JP2001332457A - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitorInfo
- Publication number
- JP2001332457A JP2001332457A JP2000151865A JP2000151865A JP2001332457A JP 2001332457 A JP2001332457 A JP 2001332457A JP 2000151865 A JP2000151865 A JP 2000151865A JP 2000151865 A JP2000151865 A JP 2000151865A JP 2001332457 A JP2001332457 A JP 2001332457A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- solid electrolytic
- thermal expansion
- transition temperature
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 25
- 239000007787 solid Substances 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 230000009477 glass transition Effects 0.000 claims abstract description 11
- 239000007784 solid electrolyte Substances 0.000 claims abstract description 10
- 229920001002 functional polymer Polymers 0.000 claims description 9
- 238000005452 bending Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 150000001448 anilines Chemical class 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 150000003233 pyrroles Chemical class 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 150000003577 thiophenes Chemical class 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、固体電解コンデン
サの外装樹脂に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exterior resin for a solid electrolytic capacitor.
【0002】[0002]
【従来の技術】固体電解コンデンサは、熱膨張係数の異
なる材質を積み重ねた多層構造になっており、使用環境
の温度やコンデンサ自体に印加される電力が頻繁に変化
するような条件下では、各材料の熱膨張率の差によって
材料間に応力が発生する。この応力により、各材料間の
接合面のはがれや誘電体酸化皮膜の損傷が発生し、等価
直列抵抗(ESR)や漏れ電流といったコンデンサ特性
に悪影響を及ぼす。2. Description of the Related Art Solid electrolytic capacitors have a multilayer structure in which materials having different coefficients of thermal expansion are stacked. Stress is generated between the materials due to the difference in the coefficient of thermal expansion of the materials. This stress causes peeling of the bonding surface between the materials and damage of the dielectric oxide film, which adversely affects capacitor characteristics such as equivalent series resistance (ESR) and leakage current.
【0003】以上のことから、固体電解コンデンサの封
止材となる外装樹脂には低応力性が求められるが、成形
性、耐湿性等の特性向上と矛盾することが多い。[0003] For the above reasons, the exterior resin used as the sealing material of the solid electrolytic capacitor is required to have a low stress, but often contradicts the improvement of properties such as moldability and moisture resistance.
【0004】たとえば、応力を小さくするには、熱膨張
係数を小さくする、ガラス転移温度を高くする、弾性率
を小さくするという3つの方法が挙げられる。しかし、
熱膨張係数を小さくするため、シリカに代表される無機
充填材の含有率を上げると、溶融状態での粘度が高くな
り成形性が劣化する。また、弾性率が高くなりクラック
が発生しやすくなる。ガラス転移温度の上昇には、樹脂
の架橋密度を高くするために活性の強い触媒を使う方法
や、多官能樹脂を使うなどの方法があるが、このような
方法では弾性率が高くなる傾向がある。弾性率を低減さ
せるには、樹脂の組成を変更するか、構成材料自体を低
弾性化する2つの方法があるが、成形性、吸湿性等の低
下をもたらすという問題があった。[0004] For example, to reduce stress, there are three methods of reducing the coefficient of thermal expansion, increasing the glass transition temperature, and decreasing the elastic modulus. But,
When the content of an inorganic filler typified by silica is increased in order to reduce the coefficient of thermal expansion, the viscosity in a molten state is increased and the moldability is deteriorated. In addition, the modulus of elasticity increases, and cracks easily occur. To increase the glass transition temperature, there are methods such as using a highly active catalyst to increase the crosslink density of the resin and using a polyfunctional resin.However, such a method tends to increase the elastic modulus. is there. To reduce the elastic modulus, there are two methods of changing the composition of the resin or reducing the elasticity of the constituent material itself. However, there is a problem that the moldability and the hygroscopicity are reduced.
【0005】上記の理由から外装樹脂の特性改善による
固体電解コンデンサの特性劣化防止を図ることは困難で
あった。For the above reasons, it has been difficult to prevent the deterioration of the characteristics of the solid electrolytic capacitor by improving the characteristics of the exterior resin.
【0006】[0006]
【発明が解決しようとする課題】上記のような問題があ
ったため、成形性、耐湿性等の諸特性を損なうことなく
応力を低減することができる樹脂を封止材に用いた固体
電解コンデンサが要求されていた。Because of the above-mentioned problems, a solid electrolytic capacitor using a resin as a sealing material, which can reduce stress without deteriorating various properties such as moldability and moisture resistance, has been developed. Had been requested.
【0007】[0007]
【課題を解決するための手段】本発明は、曲げ弾性率が
1200〜1400kg/mm2で、かつガラス転移温
度以下での熱膨張係数が0.8〜1.7×10−5/℃
の樹脂を外装材料に用いることにより組立時や実装時の
応力の低減を図り、漏れ電流特性に優れ、低ESR、高
信頼性の固体電解コンデンサを提供することができるも
のである。すなわち、固体電解質層を形成したコンデン
サ素子と外部電極および外装樹脂からなる固体電解コン
デンサにおいて、上記外装樹脂の曲げ弾性率が1200
〜1400kg/mm2であり、かつガラス転移温度以
下での熱膨張係数が0.8〜1.7×10−5/℃であ
ることを特徴とする固体電解コンデンサである。According to the present invention, a flexural modulus is from 1200 to 1400 kg / mm 2 and a coefficient of thermal expansion below the glass transition temperature is from 0.8 to 1.7 × 10 −5 / ° C.
By using this resin as an exterior material, stress during assembly and mounting can be reduced, and a solid electrolytic capacitor having excellent leakage current characteristics, low ESR and high reliability can be provided. That is, in a solid electrolytic capacitor including a capacitor element having a solid electrolyte layer formed thereon, an external electrode, and an exterior resin, the flexural modulus of the exterior resin is 1200.
A ~1400kg / mm 2, and the thermal expansion coefficient of less than a glass transition temperature of the solid electrolytic capacitor, which is a 0.8~1.7 × 10 -5 / ℃.
【0008】また、上記固体電解質層が機能性高分子で
あることを特徴とする固体電解コンデンサである。[0008] The solid electrolytic capacitor is characterized in that the solid electrolyte layer is a functional polymer.
【0009】上記機能性高分子の材料として、アニリ
ン、チオフェン、ピロールまたはそれらの誘導体を挙げ
ることができる。As the material of the above functional polymer, aniline, thiophene, pyrrole or derivatives thereof can be mentioned.
【0010】なお、上記記載のアニリン誘導体として、
アニリン骨格を有しアルキル基、フェニル基、アルコキ
シ基、エステル基、チオエーテル基のうち少なくとも1
種を置換基として有するアニリン誘導体を挙げることが
できる。[0010] As the aniline derivative described above,
Having an aniline skeleton, at least one of an alkyl group, a phenyl group, an alkoxy group, an ester group, and a thioether group;
An aniline derivative having a species as a substituent can be given.
【0011】そして、上記記載のチオフェンの誘導体
が、チオフェン骨格の3位、3位と4位またはS位に、
水酸基、アセチル基、カルボキシル基、アルキル基、ア
ルコキシ基のうち少なくとも1種を置換基として有する
チオフェン誘導体、または3,4−アルキレンジオキシ
チオフェンを挙げることができる。Then, the above-mentioned thiophene derivative is added at the 3-, 3- and 4-positions or S-position of the thiophene skeleton.
Examples include a thiophene derivative having at least one of a hydroxyl group, an acetyl group, a carboxyl group, an alkyl group, and an alkoxy group as a substituent, or 3,4-alkylenedioxythiophene.
【0012】さらに、上記記載のピロール誘導体が、ピ
ロール骨格の3位、3位と4位またはN位に、水酸基、
アセチル基、カルボキシル基、アルキル基、アルコキシ
基のうち少なくとも1種を置換基として有するピロール
誘導体を挙げることができる。Further, the above-mentioned pyrrole derivative has a hydroxyl group at the 3-, 3- and 4-positions or the N-position of the pyrrole skeleton.
Examples include pyrrole derivatives having at least one of an acetyl group, a carboxyl group, an alkyl group, and an alkoxy group as a substituent.
【0013】上記固体電解質層の構造として、化学重合
による機能性高分子によるもの、化学重合後電解重合に
よる機能性高分子によるもの、化学重合、電解重合、化
学重合の順で形成した機能性高分子によるものを挙げる
ことができる。また、機能性高分子は同一でも異なる材
料でもよい。The structure of the solid electrolyte layer may be a functional polymer formed by chemical polymerization, a functional polymer formed by chemical polymerization followed by electrolytic polymerization, or a functional polymer formed by chemical polymerization, electrolytic polymerization and chemical polymerization in this order. Molecules may be mentioned. The functional polymers may be the same or different materials.
【0014】[0014]
【発明の実施の形態】外装樹脂の曲げ弾性率を1200
〜1400kg/mm2とし、かつガラス転移温度以下
での熱膨張係数を0.8〜1.7×10−5/℃とする
ことで、組立時や実装時の応力の低減が図れ、漏れ電流
特性に優れ、低ESR、高信頼性の固体電解コンデンサ
を提供することができる。BEST MODE FOR CARRYING OUT THE INVENTION The flexural modulus of the exterior resin is 1200
11400 kg / mm 2 and a coefficient of thermal expansion below the glass transition temperature of 0.8 to 1.7 × 10 −5 / ° C. to reduce stress during assembly and mounting, and to reduce leakage current. A solid electrolytic capacitor having excellent characteristics, low ESR and high reliability can be provided.
【0015】[0015]
【実施例】タンタルワイヤーを直立させた陽極体の表面
に五酸化タンタルからなる誘電体酸化皮膜を形成した
後、固体電解質層となる導電性高分子層として化学重合
によるポリピロール層を形成した。次いでカーボンペー
スト層、銀ペースト層を形成してコンデンサ素子を形成
した。さらに陽極となるタンタルワイヤーをリードフレ
ームに溶接し、陰極となる固体電解質を導電性銀ペース
トによりリードフレームに接着した。上記状態のコンデ
ンサ素子とリードフレームをトランスファーモールド法
により、/表1の樹脂特性に基づきエポキシ樹脂で外装
後、リードを樹脂側面に沿って折り曲げ、6.3V/1
50μFの固体電解コンデンサを各100個作製した。EXAMPLE After a dielectric oxide film made of tantalum pentoxide was formed on the surface of an anode body having a tantalum wire standing upright, a polypyrrole layer was formed by chemical polymerization as a conductive polymer layer to be a solid electrolyte layer. Next, a carbon paste layer and a silver paste layer were formed to form a capacitor element. Further, a tantalum wire serving as an anode was welded to a lead frame, and a solid electrolyte serving as a cathode was bonded to the lead frame with a conductive silver paste. After the capacitor element and the lead frame in the above state are covered with an epoxy resin based on the resin characteristics shown in Table 1 by the transfer molding method, the lead is bent along the side surface of the resin to obtain 6.3 V / 1.
100 solid electrolytic capacitors of 50 μF each were produced.
【0016】実施例1〜3と比較例1〜3について10
0kHzにおけるESRおよび定格電圧印加1分後の漏
れ電流を各々測定し、さらに240℃で10秒間キープ
できる温度プロファイルのリフロー炉に3回通す耐熱試
験を行った後に同様の測定を行い、その結果を表1に示
した。Examples 1 to 3 and Comparative Examples 1 to 3
The ESR at 0 kHz and the leakage current one minute after the application of the rated voltage were measured, and a heat resistance test was performed three times through a reflow furnace having a temperature profile capable of keeping at 240 ° C. for 10 seconds, and the same measurement was performed. The results are shown in Table 1.
【0017】[0017]
【表1】 [Table 1]
【0018】比較例1のように、曲げ弾性率が1400
kg/mm2を超え、熱膨張係数も1.7×10−5/
℃を超えると素子に大きな応力がかかり、特に漏れ電流
値が悪化する。次に比較例2のように、応力を小さくす
るために曲げ弾性率を1200kg/mm2未満にする
と成形性が悪化し、外観不良率の増加、特性の悪化が見
られる。また比較例3のようにガラス転移温度以下の熱
膨張係数が0.8×10−5/℃未満でも成形性が悪化
し、外観不良率の増加、特性の悪化が見られる。これら
比較例と比べ、本発明の実施例1〜3は、外観不良率が
低く、初期、耐熱試験後いずれにおいても漏れ電流値、
ESRが小さくコンデンサとして優れた特性を持つこと
が分かる。As in Comparative Example 1, the flexural modulus was 1400
kg / mm 2 and the coefficient of thermal expansion is 1.7 × 10 −5 /
If the temperature exceeds ℃, a large stress is applied to the element, and the leakage current value is particularly deteriorated. Next, as in Comparative Example 2, when the flexural modulus is set to less than 1200 kg / mm 2 in order to reduce the stress, the formability deteriorates, the appearance defect rate increases, and the characteristics deteriorate. Also, as in Comparative Example 3, when the coefficient of thermal expansion below the glass transition temperature is less than 0.8 × 10 −5 / ° C., the moldability deteriorates, the appearance defect rate increases, and the characteristics deteriorate. As compared with these comparative examples, Examples 1 to 3 of the present invention have a low appearance defect rate, and the leakage current value at the initial stage, after any heat resistance test,
It can be seen that the ESR is small and the capacitor has excellent characteristics.
【0019】外装樹脂のガラス転移温度以下の熱膨張係
数を1.7×10−5/℃としたときの曲げ弾性率と外
観不良率および漏れ電流との特性図を図1に示す。図1
より曲げ弾性率は、1200〜1400kg/mm2が
最適であることが分かる。FIG. 1 shows a characteristic diagram of the flexural modulus, the appearance defect rate, and the leakage current when the coefficient of thermal expansion at the glass transition temperature or lower of the exterior resin is 1.7 × 10 −5 / ° C. FIG.
It can be seen from the above that the flexural modulus is optimally 1200 to 1400 kg / mm 2 .
【0020】また、外装樹脂の曲げ弾性率を1300k
g/mm2としたときのガラス転移温度以下の熱膨張係
数と外観不良および漏れ電流との特性図を図2に示す。
図2より熱膨張係数は、0.8〜1.7×10−5/℃
が最適であることが分かる。The flexural modulus of the exterior resin is 1300 k.
FIG. 2 shows a characteristic diagram of a coefficient of thermal expansion equal to or lower than the glass transition temperature when g / mm 2 , poor appearance, and leakage current.
From FIG. 2, the coefficient of thermal expansion is 0.8 to 1.7 × 10 −5 / ° C.
Is found to be optimal.
【0021】本実施例では固体電解質に応力に弱い機能
性高分子を使用したが、二酸化マンガンを固体電解質と
しても、また機能性高分子材料として実施例のピロール
に限らず、アニリン、チオフェンまたはそれらの誘導体
を用いた場合も、実施例と同等の結果が得られた。In this embodiment, a functional polymer which is weak against stress is used as the solid electrolyte. However, manganese dioxide is not limited to the pyrrole of the embodiment as the solid electrolyte and the functional polymer material. When the derivative of was used, a result equivalent to that of the example was obtained.
【0022】[0022]
【発明の効果】本発明の固体電解コンデンサは、曲げ弾
性率が1200〜1400kg/mm 2で、かつガラス
転移温度以下での熱膨張係数が0.8〜1.7×10
−5/℃の樹脂を外装材料に用いることにより、優れた
漏れ電流特性、低ESR、高信頼性を得ることができ、
工業上有益なものである。The solid electrolytic capacitor of the present invention has a bending elasticity.
The power factor is 1200 to 1400 kg / mm 2And glass
The coefficient of thermal expansion below the transition temperature is 0.8 to 1.7 × 10
-5/ C resin is used for the exterior material,
Leakage current characteristics, low ESR and high reliability can be obtained.
It is industrially useful.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成12年6月12日(2000.6.1
2)[Submission date] June 12, 2000 (2006.1.
2)
【手続補正1】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Correction target item name] Brief description of drawings
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図面の簡単な説明】[Brief description of the drawings]
【図1】曲げ弾性率と外観不良率および漏れ電流との特
性図。FIG. 1 is a characteristic diagram of a flexural modulus, a defective appearance rate, and a leakage current.
【図2】ガラス転移温度以下の熱膨張係数と外観不良率
および漏れ電流との特性図。FIG. 2 is a characteristic diagram showing a coefficient of thermal expansion below a glass transition temperature, a defective appearance rate, and a leakage current.
Claims (2)
と外部電極および外装樹脂からなる固体電解コンデンサ
において、 上記外装樹脂の曲げ弾性率が1200〜1400kg/
mm2であり、かつガラス転移温度以下での熱膨張係数
が0.8〜1.7×10−5/℃であることを特徴とす
る固体電解コンデンサ。1. A solid electrolytic capacitor comprising a capacitor element on which a solid electrolyte layer is formed, an external electrode and an exterior resin, wherein the exterior resin has a flexural modulus of 1200 to 1400 kg /
mm 2, and a solid electrolytic capacitor characterized in that the thermal expansion coefficient of less than a glass transition temperature of 0.8~1.7 × 10 -5 / ℃.
分子であることを特徴とする固体電解コンデンサ。2. A solid electrolytic capacitor according to claim 1, wherein the solid electrolyte layer is a functional polymer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000151865A JP2001332457A (en) | 2000-05-23 | 2000-05-23 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000151865A JP2001332457A (en) | 2000-05-23 | 2000-05-23 | Solid electrolytic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001332457A true JP2001332457A (en) | 2001-11-30 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112136194A (en) * | 2018-06-21 | 2020-12-25 | 阿维科斯公司 | Solid electrolyte capacitor having stable electrical properties at high temperatures |
WO2024029284A1 (en) * | 2022-08-04 | 2024-02-08 | パナソニックIpマネジメント株式会社 | Solid electrolytic capacitor |
-
2000
- 2000-05-23 JP JP2000151865A patent/JP2001332457A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112136194A (en) * | 2018-06-21 | 2020-12-25 | 阿维科斯公司 | Solid electrolyte capacitor having stable electrical properties at high temperatures |
CN112136194B (en) * | 2018-06-21 | 2022-05-31 | 京瓷Avx元器件公司 | Solid electrolyte capacitor having stable electrical properties at high temperatures |
WO2024029284A1 (en) * | 2022-08-04 | 2024-02-08 | パナソニックIpマネジメント株式会社 | Solid electrolytic capacitor |
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