JP2001260882A - Bonding condition checking system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding condition checking system adopting general sensors as sensor portions without using special displacement sensors for taking in all changes of output signals from the sensor portions and verifying these to thereby reduce the cost and size thereof and assure high reliability. SOLUTION: The bonding condition checking system comprises at least four bonding checking instruments CC1-CC6 arranged for a set of turnouts, sensors provided in the bonding checking instruments CCI-CC6 for measuring spaces between each of basic rails 1, 2 and each of movable rails 3, 4 at each point for the turnouts and a bonding condition checking data processor 5 for taking in output signals from the sensors for the bonding checking instruments, so that hysteresis check is performed in accordance with the taken-in output signals, followed by matching check of whether a specific relationship is established or not.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a high-speed railway, such as a Shinkansen, in which a branching tong rail is converted.
The present invention relates to a bonding state checking system that checks the bonding state between a bonding side tongue rail and a basic rail and determines whether the bonding is performed within an allowable value.

[0002]

2. Description of the Related Art In a railway branching device, an adhesion checker is used for confirming the adhesion state between a basic rail and a movable rail at the end of the conversion operation.

[0003] Conventionally, in this bonding illuminator, a rotary encoder (dual-system signal output) of a special displacement sensor has been used as a bonding state illuminating device for performing adjustment work using a displacement sensor and a microprocessor. (For example, see Japanese Patent Application Laid-Open No. 10-129483).

[0004]

However, the above-mentioned conventional bonding state checking device has a problem that the cost is increased because a special displacement sensor dedicated to the use is used.

The present invention has been made to solve the above problems, and has a sensor unit employing a general sensor without using a special displacement sensor for exclusive use. All changes in output signals of each sensor unit are taken in and verified. Accordingly, it is an object of the present invention to provide an adhesion state checking device that can reduce the cost and size and can ensure high reliability.

[0006]

In order to achieve the above object, the present invention provides: [1] In a bonding state checking system, at least four bonding checking devices are arranged in one set of branching devices, and each bonding checking device is arranged. The apparatus is provided with a sensor for measuring the distance between the basic rail and the movable rail at one point of the branching device, and is provided with an adhesion state inspection data processing device for taking in an output signal from the sensor of each adhesion illuminator. , And a consistency check is performed to determine whether or not there is a specific relationship.

[2] In the bonded state checking system according to the above [1], two sensors are arranged in each bonded checking device.

[3] In the bonding state checking system according to the above [2], a correlation check between the two sensors is performed.

[4] In the bonding state checking system according to the above [1], the sensor is an absolute type magnetic induction type encoder.

[5] The bonding state checking system according to [1], wherein the sensor is an absolute type rotary encoder.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic view of a bonded state checking system showing an embodiment of the present invention, and FIG. 2 is a diagram showing an operation state of a bonded state inspector of the bonded state checking system.

As shown in FIG. 1, in a railway turnout, at the end of the conversion operation, to check the bonding state between the basic rails 1 and 2 and the movable rails 3 and 4, for example, bonding checkers CC1 to CC6 are used. used.

Then, information from each bonding checker is taken into the bonding state checking data processing device 5, and the basic rails 1, 2 are read.
Check the state of adhesion between the movable rails 3 and 4. For example, as shown in FIG. 2, the bonding illuminators CC1 to CC3 have the localization N closed, the inversion R is open, and the adhesion illuminators CC4 to CC6 have the orientation N open and the inversion R closed. Thus, the adhesion checker CC1
CC3 to CC3 are closed, CC4 to CC6 are open, the movable rail 4 is separated from the basic rail 1, the basic rail 2 and the movable rail 3 are bonded, and the turnout is open to the straight side. Can be confirmed.

FIG. 3 is a plan view of an adhesive illuminator showing an embodiment of the present invention, and FIG. 4 is a side view of the adhesive illuminator.

In these figures, reference numeral 2 denotes a basic rail, 3
Is a movable rail, 10 is an adhesive illuminator, 11 is a mounting bracket for the adhesive illuminator, 12 is a housing, 13 is a push rod, 14 is a drive rack, 15 is an adjustment screw, 16 is an encoder (sensor),
17 is a connector.

Here, as the encoder (sensor) 16, a simple commercially available encoder may be used, and it is not necessary to use a special encoder (a rotary encoder having a double-system signal output as shown in the above cited example). As the encoder of this embodiment,
A linear magnetic induction encoder that can provide an absolute output can be used. Also, a commercially available absolute type rotary encoder can be used.

Therefore, it is not necessary to prepare a special encoder (sensor) 16, and the size and weight can be reduced.

FIG. 5 is a schematic diagram (part 1) of an adhesive illuminator showing an embodiment of the present invention.

As shown in this figure, in the bonding illuminator 20 of this embodiment, the operation of the push rod 21 can be detected by two sensors (encoders) 22 and 23.

In this embodiment, a "correlation check" is performed on the outputs of the two sensors.

FIG. 6 is a schematic diagram (part 2) of an adhesive illuminator showing an embodiment of the present invention.

As shown in this figure, in the bonding illuminator 30 of this embodiment, the operation of the push rod 31 can be detected by one sensor (encoder) 32.

According to this embodiment, the structure can be greatly simplified.

However, "correlation check" cannot be performed.

Hereinafter, the operation of the bonding state checking system according to the present invention will be described.

[0027] All of the adhesion checkers CC1 to CC shown in FIG.
All the changes in the output signal of No. 6 are taken into the adhesion state inspection data processing device 5, and "correlation check", "history check", and "consistency check" are performed on the change of this signal.

Here, specifically, first, when two sensors (encoders) are built in the same bonded illuminator (see FIG. 5), the two sensor output signals are correlated with each other. Sex check ”. The "correlation check" is, for example, a case where the relationship between the A sensor 22 and the B sensor 23 is "10" when the relationship is added (FIG. 9). Note that the numbers with circles shown below indicate the state of the sensor.

For example, if the A sensor 22 is
If the B sensor 23 is and if the A sensor 22 is then OK if the B sensor 23 is. On the other hand, when the A sensor 22 is, and the B sensor 23 is, the addition of the A sensor value and the B sensor value does not become "10", so that there is no specific relationship. NG and the operation is on the safe side (stop signal). For example, the adhesion state check is NG, and entry of the traveling vehicle is prohibited.

Next, when "correlation check" is OK and when there is one sensor, "history check" is performed. Here, “history check” will be described.

The "history check" in the case where the pattern of the output information from the sensor is ----- as shown in FIG. 7 is, for example, as shown in FIG. Is OK when moving to, but NG when moving directly to something else
Is determined to be.

FIG. 9 shows an example of "history check" when two sensors are used. When the current state indicates a pointer, the outputs are A = and B =. This signal is A =,
If B = or A =, B =, it is determined that the sensor is operating normally, and if it has changed to any other state, it is determined that it is abnormal. For example, the case of A =, B = or A =, B = or A =, B = corresponds to this.

Finally, a "consistency check" is performed. In the case of a branching device, when six bonded inspectors are arranged,
The sensors of the six bonded illuminators have a relational diagram 2 defined by the turning operation of the branching device.

The "consistency check" will be described in detail.

The switching operation of the branching device has the following determined characteristics.

The turning time of the switch is the time when the display of the switch changes from N to R or R to N, and this time is determined by the switch.

When the switch is N or R, the adhesive illuminator is in the state shown in FIG.

When the switch is switched, first, the display of the switch is in a state C (neutral) in which neither N nor R is displayed. This C
FIG. 2 showing the relationship between the adhesion checkers does not hold only in the case of.

As described above, when FIG. 2 is not established, the operation is on the safe side (stop signal).

That is, 1. When the time during which the relationship in FIG. 2 does not hold exceeds the conversion time. For example, if the conversion time is 10 seconds, the state in which FIG. 2 does not hold continues for 10 seconds or more. For example, the determination time can be set to “20 seconds or more”.

2. After the display changes to N or R, FIG.
2. If the relationship does not hold In the case where the relationship in FIG. 2 does not hold even though the display does not change between N and R. When the state as described in 1 to 3 is reached, the output of this apparatus is NG and the operation is on the safe side.

It is also possible to change or add features other than those described above that accompany the switching operation of the branching device.

It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0044]

As described above, according to the present invention, the following effects can be obtained.

(A) It is not necessary to prepare a special sensor (encoder), so that the configuration can be simplified and the size and weight can be reduced. Further, maintenance can be facilitated.

(B) In a device such as a signal security system which requires high reliability of data, the cost of the entire system can be reduced while ensuring the reliability.

[Brief description of the drawings]

FIG. 1 is a schematic view of an adhesion state checking system according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating an operation state of an adhesion state inspector of the adhesion state inspection system according to the embodiment of the present invention.

FIG. 3 is a plan view of an adhesive illuminator showing an embodiment of the present invention.

FIG. 4 is a side view of the bonding illuminator showing the embodiment of the present invention.

FIG. 5 is a schematic diagram (No. 1) of an adhesive illuminator showing an embodiment of the present invention.

FIG. 6 is a schematic diagram (part 2) of an adhesive illuminator showing an embodiment of the present invention.

FIG. 7 is a diagram showing a pattern of output information from a sensor.

FIG. 8 is a diagram showing whether or not output information is transferred from a sensor.

FIG. 9 is a diagram showing an example of a specific relationship indicating an embodiment of the present invention.

[Explanation of symbols]

 1, 2 Basic rail 3, 4 Movable rail CC1 to CC6, 10, 20, 30 Adhesion illuminator 5 Adhesion state inspection data processing device 10 Adhesion illuminator 11 Mounting bracket for adhesive illuminator 12 Housing 13, 21, 31 Push rod 14 Drive rack 15 Adjustment screw 16 Encoder (sensor) 17 Connector 22, 23 2 sensors (encoder) 32 1 sensor (encoder)

Claims (5)

[Claims] 1. A bonded state checking system comprising: (a)
At least four bonded illuminators in a set of diverters, (b) each bonded illuminator having a sensor for measuring the distance between a basic rail and a movable rail at one point of the diverter, and (c)
An adhesion state inspection data processing device for taking in an output signal from a sensor of each adhesion inspector is provided. (D) A history check is performed based on the acquired output signal, and (e) whether or not there is a specific relationship. A bonding state checking system, which performs a consistency check of the adhesive. 2. The bonded state inspection system according to claim 1, wherein two of said sensors are arranged in each of the bonded illuminators. 3. The bonded state checking system according to claim 2, wherein a correlation check between the two sensors is performed. 4. The bonded state inspection system according to claim 1, wherein the sensor is an absolute magnetic induction type encoder. 5. The bonded state inspection system according to claim 1, wherein the sensor is an absolute type rotary encoder.