JP2001326319A - Antenna element integration type high-frequency circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact, inexpensive antenna element integration type high-frequency circuit module. SOLUTION: This antenna element integration type high-frequency circuit module is provided with a substrate having a dielectric layer and a conductor layer where at least an antenna element is formed, and a high-frequency circuit module that includes at least one semiconductor device and is mounted to the substrate. The substrate is composed of a first conductor layer where the antenna device is provided, a second conductor layer where a grounding electrode is provided, a third conductor layer where a plurality of wirings is provided, a first dielectric layer that is provided between the first conductor layer and the second conductor layer, and a second dielectric layer that is provided between the second conductor layer and the third conductor layer. The high-frequency circuit module is mounted on the second dielectric layer or the third conductor layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency circuit module integrated with an antenna element, and more particularly to a high frequency circuit module integrated with an antenna element used in a communication terminal such as a wireless LAN or an intelligent transportation system or a base station. .

[0002]

2. Description of the Related Art At present, wireless LANs, intelligent transport systems (ITS), and the like
Various services using radio in the Hz band are being studied. In order to provide these services with versatility, it is necessary to provide high-performance, inexpensive and small-sized communication terminals. In particular, for the purpose of miniaturization, a structure in which an antenna portion and a high-frequency circuit portion are integrated is disclosed in, for example,
No. 42528 (Title of Invention; High-frequency Package)
Is disclosed. The publication (Japanese Unexamined Patent Publication No. 8-42528)
19, an antenna circuit board A and a high-frequency circuit board B are provided as shown in FIG.

The antenna circuit board A has a first dielectric substrate 62 in which an antenna element 63 and a high-frequency line 64 for supplying excitation power to the antenna element 63 are provided. It is formed. The high-frequency circuit board B is
It has a second dielectric substrate 67, and the second dielectric substrate 6
7, a cavity 68 in which a high-frequency circuit device 69 is housed is formed, and a transmission line 70 for transmitting a signal to the high-frequency circuit device 69 is formed. The antenna circuit board A and the high-frequency circuit board B are laminated and integrated, and the high-frequency line 64 of the antenna circuit board A and the transmission line 70 of the high-frequency circuit board B are electrically connected by electromagnetic coupling.

[0004]

In the above publication, the antenna circuit board A and the high-frequency device circuit board B have substantially the same area. However,
In a frequency band such as a microwave band, the antenna circuit board A
Since the area of the high-frequency device can be made smaller than that of the high-frequency circuit board, the high-frequency circuit board B side has an unnecessary area in the one described in the above publication, which leads to an increase in the cost of the high-frequency package. There was a problem. Further, in the above-mentioned publication, a method is described in which the antenna circuit board A and the high-frequency circuit board B are separately manufactured and then bonded with an adhesive. Via hole 7 with B
4, the connection of the via hole becomes difficult. Therefore, in the above-mentioned publication, as a more desirable method, the molded body of the antenna circuit board A before firing and the molded body of the high-frequency circuit board B before firing are laminated and integrated, and then simultaneously fired. And a method for producing the high-frequency circuit board B.

However, in this method, since the high-frequency device is mounted after the antenna circuit board A and the high-frequency circuit board B are prepared, there is a problem that workability is poor. The present invention has been made in order to solve the problems of the prior art, and an object of the present invention is to:
It is an object of the present invention to provide a technology capable of reducing the size and the price of an antenna element-integrated high-frequency circuit module. The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0006]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows. That is, the present invention provides an antenna element-integrated high-frequency circuit module including a substrate having a dielectric layer, at least a conductor layer on which an antenna element is formed, and at least one semiconductor element. And a circuit module. In a preferred embodiment of the present invention, the high-frequency circuit module forms a part of a high-frequency circuit that supplies excitation power to the antenna element and receives reception power from the antenna element, Includes a filter circuit for removing unnecessary waves, wherein the filter circuit is configured by a filter element mounted on the substrate at a position different from the high-frequency circuit module.

[0007] In a preferred embodiment of the present invention,
The substrate includes a first conductor layer on which the antenna element is provided, a second conductor layer on which a ground electrode is provided, a third conductor layer on which a plurality of wirings are provided, the first conductor layer, A first dielectric layer provided between the first dielectric layer and the second conductor layer;
The high-frequency circuit module includes a second dielectric layer provided between the second conductor layer and the third conductor layer, and the terminal portion is electrically and mechanically connected to a part of the wiring. And the antenna element and a part of the wiring are mounted on the second dielectric layer or the third conductor layer, and are connected to the first dielectric layer and the second dielectric layer. The ground electrode and a part of the wiring are electrically connected to each other by a via hole formed in a second dielectric layer. I do.

Further, in a more preferred embodiment of the present invention, the thickness of the second dielectric layer is smaller than the thickness of the first dielectric layer. In a preferred embodiment of the present invention, at least a surface of the high-frequency circuit module opposite to a surface facing the substrate is covered with a resin layer or a protective member.

According to the above means, after the substrate including the antenna element and the high-frequency circuit module are separately manufactured,
It is possible to provide a low-cost high-frequency circuit module that can be integrated, so that the high-frequency circuit module can be realized with only the required area size regardless of the size of the substrate including the antenna element. Can be. According to the means, for example, high-frequency circuit module, glass ceramic packages and MMIC (M onolithic M icro
wave I ntegrated C ircuit) are composed of a chip, and MMIC chip size package stacking,
The size can be large enough to accommodate wiring for connection between chips. That is, it is not necessary to make the package as large as the substrate including the antenna element, and the workability when stacking the MMIC chip on the package can be improved.

According to the above means, since the high-frequency circuit module and the substrate including the antenna element can be separately designed, the degree of freedom in the design of the high-frequency circuit module and the degree of freedom in the antenna design can be improved. In addition, the easiness of the design change can be improved. In addition, by variously combining the substrate including the antenna element and the high-frequency circuit module, it is possible to realize an antenna element-integrated high-frequency circuit module having various performances at a low price.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, components having the same function are denoted by the same reference numerals, and repeated description thereof will be omitted. [First Embodiment] FIG. 1 is a sectional view showing a sectional structure of a main part of an antenna element integrated type high frequency circuit module according to a first embodiment of the present invention. The present embodiment is an antenna element-integrated high-frequency circuit module for transmitting and receiving a 5 GHz-band circularly polarized signal. As shown in FIG. 1, the antenna element-integrated high-frequency circuit module according to the present embodiment includes a rectangular substrate 20, a high-frequency circuit module 21 configured using an MMIC, and a discrete component 22. The substrate 20 is formed of three conductor layers made of copper foil and two dielectric layers (26, 27), and each conductor layer sequentially forms an antenna element (or a radiation element; , Simply referred to as a patch.) 23, a ground electrode 24, and a wiring 25.

The third conductor layer includes a plurality of wirings 25, that is, a power supply line to the high-frequency circuit module 21, a wiring for connecting the high-frequency circuit module 21 to the discrete component 22 and an external circuit, and a patch 23 to the high-frequency circuit module. Wiring and the like for connecting the circuit module 21 are formed. The patch 23 and a part of the wiring 25 are
Connected by A part of the pattern formed on the same conductor layer as the wiring 25 and the ground electrode 24 are electrically connected by a via hole 29, and a part of the pattern formed on the same conductor layer as the wiring 25 is connected to the ground electrode. 24 is configured to have the same potential.

In the present embodiment, the thickness of the dielectric layer 26 constituting the substrate 20 is different from the thickness of the dielectric layer 27. In the present embodiment, the thickness of the dielectric layer 26 is about 1.5 mm, and the thickness of the dielectric layer 27 is about 0.4 mm. The thickness of the dielectric layer 26 and the thickness of the dielectric layer 27 are not limited to this, and the thickness of the dielectric layer 26 may be appropriately changed depending on the band, gain, and the like required for the antenna. good. Further, the thickness of the dielectric layer 27 may be appropriately changed so that the entire thickness of the antenna element integrated type high frequency circuit module or the width of the wiring 25 becomes a desired value.

FIG. 2 is a top view of the antenna element-integrated high-frequency circuit module according to the present embodiment as viewed from the wiring 25 side. In FIG. 2, a via hole connecting a part of the pattern formed on the same conductor layer as the wiring 25 and the ground electrode 24 is omitted. FIG. 1 is a cross-sectional view showing a cross-sectional structure taken along the line CD shown in FIG. FIG. 3 is a block diagram showing a circuit configuration of the antenna element-integrated high-frequency circuit module according to the present embodiment.
As shown in the drawing, the antenna element-integrated high-frequency circuit module according to the present embodiment includes a patch (radiating element) 23, a switch 101, a low-noise amplifier 10
2, power amplifier 103, bandpass filter (104,
105), mixers (106, 107), multiplier 108,
A phase locked loop (PLL) module 109 and a crystal oscillator 110 are provided. The transmission signal TS is transmitted to the mixer 10
7, and the received signal RS is supplied to the mixer 1
06 is output from one terminal.

The portion within the thick line frame shown in FIG. 3 constitutes the high-frequency circuit module 21. FIG. 4 is a schematic diagram for explaining the high-frequency circuit module 21 of the present embodiment. The high-frequency circuit module 21 according to the present embodiment includes an MMIC manufactured using a GaAs semiconductor in a package 121 manufactured using a multilayer substrate using glass ceramics.
Chips 120 are stacked. Where MMI
The C chip 120 includes the switch 101, the low noise amplifier 10
2. Construct the power amplifier 103, the mixers (106, 107), the multiplier 108, and the like. These MMIC chips 1
Wiring and the like for connecting between the MMIC chips 120 are provided in a glass ceramics package.
Are connected to wires provided in the package 121 by wire bonding. As described above, in the present embodiment, the size of the package 121 is
The size can be large enough to accommodate the IC chip 120 and wiring for connection between the chips. That is, the MMIC chip 120 does not need to be formed into a package 121 having the size of a substrate including a patch.
Good workability when laminating to

The band-pass filters (104, 105), the phase-locked loop (PLL) module 109, and the crystal oscillator 110 other than those inside the thick frame shown in FIG. These components are connected by wiring 25. Further, the portion where the wiring 25 crosses is connected using the jumper wiring 18. The connection terminal 19 for connecting the antenna element-integrated high-frequency circuit module to an external circuit is shown in FIG.
As shown in the figure, they are collectively arranged on one side of the substrate 20.
With such a structure, an antenna element-integrated high-frequency circuit module having good workability and not deteriorating aesthetic appearance can be manufactured. In FIG. 2, the discrete components 22 arranged on both sides of the high-frequency circuit module 21 are the band-pass filters (104, 105) shown in FIG. 3, but in the present embodiment,
As shown in FIG. 5, the bandpass filters (104, 10
5) can be built in a high-frequency circuit module.

As filters for removing unnecessary waves, general-purpose discrete parts are used instead of the filters shown in FIGS.
A distributed constant type filter circuit as shown in FIG. FIG. 6 is a top view showing a planar antenna using a distributed constant type filter circuit, and FIG. 7 is a diagram showing AB shown in FIG.
It is a principal part sectional view which shows the cross-section along the line. The planar antenna shown in FIG. 6 includes a patch 1, a ground conductor 2, and a feed line 3.
, And two layers of dielectric substrates (8, 9) provided between the conductors. The power supply wiring 3 and the receptacle 10 are connected by solder,
The power supply to the patch 1 is performed by a power supply via hole 4 provided between the power supply wiring 3 and the patch 1.
In the planar antenna shown in FIG. 6, the power supply wiring 3 has a transmission line 6 extending beyond the via hole 4, and the tip of the transmission line 6 is connected (short-circuited) to the ground conductor 2 by the via hole 5. I have.

Here, when λo is the free space wavelength of the used center frequency of the radiation wave radiated from the patch 1, the length (L) of the transmission line 6 is set to a length corresponding to λo / 4. The length corresponding to λo / 4 does not mean that the length (L) of the actual transmission line 6 is λo / 4, but the length (L) of the actual transmission line 6 is (L = α × λo / 4; α is the wavelength shortening rate) taking into account the wavelength shortening rate determined by characteristics such as the dielectric constant of the dielectric substrate.
It has become. That is, this transmission line 6 is a so-called １ ／
It constitutes a wavelength short stub. When the short stub 7 is provided at the end of the via hole 4, the impedance viewed from the via hole 4 becomes infinite at the center frequency used. Therefore, by providing the short stub 7 at the tip of the via hole 4 as in the planar antenna shown in FIG. The power supply efficiency of power can be improved, and unnecessary radiation from the power supply wiring 3 can be reduced.

The short stub 7 has a length of one.
For a frequency that does not correspond to ４ wavelength, this corresponds to the existence of a wiring having a finite length. Therefore, the excitation power of a frequency other than the use center frequency of the patch 1 is less likely to be transmitted to the patch 1. In particular, if the length of the transmission line 6 is about 1
/ 2 wavelength, that is, a signal having a frequency twice as high as the center frequency used by the patch 1, the via hole 4
Is seen as a short circuit (in other words, the impedance seen from the via hole 4 becomes zero), so that the excitation power is not transmitted to the patch 1. Thus, short stub 7
Acts as a filter for unnecessary frequencies, so that harmonics and the like from peripheral circuits can be removed without providing a separate filter. By employing the short stub 7 shown in FIGS. 6 and 7 in the present embodiment, a higher performance antenna element integrated high frequency circuit module can be realized.

In the high frequency circuit module with an integrated antenna element according to the present embodiment, for example, the high frequency circuit module 21 shown in FIG. 4 has a dielectric layer of the substrate 20 such that the surface on which the MMIC chip 120 is mounted is on the front side. 27,
Alternatively, on a pattern formed on the same conductor layer as the wiring 25,
The terminal portion (recess on the side surface of the high-frequency circuit module shown in FIG. 4) 122 is mounted so as to be connected to a part of the wiring 25. In general, in such a structure, the surface of the MMIC chip 120 is usually covered with a resin or a protection member (cap) in order to protect the MMIC chip 120 and take measures against moisture. Hereinafter, an example of protection of the MMIC chip 120 and measures against moisture in the antenna element-integrated high-frequency circuit module according to the present embodiment will be described with reference to FIGS.

The configuration shown in FIG. 8 is obtained by covering the surface of the high-frequency circuit module 21 on which the MMIC chip 120 is mounted with a resin layer 130. The configuration shown in FIG.
The surface of the high-frequency circuit module 21 on which the MMIC chip 120 is mounted is covered with a resin layer 130 and further covered with a protective member (lid) 131. Although not shown, the high-frequency circuit modules shown in FIGS. 8 and 9 are mounted on the dielectric layer 27 of the substrate 20 or on the pattern formed on the same conductor layer as the wiring 25 in the state shown in each figure. You.
The configuration shown in FIG. 10 is such that the entire surface of the dielectric layer 27 of the substrate 20 on which the high-frequency circuit module 21 is mounted is covered with a protective member (lid) 131, and the configuration shown in FIG. The surface of the circuit module 21 on which the MMIC chip 120 is mounted is covered with a resin layer 130,
The entire surface of the dielectric layer 27 of the substrate 20 on which the high-frequency circuit module 21 is mounted is covered with a protective member (lid) 131. In the configuration shown in FIG. 11, the resin layer 130 may be applied to the entire surface of the dielectric layer 27 of the substrate 20 on which the high-frequency circuit module 21 is mounted, and the protective member (lid) 131 may be omitted. .

In this embodiment, a package 121 using glass ceramics and an MMI using GaAs semiconductors are used.
Although the high-frequency circuit module 21 is configured using the C chip 120, it goes without saying that the materials of the package 121 and the MMIC chip 120 are not limited to these. Even if the package 121 is made of a glass epoxy substrate or a general-purpose resin substrate, or if the MMIC chip 120 is made of a semiconductor material other than GaAs,
Obviously, the above-described functions and effects can be obtained. In the present embodiment, the area of the high-frequency circuit module 21 is about one tenth of the area of the substrate 20, and the high-frequency circuit module 21 can be manufactured at low cost. Can be realized at a low price.

FIGS. 12 and 13 are views showing an example of the shape of the patch 23 according to the present embodiment. FIG.
2. In FIG. 13, P0 is a feeding point. In the present embodiment, a circularly polarized antenna is realized by using a patch 23 in which a degenerate separation element is loaded in a square or circular pattern. Thus, the patch 2 of the present embodiment
Reference numeral 3 denotes a circularly polarized antenna element, but if it is desired to transmit and receive a linearly polarized radio wave, the patch 23 of the substrate 20 may be reconfigured for linearly polarized wave. The same can be used. As described above, in the present invention, since the substrate 20 and the high-frequency circuit module 21 are separately manufactured and then integrated, a common high-frequency circuit module can be used for manufacturing an antenna element integrated high-frequency circuit module for various uses. As a result, there is an advantage that the antenna element-integrated high-frequency circuit module can be provided at a low price.

[Second Embodiment] FIG. 14 is a cross-sectional view showing a cross-sectional structure of a main part of an antenna element-integrated high-frequency circuit module according to a second embodiment of the present invention. In the present embodiment, as shown in FIG. 15, the shape of the patch 23 is different from that of the above-described embodiment. FIG. 15 is a diagram illustrating an example of the shape of the patch 23 according to the present embodiment. The patch 23 according to the present embodiment has two points for feeding power to the patch 23 from two feeding points (P1, P2). A circularly polarized antenna is realized by feeding power. In the present embodiment, the high-frequency circuit module 21 may have the same configuration as that of the above-described first embodiment, and this embodiment may have substantially the same configuration as that of the above-described first embodiment. However, it differs from the first embodiment in the following points. Also in the present embodiment, the substrate 30 is composed of three conductor layers and two dielectric layers, but the dielectric layer 26 and the dielectric layer 31 have different electrical characteristics. In particular, the dielectric layers 26 and 31 have different relative dielectric constants, and the dielectric layer 31 has a higher relative dielectric constant.

In this embodiment, in order to realize a circularly polarized antenna with two-point feeding, two via holes (32, 33) serving as feeding points of the patch 23 and two high-frequency circuit modules 21 are connected. Need to have a 90 ° phase difference between the wirings. Therefore, it is necessary to form a wiring in which one is longer than the other by an amount corresponding to a quarter wavelength. Therefore, in the wiring 25 of the present embodiment, a wiring of a quarter wavelength is further formed on the wiring pattern of the first embodiment shown in FIG. When a quarter-wavelength wiring is formed on the dielectric layer 31 using a copper foil, the length of the wiring varies depending on the relative dielectric constant of the dielectric layer 31, and the longer the relative dielectric constant, the longer the wiring pattern becomes. It becomes shorter. Therefore, in the present embodiment, the dielectric layer 31 having a large relative dielectric constant is used in order to shorten the wiring pattern of the quarter wavelength and reduce the size of the antenna element integrated high-frequency circuit module. On the other hand, the electrical characteristics of the antenna are generally better when the relative dielectric constant of the dielectric layer 26 is smaller. Therefore, the dielectric layer 26 having a lower relative dielectric constant than the dielectric layer 31 is used.

As described above, in the present embodiment, the substrate 30
By using the dielectric layer 26 and the dielectric layer 31 having different relative dielectric constants, it is possible to realize a small antenna element-integrated high-frequency circuit module having good antenna characteristics. In the present embodiment, although the dielectric properties of the dielectric layer 26 and the dielectric layer 31 of the substrate 30 are different,
0 is sufficiently large and there is sufficient space for wiring, if the relative permittivity of the dielectric layer 26 and the dielectric layer 31 is equal, or the relative permittivity of the dielectric layer 30 is Needless to say, the dielectric constant may be smaller than 26. The antenna element-integrated high-frequency circuit module according to the present invention, even when the power supply method to the antenna element is changed as in the first embodiment and the present embodiment,
Further, the same high-frequency circuit module 21 can be used even when the dielectric constituting the substrate 30 is changed, and the cost of the antenna element integrated high-frequency circuit module can be reduced by using common components. Can be.

[Third Embodiment] FIG. 16 is a cross-sectional view showing a main part cross-sectional structure of an antenna element-integrated high-frequency circuit module according to a third embodiment of the present invention. In the present embodiment, the substrate 40 is formed of five conductor layers made of copper foil and four dielectric layers (26, 41, 42, 43). The conductor layers are used as a patch 23, a first ground electrode 44, a first wiring layer 45, a second ground electrode 46, and a second wiring layer 47 in this order from the top. In the present embodiment, as shown in FIG. 17, four patches 23 are formed in an array of 2 rows and 2 columns, forming an array antenna. In the present embodiment, the power supply wiring to each patch 23 is formed on the first wiring layer 45 located on the opposite side of the patch 23 with the first ground electrode 44 interposed therebetween. Wiring layer 4
Since the first ground electrode 44 and the second ground electrode 46 exist above and below the fifth patch 5, the radiation from the power supply wiring to each patch 23 formed on the wiring layer 45 radiates from the patch 23.
Can be prevented from being superimposed on the radiation from

In this embodiment, the respective conductor layers are electrically connected by via holes (48, 49, 50, 51). In the present embodiment, the high-frequency circuit module 21, the discrete component 22, and the like are arranged on the second wiring layer 47 or the dielectric layer 43.
These components are connected by wiring formed on the second wiring layer 47. The wiring pattern and the like in the second wiring layer 47 may have the same configuration as in the first embodiment.
In the present embodiment, the power supply wiring to each patch is formed on the first wiring layer 45, but these are formed on the second wiring layer 47 and connected to the high-frequency circuit module 21, the discrete component 22, and the like. It goes without saying that the wiring may be formed in the first wiring layer 45.

In this case, the power supply wiring to each of the patches 23 is formed in the second wiring layer 47, but the high-frequency circuit module 21 and the discrete component 22 are provided so as not to affect the power supply wiring. Need to be placed. Also in this case, the connection terminal 19 for connecting the antenna element integrated high-frequency circuit module and the external circuit is
When formed on the second wiring layer 47 or on the end face of the substrate 40 as shown in FIG. 18, there is an advantage that connection with an external circuit is facilitated. Since the antenna according to the present embodiment is an array antenna including four patches, the area of the substrate 40 is about four times larger than the first and second embodiments. The size of the circuit module 21 may be substantially the same as in the first and second embodiments. Therefore, an inexpensive antenna element-integrated high-frequency circuit module can be realized without requiring an unnecessary area for the high-frequency circuit module 21.

The above is the description of the substrate including the antenna (20, 3).
0, 40), an embodiment in which the same high-frequency circuit module 21 is used to realize a high-performance and low-cost antenna element-integrated high-frequency circuit module has been described. Obviously, it is possible to provide various antenna element integrated type high frequency circuit modules by changing the performance of the high frequency circuit module in the same manner. For example, when a transmitting antenna and a receiving antenna are provided separately, the structure of a substrate including the antenna may be substantially the same, and a high-frequency circuit module having different components may be stacked on each substrate.

As described above, according to the present invention, first, the high-frequency circuit module 21 has only a required area, so that a low-cost antenna element-integrated high-frequency circuit module can be provided. Further, since the antenna element and the high-frequency circuit module 21 can be designed separately, the degree of freedom in designing both can be improved. In addition, an antenna element-integrated high-frequency circuit module having various performances can be realized at a low price. Further, when either the substrate including the antenna element or the high-frequency circuit module 21 is broken, only the broken one needs to be replaced, so that no parts are wasted. As described above, the invention made by the inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and can be variously modified without departing from the gist of the invention. Of course, it is.

[0032]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows. ADVANTAGE OF THE INVENTION According to the antenna element integrated type high frequency circuit module of this invention, size reduction can be achieved, cost can be reduced, and workability can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a cross-sectional structure of a main part of an antenna element-integrated high-frequency circuit module according to a first embodiment of the present invention.

FIG. 2 is a top view of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention, as viewed from a wiring side.

FIG. 3 is a block diagram illustrating a circuit configuration of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention.

FIG. 4 is a schematic diagram for explaining the high-frequency circuit module according to the first embodiment of the present invention.

FIG. 5 is a top view of a modification of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention, as viewed from the wiring side;

FIG. 6 is a top view showing a planar antenna using a distributed constant type filter circuit.

FIG. 7 is a cross-sectional view of a principal part showing a cross-sectional structure along the line AB shown in FIG. 6;

FIG. 8 is a cross-sectional view showing a main part cross-sectional structure of a modification of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention;

FIG. 9 is a cross-sectional view showing a main part cross-sectional structure of a modification of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention;

FIG. 10 is a cross-sectional view showing a main part cross-sectional structure of a modification of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention;

FIG. 11 is a cross-sectional view showing a main part cross-sectional structure of a modification of the antenna element-integrated high-frequency circuit module according to the first embodiment of the present invention;

FIG. 12 is a diagram illustrating an example of the shape of a patch according to the first embodiment of the present invention.

FIG. 13 is a diagram illustrating an example of a patch shape according to the first embodiment of the present invention.

FIG. 14 is a cross-sectional view illustrating a main-portion cross-sectional structure of an antenna element-integrated high-frequency circuit module according to Embodiment 2 of the present invention;

FIG. 15 is a diagram illustrating an example of a patch shape according to the second embodiment of the present invention.

FIG. 16 is a cross-sectional view illustrating a main-portion cross-sectional structure of an antenna element-integrated high-frequency circuit module according to Embodiment 3 of the present invention;

FIG. 17 is a diagram illustrating an example of a patch shape according to the third embodiment of the present invention.

FIG. 18 is a cross-sectional view showing a main part cross-sectional structure of a modification of the antenna element-integrated high-frequency circuit module according to the third embodiment of the present invention.

FIG. 19 is a cross-sectional view of a main part showing a conventional structure in which an antenna part and a high-frequency circuit part are integrated.

[Explanation of symbols]

A: antenna circuit board, B: high-frequency circuit board, P0, P
1, P2 ... feeding point, 1, 23, 63 ... antenna element (patch), 2 ... ground conductor, 3 ... feeding wiring, 4, 5, 28,
29, 32, 33, 48, 49, 50, 51, 74: via hole, 6, 70: transmission line, 7: short stub,
8, 9 dielectric substrate, 10 receptacle, 18 jumper wiring, 19 connection terminal, 20, 30, 40 substrate, 21 high frequency circuit module, 22 discrete component, 24 ground electrode, 25 wiring, 26,27,3
1, 41, 42, 43: dielectric layer, 44: first ground electrode, 45: first wiring layer, 46: second ground electrode, 47
, A second wiring layer, 62, a first dielectric substrate, 64, a high-frequency line, 67, a second dielectric substrate, 68, a cavity,
69 high frequency circuit device, 101 switch, 102
... Low noise amplifier, 103 ... Power amplifier, 104, 105
... bandpass filters, 106, 107 ... mixer, 10
8. Multiplier, 109 ... Phase lock loop (PLL)
Module, 110: Crystal oscillator, 120: MMIC chip, 121: Package, 122: Terminal, 130 ...
Resin layer, 131 ... Protective member (lid).

Claims (5)

[Claims] 1. A substrate having a dielectric layer, a conductor layer on which at least an antenna element is formed, and a high-frequency circuit module including at least one semiconductor element and mounted on the substrate. High frequency circuit module with integrated antenna element. 2. The high-frequency circuit module constitutes a part of a high-frequency circuit that supplies excitation power to the antenna element and receives input power from the antenna element, and the high-frequency circuit removes unnecessary waves. The antenna device-integrated high-frequency circuit module according to claim 1, wherein the filter circuit includes a filter element mounted on the substrate at a different position from the high-frequency circuit module. . 3. The substrate includes: a first conductor layer on which the antenna element is provided; a second conductor layer on which a ground electrode is provided; a third conductor layer on which a plurality of wirings are provided; A first dielectric layer provided between the second conductive layer and the second conductive layer; a second dielectric layer provided between the second conductive layer and the third conductive layer; Wherein the high-frequency circuit module has a terminal portion electrically and mechanically connected to a part of the wiring, and is mounted on the second dielectric layer or the third conductor layer, The antenna element and a part of the wiring are electrically connected by a via hole formed in a first dielectric layer and a second dielectric layer. The ground electrode and a part of the wiring are , Electrically connected by via holes formed in the second dielectric layer. Antenna elements integrated high-frequency circuit module according to claim 1 or claim 2,. 4. The method according to claim 1, wherein the thickness of the second dielectric layer is equal to the first dielectric layer.
4. The method according to claim 3, wherein the thickness is smaller than the thickness of the dielectric layer.
4. The high frequency circuit module with an integrated antenna element according to claim 1. 5. The high frequency circuit module according to claim 1, wherein at least a surface of the high frequency circuit module opposite to a surface facing the substrate is covered with a resin layer or a protective member. Item 2. An antenna element-integrated high-frequency circuit module according to item 1.