JP2001519019A - Compact replaceable temperature control module - Google Patents

Abstract

(57) Abstract: A compact and replaceable temperature control module for a semiconductor manufacturing device and a controller for controlling the operating temperature of the inner surface of the process chamber of the device. The temperature control module has a housing (36) sized so that it can be placed close to the semiconductor manufacturing equipment. A circulation system (38) is supported by the housing and is coupled to the semiconductor manufacturing equipment to form a closed loop system that cooperates with the semiconductor manufacturing equipment to regulate the operating temperature of the interior surfaces within the process chamber. It has become. The circulation system includes a thermoelectric heat exchanger (51) having a hollow core element (52) at a temperature different from the unknown temperature and a pump (286) for flowing liquid through the hollow core element.

Description

DETAILED DESCRIPTION OF THE INVENTION Compact replaceable temperature control module The present invention generally relates to a temperature control device, and more particularly to a temperature control device that operates without using a refrigerant. Temperature control modules are used in many types of chambers for processing wafers in the semiconductor manufacturing industry. Some semiconductor manufacturing operations utilize cluster tools having multiple process chambers or modules. These process modules include an etcher (etching device) and a cooler. The chambers of the cluster tool typically operate at different internal temperature conditions, and in some cases, the individual chambers have two inner portions or modules operating at different temperature conditions. Generally, a separate temperature control module is required for each surface or portion of the chamber that operates at different temperature conditions. Most of the currently available temperature control modules have the disadvantage of using undesirable liquids, such as freon and chlorofluorocarbons, and require relatively large compressors. Due to the relatively large size of the compressor, it is necessary to place the temperature control module away from the environment under control of the room or cluster tool. Moving the temperature control module away from the room or cluster tool will result in a larger temperature control module. This is because a relatively large pump is required to move a large amount of liquid over a considerable distance between the chamber and the temperature control module. Further, as can be appreciated, the power requirements of the pump increase with its size. In view of the above, there is a need for a new and improved temperature control module that overcomes these shortcomings. In general, it is an object of the present invention to provide a compact temperature control module for use in a wafer processing chamber of semiconductor manufacturing equipment. It is another object of the present invention to provide a temperature control module of the above type that is small in size so that it can be placed in close proximity to a chamber. Another object of the present invention is to provide a temperature control module of the above type which can be used for a process module of a cluster tool. It is another object of the present invention to provide a temperature control module of the above type that can be located within the footprint of a process module. It is another object of the present invention to provide a temperature control module of the above type for adjusting the temperature of a liquid using thermal electronics. Another object of the present invention is to provide a temperature control module of the above type that can be used to regulate the temperature of a dielectric liquid. Further objects and features of the present invention will become apparent from the following description, which describes in detail preferred embodiments in connection with the accompanying drawings. FIG. 1 is a schematic plan view of a cluster tool with three out of five process modules incorporating the compact replaceable temperature control module of the present invention. FIG. 2 is an isometric view of one of the compact replaceable temperature control modules shown in FIG. FIG. 3 is another isometric view of the compact replaceable temperature control module of FIG. FIG. 4 is a partially cutaway cross-sectional view of the compact replaceable temperature control module of FIG. 2 taken along line 4-4 of FIG. FIG. 5 is a cross-sectional view of the compact replaceable temperature control module of FIG. 2 at line 5-5 of FIG. FIG. 6 is a partial cross-sectional side view of the compact replaceable temperature control module of FIG. 2 taken along line 6-6 of FIG. FIG. 7 is a partial cross-sectional view of the compact replaceable temperature control module of FIG. 2 taken along line 7-7 of FIG. FIG. 8 is a cross-sectional view of the compact replaceable temperature control module of FIG. 2 taken along line 8-8 of FIG. FIG. 9 is a cross-sectional view of the compact replaceable temperature control module of FIG. 2 taken along line 9-9 of FIG. FIG. 10 is a cross-sectional view of the compact replaceable temperature control module of FIG. 2 taken along line 10-10 of FIG. FIG. 11 is a cross-sectional view of the compact replaceable temperature control module of FIG. 2 taken along line 11-11 of FIG. FIG. 12 is an enlarged partial cross-sectional view of a portion of the compact replaceable temperature control module of FIG. 4 in a first position. FIG. 13 is an enlarged partial view similar to FIG. 12, of a portion of the compact replaceable temperature control module of FIG. 4 in a second position. In summary, there is provided a compact, replaceable temperature control module for a semiconductor manufacturing equipment and a controller for controlling the operating temperature of the interior surface of the process chamber of the equipment. Semiconductor manufacturing equipment discharges liquid at an unknown temperature that regulates the operating temperature of the internal surface. The temperature control module has a housing sized so that it can be placed close to semiconductor manufacturing equipment. A liquid carrier is supported by the housing for receiving liquid from the semiconductor manufacturing equipment and returning the liquid to the semiconductor manufacturing equipment, and thus cooperating with the semiconductor manufacturing equipment to regulate the operating temperature of an internal surface within the process chamber. It is adapted to be coupled to semiconductor manufacturing equipment to form a closed loop system. The liquid conveying means includes a thermoelectric means having a hollow core element at a temperature different from the unknown temperature and flowing the liquid into the hollow core element so that the temperature of the liquid is closer to the temperature of the hollow core element. Including means. Detection means for detecting the temperature of the liquid received from the semiconductor manufacturing equipment is provided. The controller adjusts the temperature of the hollow core element in response to the temperature of the liquid detected by the detecting means. More specifically, the compact replaceable temperature controller or module 16 of the present invention is used in controlling the temperature of a chamber 17 for wafer processing during semiconductor manufacturing. Chamber 17 can be used, for example, to perform physical, chemical or other types of deposition on the wafer, or to etch or cool the wafer. A plurality of process modules 18 (only one shown) each having an internal chamber 16 are shown in FIG. 1 as part of a conventional plasma cluster tool 21 located in a class 1-10 clean room 22. Generally, cluster tool 21 has a cassette module 23 for loading wafers into the tool. A plurality, i.e., five as shown, of process modules 18 are disposed about and around a transfer module 24, which moves a wafer, e.g., a wafer 26, around the cassette and the process module. . The process module 18 may be in the form of a conventional plasma etcher or etcher 27, such as, for example, Applied Materials P5000, and more particularly, two etchers 27, a flat finder 29, and a photoresist. It has a stripper 31 and a cooling module or cooler 32. In FIG. 1, the temperature control module 16 is shown attached to each of the first and second etchers 27 and to the cooler 32, so that the temperature of each of these process modules 18 can be separately measured. It can be controlled. The structure and operation of the temperature control module 16 will be described below as needed in connection with one of the etchers 27, but the temperature control module is shown as having a pedestal 33 with a top or chuck surface 34 as shown. Has an internal wall portion of the form. The pedestal 33 has internal passages (not shown) extending therethrough in a serpentine pattern. Any suitable dielectric liquid (hereinafter “dielectric liquid”), such as a Fluorinert dielectric liquid manufactured by 3M Company, flows through the passage in the pedestal 33 and operates the etcher 27. During operation, the operating temperature of the surface 34 is controlled. The dielectric liquid is continuously discharged from the etcher at an unknown temperature during the operation of the cluster tool 21. The temperature control module 16 is shown in more detail in the isometric views of FIGS. 2 and 3, which module has a support structure or housing 36 as shown, which has bolts It is adapted to be attached to the process module 18 by a bracket 37 which is stopped or suitably fixed. The housing 36 has the shape of a parallelepiped having a length of about 13 inches (about 33 cm), a long lateral dimension of about 8 inches (about 20 cm), and a short lateral dimension of about 4 inches (about 10 cm). are doing. First liquid transport means in the form of a first circulation system 38 is supported by the housing 36. The circulation system includes an inlet barbed fitting or fitting 41 and a temperature control module 16 adapted to be coupled to a flexible first or drain tube 42 to receive the dielectric fluid discharged from the process module 18. An outlet barbed fitting or fitting 43 adapted to be coupled to a flexible second or inlet tube 44 for returning the activated dielectric fluid to the process module 18. A compact heat exchanger having a thermoelectric module 51 is provided in the temperature control module 16 to regulate the temperature of the supplied dielectric liquid stream of the module 16 from the process module 18. The thermoelectric module 51 has an elongated hollow core element 52 made of any suitable material, for example, aluminum or oxygen-free copper. As shown in FIGS. 5 and 6, the core element 52 has a first half 52a and a second half 52b and a first or top end piece 52c and a second or bottom end piece 52d. Are all secured to each other by any suitable means, such as brazing. The core element 52 is generally in the form of an elongated parallelepiped having a top end 53 and a bottom end 54. Accordingly, the core element 52 is generally rectangular in cross section as shown in FIG. 5 and includes first and second outer surfaces 56, 57 spaced apart from each other and parallel to each other, these outer surfaces being , Extending in the longitudinal direction of the core element. The core element 52 is about 15 inches long, about 4 inches wide, and about 1.10 inches thick. 5 inches (about 3. 8 cm). At least one As shown in FIG. First and second internal passages or lumens 61 spaced apart from each other; 62 is Extending longitudinally through the center of tubular core element 52 between top end 53 and bottom end 54. A plurality of spaced apart first and second pins 63, 64 is From the first half 52a and the second half 52b of the core element 52, a lumen 61, Extending inward into each of the 62. Pin 63, 64 is It extends longitudinally through the length of the passage. A plurality of seven conventional thermoelectric elements 71; For example, model number 9445 manufactured by International Thermal Electric, Inc. of Shelmsford, Mass. It is longitudinally spaced along each of the first outer surface 56 and the second outer surface 57 to exert a heating or cooling effect on the core element 52 (see FIGS. 4-6). Each thermoelectric element 71 as a whole is A first or inner heat transfer surface 72 and an inner surface 72 that generally conform in shape to the flat outer surface 56 or 57 are heated when cooled by the element 71; The inner surface 72 includes an opposing second or outer heat transfer surface 73 that is cooled when heated by the element 71. Clamping means or assembly 76 for clamping seven thermoelectric elements 71 to first outer surface 56 comprises: As shown in FIGS. 5 and 6, It is provided in the thermoelectric module 51 for clamping seven thermoelectric elements 71 to the first outer surface 56 and for clamping another seven thermoelectric elements 71 to the second outer surface 57. The clamp assembly 76 includes It has a heat transfer member 77 for sandwiching each of the thermoelectric elements 71 against the respective outer surface of the core element 52. Each of the heat transfer members 77 is Any suitable material, For example, made of OHFC copper, Also, each heat transfer member 77 A first or generally flat portion 77a engaging the thermoelectric element 71 and a second or upstanding portion 77b integrally formed with the flat portion 77a and extending outwardly from the flat portion away from the core element 72 It has. The clamp assembly 76 includes A first clamp plate 81 and seven heat transfer members 77 and associated and located therebelow serve to attach the seven heat transfer members 77 and the underlying thermoelectric element 71 to the first outer surface 56. It further includes a second clamp plate 82 that serves to attach the thermoelectric element 71 to the second outer surface 57 (see FIGS. 5 and 6). Elongated clamp plate 81, 82 are respectively A clamp body 83 made of aluminum or any other suitable material; It has a first or inner flat surface 86 and an opposite second or outer flat surface 87 parallel to the inner surface 86. A plurality of seven square openings 91 sized to snugly receive the upright portions 77b of the clamp members 77, They are spaced longitudinally along each of the main bodies 83, which are arranged at substantially equal distances. The portion of the main body 86 that forms the periphery of the opening 91 It overlaps with the flat portion 77a of the heat transfer member 77. The inner surface 86 of each body 83 It has a groove 92 extending around each opening 91 formed therein and opening therein. Any suitable sealable and elastomeric material, For example, an O-ring 93 made of rubber The heat transfer members 77 are held against each other and the clamp plates 81, It serves as a flexible means to allow it to be moved separately with respect to 82. O-ring 93 Surrounding the upright portion 77b of each heat transfer member 77, When the clamp plate is placed around the heat transfer member 77 and the core element 52, it fits within the respective groove 92. O-ring 93 and groove 92 The clamp body 83 does not directly engage the heat transfer member 77, It is dimensioned so that the mounting force of the main body 83 is transmitted to the heat transfer member through the O-ring. The thermoelectric module 51 Any suitable material, First and second flat side plates 96, for example made of aluminum, spaced apart from each other; These side plates 96 Clamp plates 81 spaced from each side of the core element 52, 82 extend between each other. A first crump plate 81, The second clamp plate 82 and the side plate 96 are Are fixed to each other by screws 97 extending through respective bores 98 between an inner surface 86 and an outer surface 87 of each clamp body 83; It is received in a screw bore 101 provided in the side plate 96. in this way, The side plate 96 is The clamp plate 81 of the thermoelectric module 51, 82 is provided in the means for attaching to the core element 52. Clamp plate 81, 82 are respectively Comprising a channel 106; This channel 106 Opening on the outer surface 87 of the clamp body 83, It extends longitudinally along the center of the clamp plate (see FIG. 6). The opening 91 is It extends into the bottom of the channel 106. Are spaced apart from each other, First and second flat elongated cover plates 107 made of aluminum or any other suitable material include: Clamp plate 81, 82 extending across each outer surface 87 of In cooperation with the clamp plate, The first and second clamp members of the thermoelectric module 51 are formed. The cover plate 107 is Any suitable means, For example, through the cover plate, It is fixed to the clamp plate by a screw 108 screwed into the threaded bore 111, The threaded bore 111 It extends through the outer surface 87 of the clamp plate. Clamp plate 81, 82 are respectively Formed on the outer surface 87 around the channel 106, Any suitable material, It has an elongated groove 116 for receiving a sealing strand 117 made of rubber, for example. The first clamp plate 81 and its associated cover plate 107 Serves to form a first longitudinally extending lumen or passage 118 in the core element 52; The second clamp plate 82 and its associated cover plate 107 Helps define a second longitudinally extending lumen or passageway 119 in the core element. The first passage 118 It has a lower bore opening 118a extending longitudinally through the lower end of the clamp plate 81 and an upper bore opening 118b extending longitudinally through the upper end of the clamp plate 81. The second passage 119 is Similarly, It has a lower bore opening 119a extending longitudinally through the lower end of the clamp plate 82 and an upper bore 119b extending longitudinally through the upper end of the clamp plate 82. Passage 118, 199 are each Each of the clamps 83 communicates with an opening 91 in the main body 83. O-ring 93 Separately serves as a fluid tight seal between the clamp plate and the heat transfer member 77, The O-ring 93 extends through the opening 91. The upright portion 77b of each heat transfer member 77 It has generally parallel fins 121 spaced apart from each other and extending longitudinally into passage 118. The first lumen 61 and the second lumen 62 are As shown in FIG. 4, the core elements 52 are connected to each other at the bottom end 54 and the top end 53. The bottom end piece 52d of the core element is: Lumen 61, An internal chamber 122 is provided, which communicates with 62. The longitudinal bore 123 is Extending from the chamber 122 to the bottom end of the end piece 52d, A side bore 124 extends from bore 123 to one side of end piece 52d. The top end piece 52c of the core element is Lumen 61, Each of the 62 has an open interior chamber 126. The longitudinal bore 127 It extends upwardly from the chamber 126 to the top end of the end piece 52c. The thermoelectric module 51 Having a lower elbow-shaped fitting 128; This fixture 128 is Extending through the side plate 96, Any suitable means for communicating with the side bore 124; For example, it has a flange 128a fixed to the bottom end piece 52d by a screw 129. O-ring 131 Supported by the flange 128a, The outer opening of the bore 124 is surrounded by a fluid tight seal between the funnel 128 and the core element 52. The outer fixture 43 is A flange portion 43a fixed to the top of the end piece 52c; Thus, outlet fitting 43 is in fluid communication with upper longitudinal bore 127. O-ring 132 Supported by a top end piece 52c around the opening of bore 127; It engages the flange portion 43a to form a fluid tight seal therebetween. A conventional pressure relief valve 136 is provided, This pressure relief valve 136 It has a flange portion 136a attached to the bottom of end piece 52d around the external opening of longitudinal bore 123. O-ring 137 The lower part is supported by the lower end piece 52d around the bore 123, Engages with flange portion 136a of valve 136 to form a fluid tight seal between valve 136 and end piece 52d. The temperature control module 16 Any suitable liquid, For example, it has a second liquid transport unit in the form of a second circulation system 138 for circulating tap water through the thermoelectric module 51 (see FIGS. 3 and 5 to 9). The circulation system 138 A first passage 118 and a second passage 119; Passage 118, This serves to remove the heating or cooling action from the heat transfer member 77 in communication with 119. Passage 118, 119 is Upper fluid transfer plate member or plate 139; Conventional flow sensor 141, A first tubular joint 142 and a second tubular joint 143, And at the upper end of the thermoelectric module 51 by a tubular hanging member 144. The fluid transfer plate 139 is A first or upper flat surface 146 and an opposite second or lower flat surface 147; First and second clamp plates 81, bolts 148 or any other suitable means. 82 (see FIGS. 7 to 9). Bolts 148 pass through corresponding bores (not shown) provided in plate 139, Clamp plate 81, It is fixed by screwing into corresponding bores (not shown) provided in 82. A first channel 149 and a second channel 151 spaced apart from each other are provided on the upper surface 146. The bore 152 which is in communication with the upper bore opening 118b of the first clamp plate 81 has: It extends through lower surface 147 and into the bottom of one end of first channel 149. Another bore 153 in communication with the upper bore opening 119b of the second clamp plate 82 It extends through the lower surface 147 and into the bottom of one end of the second channel 151. A circular groove, A fluid transfer plate 139 and first and second cramp plates 81, 82 to receive an O-ring 154 that forms a fluid tight seal between 153 are formed on the lower surface 147 around each of them. The fluid transfer plate 139 is The first and second channels 149, Bore 156 extending into the other end of 151 157, and surface 146 to receive outlet fitting 43. 147 through bore 152 It further comprises another bore 158 extending between 153. The first joint 142 As shown in FIG. 9, it has a top end press-fitted or otherwise firmly fitted into bore 157 and a bottom end similarly secured within the inlet opening of flow sensor 141. The annular groove is An O-ring 161 is provided in the upper end of the first joint 142 for receiving. The tubular hanging member 144 comprises It is secured to lower surface 147 by bolts 162 or any other suitable means. Bolt 162 The surface 146 of the first transfer plate 139, Encased in a bore (not shown) extending through 147, It is threaded into a bore (not shown) extending through the top of the depending member 144. The fluid passage 162 Extending through the depending member 144, The upper end communicates with the bore 156 of the plate 139. The member 144 is A circular groove is provided around the upper opening of the passage 162 to receive the O-ring 163. The second joint 143 is It has a first end press-fit or otherwise suitably provided in the outlet opening of the flow sensor 141 and a second end similarly provided in the bottom opening of the fluid passage 162. ing. O-ring 164 Concentrically supported around the second end of the fitting 143 to provide a fluid tight seal between the fitting and the depending member 144. The sealing plate 166 is It is fixed to the upper surface 146 of the fluid transfer plate 139 (see FIGS. 7 and 9). The first and second grooves are Channel 149, Plate 166 around each of the 151 A top surface 146 is provided around each of the first channel 149 and the second channel 151 to receive an O-ring shaped sealing element or strand 167 that forms a fluid tight seal between the 139. The top end cover plate 168 is Any suitable means extending over the sealing plate 166; For example, it is fixed to this by a screw (not shown). Plate 166 168 are respectively A bore is provided for receiving the outlet fitting 43 in an inserted state. An inlet tubular barbed fixture 176 and an outlet tubular barbed fixture 177 include: As shown in FIG. 7, it is provided at the lower end of the thermoelectric module 51. Inlet fitting 176 includes an upper flange portion or flange 176a; This flange The second clamp plate 82 is disposed in contact with the lower end of the The internal passage of the fitting 176 communicates with the lower bore opening 119 a of the clamp plate 82. The flange 176a A circular groove is provided around the periphery for receiving an O-ring 178 forming a fluid tight seal between the fitting 176 and the clamp plate 82. The outlet fitting 177 is Similarly, It has an upper flange 177a with a circular groove for receiving an O-ring 179. The flange 177a The first clamp plate 81 is provided in contact with the bottom end of the first clamp plate 81, A passage in fitting 177 is in fluid communication with lower bore opening 118a of clamp plate 81. The lower plate member or plate 182 is Fixture 176, 177 to the clamp plate 82, Useful for fixing to 81. Pipe to this point, Plate 182 is A first bore 183 is provided for receiving a fixture 176. Bore 183 Opening into the enlarged annular recess 184 provided on the upper surface of the plate 182, In cooperation therewith, the flange 176a is received. Plate 182 further includes There is further provided a second bore 186 for receiving the outlet fitting 177 and a second annular recess 187 sized and shaped to receive a flange 177a of the fitting 177 in cooperation therewith. The lower plate 182 Any suitable means, For example, the cramp plate 81, 82. The lower end plate 188 Any suitable means, For example, it is fixed to the bottom of the plate 182 by screws (not shown). The lower plate 182 and the lower end plate 188 Bore 191, which receives relief valve 136 192 respectively. The cover plate 107 and the side plate 96 Helps form part of the housing 196 for the thermoelectric module 51 (see FIGS. 2-4). The housing 156 It further has a sealing plate 166 and a top end plate 168 located thereon, and a lower plate 182 and a lower end plate 188 located thereunder. The first or primary circulation system 38 FIG. As shown in FIGS. 10 and 11, a reservoir tank 201 supported in the housing 36 is further provided. The tank 201 Any suitable material, For example, made of stainless steel An interior chamber 202 having a top opening 203 and a bottom opening 204 is provided. The integral housing 206 It is formed on the top of the tank 201. The vertical bore 207 It extends upwardly from the top opening 203 through the housing 206. A suitable insulation 208 made of silicone rubber or any other suitable material surrounds the entire tank 201. Any suitable material, For example, a vertically arranged inlet pipe 221 made of stainless steel is The inner chamber 202 extends from the top opening 203 to the bottom. The top end of the inlet pipe 221 is Extending upward through the opening 203, Press fit or otherwise secured in the vertical bore 207 of the housing 206. Entrance barbed fixture 41, Extending downward through a bore 212 provided in the top end cover plate 168 and a bore 218 provided in the sealing plate 166; This attachment 41 is It has a lower end portion 41a that is press-fitted or bored in the bore 207 of the housing 206 or in any other suitable manner. A continuous inlet passage 216 is provided extending downwardly through the inlet fitting 41 and the inlet tube 221. The inlet pipe 211 has a closed lower end, And this inlet pipe, A plurality of circumferentially spaced ports 217 at the bottom thereof; These ports 217 It extends from the inlet passage 216 into the bottom of the internal chamber 202 of the reservoir tank 201. Means in the form of a float assembly 221 for sensing at least two levels of the dielectric liquid in the reservoir tank 201 include: It is provided in the temperature control module 16 (see FIGS. 10 and 11). The float assembly 221 includes: It has a depending tubular element or tube 222 that extends down below the enlarged mounting block 223. The mounting block 223 is Is fitted into a recess 224 formed in cooperation with the top of the reservoir tank 201, Tube 222 is It extends into the interior chamber 202 through a bore 226 provided in the top of the reservoir tank. The mounting block 223 is Any suitable means, For example, it is fixed in the recess 224 by a bolt 227. O-ring 228 The mounting block is disposed in a groove formed around the periphery of the mounting block 223 to form a fluid tight seal between the mounting block and the tank 201 when the mounting block is fitted into the recess 224. A conventional float switch manufactured by, for example, Gems Sensors, is supported by tube 222, This float switch has a float 231 slidably mounted outside the tube 222. The central bore Along the length of the float assembly 221, it extends through the mounting block 223 and the tube 222. A first or upper magnet 233 and a second or lower magnet 234 are provided in bore 232, And as those skilled in the art can understand, In cooperation with float 231, Whether the liquid level in the reservoir tank 201 is near the magnet 233, Alternatively, it is instructed whether or not it is located near the magnet 234. The C-shaped clip 236 Attached to the bottom of tube 222 to limit the downward travel of float 231 attached to tube 222. The manually operated bleed valve 241 The inlet passage 216 is supported by the housing 206 to communicate with the top of the internal chamber 202 in the reservoir tank 201 (FIG. 4, 12 and 13). The bleed valve 241 As shown in FIGS. 12 and 13, a bore 242 extends horizontally to the opening 243 that penetrates the housing 206 and reaches the entrance passage 216. A bore 244 provided in the vertical direction A horizontal bore 243 extends downward through housing 206 and the top of reservoir tank 201 into interior chamber 202. The bleed valve 241 A valve stem 246 slidably supported within the horizontal bore 242; This valve stem 246 There is a first annular groove 247 and a second annular groove 248 spaced apart from each other for accommodating the first O-ring 251 and the second O-ring 252, respectively. Each of these O-rings A valve stem 246, Forming a horizontal bore 242; A fluid-tight seal with the inner surface of the housing 206 is provided. The stem 246 extends outwardly from the horizontal bore 242, A knob 253 is formed at one end. A valve cap 256 with a central bore 257 through which the stem 246 is inserted, Any suitable means, It is secured around the opening of the horizontal bore 242 by, for example, bolts (not shown). The stem 246 is It can move between a first or closed position shown in FIG. 12 and a second or open position shown in FIG. When the valve stem 246 is in its closed or retracted position, The second O-ring 252 is Located between the opening 213 and the vertical bore 244, Liquid flow through opening 213 and bore 244 between inlet passage 241 and interior chamber 202 is restricted. The first O-ring 251 is Liquid is prevented from flowing further through the horizontal bore 242 and past the valve cap 256. When the stem 246 is in its open or extended position, The distal end of the stem and the second O-ring 252 supported thereby are Moving past the vertical bore 244 toward the valve cap 256, Therefore, the liquid flows through the opening 213, It is free to move between the inlet passage 216 and the top of the interior chamber 202 through the horizontal bore 242 and the vertical bore 244. Detection means in the form of a temperature sensor 266 for detecting the temperature of the liquid flowing through the inlet passage 216 comprises: Outer housing 36, In particular, it is supported by the housing 206 (see FIG. 10). The sensor 266 is Any suitable type, For example, a 100Ω platinum resistance thermometer is preferable. The housing 206 A second horizontally extending bore 267 extending into the vertical bore 207; A sensor 266 is screwed into bore 267. The sensor 266 is A tip 268 extends through an opening provided in the inlet tube 271 and into the internal passage 216. The temperature control module 16 Supported by the housing 36, It further comprises means in the form of a filter 271 for removing air from the liquid flowing through the primary circulation system 38 (see FIGS. 4 and 11). The filter 271 is It may be made of any suitable porous material through which the liquid can pass but which promotes the agglomeration of the air contained within the liquid. In one preferred embodiment of the present invention, The filter 271 is It has the shape of a sponge. Any suitable material, For example, a filter housing 272 made of stainless steel It is supported by the reservoir 201. The filter housing 272 is An internal chamber 273 extends through the upper opening of the filter housing. The flange 276 Formed around the upper end of the filter housing 272, This flange 276 Along with bolts 277 that are threaded into corresponding bores provided in the bottom of reservoir tank 201 through this flange, This constitutes means for fixing the filter housing 272 to the reservoir tank 201. O-ring 278 It is arranged in a groove provided on the upper surface of the flange 276, It is engaged with the bottom of the reservoir tank 201 in a sealable manner. The filter housing 272 is When viewed in a plane parallel to the flange 276, the overall shape is a square cross section, The whole is contained in a heat insulator 281 similar to the heat insulator 208. The temperature control module 16 The dielectric liquid in the primary circulation system 38 is passed through the passage 61 of the hollow core element 52, It has means in the form of a pump 286 which flows into 62 so that the temperature of the dielectric liquid is closer to the temperature of the core element. Pump 286 is preferably Electromagnetic coupling pump, Any suitable type, For example, pump model number EG101-0024 / F manufactured by Micropump Corporation of Vancouver, Washington; This is a 30 volt DC pump operating at about a few psi. As shown in FIGS. 4 and 11, Pump 286 Any suitable means, It has an inlet 287 secured to the bottom of the filter housing 272, for example, by bolts 288. The opening 291 is Formed at the bottom of the filter housing 272, The interior chamber 273 of the filter communicates with the pump inlet 287. Pump 286 A fan housing 292 extends downward through the bottom plate 182 and the bottom end plate 188 and is exposed to the exterior of the housing 36. The housing 292 is Having an outer flange 293, This outer flange Supported by plate 182, Thus, pump 286 in housing 36, Filter housing 272, It supports the reservoir tank 201 and the inlet pipe 211. Pump outlet 296 is A pump outlet barbed fitting 297 communicating with the lower fitting 128 of the thermoelectric module 51 via a flexible hose 298; The flexible hose 298 is One end to the pump fixture 297, The other end is press-fitted or otherwise suitably secured to module fixture 128. A circulation system 38 of the temperature control module 16, Tube 42, 44 and the process module 18 whose temperature is monitored by the temperature control module, A closed loop system 299 is constituted. The temperature control module housing 36 It has a jacket 306 formed of U-shaped panels made of aluminum or any other suitable material. Jacket 306, Reservoir tank 201, It extends around the filter housing 272 and the tank 286. Screw 307 Jacket 306, A side plate 96 arranged inside, It is used to secure to the top plate 139 and the bottom plate 182 (see FIG. 4). In addition to the jacket 306, The module housing 36 further comprises Cover plate 107, A side plate 96 provided outside, It can be seen that it consists of a top plate 168 and a bottom plate 188. Means capable of providing a control signal and power to the temperature control module 16 are provided in the temperature control module 16; This means It has a first or communication connector 108 and a second or power connector 309. Electrical conductor 316, 317, 318 is Each of the flow sensors 141, Serves to connect the upper magnet 233 and the lower magnet 234 of the float assembly 221 to the communication connector 308; Conductors 321, 322 is Each serves to connect a temperature sensor 266 and a pump 286 to the communication connector 308. For simplicity, The drawing shows only a part of these conductors. The power connector 309 is Connected to a pump 286, It is connected to a thermoelectric element 71 wired in series in the thermoelectric module 51 by an electric conductor (not shown). Conventional controller and power supply, To adjust the temperature of the core element 52 in response to the temperature of the dielectric fluid detected by the temperature sensor 266, It is used for the temperature control module 16 in the temperature control device of the present invention. A controller 312 including an adjustable power level bi-directional switching power supply comprises: The whole is shown in FIG. The first cable 313 is electrically connected to the communication connector 308 and the second cable 314 is electrically connected to the power connector 309. Above all, The controller 312 Receiving an electrical signal from the temperature sensor 266, Use this information to control the power supply, Thus, the operation of the thermoelectric module 51 is controlled. To explain the function and usage, A point-of-use or point-of-use temperature control module 16 Semiconductor manufacturing equipment by heating or cooling a dielectric liquid or other suitable liquid, For example, it can be used to adjust the internal temperature of the chamber of another process module 18 in an etching apparatus or cluster tool 21. Since the size of the temperature control module 16 and the thermoelectric module 51 provided therein are compact, Module 16 As a result, it can be disposed relatively close to the process module 18 whose temperature is controlled. In FIG. The temperature control module 16 Each of the first and second etchers 27 and the cooler 32 of the cluster tool 21 are attached. However, Temperature control module 16 It should be understood that different arrangements may be made in close proximity to the process module 18 in the passage 21; This is within the scope of the present invention. For example, The temperature control module 16 may be located below the process module 18, Alternatively, it may be supported by another part of the cluster tool 21. Thus, The compact temperature control module 22 It can be supported within the installation area (footprint) of the process module 18 and the cluster tool 21 in the clean room 22. Since the temperature control module 16 is compact, The dielectric liquid can be used to heat or cool the etcher 27 and other process modules 18. The dielectric liquid is A desirable heat transfer liquid. I mean, It has a relatively high low efficiency, Thus, There is relatively little current leakage while flowing through the serpentine passages of the process module. As will be appreciated by those skilled in the art, Leakage of current through a liquid Undesirable in plasma vapor etching machines. I mean, This can adversely affect the RF power operation of the low electrode or electrostatic chuck in the process module, This is because the gas contained therein and the semiconductor manufacturing process are undesirably affected. The dielectric liquid also It is desirable because it does not freeze even at relatively low temperatures. The primary circulation system 38 of the temperature control module 16 in action, Only about 1500 ml of dielectric liquid is required. When the temperature control module 16 is filled with the dielectric liquid, The outlet pipe 42 and the inlet pipe 44 are first connected to the associated process module 18, Close the pressure relief valve 136. Place the dielectric liquid in a separate canister (not shown) Pressurize this canister, Next, it is connected to the relief valve 136. The bleed valve 196 is opened by moving the valve stem 246 to its open position shown in FIG. The canister containing the pressurized dielectric liquid is opened to allow liquid to flow through the pressure relief valve 136 and into the circulation system 38. The dielectric liquid is Flows upward through the first internal passage 61 and the second internal passage 62 of the thermoelectric module 51, And through the lower fixture 128 of the core element 52 to the pump 286, Flows upward through filter housing 272, It flows into the interior chamber 202 of the reservoir tank 201. The dielectric liquid is Flows through port 191 at the bottom of the inlet tube 178, It flows upward through the inlet passage 176. With the bleed valve 196 in the open state, Air in the reservoir tank 201 escapes through the vertical bore 201 and the horizontal bore 242 into the inlet passage 216. 1500 ml of dielectric liquid Fill the temperature control module 16, Thus, most (if not all) of the air in the primary circuit 38 44 and into the process module 18. After completing this key step, Closing the bleed valve 196 and the pressure relief valve 136, Disconnect the canister from bleed valve 136. Temperature control module 16 Activate pump 286, This allows about 2 gallons of dielectric liquid per minute (about 3. (8 liters) and circulate through closed loop system 253 to bring it into operation. During the start-up procedure, the sponge filter 271 blocks the flow of air through the closed loop system 253 and helps the air to condense and rise through the port 191 to the top of the reservoir tank interior chamber 202. Once the reservoir tank 201 has been filled with the dielectric fluid as described above, the float switch 192 has moved along the tube 222 to a position adjacent to the upper magnet 233 to ensure that the temperature control module 16 has been properly filled with the dielectric fluid. To the controller 312 by a signal. Once the air in the closed loop system 253 is discharged to the reservoir tank 201, the temperature of the dielectric liquid in the closed loop system 253 can be monitored using the temperature sensor 266, and whether the operating temperature is higher than a desired set temperature. Or, it can be instructed to the controller 312 whether it is low. The illustrated embodiment of the temperature controller of the present invention can be used to maintain a set temperature in the range of 10C to 70C during manufacturing. During operation of the temperature control module 16, the controller 312 activates the thermoelectric module 51, which heats or cools the dielectric liquid received by the inlet fitting 41 of the temperature control module to the temperature of the received liquid. Is approximately equal to the set temperature. As will be appreciated by those skilled in the art of thermal electronics, the direction and amount of current supplied to the thermoelectric element 71 can be adjusted so that its inner heat transfer surface 72 serves as either a heat source or a heat sink. For example, if it is desired to heat the dielectric liquid by the thermoelectric module 51, the controller 312 supplies power to the thermoelectric element 71 so that the inner heat transfer surface 72 heats the core element 52, and thus the interior of the core element. The dielectric liquid flowing through the passages 61 and 62 is heated. The fins 63, 64 enlarge the entire inner surface of the passage, thus increasing the heat transfer efficiency between the thermoelectric module 51 and the dielectric flowing therethrough. Conversely, if cooling of the dielectric liquid is required, the power to thermoelectric element 71 is reversed so that inner heat transfer surface 72 cools core element 52. If the level of the dielectric liquid in the reservoir tank 201 drops during operation to the level of the lower magnet 234, the float assembly 221 sends a signal to the signal controller 312, which stops operation of the temperature control module 16 or otherwise. Take appropriate action. A suitable secondary liquid, for example tap water, is pumped into the second circulation system 138 to remove the cooling action when the thermoelectric module 51 is in the heating mode and exclude the heating action when the module 51 is in the cooling mode. . Tap water enters the thermoelectric module 51 through the inlet fitting 176 and flows up one side of the module 51 through the passage 119 and then through the channel 151 of the fluid transfer plate 139 to the location of the flow sensor 141. Flows halfway to Next, tap water returns through channel 149 of plate 139, down the other side of module 51 via passage 118, and then drains through outlet fitting 177. The heat transfer member 77 gives a cooling action or a heating action from the outer heat transfer surface 73 of the thermoelectric element 71 to water in the secondary circulation system 138. In particular, the cooling or heating action is picked up by the flat portions 77a of each heat transfer member 77 and transferred to the secondary liquid by fins 121 spaced apart from each other on the upright portion 77b of the heat transfer member 77. You. The controller 312 can confirm whether the secondary circulation system 138 is operable based on the signal received from the flow sensor 141. The controller is programmed to stop operation of the temperature control module 16 and the cluster tool 21 if the desired flow of water through the circulation system 138 stops. The novel clamp assembly 76 of the present invention facilitates substantially complete engagement between the inner heat transfer surface 72 of each thermoelectric element 71 and the outer surface 56 or 57 of the core element 52 during operation of the thermoelectric module 51. As will be appreciated by those skilled in the art, the core element 52 expands and contracts, and thus slightly bends, during operation, as the heating or cooling action is exerted on the core element by the thermoelectric element 71 and the dielectric fluid flowing through the module 51. Or it tends to be twisted. This movement of the core element may create undesirable hot spots on the thermoelectric element in contact with the core element. The clamp assembly 76 allows each of the heat transfer members 77, and thus the thermoelectric elements 71 attached to the core element 52 by the heat transfer member, to move independently of each other, thus allowing these changes in the shape of the core element 52 to occur. Can adapt. In particular, the O-ring 93 allows the heat transfer member 77 to respond to the forces exerted by the core element 52 on the thermoelectric element 71 located therearound, about various vertical axes lying in the plane of the flat portion 77a. Can rotate slightly in response. Due to the non-rigid connection between the clamp plates 81 and 82 and the heat transfer member 77 as a whole, the thermoelectric element 71 adapts in the x, y and z directions according to the change in shape of the core element, and thus the thermoelectric And the substantially complete engagement between the outer heat transfer surface 73 of the thermoelectric element and the flat portion 77a of the heat transfer member while maintaining substantially complete engagement between the inner heat transfer surface 72 and the outer surfaces 56, 57 of the core element. Can be maintained. In this way, surface contact and heat transfer between the core element 52 and the thermoelectric element 71 is optimized, and high operating efficiency is maintained despite thermal expansion or contraction of the core element 52. The temperature control module 16 allows the inner surface of the process module 18, for example, the upper surface 34 of the chuck in the etcher 27, to be relatively quickly brought to the desired temperature. As described above, since the size of the temperature control module 16 is relatively compact, it can be arranged close to the process module 18. This proximity reduces the distance that the dielectric liquid must travel between control module 16 and process module 18, thus reducing the amount of dielectric liquid required in closed loop heating or cooling system 253. I do. Since the temperature control module 16 requires only about 1500 ml of dielectric liquid, the temperature of this small amount of liquid, and thus the temperature of the surface 34 which is controlled thereby, can be adjusted quickly. Having the temperature control module 16 relatively close to the associated process module 18 also helps to reduce the power requirements of the temperature control module 16. In the illustrated embodiment, the power requirement of the pump 286 is only 100W. The thermoelectric module 51 has the following features under the maximum operating condition: Only 6 kW of power is required. The modules 16 are each about four feet (about 1....) From the associated process module 18 as shown. Preferably, the pump 286 and other components within the control module 16 are operated within these design tolerances at a distance of 2 m) or less. Another advantage of the temperature control module 16 is that it allows for a more accurate measurement of the temperature of the conditioned interior surface 34 within the process module 18. As described above, the temperature sensor 266 measures the temperature of the dielectric liquid immediately after the dielectric liquid flows into the temperature control module 16. Therefore, the change in the temperature of the surface 34 and the corresponding change in the temperature of the dielectric liquid adjusting surface 34 can be quickly and accurately picked up by the temperature sensor 266. These temperature readings are more accurate than those obtained by simply monitoring the temperature of the dielectric liquid in the reservoir tank 201. This is because the temperature of the dielectric liquid in the tank 201 is not always equal to the temperature of the dielectric liquid flowing into the tank at any given time. The temperature control module 16 and the controller 312 work together to create a dynamic system that can maintain the temperature of the inner surface 34 at a relatively constant value. The fact that the temperature control module 16 is relatively close to the process module 18; the amount of dielectric liquid used in the control module 16 is relatively small; the temperature of the surface 34 in the module 18 is accurately controlled by the control module 16; And the incorporation of a bi-directional switching power supply controller 312 that is on, off, or somewhere in between, allows for the construction of such dynamic systems. Unlike conventional static systems where the rate of change of the temperature of the surface 34 or the controlled object is greater than the system can handle, the dynamic system of the present invention provides It can respond quickly and thus keep the temperature on surface 34 constant. This ability to maintain a relatively constant surface temperature is advantageous in semiconductor manufacturing where it is highly desirable that the repeatability and predictability of operation be very high. Since the temperature at which the temperature of the internal surface 34 can be changed relatively easily and the temperature at which the temperature of the internal surface 34 can be changed is high, the cleaning of the etcher 27 is easy. As will be appreciated by those skilled in the art, periodic and frequent cleaning of a process module increases the efficiency of the process module and extends its life. In such a cleaning procedure, the internal chamber of the process module may be raised to a temperature of about 70 ° C. With the temperature control device of the present invention, the operator can heat the dielectric liquid and thus the interior chamber of the process module relatively quickly compared to currently available heating and cooling devices. Since preventive maintenance cycles are performed at the expense of duty cycle, it is highly desirable to minimize the duration of such maintenance cycles. If maintenance is required on the process module 18 regulated by the temperature controller 16, simply pulling the knob 211 to move the bleed valve 196 to its open position allows the dielectric liquid to be easily drained from the process module. As described above, the dielectric liquid can now freely flow from the upper portion of the inlet passage 216 through the bores 242, 201 and into the reservoir tank 210. In this way, the dielectric liquid in the process module 18 can flow into the reservoir tank under the action of gravity to allow for disassembly or maintenance of the process module. The temperature control module or the temperature control device of the present invention has been illustrated and described as a means for adjusting the temperature of only one process module of the cluster tool used in the semiconductor manufacturing process. It should be understood that such temperature control devices are within the scope of the present invention. It should also be understood that the temperature control devices described above can be used in a wide variety of semiconductor manufacturing equipment, such as tungsten or other etching equipment and chemical vapor deposition, vacuum sputtering or other physical vapor deposition equipment. In view of the above, it can be seen that a new and improved compact temperature control module for use in a wafer processing chamber of a semiconductor manufacturing apparatus has been provided. The temperature control module can be used for a liquid that regulates the operating temperature of the inner surface of the interior chamber. Since the temperature control module is small, it can be placed close to the internal chamber. This temperature control module can be used for the process module of the cluster tool, and in particular within the footprint of the process module. Thermal electronics are utilized in the temperature control module to regulate the temperature of the liquid, which liquid may be in the form of a dielectric liquid.

Claims (1)

[Claims] 1. Semiconductor manufacturing equipment and a core for controlling the operating temperature of the inner surface of the process chamber of the equipment.   A compact replaceable temperature control module for a controller,   The vessel discharges liquid at an unknown temperature that regulates the operating temperature of the internal surface,   The control module has a housing sized to fit closely to the   Supported by the jing and coupled to the device,   Receiving liquid from an instrument and returning the liquid to the instrument, thus cooperating with the instrument;   A liquid that forms a closed loop system that works to regulate the operating temperature of the inner surface of the process chamber   Body transporting means, wherein the liquid transporting means is in a temperature state different from the unknown temperature.   Thermoelectric means with a hollow core element and the liquid into the hollow core element of the thermoelectric means   Means for flowing so that the temperature of the liquid is closer to the temperature of the hollow core element.   The temperature control module further detects the temperature of the liquid received from the device.   A detecting means for detecting the temperature of the liquid detected by the detecting means.   Adjusting the temperature of the hollow core element in response to the module. 2. Supported by the housing to attach the housing to the device.   The module of claim 1 further comprising: 3. Thermoelectric means are included in the means for controlling the operating temperature of the inner surface with about 1500 ml of liquid.   The module of claim 1, wherein the module is provided. 4. The means for flowing liquid into the hollow core element comprises a pump.   The module of claim 1. 5. 5. The module according to claim 4, wherein the pump is an electromagnetic coupling type pump.   Rules. 6. It is supported above the pump by the housing, allowing the liquid in the closed loop system to   5. The module according to claim 4, further comprising means for removing air.   . 7. The means for removing air comprises a porous filter.   Item 6. The module according to Item 6. 8. The liquid carrying means is supported by the housing above the air removing means.   A reservoir tank for collecting air in the closed loop system.   Item 6. The module according to Item 6. 9. Further has a bleed valve supported above the reservoir tank by the housing   9. The module according to claim 8, wherein the module is used. Ten. The hollow core element has a passage extending longitudinally therethrough and a length along the passage.   It has an outer surface extending in the hand direction to provide heating or cooling to the hollow core element.   A plurality of thermoelectric elements spaced apart from each other longitudinally along the outer surface.   Each thermoelectric element has a heat transfer surface whose shape substantially matches the outer surface of the hollow core element.   Means are provided for clamping a plurality of thermoelectric elements to the outer surface of the hollow core element.   The module of claim 1, wherein the step includes at least one heat transfer member.   Wool. 11． The outer surface and the thermoelectric element are each generally flat,   The at least one heat transfer member engages the thermoelectric element and connects the thermoelectric element to an outer surface of the hollow core element.   11. The device of claim 10 having a generally flat portion that presses against the surface.   The described module. 12． The at least one heat transfer member is coupled with the entire body away from the hollow core element.   And having an upstanding portion extending outwardly from the flat portion, wherein the clamping means comprises   At least one opening for receiving an upright portion of the at least one heat transfer member;   Provided with an elongated clamp member and a hand for attaching the clamp member to a hollow core element   The module of claim 11, comprising a step. 13. The clamping member extends longitudinally therethrough and the at least one   Communicating with the two openings to exchange heat with the thermoelectric element for heating or cooling   13. The moji according to claim 12, further comprising a passage for carrying the secondary liquid.   Wool. 14. The upright portion of the at least one heat transfer member is connected to a plurality of mutually flowing secondary liquids.   14. The method of claim 13 including spaced longitudinally extending fins.   On the module. 15． The hollow core element has another exterior surface extending longitudinally along the hollow core element and the   Extends longitudinally between said outer surface and said another outer surface, wherein a plurality of other thermoelectric elements   The other thermoelectric element is provided longitudinally spaced along the another outer surface,   Is   Each having a heat transfer surface substantially identical in shape to the other outer surface of the hollow core element,   Means are provided for clamping said another thermoelectric element to said another outer surface of the hollow core element   Wherein said means includes at least one additional heat transfer member.   Item 11. The module according to Item 10. 16． The module of claim 1 in combination with a controller. 17． The half temperature controlling operating temperature of the internal surface in the process module of the cluster tool   An apparatus for producing conductors, wherein the process module regulates the operating temperature of the inner surface.   Draining liquid of unknown temperature, said device has a compact replaceable temperature   Having a control module, the temperature control module is attached to the cluster tool   Housing and a housing supported by the housing for processing.   And can accept liquid from the process module   Return the liquid to the process module, thus cooperating with the process module   Construct a closed loop system that regulates the operating temperature of the internal surface in the process module   A liquid transport means, the liquid transport means having an inlet fitting and a refill in series connection.   A reservoir tank, a pump, thermoelectric means and an outlet fitting, wherein the thermoelectric means   A hollow core element at a temperature different from a known temperature, and a pump heats the liquid.   Flowing into the hollow core element of the electrical means so that the temperature of the liquid is closer to the temperature of the hollow core element;   And the temperature control module is further supported by a housing.   A sensor for detecting the temperature of the liquid received from the device,   The device is electrically coupled to the sensor and controls the temperature of the liquid detected by the detecting means.   A controller for adjusting the temperature of the hollow core element in response to the temperature.   The temperature control module and the controller are configured to control the liquid   Apparatus characterized in that it is included in the means for controlling the operating temperature of the inner surface in the body   . 18． The liquid conveying means is provided between the inlet fitting and the reservoir tank,   It further includes a bleed valve to facilitate maintenance on the process module.   18. The device according to claim 17, wherein the device comprises: