JP2001284787A - Flux for mounting solder ball - Google Patents
Flux for mounting solder ballInfo
- Publication number
- JP2001284787A JP2001284787A JP2001016671A JP2001016671A JP2001284787A JP 2001284787 A JP2001284787 A JP 2001284787A JP 2001016671 A JP2001016671 A JP 2001016671A JP 2001016671 A JP2001016671 A JP 2001016671A JP 2001284787 A JP2001284787 A JP 2001284787A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- solder ball
- viscosity
- mounting
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Abstract
Description
【発明の属する技術分野】本発明は、半田ボールを電極
に搭載するのに好適なフラックスに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux suitable for mounting a solder ball on an electrode.
【従来の技術】近年、ＢＧＡなどの電子部品にバンプを
形成したり、基板に半田プリコートを施すために、半田
ボールが使用されるようになってきている。この半田ボ
ールは、直径が１ミリメートル以下の小さな形状をなし
ており、電極に搭載された後に、電極に半田付けされる
ものである。ここで、半田ボールを円滑に溶融させるた
めには、半田ボールにフラックスを付ける必要がある。
ここで、半田ボールにフラックスを付けるため、次に述
べる新しい工法が実施され始めている。図６〜図１０を
参照しながら、この新しい工法について説明する。図６
中、１は水平に支持される容器、２は容器１にためられ
たフラックス、３、４はフラックス２をかき寄せてフラ
ックス２の液面を平滑化するスキージ、５、６はスキー
ジ３、４を昇降させるシリンダ、７はシリンダ５、６を
保持し、これらシリンダ５、６を図６左右方向に移動さ
せる移動テーブルである。また８はＸＹＺ方向に移動す
る移載ヘッド、９は移載ヘッド８の下部に装着され、下
方に露呈する吸引孔９ａ（図８参照）により、複数の半
田ボール１０を吸着する吸着ブロックである。ここで従
来、上述した新しい工法に適するフラックスが、知られ
ていなかったので、フラックス２として、汎用的なフラ
ックスを代用していた。2. Description of the Related Art In recent years, solder balls have been used to form bumps on electronic components such as BGA and to apply a solder precoat to a substrate. The solder ball has a small shape with a diameter of 1 mm or less, and is mounted on the electrode and then soldered to the electrode. Here, in order to melt the solder ball smoothly, it is necessary to apply a flux to the solder ball.
Here, in order to apply flux to the solder balls, a new method described below has begun to be implemented. This new method will be described with reference to FIGS. FIG.
Among them, 1 is a horizontally supported container, 2 is a flux accumulated in the container 1, 3 and 4 are squeegees for drawing the flux 2 and smoothing the liquid level of the flux 2, and 5 and 6 are squeegees 3 and 4. The cylinder 7 to be moved up and down is a moving table that holds the cylinders 5 and 6 and moves the cylinders 5 and 6 in the left-right direction in FIG. Reference numeral 8 denotes a transfer head that moves in the XYZ directions. Reference numeral 9 denotes a suction block that is mounted below the transfer head 8 and suctions a plurality of solder balls 10 by suction holes 9a (see FIG. 8) exposed downward. . Here, conventionally, a flux suitable for the above-mentioned new construction method has not been known, so that a general-purpose flux was used as the flux 2.
【発明が解決しようとする課題】そして、容器１に液状
のフラックス２をため、シリンダ５を作動してスキージ
３を下降させ、移動テーブル７を図６右方向に移動させ
ることにより、フラックス２の液面を平滑化する。しか
しながら、上述したように、汎用的なフラックスを用い
ると、図７に示すように、フラックス２がスキージ４に
沿って、上方へ這いあがってしまい、液面の平滑化が円
滑に行えないという問題点があった。そして、図８に示
すように、吸着ブロック９に半田ボール１０を吸着し
て、吸着ブロック９を下降させ、半田ボール１０の下部
をフラックス２につけ（図９（ａ））、その後吸着ブロ
ック９を上昇させることにより、半田ボール１０の下部
に適量のフラックス２を付着させるものである。しかし
ながら、汎用的なフラックスを用いると、図９（ｂ）に
示すように、半田ボール１０に付着するフラックスの量
が不足しがちであるという問題点があった。この付着す
るフラックスの量が過小であると、後工程において半田
ボール１０がスムーズに溶融せず、バンプ形成不良とな
る。さらに、この後、図１０（ａ）に示すように、バン
プを形成すべき基板１１の電極１２にフラックス２が付
いた半田ボール１０を近づけ、図１０（ｂ）に示すよう
に、吸着ブロック９を下降させて、半田ボール１０を電
極１２上に搭載し、その後吸着ブロック９を上昇させ、
図１０（ｃ）に鎖線で示すように、半田ボール１０を吸
引孔９ａから外し、電極１２上に載置することが必要と
なる。しかしながら、汎用的なフラックスを用いると、
図１０（ｃ）の実線で示すように、真空破壊後に半田ボ
ール１０が吸引孔９ａにくっついたままの状態となり、
電極１２上に載置できないことが多い。このように、従
来のフラックスでは、半田ボールの搭載が不可能になる
ことがあった。そこで、本発明者は、上述した新しい工
法に好適なフラックスの物性値及びその物性値を実現で
きる組成について、鋭意研究を行った結果、本発明を完
成するにいたったものである。すなわち本発明は、半田
ボールに転写しやすく、転写した後の半田ボールの移載
をスムーズに行うことができる半田ボールの搭載用フラ
ックスを提供することを目的とする。Then, the cylinder 5 is operated to lower the squeegee 3 and the moving table 7 is moved rightward in FIG. Smooth the liquid level. However, as described above, when a general-purpose flux is used, the flux 2 creeps upward along the squeegee 4 as shown in FIG. 7, and the liquid level cannot be smoothed smoothly. There was a point. Then, as shown in FIG. 8, the solder ball 10 is sucked to the suction block 9, the suction block 9 is lowered, and the lower part of the solder ball 10 is attached to the flux 2 (FIG. 9A). By ascending, a proper amount of flux 2 is attached to the lower part of the solder ball 10. However, when a general-purpose flux is used, as shown in FIG. 9B, there is a problem that the amount of the flux adhering to the solder ball 10 tends to be insufficient. If the amount of the adhered flux is too small, the solder ball 10 will not be smoothly melted in a subsequent process, resulting in defective bump formation. Thereafter, as shown in FIG. 10A, the solder ball 10 with the flux 2 is brought close to the electrode 12 of the substrate 11 on which the bump is to be formed, and as shown in FIG. Is lowered, the solder ball 10 is mounted on the electrode 12, and then the suction block 9 is raised.
As shown by a chain line in FIG. 10C, it is necessary to remove the solder ball 10 from the suction hole 9a and place it on the electrode 12. However, if a general-purpose flux is used,
As shown by the solid line in FIG. 10C, the solder ball 10 remains in the suction hole 9a after the vacuum breaking,
In many cases, it cannot be placed on the electrode 12. As described above, with the conventional flux, it is sometimes impossible to mount the solder ball. The inventor of the present invention has conducted intensive studies on the physical properties of the flux suitable for the above-mentioned new construction method and the composition capable of realizing the physical properties, and as a result, completed the present invention. That is, an object of the present invention is to provide a solder ball mounting flux which can be easily transferred to a solder ball and can be smoothly transferred after the transfer.
【課題を解決するための手段】本発明は、半田ボールの
電極への搭載に用いるフラックスであって、粘性比が２
以上５以下であり、かつ粘度が２Ｐａ・Ｓ以上１００Ｐ
ａ・Ｓ以下である。上記構成によれば、本発明者の実験
により、次の作用が奏されることが確認された。すなわ
ち、フラックスの液面を平滑化する際に、スキージなど
への這いあがり現象を防止することができる。また、フ
ラックスに半田ボールを付けると、十分な量のフラック
スが半田ボールの下部に付着する。さらに、フラックス
を付着させた半田ボールを電極に移載する際に、フラッ
クスが十分強い力で、電極に粘着し、半田ボールの移載
のミスを回避できる。The present invention relates to a flux used for mounting a solder ball on an electrode, the flux having a viscosity ratio of 2 or less.
Not less than 5 and the viscosity is not less than 2 Pa · S and not less than 100 P
a · S or less. According to the above-described configuration, it was confirmed by the inventor's experiments that the following effects were obtained. That is, when smoothing the liquid surface of the flux, it is possible to prevent the phenomenon of crawling on a squeegee or the like. When a solder ball is attached to the flux, a sufficient amount of the flux adheres to a lower portion of the solder ball. Furthermore, when transferring the solder ball to which the flux has been attached to the electrode, the flux adheres to the electrode with a sufficiently strong force, and mistakes in transferring the solder ball can be avoided.
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しながら説明する。なお、図中従来の構成
を示す図６〜図１０に示した構成要素と同様の構成要素
については、同一符号を付すことにより、説明を省略す
る。さて、本実施の形態におけるフラックスの配合例に
ついて、説明するに先立ち、本発明者が、実験により明
らかにした物性値について、説明する。まず、スキージ
４により、フラックス２の液面を平滑化するについて、
図１に示すように、スキージ４に接触するフラックス２
が矢印Ｒで示すように適度にローリングし、図７のよう
な這いあがり現象を生じないようにするには、粘性比が
５以下であり、かつ粘度が１００Ｐａ・Ｓ以下であれば
よいことが判明した。ここで、本明細書において、粘度
とは、２５℃においてＥ型（３°コーン）の粘度計で５
ｒｐｍの回転数で計測した粘度であり、粘性比とは、こ
の粘度計を用いて、回転数が０．５ｒｐｍの時の粘度と
５ｒｐｍの時の粘度との比である。また図２、図３に示
すように、半田ボール１０に十分な量のフラックス２を
転写できるようにするには、粘性比を２以上にすればよ
いことが判明した。さらにフラックス２を下部に付着さ
せた半田ボール１０を確実に電極１２に移載するために
は、粘度を２Ｐａ・Ｓ以上にすればよいことがわかっ
た。以上を総合すると、粘性比が２以上５以下であり、
かつ粘度が２Ｐａ・Ｓ以上１００Ｐａ・Ｓ以下という条
件を満たすフラックスであればよいということになる。
ここで、このような条件を満たすフラックスの配合例を
説明する。勿論、この配合は一例であって、本手段のフ
ラックスはこの配合例に限定されるものではない。ロジ
ンとして、不均化ロジンを４５、重合ロジンを１０含
む。また、活性剤として、プロピルアミン塩酸塩を１
０、チキソ剤としてパラフィンワックスを５、溶剤とし
て、イソプロピルアルコールを３０（以上数値はいずれ
も重量パーセント）含む。この配合例では、粘度が５Ｐ
ａ・Ｓ、粘性比が４となる。なお、ここで、粘度をより
あげた方が望ましいときは、ロジンの比率を増加し、溶
剤の比率を少なくするとよい。また、粘性比を上げたい
場合には、チキソ剤を増量すればよい。したがって、上
記フラックスを用いた本実施の形態の半田ボールの搭載
方法は、次の工程を含む。即ち、まず容器１に、粘性比
が２以上５以下であり、かつ粘度が２Ｐａ・Ｓ以上１０
０Ｐａ・Ｓ以下であるフラックス２をためる。次に、フ
ラックス２の液面をスキージ３を用いて平滑化する。こ
の際、図１に示すように、フラックス２の這いあがり現
象を生ずることはない。次に、平滑化されたフラックス
２に半田ボール１０の下部を付ける。このとき、図３
（ｂ）に示すように、十分な量のフラックス２を半田ボ
ール１０に転写できる。そして、図４、図５に示すよう
に、半田ボール１０の下部を電極１２に載せる。このと
き、図５（ｂ）に示すように、電極１２上に載った半田
ボール１０は、フラックス２の強い粘着力によって、真
空破壊後に吸引孔９ａから外れ、確実に電極１２上に残
存する。Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same components as those shown in FIGS. 6 to 10 showing the conventional configuration are denoted by the same reference numerals, and description thereof will be omitted. Prior to describing the example of mixing of the flux in the present embodiment, the physical properties which have been clarified by the present inventors through experiments will be described. First, about smoothing the liquid surface of the flux 2 by the squeegee 4,
As shown in FIG. 1, the flux 2 contacting the squeegee 4
In order to appropriately roll as shown by the arrow R and prevent the crawling phenomenon as shown in FIG. 7 from occurring, it is sufficient that the viscosity ratio is 5 or less and the viscosity is 100 Pa · S or less. found. Here, in this specification, the viscosity refers to an E-type (3 ° cone) viscometer at 25 ° C.
The viscosity is a viscosity measured at a rotational speed of rpm, and the viscosity ratio is a ratio of a viscosity at a rotational speed of 0.5 rpm to a viscosity at a rotational speed of 5 rpm using this viscometer. Further, as shown in FIGS. 2 and 3, it was found that the viscosity ratio should be set to 2 or more in order to transfer a sufficient amount of flux 2 to the solder ball 10. Further, it was found that the viscosity should be set to 2 Pa · S or more in order to transfer the solder ball 10 having the flux 2 adhered to the lower portion to the electrode 12 without fail. In summary, the viscosity ratio is 2 or more and 5 or less,
It is sufficient that the flux satisfies the condition of 2 Pa · S or more and 100 Pa · S or less.
Here, a composition example of the flux that satisfies such a condition will be described. Of course, this composition is an example, and the flux of this means is not limited to this composition example. The rosin contains 45 disproportionated rosins and 10 polymerized rosins. In addition, propylamine hydrochloride is used as an activator.
0, 5 paraffin wax as a thixotropic agent, and 30 isopropyl alcohol as a solvent (each numerical value is a weight percent). In this formulation, the viscosity is 5P
a · S and the viscosity ratio are 4. Here, when it is desirable to increase the viscosity, the ratio of the rosin may be increased and the ratio of the solvent may be decreased. When it is desired to increase the viscosity ratio, the thixotropic agent may be increased. Therefore, the method of mounting a solder ball according to the present embodiment using the above flux includes the following steps. That is, first, the container 1 has a viscosity ratio of 2 to 5 and a viscosity of 2 Pa · S to 10
Flux 2 which is 0 Pa · S or less is accumulated. Next, the liquid surface of the flux 2 is smoothed using the squeegee 3. At this time, as shown in FIG. 1, the flux 2 does not crawl. Next, the lower part of the solder ball 10 is attached to the smoothed flux 2. At this time, FIG.
As shown in (b), a sufficient amount of the flux 2 can be transferred to the solder ball 10. Then, as shown in FIGS. 4 and 5, the lower part of the solder ball 10 is placed on the electrode 12. At this time, as shown in FIG. 5B, the solder ball 10 placed on the electrode 12 is detached from the suction hole 9a after the vacuum break due to the strong adhesive force of the flux 2, and remains on the electrode 12 without fail.
【発明の効果】本発明のフラックスは、粘性比が２以上
５以下であり、かつ粘度が２Ｐａ・Ｓ以上１００Ｐａ・
Ｓ以下という条件を具備するので、スキージなどへの這
いあがり現象を防止でき、十分な量のフラックスが半田
ボールの下部に付着する。また、フラックスが十分強い
力で、電極に粘着し、半田ボールを確実に移載すること
ができる。The flux of the present invention has a viscosity ratio of 2 to 5 and a viscosity of 2 Pa · S to 100 Pa ·
Since the condition of S or less is satisfied, the phenomenon of crawling on a squeegee or the like can be prevented, and a sufficient amount of flux adheres to the lower portion of the solder ball. In addition, the flux adheres to the electrode with a sufficiently strong force, and the solder ball can be reliably transferred.
【図１】本発明の一実施の形態における半田ボールの搭
載方法の工程説明図FIG. 1 is a process explanatory view of a solder ball mounting method according to an embodiment of the present invention.
【図２】本発明の一実施の形態における半田ボールの搭
載方法の工程説明図FIG. 2 is a process explanatory view of a method for mounting a solder ball according to an embodiment of the present invention.
【図３】（ａ）本発明の一実施の形態における半田ボー
ルの搭載方法の工程説明図 （ｂ）本発明の一実施の形態における半田ボールの搭載
方法の工程説明図FIGS. 3A and 3B are process explanatory views of a method of mounting a solder ball according to an embodiment of the present invention; and FIG. 3B are process explanatory views of a method of mounting a solder ball according to an embodiment of the present invention.
【図４】本発明の一実施の形態における半田ボールの搭
載方法の工程説明図FIG. 4 is a process explanatory view of a method of mounting a solder ball according to an embodiment of the present invention.
【図５】（ａ）本発明の一実施の形態における半田ボー
ルの搭載方法の工程説明図 （ｂ）本発明の一実施の形態における半田ボールの搭載
方法の工程説明図FIG. 5A is an explanatory view showing a step of a method for mounting a solder ball according to an embodiment of the present invention. FIG. 5B is an explanatory view showing a step of a mounting method for a solder ball according to an embodiment of the present invention.
【図６】従来の半田ボールの搭載方法の工程説明図FIG. 6 is a process explanatory view of a conventional solder ball mounting method.
【図７】従来の半田ボールの搭載方法の工程説明図FIG. 7 is a process explanatory view of a conventional solder ball mounting method.
【図８】従来の半田ボールの搭載方法の工程説明図FIG. 8 is a process explanatory view of a conventional solder ball mounting method.
【図９】（ａ）従来の半田ボールの搭載方法の工程説明
図 （ｂ）従来の半田ボールの搭載方法の工程説明図FIG. 9A is a process explanatory view of a conventional solder ball mounting method. FIG. 9B is a process explanatory view of a conventional solder ball mounting method.
【図１０】（ａ）従来の半田ボールの搭載方法の工程説
明図 （ｂ）従来の半田ボールの搭載方法の工程説明図 （ｃ）従来の半田ボールの搭載方法の工程説明図FIG. 10 (a) Process explanatory view of a conventional solder ball mounting method (b) Process explanatory view of a conventional solder ball mounting method (c) Process explanatory view of a conventional solder ball mounting method
１ 容器 ２ フラックス ３ スキージ ４ スキージ ９ 吸着ブロック １０ 半田ボール １２ 電極 DESCRIPTION OF SYMBOLS 1 Container 2 Flux 3 Squeegee 4 Squeegee 9 Suction block 10 Solder ball 12 Electrode
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｂ２３Ｋ 1/00 ３３０ Ｂ２３Ｋ 3/00 Ａ 3/00 101:42 Ｂ２３Ｋ 101:42 Ｈ０１Ｌ 21/92 ６０４Ｈ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // B23K 1/00 330 B23K 3/00 A 3/00 101: 42 B23K 101: 42 H01L 21/92 604H
Claims (2)
クスであって、粘性比が２以上５以下であり、かつ粘度
が２Ｐａ・Ｓ以上１００Ｐａ・Ｓ以下であることを特徴
とする半田ボールの搭載用フラックス。1. A flux used for mounting a solder ball on an electrode, wherein the flux has a viscosity ratio of 2 or more and 5 or less and a viscosity of 2 Pa · S or more and 100 Pa · S or less. Flux for mounting.
とを特徴とする請求項１記載の半田ボールの搭載用フラ
ックス。2. The solder ball mounting flux according to claim 1, further comprising a rosin, an activator, a thixotropic agent, and a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001016671A JP3518512B2 (en) | 2001-01-25 | 2001-01-25 | Flux for mounting solder balls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001016671A JP3518512B2 (en) | 2001-01-25 | 2001-01-25 | Flux for mounting solder balls |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03521195A Division JP3204020B2 (en) | 1995-02-23 | 1995-02-23 | Solder ball mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001284787A true JP2001284787A (en) | 2001-10-12 |
| JP3518512B2 JP3518512B2 (en) | 2004-04-12 |
Family
ID=18882992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001016671A Expired - Fee Related JP3518512B2 (en) | 2001-01-25 | 2001-01-25 | Flux for mounting solder balls |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3518512B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006134891A1 (en) * | 2005-06-16 | 2006-12-21 | Senju Metal Industry Co., Ltd. | Method for soldering module substrate |
| WO2010076960A2 (en) * | 2008-11-06 | 2010-07-08 | 고려대학교 산학협력단 | Solder ball attaching method and soldering method using same |
| WO2013153616A1 (en) * | 2012-04-10 | 2013-10-17 | 富士機械製造株式会社 | Ball mounting method and substrate-working machine |
| EP3348344A1 (en) | 2017-01-13 | 2018-07-18 | Senju Metal Industry Co., Ltd | Flux |
| WO2022191227A1 (en) * | 2021-03-12 | 2022-09-15 | 千住金属工業株式会社 | Flux and method for manufacturing electronic device |
| JP2022140277A (en) * | 2021-03-12 | 2022-09-26 | 千住金属工業株式会社 | Flux and electronic device manufacturing method |
| CN117042914A (en) * | 2021-03-12 | 2023-11-10 | 千住金属工业株式会社 | Soldering flux and method for manufacturing electronic device |
-
2001
- 2001-01-25 JP JP2001016671A patent/JP3518512B2/en not_active Expired - Fee Related
Cited By (15)
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| WO2006134891A1 (en) * | 2005-06-16 | 2006-12-21 | Senju Metal Industry Co., Ltd. | Method for soldering module substrate |
| JPWO2006134891A1 (en) * | 2005-06-16 | 2009-01-08 | 千住金属工業株式会社 | Module board soldering method |
| WO2010076960A2 (en) * | 2008-11-06 | 2010-07-08 | 고려대학교 산학협력단 | Solder ball attaching method and soldering method using same |
| WO2010076960A3 (en) * | 2008-11-06 | 2010-08-19 | 고려대학교 산학협력단 | Solder ball attaching method and soldering method using same |
| KR101019385B1 (en) | 2008-11-06 | 2011-03-07 | 고려대학교 산학협력단 | Method for self-arranging of solder balls for packaging and soldering using the same |
| WO2013153616A1 (en) * | 2012-04-10 | 2013-10-17 | 富士機械製造株式会社 | Ball mounting method and substrate-working machine |
| CN104206033A (en) * | 2012-04-10 | 2014-12-10 | 富士机械制造株式会社 | Ball mounting method and substrate-working machine |
| EP2838328A4 (en) * | 2012-04-10 | 2015-05-20 | Fuji Machine Mfg | Ball mounting method and substrate-working machine |
| US9763335B2 (en) | 2012-04-10 | 2017-09-12 | Fuji Machine Mfg. Co., Ltd. | Ball mounting method and working machine for board |
| EP3348344A1 (en) | 2017-01-13 | 2018-07-18 | Senju Metal Industry Co., Ltd | Flux |
| US11305385B2 (en) | 2017-01-13 | 2022-04-19 | Senju Metal Industry Co., Ltd. | Flux |
| WO2022191227A1 (en) * | 2021-03-12 | 2022-09-15 | 千住金属工業株式会社 | Flux and method for manufacturing electronic device |
| JP2022140277A (en) * | 2021-03-12 | 2022-09-26 | 千住金属工業株式会社 | Flux and electronic device manufacturing method |
| JP7328311B2 (en) | 2021-03-12 | 2023-08-16 | 千住金属工業株式会社 | Manufacturing method of flux and electronic device |
| CN117042914A (en) * | 2021-03-12 | 2023-11-10 | 千住金属工业株式会社 | Soldering flux and method for manufacturing electronic device |
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