JP2001334461A5 - - Google Patents
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- Publication number
- JP2001334461A5 JP2001334461A5 JP2000157006A JP2000157006A JP2001334461A5 JP 2001334461 A5 JP2001334461 A5 JP 2001334461A5 JP 2000157006 A JP2000157006 A JP 2000157006A JP 2000157006 A JP2000157006 A JP 2000157006A JP 2001334461 A5 JP2001334461 A5 JP 2001334461A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000157006A JP2001334461A (en) | 2000-05-26 | 2000-05-26 | Polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000157006A JP2001334461A (en) | 2000-05-26 | 2000-05-26 | Polishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001334461A JP2001334461A (en) | 2001-12-04 |
| JP2001334461A5 true JP2001334461A5 (en) | 2005-07-07 |
Family
ID=18661707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000157006A Pending JP2001334461A (en) | 2000-05-26 | 2000-05-26 | Polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001334461A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4259048B2 (en) * | 2002-06-28 | 2009-04-30 | 株式会社ニコン | Conditioner lifetime determination method, conditioner determination method using the same, polishing apparatus, and semiconductor device manufacturing method |
| JP4597634B2 (en) * | 2004-11-01 | 2010-12-15 | 株式会社荏原製作所 | Top ring, substrate polishing apparatus and polishing method |
| CN101934491B (en) | 2004-11-01 | 2012-07-25 | 株式会社荏原制作所 | Polishing apparatus |
| JP5306065B2 (en) * | 2009-06-04 | 2013-10-02 | 株式会社荏原製作所 | Dressing apparatus and dressing method |
| JP5896625B2 (en) | 2011-06-02 | 2016-03-30 | 株式会社荏原製作所 | Method and apparatus for monitoring the polishing surface of a polishing pad used in a polishing apparatus |
| CN107695860B (en) * | 2017-11-07 | 2023-10-20 | 佛山市高明富东机械制造有限公司 | Marble slab polishing millstone device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09285959A (en) * | 1996-04-18 | 1997-11-04 | Hitachi Cable Ltd | Method for polishing wafer |
| JPH1086056A (en) * | 1996-09-11 | 1998-04-07 | Speedfam Co Ltd | Management method and device for polishing pad |
| JPH10315118A (en) * | 1997-05-19 | 1998-12-02 | Toshiba Corp | Abrasive cloth dressing device |
| JPH10315131A (en) * | 1997-05-23 | 1998-12-02 | Hitachi Ltd | Polishing method of semiconductor wafer and device therefor |
| JP2973404B2 (en) * | 1997-07-11 | 1999-11-08 | 株式会社東京精密 | Wafer polishing equipment |
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2000
- 2000-05-26 JP JP2000157006A patent/JP2001334461A/en active Pending