JP2001351870A5 - - Google Patents
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- Publication number
- JP2001351870A5 JP2001351870A5 JP2000174330A JP2000174330A JP2001351870A5 JP 2001351870 A5 JP2001351870 A5 JP 2001351870A5 JP 2000174330 A JP2000174330 A JP 2000174330A JP 2000174330 A JP2000174330 A JP 2000174330A JP 2001351870 A5 JP2001351870 A5 JP 2001351870A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing apparatus
- valve
- substrate processing
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
【0011】
また、請求項2に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板を保持する機能を併せ持つことを特徴とする。[0011]
Further, the invention according to claim 2 controls the pressure inside the barber device by the opening and / or gas introduction amount of the valve, processing the substrate, which is introduced into the vessel at low pressure The substrate processing apparatus is characterized in that the valve also has a function of holding a substrate.
【0012】
更に、請求項3に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板を回転させる機能を併せ持つことを特徴とする。[0012]
Furthermore, the present invention according to claim 3 is a substrate processing apparatus that controls the pressure inside the container by the opening of the valve and / or the gas introduction amount, and processes the substrate introduced into the container under low pressure. in, the valve is characterized by having both the function of rotating the substrate.
【0013】
また、請求項4に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板の温度を調節する機能を併せ持つことを特徴とする。[0013]
In the substrate processing apparatus according to the fourth aspect of the present invention, the pressure inside the container is controlled by the opening of the valve and / or the gas introduction amount, and the substrate introduced into the container is processed under low pressure. In the above, the valve is characterized in that it also has a function of adjusting the temperature of the substrate.
【0014】
更に、請求項5に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、上記容器内にガスを導入する機能を併せ持つことを特徴とする。[0014]
Furthermore, the present invention according to claim 5 is a substrate processing apparatus which controls the pressure inside the container by the opening of the valve and / or the gas introduction amount, and processes the substrate introduced into the container under low pressure. in, the valve is characterized by having both the function of introducing a gas into the container.
Claims (5)
上記真空ポンプを上記容器に隣接して配置し、
上記真空ポンプの上記容器側に形成される吸込口を閉塞可能なバルブ体を上記容器の内部に設けたことを特徴とする基板処理装置。In a substrate processing apparatus which decompresses the inside of a container by a vacuum pump and processes a substrate introduced into the inside of the container under a low pressure,
Placing the vacuum pump adjacent to the vessel;
A substrate processing apparatus characterized in that a valve body capable of closing a suction port formed on the container side of the vacuum pump is provided inside the container.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000174330A JP2001351870A (en) | 2000-06-09 | 2000-06-09 | Substrate processing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000174330A JP2001351870A (en) | 2000-06-09 | 2000-06-09 | Substrate processing system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001351870A JP2001351870A (en) | 2001-12-21 |
JP2001351870A5 true JP2001351870A5 (en) | 2004-11-04 |
Family
ID=18676394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000174330A Pending JP2001351870A (en) | 2000-06-09 | 2000-06-09 | Substrate processing system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001351870A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5241052B2 (en) * | 2001-09-03 | 2013-07-17 | ラム リサーチ コーポレーション | Plasma processing equipment |
JP2004063925A (en) * | 2002-07-31 | 2004-02-26 | Mitsubishi Heavy Ind Ltd | Plasma processing apparatus and method |
JP2012104488A (en) * | 2011-12-08 | 2012-05-31 | Lam Research Corporation | Plasma processing device |
GB2575451B (en) * | 2018-07-09 | 2021-01-27 | Edwards Ltd | Vacuum pump with through channel and vacuum chamber |
TW202101638A (en) * | 2019-03-15 | 2021-01-01 | 美商蘭姆研究公司 | Turbomolecular pump and cathode assembly for etching reactor |
GB2584160A (en) * | 2019-05-24 | 2020-11-25 | Edwards Ltd | Vacuum assembly and vacuum pump with an axial through passage |
WO2021181498A1 (en) * | 2020-03-10 | 2021-09-16 | 株式会社Kokusai Electric | Substrate treatment device, exhaust flow rate control device, and method for manufacturing semiconductor device |
-
2000
- 2000-06-09 JP JP2000174330A patent/JP2001351870A/en active Pending
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