JP2001267787A - Mold plate - Google Patents

Mold plate

Info

Publication number
JP2001267787A
JP2001267787A JP2000071426A JP2000071426A JP2001267787A JP 2001267787 A JP2001267787 A JP 2001267787A JP 2000071426 A JP2000071426 A JP 2000071426A JP 2000071426 A JP2000071426 A JP 2000071426A JP 2001267787 A JP2001267787 A JP 2001267787A
Authority
JP
Japan
Prior art keywords
resin
sheet
molded
paper
decorative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000071426A
Other languages
Japanese (ja)
Inventor
Hideo Tsukito
秀夫 月東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aica Kogyo Co Ltd
Original Assignee
Aica Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aica Kogyo Co Ltd filed Critical Aica Kogyo Co Ltd
Priority to JP2000071426A priority Critical patent/JP2001267787A/en
Publication of JP2001267787A publication Critical patent/JP2001267787A/en
Pending legal-status Critical Current

Links

Landscapes

  • Building Environments (AREA)
  • Panels For Use In Building Construction (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve the problem where the electromagnetic wave generated at an electronic apparatus induces malfunction of surrounding electronic apparatus, and recently, as with a portable telephone set, use of highly integrated apparatus of high frequency is increased, and it is difficult to take countermeasure against troubles with respect to circuitry. SOLUTION: The problem is solved using a mold plate where mold sheets comprising resin-processed carbon fiber paper and metal mesh are stacked and molded. The one with a decorative sheet laminated on the molds sheet where a decorative paper and the like is resin-processed is used in the same way as a conventional building material. In particular, the one with a phenolic resin used as the mold sheet is very useful as a decorative material and the like with fire resistance and slow-burning characteristics.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する分野】本発明は電磁波シールド機能を持
つ化粧材に関わり、詳しくは信号動作周波数が100M
Hzあるいはそれ以上の周波数の電磁波をシールドでき
る電磁波シールド性能を持つ成形板に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cosmetic material having an electromagnetic wave shielding function.
The present invention relates to a molded plate having electromagnetic wave shielding performance capable of shielding electromagnetic waves having a frequency of Hz or higher.

【0002】[0002]

【従来技術】デジタル電子機器より発生する電磁波は周
辺の電子機器の誤作動を誘発して電磁波障害の原因とな
る。また近年、半導体の集積度が高くなつていること、
信号作動周波数が100MHz以上での利用が多くなつ
ていることなどから放射ノイズが高周波域にシフトして
きており回路上での発生防止対策だけで解決を図ること
が難しくなってきている。
2. Description of the Related Art Electromagnetic waves generated by digital electronic devices cause malfunctions of peripheral electronic devices and cause electromagnetic interference. In recent years, the degree of integration of semiconductors has increased,
Radiation noise has shifted to a high frequency region due to the increasing use at signal operating frequencies of 100 MHz or higher, and it has become difficult to achieve a solution only by measures to prevent occurrence on a circuit.

【0003】[0003]

【発明が解決しようとする課題】電子機器、例えば医療
分野で使用される各種電子機器、例えばペースメーカー
等が外部から透過した電磁波により誤作動を招くなどの
医学的に看過できない問題は緊急に解決すべき課題とな
つている。しかし普及率が急速に伸びている携帯電話等
の電子機器は周りにおいて頻繁に使用されるため絶えず
誤作動が引き起こされる恐れが潜在している。また公的
建物例えば会議室、劇場、美術館、映画館等において携
帯電話に外部からかかる通信は周辺の迷惑となってい
る。本発明になる化粧材はこのような状況に鑑み、建物
の内装、パーテイション等の部材として使用することに
より、周辺の電子機器から透過してくる電磁波をシール
ドし、建築物内部で使用される電子機器の誤作動を防止
したり、公的建物等での迷惑を回避できる成形板を提供
することにある。
Problems that cannot be overlooked medically, such as malfunction of electronic devices, for example, various electronic devices used in the medical field, for example, pacemakers and the like due to electromagnetic waves transmitted from the outside, are urgently solved. It is a task to be done. However, electronic devices such as mobile phones, whose penetration rate is rapidly increasing, are frequently used in the surroundings, and there is a danger that malfunctions will occur constantly. In a public building such as a conference room, a theater, a museum, a movie theater, and the like, communication from the outside to a mobile phone causes annoying surroundings. In view of such a situation, the cosmetic material according to the present invention shields electromagnetic waves transmitted from peripheral electronic devices by using it as a member of a building interior, partition, etc. An object of the present invention is to provide a molded plate capable of preventing malfunction of equipment and avoiding trouble in a public building or the like.

【0004】[0004]

【課題を解決するための手段】本発明の成形板は電磁波
シールド性能を確保するために炭素繊維(以下CFとい
う)から抄造された炭素繊維紙紙(以下CPという)を
使用し、該CPに樹脂、例えばフェノール樹脂を含浸し
てなる成形シート(以下SSという)と金属メッシュ
(以下MMという)もしくは該MMに樹脂処理した処理
シート(以下SYSという)とを単独あるいは基材層と
して使用し、基材層として使用した場合は、これら基材
層の上に紙、化粧紙等の多孔質な基材にメラミン樹脂等
の樹脂を含浸処理したシート(以下DSという)を重ね
て熱圧成形されたものからなる。
Means for Solving the Problems The molded plate of the present invention uses carbon fiber paper (hereinafter referred to as CP) made of carbon fiber (hereinafter referred to as CF) in order to secure electromagnetic wave shielding performance. A molded sheet (hereinafter referred to as SS) impregnated with a resin, for example, a phenol resin, and a metal mesh (hereinafter referred to as MM) or a treated sheet obtained by resin-treating the MM (hereinafter referred to as SYS) alone or as a substrate layer, When used as a substrate layer, a sheet (hereinafter referred to as DS) obtained by impregnating a porous substrate such as paper or decorative paper with a resin such as a melamine resin on the substrate layer is formed by hot pressing. Consisting of

【0005】該CFは、いわゆるパン系、ピッチ系のい
ずれでもあつても使用できる。該CFの繊維径は4〜8
μm、繊維長4μ〜10mmの素材が使用される。該C
Pとしての体積抵抗率は坪量10g/m2で1.5×1
-3Ω・cmがあり、坪量がこれ以上であればより低い
体積抵抗率が得られる。本発明における該CPの坪量は
10〜150g/m2のものが使用できるが、坪量が大
きくなれば性能は確保できるものの、コスト高となるた
め適合する坪量が選定されればよい。また、他の繊維た
とえばパルプ、麻等の天然繊維、或いはポリエステル、
ナイロン、ビニロン等の合成繊維等が許容範囲である体
積抵抗率を確保できる範囲において混抄されたCPであ
つても良い。
[0005] The CF can be used in any of so-called pan and pitch systems. The fiber diameter of the CF is 4 to 8
A material having a length of 4 μm and a fiber length of 4 μm to 10 mm is used. The C
The volume resistivity as P is 1.5 × 1 at a basis weight of 10 g / m 2.
0 −3 Ω · cm, and if the basis weight is more than this, a lower volume resistivity can be obtained. In the present invention, a basis weight of the CP of 10 to 150 g / m 2 can be used, but if the basis weight is large, the performance can be secured, but the cost is high, so that a suitable basis weight may be selected. In addition, other fibers such as pulp, natural fibers such as hemp, or polyester,
Synthetic fibers such as nylon and vinylon may be mixed CPs in a range that can secure an acceptable volume resistivity.

【0006】該MMは線径0.02〜2.0mmのステ
ンレス、真鍮、銅、アルミニュウム等の金属繊維から平
織加工されたもので20〜300メッシュの織り密度の
ものが望ましい。該MMには他の層との密着のため必要
により該CPと同様な樹脂により対重量比で5〜20%
程度処理された該SYSとして使用されてもよい。
The MM is made of a metal fiber such as stainless steel, brass, copper, aluminum or the like having a wire diameter of 0.02 to 2.0 mm, and is preferably plain woven and has a woven density of 20 to 300 mesh. 5-20% by weight of the MM with the same resin as the CP if necessary for adhesion to other layers
The degree processed SYS may be used.

【0007】該CPに含浸処理される樹脂として、例え
ばフェノール樹脂、ポリエステル樹脂、エポキシ樹脂等
が例示され、この中でもフェノール樹脂は含浸処理性に
優れ、耐火性があり、自己消化性で難燃性がある、炭化
による遮炎効果がある、コスト的にも有利である等の特
徴があるため建築用材料としての観点から好ましい。該
フェノール樹脂は一般のメラミン樹脂化粧板に採用され
ているレゾールタイプが含浸処理に適し、また同一ライ
ンで加工できることから適合している。樹脂率は対重量
比40〜80%が適合する。
Examples of the resin to be impregnated with the CP include phenolic resins, polyester resins, epoxy resins and the like. Among them, phenolic resins are excellent in impregnating properties, have fire resistance, are self-extinguishing, and are flame-retardant. It is preferable from the viewpoint of building materials because it has features such as the presence of a flame barrier effect due to carbonization and the advantage of cost. As the phenol resin, a resol type used for a general melamine resin decorative board is suitable for the impregnation treatment and can be processed in the same line, so that it is suitable. A resin ratio of 40 to 80% by weight is suitable.

【0008】シートはパルプ繊維等から抄造された紙或
いは合成繊維、天然繊維より加工された不織布等あるい
はこれらに模様柄等が印刷加工された多孔質な基材に樹
脂、好ましくは熱硬化性樹脂、例えばメラミン樹脂、ポ
リエステル樹脂、ジアリルフタレート樹脂等を含浸処理
して加工されたものが使用される。該基材に対する含浸
処理率は対重量比50〜100%が好ましい。また、天
然木からなる突板や挽板等の樹脂処理あるいは未処理材
も化粧シートとして使用できる。
The sheet is made of paper or synthetic fiber made of pulp fiber or the like, nonwoven fabric processed from natural fiber, or a porous substrate on which a pattern or the like is printed. For example, a resin processed by impregnation with a melamine resin, a polyester resin, a diallyl phthalate resin or the like is used. The impregnation rate for the substrate is preferably 50 to 100% by weight. In addition, resin-treated or untreated materials such as veneers and ground plates made of natural wood can also be used as decorative sheets.

【0009】本発明になる成形板は該CP間に該MMを
配したり、複数枚の該SSと該MMもしくは該SYSと
を重ね成形されるか、更にその上に該DSを重ねて熱圧
して成形されるが、場合により最上層に坪量10〜50
g/m2程度の薄紙に該DSに使用したと同様な樹脂を
含浸処理してなるオーバーレイを重ねて成形したり、該
SSの上に該SSに使用した樹脂または該CFの色調を
隠蔽するために酸化チタン等の隠蔽性のある物質を混抄
したバリアー紙に該DSに使用したと同様な樹脂等によ
り含浸加工したシートを配して成形仕上げする方法も採
用されてもよい。
In the molded plate according to the present invention, the MM is arranged between the CPs, a plurality of the SSs and the MMs or the SYSs are laminated or molded, or the DSs are further laminated thereon and heat is formed. It is molded by pressing.
An overlay formed by impregnating a resin similar to that used for the DS on a thin paper of about g / m 2 is formed by overlapping, and the color tone of the resin used for the SS or the CF is hidden on the SS. For this purpose, a method in which a sheet impregnated with a resin or the like used in the DS or the like is disposed on a barrier paper mixed with a material having an opaque property such as titanium oxide, and then formed and finished may be adopted.

【0010】本発明の成形板を内装材料として使用する
場合は、成形板の継ぎ目部に金属箔に粘着剤をコートし
た導電性テープ、紙や樹脂フィルムの表面に金属蒸着し
たシートの裏面に粘着剤のコートされた導電性テープ等
を接着するか、成形板の継ぎ目部に導電性シーリング材
を充填した状態あるいは導電性テープと導電性シーリン
グ材とを併用して、壁下地に接着またはビス等にて施工
するとともにアース接続すれば継ぎ目部からのシールド
漏れ等の問題を回避することができる。
When the molded plate of the present invention is used as an interior material, a conductive tape in which a metal foil is coated with an adhesive at a joint portion of the molded plate, or a metal or metal sheet on the surface of a paper or a resin film is adhered to the back surface of the sheet. Glue a conductive tape, etc. coated with an agent, or apply a conductive sealing material to the joint of the molded plate, or use a combination of a conductive tape and a conductive sealing material to bond or glue to the wall base. If it is constructed and grounded, problems such as leakage of the shield from the joint can be avoided.

【0011】次に本発明について実施例を比較例ととも
に説明する。 実施例1 繊維径4〜7μm、繊維長5〜7mmのCFを抄造して
調製した坪量50g/m2、体積抵抗率1.2×10-3
Ω・cmのCPにレゾールタイプフェノール樹脂を含
浸、乾燥して対CP重量比40%付着させたSSを得
た。 また線径0.1mm、メッシュサイズ100のス
テンレス平織に該CPと同一の樹脂を50g/m2付着
させたSYSを得た。一方、パルプ紙に印刷を施した坪
量100g/m2の化粧紙にメラミン樹脂を含浸、乾燥
して対化粧紙重量比60%付着させたDSを得た。該S
Sの間に該MMを配し、その上に該DSを重ね120
℃、40kg/cm 2で熱圧して実施例1の成形板を得
た。
Next, examples of the present invention will be described together with comparative examples.
Will be described. Example 1 CF having a fiber diameter of 4 to 7 μm and a fiber length of 5 to 7 mm was formed.
Prepared basis weight 50 g / mTwo, Volume resistivity 1.2 × 10-3
Ω · cm CP contains resol type phenolic resin
Soak and dry to obtain SS with 40% weight ratio of CP to CP
Was. In addition, a wire with a wire diameter of 0.1 mm and a mesh size of 100
50 g / m of the same resin as the CP in Tenres plain weaveTwoAdhesion
The obtained SYS was obtained. On the other hand, tsubo printed on pulp paper
100g / mTwoImpregnated with melamine resin and dried
Thus, a DS having a decorative paper weight ratio of 60% was obtained. The S
The MM is placed between S, and the DS is placed on the MM.
° C, 40kg / cm TwoTo obtain the formed plate of Example 1.
Was.

【0012】実施例2 実施例1に使用したSSとSYSの間に坪量180g/
2のクラフト紙に実施例1に使用したフェノール樹脂
を対重量比70%含浸したクラフト含浸紙を各1枚挟み
実施例1と同様に成形板を成形した。
Example 2 A basis weight of 180 g / SS was used between SS and SYS used in Example 1.
A molded plate was formed in the same manner as in Example 1 except that one kraft paper impregnated with 70% by weight of the phenolic resin used in Example 1 was impregnated into m 2 kraft paper.

【0013】比較例1 実施例1においてSS、SYSに代えて坪量180g/
2のクラフト紙に実施例1に使用したと同一樹脂を対
クラフト紙重量比50%付着させたシートを4枚重ね、
その上に実施例1と同一のDSを重ねて120℃、40
kg/cm2で熱圧して比較例1の成形板を成形した。
Comparative Example 1 In Example 1, the basis weight was 180 g /
The same resin as that used in Example 1 was attached to kraft paper of m 2 in an amount of 50% by weight with respect to kraft paper, and four sheets were overlapped.
Then, the same DS as in Example 1 was placed thereon, and the temperature was set to 120 ° C. and 40 ° C.
The molded plate of Comparative Example 1 was molded by applying heat and pressure at kg / cm 2 .

【0014】比較例2 実施例1に使用したSSを2枚使用して実施例1と同様
に比較例2の成形板を成形した。
Comparative Example 2 A molded plate of Comparative Example 2 was formed in the same manner as in Example 1 except that two SSs used in Example 1 were used.

【0015】実施例の成形板、比較例の成形板並びに参
考として厚み0.3mmの銅板について電界及び磁界に
おける減衰率を100〜1000MHzの周波数に亘り
電界及び磁界について測定した結果は表1及び2の通り
であつた。
Tables 1 and 2 show the results obtained by measuring the electric and magnetic field attenuation factors over the frequency of 100 to 1000 MHz for the molded plate of the example, the molded plate of the comparative example, and the copper plate having a thickness of 0.3 mm for reference. It was on the street.

【0016】[0016]

【表1】 注) 測定単位 減衰率 dB 測定方法 アドバンテステスト法(MIL−STD−
285)による。
[Table 1] Note) Measurement unit Decay rate dB Measurement method Advantage test method (MIL-STD-
285).

【0017】[0017]

【表2】 注) 測定単位 減衰率 dB 測定方法 アドバンテステスト法(MIL−STD−
285)による。
[Table 2] Note) Measurement unit Decay rate dB Measurement method Advantage test method (MIL-STD-
285).

【0018】実施例及び比較例の成形板及び銅板に補強
材として9ミリ合板を接着してた板体を使用して縦、
横、高さが各50センチのボックスを作成し、内部に携
帯電話もしくはPHSを置いたのち、各板体の継ぎ目部
を銅箔に導電性粘着剤が塗布されたテープにて密封し
た。外部のPHSもしくは携帯電話から内部の携帯電話
もしくはPHSへの通信の可不可について通信テストし
た結果は表3の通りであつた。
Using a plate obtained by bonding 9 mm plywood as a reinforcing material to the molded plate and the copper plate of the examples and comparative examples,
A box having a width and a height of 50 cm was prepared. A mobile phone or a PHS was placed inside the box, and the joint of each plate was sealed with copper tape coated with a conductive adhesive. Table 3 shows the results of a communication test on whether communication from an external PHS or mobile phone to an internal mobile phone or PHS was possible.

【0019】[0019]

【表3】 注) 可 外部機器より内部機器への通信ができ
る。 不可 外部機器より内部機器への通信ができない。
[Table 3] Note) Yes External devices can communicate with internal devices. Not possible Communication from the external device to the internal device is not possible.

【0020】[0020]

【発明の効果】本発明になる成形板は樹脂処理された複
数枚の炭素繊維紙と金属メッシュからなる基材層が一体
に成形してなるものであるため、銅板と同程度の優れた
電磁波シールド性能を備え、外部からの電磁波の透過を
強力に遮断することができる。ことに化粧紙を基材に使
用したシートが成形されたものでは一般の化粧材と同一
外観をもつため壁面、天井等の内装材として従来通り使
用できる。従って各種の電子機器を設置した事務室、作
業室、計測室や各種医療機器を設置した医療室等にの
壁、天井等の内装材としての役割を果たすことができ、
同時にこれら室内に設置したこれらの電子機器の誤作動
を防止できる。
The molded plate according to the present invention is formed by integrally molding a plurality of resin-treated carbon fiber papers and a base material layer made of a metal mesh. It has shielding performance and can strongly block transmission of electromagnetic waves from outside. In particular, a sheet formed using a decorative paper as a base material has the same appearance as a general decorative material, and can be used as an interior material such as a wall surface or a ceiling as in the past. Therefore, it can play a role as an interior material such as walls, ceilings, etc. in offices, work rooms, measurement rooms where various electronic devices are installed, and medical rooms where various medical devices are installed, and the like.
At the same time, malfunction of these electronic devices installed in these rooms can be prevented.

【0021】また各種の会議室、ホール等の公的建物等
に使用されれば外部からの通信を遮断することができ、
公的場所として快適な利用ができる。殊に成形シートの
樹脂にフェノール樹脂使用された場合はフェノール樹脂
の難燃性、耐火性が加わるため防火性の高い機能性内装
材として利用価値が高いものとなる。また金属メッシュ
が積層されているため強度に優れ、割れたり、破断した
りすることがない。
When used in public buildings such as various conference rooms and halls, external communication can be cut off.
Comfortable use as a public place. In particular, when a phenolic resin is used as the resin for the molded sheet, the phenolic resin has high flame retardancy and fire resistance, so that it has a high utility value as a functional interior material having high fire resistance. Also, since the metal mesh is laminated, the strength is excellent, and it is not broken or broken.

フロントページの続き Fターム(参考) 2E001 DH01 GA23 GA24 GA25 GA28 GA32 GA42 HB03 HB04 HB05 HC07 HD11 JA29 JC02 JD02 LA04 2E162 CB10 CB16 CB21 CD11 FA20 FB07 FB09 FC01 FC03 FD04 FD06 5E321 AA11 AA41 AA44 BB21 BB25 BB33 BB34 BB41 CC16 GG05 GH10 Continued on the front page F term (reference) 2E001 DH01 GA23 GA24 GA25 GA28 GA32 GA42 HB03 HB04 HB05 HC07 HD11 JA29 JC02 JD02 LA04 2E162 CB10 CB16 CB21 CD11 FA20 FB07 FB09 FC01 FC03 FD04 FD06 5E321 AA11 BB21 BB33

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】樹脂処理された炭素繊維紙と金属メッシュ
とからなる成形シートが重ねられ、熱圧して成型されて
いることを特徴とする成形板。
1. A molded plate characterized by being formed by laminating molded sheets made of resin-treated carbon fiber paper and a metal mesh and applying heat and pressure.
【請求項2】化粧仕上げされた紙もしくは不織布等の多
孔質な基材に樹脂の含浸処理されたシートが成形シート
の上部の表面層に積層され成形されていることを特徴と
する請求項1記載の成形板。
2. A sheet obtained by impregnating a resin with a porous base material such as a paper or a non-woven fabric which has been subjected to decorative finishing is laminated and formed on the upper surface layer of the formed sheet. The molded plate as described.
【請求項3】フェノール樹脂が成形シートに使用されて
いることを特徴とする請求項1或いは請求項2記載の成
形板。
3. The molded plate according to claim 1, wherein a phenolic resin is used for the molded sheet.
JP2000071426A 2000-03-15 2000-03-15 Mold plate Pending JP2001267787A (en)

Priority Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020526029A (en) * 2017-09-30 2020-08-27 シーアールアールシー チンタオ シーファン カンパニー,リミティッド Nickel-plated carbon fiber film, its manufacturing method, shield structure and its manufacturing method
JP7027587B1 (en) 2021-02-12 2022-03-01 株式会社ユウホウ Electromagnetic wave shielding material and its manufacturing method
JP7421971B2 (en) 2020-03-26 2024-01-25 北越コーポレーション株式会社 Electromagnetic wave absorber and its manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020526029A (en) * 2017-09-30 2020-08-27 シーアールアールシー チンタオ シーファン カンパニー,リミティッド Nickel-plated carbon fiber film, its manufacturing method, shield structure and its manufacturing method
JP7421971B2 (en) 2020-03-26 2024-01-25 北越コーポレーション株式会社 Electromagnetic wave absorber and its manufacturing method
JP7027587B1 (en) 2021-02-12 2022-03-01 株式会社ユウホウ Electromagnetic wave shielding material and its manufacturing method
WO2022173009A1 (en) * 2021-02-12 2022-08-18 株式会社ユウホウ Electromagnetic wave shielding material and method for producing same
JP2022123743A (en) * 2021-02-12 2022-08-24 株式会社ユウホウ Electromagnetic wave shield material and method for manufacturing the same

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