JP2001326460A - Aluminum intermediate plate for manufacturing printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aluminum intermediate plate for manufacturing a printed board which is excellent in releasing property in a moderate temperature region of 170 to 200 deg.C and in handling property, and can be used repeatedly, and whose raw material is inexpensive. SOLUTION: A 0.4 mm-thick aluminum thin plate is subjected to alkaline degreasing/washing. Then, 100 pts.mass of alkyd modified silicone resin (product name; X62-9027, Shin-Etsu Chemical Co., Ltd.), 50 parts by mass of toluene, 2.5 parts by mass unit of curing catalyst and 30 parts by mass of silane mold release (product name: Chemlease RC-1, Chemlease Inc.) are mixed to toluene. The obtained mixed paint is applied on an aluminum thin plate by a bar coater and the film thickness is adjusted. Thereafter, it is subjected to heating treatment for 3 minutes at 250 deg. and a release layer is cured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum intermediate plate for manufacturing a printed circuit board used for manufacturing a resin-based printed circuit board, and is particularly used for a multi-stage press and has a surface releasability. The present invention relates to an aluminum intermediate plate for manufacturing a printed circuit board which can be used repeatedly.

[0002]

2. Description of the Related Art A resin-based printed circuit board is made by impregnating a base material such as glass cloth or paper with a thermosetting resin such as an epoxy resin or a phenol resin, and heat-curing a semi-cured prepreg (PrePreg). To be obtained. The heat curing of the prepreg is performed by a multi-stage press in which a plurality of prepregs cut (cut) to an appropriate size are stacked as needed and heat and pressure are applied vertically for a predetermined time.

FIG. 3 is a perspective view for explaining a general multi-stage press of a prepreg. As shown in FIG. 3, the multi-stage press includes a stainless steel mirror plate 51,
Release film 52, prepreg P (three sheets), release film 52, stainless steel mirror plate 51, release film 52
..., stainless steel mirror plate 51, release film 5
2. The three members of prepreg P are sequentially stacked in about 40 stages (the number of stages based on the three prepregs P), and are stacked in a sandwich shape (hereinafter, the stacked product is referred to as a “laminate”). The hot plate 10u is arranged on the stainless steel mirror plate 51 in the upper layer.

[0004] As described above, the prepregs P are placed one by one,
The upper and lower portions are sandwiched between the stainless steel mirror plate 51 and the release film 52, and the prepreg P is cured by applying heat and pressure from above and below, and the printed circuit board is manufactured. FIG. 3 shows a method of manufacturing one printed circuit board from three prepregs. In this multi-stage press, the temperatures of the upper and lower hot plates 10u and 10d are each set to about 180 ° C., and the prepreg P is heated and pressed for 3 to 4 hours. The heat is transmitted vertically by conduction heat transfer using the upper and lower heating plates 10u and 10d as heat sources.

As a release film for manufacturing a printed circuit board, a fluororesin film or a biaxially stretched polypropylene film (OPP) having excellent release properties is used, sandwiched between stainless steel mirror plates. Had been
In this method, the film is wrinkled by one press, so that the film cannot be used repeatedly and it is necessary to replace the film each time it is used. In addition, the stainless steel mirror plate is used once
The surface must be polished and cleaned every several uses, which is inconvenient to handle.

Further, stacking a large number of heavy stainless steel mirror plates and a release film together with a prepreg requires a great deal of labor and, due to its weight, puts a heavy burden on an apparatus for performing multi-stage pressing. Therefore, there has been a demand for an improvement in handling properties such as a significant reduction in labor in a multi-stage press, a reduction in cost due to repeated use of members, and a reduction in weight burden on the apparatus.

Therefore, conventionally, as a method for solving these problems, for example, as disclosed in Japanese Patent Publication No. Hei 8-21765, “a support sheet made of aluminum foil and both sides of the support sheet are covered at least at 375 ° C. To provide a release layer containing a polymer resin that is thermally stable up to this point. " However, in the method disclosed in Japanese Patent Publication No. Hei 8-21765, a polymer resin that can withstand temperatures of up to 375 ° C. is generally expensive and requires high temperatures for baking a coating film.

[0008] Therefore, the present inventors have filed Japanese Patent Application No. Hei 11-3.
No. 10067 proposed "Aluminum intermediate plate for manufacturing printed circuit boards". In Japanese Patent Application No. 11-310067,
"Using a blend of epoxy resin and silicone resin for the release layer" was proposed. By doing so, 170 ° C
Excellent releasability and repeated use performance can be obtained in a use temperature range of up to 200 ° C. In addition, there is an advantage that the cost of the polymer resin forming the release layer can be reduced.

[0009]

However, the conventional means using an aluminum intermediate plate requires further improvement. That is, generally, the compatibility between the epoxy resin and the silicone resin is not always good. Therefore, if the epoxy resin and the silicone resin are used together, the selection range of the resin components and the adjustment range of the compounding ratio may be limited. When the addition of the third component is necessary for adjusting the film thickness or the coating film hardness, the epoxy resin and the silicone resin may cause phase separation depending on the added component. If the ratio of the epoxy resin is too high, the affinity between the prepreg and the release layer is increased, and there is a concern that the release force may decrease.

Accordingly, the present invention has been made in view of the above-mentioned problems. In manufacturing a resin-based printed circuit board, the material is inexpensive, the addition of other necessary components is easy, and the temperature is 170 ° C. An object of the present invention is to provide an aluminum intermediate plate for manufacturing a printed circuit board, which has excellent release properties in a medium temperature range of 200 to 200 ° C., has good handleability, and can be used repeatedly.

[0011]

Means for Solving the Problems The present inventors have solved the above problems by the following means. The aluminum intermediate plate for manufacturing a printed circuit board of the present invention is an aluminum intermediate plate for manufacturing a printed circuit board, comprising an aluminum thin plate and a release layer based on an alkyd-modified silicone resin formed on one or both surfaces of the aluminum thin plate. The release layer was configured to include a silane-based release agent as a release force adjusting agent.

With this configuration, the alkyd-modified silicone resin exhibits good adhesive strength to the aluminum substrate surface due to the polarity of the alkyd group in the molecule, and finishes the coating film hardness relatively high. On the other hand, the prepreg exhibits a good peeling force. Further, even when repeatedly used for hot pressing, the release layer is less susceptible to deterioration over time such as creep.

Although the alkyd-modified silicone resin is inferior in heat resistance to general silicone resins, it is sufficient that the heat-resistant temperature of the release layer is about 200 ° C. When the aluminum intermediate plate is used by pressing in multiple stages, the temperature of the release layer rarely becomes higher. This is because aluminum has a high thermal conductivity, so that a single processing time in a multi-stage press is shorter than when a stainless steel mirror plate is used, and there is almost no need to forcibly heat the intermediate plate itself.

The silane-based release agent does not impair the excellent characteristics of the alkyd-modified silicone resin and increases the release force as a release layer. The silane-based release agent does not cause phase separation with the alkyd-modified silicone resin, and does not lower the smoothness or gloss of the coating film. Apply the blended paint,
Since no separation or bleeding occurs during baking and curing, the silane release agent can be uniformly dispersed in the coating film.

The mixing ratio of the silane-based release agent to the alkyd-modified silicone resin is preferably 5 to 50 parts by mass with respect to 100 parts by mass of the alkyd-modified silicone resin. When the mixing ratio of the silane-based release agent is 5 to 50 parts by mass with respect to the alkyd-modified silicone resin, the mixing ratio of both becomes appropriate.

Further, the coating thickness of the release layer is 4 to 20.
It is convenient that the thickness is in the range of μm, and the hardness of the coating thickness itself is 70 or more in durometer A scale hardness. When the coating thickness of the release layer is 4 to 20 μm, even if the aluminum substrate has a scratch of about several microns, it can be sufficiently repaired.
Further, when the hardness is 70 or more in durometer A scale hardness, the coating film hardness is high, so that the coating film surface hardly deteriorates in mechanical strength even after repeated use.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a configuration of an aluminum intermediate plate for manufacturing a printed circuit board according to the present embodiment. FIG. 2 is a perspective view illustrating a multi-stage press using an aluminum intermediate plate for manufacturing a printed circuit board according to the present embodiment. In the embodiment of the present invention,
A coating of a release layer based on an alkyd-modified silicone resin is provided on at least one side of the aluminum sheet.

Aluminum intermediate plate A for manufacturing printed circuit boards
(Hereinafter, referred to as “aluminum intermediate plate A”) has both surfaces of an aluminum thin plate 1 covered with a release layer 2 containing an alkyd-modified silicone resin. The aluminum intermediate plate A is used when a prepreg P is cured by heating to produce a printed circuit board, has excellent release properties, has excellent durability, and can be used repeatedly.

[Aluminum Thin Plate] The aluminum intermediate plate A is obtained by covering the surface of an aluminum thin plate 1 with a release layer 2. Aluminum is light and has excellent mechanical strength.
It is a metal with good thermal conductivity. Since the aluminum is light, handling of the prepreg P at the time of the multi-stage pressing becomes easy, and the weight load at the time of performing the multi-stage pressing is reduced. In addition, due to the excellent mechanical strength of aluminum, the flow of the prepreg P and the surface transfer due to the unevenness of the base material hardly occur on the aluminum thin plate 1.

Further, the good thermal conductivity prevents the release layer 2 from being exposed to an unnecessarily high temperature. Accordingly, the release layer 2 can be made of an inexpensive material. At the same time, the life of the release layer 2 is extended. In addition, the amount of one processing in the multi-stage press can be greatly increased. In addition, the processing time in the multi-stage press can be significantly reduced.

With respect to the aluminum (aluminum material) constituting the aluminum thin plate 1, if the tensile strength and the proof stress of the aluminum material are small, the flow of the prepreg P and the surface transfer due to the unevenness of the base material during the multi-stage pressing can be reduced. 1 easily occurs. Therefore, the aluminum material has a tensile strength of 300 N / mm ² or more and a proof stress of 2
It is preferably at least 80 N / mm ² . In addition, as the aluminum material satisfying such a condition, 5000 series aluminum (for example, 5182) having high strength and stiffness is used.
and so on.

Although the aluminum thin plate 1 can have a thickness of 0.2 mm or more, if the thickness is small,
During the multi-stage pressing, the surface transfer to the aluminum thin plate 1 due to the flow of the prepreg P and the unevenness of the base material easily occurs. Considering this surface transfer and the like, the thickness of the aluminum thin plate 1 is more preferably 0.3 mm or more (in the case of 5182-H38 as an example). It should be noted that as the thickness of the aluminum thin plate 1 increases, the heat transfer becomes poor and the material cost increases due to the increase in weight. Therefore, it is not good that the aluminum thin plate 1 is too thick. For this reason, the thickness of the aluminum thin plate 1 is 1 mm or less (preferably 0.1 mm).
61 mm or less). By the way, at the time of multi-stage pressing, the aluminum thin plate 1 has about 30-60 ×
A pressure of about 10 ⁵ Pa is applied.

[Release Layer] The release layer 2 is formed on the surface of the aluminum thin plate 1. At the time of manufacturing a printed circuit board, it is sufficient if the prepreg P side is released, and it is sufficient if the prepreg P is on one side. It plays the role of a release material that allows the printed circuit board obtained by thermosetting the prepreg P to be easily separated from the aluminum intermediate plate A. The release layer 2 of the present embodiment is based on an alkyd-modified silicone resin, and contains a silane-based release agent as a release force adjusting agent.

The alkyd-modified silicone resin exhibits good adhesion to the aluminum substrate surface due to the polarity of the alkyd group in the molecule, and finishes the coating film hardness relatively high. On the other hand, the prepreg exhibits a good peeling force. Further, even when repeatedly used for hot pressing, the release layer is less susceptible to deterioration over time such as creep.

The alkyd-modified silicone resin is inferior in heat resistance to general silicone resins, but it is sufficient if the heat-resistant temperature of the release layer is about 200 ° C. When the aluminum intermediate plate is used by pressing in multiple stages, the temperature of the release layer rarely becomes higher. This is because aluminum has a high thermal conductivity, so that a single processing time in a multi-stage press is shorter than when a stainless steel mirror plate is used, and there is almost no need to forcibly heat the intermediate plate itself.

Alkyd-modified silicone resins are available at relatively low cost. In addition, when a curing catalyst is added for the curing reaction, there is no need to pay special attention at the time of coating because the reaction is hardly hindered. Generally, it has compatibility with epoxy resin and alkyd resin. Even if these are mixed in the release layer, the alkyd-modified silicone resin has good compatibility with them. By appropriately blending an epoxy resin, an alkyd resin, or the like, it is possible to adjust coating film performance such as mechanical strength and to adjust material cost according to assumed use conditions.

The alkyd-modified silicone resin has a relatively low viscosity. In production, there is no need to increase the dilution ratio with a solvent during coating. If the amount of the solvent used is small, the volatile matter can be reduced when the solvent is volatilized and removed, and a thick film can be applied.

As modified silicone resins other than alkyd-modified silicone resins, epoxy-modified silicone resins, polyester-modified silicone resins,
An acrylic-modified silicone resin may be used, but these resins are inferior in releasability as compared to alkyd-modified silicone resins.

In the present invention, a silane release agent is used in combination. The silane-based release agent increases the release force of the release layer without impairing the excellent features of the alkyd-modified silicone resin. The silane-based release agent does not cause phase separation with the alkyd-modified silicone resin, and does not lower the smoothness or gloss of the coating film. Even when the compounded paint is applied and baked and cured, separation and bleeding do not occur, so that the silane-based release agent can be uniformly dispersed in the coating film. The alkyd-modified silicone resin can be represented, for example, by the following formula.

[0030]

Embedded image

In the above formula, R ′ and R ″ are preferably an organic group. For example, R can be generally a methyl group. R ′ and R ″ may be an oil component (unsaturated). Groups) and fatty acids.

In one molecule or in the repeating unit, R, R 'and R "may be a common substituent represented by the same chemical formula or different substituents having different chemical formulas. R ′ and R ″ are not particularly defined as functional groups,
It may be a long-chain hydrocarbon or the like.

The alkyd-modified silicone resin that can be used in the present invention is not particularly limited as long as it is commercially available, and for example, the silicone content is 30 to 70.
%, And the solvent is diluted with a solvent such as toluene, xylene and methyl ethyl ketone (MEK) so that the active ingredient becomes 30 to 60% by mass.
It is convenient to use one having a property of 300 mPa · s.

In general, the modified silicone resin has a functional group of a polysiloxane called a so-called silicone resin,
It is obtained by chemically reacting and bonding an organic resin having an alcoholic hydroxyl group in the molecule.

Examples of the alkyd-modified silicone resin that can be particularly preferably used in the embodiment of the present invention include the following. Shin-Etsu Chemical Co., Ltd. X-62-9027, X-62-900B, Toray, Dow Corning, Silicone SR2114, SR
2107 and TSR180 manufactured by Toshiba Silicone.

Incidentally, examples of modified silicone resins other than the alkyd-modified silicone resin include an epoxy-modified silicone resin, a polyester-modified silicone resin, and an acryl-modified silicone resin, and the alkyd-modified silicone resin is most suitable for this application.

Although a silicone resin having only a polysiloxane skeleton without modification has excellent properties of heat resistance and weather resistance, and exhibits excellent performance of releasability, it is a good material. Usually, it is expensive, requires high temperature for baking of the coating film, and depending on the curing catalyst used, the reaction may be hindered by a trace amount of chemical substances present on the coated surface and sufficient coating film performance may not be obtained, The range of application is limited due to poor mechanical strength of the coating film and poor adhesion to the substrate.

Further, a silane-based release agent is added to the alkyd-modified silicone resin as a release force regulator.
Specific examples of the silane-based release agent as a release force adjusting agent include Frekote (trade name of Dexter CorP., USA) and Chemlease In (USA).
c.) under the trade name Chemlease.
These may be used alone or in combination.

These silane release agents are low-viscosity liquids diluted with a solvent. Since it is uniformly dispersed in the coating film, transfer to the prepreg hardly occurs even when applied to an aluminum intermediate plate and subjected to a multi-stage hot press.

Although the alkyd-modified silicone resin itself has excellent release performance, the alkyd-modified silicone resin peels more heavily than a silicone resin having only a non-modified polysiloxane skeleton. By adding a silane release agent, without impairing the excellent durability of the alkyd-modified silicone resin,
Only the peeling force can be improved.

The amount of the silane-based release agent to be added is usually 5 to 100 parts by mass of the alkyd-modified silicone resin.
More preferably, it is 50 parts by mass. Depending on the prepreg processing conditions (temperature, pressure, holding time, etc. applied to the aluminum substrate and release layer coating) during multi-stage hot pressing, the optimum value of the addition amount changes, but under general processing conditions, As long as the amount is within the range of 5 to 50 parts by mass, there is almost no risk that the silane-based release agent component is transferred to the prepreg while exhibiting excellent release performance. 5 silane release agent components
When the amount is less than the parts by mass, it may not contribute much to the improvement of the release performance of the coating film. In addition, the silane-based release agent component contains 50
If the amount is at least part by mass, the silane-based release agent component may be transferred to the prepreg.

Incidentally, the release layer based on the alkyd-modified silicone resin is usually added with other components in many cases. For example, a curing reaction catalyst is added. As a curing reaction catalyst, for example, organotin (trade name; CA
T-PS80, manufactured by Shin-Etsu Chemical Co., Ltd.). Other examples include salts of fatty acids such as zinc, lead, and cobalt. The addition amount is preferably 1 to 3% by mass.

The thickness of the release layer is 4 to 2 as a thickness after drying.
Desirably, it is 0 μm. If the thickness of the release layer is small,
The rolling roughness on the surface of the aluminum sheet cannot be canceled, and a pattern (rolled line) due to the rolling roughness may appear on the prepreg. Conversely, if the thickness of the release layer is too large, peeling or cracking of the release layer due to impact may easily occur, which may increase the cost. Therefore, the thickness of the release layer is preferably 4 to 20 microns. Within this range, the surface roughness of the aluminum thin plate can be canceled and the coating film is less likely to crack. Incidentally, when it is difficult to control the film thickness only by adjusting the coating equipment, the paint may be diluted with a solvent to lower the viscosity as necessary.

Examples of the solvent used for controlling the film thickness include toluene, xylene, methyl ethyl ketone (MEK) and the like. The amount of solvent used is 0 to 100
Parts by weight are preferred.

The hardness of the release layer is preferably a durometer A scale hardness (based on JIS. K6253) of 70.
It is good to be above. It is preferable that the hardness is 70 or more in durometer A scale hardness because plastic deformation hardly occurs due to repeated press stress and deterioration with time such as creep hardly occurs. In general, if it is 70 or more, it approaches not the rubber-like property but the high elastic mechanical property of the hard resin. When the scale is over, the hardness of the release layer is measured by a durometer D scale, and the upper limit may be any range as long as the release layer is too hard to cause cracks when pressed. Here, the durometer D
It is convenient if the scale hardness is 90 or less.

The aluminum intermediate plate A of the present embodiment is intended to be used repeatedly about five times (or more). Therefore, the release layer 2 is also required to withstand about five (or more) repeated uses. The heat resistance of the release layer 2 is as follows.
It is required to withstand a temperature of 170 to 200 ° C. in a multi-stage press. In this regard, in the case of the release layer 2 described above,
Such demands can be met.

Hereinafter, a method of manufacturing the aluminum intermediate plate A will be described. The coating film baking machine may be an apparatus capable of heating at a substrate temperature of 200 ° C. or more for 3 minutes or more. Generally, a method used for drying and curing of a paint can be widely used. It is not necessary to control the atmosphere in the drying furnace.

For the aluminum intermediate plate A (release layer 2), for example, an alkyd-modified silicone resin and a silane-based release agent are mixed at a predetermined ratio, and this mixed solution is placed on an aluminum thin plate 1 having a predetermined size. It is obtained by applying the film so as to be thick and performing a heat treatment.

The method of applying the release layer 2 may be any method generally used for coating the surface of a thin metal plate, such as a roll coating method, a gravure coating method, a reverse coating method, a bar coating method or a spraying method. and so on. In addition, by performing heat treatment on the coating film, 3
A three-dimensional network structure is formed, and an aluminum intermediate plate A (an aluminum intermediate plate A for manufacturing a printed circuit board) covered with the strong release layer 2 is obtained.

Next, an example of a method of using the aluminum intermediate plate A thus obtained will be described. Aluminum intermediate plate A
The prepreg P is sandwiched from above and below instead of the conventional stainless steel mirror plate and release film in the multi-stage press.

More specifically, as shown in FIG.
, aluminum intermediate plate A, prepreg P, aluminum intermediate plate A, prepreg P,.
(The number of stages based on the prepreg P), and stacked in a sandwich shape (hereinafter, the stacked product is referred to as a “laminate”).
Finally, the hot plate 10u is placed on the uppermost aluminum intermediate plate A. As described above, in the multi-stage press, the prepreg P has the aluminum intermediate plate A on both sides.
Between the release layers 2. By the way, in this figure,
One printed circuit board is manufactured from three prepregs P.

Then, the laminate is heated from above and below and heated for about 2 to 3 hours. The pressure to be applied is about 30
６０60 × 10 ⁵ Pa. In addition, hot plates 10u and 10d
Is 170-200 ° C. Due to this pressurization and heating, the epoxy resin of the prepreg P is thermoset (forms a three-dimensional network structure by crosslinking) to form a strong printed board. After pressing and heating, the laminate is disassembled and cured,
And take out the flat printed circuit board. In addition, since the aluminum intermediate plate A is based on the aluminum thin plate 1 having excellent mechanical strength, it can be used repeatedly.

As described above, (1) aluminum intermediate plate A
(A) Since the aluminum sheet 1 having excellent mechanical strength is used as a base material, there is little deterioration, and (b)
The release layer 2 has excellent strength and releasability due to the alkyd-modified silicone resin to which the silane release agent is added,
Repetitive use is possible by such as. (2) Regarding work labor, aluminum is lightweight, so it is easy to handle and work can be performed easily. Further, (3) With regard to the throughput per press, aluminum is lightweight and has a good thermal conductivity, so that the throughput per press can be about 1.5 times that of the prior art. And (4)
Regarding the processing time per press, since aluminum has a high thermal conductivity, the processing time per press can be reduced to about 2/3 as compared with the related art.

[0054]

Next, the present invention will be described in more detail by way of examples. Note that the present invention is not limited to the present embodiment. Table 1 shows the manufacturing conditions and the results of the evaluation tests of the aluminum intermediate plates of the examples and the comparative examples.

[Example 1] (1) Aluminum substrate As a thin plate for an aluminum intermediate plate, material 5182-H3 was used.
8. An aluminum thin plate having a plate thickness of 0.4 mm was prepared, and the painted surface was previously subjected to alkaline degreasing and washing before use.

(2) Paint Composition A release layer paint having the following composition was prepared. Alkyd-modified silicone resin (trade name: X62-9027, manufactured by Shin-Etsu Chemical Co., Ltd.) 100 parts by mass Diluent solvent (toluene) 50 parts by mass Curing catalyst (trade name: CAT-PS80, manufactured by Shin-Etsu Chemical Co., Ltd.) 2 .5 parts by mass

30 parts by mass of a silane-based release agent (trade name: Chemlease RC-1, manufactured by Chemlease Inc) First, a predetermined amount of toluene was added to an alkyd-modified silicone resin, and the mixture was stirred, mixed and diluted until it became uniform. Thereafter, a predetermined amount of a curing catalyst was added, and the mixture was further stirred until the concentration became uniform.

(3) Formation and baking of coating film The compounded paint prepared in (2) was applied on an aluminum thin plate with a bar coater. At that time, the thickness of the coating film was adjusted so that the thickness of the release layer after curing was about 6 μm. afterwards,
A heat treatment was performed in a dry furnace for 3 minutes while controlling the temperature so that the temperature of the aluminum substrate became 250 ° C., thereby curing the release layer. Durometer A scale hardness was measured. The hardness was (80).

(4) Hot Press A prepreg press test was performed using the aluminum intermediate plate obtained in (3). The prepreg specifications and press conditions are described below. Test prepreg; (Product name: ES-330 manufactured by Risho Kogyo Co., Ltd.)
5) Prepreg dimensions: 200 mm x 200 mm x 0.1 mm Press temperature; 170 ° C Press pressure; 40 x 10 ⁵ Pa Press pressure holding time; 40 minutes / time

(5) Performance Evaluation The performance of the aluminum intermediate plate was evaluated based on the quality of the formed prepreg. The evaluation items are as follows. (A) Releasability (whether peeling when removing the prepreg after pressing is sufficiently light). (B) Surface smoothness and gloss (visual judgment). (C) Paintability (whether or not the release layer component has migrated is determined by repelling the oil-based ink).

The aluminum intermediate plate as a test object was subjected to a repeated and repeated press test until any one of these items was disqualified, and the durability was evaluated by the number of uses. The results are shown in Tables 1 and 2.

[0062]

[Table 1]

[0063]

[Table 2]

The intermediate plate of this example exhibited performance satisfying all of the above (a), (b) and (c) up to eight repetitive uses.

Example 2 The procedure of Example 1 was repeated except that the addition amount of the silane-based release agent of Example 1 was changed to 3 parts by mass. In the same manner as in Example 1, the hardness of the release layer itself was measured by durometer A scale hardness. The hardness was (80). Other results are shown in Tables 1 and 2. Although the repeated use performance of the aluminum intermediate plate was inferior to the case of Example 1 in which no silane-based release agent was added, the intended five times could be secured.

Example 3 The procedure of Example 1 was repeated except that the amount of the silane-based release agent added was 60 parts by mass. In the same manner as in Example 1, the hardness of the release layer itself was measured by durometer A scale hardness. Hardness is (80)
was. Other results are shown in Tables 1 and 2.

The release performance of the aluminum intermediate plate was remarkably improved. The transfer of the release component to the prepreg was observed, and the product obtained had slightly poor paintability as compared with Examples 1 and 2.

[Comparative Example 1] A coating composition prepared with the following composition was used as a release layer paint, and the same procedure as in Example 1 was carried out except that no silane-based release agent was contained. Alkyd-modified silicone resin (trade name: X62-9027, manufactured by Shin-Etsu Chemical Co., Ltd.) 100 parts by mass Diluent solvent (toluene) 50 parts by mass Curing catalyst (trade name: CAT-PS80, manufactured by Shin-Etsu Chemical Co., Ltd.) 2 0.5 parts by mass The hardness of the release layer itself was measured using a durometer A scale hardness in the same manner as in Example 1. The hardness was (80). Other results are shown in Tables 1 and 2.

The intermediate plate of this comparative example shows performance satisfying all of the above (a), (b) and (c) up to three repetitive uses, and the releasability of (a) from the third time Decreased.

[Comparative Example 2] A coating composition prepared with the following composition was used as a release layer coating composition. Addition reaction type silicone resin (trade name; KS778, manufactured by Shin-Etsu Chemical Co., Ltd.) 100 parts by mass Diluent solvent (toluene) 300 parts by mass Curing catalyst (trade name: CAT-PL-8, manufactured by Shin-Etsu Chemical Co., Ltd.) 5 parts by mass The hardness of the release layer itself was measured by durometer A scale hardness in the same manner as in Example 1. The hardness was (40). Other results are shown in Tables 1 and 2.

In the intermediate plate of the present comparative example, at the baking temperature of 250 ° C., the curing of the coating film did not sufficiently proceed, and the releasability of the evaluation item (a) was sufficient, but after the first use. Transfer of the release component to the prepreg was observed, and repelling of the oil-based ink was remarkable on the surface of the prepreg.

[Comparative Example 3] A coating composition prepared with the following composition was used as a release layer coating composition. 1. Epoxy-modified silicone resin (trade name: ESI001N, manufactured by Shin-Etsu Chemical Co., Ltd.) 100 parts by mass Diluent solvent (toluene) 50 parts by mass Curing catalyst (trade name: CAT-PS80, manufactured by Shin-Etsu Chemical Co., Ltd.) 5 parts by mass The hardness of the release layer itself was measured by durometer A scale hardness in the same manner as in Example 1. The hardness was (80). Other results are shown in Tables 1 and 2. In the intermediate plate of this comparative example, the releasability of the evaluation item (a) was insufficient, and the adhesion of the prepreg to the intermediate plate was remarkable from the second use.

Comparative Example 4 As a release layer coating material, only a silane-based release agent (trade name: Chemlease RC-1, manufactured by Chemlease Inc) was applied to an aluminum thin plate, and a test was performed in the same manner as in Example 1. Other results are shown in Tables 1 and 2. Evaluation items (a) The releasability and (c) the non-migratory property of releasability were sufficient, but the release layer was extremely thin, so that the rolling flaws on the surface of the aluminum sheet could not be sufficiently covered. Regarding items (b), the scratches were transferred to the prepreg, and the gloss was extremely poor. Here, the measurement was impossible because the release layer was too thin.

In this embodiment, when measuring the hardness of each release layer, the release layer is too thin, so that a thick resin cured product (1 to 6 mm thick) is separately cast on a petri dish. The measured value of the bulk body obtained in this way was used.

[0075]

The aluminum intermediate plate for manufacturing a printed circuit board according to the present invention has a release layer based on an alkyd-modified silicone resin for manufacturing a resin-based printed circuit board. Since a silane-based release agent is contained as a release force adjusting agent, the material is inexpensive, and it is easy to add other necessary components.
It has excellent release properties in the middle temperature range of 200 ° C., has good handling properties, and can be used repeatedly. In addition, when the silane-based release agent is contained in the range of 5 to 50 parts by mass, particularly excellent release performance is exhibited.

Further, since the aluminum intermediate plate is made of a thin aluminum plate, it has high mechanical strength, and since the coating film hardness is relatively high, the printed surface of the prepreg is smoothly finished to give good gloss.

Further, at the time of manufacturing the coating of the aluminum intermediate plate,
Almost no solvent is required, the thickness can be easily controlled, and a film having a thickness of several microns or more can be obtained.
Therefore, even if the aluminum substrate is scratched, if it is small, it can be canceled in a considerable range in performance.

In the production of the aluminum intermediate plate, since a phase separation hardly occurs in the components of the release layer, it is not necessary to pay special attention at the time of including the resin or at the time of coating, and a qualitatively uniform coating film can be easily obtained. be able to. 250 ° C baking temperature
Because it can be processed in the general paint drying temperature range of about
An excellent release layer can be formed very easily.

When the mixing ratio of the silane-based release agent is 5 to 50 parts by mass with respect to the alkyd-modified silicone resin, the mixing ratio of both is particularly moderate. It exhibits excellent release performance, and has no danger of the silane-based release agent component being transferred to the prepreg, so that it can be used more times.

The thickness of the release layer of the aluminum intermediate plate is 4
When the thickness is about 20 μm, even if the aluminum substrate has scratches of about several microns, it can be sufficiently repaired, and a high-quality printed circuit board can be stably manufactured.

When the release layer of the aluminum intermediate plate has a durometer A scale hardness of 70 or more, it is difficult to produce wrinkles and the like on the release layer at the time of manufacturing a printed circuit board. It can be repeated many times.

The aluminum intermediate plate was pressed at a pressing temperature of 200
Under a condition of not more than 0 ° C. and a pressing pressure of not more than 80 × 10 ⁵ Pa, repetitive use of at least 5 times or more is possible.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of an aluminum intermediate plate for manufacturing a printed circuit board.

FIG. 2 is a perspective view illustrating a multi-stage press using an aluminum intermediate plate for manufacturing a printed circuit board.

FIG. 3 is a perspective view illustrating a general multi-stage press of a prepreg.

[Explanation of symbols]

 A Aluminum intermediate plate for printed circuit board production P Prepreg 1 Aluminum thin plate 2 Release layer 10u, 10d Hot plate 51 Stainless steel mirror plate 52 Release film

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 83/06 H05K 3/00 L H05K 3/00 C08K 5/54 (72) Inventor Eiichiro Yoshikawa Kobe, Hyogo Prefecture 1-5-5 Takatsukadai, Nishi-ku, Kobe, Japan Kobe Steel, Ltd.Kobe Research Institute (72) Inventor Yasuhiro Okamura 260, Roppo-cho, Inage-ku, Chiba-shi, Chiba Pref. Tatsuo Ono 260, Roppo-cho, Inage-ku, Chiba-shi, Chiba Prefecture Inside San Aluminum Industry Co., Ltd. (72) Inventor Hiroshi Kawai 260, Roppo-cho, Inage-ku, Chiba City, Chiba Prefecture F-term (reference) 4F100 AB10A AH06B AK44B AK52B AL06B BA02 CA17B CA30B CC00 EH46 EJ08 EJ42 GB43 JK12B JL05 JL14B YY00B 4J002 CP051 CP151 EX006 FD166 GQ00 5E346 AA02 AA12 AA22 AA38 AA51 CC01 CC04 CC08 CC09 DD02 EE02 EE09 GG28 HH31

Claims (4)

[Claims] 1. An aluminum intermediate plate for manufacturing a printed circuit board, comprising: an aluminum thin plate; and a release layer based on an alkyd-modified silicone resin formed on one or both surfaces of the aluminum thin plate. An aluminum intermediate plate for manufacturing a printed circuit board, comprising a silane-based release agent as a release force adjusting agent. 2. The print according to claim 1, wherein the mixing ratio of the silane-based release agent to the alkyd-modified silicone resin is 5 to 50 parts by mass with respect to 100 parts by mass of the alkyd-modified silicone resin. Aluminum intermediate plate for substrate production. 3. The aluminum intermediate plate for manufacturing a printed circuit board according to claim 1, wherein said release layer has a thickness of 4 to 20 μm. 4. The aluminum intermediate plate according to claim 1, wherein the hardness of the release layer is 70 or more in durometer A scale hardness.