JP2001351870A5 - - Google Patents

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Publication number
JP2001351870A5
JP2001351870A5 JP2000174330A JP2000174330A JP2001351870A5 JP 2001351870 A5 JP2001351870 A5 JP 2001351870A5 JP 2000174330 A JP2000174330 A JP 2000174330A JP 2000174330 A JP2000174330 A JP 2000174330A JP 2001351870 A5 JP2001351870 A5 JP 2001351870A5
Authority
JP
Japan
Prior art keywords
substrate
processing apparatus
valve
substrate processing
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000174330A
Other languages
Japanese (ja)
Other versions
JP2001351870A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000174330A priority Critical patent/JP2001351870A/en
Priority claimed from JP2000174330A external-priority patent/JP2001351870A/en
Publication of JP2001351870A publication Critical patent/JP2001351870A/en
Publication of JP2001351870A5 publication Critical patent/JP2001351870A5/ja
Pending legal-status Critical Current

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Description

【0011】
また、請求項2に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板を保持する機能を併せ持つことを特徴とする。
[0011]
Further, the invention according to claim 2 controls the pressure inside the barber device by the opening and / or gas introduction amount of the valve, processing the substrate, which is introduced into the vessel at low pressure The substrate processing apparatus is characterized in that the valve also has a function of holding a substrate.

【0012】
更に、請求項3に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板を回転させる機能を併せ持つことを特徴とする。
[0012]
Furthermore, the present invention according to claim 3 is a substrate processing apparatus that controls the pressure inside the container by the opening of the valve and / or the gas introduction amount, and processes the substrate introduced into the container under low pressure. in, the valve is characterized by having both the function of rotating the substrate.

【0013】
また、請求項4に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板の温度を調節する機能を併せ持つことを特徴とする。
[0013]
In the substrate processing apparatus according to the fourth aspect of the present invention, the pressure inside the container is controlled by the opening of the valve and / or the gas introduction amount, and the substrate introduced into the container is processed under low pressure. In the above, the valve is characterized in that it also has a function of adjusting the temperature of the substrate.

【0014】
更に、請求項5に記載の本発明は、バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、上記容器内にガスを導入する機能を併せ持つことを特徴とする。
[0014]
Furthermore, the present invention according to claim 5 is a substrate processing apparatus which controls the pressure inside the container by the opening of the valve and / or the gas introduction amount, and processes the substrate introduced into the container under low pressure. in, the valve is characterized by having both the function of introducing a gas into the container.

Claims (5)

真空ポンプにより容器の内部を減圧し、上記容器の内部に導入された基板を低圧下で処理する基板処理装置において、
上記真空ポンプを上記容器に隣接して配置し、
上記真空ポンプの上記容器側に形成される吸込口を閉塞可能なバルブ体を上記容器の内部に設けたことを特徴とする基板処理装置。
In a substrate processing apparatus which decompresses the inside of a container by a vacuum pump and processes a substrate introduced into the inside of the container under a low pressure,
Placing the vacuum pump adjacent to the vessel;
A substrate processing apparatus characterized in that a valve body capable of closing a suction port formed on the container side of the vacuum pump is provided inside the container.
バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板を保持する機能を併せ持つことを特徴とする基板処理装置。In the substrate processing apparatus to control the pressure inside the barber device by the opening and / or gas introduction amount of the valve, processing the substrate, which is introduced into the vessel under low pressure, the valve, holds the substrate What is claimed is: 1. A substrate processing apparatus comprising: バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板を回転させる機能を併せ持つことを特徴とする基板処理装置。In the substrate processing apparatus to control the pressure inside the barber device by the opening and / or gas introduction amount of the valve, processing the substrate, which is introduced into the vessel under low pressure, the valve may rotate the substrate What is claimed is: 1. A substrate processing apparatus comprising: バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、基板の温度を調節する機能を併せ持つことを特徴とする基板処理装置。In the substrate processing apparatus to control the pressure inside the barber device by the opening and / or gas introduction amount of the valve, processing the substrate, which is introduced into the vessel under low pressure, the valve, the temperature of the substrate A substrate processing apparatus having a function of adjusting バルブの開度及び/又はガス導入量により容器の内部の圧力を制御し、該容器の内部に導入された基板を低圧下で処理する基板処理装置において、上記バルブは、上記容器内にガスを導入する機能を併せ持つことを特徴とする基板処理装置。In the substrate processing apparatus to control the pressure inside the barber device by the opening and / or gas introduction amount of the valve, processing the substrate, which is introduced into the vessel under low pressure, the valve, said container A substrate processing apparatus having a function of introducing a gas to the substrate.
JP2000174330A 2000-06-09 2000-06-09 Substrate processing system Pending JP2001351870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000174330A JP2001351870A (en) 2000-06-09 2000-06-09 Substrate processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000174330A JP2001351870A (en) 2000-06-09 2000-06-09 Substrate processing system

Publications (2)

Publication Number Publication Date
JP2001351870A JP2001351870A (en) 2001-12-21
JP2001351870A5 true JP2001351870A5 (en) 2004-11-04

Family

ID=18676394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000174330A Pending JP2001351870A (en) 2000-06-09 2000-06-09 Substrate processing system

Country Status (1)

Country Link
JP (1) JP2001351870A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5241052B2 (en) * 2001-09-03 2013-07-17 ラム リサーチ コーポレーション Plasma processing equipment
JP2004063925A (en) * 2002-07-31 2004-02-26 Mitsubishi Heavy Ind Ltd Plasma processing apparatus and method
JP2012104488A (en) * 2011-12-08 2012-05-31 Lam Research Corporation Plasma processing device
GB2575451B (en) * 2018-07-09 2021-01-27 Edwards Ltd Vacuum pump with through channel and vacuum chamber
TW202101638A (en) * 2019-03-15 2021-01-01 美商蘭姆研究公司 Turbomolecular pump and cathode assembly for etching reactor
GB2584160A (en) * 2019-05-24 2020-11-25 Edwards Ltd Vacuum assembly and vacuum pump with an axial through passage
WO2021181498A1 (en) * 2020-03-10 2021-09-16 株式会社Kokusai Electric Substrate treatment device, exhaust flow rate control device, and method for manufacturing semiconductor device

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