JP2002000883A - Label for package of integrated circuit of game machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a label for the package of an integrated circuit of a game machine capable of easily finding a forged integrated circuit. SOLUTION: This label 70 constituted of a transparent base material is stuck to the surface of the transparent package 51 of a CPU 42 by a transparent adhesive material layer 72 and the manufacturer name and machine kind name of a pachinko machine are printed on the label 70 by a translucent ink layer 74. Thus, the view of an integrated circuit chip 53 and a lead frame 52 inside the CPU 42 is not obstructed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a game machine such as a pachinko machine and, more particularly, to a package label for an integrated circuit of the game machine.

[0002]

2. Description of the Related Art Conventionally, in a pachinko machine, which is a kind of a game machine, a game board is provided on a surface, and a special symbol display portion capable of displaying a plurality of symbols is provided in a game area where a game ball is hit on the game board. Provided, when the game ball has passed the predetermined game ball detection means, the symbol displayed on the special symbol display unit starts to fluctuate, the symbol is confirmed and displayed after a predetermined time, and further, the symbol that has been confirmed and displayed , A predetermined combination of specific symbols, that is, "big hit symbol" (for example,
In the case of "7, 7, 7"), there is known a so-called symbol matching type in which a special gaming state which is advantageous to the player such as a jackpot and a special winning opening repeatedly opened a predetermined number of times occurs. .

In this conventional gaming machine, a control board for performing various controls including the control of the occurrence of the special game state is provided on a rear surface. The control board includes an integrated circuit for performing various controls. A certain CPU (Central Processing Unit) and the CP
R is an integrated circuit storing a program to be executed by U
One provided with an OM (read only memory) is known. In recent years, a package in which the CPU and the ROM are combined into one package is also known. Since the control of the gaming machine is performed according to the program stored in the ROM, the probability of the jackpot or the like occurs at the probability stored in the ROM. Therefore, the game content of the gaming machine is determined by the content stored in the ROM.

[0004]

However, in a conventional gaming machine, the above-mentioned ROM may be replaced with a forged ROM (so-called back ROM) storing an unauthorized program for an illegal game. Also, in the case of a CPU, a CPU
In some cases, it was replaced with a counterfeit CPU containing a small ROM in which an unauthorized program was stored. In the case of a real ROM or a real CPU, a manufacturer name and a product number of a manufacturer of the ROM or the CPU are described on a package which is an exterior of the ROM or the CPU.
A label printed with the name of the gaming machine in which U is used and the name of the manufacturer of the gaming machine are affixed, but in a forged ROM or a forged CPU, since these are also forged exactly like the real thing, from the appearance, It was difficult to determine whether the ROM or CPU was genuine or fake.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has been made in order to make it possible to identify an internal circuit of an integrated circuit provided on a control board for controlling a gaming machine, and to find a counterfeit integrated circuit. It is an object of the present invention to provide a label for a package of an integrated circuit of a gaming machine, which can facilitate the above.

[0006]

According to one aspect of the present invention, a package label for an integrated circuit of a gaming machine according to the present invention is provided on a control board for controlling a main control of the gaming machine. Is a label attached to a transparent integrated circuit, and the label is formed of a transparent base material. Since the package label of the integrated circuit of the gaming machine having this configuration is formed of a transparent base material, the label does not hinder the external view of the structure of the integrated circuit.

According to a second aspect of the present invention, in the package label for an integrated circuit of a gaming machine, in addition to the configuration of the first aspect, the label is made of a base material made of a transparent resin material. It is characterized by being. Since the package label of the integrated circuit of the gaming machine having this configuration is made of a base made of a transparent resin material, the structure of the integrated circuit can be visually recognized from the outside through the base made of the transparent resin material.

According to a third aspect of the present invention, there is provided a package label for an integrated circuit of a gaming machine according to the first or second aspect of the present invention, wherein the label has characters and / or symbols and / or figures. , Printed with translucent ink. In the package label for an integrated circuit of a gaming machine having this configuration, the present invention is applied to a label for a game machine.
In addition to the label function for a package of an integrated circuit of a gaming machine described in 1 above, the letters and / or symbols and / or graphics of the label are printed by translucent ink, so that the letters and / or symbols of the label are printed. And / or graphics do not obstruct the external view of the structure of the integrated circuit.

According to a fourth aspect of the present invention, there is provided a package label for an integrated circuit of a gaming machine according to the first or second aspect of the present invention, wherein the label has characters and / or symbols and / or figures. , Formed by engraving on the label. In the package label for an integrated circuit of a gaming machine having this configuration, in addition to the label action for a package of an integrated circuit for a gaming machine according to claim 1 or 2, the characters and / or symbols and / or graphics of the label are: Since the label is formed by engraving, the characters and / or symbols and / or graphics on the label do not hinder the external structure of the integrated circuit from being visually recognized.

According to a fifth aspect of the present invention, there is provided a package label for an integrated circuit of a gaming machine according to any one of the first to fourth aspects, wherein the label is a transparent adhesive layer. , And attached to the upper surface of the package of the integrated circuit by the adhesive layer. In the label for a package of an integrated circuit of a gaming machine having this configuration, in addition to the function of the label for a package of an integrated circuit of a gaming machine according to any one of claims 1 to 4, the label is also transparent because the adhesive layer is transparent. However, the adhesive layer does not hinder the structure of the integrated circuit from being viewed from the outside.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. First, a mechanical configuration of the pachinko machine 1 will be described with reference to the drawings. FIG. 1 is a front view of the pachinko machine 1. As shown in FIG. 1, a substantially square game board 2 is provided in the upper half of the front of the pachinko machine 1.
The game board 2 is provided with a substantially circular game area 4 surrounded by a guide rail 3. A lower plate of the game board 2 of the pachinko machine 1 is provided with an upper plate 5 for supplying game balls to a launcher (not shown) and receiving a prize ball, and directly below the upper plate 5 receives a prize ball. A lower plate 6 is provided, and a firing handle 7 is provided on the right side of the lower plate 6.

Next, the mechanical structure of the game board 2 is shown in FIG.
This will be described with reference to FIG. FIG. 2 is a front view of the game board 2 of the pachinko machine 1. The game board 2 is provided with a substantially circular game area 4 surrounded by a guide rail 3. At a substantially center of the game area 4, a special symbol display section 8 having a liquid crystal screen is provided. Further, an illuminated windmill 9 is provided at the upper right of the special symbol display section 8, and an illuminated windmill 10 is also provided at the upper left. Further, a normal symbol start gate 11 is provided on the right side of the special symbol display section 8, and an ordinary symbol start gate 12 is provided on the left side.

A special symbol starting electric accessory 15 is provided below the special symbol display section 8, and a special winning opening 16 is provided below the special symbol starting electric accessory 15. I have. Further, below the normal symbol starting gate 11,
A winning opening 19 is provided, and a winning opening 20 is provided below the normal symbol starting gate 12. Further, a stage 2 on which game balls can be temporarily mounted is provided below the special symbol display section 8.
1 is provided substantially perpendicular to the surface of the game board 2, a game ball passage opening 22 is provided on the right shoulder of the special symbol display portion 8, and a game ball passage opening 23 is provided on the left shoulder of the special symbol display portion 8. Is provided. The game balls passing through these game ball passage openings 22 and 23 appear on the stage 21 through the inside (warp zone) of the special symbol display section 8. The game ball appearing on the stage 21 falls toward the special symbol starting electric accessory 15 provided immediately below the stage 21.

Above the special symbol display section 8, a normal symbol display device 24 is provided so that a symbol such as a single digit or a single alphabet can be displayed. Further, each of the left and right sides of the normal symbol display device 24 is
A special symbol starting reservation unit 25 made up of individual LEDs is provided, and the number of so-called reserved balls that have won the special symbol starting electric accessory 15 can be displayed. Further, between the special symbol display section 8 and the ordinary symbol display device 24, there is provided an ordinary symbol start holding section 26 comprising four LEDs, and the ordinary symbol start holding section 26 is provided with an ordinary symbol start gate. It is possible to display the so-called reserved ball number of the game balls that have passed through 11 and 12. In addition, in addition to the above, the game board 2 is provided with various illumination lamps, windmills, a large number of obstacle nails, and the like.

Next, the structure and display screen of the special symbol display section 8 will be described with reference to FIG. FIG. 3 is a front view of the special symbol display unit 8. As shown in FIG. 3, the liquid crystal screen of the special symbol display section 8 usually includes a first stop symbol display section 27.
a, second stop symbol display section 27b, third stop symbol display section 2
The three special symbols 7c can be displayed side by side in the horizontal direction. The special symbol display section 8 includes the first stop symbol display section 27a, the second stop symbol display section 27b, and the third stop symbol display section 27b.
In addition to the display of the stop symbol display section 27c, a moving image, a message, and the like can be displayed.

The symbols displayed on the first stop symbol display portion 27a, the second stop symbol display portion 27b, and the third stop symbol display portion 27c include numerals "0-9" and alphabets "A, B, C, D, E ", and the special symbol starting electric accessory 15 is awarded with a game ball, the first stop symbol display section 27a, the second stop symbol display section 27b, and the third stop symbol display. When the three symbols of the portion 27c are aligned with specific numbers, characters, symbols, or the like (for example, “7” shown in FIG. 3)
Is obtained), a jackpot is determined. The jackpot probability is set to 31/55 as an example, but is not necessarily limited to this value.

Next, the structure of the back of the pachinko machine 1 will be described with reference to FIG. FIG. 4 is a rear view of the pachinko machine 1. As shown in FIG. 4, on the back of the pachinko machine 1, a board box 31 containing a main board 41 constituting a control unit is provided.

Next, the structure of the main board 41 will be described with reference to FIG. FIG. 5 is a plan view of the main base 41. The main board 41 is composed of a substantially rectangular printed circuit board. The main board 41 is provided with a CPU 42 which is a large-scale integrated circuit (LSI) for performing main control of the pachinko machine 1. Inside the CPU 42, a central processing unit, a RAM and a ROM are integrally incorporated. Therefore, the CPU 42 is one, and the central processing unit and the R
It can play the role of AM and ROM.

The ROM inside the CPU 42 stores C
Programs and parameters executed by the PU 42 to control the pachinko machine 1 are stored. CPU42
Controls the pachinko machine 1 by executing the program.

On the main board 41, TTL-I
Many integrated circuits such as C43 are arranged. further,
On the main board 41, a connector 45, an electrolytic capacitor 44 for stabilizing a power supply, and a chip resistor (not shown)
A chip capacitor and the like are also provided.

Next, referring to FIG. 6 to FIG.
2 will be described. FIG. 6 is a plan view showing a state in which marking printing, labels, and the like are not displayed on the upper surface of the CPU. FIG. 7 is a plan view showing a state where marking is printed and a substantially square label is attached to the upper surface of the CPU 42. 8 and 9 are cross-sectional views of the CPU 42.

As shown in FIG. 6, a CPU 42 includes a lead frame 52 provided in a package 51 made of a transparent resin material. In the center of the lead frame 52, a central processing unit, a RAM, and a ROM are provided. An integrated circuit chip 53 configured as a chip is fixed by wire bonding 55. External leads 54 are connected to the lead frame 52.

As a material of the package 51 of the CPU 42, a resin having high transparency such as acrylic, polypropylene, polyethylene, polycarbonate, polystyrene, methacrylic resin, polyimide or the like is used. As shown in FIG. However, the lead frame 52 and the integrated circuit chip 53 can be visually recognized.

Further, as shown in FIG.
On the left side of the upper surface of the package 51, markings such as the manufacturer name 61 and the product number 62 of the CPU 42 are made.
On the right side (upper side in FIG. 7) of the upper surface of the package 51 of the U42, a label 70 indicating a manufacturer name 81 of the pachinko machine 1 and a model name 82 of the pachinko machine 1 in which the CPU 42 is used is affixed. .

Next, the marking of the manufacturer name 61 and the product number 62 of the CPU 42 will be described. As shown in FIG. 7, the manufacturer name 61 and the product number 6 provided on the left portion (the lower side in FIG. 7) of the package 51 of the CPU 42 are provided.
Markings such as 2 are formed by printing with a translucent ink or by performing a marking process by irradiating a laser beam such as an excimer laser from above a masking of a metal plate having a character-shaped hole.

When the manufacturer name 61 and the product number 62 are printed with translucent ink, as shown in FIG.
The semi-transparent ink layer 60 is formed on the surface of the package 51 of 42, and represents the manufacturer name 61 and the product number 62. in this way. By printing the manufacturer name 61 and the product number 62 on the surface of the package 51 of the CPU 42 with the translucent ink layer 60, it does not hinder the visual recognition of the integrated circuit chip 53 and the lead frame 52 inside the CPU 42.

Further, the manufacturer name 61 and the product number 62 are changed to the CPU 4 by a marking process by laser beam irradiation.
In the case of engraving on the surface of the second package 51, a concave portion 63, which is a slight depression, is formed on the surface of the package 51 of the CPU 42 as shown in FIG. become. Note that this marking is not necessarily limited to a laser beam, and the marking of the character may be heated and pressed against the surface of the package 51 of the CPU 42 to perform the marking by heating. in this way. By engraving the manufacturer's name 61 and the product number 62 on the surface of the package 51 of the CPU 42, the engraved portion is also transparent, so that the integrated circuit chip 53 and the lead frame 52 inside the CPU 42 are not obstructed.

Next, referring to FIG.
Will be described. FIG. 10 shows that the label 70 is the CPU 4
FIG. 14 is a cross-sectional view showing a state before being attached to the surface of a second package 51; The label 70 has a translucent ink layer 74 on the surface of a base material 71 made of a film of a resin material such as polyester (polyethylene terephthalate, polyethylene naphthalate), polyvinylidene chloride, polyimide, polyether ketone having high transparency. , A manufacturer name 81 and a model name 82 of the pachinko machine 1 are printed. Further, a transparent adhesive layer 72 is provided on the lower surface of the base 71.
Is provided. As a material of the adhesive layer 72,
An acrylic pressure-sensitive adhesive having very high transparency and good weather resistance and chemical resistance is desirable.

Under the adhesive layer 72, a release paper 7
3 are provided. As the release paper 73, glassine paper, high-quality paper coated with silicon or polyethylene, or polyethylene terephthalate (PET) coated with silicon or polyethylene is preferably used.
When the release paper 73 is peeled off and the label 70 is attached to the surface of the package 51 of the CPU 42, the label 70 is adhered to the CPU 42 by the adhesive layer 72 in a state as shown in FIG.
Is affixed to the surface of the package 51. FIG.
FIG. 4 is a cross-sectional view showing a state in which a label 70 is attached to a surface of a package 51 of a CPU 42. Here, the label 70
The base material 71 and the adhesive material layer 72 are transparent, and the ink layer 7
Reference numeral 4 denotes a translucent ink layer, which does not hinder visual recognition of the integrated circuit chip 53 and the lead frame 52 inside the CPU 42. Note that the translucent ink layer 74 is
1 and the adhesive layer 72. That is, the base material 71
Is printed with mirror letters on the back side of the translucent ink layer 74,
Then, the adhesive layer 72 may be formed.

Next, a modified example of the label 70 will be described with reference to FIGS. FIG. 12 is a cross-sectional view showing a state before a label 90 which is a modification of the label 70 is attached to the surface of the package 51 of the CPU 42. FIG. 13 shows a case where the label 90 is attached to the package 5 of the CPU 42.
FIG. 2 is a cross-sectional view showing a state of being attached to the upper surface of the first embodiment.

The label 90 is made of a highly transparent polyester (polyethylene terephthalate, polyethylene naphthalate), polyvinylidene chloride, polyimide,
A concave portion 94, which is a slight depression, is formed on the surface of a base material 91 made of a film of a resin material such as polyetherketone, and the manufacturer name 81 and model name 8 of the pachinko machine 1 are formed.
2 etc. are engraved. The inscription is formed by a marking process by irradiating a laser beam such as an excimer laser from above the masking of a metal plate having a character-shaped hole. Also, the character mold is heated and the CPU 42
May be pressed against the surface of the package 51 and stamped by heating.

On the lower surface of the base material 91 of the label 90,
A transparent adhesive layer 92 is provided. This adhesive layer 9
As the second material, an acrylic pressure-sensitive adhesive having very high transparency and excellent weather resistance and chemical resistance is desirable.

Further, a release paper 93 is provided below the adhesive layer 92. As the release paper 93, similarly to the release paper 73, glassine paper, high-quality paper coated with silicon or polyethylene, or polyethylene terephthalate (PET) coated with silicon or polyethylene is preferably used. When the release paper 93 is peeled off and the label 90 is attached to the surface of the package 51 of the CPU 42, the label 90 is attached to the surface of the package 51 of the CPU 42 by the adhesive layer 92 in a state as shown in FIG. Here, the base material 91 and the adhesive layer 92 of the label 90 are transparent, and the manufacturer name 81 and the model name 82 of the pachinko machine 1 are concave portions
Since it is engraved as 4, it does not hinder the visual recognition of the integrated circuit chip 53 and the lead frame 52 inside the CPU 42. Note that the concave portion 94 may be provided on the back surface of the base material 91.

As shown in FIG. 7, a label 70 is adhered on the package 51 of the CPU 42 so as not to be directly above the integrated circuit chip 53.
If the manufacturer name 61 or the product number 62 of the CPU 42 is marked while avoiding the position immediately above the IC chip 3, the integrated circuit chip 53 can be visually recognized from outside the package 51.
3 is clearly visible. In this case, the manufacturer name 61 and the product number 62 of the CPU 42 and the manufacturer name 81 and the model name 82 of the pachinko machine 1 are not necessarily translucent ink but are printed with black, white, gray, or other ink. May be.

Next, a modification of the label 70 will be described with reference to FIG.
This will be described with reference to FIG. FIG. 14 is a plan view showing a modification of the label 70. FIG. In the modification shown in FIG.
00 denotes a rectangular package 51 of the CPU 42.
Is attached so as to substantially cover the upper surface of the. This label 1
00 has the same material and structure as the label 70, and the manufacturer name 61 and the product number 62 of the CPU 42 and the manufacturer name 81 and the model name 82 of the pachinko machine 1 are printed with translucent ink. ing. Also, this label 1
00 is the same material and structure as the label 90,
The manufacturer name 61 and the product number 62 of the CPU 42 and the manufacturer name 81 and the model name 82 of the pachinko machine 1 are labeled 100.
May be engraved.

As shown in the label 100, the package 51
The label 100 is made of a transparent resin material and a pressure-sensitive adhesive layer, and the manufacturer name 61 and the product number 62 of the CPU 42, the manufacturer name 81 of the pachinko machine 1, and the like. Since the model name 82 is printed with translucent ink or formed by engraving, the integrated circuit chip 53
When visually recognizing, the integrated circuit chip 53 and the lead frame 52 can be surely visually recognized.

As described above, in the above embodiment, the C provided on the main board 41 of the pachinko machine 1
The package 51 of the PU 42 is made of a transparent resin material, and the CPU marked on the package 51
The manufacturer name 61 and product number 62 of 42 are also printed or stamped with translucent ink, and the manufacturer name 81 and model name 82 of the pachinko machine 1 printed on the label 70 are also printed with translucent ink. In the case of the label 90, the manufacturer name 81 and the model name 82 of the pachinko machine 1 are engraved, so that when the integrated circuit chip 53 and the lead frame 52 are visually recognized from outside the package 51 of the CPU 42, Has an effect that the user can surely recognize the image. Therefore, in the case of the counterfeit CPU 42 storing an unauthorized program, the counterfeit can be easily found because the circuit pattern of the integrated circuit chip, the structure of the lead frame, and the like are different.

In the above-described embodiment, an example is described in which the central processing unit and the RAM and the ROM are integrally incorporated in the CPU 42. However, the present invention is not necessarily limited to the central processing unit. It is needless to say that the present invention is not limited to an integrated RAM and ROM, but can be applied to various integrated circuits. For example, as shown in FIG. 15, a CP in which only a central processing unit is built in a main board 41 is provided.
The present invention can be applied to a configuration in which a U46, a ROM 47 storing programs executed by the CPU 46 and the like, and a RAM 48 temporarily storing various data and flags are separately provided. FIG. 15 is a plan view showing a modification of the main board 41. In this case, the present invention can be applied to the ROM 47 to make it easier to find a forged ROM. Further, when the present invention is applied to the CPU 46 having only the central processing unit, the forged CPU 46 having a small forged ROM built in the CPU and capable of executing an unauthorized program stored in the ROM is provided on the main board 41. , It is possible to easily find a counterfeit CPU.

It goes without saying that the present invention can be variously modified. For example, in the above embodiment, a pachinko machine has been described as an example, but it goes without saying that the present invention can be applied to various game machines such as a pachislot machine and a pachicon machine. In the case of a pachinko machine, it goes without saying that the present invention can be applied to various types of pachinko machines such as a CR machine and a cash machine. Further, in the above-described embodiment, printing of characters and the like uses a normal font using translucent ink.
If the characters are hollow, the integrated circuit chip 53 and the lead frame 52 can be more reliably visually recognized. Also, if the characters are hollow, printing of characters and the like is not translucent ink, but black,
The characters may be white or gray. Also, package 51
Needless to say, the markings on the labels 70, 90, and 100 are not limited to characters, but may be various identification codes such as numbers, symbols, and figures.

[0040]

As described above, the package label of the integrated circuit of the gaming machine according to the first aspect of the present invention is formed of a transparent base material, and the label is used when the structure of the integrated circuit is visually recognized from the outside. Therefore, a counterfeit integrated circuit having a different internal structure can be easily found.

According to the second aspect of the present invention, the package label for an integrated circuit of a game machine is the same as that of the first aspect. Therefore, there is an effect that the label does not hinder the visual recognition of the structure of the integrated circuit from outside through the base made of a transparent resin material.

According to a third aspect of the present invention, in addition to the effects of the first or second aspect of the present invention, the package label of the integrated circuit of the gaming machine further includes a character and / or symbol and / or figure of the label. Since it is printed with the translucent ink, it is effective that the characters and / or symbols and / or figures of the label do not hinder the structure of the integrated circuit from being visually recognized from the outside.

According to a fourth aspect of the present invention, in addition to the effects of the first or second aspect of the present invention, the label for a package of an integrated circuit of a gaming machine further includes characters and / or symbols and / or figures of the label. Since it is formed by engraving on the label, there is an effect that the characters and / or symbols and / or figures of the label do not hinder the external view of the structure of the integrated circuit.

According to a fifth aspect of the present invention, there is provided a package label for an integrated circuit of a game machine, wherein the label has a transparent adhesive layer in addition to the effects of the first aspect. Therefore, there is an effect that the pressure-sensitive adhesive layer does not hinder the structure of the integrated circuit from being visually recognized from the outside.

[Brief description of the drawings]

FIG. 1 is a front view of a pachinko machine according to the present embodiment.

FIG. 2 is a front view of a game board of the pachinko machine of the present embodiment.

FIG. 3 is a front view of a special symbol display unit of the pachinko machine of the embodiment.

FIG. 4 is a rear view of the pachinko machine of the present embodiment.

FIG. 5 is a plan view of a main board 41.

FIG. 6 is a plan view showing a state where markings are not printed or labels are not displayed on the upper surface of the CPU 42;

FIG. 7 is a plan view showing a state in which printing of a marking and a label are attached to an upper surface of a CPU 42;

FIG. 8 is a sectional view of a CPU 42.

FIG. 9 is a sectional view of a CPU 42.

FIG. 10 shows a case where a label 70 is a package 51 of the CPU 42.
FIG. 5 is a cross-sectional view showing a state before being attached to the surface of the hologram.

FIG. 11 shows a case where the label 70 is the package 51 of the CPU 42.
It is sectional drawing which shows the state attached to the surface of.

FIG. 12 shows a modification of the label 70, in which the label 90 is C
It is sectional drawing which shows the state before sticking on the surface of the package 51 of PU42.

FIG. 13 is a cross-sectional view showing a state in which a label 90 is attached to an upper surface of a package 51 of the CPU 42.

FIG. 14 is a plan view showing a label 100 which is a modification of the label 70.

FIG. 15 is a plan view showing a modification of the main board 41.

[Explanation of symbols]

 1 Pachinko machine 41 Main board 42 CPU 46 CPU 47 ROM 48 RAM 51 Package 52 Lead frame 53 Integrated circuit chip 55 Wire bonding 54 External lead 60 Ink layer 61 Manufacturer name 62 Product number 63 Recess 70 Label 71 Base material 72 Adhesive material layer 73 Release paper 74 Ink layer 81 Manufacturer name 82 Model name 90 Label 91 Base material 92 Adhesive layer 93 Release paper 94 Depression 100 Label

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/28 H01L 23/28 H

Claims (5)

[Claims] 1. A label attached to a transparent integrated circuit, wherein a package provided on a control board for controlling a main control of a gaming machine is characterized in that the label is made of a transparent base material. A packaging label for an integrated circuit of a gaming machine. 2. The package label for an integrated circuit of a gaming machine according to claim 1, wherein said label is made of a base material made of a transparent resin material. 3. The character and / or symbol and / or the label of the label
The label according to claim 1 or 2, wherein the graphic is printed with translucent ink. 4. The character and / or symbol and / or the label of the label
The label according to claim 1 or 2, wherein the graphic is formed by engraving the label. 5. The label includes a transparent adhesive layer,
The package label for an integrated circuit of a gaming machine according to any one of claims 1 to 4, wherein the adhesive layer is attached to an upper surface of the package of the integrated circuit.