JP2001301176A - Method for joining substrate, method for manufacturing substrate, and method for manufacturing recording head and nozzle substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent distortion or separation or the like by easing a residual stress when different materials are joined. SOLUTION: When nickel is used for a nozzle substrate 13 of a recording head 3 and silicon is used for a liquid chamber substrate 18, a flank part 25 is formed on a joining face of the nozzle substrate using the nickel of a large coefficient of linear expansion of the nozzle substrate 13 and the liquid chamber substrate 18 to be joined at a wide face. The residual stress caused by difference of coefficients of linear expansion of the nozzle substrate 13 and the liquid chamber substrate 18 when the substrates 13 and 18 are joined by heating is eased, so that the separation or warp to the joining face is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of joining substrates and a method of manufacturing substrates of an ink jet recording head for printing by ejecting ink droplets from nozzles, and a recording head and a nozzle substrate using the same. And a method for producing the same.

[0002]

2. Description of the Related Art As shown in, for example, JP-A-9-39229 and JP-A-9-39235, an ink jet recording head comprises a nozzle substrate provided with a plurality of nozzles in an array, and a nozzle substrate. And a liquid chamber that is provided corresponding to each nozzle and that is connected to the nozzle, forms a fluid resistance path that supplies ink to the pressure liquid chamber, and a common liquid chamber that communicates with each fluid resistance path. It has a substrate and a drive substrate provided with an individual electrode which is joined to the liquid chamber substrate and is opposed to a vibration plate provided on one surface of the pressurized liquid chamber. Then, a voltage is applied between the diaphragm provided on one surface of the pressurized liquid chamber having the nozzle and the individual electrode, and a positive or negative charge is applied to them to electrostatically attract or repel the diaphragm toward the individual electrode. The ink in the pressurized liquid chamber is ejected from the nozzles and printed on recording paper.

There are various joining methods for joining the nozzle substrate, the liquid chamber substrate, and the driving substrate, such as adhesive joining, heat welding, direct joining using silicon or the like, and anodic joining. Are joined by heating to shorten the tact time in the joining step. When two substrates to be bonded are formed of different materials when heating and bonding different substrates in this manner, stress is left when heating and cooling due to a difference in linear expansion coefficient, and the bonding surface is not bonded. Warpage and peeling occur. For this reason, for example, see
In the ink jet recording head disclosed in JP-A-29114 and JP-A-10-44420, the nozzle substrate and the liquid chamber substrate are formed of a material having the same linear expansion coefficient.

Further, when two substrates having different linear expansion coefficients are bonded, as shown in Japanese Patent Application Laid-Open No. 7-299911, the bonding temperature is determined by the shrinkage amount of the two substrates when cooled from the bonding temperature to room temperature. And Japanese Patent Laid-Open No. 8-1951
As shown in the publication, one substrate is formed of a photosensitive glass, and the other substrate is formed of a material having a smaller linear expansion coefficient than the photosensitive glass, and the temperature is lower than the crystallization temperature of the substrate formed of the photosensitive glass. And heat bonding. Also,
As disclosed in Japanese Utility Model Publication No. 7-11982, a nozzle substrate and a liquid chamber substrate are partially joined,
As disclosed in Japanese Patent No. 374, the nozzle substrate and the liquid chamber substrate are formed of materials having similar linear expansion coefficients to avoid concentration of stress.

[0005]

SUMMARY OF THE INVENTION However, Japanese Patent Application Laid-Open
As shown in JP-A-229114 or the like, the nozzle substrate and the liquid chamber substrate are formed of a material having the same linear expansion coefficient, or as shown in JP-A-10-264374,
If the nozzle substrate and the liquid chamber substrate are formed of materials having similar linear expansion coefficients, the materials to be used are limited, and the restrictions on the materials are great. In recent years, silicon materials have attracted attention in recent years as recording heads have become finer and more highly integrated. When joining a substrate made of a material and a substrate made of a metal material, there is a problem that the joining cannot be performed unless a special alloy such as Kovar is selected as the metal material.

Further, as disclosed in Japanese Patent Application Laid-Open No. 7-299911 and Japanese Patent Application Laid-Open No. 8-1951, the bonding temperature is determined according to the materials of the two substrates to be bonded. However, depending on the type of the material, the bondable temperature may be limited. Furthermore, actual fairness 7-
In the case of partial joining as disclosed in Japanese Patent No. 11982, stress concentration is greatly affected by reliability of the position where the adhesive is applied and protrusion of the adhesive, and there are problems such as reliability.

The present invention has been made to solve the above-mentioned disadvantages, and has a method of joining a substrate, a method of manufacturing a substrate, and a recording head, which can alleviate residual stress when joining different materials and prevent the occurrence of peeling or the like due to distortion. And a method of manufacturing a nozzle substrate.

[0008]

According to the method for bonding substrates according to the present invention, when bonding substrates formed of different materials, a lightening portion is provided on a bonding surface of a substrate made of a material having a large linear expansion coefficient to heat the substrate. It is characterized by joining.

[0009] A method of manufacturing a substrate according to the present invention is characterized in that a substrate of a material having a large linear expansion coefficient among substrates of different materials to be heat-bonded is formed by forming a lightening portion on a bonding surface by electroforming. And

A recording head according to the present invention has a nozzle substrate provided with a plurality of nozzles in an array, and a diaphragm, and is provided with a diaphragm connected to the nozzle substrate and provided corresponding to each nozzle to communicate with the nozzles. A pressure liquid chamber, a fluid resistance path for supplying ink to the pressurized liquid chamber, a liquid chamber substrate forming a common liquid chamber communicated with each fluid resistance path, and a driving substrate having driving means for driving the diaphragm. In a recording head having a frame joined to a drive substrate, any two substrates or frames joined are formed of dissimilar materials, and a lightening portion is provided on a joining surface of a substrate having a large linear expansion coefficient. It is characterized by having.

It is desirable that the substrate made of a material having a large linear expansion coefficient be a nozzle substrate.

The lightening portion may be formed so as to penetrate the nozzle substrate, or may be formed in a concave shape with respect to the joint surface of the nozzle substrate. Further, in the case of a hollow portion formed in a concave shape with respect to the joint surface of the nozzle substrate, it is desirable to provide an air vent hole in the hollow portion.

[0013] The method of manufacturing a nozzle substrate according to the present invention includes:
The nozzle substrate is formed by forming a lightening portion between the nozzle and the joining surface by electroforming.

When manufacturing a nozzle substrate, after forming a nozzle pattern by photolithography, electroforming is performed.
It is preferable to form a nozzle substrate having a nozzle and a hollow portion again by forming a pattern of the hollow portion by photolithography and performing electroforming.

When a nozzle substrate is manufactured, a latent image of a pattern of a lightened portion is formed on a resist layer, a resist layer is formed on the resist layer, a latent image of a nozzle pattern is formed, and batch development is performed. The nozzle and the lightening portion may be formed collectively by electroforming.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A recording head according to the present invention includes a nozzle substrate having a plurality of nozzles arranged in an array, a pressurized liquid chamber joined to the nozzle substrate and having a vibration plate and communicating with the nozzles. A liquid chamber substrate forming a passage and a common liquid chamber, a driving substrate having individual electrodes provided opposite to the diaphragm of the pressurized liquid chamber at a fixed gap, and a surface of the driving substrate opposite to the individual electrodes. It has a joined frame. The individual electrodes of the drive board are connected to a flexible printed wiring board (FPC) on which a drive IC is mounted, and the FPC is joined to the nozzle board. Then, a voltage is applied between the diaphragm and the individual electrodes to give a positive or negative charge to them, and the diaphragm is deformed by electrostatic attraction or repulsion toward the individual electrodes, and ink in the pressurized liquid chamber is ejected from the nozzles. And prints on recording paper.

When nickel is used as a nozzle substrate of this recording head and silicon is used as a liquid chamber substrate,
Of the nozzle substrate and the liquid chamber substrate that have a wide surface joint, a thinned portion is provided on the joint surface of the nozzle substrate using nickel having a large linear expansion coefficient, and the nozzle substrate when the nozzle substrate and the liquid chamber substrate are heated and joined. The residual stress due to the difference in the coefficient of linear expansion of the liquid chamber substrate is reduced, and peeling or warping of the joint surface is prevented.

[0018]

FIG. 1 is a block diagram of one embodiment of the present invention.
As shown in the figure, an ink jet printer 1 includes four ink cartridges 2 each containing ink of each color of cyan C, magenta M, yellow Y, and black Bk,
Four recording heads 3 each having a plurality of nozzles and supplied with ink from each ink cartridge 2, a carriage 4 on which the ink cartridge 2 and the recording head 3 are mounted, and paper feed trays 5a, 5b containing recording paper, It has a transport roller 8 for transporting recording paper from the manual feed table 6 to the printing unit 7, and a discharge roller 10 for discharging the printed recording paper to a discharge tray 9. When printing the image data sent from the host device on the recording paper, the carriage 4 scans along the carriage guide roller 11 while the nozzles of the recording head 3 print on the recording paper sent to the printing unit 7 by the transport rollers 8. And ejects ink according to the image data to record characters and images.

As shown in the sectional view of FIG. 2, the recording head 3 has a nozzle substrate 13 on which a plurality of nozzles 12 are provided in an array, and is joined to the nozzle substrate 13 to form a vibration plate 14.
And a liquid chamber substrate 18 forming a common liquid chamber 17 and a fluid resistance path 16 and a common liquid chamber 17 communicating with the nozzle 12, and facing the diaphragm 14 of the pressurized liquid chamber 15 with a certain gap. A drive substrate 20 having the provided individual electrodes 19, and a frame 21 joined to a surface of the drive substrate 20 opposite to the individual electrodes 19
And an outer peripheral frame 22 joined to the outer peripheral portion of the nozzle substrate 13. The individual electrodes 19 of the drive substrate 20 are connected to a flexible printed wiring board (F) on which a drive IC 23 is mounted.
The FPC 24 is connected to the nozzle substrate 13. Then, a voltage is applied between the diaphragm 14 and the individual electrode 19 to give a positive or negative charge to them, and the diaphragm 14 is deformed by electrostatic attraction or repulsion toward the individual electrode 19 side, and the pressurized liquid chamber Nozzle 12 with 15 inks
And prints on recording paper.

Among the bonding portions of the recording head 3, the wide surface bonding is the bonding surface between the nozzle substrate 13 and the liquid chamber substrate 18 and the bonding surface between the driving substrate 20 and the frame 21. Various materials are used for the nozzle substrate 13, the liquid chamber substrate 18, the drive substrate 20, and the frame 21. The nozzle substrate 13 is made of a metal material such as nickel or stainless steel or a synthetic resin material such as a polyimide resin. Reference numeral 18 is widely used such as silicon single crystal, silicon compound, stainless steel, acrylic photosensitive resin, epoxy resin, and aramid resin. The drive substrate 20 forms a groove by etching the surface of a metal such as stainless steel or a material such as silicon to a desired depth, forms an insulating layer on the surface of the groove with a synthetic resin or SiO ₂ , and forms a nickel layer thereon. , Aluminum, copper or the like forms the individual electrode 19. The frame 21 is made of epoxy resin or the like.

Here, for example, when nickel is used for the nozzle substrate 13, silicon is used for the liquid chamber substrate 18 and the drive substrate 20, and epoxy resin is used for the frame 21, the linear expansion coefficient of the material used for each substrate Is epoxy resin>nickel> silicon. When the nozzle substrate 13 and the liquid chamber substrate 18 that are to be bonded in a wide area are joined in a heated state, the joint surface peels off after cooling because the nozzle substrate 13 using nickel has a large shrinkage. The phenomenon of warping and warping appears. Further, the driving substrate 2 having a wide surface bonding
Even when the frame 21 is bonded to the frame 21 by heating, a phenomenon in which the bonded surface peels or warps due to a large shrinkage of the frame 21 using the epoxy resin appears. In order to alleviate this problem, as shown in FIG. 3 showing an AA cross section in FIG. 2, a bonding surface of the nozzle substrate 13 using nickel having a large linear expansion coefficient in a portion which becomes a wide surface bonding, and a linear expansion coefficient Lightening portions 25 and 26 are provided on a frame 21 using a large epoxy resin.

The hollow portions 25 and 26 can be reflected everywhere when different materials are joined by heating. However, since the fine patterns are formed and the nozzle substrate 13 which is considered to be more vulnerable to the occurrence of peeling and the like, The state of the bonding surface of the liquid chamber substrate 18 will be described. The lightening portion 25 provided on the joining surface of the nozzle substrate 13 has a shape penetrating the nozzle substrate as shown in FIG. 3 and a concave portion with respect to the joining surface as shown in the sectional view of FIG. Some do not penetrate. As shown in FIG. 3, the penetrated hollow portion 25 has a large effect of alleviating residual stress due to a difference in linear expansion coefficient with the liquid chamber substrate 18, and the hollow portion 25 can be formed together with the nozzle 12. There is an advantage that it can be manufactured by a relatively simple process. On the other hand, as shown in FIG. 4, the concave-shaped lightening portion 25 a is inferior to the penetrating lightening portion 25 as the effect of relaxing the residual stress, but does not penetrate the nozzle substrate 13. As shown in the drawing, the lightening portion 27 can be provided also in a portion corresponding to the pressurized liquid chamber 15 and the common liquid chamber 17, and a large effect of alleviating residual stress can be exhibited. Further, the width of the lightening portion 27 provided at a portion corresponding to the pressurized liquid chamber 15 can be made substantially equal to the width of the pressurized liquid chamber 15 as shown in the sectional view of FIG. By increasing the volume of the chamber 15,
The amount of ink in the pressurized liquid chamber 15 can be increased.

As described above, the concave portion 25 is formed on the joint surface.
When the nozzle substrate 13 provided with “a” is joined to the liquid chamber substrate 18, air is sealed in the hollow portion 25 a, and the air sealed in the hollow portion 25 a expands due to heat generated during heating and joining, thereby inhibiting the joining. May be. Therefore, the nozzle substrate 13
6, an air vent hole 28 is formed in the concave portion 25a. In this manner, when the nozzle substrate 13 is joined to the liquid chamber substrate 18, air can be prevented from being sealed in the lightening portion 25a, and the joining reliability can be significantly improved. This air vent hole 28 may be formed together with the nozzle 12.

Although various materials are used as the material of the nozzle substrate 13, it is particularly preferable to use nickel. That is, nickel is relatively easy to form a fine structure such as the nozzle 12 and the lightening portions 25, 25a, 27 and the like by the electroforming process, has higher rigidity than resin and the like, and can increase the injection efficiency. It is.

A method for manufacturing the nozzle substrate 13 will be described with reference to the process chart of FIG. As shown in FIG. 7A, a nozzle portion is formed on a substrate 31 made of, for example, stainless steel by a resist 32.
Then, as shown in FIG. 2B, a nickel layer 33 having the nozzle 12 is formed by nickel electroforming.
Next, as shown in (c), a lightening pattern 34 is formed on the nickel layer 33 using a dry film resist or a thick film resist, and as shown in (d), the nickel layer 35 is again formed by nickel electroforming. Form. Next, as shown in (e), the substrate 31 is removed from the nickel layer 35,
As shown in (f), the resist 32 and the lightening pattern 3
The nozzle substrate 13 having the nozzle 12 and the lightening portions 25a and 27 is formed by peeling the nozzle substrate 4. In this case, since a general thin film resist is used as the first resist 32,
The horn-shaped nozzle 12 is formed. However, if a dry film resist or a thick-film resist is used as the first-layer resist 32, the nozzle 12 having a substantially straight shape can be formed.

Next, another manufacturing method for manufacturing the nozzle substrate 13 having the nozzle 12 and the hollow portions 25a and 27 by batch electroforming will be described with reference to the process chart of FIG.

First, as shown in FIG.
Then, a dry film resist or a thick film resist is attached or applied to form a resist layer 41. Next (b)
As shown in (c), a latent image is exposed in the lightening pattern equivalent portion 42 by exposing the lightening pattern equivalent portion 42, and a second dry film resist or a thick film resist is formed thereon as shown in FIG. A resist layer 43 is formed. Thereafter, as shown in (d), the pattern portion 44 of the nozzle 12 is exposed to form a latent image. Then, as shown in (e), batch development is performed to remove the second resist layer 43 and the resist layer 41 other than the pattern portion 44 of the nozzle 12 and the lightening pattern corresponding portion 42, and as shown in (f), A nickel layer 45 is formed by batch electroforming. Thereafter, as shown in (g), the nozzle substrate 13 is manufactured by removing the substrate 31, the pattern portion 44 of the nozzle 12, and the portion 42 corresponding to the lightening pattern. The pattern portion 44 of the nozzle 12 forming the nozzle 12 of the manufactured nozzle substrate 13 has a second resist layer 43.
And the resist layer 41 are collectively exposed and formed, so that the formed nozzle 12 does not have a step in the middle, and the nozzle 12 having a smooth straight shape is formed. In addition, when the first resist layer 41 is exposed to light, if the exposure of the nozzle portion is widened, a two-stage nozzle formation can be formed.

Further, the nozzle substrate 1 prepared by this method
As shown in FIG. 3F, a concave portion 3 is formed on the surface of the lightening pattern equivalent portion 42 by electroforming to the lightening pattern equivalent portion 42. There is no effect on the characteristics. Further, the maximum width of the formed lightening portions 25a and 27 must be closed by electroforming, and thus is determined by the total thickness of electroforming. Therefore, it is preferable to provide a large number of narrow grooves.

The lightening portions 25, 2 thus formed
The nozzle substrate 13 having the nozzles 5a and 27 and the liquid chamber substrate 18 are heat-bonded, and the frame 21 having the thinned portion 26 and the drive substrate 20 are heat-bonded using an epoxy resin to produce the recording head 3, thereby providing a wide recording head. It is possible to manufacture a recording head 3 having no peeling or warpage on the joining surface, and by using this recording head 3 in an ink jet printer 1, a copying machine, or a facsimile, ink is ejected from the nozzles 12 with stable ejection characteristics for printing. can do.

Although the above embodiment has been described with respect to the side shooter type recording head 3, the present invention can be similarly applied to an edge shooter type recording head. In the above embodiment, the recording head 3 of the electrostatic drive type has been described. However, the present invention can be similarly applied to a recording head of a piezoelectric drive type or a thermal drive type.

Further, in the above-described embodiment, the joining of the substrates of the recording head 3 has been described. However, also in the case of joining various substrates made of different materials by heating, similarly, a lightened portion is formed on the joining surface of the substrates having a large linear expansion coefficient. Provision of such an arrangement can prevent the occurrence of peeling or warpage, and achieve good bonding.

[0032]

As described above, according to the present invention, when joining substrates formed of different kinds of materials, a lightening portion is provided on the joining surface of the substrate made of a material having a large linear expansion coefficient, and the joining is performed by heating. This alleviates the residual stress due to the difference in the coefficient of linear expansion of the substrates when the substrates are heated and bonded, and prevents the bonded surfaces from being separated or warped.

Further, of the substrates of different materials to be joined by heating, a substrate of a material having a large linear expansion coefficient is formed by forming a lightening portion on the joining surface by electroforming, so that the lightening portion can be formed in a simple process. It can be formed with high accuracy.

Further, a nozzle substrate having a nozzle of an ink jet type recording head, a liquid chamber substrate having a pressurized liquid chamber, and the like are formed of different materials, and a lightening portion is formed on a joining surface of the substrate having a large linear expansion coefficient. Is provided, it is possible to prevent separation or warpage from occurring on the bonding surface of each substrate, to eject ink from the nozzles with stable ejection characteristics, and to form a high-quality image. .

Further, by forming the nozzle substrate from a material having a large linear expansion coefficient and providing a lightening portion on the joint surface,
The nozzle substrate with high required component accuracy can be joined to the liquid chamber substrate without causing peeling or warpage.

Further, by forming the lightening portion through the nozzle substrate, the effect of relieving residual stress due to the difference in linear expansion coefficient when joined to the liquid chamber substrate can be increased, and the joint surface can be peeled off. Or warpage can be prevented. Further, a lightening portion can be formed together with the nozzle, and the nozzle substrate can be manufactured by a relatively simple process.

Further, by forming the lightening portion in a concave shape with respect to the joint surface of the nozzle substrate, the lightening portion can also be provided in a portion corresponding to the pressurized liquid chamber or the common liquid chamber, so that the entire surface remains. The effect of relieving large stress can be exhibited.
Also, the width of the lightening portion provided in the portion corresponding to the pressurized liquid chamber can be made substantially equal to the width of the pressurized liquid chamber, and the volume of the pressurized liquid chamber can be increased to increase the amount of ink in the pressurized liquid chamber. Can also be increased.

Further, by providing an air vent hole in the hollow portion formed concavely with respect to the joining surface of the nozzle substrate, air is sealed in the hollow portion when the nozzle substrate and the liquid chamber substrate are joined. And the reliability of the joint can be significantly improved.

Further, by forming a nozzle substrate having a hollow portion by electroforming, a highly rigid and accurate nozzle substrate can be manufactured.

Further, after forming the pattern of the nozzle by photolithography, electroforming is performed, and the pattern of the lightening portion is formed again by photolithography, and electroforming is performed to produce a nozzle substrate having the nozzle and the lightening portion. By doing
The lightening portion can be formed in any size and can be formed integrally with the nozzle.

Further, after forming a latent image of the pattern of the lightening portion on the resist layer, a resist layer is formed on the resist layer, a latent image of the nozzle pattern is formed, batch development is performed, and the nozzle and the lightening portion are formed by electroforming. , The hollow portion and the nozzle can be formed simultaneously by batch electroforming, so that the manufacturing process of the nozzle substrate can be simplified and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an ink jet printer according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a configuration of a recording head.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a cross-sectional view showing a second lightening portion provided on a bonding surface of the nozzle substrate.

FIG. 5 is a cross-sectional view showing a third lightening portion provided on a bonding surface of the nozzle substrate.

FIG. 6 is a plan view showing a lightened portion as viewed from the joint surface side of the nozzle substrate.

FIG. 7 is a process chart showing a manufacturing process of the nozzle substrate.

FIG. 8 is a process chart showing another manufacturing process of the nozzle substrate.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1; Ink-jet printer, 2; Ink cartridge, 3; Recording head, 4; Carriage, 12;
13; nozzle substrate; 14; diaphragm; 15; pressurized liquid chamber, 1
6; fluid resistance path, 17; common liquid chamber, 18; liquid chamber substrate, 1
9; individual electrode, 20; drive board, 21; frame, 2
2: outer peripheral frame, 24; FPC, 25, 26, 27;
Lightening portion, 28; air vent hole.

Claims (10)

[Claims] 1. A method of joining substrates, comprising joining a substrate formed of a dissimilar material to a substrate with a material having a large linear expansion coefficient by providing a lightening portion on a joining surface of the substrate. 2. A method for manufacturing a substrate, wherein a substrate made of a material having a large linear expansion coefficient among substrates of different materials to be joined by heating is formed by forming a lightening portion on a joining surface by electroforming. 3. A pressurized liquid chamber having a plurality of nozzles provided in an array, a vibrating plate, joined to the nozzle substrate, provided corresponding to each nozzle, and communicating with the nozzles. A fluid resistance path for supplying ink to the pressure liquid chamber, a liquid chamber substrate forming a common liquid chamber communicated with each fluid resistance path, a driving substrate having driving means for driving the diaphragm, and a driving substrate A recording head provided with a frame, wherein any two substrates or frames that are bonded are formed of different materials, and a lightening portion is provided on a bonding surface of the substrate made of a material having a large linear expansion coefficient. Recording head. 4. The recording head according to claim 3, wherein the substrate made of a material having a large linear expansion coefficient is a nozzle substrate. 5. The recording head according to claim 4, wherein said lightening portion is formed through the nozzle substrate. 6. The recording head according to claim 4, wherein the lightening portion is formed in a concave shape with respect to a joining surface of the nozzle substrate. 7. The recording head according to claim 6, wherein an air vent hole is provided in a lightening portion formed in a concave shape with respect to a bonding surface of the nozzle substrate. 8. A pressurized liquid chamber having a nozzle substrate provided with a plurality of nozzles in an array, a vibrating plate, joined to the nozzle substrate, provided corresponding to each nozzle, and connected to the nozzle. A fluid resistance path for supplying ink to the pressure liquid chamber, a liquid chamber substrate forming a common liquid chamber communicated with each fluid resistance path, a driving substrate having driving means for driving the diaphragm, and a driving substrate A method of manufacturing a nozzle substrate for a recording head having a frame, comprising: forming a nozzle substrate by forming a hollow portion between a nozzle and a joining surface by electroforming; 9. After forming the pattern of the nozzle by photolithography, electroforming is performed, and the pattern of the lightening portion is formed again by photolithography and electroforming to form a nozzle substrate having the nozzle and the lightening portion. The method for manufacturing a nozzle substrate according to claim 8, wherein the method comprises: 10. A method for forming a latent image of a pattern of the lightening portion on a resist layer, forming a latent image of a nozzle pattern on the resist layer, forming a latent image of a nozzle pattern, and performing collective development. 9. The method for manufacturing a nozzle substrate according to claim 8, wherein the portions are collectively formed.