36b, 37a, 37b
Is formed to be a reference for aligning the regions A4 and A5, which are the anisotropic conductive regions, when the anisotropic conductive film of the present invention is used for a function test of an electronic component as described above. . In the embodiment of FIG. 7, the through hole 36a is located in the region B4.
And the through hole 36b is formed on the other side in the second width direction Y. The through hole 37a is formed on one side of the region B5 in the second width direction Y, and the through hole 37b
Are formed on the other side in the second width direction Y. The shape of the through hole, the cross-sectional area perpendicular to the thickness direction Z, the number to be formed, and the position to be formed are used as the reference for positioning the anisotropic conductive region. It can be changed as appropriate depending on the form of the inspection device. Also, instead of the through holes 36a, 36b, 37a, 37b,
A recess that does not penetrate in the thickness direction Z may be formed.

FIG. 8 is a diagram schematically showing an example of use of the anisotropic conductive film 35 of FIG. 7 for a function test of an electronic component. An anisotropic conductive film 1 that has been bent
5 except that an anisotropic conductive film 35 having through holes 36a, 36b, 37a, 37b was used in place of FIG.
This is the same as the embodiment shown in (a), and the portions having the same configuration are denoted by the same reference numerals and description thereof will be omitted. The inspection socket 38 used in the function inspection is a positioning pin 3 that projects substantially vertically from the bottom wall 27a toward the first housing portion 26 in the second housing portion 27.
Except that 9a, 39b, 40a, and 40b are provided, it is the same as the test socket 21 used in FIG.
The positioning pins 39b and 40b are formed on the depth side of the sheet of FIG. 8 with respect to the positioning pins 39a and 40a, respectively, and do not appear in FIG.

The through holes 36a, 36b, 37a, 37
b denotes a positioning pin 39a of the inspection socket 38,
39b, 40a, and 40b are formed at such positions as to be fitted respectively. As described above, even when using an anisotropic conductive film in which a through hole or a recess is formed as a reference for alignment, instead of bending, it can be easily attached to and detached from an inspection device. In the function inspection of the electronic component, the same effect as above can be obtained.

As described above, the anisotropic conductive films 1, 6, and 11 of the above-described embodiments are both used in the second width direction Y so that the anisotropic conductive films 1, 6, and 11 can be used particularly suitably in the function inspection of electronic components. The regions and the insulating regions are alternately arranged in a row without forming a step, and have a configuration in which at least any one of the insulating regions can be easily subjected to the above-described various processes. The anisotropic conductive film belonging to the first group of the present invention has a configuration in which both ends thereof can be easily subjected to the various processes described above. Further, the anisotropic conductive film belonging to the second group of the present invention has a configuration in which the above-mentioned various processes can be easily applied to a region sandwiched between the anisotropic conductive regions.

Therefore, the above-described processing such as bending, forming a cut, and forming a through hole or a recess is performed by the anisotropic conductive films 1 and 2 shown in FIGS. 1 and 2 respectively.
6 can also be suitably applied. In the anisotropic conductive film 1 shown in FIG. 1 belonging to the first group of the present invention, the above-described processing is performed on the regions B1 and B2 arranged at both ends of the film 1 so that the anisotropic conductive region can be inspected by the inspection apparatus. An anisotropic conductive film that can be easily positioned on the electrode can be obtained. Further, in the anisotropic conductive film 6 belonging to the second group of the present invention shown in FIG. 2, for example, in the inspection device having the positioning pins, a through hole or a recess is formed in the region B3 corresponding to the positioning pins. By forming a place, an anisotropic conductive film that can be easily aligned with the inspection device can be obtained. Further, for example, an anisotropic conductive film that can be easily aligned with the inspection device can be obtained by folding the region B3 into a concave shape corresponding to the concave groove in an inspection device having a concave groove for alignment. .

Here, the anisotropic conductive films 1, 6, 11, 31, and 35 of the above-described embodiments have a configuration in which a coating layer is formed between each conductive path 3 and the film substrate 2. There may be. The coating layer is made of an insulating material, and covers the remaining portions of each conductive path 3 excluding both ends exposed on the front and back surfaces of the film substrate 2. By forming such a coating layer on each conductive path 3, the adhesiveness between the film substrate 2 and each conductive path 3, the strength of the obtained anisotropic conductive film,
Heat resistance and dielectric properties are improved. These can be achieved by appropriately selecting the material of the film substrate and the material of the coating layer as described later. The thickness of the coating layer between each conductive path 3 and the film substrate 2 is appropriately selected according to the pitch between the conductive paths of the desired anisotropic conductive film, that is, the number per unit area. When formed, the thickness is preferably 0.5 to 50 μm, more preferably 1 to 20 μm. Also, such a coating layer,
Not limited to one layer, a plurality of layers may be formed.

Next, a preferred method of manufacturing the anisotropic conductive film according to the present invention will be described with reference to an example of manufacturing the anisotropic conductive film 1 shown in FIG. A preferred example of the above manufacturing method is basically a winding coil forming step,
It has four steps: a winding coil block forming step, a composite block forming step, and a film forming step.

In the winding coil forming step, first, at least one coating layer made of an insulating material is formed on a wire made of a conductive material to form an insulated conductor. The coating layer may be any number of layers as needed. When a plurality of coating layers are formed, the outermost layer corresponds to the film substrate in the anisotropic conductive region. In the case of the conductive path 3 in FIG.
Is formed only in one coating layer. As a method for forming the coating layer on the surface of the wire, a conventionally known method is employed, and examples thereof include solvent coating (wet coating) and melt coating (dry coating).

This insulated conductor is wound on a core material to form a roll-shaped winding coil. The shape of the core material is not particularly limited, but a rectangular parallelepiped shape is preferably used. For the winding, a known technique for manufacturing an electromagnetic coil such as a relay or a transformer, for example, a spindle method for rotating a core material, a fryer method for rotating an insulated conductor, or the like may be applied. Examples of the winding method include a general method of winding one insulated conductor around a core material and a method of winding a plurality of insulated conductors around a core material. In addition, the winding wire is turbulent winding that rotates at a high speed with a coarse feed pitch, or closely wound at a relatively low speed rotation with the feed pitch about the outer diameter of the wire, and the wires are stacked densely like a bales stack on the lower wire. And the closest winding. The form of these windings may be freely determined according to the wire diameter, cost, application, etc., but in order to obtain a high quality anisotropic conductive film in which the conductive paths are regularly arranged, the closest winding is required. preferable. The winding width (the total length of the bobbin in the electromagnetic coil and related to the number of turns in one layer), the thickness (related to the number of layers), and the like are appropriately determined according to the size of the desired anisotropic conductive film. You only have to decide.

In the winding coil block forming step, the winding coil is heated and / or pressurized, and the insulated conductors adjacent to each other are fused and / or pressed with the outermost coating layer to integrate them. Thereby, a winding coil block is formed. The heating and / or pressing may be performed on the wound coil that is being formed while winding is performed in the middle of the process, or may be performed on the completed wound coil after the completion of the winding. You may.

In the heating and / or pressurizing, a certain amount of tension is applied to the wound coil during winding, so that only heating or pressurizing simultaneously with heating is preferable. The heating temperature is appropriately selected according to the material of the coating layer, but is usually from the softening temperature of the material to about 300 ° C., specifically, from about 50 to 300 ° C. When pressurizing, preferably 1 to 100 kg / cm ² , more preferably ^{2 to} 100 kg / cm 2
It is about 20 kg / cm ² . In addition, the heating and / or pressurization may be performed under reduced pressure in order to remove air in the gap between the insulated conductive wires.

In the composite block forming step, first, a rectangular parallelepiped wire-containing material block containing no core material is formed by cutting out the wound coil block obtained in the above process. The wire-containing material block is formed such that the wire is linear, and any one of the three perpendicular directions substantially parallel to each side of the rectangular parallelepiped and the axial direction of the wire is substantially parallel. You. The wire-containing material block thus formed and the rectangular parallelepiped resin block made of an insulating material are alternately laminated to form a laminate. In this case, the wire-containing material blocks are stacked such that the axial direction of the wire is substantially parallel to the stacking direction in which the blocks are stacked.

In the formation of the above-mentioned laminate, when the first group of anisotropic conductive films of the present invention is produced, the two outermost layers at both ends of the laminate in the laminating direction are necessarily resin blocks. I do. In the case of producing the second group of anisotropic conductive films of the present invention, lamination is performed so that the two outermost layers at both ends in the laminating direction of the laminate always become wire-containing blocks. The laminate thus formed is heated and pressed. FIG. 9 is a diagram schematically showing this composite block forming step. When the anisotropic conductive film 1 of FIG. 1 is manufactured, the anisotropic conductive film 1 is laminated so that one wire-containing material block 41 is interposed between two resin blocks 42 as shown in FIG. The laminate thus formed is fused with the blocks 41 and 42 adjacent to each other to form an integrated composite block 43 as shown in FIG. 9B.

The heating temperature is appropriately selected according to the material of the resin block.
The temperature is about 0 ° C., specifically, about 50 to 300 ° C. When pressurized, preferably 1 to 100 kg / c
m ² , more preferably about ² to ²⁰ kg / cm ² .
In addition, the heating and / or pressurization may be performed under reduced pressure in order to remove air in the gap between the layers.

In the film forming step, from the composite block, the wire portion is used as a conductive path, the fusion-bonded and / or pressure-bonded coating layer portion is used as a film base in the step, and the wire-containing block portion is anisotropically formed. The anisotropic conductive film of the present invention is formed by using the conductive block as the conductive region and the resin block portion as the insulating region. FIG. 10 is a diagram schematically showing this film forming step. Anisotropic conductive film 1
Is formed by slicing the composite block 43 into, for example, a sheet using a film forming unit 44 described later. The film 1 is formed such that the axial direction of the wire of the wire-containing material block 41 substantially coincides with the thickness direction Z of the film substrate 2 and has a predetermined thickness D3. According to such a production method, an anisotropic conductive film having a thickness D3 of 50 μm or more, which has been difficult to produce, can be easily produced.

Through these steps, the anisotropic conductive film 1 shown in FIG. 1 can be suitably manufactured. That is, the portion of the wire corresponds to the conductive path 3 in the region A1, and the portion of the outermost coating layer that has been fused and / or pressed in the step of the coating layer of the wire corresponds to the film substrate 2. The portion of the wire-containing material block 41 including the above corresponds to the region A1, and the portion of the resin block 42 corresponds to the regions B1 and B2. In such a manufacturing method, not only the anisotropic conductive film 1 of FIG. 1 but also a method of laminating the respective blocks in the step of FIG. 11 can be manufactured. That is, in the case of the anisotropic conductive film 6, it is sufficient to laminate the two wire-containing material blocks 41 so that one resin block 42 is interposed. Further, in the case of the anisotropic conductive film 11, it may be laminated so that one wire-containing material block 41 is interposed between three resin blocks 42. The size and the combination of the lamination of the wire-containing material block 41 and the resin block 42 are not particularly limited, and the required anisotropic conductive region and insulating region of the anisotropic conductive film to be manufactured are not limited. It can be appropriately changed depending on the area and the positional relationship.

Next, another preferred method of manufacturing the anisotropic conductive film according to the present invention will be described with reference to an example of manufacturing the anisotropic conductive film 11 shown in FIG. Another preferable example of the manufacturing method basically has three steps of a winding coil forming step, a composite block forming step, and a film forming step.

The winding coil forming step is the same as the winding coil forming step of the above-described preferred manufacturing method, except that the core used is limited to a rectangular parallelepiped core made of an insulating material. Anisotropic conductive film 11 of FIG.
Since the conductive path 3 has no coating layer between itself and the film substrate 2, only one outermost coating layer corresponding to the film substrate 2 is formed in this case. FIG. 11 is a perspective view schematically showing the winding coil 46 formed by this step. The winding coil 46 is formed by winding an insulated conductor 48 around a core 47 having a rectangular parallelepiped shape. As described above, the core material 47 has a rectangular parallelepiped shape, and is made of an insulating material.

In the composite block forming step, first, the winding coil 46 formed in the above-described step and the resin block 49 made of an insulating material are alternately laminated to form a laminate. At this time, the winding coil 46 is laminated so that the insulated conductor 48 is always interposed between the adjacent resin blocks 49. The laminate thus formed is heated and pressed. FIG. 12 is a diagram schematically showing this composite block forming step. In FIG. 12, FIG.
Since the anisotropic conductive film 11 is manufactured, it is laminated so that one winding coil 46 is interposed between two resin blocks 49. The laminate thus obtained is heated and / or pressurized as described above so that the insulated conductors 48 adjacent to each other are fused and / or crimped by the outermost coating layer, and at the same time, the resin block 49 and the core are bonded. The material 47 is fused and / or crimped through the insulated conducting wire 48 to be integrated to form a composite block 50 including the core material 47.

In the film forming step, from the composite block 50, the wire portion is used as a conductive path, the coating layer portion fused and / or crimped in the step is used as a film substrate, and the insulated conductive wire portion is anisotropically. The anisotropic conductive film of the present invention is formed by using the conductive block as the insulating area and the resin block and the core as the insulating area. FIG. 13 is a diagram schematically showing this film forming step. For forming the anisotropic conductive film 11 from the composite block 50, for example, the same film forming means 44 as shown in FIG. 10 is used. The film 11 is formed such that the axial direction of the wire of the winding coil 46 substantially matches the thickness direction Z of the film substrate 2 and has a predetermined thickness D3. That is, in this manufacturing method, the core material 47 is formed on the film 11.

Through these steps, the anisotropic conductive film 11 of FIG. 3 can be suitably manufactured. That is, the wire portion corresponds to the conductive path 3 in the regions A4 and A5, and the outermost coating layer portion fused and / or pressed in the step of the wire coating layer corresponds to the film substrate 2. , The part of the winding coil 46 including these
4, A5. The portion of the resin block 49 laminated on the winding coil 46 corresponds to the regions B4 and B5, and the portion of the core material 47 corresponds to the region B6. The combination of the size and lamination of the winding coil 46 and the resin block 49 should be appropriately changed according to the area and positional relationship of the required anisotropic conductive region and insulating region of the anisotropic conductive film to be manufactured. Is possible.

According to the above-described manufacturing method of the present invention, it is possible to preferably manufacture an anisotropic conductive film made of different materials and having the same thickness, which are difficult to form in the past, and in which the regions contact each other without forming a step. Can be.

Although the film forming means 44 is shown as a blade in FIGS. 10 and 13, the film forming means 44 is not limited to such an embodiment, and includes all cutting means and cutting tools. In the formation of a film from the composite block, cutting and polishing may be performed as long as only one anisotropic conductive film is obtained from one composite block. Finishing of each surface of the formed anisotropic conductive film is performed as needed.

The processing for forming the above-described cuts in the insulating regions disposed at both ends in the first width direction X of the film of the present invention includes a general processing method such as Thomson blade processing. For example, in the regions B4 and B5 of the anisotropic conductive film 11 in FIG.
Can be suitably manufactured.

Further, regarding the processing for forming a through hole or a recess as a reference for alignment of the anisotropic conductive region in the insulating region arranged at both ends in the first width direction X of the film of the present invention, General methods used for drilling, such as Thomson blade processing, die processing, and drill processing, may be used. Regions B4 and B5 of the anisotropic conductive film 11 in FIG.
Further, for example, by further forming a through hole by the above processing method, the anisotropic conductive film 35 of FIG. 7 can be suitably manufactured.

A conductive material that is preferable as a wire corresponding to the conductive path 3 at the time of film formation is a thin metal wire such as gold, copper, or aluminum, which has a known winding strength such as a copper or aluminum wire. Is preferred. The conductive material may be, for example, a thin metal wire of an alloy such as brass, bronze, or SUS.

As the material of the outermost coating layer of the insulated conductor corresponding to the film substrate 2 at the time of forming the film, a known resin material may be used regardless of a thermosetting resin or a thermoplastic resin as long as it is an insulating material. No. Specifically, thermoplastic polyimide resin, epoxy resin, polyetherimide resin, polyamide resin, silicone resin, phenoxy resin, acrylic resin, polycarbodiimide resin, fluororesin, polyester resin, polyurethane resin, etc. Selected as appropriate. These resins may be used alone or in combination of two or more. Various fillers, plasticizers, or rubber materials may be added to these resins depending on the application. Examples of the filler include SiO ₂ and Al ₂ O _3. Examples of the plasticizer include TCP (tricresyl phosphate) and DOP (dioctyl phthalate). Examples of the rubber material include NBS (acrylonitrile butadiene rubber) and SBS. (Polystyrene-polybutylene-polystyrene).
When one or more coating layers are formed, they are appropriately selected from the above resins and used.

As the material of the resin blocks 42 and 49 corresponding to the insulating region at the time of forming the film and the core material 47 used in another example of the above-mentioned manufacturing method, a material known as an engineering plastic can be used. Specifically, polyamide resin, polycarbonate resin, polyacetal resin, modified polyphenylene oxide resin, polybutylene terephthalate resin, polyimide resin, polyetherimide resin, polyamideimide resin, polyethersulfone resin, polysulfone resin, polyarylate resin, polyarylate resin Oxybenzoyl resin, polyether ether ketone resin, polyphenylene sulfide resin, polyethylene resin, polystyrene resin, polyester resin, polyurethane resin, polyolefin resin, fluorine resin, polypropylene resin, epoxy resin and the like can be mentioned. As the material of the core material 47, a material having an elastic modulus of preferably 0.01 to 10 GPa, more preferably 0.05 to 5 GPa is used among the above-mentioned materials.

As described above, the resin blocks 42 and 49 laminated on the wire material block 41 or the winding coil 46 are used.
Is appropriately selected depending on the width of the insulating region required at the time of film formation. The thickness of the resin block is
Preferably 1 to 30 mm, more preferably 2 to 15 mm
It is. The thickness of the core material 47 is also appropriately selected according to the width of the insulating region sandwiched between the anisotropic conductive regions required for forming the film, but is preferably 1 to 30 mm, more preferably 2 to 15 mm. The above resin block 4
2, 49 and the thickness of the core material 47 refer to a length in a direction corresponding to the first width direction at the time of film formation.

Here, the anisotropic conductive films 1, 6, and 11 of the present invention shown as preferable examples in FIGS. 1 to 3 are preferably manufactured by the above-described respective manufacturing methods. Each anisotropic conductive film 1,
The method for producing 6, 11 is not limited to the above-described production methods, but may be a method produced by a production method other than the above. Further, the anisotropic conductive film of the present invention is not limited to the exemplified structure, and includes various preferable structures according to the mode of the function inspection of the electronic component used without departing from the scope of the present invention.

[0076]

EXAMPLES The present invention will be described in more detail with reference to the following examples, which are merely examples, and the present invention is not limited thereto. (Embodiment 1) In this embodiment, the surface of a copper wire is
An anisotropic conductive film 1 of the embodiment shown in FIG. 1 was formed by forming a coating layer. First, a coating layer having a thickness of 12.5 μm was formed with a polycarbodiimide resin on the surface of a wire having an outer diameter of 30 μm to obtain an insulated conductor having an outer diameter of 55 μm. Polycarbodiimide resin is 40 g of 2,2-dimethyl-
1,3-bis (4-isocyanatophenoxy) propane, 1.14 g of carbodiimidation catalyst 3-methyl-1-phenyl-2-phospholene-1-oxide, and 2.19 g of p-isopropylphenylisocyanate Was polymerized in toluene at 80 ° C. for 2 hours. The average molecular weight of the obtained polycarbodiimide resin was 12,000.

Next, using a winding device, a rectangular parallelepiped aluminum core material having a total length (winding width) of 100 mm and a cross-sectional shape of 50 mm × 10 mm is closest-wrapped, and the wire material is closest-packed. A winding coil having an average number of turns of 1800 turns and a number of turns of 300 (= layer thickness: about 12 mm) was formed.

The obtained wound coil was heated at about 160 ° C. and pressurized at 20 kg / cm ² to fuse the polycarbodiimide resin, and cooled to room temperature. The wound insulated wires were integrated with each other. The obtained winding coil block was obtained.

This wound coil block was cut into a rectangular parallelepiped plate with the cross section perpendicular to the wound wire rod to obtain a cored wire block of 100 mm × 50 mm × 10 mm. The obtained cored wire block was laminated so as to be sandwiched between two resin blocks to obtain a laminate. As the resin block, a 100 mm × 50 mm × 3 mm polyester resin plate (manufactured by Toray DuPont, Hytrel, elastic modulus: 0.09 GPa) was used. About 20
While heating to 0 ° C., pressure is applied at 20 kg / cm ² to fuse the polycarbodiimide resin of the wire-containing block and the polyester resin of the resin block, and then cool to room temperature.
A composite block in which the wire-containing material block and the resin block were integrated was obtained.

The composite block is thinly sliced with the surface perpendicular to the wire wound by the coil wound as a cross section, and the outer diameter is finished. The first width D1 is 15 mm, the second width D2 is 16.5 mm and The anisotropic conductive film 1 of FIG. 1 having a thickness D3 of 0.1 mm was obtained.

(Example 2) In Example 1, the number of winding layers of the insulated conductor was set to 65 (= layer thickness: about 2.5 mm), and two 100 mm × 50 mm × 2 mm plate-like layers were included. Forming a wire block, 100 mm x 50 mm x 6 m as a resin block between two wire rod blocks
m, a polyester resin plate (manufactured by Toray Dupont Co., Ltd., Hytrel, elastic modulus: 0.09 GPa), and a wire-containing material block sandwiched between two 100 mm × 50 mm × 3 mm polyester resin plates to form a composite block. Except for the above, an anisotropic conductive film 11 of FIG. 2 having a first width D1 of 15 mm, a second width D2 of 16.5 mm and a thickness D3 of 0.1 mm was obtained in the same manner as in Example 1.

(Embodiment 3) The core material has a cross section of 50 m.
100 mm x 55 m using a rectangular plate-shaped polysulfone resin plate (elastic modulus: 2.5 GPa) of mx 6 mm
An m × 11 mm winding coil is formed, and the obtained winding block is sandwiched between the two resin blocks by using a 100 mm × 50 mm × 3 mm polysulfone resin plate (elastic modulus: 2.5 GPa) as a resin block. In the same manner as in Example 1 except that the first width D1
Was 15 mm, the second width D2 was 16.5 mm, and the thickness D3 was 0.1 mm to obtain the anisotropic conductive film 11 of FIG.

(Comparative Example 1) The number of winding layers of the insulated conductor was 540
The first width was 15 mm and the second width was 16 mm in the same manner as in Example 1 except that the layer was a layer (= layer thickness: about 21 mm) and the obtained wound coil block was not laminated with a resin block. An anisotropic conductive film having a thickness of 5 mm and a thickness of 0.1 mm was obtained.

(Comparative Example 2) The material of the resin block was a cured epoxy resin (containing 70 W% of filler, elastic modulus: 12 G).
Pa), except that the first width was 1 in the same manner as in Example 2.
5mm, second width is 16.5mm, and thickness is 0.1mm
Was obtained.

(Evaluation 1) Insulating regions respectively arranged at both ends in the first width direction of the anisotropic conductive films 1 and 11 obtained in Examples 1 to 3 and the anisotropic conductivity obtained in Comparative Example 1. At both ends in the first width direction of the film, perforated cuts were formed with a Thomson blade, and bending along the cuts was attempted. The results were as shown in Table 1.

[0086]

[Table 1]

As can be seen from the results, in the anisotropic conductive film of Comparative Example 1 having no insulating regions at both ends in the first width direction of the film, breakage occurs during processing, so that a perforated cut is formed. I couldn't. On the other hand, in the anisotropic conductive films 1 and 11 of Examples 1 to 3 having insulating regions at both ends in the first width direction, perforated cuts can be formed, and the cuts can be easily formed as folds. Was able to be bent. Therefore, the anisotropic conductive films 1 and 11 of the present invention obtained in Examples 1 to 3 are better than the non-inventive anisotropic conductive films obtained in Comparative Example 1 for an inspection device such as an inspection socket. It has been found that mounting and positioning can be easily performed.

(Evaluation 2) Insulating regions respectively arranged at both ends in the first width direction of the anisotropic conductive films obtained in Examples 1 to 3 and the first width direction of the anisotropic conductive film of Comparative Example 1 Drilling was performed at both ends with a mold to form through holes serving as references for alignment. The results were as shown in Table 2.

[0089]

[Table 2]

As can be seen from the results, in the anisotropic conductive film of Comparative Example 1 having no insulating regions at both ends in the first width direction of the film, breakage occurs during processing, so that a through hole may be formed. could not. On the other hand, in the anisotropic conductive films 1 and 11 of the present invention having insulating regions at both ends in the first width direction, a through-hole could be formed so as to be easily aligned. Therefore, the anisotropic conductive films 1 and 11 of the present invention obtained in Examples 1 to 3
It can be seen that can be more easily mounted and positioned on an inspection device such as an inspection socket than the anisotropic conductive film which is not the present invention obtained in Comparative Example 1.

(Evaluation 3) Next, the proportions of the anisotropic conductive regions of the anisotropic conductive films obtained in Examples 1 to 3 and Comparative Example 1 with respect to the entire film are as shown in Table 3. .

[0092]

[Table 3]

The anisotropic conductive films 1 and 11 obtained in Examples 1 to 3, particularly the anisotropic conductive film 11 obtained in Example 2, were the same as the anisotropic conductive films obtained in Comparative Example 1. In comparison, the ratio of the anisotropic conductive region is small, and the manufacturing cost can be reduced accordingly.

(Evaluation 4) Next, each anisotropic conductive film was mounted on a socket for SOP inspection (manufactured by Yamaichi Electric Co., Ltd.), and the durability of repeated inspection was evaluated. In addition, about the anisotropic conductive films 1 and 11 obtained in Examples 1 to 3, bending processing was performed in advance on insulating regions at both ends of the film. Anisotropic conductive films obtained in Comparative Examples 1 and 2,
Since the film was broken when the bending process was performed, the bending process was not performed. The above-mentioned evaluation of the repetition durability is performed by opening and closing the socket in a state where the lead pin of the IC of the SOP package is brought into contact with each film mounted on the inspection socket, pressing the IC to the contact pin and releasing the IC from the contact pin. The contact resistance was increased at the initial stage, after opening and closing 500 times, after opening and closing 1000 times, and stains on the film after opening and closing 1000 times were visually observed. The results were as shown in Table 4.

[0095]

[Table 4]

The anisotropic conductive film 11 obtained in Examples 2 and 3 having an insulating region having the above-mentioned elastic modulus over the whole area in the second width direction near the center in the first width direction X was not contacted in the durability test. The increase in the low resistance was particularly low and was at a practically unimpaired level. On the other hand, in Example 1 and Comparative Examples 1 and 2 which did not have a portion having a low elastic modulus, dirt was generated due to abrasion with the contact pin, and a large increase in resistance was caused by the dirt.

[0097]

As is apparent from the above description, according to the present invention, it is possible to prevent contamination on the electrodes of the inspection apparatus during repeated function inspections, and furthermore, to adjust the position when mounting on the inspection apparatus. And an inexpensive anisotropic conductive film that can be easily prepared, and a preferable method for producing the anisotropic conductive film can be provided.

[Brief description of the drawings]

FIG. 1 is a simplified diagram showing a preferred example of an anisotropic conductive film 1 of the first group of the present invention, and FIG.
1B is a top view, and FIG. 1B is a cross-sectional line Ib-I of FIG.
It is sectional drawing seen from b.

FIG. 2 is a simplified view showing a preferred example of the anisotropic conductive film 6 of the second group of the present invention, and FIG.
2B is a top view, and FIG. 2B is a section line IIb− in FIG.
It is sectional drawing seen from IIb.

FIG. 3 is a simplified view showing another preferred example of the anisotropic conductive film 11 of the first group of the present invention.
3 (a) is a top view, and FIG. 3 (b) is a section line I of FIG. 3 (a).
It is sectional drawing seen from IIb-IIIb.

FIG. 4 is a cross-sectional view showing a state in which regions B4 and B5 of the anisotropic conductive film 11 of the embodiment shown in FIG. 3 are bent.

5 is a diagram schematically showing an example of use of the bent anisotropic conductive film 11 of FIG. 4 for function inspection of an electronic component, and FIG. 5 shows an opened state, and FIG. 5B shows a state in which the inspection socket 21 is closed.

FIG. 6 is a simplified top view showing another preferred example of the anisotropic conductive film 31 of the present invention.

7A and 7B are simplified views of an anisotropic conductive film 35 according to still another preferred embodiment of the present invention. FIG. 7A is a top view, and FIG. 7B is a cutaway view of FIG. 7A. Surface line VIIb-V
It is sectional drawing seen from IIb.

8 is a diagram schematically showing an example of use of the anisotropic conductive film 35 of FIG. 7 for a function test of an electronic component.

FIG. 9 is a view schematically showing a composite block forming step of a preferred example of the method for producing an anisotropic conductive film of the present invention.

FIG. 10 is a view schematically showing a film forming step of a preferred example of the method for producing an anisotropic conductive film of the present invention.

FIG. 11 is a simplified perspective view showing a winding coil 46 formed by a winding coil forming step of another preferred example of the method for producing an anisotropic conductive film of the present invention.

FIG. 12 is a view schematically showing a composite block forming step of another preferred example of the method for producing an anisotropic conductive film of the present invention.

FIG. 13 is a diagram schematically showing a film forming step of another preferred example of the method for producing an anisotropic conductive film of the present invention.

[Explanation of symbols]

1,6,11,31,35 Anisotropic conductive film 2 Film base 3 Conducting path 19 IC 21,38 Inspection socket 25 Contact pin 32,33 Cut 36a, 36b, 37a, 37b Through hole A1, A2, A3 , A4, A5 Anisotropic conductive region B1, B2, B3, B4, B5, B6 Insulating region X First width direction Y Second width direction Z Thickness direction

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01R 43/00 H01R 43/00 H (72) Inventor Fumi Asai 1-1-1, Shimohozumi, Ibaraki-shi, Osaka No. 2 Nitto Denko Corporation F term (reference) 5E024 CA18 CB06 5E051 CA04 5G307 CC04 HA02 HB03 HC01

Claims (14)

[Claims] 1. A plurality of conductive paths made of a conductive material penetrate through an insulating film substrate substantially along the thickness direction of the film substrate, and both end portions are formed on the front and back surfaces of the film substrate. One or more anisotropic conductive regions exposed and arranged insulated from each other, and a plurality of insulating regions having an insulating property and including regions arranged at least at both ends of the film. An anisotropic conductive film, wherein an anisotropic conductive region and an insulating region are alternately arranged in a line without forming a step. 2. A plurality of conductive paths made of a conductive material penetrate through an insulating film substrate substantially along a thickness direction of the film substrate, and both end portions are formed on front and back surfaces of the film substrate. A plurality of anisotropic conductive regions including regions exposed and arranged at least at both ends of the film and insulated from each other; and one or more insulating regions having an insulating property. An anisotropic conductive film, wherein an anisotropic conductive region and an insulating region are alternately arranged in a line without forming a step. 3. The anisotropic conductive film according to claim 1, wherein the film is obtained by a production method having at least the following steps. A winding coil forming step in which at least one or more coating layers made of an insulating material are provided on a wire made of a conductive material to form an insulated conductor, and the insulated conductor is wound in a roll shape around a core to form a wound coil. Heating and / or pressurizing the wound coil while winding in the above-mentioned step or after the above-mentioned step to fuse and / or press-bond the coated layers of the insulated insulated wires to integrate them. A winding coil block forming step of forming a coil block. A rectangular parallelepiped wire-containing material block containing no core material is formed from the wound coil block obtained in the above step, and the wire-containing material block and a rectangular parallelepiped resin block made of an insulating material are alternately laminated and heated. And a step of forming a composite block in which adjacent blocks are fused together under pressure to form an integrated composite block. From the composite block obtained in the above step, the wire portion is used as a conductive path, the coating layer portion fused and / or crimped in the step is used as a film substrate, and the wire-containing block portion is used as an anisotropic conductive material. A film forming step of forming an anisotropic conductive film using the resin block as an insulating region and the resin block as an insulating region. 4. A function inspection of an electronic component for inspecting continuity between an electrode of the inspection device and an input / output electrode of the electronic component using the inspection device. The electrode according to any one of claims 1 to 3, which is used to be interposed between an electrode of the inspection device and an input / output electrode of the electronic component so that a contact portion with the electrode is an anisotropic conductive region. Anisotropic conductive film. 5. The anisotropically conductive film according to claim 4, wherein at least one of the insulating regions is bent in a thickness direction of the film. 6. The anisotropic conductive film according to claim 5, wherein a cut is formed in advance in at least one of the insulating regions, and the cut is formed at the cut. 7. A reference for aligning an anisotropic conductive area of the film with a part of the film which is in contact with an electrode of an inspection device and an input / output electrode of an electronic component, at least one of the insulating areas. The anisotropic conductive film according to claim 4, wherein a through hole or a recess is formed. 8. One region A as said anisotropic conductive region
2. The anisotropic conductive film according to claim 1, wherein the film has two regions B <b> 1 and B <b> 2 as the insulating region. 9. Two regions A as said anisotropic conductive regions
3. The anisotropic conductive film according to claim 2, comprising: A2, A3, and one region B3 as the insulating region. 10. The elastic modulus of the region B3 is 0.01 to 10 G.
The anisotropic conductive film according to claim 9, wherein Pa is Pa. 11. The two regions A4 and A5 as the anisotropic conductive region and the three regions B4 and B4 as the insulating region.
B5 and B6, the region B4 and the region B5 are respectively disposed at both ends of the film, the region A4 and the region A5 are disposed between the regions B4 and B5, and the region B6 is disposed between the regions A4 and A5. The anisotropic conductive film according to claim 1, wherein: 12. At least a region B6 of the insulating region
The anisotropic conductive film according to claim 11, wherein the elastic modulus of the anisotropic conductive film is 0.01 to 10 GPa. 13. A method for producing an anisotropic conductive film, comprising at least the following steps: A winding coil forming step in which at least one or more coating layers made of an insulating material are provided on a wire made of a conductive material to form an insulated conductor, and the insulated conductor is wound in a roll shape around a core to form a wound coil. Heating and / or pressurizing the wound coil while winding in the above-mentioned step or after the above-mentioned step to fuse and / or press-bond the coated layers of the insulated insulated wires to integrate them. A winding coil block forming step of forming a coil block. A rectangular parallelepiped wire-containing material block containing no core material is formed from the wound coil block obtained in the above step, and the wire-containing material block and a rectangular parallelepiped resin block made of an insulating material are alternately laminated and heated. And a step of forming a composite block in which adjacent blocks are fused together under pressure to form an integrated composite block. From the composite block obtained in the above step, the wire portion is used as a conductive path, the coating layer portion fused and / or crimped in the step is used as a film substrate, and the wire-containing block portion is used as an anisotropic conductive material. A film forming step of forming an anisotropic conductive film using the resin block as an insulating region and the resin block as an insulating region. 14. A method for producing an anisotropic conductive film, comprising at least the following steps: At least one coating layer made of an insulating material is provided on a wire made of a conductive material to form an insulated conductor, and the insulated wire is wound around a rectangular parallelepiped core made of an insulative material in a roll shape to form a winding coil. Winding coil forming step. After the above process, the winding coil and the rectangular parallelepiped resin block made of an insulating material are alternately laminated, and the coating layers of the insulated conductive wire wound around the core material by heating and / or pressing are fused and fused. A composite block forming step of forming a composite block by fusing and / or crimping a resin block and a core material made of an insulating material together with a core material made of an insulating material at the same time as crimping. From the composite block obtained in the above step, the wire portion is used as a conductive path, the coating layer portion fused and / or crimped in the step is used as a film substrate, and the insulated conductive wire portion is used as an anisotropic conductive region. And a film forming step of forming an anisotropic conductive film using the resin block portion and the core material portion as insulating regions.