JP2001516942A5 - - Google Patents

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Publication number
JP2001516942A5
JP2001516942A5 JP2000512225A JP2000512225A JP2001516942A5 JP 2001516942 A5 JP2001516942 A5 JP 2001516942A5 JP 2000512225 A JP2000512225 A JP 2000512225A JP 2000512225 A JP2000512225 A JP 2000512225A JP 2001516942 A5 JP2001516942 A5 JP 2001516942A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000512225A
Other versions
JP2001516942A (ja
JP4255616B2 (ja
Filing date
Publication date
Priority claimed from US08/932,318 external-priority patent/US5894188A/en
Application filed filed Critical
Publication of JP2001516942A publication Critical patent/JP2001516942A/ja
Publication of JP2001516942A5 publication Critical patent/JP2001516942A5/ja
Application granted granted Critical
Publication of JP4255616B2 publication Critical patent/JP4255616B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000512225A 1997-09-17 1998-09-10 電界放出表示装置及びその製造方法 Expired - Fee Related JP4255616B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/932,318 1997-09-17
US08/932,318 US5894188A (en) 1997-09-17 1997-09-17 Dual-layer metal for flat panel display
PCT/US1998/018786 WO1999014780A1 (en) 1997-09-17 1998-09-10 Dual-layer metal for flat panel display

Publications (3)

Publication Number Publication Date
JP2001516942A JP2001516942A (ja) 2001-10-02
JP2001516942A5 true JP2001516942A5 (ja) 2006-01-05
JP4255616B2 JP4255616B2 (ja) 2009-04-15

Family

ID=25462137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000512225A Expired - Fee Related JP4255616B2 (ja) 1997-09-17 1998-09-10 電界放出表示装置及びその製造方法

Country Status (6)

Country Link
US (3) US5894188A (ja)
EP (1) EP1016113B1 (ja)
JP (1) JP4255616B2 (ja)
KR (1) KR20010023850A (ja)
DE (1) DE69839124T2 (ja)
WO (1) WO1999014780A1 (ja)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5894188A (en) * 1997-09-17 1999-04-13 Candescent Technologies Corporation Dual-layer metal for flat panel display
US6433473B1 (en) * 1998-10-29 2002-08-13 Candescent Intellectual Property Services, Inc. Row electrode anodization
US6822386B2 (en) * 1999-03-01 2004-11-23 Micron Technology, Inc. Field emitter display assembly having resistor layer
US6462467B1 (en) * 1999-08-11 2002-10-08 Sony Corporation Method for depositing a resistive material in a field emission cathode
US7052350B1 (en) * 1999-08-26 2006-05-30 Micron Technology, Inc. Field emission device having insulated column lines and method manufacture
US6635983B1 (en) * 1999-09-02 2003-10-21 Micron Technology, Inc. Nitrogen and phosphorus doped amorphous silicon as resistor for field emission device baseplate
US6710525B1 (en) * 1999-10-19 2004-03-23 Candescent Technologies Corporation Electrode structure and method for forming electrode structure for a flat panel display
US20020184970A1 (en) * 2001-12-13 2002-12-12 Wickersham Charles E. Sptutter targets and methods of manufacturing same to reduce particulate emission during sputtering
US6739196B2 (en) 2000-05-11 2004-05-25 Tosoh Smd, Inc. Cleanliness evaluation in sputter targets using phase
US6407516B1 (en) 2000-05-26 2002-06-18 Exaconnect Inc. Free space electron switch
US6800877B2 (en) * 2000-05-26 2004-10-05 Exaconnect Corp. Semi-conductor interconnect using free space electron switch
US6801002B2 (en) * 2000-05-26 2004-10-05 Exaconnect Corp. Use of a free space electron switch in a telecommunications network
US6545425B2 (en) 2000-05-26 2003-04-08 Exaconnect Corp. Use of a free space electron switch in a telecommunications network
US7064500B2 (en) * 2000-05-26 2006-06-20 Exaconnect Corp. Semi-conductor interconnect using free space electron switch
AU2001266684A1 (en) * 2000-05-31 2001-12-11 Candescent Technologies Corporation Multilayer electrode structure and method for forming
US6620012B1 (en) * 2000-10-27 2003-09-16 Science Applications International Corporation Method for testing a light-emitting panel and the components therein
US6796867B2 (en) * 2000-10-27 2004-09-28 Science Applications International Corporation Use of printing and other technology for micro-component placement
US6762566B1 (en) 2000-10-27 2004-07-13 Science Applications International Corporation Micro-component for use in a light-emitting panel
US6935913B2 (en) * 2000-10-27 2005-08-30 Science Applications International Corporation Method for on-line testing of a light emitting panel
US6801001B2 (en) * 2000-10-27 2004-10-05 Science Applications International Corporation Method and apparatus for addressing micro-components in a plasma display panel
US6822626B2 (en) 2000-10-27 2004-11-23 Science Applications International Corporation Design, fabrication, testing, and conditioning of micro-components for use in a light-emitting panel
US6612889B1 (en) * 2000-10-27 2003-09-02 Science Applications International Corporation Method for making a light-emitting panel
US7288014B1 (en) 2000-10-27 2007-10-30 Science Applications International Corporation Design, fabrication, testing, and conditioning of micro-components for use in a light-emitting panel
US6545422B1 (en) * 2000-10-27 2003-04-08 Science Applications International Corporation Socket for use with a micro-component in a light-emitting panel
US6570335B1 (en) * 2000-10-27 2003-05-27 Science Applications International Corporation Method and system for energizing a micro-component in a light-emitting panel
US6764367B2 (en) * 2000-10-27 2004-07-20 Science Applications International Corporation Liquid manufacturing processes for panel layer fabrication
JP4303970B2 (ja) * 2001-04-04 2009-07-29 トーソー エスエムディー，インク． アルミニウムスパッタリングターゲットまたはアルミニウム合金スパッタリングターゲット中の酸化アルミニウム介在物の臨界寸法を決定する方法
US6632117B1 (en) * 2001-06-26 2003-10-14 Candescent Intellectual Property Services, Inc. Frit protection in sealing process for flat panel displays
US6565400B1 (en) * 2001-06-26 2003-05-20 Candescent Technologies Corporation Frit protection in sealing process for flat panel displays
JP4349904B2 (ja) * 2001-08-09 2009-10-21 トーソー エスエムディー，インク． 寸法と位置によって分類された欠陥の種類による、非破壊的なターゲット清浄度特性決定のための方法と装置
US6406926B1 (en) * 2001-08-15 2002-06-18 Motorola, Inc. Method of forming a vacuum micro-electronic device
US7064475B2 (en) * 2002-12-26 2006-06-20 Canon Kabushiki Kaisha Electron source structure covered with resistance film
US20050189164A1 (en) * 2004-02-26 2005-09-01 Chang Chi L. Speaker enclosure having outer flared tube
EP3804158B1 (en) 2018-06-01 2024-02-07 Telefonaktiebolaget LM Ericsson (publ) Approaches for beam selection
US11122571B2 (en) 2018-11-30 2021-09-14 Telefonaktiebolaget Lm Ericsson (Publ) Approaches for beam selection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144191A (en) * 1991-06-12 1992-09-01 Mcnc Horizontal microelectronic field emission devices
JPH08507643A (ja) * 1993-03-11 1996-08-13 フェド．コーポレイション エミッタ先端構造体及び該エミッタ先端構造体を備える電界放出装置並びにその製造方法
US5601466A (en) * 1995-04-19 1997-02-11 Texas Instruments Incorporated Method for fabricating field emission device metallization
AU6273396A (en) * 1995-06-13 1997-01-09 Advanced Vision Technologies, Inc. Laminar composite lateral field-emission cathode and fabrica tion process
US5780960A (en) * 1996-12-18 1998-07-14 Texas Instruments Incorporated Micro-machined field emission microtips
US5894188A (en) * 1997-09-17 1999-04-13 Candescent Technologies Corporation Dual-layer metal for flat panel display

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