JP2001267869A - Method for manufacturing surface acoustic wave device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacturing method of a surface acoustic wave device, which facilitates a work process for bonding a resin cap to a casing resin base where a surface acoustic wave element is mounted, for precisely positioning the resin cap and bonding it to the casing resin base. SOLUTION: In the manufacturing method of a surface acoustic wave device, a resin cap 13 formed in an almost flat shape is bonded to the opening part of a casing resin base 12 where a surface acoustic wave element 20 is stored inside, a sheet-like resin cap 22 where plural pieces becoming the resin cap 13 are integrally formed so that they are connected in a row is divided and one piece of resin cap 13 is obtained. The resin cap 13 is bonded to the opening part of the casing resin base 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved method of manufacturing a surface acoustic wave device used as a filter for a mobile terminal in a mobile radio communication system, for example.

[0002]

2. Description of the Related Art As is well known, surface acoustic wave devices are in demand in various fields as signal filters for electric and electronic devices using electromagnetic waves, and are not limited to the field of mobile radio communication systems as described in the introduction. For example, it is widely used as a video frequency filter in a video processing field represented by, for example, a television receiver or a VTR (Video Tape Recorder).

Here, in a conventional surface acoustic wave device, a surface acoustic wave element is mounted in a metal stem in which lead pins are hermetically sealed, and the lead pins and terminals of the surface acoustic wave element are electrically connected by wire bonding. Later, it is manufactured by attaching a metal shell to a metal stem using a projection welding method, which is a type of electric resistance welding, and metal envelopes have become versatile.

In such a metal envelope, the weight of the surface acoustic wave device is increased, and the work of welding the metal stem and the metal shell becomes difficult. For this reason,
At present, a resin envelope (plastic package) using a lead frame has been increasingly used for the purpose of reducing the size and weight of a surface acoustic wave device and streamlining manufacturing operations.

The resin envelope includes a housing resin base formed by forming a resin into a substantially box shape having an opening on one surface, and a resin cap for closing the opening of the housing resin base. Of these, the housing resin base, when formed,
A die pad for mounting the surface acoustic wave element and a lead frame having a bonding pad are inserted and integrated.

In a surface acoustic wave device using the resin envelope, a surface acoustic wave element is mounted on a die pad portion of a housing resin base and fixed with an adhesive, and a surface acoustic wave device is connected to a bonding pad portion of a lead frame. After being electrically connected to the terminals of the element by wire bonding, a resin cap is placed over the opening of the housing resin base and fixed with an adhesive.

[0007]

However, in the conventional method of manufacturing a surface acoustic wave device using a resin envelope as described above, the final step of attaching a resin cap to a housing resin base is performed. In such a case, the following problems occur.

That is, the resin cap is packed in such a state that a plurality of individual pieces thereof are arranged in a grid or the like on a tray or the like in advance. Since the automatic assembly machine of the surface acoustic wave device repeatedly takes out the resin caps one by one from the tray and attaches them to the housing resin base installed in another place, the work is complicated. It will take time.

In addition, a step of separately arranging a plurality of resin caps on a tray in a grid pattern is required. Further, when the tray is conveyed, the aligned resin caps pop out even with a slight vibration, so that extreme care is required. In addition, there is also a disadvantage that the positioning when attaching the resin cap to the housing resin base cannot ensure high accuracy unless, for example, an image detecting means or the like is used.

In view of the above circumstances, the present invention has been made in consideration of the above circumstances, and aims to simplify a process of attaching a resin cap to a housing resin base on which a surface acoustic wave element is mounted, and to improve the precision of the resin cap. It is an object of the present invention to provide a method of manufacturing a very good surface acoustic wave device which can be well positioned and attached to a housing resin base.

[0011]

According to a method of manufacturing a surface acoustic wave device according to the present invention, a resin cap formed in a substantially flat shape is covered by an opening of a housing resin base accommodating a surface acoustic wave element therein. It is intended to be worn. A first step of dividing a sheet-shaped resin cap integrally formed so as to connect a plurality of pieces each serving as a resin cap in a line to obtain a piece of resin cap; and the first step And a second step of attaching the resin cap divided by the above to the opening of the housing resin base.

According to the above-described method, the resin cap is formed as a sheet-like resin cap in which a plurality of individual pieces are connected in a line. Is divided and attached to the housing resin base, so that the handling of the resin cap is easier than the conventional method in which a plurality of individual pieces of the resin cap are arranged in a grid in a tray. This is extremely convenient, and the work process of attaching the resin cap to the housing resin base on which the surface acoustic wave element is mounted can be simplified.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, FIG.
(A) and (b) are a front view and a side view showing the overall structure of the surface acoustic wave device described in the present embodiment.
In FIGS. 1A and 1B, reference numeral 11 denotes a resin envelope, which includes a housing resin base 12 made of an insulating thermosetting epoxy resin or the like and a resin cap 13.

The housing resin base 12 has a substantially rectangular flat portion 14 serving as a mounting surface thereof, and a bank portion 15 rising from a peripheral portion of the flat portion 14 at a substantially right angle to a certain height. Are integrally molded. The lead frame 16 is inserted into and integrated with the housing resin base 12 at the time of molding.

The lead frame 16 is formed of a conductive material such as a copper alloy. This lead frame 1
6 is a mounting part 17 arranged on the plane part 14,
Each has a bonding pad portion 18, and is composed of a plurality (five in the illustrated case) of lead portions 19 extending to the outside of the housing resin base 12 in a predetermined arrangement.

Then, a surface acoustic wave element 20 is fixed along the mount portion 17 of the lead frame 16 with, for example, a thermosetting adhesive or the like, and bonding between the terminals of the surface acoustic wave element 20 and the lead portion 19 is performed. Pad section 18
Are electrically connected to each other by a metallic bonding wire 21, whereby the surface acoustic wave element 20 is mounted in the housing resin base 12.

On the other hand, the resin cap 13 is molded into a flat plate that seals a substantially rectangular opening surrounded by the bank 15 of the housing resin base 12. The resin cap 13 is adhered to the housing resin base 12 with, for example, a thermosetting adhesive or the like, so that the surface acoustic wave element 20 is formed by the housing resin base 12 and the resin cap 13. Sealed inside.

In the surface acoustic wave device having the above-described configuration, a method of manufacturing a resin cap 13 on the housing resin base 12 on which the surface acoustic wave element 20 is mounted will be described below. First, as shown in FIGS. 2A to 2C, the resin cap 13 is formed in a sheet shape by connecting a plurality of (seven in the illustrated case) individual pieces to be the resin cap 13 in a row. The resin cap 22 is integrally formed.

The sheet-like resin cap 22 is made of, for example, a thermosetting epoxy resin or the like.
3 is formed in a sheet shape having a width equal to the length of the side that is the longitudinal direction.

On one surface side of the sheet-like resin cap 22, as a guideline for dividing the resin cap 13 into individual pieces by bending, the short side of the resin cap 13 is set in the width direction. A substantially V-shaped groove 23 is formed for each length of the side that is the direction.

Further, on the other surface of the sheet-shaped resin cap 22,
Four positioning projections 24 are formed.

Here, in order to attach the resin cap 13 to the housing resin base 12, first, as shown in FIG. 3 (a), the resin located at one end of the sheet-like resin cap 22 is formed. The cap 13 is placed such that the surface on which the positioning projections 24 are formed faces the opening formed by the bank 15 of the housing resin base 12 to which the surface acoustic wave element 20 is mounted.

Then, as shown in FIG. 3 (b), the resin cap 13 located at one end of the sheet-like resin cap 22 is bent from the groove 23 in the direction indicated by the arrow A in the figure to form individual pieces. To divide. Then, as shown in FIG. 3C, the divided resin cap 13 is fixed to the bank portion 1 of the housing resin base 12 by all four positioning protrusions 24.
5 so as to be fitted to the housing resin base 12.
, Where the surface acoustic wave device is to be manufactured.

FIG. 4 shows the resin cap 1 as described above.
3 shows a manufacturing apparatus for attaching 3 to a housing resin base 12. In FIG. 4, reference numeral 25 denotes a sheet-like resin cap storage unit, which stores a plurality of sheet-like resin caps 22 in a stacked manner, and a plurality of sheets stacked by a lift 27 which moves up and down by the action of a lift drive motor 26. The resin caps 22 are sequentially pushed up one by one and supplied.

The uppermost sheet-like resin cap 22 among the plurality of sheet-like resin caps 22 stacked and housed in the sheet-like resin cap storage section 25 is attached to the sheet-like resin cap transfer device 28 by suction. The sheet-like resin cap 22 is sucked by the pad 29 and transported to the dividing station 30, and is mounted between a pair of transport guides 31 formed in a substantially L-shape and supporting both ends in the width direction of the sheet-like resin cap 22.

The sheet-like resin cap 22 mounted between the pair of transport guides 31 is
A pusher 3 interposed therebetween and pressing one end of the sheet-shaped resin cap 22 by the action of the pusher drive motor 32
By 3, each individual piece is slid in one direction along the transport guide 31.

Here, a pair of sheet retainers 34 for holding both upper surface portions of the sheet-shaped resin cap 22 in the width direction are provided at the end of the conveyance guide 31 corresponding to the sliding direction of the sheet-shaped resin cap 22. I have. In addition, the same end of the transport guide 31 is provided with a resin cap 1 pushed out from the end by the pusher 33 by one piece.
An individual segmenting stage 35 for receiving the third stage 3 is provided.

The resin cap 13 pushed outward by one piece from the end of the transport guide 31 is
After being divided by the individual dividing section 37 of the individual conveying machine 36 as described later, the divided sheet is adsorbed by the individual dividing section 37 and transported to the position correction stage 38, and thereafter, is adhered to the housing resin base 12. Provided.

FIGS. 5A to 5C show a method of dividing the resin cap 13 extruded outward from the end of the transport guide 31 by one piece. That is, as shown in FIG.
5, the resin cap 13 is moved from the groove 23 by the arrow A as described above with reference to FIG.
The inclined surface 39 is formed so as to be bent in the direction shown by the arrow and divided into individual pieces.

The individual dividing section 3 of the individual conveying machine 36
7 also has an inclined surface 40 corresponding to the inclined surface 39 of the individual piece division stage 35. Further, a suction hole 41 is formed in the center of the individual divided portion 37.

Then, as shown in FIG. 5B, the resin cap 13 extruded outward by one piece from the end of the transport guide 31 is applied to the individual part 37 from above.
By pressing the inclined surface 40, the resin cap 13 is bent from the groove 23 and divided into individual pieces.

At this time, since the suction hole 41 of the individual divided portion 37 is closed by the resin cap 13, the air in the suction hole 41 is sucked out, as shown in FIG. The resin cap 13 can be adsorbed to 37 and transported to the position correction stage 38.

According to the above-described embodiment, the resin cap 13 is formed as a sheet-like resin cap 22 in which a plurality of individual pieces are connected in a line, and the end of the sheet-like resin cap 22 is manufactured at the time of manufacture. The individual pieces of the resin cap 13 are divided one by one and attached to the housing resin base 12.

For this reason, the handling of the resin cap 13 can be made much more convenient than in the conventional case in which a plurality of individual pieces of the resin cap are arranged in a grid on a tray. It is possible to simplify the work process of attaching the resin cap 13 to the housing resin base 12 on which the surface acoustic wave element 20 is mounted.

Further, four positioning projections 24 are formed on the resin cap 13, and the four positioning projections 24 are fitted to the bank 15 of the housing resin base 12. And is attached to the housing resin base 12 so that the resin cap 13
Can be easily and accurately positioned and attached to the housing resin base 12.

Here, in the above-described embodiment, a substantially V-shaped groove 23 is formed on one surface as a guideline for dividing the sheet-shaped resin cap 22. Not limited to, for example, substantially V
It is conceivable to form letter-shaped grooves, or to form perforations or the like.

It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified and implemented without departing from the scope of the invention.

[0038]

As described in detail above, according to the present invention,
The work process of attaching the resin cap to the housing resin base on which the surface acoustic wave element is mounted is simplified, and the resin cap can be accurately positioned and attached to the housing resin base. A good method for manufacturing a surface acoustic wave device can be provided.

[Brief description of the drawings]

FIG. 1 is a view for explaining an embodiment of a method of manufacturing a surface acoustic wave device according to the present invention and is shown for explaining the overall structure of the surface acoustic wave device.

FIG. 2 is a view for explaining a detailed structure of a sheet-shaped resin cap in the embodiment.

FIG. 3 is a side sectional view for explaining a manufacturing method of attaching the resin cap to the housing resin base in the embodiment.

FIG. 4 is a perspective view showing an example of a manufacturing apparatus for attaching the resin cap to the housing resin base in the embodiment.

FIG. 5 is a view for explaining an operation of dividing the individual pieces of the resin cap from the sheet-shaped resin cap in the manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... resin envelope, 12 ... housing resin base, 13 ... resin cap, 14 ... plane part, 15 ... bank part, 16 ... lead frame, 17 ... mount part, 18 ... bonding pad part, 19 ... lead part, DESCRIPTION OF SYMBOLS 20 ... Surface acoustic wave element, 21 ... Bonding wire, 22 ... Sheet-shaped resin cap, 23 ... Groove, 24 ... Positioning protrusion, 25 ... Sheet-shaped resin cap storage part, 26 ... Lift drive motor, 27 ... Lift, 28 ... Sheet-shaped resin cap conveyor, 29: suction pad, 30: dividing station, 31: conveyance guide, 32: pusher drive motor, 33: pusher, 34: sheet presser, 35: individual dividing stage, 36: individual conveying 37, individual piece dividing section, 38: position correction stage, 39, 40: inclined surface, 41: suction hole.

Claims (7)

[Claims] In a method of manufacturing a surface acoustic wave device in which a resin cap formed in a substantially flat shape is attached to an opening of a housing resin base accommodating a surface acoustic wave element therein, each becomes a resin cap. A first step of dividing a sheet-like resin cap integrally formed so as to connect a plurality of pieces in a line to obtain a resin cap of the piece, and the resin cap divided in the first step. And a second step of attaching the surface acoustic wave device to the opening of the housing resin base. 2. The surface acoustic wave according to claim 1, wherein a guideline for division is formed on the sheet-like resin cap so that the guide can be divided into individual resin caps by bending. Device manufacturing method. 3. The sheet-shaped resin cap is formed in a sheet shape having a width corresponding to a length of a side that is a longitudinal direction of the resin cap formed in a substantially rectangular shape. A manufacturing method of the surface acoustic wave device according to the above. 4. The method for manufacturing a surface acoustic wave device according to claim 3, wherein the guideline for division is a substantially V-shaped groove formed on one surface of the sheet-shaped resin cap. . 5. The method for manufacturing a surface acoustic wave device according to claim 1, wherein a positioning projection is formed on the resin cap when the resin cap is attached to the housing resin base. 6. The method according to claim 1, wherein the first step includes forming an inclined surface formed on the resin cap located at an end of the sheet-shaped resin cap in an individual piece portion moving in a direction perpendicular to one surface thereof. The method for manufacturing a surface acoustic wave device according to any one of claims 2 to 5, wherein the resin cap is divided by pressing the resin cap. 7. The method of manufacturing a surface acoustic wave device according to claim 6, wherein a suction hole for sucking the divided resin cap is formed on the inclined surface of the individual piece dividing portion. .