JP2001267352A5 - - Google Patents

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Publication number
JP2001267352A5
JP2001267352A5 JP2000073363A JP2000073363A JP2001267352A5 JP 2001267352 A5 JP2001267352 A5 JP 2001267352A5 JP 2000073363 A JP2000073363 A JP 2000073363A JP 2000073363 A JP2000073363 A JP 2000073363A JP 2001267352 A5 JP2001267352 A5 JP 2001267352A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000073363A
Other languages
Japanese (ja)
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JP2001267352A (ja
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Publication date
Application filed filed Critical
Priority to JP2000073363A priority Critical patent/JP2001267352A/ja
Priority claimed from JP2000073363A external-priority patent/JP2001267352A/ja
Publication of JP2001267352A publication Critical patent/JP2001267352A/ja
Publication of JP2001267352A5 publication Critical patent/JP2001267352A5/ja
Pending legal-status Critical Current

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JP2000073363A 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法 Pending JP2001267352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000073363A JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000073363A JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Publications (2)

Publication Number Publication Date
JP2001267352A JP2001267352A (ja) 2001-09-28
JP2001267352A5 true JP2001267352A5 (cg-RX-API-DMAC10.html) 2007-04-26

Family

ID=18591618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000073363A Pending JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Country Status (1)

Country Link
JP (1) JP2001267352A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods

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