JP2001297696A - Fluorescent screen producing method for color cathode- ray tube - Google Patents

Abstract

PROBLEM TO BE SOLVED: To assure the uniformity of a white color over a whole display screen and improve the imaging characteristics. SOLUTION: The brightness of the whole display screen is controlled by changing the film thickness of a fluorescent layer, corresponding to the areas of opening holes in a light-absorbing layer on which the fluorescent layer is formed. For example, the viscosity of a fluorescent slurry and the rotaing speed of a face panel in application are changed to obtain a desired film thickness distribution.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a phosphor screen of a color cathode ray tube.

[0002]

2. Description of the Related Art Generally, as shown in FIG. 4, a color cathode ray tube has a face panel 1 and an envelope formed of a face panel 2 and a plurality of electron beam passage holes inside the face panel 1. The formed shadow mask 3 is provided, and the face panel 1 faces the shadow mask 3.
A fluorescent screen 4 is formed on the inner surface. In addition, funnel 2
An electron gun 6 is disposed in the neck 5 of the first embodiment, and an electron beam 7 emitted from the electron gun 6 is deflected by a magnetic field generated by a deflection yoke 8 mounted outside the funnel 2.
The phosphor screen 4 is scanned in the horizontal and vertical directions, and the electron beam 7 collides with the phosphor layer so that the phosphor emits light of each color to display a color image. Further, a metal back layer 15 is formed on the back surface of the phosphor screen 4 to prevent the phosphor from being deteriorated by the electron beam 7 radiated from the electron gun 6, and
It has the function of radiating the electrification stored in the phosphor screen 4 to the outside and reflecting the light emitted from the phosphor to the front surface of the face panel 1.

The fluorescent screen 4 includes a black stripe type and a black matrix type. FIG. 5 shows a black stripe type phosphor screen. (A) is a sectional view,
(B) is a plan view. As shown in the drawing, blue and blue are embedded between stripe-shaped black light absorbing layers 9.
A striped three-color phosphor layer 10B that emits green and red light,
10G and 10R are provided.

The phosphor screen 4 is formed by a photo printing method. First, a light absorbing layer 9 is formed, and then a phosphor layer 10 is formed. Specifically, a photosensitive resist is applied to the inner surface of the face panel, dried by heating to form a coating, and then the phosphor pattern is sequentially exposed to the coating through the opening of the shadow mask. After insolubilizing the photosensitive resist located in the region, develop it to obtain a resist pattern, then apply and form a light absorbing layer on the inner surface of the face panel, and lift off the resist pattern by etching with acid or the like and high-pressure development I do.
Next, a phosphor slurry containing a photosensitive agent and a phosphor as main components is applied to the inner surface of the face panel on which the light absorbing layer 9 is formed, and dried by heating to form a film. The steps of exposing, baking, developing and heating and drying the phosphor pattern forming regions of each color in the coating are repeated for each of the three-color phosphors, whereby the phosphor layer 1 is formed.
0B, 10G, and 10R. Thereafter, a metal is deposited on the phosphor screen 4 to form a metal back layer 15.

[0005]

When a phosphor pattern forming region is sequentially exposed through a shadow mask, the temperature of the face panel rises in a photosensitive resist drying step, and then the light absorbing layer is exposed. During this time, the temperature of the face panel decreases. At this time, the central part of the face panel has a smaller heat capacity than the peripheral part, so that the temperature drops sharply. The temperature change becomes the largest during the exposure of the first color. Therefore, when a photosensitive resist whose exposure sensitivity is temperature-dependent is used, the adjustment to make the aperture width of the light absorbing layer uniform among the first, second, and third colors is performed by adjusting the exposure illuminance and the exposure. Even if it is performed depending on the time, the opening width of the center portion of the face panel becomes relatively small as compared with the second and third colors, especially in the first color.
The white uniformity is impaired.

For example, when the exposure is performed in the order of blue, green, and red, the aperture width at the center of the blue face panel becomes relatively small, so that the beam becomes white at the center of the face panel. When the current is adjusted, the peripheral portion is shifted in color from white compared to the central portion (the peripheral portion is shifted in the blue direction).

The degree of coincidence of the geometrical positional relationship between the passing beam and the phosphor layer corresponding to each electron beam passing hole formed in the shadow mask is called a landing characteristic. If this is formed so as to deviate from the predetermined phosphor pattern forming area, the landing of the electron beam will deviate. For example, when the deviation of the landing of the blue phosphor layer at the center portion of the face panel is large, the luminance at such a portion is reduced, and the white uniformity is impaired as described above.

Further, white uniformity is impaired even when the characteristics of the metal back layer are not uniform, such as when the thickness of the metal back layer is not uniform or when the pinhole density is not uniform. For example, if there are many pinholes in the metal back layer of the red phosphor layer in the center part of the face panel, the brightness in such a part decreases, so the beam current is set so that the center part of the face panel becomes white. If the adjustment is performed, the peripheral portion will cause a color shift in the red direction.

An object of the present invention is to solve the above problems. More specifically, an object of the present invention is to provide a method for manufacturing a phosphor screen that can improve white uniformity over the entire display screen.

[0010]

According to a first aspect of the present invention, there is provided a method of manufacturing a fluorescent screen of a color cathode ray tube, comprising forming a photosensitive resist film on an inner surface of a face panel, Selectively exposing the phosphor pattern forming regions of the first color, the second color and the third color in order, and developing the exposed resist film to form a resist corresponding to the phosphor pattern forming region. Forming a pattern and applying a black light-absorbing substance to the inner surface of the face panel on which the resist pattern is formed, and peeling off the light-absorbing substance formed on the resist pattern together with the resist pattern by a lift-off method Then, a light absorption layer made of a reverse pattern of the resist pattern and having openings in the first, second and third color phosphor pattern forming regions is formed. And degree, the opening of the light absorbing layer,
Forming a phosphor layer of a first color, a second color and a third color, wherein the area of the aperture of the light absorbing layer and the displacement of the landing of the electron beam are adjusted. When any one of them differs depending on the part of the face panel, the thickness of the phosphor layer is controlled.

According to a second aspect of the present invention, there is provided a method for manufacturing a fluorescent screen of a color cathode ray tube, wherein a photosensitive resist film is formed on an inner surface of a face panel, and the first color and the first color of the photosensitive resist film are formed. Selectively exposing the two-color and third-color phosphor pattern formation regions in order; developing the exposed resist film to form a resist pattern corresponding to the phosphor pattern formation region; After applying a black light-absorbing substance to the inner surface of the face panel on which the resist pattern is formed, the light-absorbing substance formed on the resist pattern is peeled off together with the resist pattern by a lift-off method. Forming a light absorbing layer having openings in the first, second, and third color phosphor pattern forming regions. Forming a first color, a second color and a third color phosphor layer in the opening of the layer; and forming a metal back layer by depositing a metal on the phosphor layer. In the method for manufacturing a phosphor screen of a color cathode ray tube having
When the characteristics of the metal back layer differ depending on the portion of the face panel, the thickness of the phosphor layer is controlled.

According to a third aspect of the present invention, in the method of manufacturing a phosphor screen of a color cathode ray tube according to the first aspect, each of the apertures of the light absorbing layer is provided for at least one of the phosphors. When the area of the phosphor layer differs depending on the portion on the face panel, it is preferable that the thickness of the phosphor layer is made closer to the optimum thickness having the highest luminous efficiency in the portion where the area of the opening is small as compared with other portions. Features.

According to a fourth aspect of the present invention, in the method of manufacturing a color cathode ray tube according to the first aspect of the present invention, the deviation of the landing of the electron beam on at least one of the phosphor layers is reduced on the face panel. In this case, the thickness of the phosphor layer is made closer to the optimum film thickness having the highest luminous efficiency in the portion where the landing deviation is large as compared with the other portions.

According to a fifth aspect of the present invention, in the method of manufacturing a fluorescent screen of a color cathode ray tube according to the second aspect of the present invention, the characteristics of the metal back layer of at least one of the phosphor layers are the face. In a case where the characteristics of the metal back layer are not good, the thickness of the phosphor layer is made closer to an optimum film thickness having the highest luminous efficiency as compared with other portions in a portion where the characteristics of the metal back layer are not good when different from each other on the panel. .

According to a sixth aspect of the present invention, in the method of manufacturing a fluorescent screen of a color cathode ray tube according to the first or third aspect, the area of the aperture of the light absorbing layer is the center of the face panel. In the case where the thickness is relatively small in the portion and becomes large toward the peripheral portion of the face panel, the thickness of the phosphor layer is close to the optimum thickness in the central portion of the face panel, It is characterized in that the distance from the optimum film thickness increases as going to the portion.

According to a seventh aspect of the present invention, in the method of manufacturing a fluorescent screen of a color cathode ray tube according to the first or fourth aspect, the landing deviation of the electron beam is relatively small in a central portion of the face panel. In the case where the thickness of the phosphor layer is large toward the periphery of the face panel, the thickness of the phosphor layer is close to the optimum thickness at the center of the face panel, and the thickness of the phosphor layer increases toward the periphery of the face panel. It is characterized in that it departs from the optimum film thickness.

According to a eighth aspect of the present invention, in the method for manufacturing a fluorescent screen of a color cathode ray tube according to the second or fifth aspect, the characteristic of the metal back layer is not good in the central portion of the face panel. In the case where the thickness of the phosphor layer becomes better toward the peripheral portion of the face panel, the thickness of the phosphor layer is set closer to the optimum thickness at the central portion of the face panel, and the thickness becomes closer to the peripheral portion of the face panel. It is characterized in that it departs from the optimum film thickness.

According to a ninth aspect of the present invention, in the method of manufacturing a phosphor screen of a color cathode ray tube according to any one of the first to eighth aspects, the step of forming the phosphor layer comprises the step of forming the phosphor layer. The first face is formed on the inner surface of the face panel formed with
Applying the slurry of the color, the second color, and the third color, and baking the opening pattern of the shadow mask, and then developing the slurry. In a state of being inclined obliquely upward with respect to, supplying the phosphor slurry into the face panel while rotating the face panel,
Spreading the phosphor slurry on the face panel inner surface, and removing excess phosphor slurry while rotating the face panel while the face panel inner surface is inclined obliquely downward with respect to a horizontal plane. The thickness of the phosphor layer is changed by changing the viscosity of the phosphor slurry and the rotation speed in the step of removing the surplus phosphor slurry of the face panel.

According to a tenth aspect of the present invention, in the method for manufacturing a fluorescent screen of a color cathode ray tube according to the sixth aspect, the step of forming the photosensitive resist film comprises applying the photosensitive resist. And a step of heating and drying the applied photosensitive resist, wherein the step of forming the resist pattern is performed while the temperature of the face panel raised by the heating decreases.

According to a eleventh aspect of the present invention, in the method for manufacturing a fluorescent screen of a color cathode ray tube according to the tenth aspect, the face panel has a relatively small heat capacity at a central portion. And

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a manufacturing process of the phosphor screen. First, after cleaning the inner surface of the face panel 1,
As shown in FIG. 1A, a photosensitive resist 11 is applied and dried by heating to form a film of the resist 11. Next, as shown in (b), a shadow mask 3 is mounted on the face panel 1 on which the photosensitive resist 11 is formed, and light emitted from a light source (not shown) such as an ultra-high pressure mercury lamp is used. The photosensitive resist 11 is exposed to light through a correction lens that approximates the trajectory of the light to the trajectory of the electron beam and a correction filter (not shown) that corrects the illuminance distribution of the light source with respect to the photosensitive resist 11. A pattern corresponding to the pattern forming area is printed. The exposure is performed three times by sequentially moving the light source to a position corresponding to the center of deflection of the color cathode ray tube. Next, the photosensitive resist 11 on which the pattern is baked is developed to remove the unexposed portions, and a resist pattern 12 corresponding to the phosphor pattern forming region is formed as shown in FIG. As the photosensitive resist, for example, a resist mainly containing polyvinyl alcohol and an azide compound is used.

Next, as shown in FIG. 2D, a black light absorbing substance such as a graphite suspension is applied to the inner surface of the face panel 1 on which the resist pattern 12 is formed, and is heated and dried. The absorption layer 13 is formed. afterwards,
The resist pattern 12 on which the light absorbing layer 13 is formed is lifted off by etching and high-pressure development to form a light absorbing layer 9 having an inverted pattern of the resist pattern 12 as shown in FIG. For the etching, for example, an acid or a peroxide is used.

Here, the opening portion of the light absorbing layer 9 will be described.
The relationship with the surface temperature of the face panel 1 when exposing the photosensitive resist 11 will be described in detail.

Since the photosensitive resist 11 applied to the face panel 1 is heated and dried before exposure, the surface temperature of the face panel 1 at the time of exposure is higher than room temperature. Although the temperature gradually decreases with the passage of time, the heat capacity of the central portion of the face panel 1 is smaller than that of the peripheral portion. Assuming that the temperature is 50 ° C., the temperature changes to 46 ° C. at the central portion during exposure of the second color, to 48 ° C. at the peripheral portion, and to 44 ° C. at the central portion and to 46 ° C. at the peripheral portion during exposure of the third color. That is, during the exposure of the first color, the temperature change particularly at the central portion becomes large.

At this time, for example, the width 9a of the aperture portion (the portion where the phosphor layer is formed) of the light absorbing layer 9 shown in FIG.
Illuminance can be adjusted so that the exposure time is 50 μm for the second and third colors, and the illuminance distribution in the face panel surface can be adjusted so that the width 9a of the opening portion is the same in the central portion and the peripheral portion. When a correction filter (a common sheet is used for the first color, the second color, and the third color) is used, since the temperature change of the first color and the second color in the central portion is large, the peripheral portion of the first color is used. Is adjusted to be 50 μm, a situation occurs in which the central portion has a width smaller than 50 μm, for example, only 48 μm.

In the present embodiment, in order to compensate for such non-uniformity of the width 9a of the opening, the region where the width 9a of the opening is small (the central portion of the face panel) when forming the phosphor layer 10. 3), the phosphor layer 10 is formed to have an optimum film thickness with the highest luminous efficiency as described below.

That is, as shown in FIG. 2, the phosphor slurry 14 of the first color is applied to the inner surface of the face panel 1 by spin coating. The color used for the first color may be any of blue, green, and red. As shown in FIG. 2A, the phosphor slurry 14 is supplied into the face panel 1 while rotating the face panel 1 at a low speed while being inclined obliquely upward with respect to the horizontal plane. The phosphor slurry 14 is
The rotation of the face panel 1 causes the inner surface of the face panel 1 to spread substantially uniformly. Next, as shown in (b), the face panel 1 is moved and the excess phosphor slurry 14 is removed while rotating the face panel 1 at a high speed while the inner surface of the face panel 1 is inclined obliquely downward with respect to the horizontal plane. Then, the phosphor layer 14 is formed (FIG. 1F). At this time, by adjusting the viscosity of the phosphor slurry 14 and the rotation speed of the face panel (hereinafter, referred to as a shake-off speed) when removing the excess phosphor slurry, the phosphor application amount in the central portion is more than that in the peripheral portion. Can also be optimized.

FIG. 3 shows that a blue phosphor slurry having a viscosity of about 20 mPa · s was used and the shake-off speed was 100 rpm to 1 rpm.
It is changed in the range of 60 rpm, and the center part (1a in FIG. 2B) and the peripheral part (1 in FIG. 2B) of the face panel 1 are changed.
The result of measuring the amount of the phosphor slurry applied in b) is shown.

In general, it is considered that the luminous efficiency is most improved when the thickness of the phosphor layer is about 1.4 times the average particle diameter of the phosphor. Also, the luminous efficiency is reduced even if it becomes larger. Average particle size is 5
When a phosphor of μm is used, the optimum film thickness is about 7 μm, which corresponds to a coating amount of about 1.8 mg / cm ² .
As can be seen from FIG. 3, when the shake-off speed of the face panel 1 is 130 rpm, the coating amount of the phosphor (film thickness of the phosphor layer) is equal between the central portion and the peripheral portion. Therefore,
In the conventional example, the shaking-off speed is set to 130 rpm, and the application amount is about 1.
It was adjusted to 80 mg / cm ² .

In the present embodiment, the swing-off speed of the face panel 1 is set to 100 rpm. At this time, the applied amount of the phosphor was about 1.80 mg in the central part from FIG.
/ Cm ² , and about 1.66 mg / cm ² at the periphery.

The phosphor layer 14 formed as described above
Is heated and dried, and as shown in FIG. 1 (g), a shadow mask 3 is mounted on the face panel 1, and a light source such as an ultra-high pressure mercury lamp is disposed at a position corresponding to the deflection center of the color cathode ray tube. The light emitted from the light source (not shown) passes through a correction lens (not shown) that corrects the illuminance distribution of the light source with respect to the phosphor layer 14 and a correction lens that approximates the trajectory of the light to the trajectory of the electron beam. Exposure,
A pattern corresponding to the phosphor pattern forming region is printed on the phosphor layer 14. Thereafter, the phosphor layer 14 on which the pattern has been printed is developed to remove the unexposed portions, and as shown in (h), a phosphor layer of any one color, such as blue, is provided in a predetermined gap of the light absorbing layer 9. The phosphor layer 10B is formed.

Such a series of phosphor layer forming steps is described as a first step.
The second color and the third color other than the color, for example, green and red phosphors are sequentially and repeatedly performed so that the blue phosphor layer 10B, the green phosphor layer 10G, and the red phosphor layer 10R are arranged in a predetermined pattern. The formed phosphor screen is formed (FIG. 1 (i)).

Thereafter, a metal is deposited on the phosphor layer to form a metal back layer 15 (FIG. 1 (j)). As the metal to be vapor-deposited, for example, a material having good electron permeability such as aluminum is used. Before forming the metal back layer 15, an organic film may be formed on the phosphor layer in order to flatten the phosphor layer.

In the present embodiment, as described above, the applied amount of the phosphor slurry (that is, the thickness of the phosphor layer) is closer to the optimum amount at the center portion of the face panel, and is further away from the optimum amount toward the periphery. Like that. Thus, according to the present embodiment, the non-uniformity that the width 9a of the aperture of the light absorbing layer is narrower toward the center of the face panel 1 and wider toward the periphery of the face panel 1 is compensated for, and the white uniformity of the display screen is compensated. Improve the sex.

The viscosity of the phosphor slurry, the swing speed of the face panel, and the amount of the phosphor applied are not limited to the above examples. For example, in FIG. 3, when the shake-off speed of the face panel 1 is set to 160 rpm, the applied amount in the central portion is smaller than the applied amount in the peripheral portion. However, by increasing the viscosity of the phosphor slurry 14, the speed is reduced to 160 rpm. Even so, the same effect can be obtained by setting the applied amount at the central portion to about 1.80 mg / cm ² . The viscosity can be set to a desired value by changing, for example, the phosphor concentration and the type of solvent.

The formation of the phosphor layer shown in the present embodiment is preferably performed on a phosphor corresponding to the color of the electron beam corresponding to the first color exposure of the photosensitive resist. This is because, as described above, the area of the aperture of the light absorbing layer formed by the exposure of the first color is the smallest as compared with the second and third colors. In addition, not only the first color, but also the phosphor corresponding to the color of the electron beam corresponding to the exposure of the second color, or all three colors may be performed. Since the area of the aperture portion of the light absorbing layer formed by the exposure of the second color or the third color is not uniform between the center portion and the peripheral portion of the face panel (although not as large as the first color), By changing the thickness of the phosphor layer in the face panel, the uniformity of the white color of the display screen can be further improved.

In the present embodiment, the case where the area of the aperture of the light absorbing layer is small in the central portion of the face panel and becomes large toward the peripheral portion, however, the deviation of the landing of the electron beam is reduced in the central portion of the face panel. The same applies to the case where the area is large and becomes smaller toward the peripheral part, or the case where the characteristics of the metal back layer are not good in the central part of the face panel and become better toward the peripheral part. That is, the deviation of the landing of the electron beam is large, or the thickness of the phosphor layer in the central portion where the characteristics of the metal back layer is not good is made to be close to the optimal thickness with good luminous efficiency, and the more it goes to the peripheral portion, The thickness may be set apart from the film thickness.

[0038]

According to the method for manufacturing a phosphor screen of a color cathode ray tube according to the first aspect of the present invention, any one of the area of the aperture of the light absorbing layer on the phosphor screen and the displacement of the landing of the electron beam is reduced on the face panel. Can be compensated for, and the uniformity of the white color of the display screen can be improved.

According to the method of manufacturing a phosphor screen of a color cathode ray tube according to the second aspect of the present invention, the influence of the fact that the characteristics of the metal back layer differ depending on the portion on the face panel is compensated, and the uniformity of the display screen is improved. be able to.

According to the method of manufacturing a fluorescent screen of a color cathode ray tube according to the third aspect of the present invention, it is not necessary to change the manufacturing apparatus used conventionally, and the method can be performed without making a significant change in the manufacturing procedure. It is possible to easily improve the white uniformity with almost no increase in cost.

According to the method of manufacturing a fluorescent screen of a color cathode ray tube according to the fourth aspect of the present invention, it is not necessary to change the manufacturing apparatus used in the prior art, and the method can be carried out without significantly changing the manufacturing procedure. It is possible to easily improve the white uniformity with almost no increase in cost.

According to the method of manufacturing a phosphor screen of a color cathode ray tube according to the fifth aspect of the present invention, it is not necessary to change a manufacturing apparatus used in the past, and the method can be performed without making a significant change in the manufacturing procedure. It is possible to easily improve the white uniformity with almost no increase in cost.

According to the method for manufacturing a phosphor screen of a color cathode ray tube according to the sixth aspect of the present invention, it is possible to improve the non-uniformity of the luminance of the phosphor screen as a whole. This makes it possible to compensate for the influence of the non-uniform area of the aperture portion of the light absorbing layer and to ensure uniform whiteness of the display screen. Further, the brightness can be adjusted without changing the average particle diameter of the phosphor, which is simple.

According to the method of manufacturing a phosphor screen of a color cathode ray tube according to the present invention, it is possible to improve the non-uniformity of the luminance of the entire phosphor screen and to assure the uniformity of the white color of the display screen. can do.

According to the method of manufacturing a phosphor screen of a color cathode ray tube according to the present invention, the non-uniformity of the luminance of the entire phosphor screen can be improved and the uniformity of the white color of the display screen can be ensured. can do.

According to the method for manufacturing a phosphor screen of a color cathode ray tube according to the ninth aspect, a desired film thickness distribution can be easily obtained. That is, it is possible to uniformly change the thickness of the phosphor layer in response to a change in luminance on the face panel.

According to the method for manufacturing a phosphor screen of a color cathode ray tube according to the tenth aspect of the present invention, the light absorbing layer generated due to the non-uniform temperature change of the face panel surface during the exposure of the photosensitive resist film. Can compensate for the unevenness of the width of the aperture portion of the aperture, and can improve the uniformity of the white color of the display screen.

According to the method of manufacturing a phosphor screen of a color cathode ray tube according to the eleventh aspect of the present invention, light absorption generated due to a large temperature drop at the center portion of the face panel during exposure of the photosensitive resist. Nonuniformity of the width of the opening portion of the layer can be compensated, and white uniformity of the display screen can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating a process of forming a phosphor screen and a metal back layer according to an embodiment of the present invention.

FIGS. 2A and 2B are schematic views showing a phosphor slurry application step according to the embodiment of the present invention, wherein FIG. 2A is a cross-sectional view showing a state where the face panel is applied obliquely upward, and FIG.
FIG. 4 is a cross-sectional view showing a state where the application is performed with the face panel facing obliquely downward.

FIG. 3 is a diagram illustrating a relationship between a rotation speed of a face panel and an application amount of a phosphor slurry in a phosphor slurry application step according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view of a color cathode ray tube having a phosphor screen according to the present invention.

FIG. 5A is a cross-sectional view and FIG. 5B is a plan view showing a black-stripe fluorescent screen according to the present invention.

[Explanation of symbols]

1 face panel, 2 funnel, 3 shadow mask, 4 phosphor screen, 5 neck, 6 electron gun, 7 electron beam, 8 deflection yoke, 9, 13
Light absorbing layer, 10 phosphor layer, 11 photosensitive resist, 12 resist pattern, 14 phosphor slurry, 15 metal back layer.

Claims (11)

[Claims] 1. A photosensitive resist film is formed on the inner surface of a face panel, and a first color, a second color, and a third color phosphor pattern forming region of the photosensitive resist film are sequentially selected. A step of developing the exposed resist film to form a resist pattern corresponding to the phosphor pattern forming region; and forming a black light on the inner surface of the face panel on which the resist pattern is formed. After the application of the absorbing substance, the light absorbing substance formed on the resist pattern is peeled off together with the resist pattern by a lift-off method, and the first color, the second color and the third color are formed by inversion of the resist pattern. Forming a light absorbing layer having an opening in the color phosphor pattern forming region; and forming a first color, a second color, and a third color phosphor layer in the opening of the light absorbing layer. A method of manufacturing a phosphor screen for a color cathode ray tube, the method comprising: when any one of an area of the aperture of the light absorbing layer and a shift of landing of an electron beam differs depending on a portion of the face panel, A method for producing a phosphor screen of a color cathode ray tube, comprising controlling the thickness of a layer. 2. A photosensitive resist film is formed on an inner surface of the face panel, and a first color, a second color, and a third color phosphor pattern forming region of the photosensitive resist film are selectively selected in this order. A step of developing the exposed resist film to form a resist pattern corresponding to the phosphor pattern forming region; and forming a black light on the inner surface of the face panel on which the resist pattern is formed. After the application of the absorbing substance, the light absorbing substance formed on the resist pattern is peeled off together with the resist pattern by a lift-off method, and the first color, the second color and the third color are formed by inversion of the resist pattern. Forming a light absorbing layer having an opening in the color phosphor pattern forming region; and forming a first color, a second color, and a third color phosphor layer in the opening of the light absorbing layer. Forming a metal back layer by vapor-depositing a metal on the phosphor layer, wherein a characteristic of the metal back layer depends on a part of the face panel. A method of manufacturing a phosphor screen for a color cathode ray tube, wherein the thickness of the phosphor layer is controlled when different. 3. When at least one of the phosphors has an area of each of the apertures of the light absorbing layer that differs depending on an area on the face panel, the fluorescent light is emitted at a location where the area of the aperture is small. 2. The method according to claim 1, wherein the thickness of the body layer is made closer to the optimum thickness having the highest luminous efficiency as compared with other portions. 4. A film thickness of the phosphor layer at a portion where the landing deviation is large, when a displacement of the landing of the electron beam is different depending on a portion on the face panel for at least one color of the phosphor layer. 2. The method for manufacturing a phosphor screen of a color cathode ray tube according to claim 1, wherein the thickness of the color cathode ray tube is approximated to an optimum film thickness having the highest luminous efficiency as compared with other portions. 5. When at least one color of the phosphor layer has different characteristics of the metal back layer depending on a portion on the face panel, the portion of the metal layer having a poor characteristic has a lower characteristic. 3. The method according to claim 2, wherein the film thickness is made closer to an optimum film thickness having the highest luminous efficiency as compared with other portions. 6. The film of the phosphor layer, wherein an area of the opening of the light absorbing layer is relatively small in a central portion of the face panel and becomes larger toward a peripheral portion of the face panel. 4. The color cathode ray tube fluorescent lamp according to claim 1, wherein the thickness is closer to the optimum film thickness at a central portion of the face panel, and is further away from the optimum film thickness toward a peripheral portion of the face panel. Surface manufacturing method. 7. The displacement of the landing of the electron beam is relatively large in a central portion of the face panel,
In a case where the thickness of the phosphor layer becomes smaller toward the peripheral portion of the face panel, the thickness of the phosphor layer is closer to the optimum thickness at the central portion of the face panel, and the thickness of the phosphor layer becomes closer to the peripheral portion of the face panel. 5. The method for producing a phosphor screen of a color cathode ray tube according to claim 1, wherein the phosphor screen is separated from the film thickness. 8. In a case where the characteristics of the metal back layer are not good at the central part of the face panel but become better toward the peripheral part of the face panel, the thickness of the phosphor layer is 6. The method according to claim 2, wherein a central portion of the face panel is closer to the optimum film thickness, and further away from the optimum film thickness toward a peripheral portion of the face panel. 9. The step of forming the phosphor layer includes the step of: forming a first color, a first color on an inner surface of the face panel on which the light absorbing layer is formed.
Applying the slurry of the second color and the third color, baking the opening pattern of the shadow mask, and then developing; applying the slurry of the phosphor to the horizontal surface of the face panel with respect to a horizontal plane. Supplying the phosphor slurry into the face panel while rotating the face panel in a state of being inclined obliquely upward, and spreading the phosphor slurry on the face panel inner surface; Removing the excess phosphor slurry while rotating the face panel in a state of being inclined obliquely downward with respect to the horizontal plane, wherein the viscosity of the phosphor slurry and the excess fluorescence of the face panel are The thickness of the phosphor layer is changed by changing the rotation speed in the step of removing the body slurry. Color cathode ray tube fluorescent screen manufacturing method according to any one of Motomeko 1-8. 10. The step of forming the resist pattern, wherein the step of forming a film of the photosensitive resist includes: a step of applying the photosensitive resist; and a step of heating and drying the applied photosensitive resist. 7. The method according to claim 6, wherein the heating is performed while the temperature of the face panel raised by the heating decreases. 11. The method of claim 10, wherein the face panel has a relatively small heat capacity at a central portion.