JP2001313996A - Damper for speaker, its manufacturing method and speaker device provide with the damper - Google Patents

Damper for speaker, its manufacturing method and speaker device provide with the damper

Info

Publication number
JP2001313996A
JP2001313996A JP2000133426A JP2000133426A JP2001313996A JP 2001313996 A JP2001313996 A JP 2001313996A JP 2000133426 A JP2000133426 A JP 2000133426A JP 2000133426 A JP2000133426 A JP 2000133426A JP 2001313996 A JP2001313996 A JP 2001313996A
Authority
JP
Japan
Prior art keywords
damper
speaker
conductive
resin member
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000133426A
Other languages
Japanese (ja)
Inventor
Shigeru Watanabe
茂 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp, Pioneer Electronic Corp filed Critical Tohoku Pioneer Corp
Priority to JP2000133426A priority Critical patent/JP2001313996A/en
Publication of JP2001313996A publication Critical patent/JP2001313996A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To make a speaker thin in thickness, high in power, stable in strength and low in cost. SOLUTION: The damper for speaker is provided with at least separated electrically conductive damper members. The electrically conductive damper member is manufactured sticking, applying or mixing an electrically conductive material to a resin member to prepair an electrically conductive damper member, them separating and blanking the prepared member into at least two parts, or molding the member.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、スピーカ用ダンパ
ならびにその製造方法および同ダンパを備えたスピーカ
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a speaker damper, a method of manufacturing the same, and a speaker device provided with the damper.

【0002】[0002]

【従来の技術】ダイナミック型スピーカの動作原理は周
知のとおりである。ところで、このダイナミックスピー
カが持つボイスコイルに電力を供給する方法に、錦糸線
を介して行う方法と、ダンパに導電部を設け行う方法の
2種類がある。
2. Description of the Related Art The principle of operation of a dynamic speaker is well known. By the way, there are two methods of supplying power to the voice coil of the dynamic speaker, a method of supplying power through a tinsel wire, and a method of providing a conductive portion in a damper.

【0003】前者を図2に、後者を図3に示す。従来の
スピーカユニットの信号入力配線構造は、図2に示すよ
うに、フレーム13に端子板16を取付けると共に、端
子板16から錦糸線15をコーン振動板14に導き、コ
ーン振動板14面を這わしてボイスコイル12に接続す
るか、あるいは、図3に示すように、ダンパ11に導電
パターンを這わしてボイスコイル12に接続している。
なお、図2、図3において、17は磁気回路部である。
The former is shown in FIG. 2, and the latter is shown in FIG. As shown in FIG. 2, the signal input wiring structure of the conventional speaker unit is such that a terminal plate 16 is attached to a frame 13, a tinsel wire 15 is guided from the terminal plate 16 to a cone diaphragm 14, and the surface of the cone diaphragm 14 is crawled. For example, the voice coil 12 is connected to the voice coil 12 or, as shown in FIG.
2 and 3, reference numeral 17 denotes a magnetic circuit unit.

【0004】図3に示すスピーカにおいて、ダンパ11
は、図4に示すように、ボイスコイル12のボビン部1
2aに接続されるべき内輪部2とフレーム13に取付け
られるべき外輪部3とを連結部4で連結され、内輪部2
の内周端縁2aから連結部4を介して外輪部3の外周部
3aに至るように導電パターン5をプリントしている。
このプリントは、樹脂成形されるダンパに導電材をイン
サート成形するか、あるいは縫い込むことによって得ら
れる。
In the speaker shown in FIG.
Is the bobbin 1 of the voice coil 12 as shown in FIG.
The inner ring portion 2 to be connected to the inner ring portion 2a and the outer ring portion 3 to be attached to the frame 13 are connected by a connecting portion 4,
The conductive pattern 5 is printed from the inner peripheral edge 2a to the outer peripheral portion 3a of the outer ring portion 3 via the connecting portion 4.
This print is obtained by insert-molding or sewing a conductive material into a damper made of resin.

【0005】上述した従来例において、図2に示す例で
は錦糸線が切れやすく、また、コーン振動板やダンパに
接触することが多々あり、薄型化が困難になる。また、
図3に示す例では、導電パターンは、樹脂成形されるダ
ンパに導電材をインサート成形するか、あるいは縫い込
むことによって得ているため、製造コストが高く、ま
た、接合部の強度を上げるのが困難であった。
[0005] In the conventional example described above, in the example shown in FIG. 2, the tinsel wire is apt to be cut and often comes into contact with the cone diaphragm or the damper, making it difficult to reduce the thickness. Also,
In the example shown in FIG. 3, since the conductive pattern is obtained by insert-molding or sewing a conductive material into a resin-molded damper, the manufacturing cost is high and the strength of the joint is increased. It was difficult.

【0006】本発明は上記事情に鑑みてなされたもので
あり、樹脂に導電材を貼り付け、塗布、混合する等して
ダンパ自体を導電材として用い、これを少なくとも2以
上に打ち抜き、あるいは成形することによってスピーカ
の薄型、ハイパワー化を実現し、また、強度の安定、低
コスト化をはかったスピーカ用ダンパならびにその製造
方法および同ダンパを備えたスピーカ装置を提供するこ
とを目的とする。
The present invention has been made in view of the above circumstances, and uses a damper itself as a conductive material by sticking, coating, and mixing a conductive material on a resin, and punching or molding the same into at least two or more. Accordingly, it is an object of the present invention to provide a speaker damper which achieves a thinner and higher-powered speaker, achieves stable strength and lower cost, a method of manufacturing the same, and a speaker device including the damper.

【0007】[0007]

【課題を解決するための手段】上記した課題を解決する
ために請求項1に記載の発明は、少なくとも2つの互い
に分離された導電性ダンパ部材を備えることとした。こ
のことにより、ダンパ自体を導電材として用い錦糸線を
使用せずに済むため、スピーカの薄型、ハイパワー化を
実現することができる。
In order to solve the above-mentioned problems, the invention according to claim 1 includes at least two conductive damper members separated from each other. This eliminates the need to use a tinsel wire by using the damper itself as a conductive material, thereby realizing a thin and high-power speaker.

【0008】請求項2に記載の発明は、振動板を振動さ
せるボイスコイルと、前記振動板とフレームとを連結
し、前記ボイスコイルに入力信号を供給する、少なくと
も2つの互いに分離された導電性ダンパ部材から成るス
ピーカ用ダンパとを備えることとした。このことによ
り、スピーカユニットの信号入力配線構造が簡易化さ
れ、ボイスコイルへの入力がとり易く、作業性が改善さ
れスピーカ組み立てが容易化される。
According to a second aspect of the present invention, there is provided a voice coil for vibrating a diaphragm, and at least two separated conductive coils for connecting the diaphragm to a frame and supplying an input signal to the voice coil. And a speaker damper made of a damper member. This simplifies the signal input wiring structure of the speaker unit, facilitates input to the voice coil, improves workability, and facilitates speaker assembly.

【0009】請求項3に記載の発明は、請求項1または
2に記載のスピーカ用ダンパまたはスピーカ装置におい
て、前記導電性ダンパ部材は、樹脂部材と当該樹脂部材
に貼り合わせた導電材から成ることとした。また、請求
項4に記載の発明は、請求項1または2に記載のスピー
カ用ダンパまたはスピーカ装置において、前記導電性ダ
ンパ部材は、樹脂部材と当該樹脂部材に塗布された導電
材から成ることとした。更に、請求項5に記載の発明
は、請求項1または2に記載のスピーカ用ダンパまたは
スピーカ装置において、前記導電性ダンパ部材は、樹脂
部材と当該樹脂部材に混入された導電材から成ることと
した。このことにより、ダンパ自体を導電材として用い
錦糸線を使用せずに済むため、スピーカの薄型、ハイパ
ワー化を実現することができ、また、導電材のインサー
トや縫込みを不要とするため強度の安定、低コスト化が
はかれる。
According to a third aspect of the present invention, in the speaker damper or speaker device according to the first or second aspect, the conductive damper member is made of a resin member and a conductive material bonded to the resin member. And According to a fourth aspect of the present invention, in the speaker damper or speaker device according to the first or second aspect, the conductive damper member includes a resin member and a conductive material applied to the resin member. did. According to a fifth aspect of the present invention, in the speaker damper or speaker device according to the first or second aspect, the conductive damper member is made of a resin member and a conductive material mixed in the resin member. did. As a result, the damper itself can be used as a conductive material, and the need for a tinsel wire can be eliminated, so that the speaker can be made thinner and higher in power. In addition, since there is no need to insert or sew the conductive material, the strength can be reduced. Stability and cost reduction.

【0010】請求項6に記載の発明は、少なくとも2つ
の互いに分離された導電性ダンパ部材を備えるスピーカ
用ダンパであって、樹脂部材と当該樹脂部材に導電材を
貼り合わせて導電性ダンパ部材を作成する工程と、前記
作成された導電性ダンパ部材を少なくとも2つに互いに
分離して打ち抜き、もしくは成形する工程とを備えるこ
ととした。請求項7に記載の発明は、少なくとも2つの
互いに分離された導電性ダンパ部材を備えるスピーカ用
ダンパであって、樹脂部材と当該樹脂部材に導電材を塗
布して導電性ダンパ部材を作成する工程と、前記作成さ
れた導電性ダンパ部材を少なくとも2つに互いに分離し
て打ち抜き、もしくは成形する工程とを備えることとし
た。請求項8に記載の発明は、少なくとも2つの互いに
分離された導電性ダンパ部材を備えるスピーカ用ダンパ
であって、樹脂部材と当該樹脂部材に導電材を混合して
導電性ダンパ部材を作成する工程と、前記作成された導
電性ダンパ部材を少なくとも2つに互いに分離して打ち
抜き、もしくは成形する工程とを備えることとした。上
記各製造方法によれば、ダンパ自体を導電材として用い
錦糸線を使用せずに済むため、スピーカの薄型、ハイパ
ワー化を実現することができ、また、導電材のインサー
トや縫込み工程を不要とするため強度の安定化、低コス
ト化がはかれる。
According to a sixth aspect of the present invention, there is provided a speaker damper including at least two conductive damper members separated from each other, wherein the conductive damper member is formed by bonding a resin member and a conductive material to the resin member. The method includes a step of forming, and a step of punching or molding the formed conductive damper member separately into at least two parts. The invention according to claim 7 is a speaker damper including at least two conductive damper members separated from each other, wherein a resin member and a conductive material are applied to the resin member to form a conductive damper member. And a step of punching or molding the formed conductive damper member separately into at least two parts. An invention according to claim 8 is a speaker damper including at least two conductive damper members separated from each other, wherein a resin member and a conductive material are mixed with the resin member to form a conductive damper member. And a step of punching or molding the formed conductive damper members separately into at least two parts. According to each of the above manufacturing methods, since the damper itself is used as the conductive material and the tinsel wire is not used, the speaker can be made thin and high power can be realized. Stabilization of strength and cost reduction are achieved because they are not required.

【0011】[0011]

【発明の実施の形態】図1は、本発明の実施形態を示す
図である。ここでは、ダンパ11自体が導電部として形
成され、ダンパ11は、樹脂に導電材を貼り付けるか、
樹脂に導電材を塗布するか、あるいは、導電材を混合す
ることにより製造される。
FIG. 1 is a diagram showing an embodiment of the present invention. Here, the damper 11 itself is formed as a conductive portion, and the damper 11 is formed by attaching a conductive material to a resin,
It is manufactured by applying a conductive material to a resin or mixing a conductive material.

【0012】上記導電部の形成に関しては以下の工程で
行われる。すなわち、図1に示すダンパの形状に対応す
る形状の導電材をプレス抜き金型で製作し、プラスおよ
びマイナス用の一対の導電材111、112を製作す
る。あるいは、成形用金型に挿入し、2以上の導電部と
して使用する。ここで、ダンパ11の樹脂材料として
は、ABS、ポリプロピレン、ナイロン、合成ゴム等が
考えられ、また、導電材としては、銅、真鍮、アルミ等
が考えられる。
The formation of the conductive portion is performed in the following steps. That is, a conductive material having a shape corresponding to the shape of the damper shown in FIG. 1 is manufactured by a stamping die, and a pair of positive and negative conductive materials 111 and 112 are manufactured. Alternatively, it is inserted into a molding die and used as two or more conductive parts. Here, as the resin material of the damper 11, ABS, polypropylene, nylon, synthetic rubber, or the like can be considered, and as the conductive material, copper, brass, aluminum, or the like can be considered.

【0013】以上説明のように、本発明は、樹脂に導電
材を貼り付け、塗布、混合する等してダンパ自体を導電
材として用い、これを少なくとも2以上に打ち抜き、あ
るいは成形することによってスピーカの薄型、ハイパワ
ー化を実現し、また、強度の安定、低コスト化をはかる
ものである。
As described above, according to the present invention, the damper itself is used as a conductive material by sticking, coating, or mixing a conductive material on a resin, and the damper itself is punched or molded into at least two or more pieces to form a speaker. It achieves a thinner, higher power, stable strength, and lower cost.

【0014】[0014]

【発明の効果】以上説明のように本発明のスピーカ用ダ
ンパならびにその製造方法および同ダンパを備えたスピ
ーカ装置によれば、ダンパ自体を導電部として構成する
ことにより、以下に列挙する効果が得られる。 (1)ボイスコイルに電力を供給するのに錦糸線を使用
せずに済むため、錦糸線が切れたり、コーン振動板やダ
ンパに接触することがなく、スピーカの薄型化、ハイパ
ワー化に貢献する。 (2)導電材のインサート成形や縫込みを不要とするた
め、機械的強度が安定する。 (3)部品作成が容易でかつ製造コストを安価に提供で
きる。 (4)スピーカのボイスコイルへの入力が取りやすく、
作業性が改善されるためスピーカの組み立てが用意にな
る。
As described above, according to the speaker damper, the method of manufacturing the same, and the speaker device provided with the damper of the present invention, the following effects can be obtained by configuring the damper itself as a conductive portion. Can be (1) It is not necessary to use a tinsel wire to supply power to the voice coil, so there is no breakage of the tinsel wire or contact with the cone diaphragm or damper, contributing to thinner speakers and higher power. I do. (2) The mechanical strength is stabilized because insert molding and sewing of the conductive material are not required. (3) Parts can be easily created and the manufacturing cost can be provided at low cost. (4) Easy input to the voice coil of the speaker
Since the workability is improved, the assembly of the speaker becomes ready.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施形態を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.

【図2】従来のダイナミックスピーカの概略構造を示す
図である。
FIG. 2 is a diagram showing a schematic structure of a conventional dynamic speaker.

【図3】従来のダイナミックスピーカの概略構造を示す
図である。
FIG. 3 is a diagram showing a schematic structure of a conventional dynamic speaker.

【図4】図3におけるダンパを説明するために引用した
図である。
FIG. 4 is a diagram cited for explaining a damper in FIG. 3;

【符号の説明】[Explanation of symbols]

11 ダンパ 111 プラス用導電材 112 マイナス用導電材 12 ボイスコイル 13 フレーム 14 コーン振動板 Reference Signs List 11 damper 111 conductive material for plus 112 conductive material for minus 12 voice coil 13 frame 14 cone diaphragm

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも2つの互いに分離された導電
性ダンパ部材を備えることを特徴とするスピーカ用ダン
パ。
1. A speaker damper comprising at least two separated conductive damper members.
【請求項2】 振動板を振動させるボイスコイルと、 前記振動板とフレームとを連結し、前記ボイスコイルに
入力信号を供給する、少なくとも2つの互いに分離され
た導電性ダンパ部材から成るスピーカ用ダンパとを備え
たことを特徴とするスピーカ装置。
2. A loudspeaker damper comprising: a voice coil for vibrating a diaphragm; and at least two separated conductive damper members connecting the diaphragm to a frame and supplying an input signal to the voice coil. A speaker device comprising:
【請求項3】 前記導電性ダンパ部材は、樹脂部材と当
該樹脂部材に貼り合わせた導電材から成ることを特徴と
する請求項1または2に記載のスピーカ用ダンパまたは
スピーカ装置。
3. The speaker damper or speaker device according to claim 1, wherein the conductive damper member is made of a resin member and a conductive material bonded to the resin member.
【請求項4】 前記導電性ダンパ部材は、樹脂部材と当
該樹脂部材に塗布された導電材から成ることを特徴とす
る請求項1または2に記載のスピーカ用ダンパまたはス
ピーカ装置。
4. The speaker damper or speaker device according to claim 1, wherein the conductive damper member is made of a resin member and a conductive material applied to the resin member.
【請求項5】 前記導電性ダンパ部材は、樹脂部材と当
該樹脂部材に混入された導電材から成ることを特徴とす
る請求項1または2に記載のスピーカ用ダンパまたはス
ピーカ装置。
5. The speaker damper or speaker device according to claim 1, wherein the conductive damper member is formed of a resin member and a conductive material mixed in the resin member.
【請求項6】 少なくとも2つの互いに分離された導電
性ダンパ部材を備えるスピーカ用ダンパであって、 樹脂部材と当該樹脂部材に導電材を貼り合わせて導電性
ダンパ部材を作成する工程と、 前記作成された導電性ダンパ部材を少なくとも2つに互
いに分離して打ち抜き、もしくは成形する工程と、 を備えたことを特徴とするスピーカ用ダンパの製造方
法。
6. A speaker damper provided with at least two conductive damper members separated from each other, wherein a step of forming a conductive damper member by bonding a resin member and a conductive material to the resin member; And separating or punching out or shaping the conductive damper members into at least two parts, and manufacturing the speaker damper.
【請求項7】 少なくとも2つの互いに分離された導電
性ダンパ部材を備えるスピーカ用ダンパであって、 樹脂部材と当該樹脂部材に導電材を塗布して導電性ダン
パ部材を作成する工程と、 前記作成された導電性ダンパ部材を少なくとも2つに互
いに分離して打ち抜き、もしくは成形する工程と、 を備えたことを特徴とするスピーカ用ダンパの製造方
法。
7. A damper for a speaker comprising at least two conductive damper members separated from each other, wherein a step of forming a conductive damper member by applying a resin member and a conductive material to the resin member; And separating or punching out or shaping the conductive damper members into at least two parts, and manufacturing the speaker damper.
【請求項8】 少なくとも2つの互いに分離された導電
性ダンパ部材を備えるスピーカ用ダンパであって、 樹脂部材と当該樹脂部材に導電材を混合して導電性ダン
パ部材を作成する工程と、 前記作成された導電性ダンパ部材を少なくとも2つに互
いに分離して打ち抜き、もしくは成形する工程と、 を備えたことを特徴とするスピーカ用ダンパの製造方
法。
8. A speaker damper comprising at least two conductive damper members separated from each other, wherein a step of forming a conductive damper member by mixing a resin member and a conductive material with the resin member; And separating or punching out or shaping the conductive damper members into at least two parts, and manufacturing the speaker damper.
JP2000133426A 2000-05-02 2000-05-02 Damper for speaker, its manufacturing method and speaker device provide with the damper Pending JP2001313996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000133426A JP2001313996A (en) 2000-05-02 2000-05-02 Damper for speaker, its manufacturing method and speaker device provide with the damper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000133426A JP2001313996A (en) 2000-05-02 2000-05-02 Damper for speaker, its manufacturing method and speaker device provide with the damper

Publications (1)

Publication Number Publication Date
JP2001313996A true JP2001313996A (en) 2001-11-09

Family

ID=18641926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000133426A Pending JP2001313996A (en) 2000-05-02 2000-05-02 Damper for speaker, its manufacturing method and speaker device provide with the damper

Country Status (1)

Country Link
JP (1) JP2001313996A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7505603B2 (en) 2002-08-30 2009-03-17 Jin Young Acoustic Co., Ltd. Dynamic micro speaker with dual suspension
WO2011025193A2 (en) * 2009-08-27 2011-03-03 Shin Joung Youl Slimline speaker
JP2011071681A (en) * 2009-09-25 2011-04-07 Hosiden Corp Speaker damper and speaker
KR101032989B1 (en) * 2010-08-02 2011-05-09 범진시엔엘 주식회사 Super-slim type speaker
KR101052825B1 (en) * 2010-08-20 2011-07-29 범진시엔엘 주식회사 Super slim speaker
KR200457584Y1 (en) * 2009-10-23 2011-12-26 후이저우 그로우징 일렉트로닉스 컴퍼니 리미티드 A suspension having circuit function for a small speaker
KR101107050B1 (en) * 2010-12-28 2012-01-30 범진시엔엘 주식회사 Super-slim speaker
KR101197917B1 (en) * 2011-08-29 2012-11-05 염강문 A speaker unit
WO2012144773A3 (en) * 2011-04-20 2013-01-17 주식회사 엑셀웨이 Flat-type speaker having a plurality of consecutively connected magnetic circuits
WO2021119655A1 (en) * 2019-12-12 2021-06-17 Sonos, Inc. Audio device transducer and associated systems and methods

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7505603B2 (en) 2002-08-30 2009-03-17 Jin Young Acoustic Co., Ltd. Dynamic micro speaker with dual suspension
WO2011025193A2 (en) * 2009-08-27 2011-03-03 Shin Joung Youl Slimline speaker
WO2011025193A3 (en) * 2009-08-27 2011-06-09 Shin Joung Youl Slimline speaker
US8767999B2 (en) 2009-08-27 2014-07-01 Joung Youl Shin Slimline speaker
KR101062039B1 (en) * 2009-08-27 2011-09-05 신정열 Slim speakers
JP2011071681A (en) * 2009-09-25 2011-04-07 Hosiden Corp Speaker damper and speaker
KR200457584Y1 (en) * 2009-10-23 2011-12-26 후이저우 그로우징 일렉트로닉스 컴퍼니 리미티드 A suspension having circuit function for a small speaker
KR101032989B1 (en) * 2010-08-02 2011-05-09 범진시엔엘 주식회사 Super-slim type speaker
KR101052825B1 (en) * 2010-08-20 2011-07-29 범진시엔엘 주식회사 Super slim speaker
KR101107050B1 (en) * 2010-12-28 2012-01-30 범진시엔엘 주식회사 Super-slim speaker
WO2012144773A3 (en) * 2011-04-20 2013-01-17 주식회사 엑셀웨이 Flat-type speaker having a plurality of consecutively connected magnetic circuits
KR101197917B1 (en) * 2011-08-29 2012-11-05 염강문 A speaker unit
WO2021119655A1 (en) * 2019-12-12 2021-06-17 Sonos, Inc. Audio device transducer and associated systems and methods

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