JP2001311857A - Optical module, its manufacturing method and optical transmission device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module having high positional accuracy of an optical fiber and to provide its manufacturing method and optical transmission device. SOLUTION: The manufacturing method of the optical module includes such processes that, while an optical element 20 with an optical part 22 is driven, an optical fiber 40 is moved its position toward the optical part 22 and that an optical transmission sensitivity detected between the optical fiber 40 and the optical element 20 is detected and positioning is performed between the optical fiber 40 and the optical part 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical module, a method of manufacturing the same, and an optical transmission device.

[0002]

2. Description of the Related Art In recent years, information communication has been trending toward higher speed and larger capacity, and optical communication has been developed. In optical communication, an electric signal is converted into an optical signal, the optical signal is transmitted through an optical fiber, and the received optical signal is converted into an electric signal. The conversion between an electric signal and an optical signal is performed by an optical element. Also, an optical module in which an optical element is mounted on a platform is known.

In the conventional optical module, it has been difficult to align the optical element with the optical fiber. For example, although the position of the optical fiber has been adjusted using the V-groove formed in the platform, it has been difficult to perform the alignment with high precision.

An object of the present invention is to solve this problem, and an object of the present invention is to provide an optical module having high optical fiber position accuracy, a method of manufacturing the same, and an optical transmission device.

[0005]

(1) In a method of manufacturing an optical module according to the present invention, an optical element having an optical part is driven and an optical fiber is formed by forming the optical part of the optical element. Moving the position toward the inclined surface, detecting light emitted from the optical fiber, and aligning the optical fiber with the optical portion based on the detection result.

According to the present invention, since the optical element is driven and the optical element is aligned with the optical element while detecting the light, the positional accuracy can be extremely increased.

(2) In this method of manufacturing an optical module, the optical element is a light emitting element, and the light emitted from the optical part is made incident from one end face of the optical fiber, and the other of the optical fiber The light transmitted from the end face of the light-receiving element may be made incident on the sensor to detect the light transmission sensitivity.

According to this, the position where the light emitted from the light emitting element is detected by the sensor and the highest sensitivity is obtained is the optimum position of the optical fiber.

(3) In this method of manufacturing an optical module, the optical element is a light-receiving element, which allows light to enter one surface of the optical fiber and emits light emitted from the other surface of the optical fiber. The light transmission sensitivity may be detected by making the light enter the optical portion.

According to this, the position where the light receiving element detects the incident light and the highest sensitivity is obtained is the optimum position of the optical fiber.

(4) In the method of manufacturing an optical module according to the present invention, an optical element having an optical part is arranged in a mold, and the optical element is driven and an optical fiber is connected to the optical part of the optical element. The position is moved toward the surface on which is formed, the light emitted from the optical fiber is detected, and based on the detection result, the optical fiber and the optical part are aligned with each other, and the mold is made of resin. And fixing the optical fiber and the optical element with the resin, curing the resin, and peeling the optical element and the optical fiber together with the resin from the mold.

According to the present invention, since the optical element is driven and the optical element is aligned with the optical element while detecting the light, the positional accuracy can be made extremely high. Fixing to the fiber can be easily performed.

(5) In this method for manufacturing an optical module, after the wiring is provided on the optical element and the mold, the resin may be formed so as to cover the wiring, and the resin may be peeled from the mold. .

According to this, the portion other than the surface of the wiring attached to the mold is sealed with the resin. Then, when the wiring is peeled off from the mold together with the resin, the wiring is in a form embedded in the resin except for the surface attached to the mold.

(6) In the method for manufacturing an optical module, the resin may be provided in a state where a mold release agent is applied to the mold.

(7) The optical module according to the present invention comprises: an optical fiber; an optical element aligned with the optical fiber; a molded body for fixing the optical fiber and the optical element; And a wiring having a portion exposed and electrically connected to the optical element.

According to the present invention, except for a part of the wiring, the wiring is embedded in the molded body, so that no projection is formed.

(8) An optical transmission device according to the present invention comprises an optical fiber, a first optical element mounted on one end face of the optical fiber with a light-emitting portion facing the other end face, and a first optical element mounted on the other end face of the optical fiber. A second optical element mounted with the light receiving portion facing, a molded body for fixing each end of the optical fiber and the first and second optical elements, and at least a part of each molded body. And a wiring that is exposed and electrically connected to the first and second optical elements.

According to the present invention, except for a part of the wiring,
Since it is embedded in the molded body, no protrusion due to wiring is formed on the molded body.

(9) In this light transmission device, the light emitting element may be connected to a first plug, and the light receiving element may be connected to a second plug.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIGS. 1 to 8 are views showing a method of manufacturing an optical module according to a first embodiment of the present invention. In the present embodiment, the mold 10 shown in FIG. 1 is used.

The mold 10 has a work surface 12 for performing processes such as mounting the optical element 20 as shown in FIG. 2 and providing a resin 60 as shown in FIG. The mold 10 has electrical connections 14,16. Electrical connections 14, 16
Has a surface exposed on the work surface 12. Electrical connection 1
The conductive layers 4 and 16 may be conductive layers formed on the work surface 12, but in the present embodiment, the electric connection portions 14 and 16 penetrate the work surface 12 of the mold 10 and other surfaces. Are formed. By doing so, it is possible to make an electrical connection from the other surface without obstructing the process on the work surface 12.

The electrical connection portions 14 and 16 are preferably formed of a material having high conductivity, and preferably have high strength. Further, in the example shown in FIG.
4 and 16 are inserted and provided in the tapered through holes extending in the opposite direction from the work surface 12, so that they are prevented from falling in the direction of the work surface 12.

It should be noted that, unlike the example shown in FIG. 1, when the electrical connection portions 14 and 16 are made of a conductive layer formed on the work surface 12, it is preferable that the electrical connection portions 14 and 16 are not easily separated from the work surface 12. For example, a conductive layer formed by sputtering is less likely to peel than a conductive layer formed by plating.

The one electrical connection portion 14 is formed so as to protrude from the work surface 12. If necessary, the other electrical connection 16 may also protrude from the work surface 12. Further, the electrical connection portions 14 and 16 may protrude from a surface other than the work surface 12.

The mold 10 may be made of resin, glass, ceramic or metal. However, if silicon (for example, silicon wafer) is used, fine processing can be performed by etching.

In this embodiment, as shown in FIG. 2, the optical element 20 is placed on the work surface 12 of the mold 10. Optical element 20
May be a light emitting element or a light receiving element. As an example of the light emitting element, a surface emitting element, in particular, a surface emitting laser can be used. Surface emitting devices such as surface emitting lasers
Emit light vertically from the surface. The optical element 20 has an optical part 22. When the optical element 20 is a light emitting element, the optical part 22 is a light emitting part, and when the optical element 20 is a light receiving element, the optical part 22 is a light receiving part.

The optical element 20 has an electrode 24 on the side on which the optical portion 22 is formed, and an electrode 26 on the opposite side. That is, the optical element 20 has electrodes 24, 2
6 is formed, and a voltage is applied between both electrodes 24 and 26.

The optical element 20 is arranged with the surface opposite to the optical part 22 facing the work surface 12. The electrode 26 formed on the surface opposite to the optical part 22 and the mold 1
0 is electrically connected to the electrical connection unit 16.

In the example shown in FIG. 2, a wiring 30 extending from the electrical connection portion 16 to the region where the optical element 20 is arranged is formed on the work surface 12, and the wiring 30 and the electrode 26 are electrically connected. I do. The wiring 30 is a conductive layer. The conductive layer may be a metal foil formed by vapor deposition or plating. When applying electroless plating as plating, the catalyst may be discharged by an inkjet method. Conductive layer, printing,
You may form by applying potting or an inkjet method. The material of the conductive layer may be a conductive paste.
It is preferable that the wiring 30 be easily separated from the mold 10.
For example, if the wiring 30 is formed by plating with tin or the like, it is easy to peel off. Alternatively, even when the wiring 30 is formed by printing, the wiring 30 can be peeled relatively easily.

When the wiring 30 is separated from the mold 10 in a later step, the electrode 26 of the optical element 20 is preferably bonded to the wiring 30. For example, the electrode 26 and the wiring 3
0, a brazing material such as solder or a conductive adhesive may be provided, or the wiring 30 itself is formed of a conductive paste,
The electrode 26 may be brought into close contact before the curing.

By forming the wiring 30 so as to extend over the electrical connection portion 16 of the mold 10, electrical connection with the electrode 26 of the optical element 20 can be achieved via the electrical connection portion 16. .

The optical part 22 of the optical element 20
The electrode 24 formed on the surface on which is formed and the electrical connection portion 14 are electrically connected by the wiring 32. The electrical connection 14 protrudes from the work surface 12 of the mold 10,
The wiring 32 is attached to the upper end surface.

In the example shown in FIG. 2, the wiring 32 is formed by bonding both ends of the wire to the electrode 24 and the electrical connection portion 14. The wires may be bonded by a wire bonder used for manufacturing a semiconductor device. In this case, bonding is performed by at least one of heat, pressure, and ultrasonic vibration. The wire may be made of gold or aluminum.

When the portion of the mold 10 to which the wiring 32 is attached is made of a material to which the wire is not easily attached or the wire is not easily separated, it is preferable to form the conductive film 34 on the mold 10 in advance. . In this case, the wire and the conductive layer 34 are integrated to form the wiring 32. The surface of the conductive film 34 may be formed of the same material as the wire. For example,
When the wire is made of gold, the conductive film 34 may be formed of a film made of chromium and a film made of gold thereon.

Next, as shown in FIG.
Is positioned with the tip facing the optical part 22. The optical fiber 40 includes a core and a clad that concentrically surrounds the core, and light is reflected at a boundary between the core and the clad,
Light is confined in the core and propagates. Also, the periphery of the cladding is often protected by a jacket.

At the tip of the optical fiber 40, a connector 4
2 are provided. The connector 42 is fixed to the optical element 20. The connector 42 is an optical fiber 40
The optical fiber 40 is provided with the distal end face exposed.
A portion 44 protruding from the front end surface of the optical fiber 40 prevents the front end surface of the optical fiber 40 from contacting the optical portion 22.

Then, the optical element 20 is driven. Specifically, a voltage is applied between the electrodes 24 and 26. In the example shown in FIG. 3, the optical element 20 is a light emitting element, and emits light from the optical part 22. The light is made to enter the optical fiber 40 from one end face thereof. A sensor 50 is attached to the other end of the optical fiber 40, and the incident light is detected by the sensor 50. The sensor 50 is, for example,
It includes a light receiving element and converts incident light into an electric signal.
As described later with reference to FIG. 4, a light receiving element mounted by a method to which the present invention is applied may be used as the sensor 50.

The result of detection by the sensor 50 (generally, an electric signal) is subjected to necessary data processing,
It may be sent to a visually recognizable display unit (not shown), or may be sent to an arithmetic processing unit (not shown) when performing automatic control.

Here, the optical portion 22 of the optical fiber 40
When the end on the side (connector 42) is moved, the sensor 5
The detected value of light due to 0 changes. That is, the sensor 50
Can detect the optical transmission sensitivity between the optical fiber 40 and the optical element 20. The position where the highest optical transmission sensitivity can be detected by the sensor 50 is the optimum position of the optical fiber 40. The optical fiber 40 may be moved by an actuator.

Note that an arithmetic processing unit (not shown) to which a detection result (electric signal) by the sensor 50 is input is provided.
An actuator (not shown) for moving the optical fiber 40 may be driven to position the optical fiber 40 so as to detect the highest light transmission sensitivity.

FIG. 4 is a diagram showing an example where the optical element 20 is a light receiving element. In this case, a light source 54 is provided at one end of the optical fiber 40. As described above with reference to FIG. 3, the light emitting device mounted by the method to which the present invention is applied may be used as the light source 54. Then, the other end (connector 42) of the optical fiber 40 is moved to make light incident on the optical portion 22 of the optical element 20.
Further, a measuring device 52 is connected between the electrodes 24 and 26. The measuring device 52 is, for example, a voltmeter, and measures a voltage generated by incident light.

The electrodes 24 and 26 may be sent to an arithmetic processing unit (not shown) when performing automatic control instead of connecting to the measuring device 52.

Here, the optical portion 22 of the optical fiber 40
When the side end (connector 42) is moved, the measuring instrument 5
The value measured by 2 changes. That is, the measuring device 52
The optical transmission sensitivity between the optical fiber 40 and the optical element 20 can be detected. The position where the highest optical transmission sensitivity can be detected by the measuring device 52 is the optimum position of the optical fiber 40. The optical fiber 40 may be moved by an actuator.

An actuator (not shown) for moving the optical fiber 40 is driven by an arithmetic processing unit (not shown) to which a voltage between the electrodes 24 and 26 is applied, and the highest light transmission sensitivity is detected. Thus, the optical fiber 40 may be positioned.

By the above-described steps, as shown in FIG. 5, the end of the optical fiber 40 (for example, the connector 42) is
It is positioned with respect to the optical part 22. Note that the connector 42 may be brought into contact with the optical element 20. At this time, the connector 42 and the optical element 20 may be bonded.

Next, as shown in FIG. 6, a resin 60 is provided on the work surface 12 of the mold 10. The end of the optical fiber 40 (connector 42) and the optical element 20 are fixed by the resin 60. The resin 60 may cover the entire connector 42 or may not cover a part of the connector 42. Note that the resin 60 preferably seals the optical element 20. The wiring 32 formed by bonding the wires is sealed with the resin 60, thereby preventing the wires from being cut. The wiring 30 formed by the conductive layer is covered with the resin 60 except for the surface where the wiring 30 is attached to the mold 10.

As described above, since the electrical connection portion 14 of the mold 10 protrudes on the work surface 12 side, the inverted concave portion is formed in the resin 60.

If necessary, a mold release agent (not shown) is applied to the mold 10 before the resin 60 is provided. The release agent (lubricant) has low adhesiveness to the resin 60, and the release of the resin 60 from the mold 10 is improved by applying the release agent.

In the present embodiment, the resin 60 is provided by potting, but the resin 60 may be a mold resin. In that case, the resin 60 is filled into a cavity formed by the mold 10 and another mold (not shown).

Next, as shown in FIG. 7, the resin 60 is cured and peeled from the mold 10. The optical element 20 and the optical fiber 40 are fixed by a molded body made of the resin 60. In addition, together with the resin 60, the mold 10
Is peeled from the mold 10. The wiring 32
The surface at the end of the wire or the surface of the conductive film 34 is peeled from the mold 10. The wiring 30 formed by the conductive layer is
The surface that has adhered to the mold is peeled from the mold 10.

Thus, the platform 1 is obtained. The platform 1 has a molded body made of the resin 600. The wires 30 and 32 are embedded in the molded body in a state where at least a part thereof is exposed. The wiring 30 has its entire surface exposed. In the wiring 32, the surface of the end of the wire or the surface of the conductive film 34 to which the end of the wire is bonded is exposed from the molded body. Specifically, the molded body has a concave portion 62 formed by the electric connection portion 14 of the mold 10, and the conductive layer 3 is formed on the bottom surface of the concave portion 62.
4 (wiring 32) is exposed.

As shown in FIG. 8, the recess 62 may be filled with a conductive material 64 such as a conductive paste. In this case, the wiring 32 (conductive film 34) is covered with the conductive material 64 and forms a part of the surface (bottom surface) of the concave portion 62. Further, on the wirings 30 and 32 (or the conductive material 64),
External terminals 66 such as solder balls may be provided.

As described above, according to the present embodiment, the alignment between the optical fiber 40 and the optical element 20 can be performed with high accuracy.

(Second Embodiment) FIG. 9 is a view showing an optical module according to a second embodiment to which the present invention is applied. This optical module includes an optical element 120 having a plurality of optical portions 122 and a plurality of optical fibers 40. Each optical fiber 40 is provided corresponding to each optical portion 122. The plurality of optical fibers 40 are fixed by connectors 142.

The example shown in FIG.
When the optical module is used for transmitting a color image signal, the optical part 122 and the optical fiber 40 are used for transmitting and receiving R, G, B signals and a clock signal.

In the optical module according to the present embodiment, each optical fiber 40 and each optical portion 122 can be aligned by the manufacturing method described in the above embodiment.

(Third Embodiment) FIG. 10 is a view showing an optical transmission device according to a third embodiment to which the present invention is applied. The light transmission device 200 interconnects electronic devices 202 such as a computer, a display, a storage device, and a printer. The electronic device 202 may be an information communication device. The light transmission device 200 may be one in which plugs 206 are provided at both ends of a cable 204.
The cable 204 includes one or more (at least one) optical fibers 40. The plug 206 may incorporate a molded body made of the resin 60 shown in FIG. 7, or the molded body may be the plug 206. The plug 206 may include a semiconductor chip.

In the present embodiment, the first optical element 20 connected to one end of the optical fiber 40 is a light emitting element. The first optical element 20 has a first plug 206 connected thereto. An electric signal output from one electronic device 202 is converted into an optical signal by the first optical element 20 which is a light emitting element. The optical signal travels through the optical fiber 40 and is input to the second optical element 20. The second optical element 20 has a second plug 206 connected thereto. The second optical element 20 is a light receiving element, and converts an input optical signal into an electric signal. The electric signal is input to the other electronic device 202.
Thus, according to optical transmission device 200 according to the present embodiment, information transmission of electronic device 202 can be performed by an optical signal.

(Fourth Embodiment) FIG. 11 is a diagram showing a use form of an optical transmission device according to a fourth embodiment to which the present invention is applied. The light transmission device 212 is used for the electronic device 210.
Connect between. As the electronic device 210, a liquid crystal display monitor or a digital CRT (sometimes used in the fields of finance, mail order, medical care, and education), a liquid crystal projector, a plasma display panel (PDP), a digital TV, and a retailer Checkout (POS (Pointof Sale S
canning), video, tuner, game machine, printer, and the like.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing an optical module according to a first embodiment to which the present invention is applied.

FIG. 2 is a diagram illustrating a method for manufacturing an optical module according to a first embodiment to which the present invention is applied.

FIG. 3 is a diagram illustrating a method of manufacturing the optical module according to the first embodiment to which the present invention is applied.

FIG. 4 is a diagram showing a method for manufacturing an optical module according to the first embodiment to which the present invention is applied.

FIG. 5 is a diagram showing a method for manufacturing an optical module according to the first embodiment to which the present invention is applied.

FIG. 6 is a diagram showing a method of manufacturing the optical module according to the first embodiment to which the present invention is applied.

FIG. 7 is a diagram showing a method of manufacturing the optical module according to the first embodiment to which the present invention is applied.

FIG. 8 is a diagram illustrating a method of manufacturing the optical module according to the first embodiment to which the present invention is applied.

FIG. 9 is a diagram illustrating an optical module according to a second embodiment to which the present invention is applied.

FIG. 10 is a diagram illustrating a light transmission device according to a third embodiment to which the present invention has been applied.

FIG. 11 is a diagram illustrating a use form of an optical transmission device according to a fourth embodiment to which the present invention is applied.

[Explanation of symbols]

 Reference Signs List 1 platform 10 type 12 working surface 20 optical element 22 optical part 30 wiring 32 wiring 40 optical fiber 50 sensor 52 measuring instrument 54 light source 60 resin 122 optical part

Claims (9)

[Claims] An optical device having an optical portion is driven, and an optical fiber is moved toward a surface of the optical device on which the optical portion is formed, so that light emitted from the optical fiber is emitted. A method for manufacturing an optical module, comprising detecting and positioning the optical fiber and the optical part based on the detection result. 2. The method for manufacturing an optical module according to claim 1, wherein the optical element is a light emitting element, and the light emitted from the optical portion is made incident on one end face of the optical fiber, and the light is emitted. A method for manufacturing an optical module for detecting light transmission sensitivity by causing light emitted from the other end face of a fiber to enter a sensor. 3. The method for manufacturing an optical module according to claim 1, wherein the optical element is a light receiving element, and light is incident on one surface of the optical fiber and emitted from the other surface of the optical fiber. A method of manufacturing an optical module for detecting light transmission sensitivity by making light incident on the optical part. 4. An optical element having an optical portion is arranged in a mold, and while driving the optical element, an optical fiber is moved toward a surface of the optical element on which the optical portion is formed. Detecting the light emitted from the optical fiber, based on the detection result, aligning the optical fiber and the optical portion, and providing a resin in the mold, the optical fiber and the optical element, And fixing the resin with the resin, curing the resin, and peeling the optical element and the optical fiber together with the resin from the mold. 5. The method for manufacturing an optical module according to claim 4, wherein after providing wiring on the optical element and the mold, the resin is formed so as to cover the wiring, and the resin is separated from the mold. Manufacturing method of optical module. 6. The method for manufacturing an optical module according to claim 1, wherein the resin is provided in a state where a mold release agent is applied to the mold. 7. An optical fiber, an optical element aligned with the optical fiber, a molded body for fixing the optical fiber and the optical element, and at least a part of the molded body being exposed to the optical element. An optical module comprising: an electrically connected wiring; 8. An optical fiber, a first optical element mounted with a light emitting portion facing one end face of the optical fiber, and a second optical element mounted with a light receiving portion facing the other end face of the optical fiber. An optical element, a molded body for fixing each end of the optical fiber and the first and second optical elements, and at least a part of each of the molded bodies is exposed while the first and second optical elements are exposed. And a wiring electrically connected to the optical element. 9. The light transmission device according to claim 8, wherein the light emitting element is connected to a first plug, and the light receiving element is connected to a second plug.