JP2001255672A - Porous photoreceptor and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and inexpensively manufacture a cylindrical porous photoreceptor having a porous layer formed with many through-holes at a specified thickness. SOLUTION: A transparent conductive film 2b and a photosensitive resin layer 37 are formed on the inside surface of a matrix 34 constituted by forming light shielding film patterns 32 on the outside surface of a translucent cylinder 31 and are exposed to form photosensitized parts 37a and nonphotosensitized parts 37b. A photoconductive layer 5 and lower electrode 6 are successively laminated (e) on the inside surfaces. A translucent substrate 7 is formed on the inside surfaces (f). The matrix 34 is removed (g). The photosensitive resin layer 37 is developed and upper electrode 2 and porous layers 4 are formed (h).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a copier, a facsimile,
The present invention relates to a photoreceptor having a porous layer having a large number of micropores on its surface (hereinafter, referred to as a “porous photoreceptor”) and a method of manufacturing the same. The present invention relates to the manufacturing method.

[0002]

2. Description of the Related Art As an image forming technique of a conventional copier / printer, there is an electrophotographic process, which is widely applied. A representative example of this process is the Carlson method (xerography). In this method, printing is performed through six steps of charging, exposure, development, transfer, fixing, and cleaning, and a dedicated unit is required for each step, so that the size of the entire apparatus cannot be avoided. Japanese Patent Application Laid-Open No. 9-20409 discloses a simplified electrophotographic process replacing the Carlson method.
There is an image recording method disclosed in Japanese Patent Application Laid-Open Publication No. H06-209, No. 2 (KOKAI).

FIG. 14 is a sectional view schematically showing an image recording apparatus of this type. In FIG. 14, the image recording device 2
1 is a porous photoreceptor 1, a conductive roller 22, a counter electrode 2
3, a light source 24 and a controller (not shown). The porous photoconductor 1 is rotatably held on a shaft (not shown) via a flange. Thereby, V
It rotates in the direction indicated by the arrow at a speed of 2. The conductive roller 22 has a thin layer of conductive particles 26 thinned by the regulating blade 25, and is disposed upstream of the porous photoconductor 1 in the rotation direction. The porous photoreceptor 1 includes a translucent support 7, a lower electrode 6, a photoconductive layer 5, a porous layer 4 having a through hole 4 a formed thereon, and an upper electrode 2. The counter electrode 23 is disposed downstream of the porous photoconductor 1 in the rotation direction. A recording medium 27 is disposed on the porous photoconductor 1 side of the counter electrode 23. The recording medium 27 is conveyed in a direction indicated by an arrow at a speed of V1 by driving a conveying device (not shown) during image recording. Light source 24
Are arranged in the porous photoreceptor 1, and therefore, the printing method using the porous photoreceptor by this method is classified as a kind of so-called back exposure method.

A controller (not shown) includes a recording medium 2
The control unit controls the ratio between the transport speed of the photoconductor 7 and the peripheral speed of the porous photoconductor 1. That is, the controller adjusts the peripheral speed ratio so as to correspond to the print data, and forms a good print balanced in the vertical and horizontal directions on the recording medium 27 during image recording. Reference numeral 26 in the figure denotes the porous photoconductor 4 at the time of image recording.
The recording medium 2 flies from the inside of the through hole 4a of the porous layer 4 in the
7 are conductive particles that adhere to the substrate. Image recording in the image recording device 21 configured as described above is performed as follows. First, an electric field is formed between the lower electrode 6 and the conductive roller 22 by applying a voltage between the lower electrode 6 and the upper electrode 2 and between the upper electrode 2 and the conductive roller 22.

At this time, the conductive particles 26 on the conductive roller 22 are negatively inductively charged and are filled in the openings (through holes 4a) of the porous photoreceptor 1. In addition, the conductive particles 26 colliding with the upper electrode 2 are charged to a positive polarity and return to the conductive roller 22. Therefore, the conductive particles 26 are filled only in the through holes 4a so as to have a potential equal to the potential of the upper electrode 2. And since the electric field on the particle layer surface approaches zero,
The conductive particles 26 are confined in the through holes 4a. Next, in the image recording unit, the lower electrode 6 and the counter electrode 23
Is formed, and the light source 24 irradiates the photoconductive layer 5 with exposure light 8 corresponding to image information. At this time, the conductivity of the irradiated portion in the photoconductive layer 5 increases, and the charges of the conductive particles 26 in the through holes 4a leak through the photoconductive layer 5. For this reason, the potential of the conductive particles 26 in the through hole 4a approaches the potential of the lower electrode 6, and an electric field is generated on the layer surface of the conductive particles 26, and the conductive particles 26 on the upper electrode 2 side.
Is positively charged, flies from the through-hole 4a, and adheres to the recording medium 27. Thus, an image can be recorded on the recording medium 27. As described above, according to this printing method, the conductive colored particles are contained in the pores of the porous photoconductor in which the insulating porous layer having the upper electrode formed on the upper surface is laminated on the surface of the photoconductive layer. The conductive particles are selectively fly to the counter electrode side through the recording paper by irradiating exposure light according to print information, and the conductive particle filling step, the exposure flying step, the fixing Since the printing process is completed in three of the processes, the size of the apparatus can be reduced.

As described above, Japanese Patent Application Laid-Open No. 9-204092
In the image recording method disclosed in Japanese Patent Application Laid-Open Publication No. H10-270, since one of a large number of holes is a minimum printing constituent unit (1 dot), the number of conductive particles in the holes is reduced in order to secure a certain or more image density. In order to set the depth of the resulting holes, that is, the thickness of the porous layer to a certain value or more, and to obtain a high-resolution image, it is necessary to make the distance between the holes small and dense. In order to ensure the printing speed, it is necessary to continuously process the printing process described above. For this reason, the porous photoreceptor should be formed into a cylindrical or endless belt, and the printing process should be performed while rotating the belt. Is preferred. The above is what is required for the performance of the porous photoreceptor, and a method for producing the porous photoreceptor that satisfies these conditions and also takes into account mass productivity is desired. That is, in consideration of the total number of holes, it is preferable to punch all or some of the holes at once instead of sequentially opening the holes one by one from the viewpoint of reducing the number of working steps. At this time, there should be no portions where holes are not formed in the porous layer, that is, portions where printing cannot be performed, and it is more preferable that the holes are arranged at regular intervals over the entire circumference. The present inventors have already proposed a method for manufacturing a porous photoconductor in consideration of the above in Japanese Patent Application No. 11-245754.

FIGS. 15A to 15F are sectional views in the order of steps showing a method for manufacturing a porous photoreceptor proposed in the above-mentioned prior application. In the method of manufacturing the porous photoreceptor, before performing the illustrated steps, first, a metal mesh sleeve serving as an upper electrode is formed as follows. That is, a cylindrical conductive matrix having an outer diameter substantially equal to the inner diameter of the metal mesh sleeve to be prepared is prepared, and a position corresponding to the opening of the mesh to be prepared is provided on the conductive matrix. An insulating coating is applied with a photoresist or the like. Then, a metal such as nickel is deposited by electroforming using the insulating film as a mask to form a metal mesh sleeve to be the upper electrode 2 '. Thereafter, the insulating coating is removed, and the cylindrical conductive matrix is pulled out.

In FIG. 15, the upper part of the figure represents the upper electrode (metal mesh sleeve) and the front side of the porous photosensitive member. As shown in FIG. 15A, a photosensitive resin layer 37 made of a positive photosensitive material is formed on the inner wall surface of the upper electrode (metal mesh sleeve) 2 '. Next, FIG.
As shown in (b), the photosensitive resin layer 37 not covered with the upper electrode 2 'is exposed to light using the photosensitive light R to form a photosensitive portion 37a. Next, as shown in FIG. 15C, development is performed to remove the photosensitive portion 37a, and the through hole 4a is removed.
Is formed. Next, as shown in FIG. 15D, a photoconductive layer 5 composed of a charge transport layer 5b and a charge generation layer 5a is formed in this order on the inner wall of the porous layer 4 pierced by the above process. Thereafter, as shown in FIG. 15E, a lower electrode 6 is formed on the inner wall surface of the charge generation layer 5a using a light-transmitting conductive material. Further, when it is necessary to increase the strength of the porous photoreceptor 1, a translucent support 7 is formed on the inner wall surface of the lower electrode 6, as shown in FIG.

[0009]

Problems to be Solved by the Invention Japanese Patent Application No. 11-2457
In the manufacturing method proposed in No. 54, a metal mesh sleeve serving as a support for a porous photoreceptor is formed by an electroforming method, and this method is adopted because the metal mesh sleeve is In order to support the entire porous photoreceptor and to function as an upper electrode, strength and conductivity are necessary, and the interval and diameter of the fine holes formed in the cylinder are as fine as those of the porous photoreceptor. This is because it is preferable to use an electroforming method that enables precise molding transfer. However, since the electroforming method involves electrodeposition, it generally takes a long time to obtain a desired thickness, and it is inconvenient in terms of cost and time to apply it as a component of a mass-produced porous photoreceptor. is there. Further, at the time of forming an electroformed product, it is necessary to mask an area where metal is not desired to be deposited with a resist or the like, and a photolithography technique is generally used for forming a pattern of the resist. Here, the method of exposing the resist can be roughly classified into a method in which a pattern is sequentially drawn by a laser beam or the like and a method in which the pattern is exposed, and a collective exposure method in which light is irradiated through a mask or the like in which a pattern is previously drawn. The former sequential exposure is based on CAD data transmission and ON /
Although it takes time for the OFF control, it is possible to expose a cylindrical object while maintaining the hole pattern arrangement.

In the latter batch exposure method, all or a part of the pattern is exposed collectively, so that the irradiation is completed in a short time. However, in the case of a cylindrical object, the mask is generally planar, so Disorder of pattern arrangement is likely to occur at joints. In the case of the above-mentioned prior application in which one electroformed product is used for one porous photoreceptor, collective exposure is usually performed in consideration of the above man-hours. Cheap. In addition, there are problems such as pattern loss due to abnormal growth at the time of electrodeposition peculiar to the electroforming method, and particularly, in a cylindrical electroformed product, the metal mesh sleeve is easily deformed and it is difficult to separate from the matrix. Was. An object of the present invention is to solve the above-mentioned problems of the prior art, and an object of the present invention is to form a porous layer having a constant thickness and a large number of holes on a cylindrical photoconductive layer. An object of the present invention is to make it easy to manufacture a low-cost porous photoreceptor.

[0011]

According to the present invention, there is provided a cylindrical porous layer made of an organic insulator having a large number of micropores, and an outer periphery of the porous layer. A first electrode layer formed of a transparent conductive film having micropores of the same pattern as the plurality of micropores formed on a surface thereof; a photoconductive layer formed on an inner peripheral surface of the porous layer; A porous electrode comprising: a second electrode layer formed of a transparent conductive film formed on an inner peripheral surface of the layer; and a light-transmitting support formed on an inner peripheral surface of the second electrode layer. Body, is provided.

According to the present invention, in order to solve the above-mentioned problems, according to the present invention, a first electrode layer having a large number of fine holes is formed on a surface, and an insulating layer having the same pattern of fine holes as the large number of fine holes. The method for producing a porous photoreceptor in which the porous layer of the above is laminated on the laminate of the second electrode layer and the photoconductive layer,
(1) A step of forming a light-shielding film having a pattern substantially corresponding to the large number of micropores on the first main surface of the translucent temporary base having the first main surface and the second main surface. (2) forming, in this order, a conductive layer for forming the first electrode layer and a photosensitive resin insulating layer on the second main surface of the temporary base material; Exposing the resin insulating layer from the first main surface side of the temporary base; and (4) forming the photoconductive layer, the second electrode layer, and the light-transmitting support on the exposed resin insulating layer. Forming a body layer in this order; (5)
After removing the temporary base, the resin insulating layer is developed by performing development of the resin insulating layer and the conductive layer in the micropore portion, and the porous layer and the first electrode layer are removed. Forming a porous photoreceptor, comprising the steps of:

According to the present invention, in order to solve the above-mentioned problems, according to the present invention, a first electrode layer having a large number of fine holes is formed on the surface, and an insulating layer having fine holes of the same pattern as the large number of fine holes is formed. The method for producing a porous photoreceptor in which the porous layer of the above is laminated on the laminate of the second electrode layer and the photoconductive layer,
(1 ′) A light-shielding film having a pattern substantially matching the large number of micropores is formed on the first main surface of the translucent temporary base having the first main surface and the second main surface. Process and
(2 ′) A conductive layer for forming the first electrode layer, a photosensitive resin insulating layer, the photoconductive layer, and the second electrode on the second main surface of the temporary base material. Forming a layer and a light-transmitting support layer in this order; (3 ') exposing the resin insulating layer from the first main surface side of the temporary base; After removing the base material, the resin insulating layer is developed to remove the resin insulating layer and the conductive layer in the micropores, thereby forming the porous layer and the first electrode layer. And a process for producing a porous photoreceptor.

Preferably, the pattern corresponding to the minute holes formed in the light-shielding film of the temporary base is in the main scanning direction and the sub-scanning direction.
Each is continuously arranged at regular intervals. Preferably, in the step (1) or the step (1 ′), a light-shielding film is deposited on the first main surface of the temporary base material, and the light-shielding film is patterned by a photolithography method. Or a step of forming a photographic emulsion layer on the first main surface of the temporary base material and exposing and developing the photographic emulsion layer. More preferably, the pattern of the light-shielding film is formed by sequentially drawing each micropore shape on the first main surface of the temporary base material. Preferably, the temporary base has a cylindrical shape, and is used repeatedly in a process of manufacturing a plurality of porous photoconductors.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2 are a perspective view and a sectional view, respectively, showing a porous photoreceptor according to an embodiment of the present invention. In FIG. 2, the outside of the cylinder is shown above the figure. 3 and FIGS. 5 to 12. 1 and 2, the porous photoreceptor 1
Includes an upper electrode 2, a porous layer 4, a photoconductive layer 5, a lower electrode 6, and a translucent support 7, and further includes a flange and a shaft (not shown) for holding and driving. As shown in FIGS. 1 and 2, the upper electrode 2 and the porous layer 4 are arranged at equal intervals in the axial direction (main scanning direction), and furthermore, in the circumferential direction (sub scanning direction). Micro-holes 2a and through-holes 4 arranged at equal intervals with different / or same intervals
a are established. In the figure, the shape of the fine holes 2a is illustrated as a lattice shape, that is, a rectangular shape, as an example. However, the planar shapes of the fine holes and the through holes produced by the present invention are not limited to this, Holes of various shapes such as a circle, an ellipse, a square, and a honeycomb shape can be produced. In the porous photoreceptor 1, a photoconductive layer 5, a lower electrode 6, and finally a translucent support 7 are sequentially laminated in a predetermined thickness on the inner peripheral surface of the upper electrode 2 via a porous layer 4. Formed. The porous layer 4 has the same pattern of through-holes 4 a communicating with the respective fine holes 2 a of the upper electrode 2, and is laminated on the inner peripheral surface of the upper electrode 2. The entire porous layer 4 is formed of a photosensitive resin. The photoconductive layer 5 has a charge generation layer 5a and a charge transport layer 5b, and is laminated on the inner peripheral surface of the porous layer 4 so as to close the through hole 4a. Exposure light (not shown) corresponding to print information at the time of image recording is shown in FIG.
When the photoconductive layer 5 is irradiated from the lower part of the photoconductive layer 5 via the lower electrode 6 and the translucent support 7, charges are generated from the charge generation layer 5a in accordance with the exposure amount. On the other hand, the charge transport layer 5b transports the charge generated from the charge generation layer 5a to the surface of the photoconductive layer 5, and when there is a counter charge of the opposite polarity to the generated charge on the surface of the photoconductive layer 5, the charge is transferred to the middle. To eliminate the charge. Both the upper electrode 2 and the lower electrode 6 have translucency, but the former transmits light (not shown) for exposing a photosensitive resin layer for forming the porous layer 4, The latter is for transmitting exposure light (not shown) corresponding to print information to the photoconductive layer 5 during image formation. The lower electrode 6 is formed uniformly on the translucent support, while the upper electrode 2 is formed only on the portion of the porous layer 4 other than the through holes 4a. An image recording apparatus using the porous photoreceptor of the present invention thus configured is shown in FIG.
4 is similar to that of the prior art described with reference to FIG. Therefore, description of the image recording apparatus using the porous photoreceptor of the present invention and its operation will be omitted. .

Next, a method for manufacturing a porous photoreceptor of the present invention will be described with reference to the drawings. In the first embodiment of the present invention, for the porous photoreceptor, a light-transmitting master is first prepared (“preparing a master”) (FIG. 3), and an upper electrode is formed on the inner peripheral wall surface of the master. Form a layer ("formation of the top electrode"), then
After laminating a photosensitive resin layer on the inner peripheral surface of the upper electrode (“formation of photosensitive resin layer”), the resin layer is exposed to a hole pattern (“pattern exposure of photosensitive resin layer”). ), A photoconductive layer, a lower electrode layer, and a translucent support layer are sequentially laminated on the inner peripheral surface of the photosensitive resin layer (“Formation of photoconductive layer, lower electrode layer, translucent support layer”). After that, the master is pulled out of the porous photoreceptor (“removal of the master”), and finally, the exposed insulating layer is developed to form a porous layer. 5 (a) to 6 (h) and FIGS. 7 (a) to 8 (h)].

Further, in the second embodiment of the present invention, the porous photoreceptor can be used in the steps of “preparing a matrix”, “forming an upper electrode”, and “forming a photosensitive resin layer”. Is the first
Performed in the same manner as in the embodiment, after that, after the process of "formation of photoconductive layer, lower electrode layer, translucent support", "pattern exposure to insulating layer" process, It is formed through the steps of “removal” and “development of the photosensitive resin layer” (above, FIGS. 9A to 10H). Further, in the third embodiment of the present invention, the porous photoreceptor includes the above-described “manufacture of a matrix”, “formation of an upper electrode”, “formation of a photosensitive resin layer”, and “formation of a photosensitive resin layer”. The steps up to the step of "pattern exposure" are performed in the same manner as in the first embodiment. Immediately after the photosensitive processing, "development of the photosensitive resin layer" is performed. A photoconductive layer, a lower electrode layer,
After sequentially laminating the translucent support layers (“formation of photoconductive layer, lower electrode layer, translucent support layer”), the master is pulled out of the porous photoreceptor (“removal of the master”). It is manufactured by going through each of the steps.
(H)]. Which one of the first, second, and third embodiments is selected is determined in consideration of the resolution of the porous layer and the mass productivity of the porous photoconductor. That is, in the case of the first embodiment, since there is no lower layer of the photosensitive resin layer at the time of the photosensitive step, the resolution is excellent (described later). On the other hand, in the case of the second embodiment, the coating process of each layer can be performed continuously, which has an advantage of excellent workability.
Further, according to the third embodiment, high resolution can be obtained, and damage to the upper electrode can be minimized.

In the present specification, the photosensitive resin layer and the porous layer refer to the same layer, but are developed (hole processing).
The layer after the step is performed is particularly referred to as a porous layer. Further, as described above, "exposure", which irradiates light corresponding to image information during printing, and "photosensitization", which forms a pattern on a photosensitive resin, are distinguished. Was used as is.

[0019]

Next, preferred embodiments of the present invention will be described in detail with reference to the drawings. [Example 1] "Preparation of master block" Figs. 3A to 3F are cross-sectional views in the order of steps showing a method of manufacturing a master block used in an embodiment of the present invention. First, a transparent cylinder 31 having a smooth inner surface, a high roundness, and an inner diameter substantially corresponding to the outer diameter of the porous photoreceptor to be manufactured is formed, for example, with high precision finished glass. It is manufactured using a tube (FIG. 3A).
This translucent cylinder 31 has a matrix of a porous photoreceptor (master).
The purpose of this step is to provide a light-transmitting cylinder 31 with a light-shielding film pattern after fabrication.
Is commonly used as a matrix in Examples 1 to 4. However, the light-shielding film pattern formed depending on whether the photosensitive resin used is a negative type or a positive type is inverted. Using the light-transmitting cylinder 31 with the light-shielding film pattern as a matrix,
Each layer of the porous photoreceptor is sequentially laminated on the inner wall surface of the light-transmitting cylinder 31 to produce a porous photoreceptor. Therefore, high precision is particularly required for the inner diameter of the light-transmitting cylinder 31. Further, as a function of the mask carrier, it is required to transmit light sufficient for exposing the photosensitive resin (described later). Assuming that these two conditions are satisfied, here, an inner diameter of 50 ± 0.1 mm having a thickness of 1.0 ± 0.1 mm.
A 0.1 mm quartz glass tube was used. Further, a fine hole pattern is formed on the outer surface of the light transmitting cylinder 31. As a forming method thereof, a conventionally known semiconductor mask manufacturing technique can be applied. For example, a method in which a photographic emulsion (emulsion) is applied to the outer surface of the light-transmitting cylinder 31 and then patterned to form a light-shielding film pattern can be used. However, a method for forming a light-shielding film pattern using a thin film forming technique and a photolithography technique will be described here. That is, a thin metal film such as chromium is formed as a light-shielding film 32a on the outer surface of the light-transmitting cylinder 31 to a uniform film thickness by a sputtering method, a vapor deposition method, or the like [FIG. Next, a photosensitive resist resin film 33a is formed on the light shielding film 32a to have a uniform film thickness (FIG. 3C). Thereafter, the resist resin film 33 is exposed and developed in a pattern described later,
A resist resin film pattern 33 having a desired pattern is formed (FIG. 3D). Next, using the resist resin film pattern 33 as a mask, an unnecessary light-shielding film 32a is removed by wet or dry etching to form a light-shielding film pattern 32 (FIG. 3E). After that, if the resist resin film pattern 33 is peeled off, the manufacturing process of the matrix 34 for manufacturing the porous photoreceptor of the present invention is completed [FIG. 3 (f)].

Here, the light-shielding film pattern 32 shown in FIG. 3F will be described. Since the matrix 34 is used as a mask for manufacturing the porous photoreceptor 1, the light-shielding film pattern 32 must be formed on the outer surface uniformly and without defects over the entire circumference. Therefore, FIG.
As shown in (c), the resist resin film 33a is
It is necessary that the resist resin film 33a be formed uniformly on the surface 2a and that the resist resin film 33a can be patterned [FIG. The former can be achieved by applying a liquid resist by a dip coating method, and the latter can be achieved by using a sequential photosensitive method such as a laser drawing apparatus. The pattern is shown in FIG.
As shown in FIG. 4B and FIG. 4C, two light-shielding film patterns 32 having a positive-negative relationship are selected and used (these are selected depending on the type of a photosensitive resin described later). FIG. 4A is a pattern diagram of the hole shape on the surface of the porous layer to be produced, and the portions corresponding to the upper electrode 2 and the minute holes 2a (the porous layer 4 and the through holes 4a) are negative. In the pattern of FIG. 4B used for the mold photosensitive resin,
The light-transmitting portion 32b and the light-shielding film pattern 32 are provided, respectively. In the pattern of FIG. 4C used for the positive photosensitive resin, the light-shielding film pattern 32 and the light-transmitting portion 32b are provided, respectively.

Further, in order to easily pull out the completed porous photoreceptor from the light-transmitting cylinder 31 (release will be described later), the inner peripheral surface of the light-transmitting cylinder 31 shown in FIG. May be applied. Matrix 34 (light-transmitting cylinder 31 having light-shielding film pattern 32) manufactured by the above method
Is a mold, so it can be used a plurality of times, and it is not necessary to manufacture one photoreceptor like an electroformed metal mesh sleeve. Is advantageous.

[Formation of Transparent Conductive Film] Next, as shown in FIG. 5A, the upper electrode of the porous photosensitive member 1 of FIG. 2 is formed. Here, the light-transmitting cylinder 31 is a cylinder, and it is difficult to uniformly form a conductive layer on the inner wall of the cylinder, so that metal sputtering, vacuum evaporation, and the like are not suitable.
Therefore, a method of applying a conductive coating liquid was used. The coating liquid is 50% in the wavelength range of the irradiated light after film formation so that the light irradiated from the outer periphery of the light transmitting cylinder 31 reaches the photoconductive layer formed on the inner peripheral wall of the light transmitting cylinder. As described above, a light transmittance of preferably 60% or more is required. This is because if the transmittance is lower than that, it becomes difficult to give a contrast between the photosensitive portion and the non-photosensitive portion when the photosensitive resin described later is exposed, and it becomes impossible to form a hole in the photosensitive resin layer. In addition, since the mold is separated from the light-transmitting cylinder 31, it is desirable that the resin has better adhesion to the photosensitive resin layer than the inner wall surface of the light-transmitting cylinder 31. Further, as described later, it is desirable that the resin is dissolved in a developing solution at the time of forming a hole and is discharged together with the resin in the hole at the time of forming the hole. Therefore, an ITO translucent conductive coating liquid of an alcohol solvent manufactured by Sumitomo Osaka Cement Co., Ltd. was used. Using this transparent conductive coating solution, a transparent conductive film 2b was formed as follows by the coating method shown in FIG.

When the dip coating method shown in FIG. 13A is used, a cover mask 35 is formed on the outer peripheral surface of the matrix 34, and the matrix 34 is immersed in a tank filled with the transparent conductive coating solution 2c. The film is pulled up at 2 mm / sec, and a transparent conductive film 2b is formed on the inner and outer peripheral surfaces. The transparent conductive film attached to the outer periphery of the light-transmitting cylinder is removed together with the cover mask 35. FIG.
In the case of using the stage descent coating method shown in FIG. 6B, the stage 36 is filled with the transparent conductive coating liquid 2c, and the stage is lowered to lower the coating surface dammed by the stage, so that the inner peripheral surface of the matrix 34 is transparent. The conductive film 2b is formed. When the spin coating method shown in FIG. 13C is used, a proper amount of the transparent conductive coating liquid 2c is applied in a line in the axial direction on the inner peripheral surface of the matrix 34, and the matrix 34 is rotated at a high speed. As a result, a transparent conductive film having a uniform thickness is obtained by centrifugal force. After forming the coating film, it is dried. By this drying step, the transparent conductive film 2b is temporarily fixed on the inner peripheral wall surface of the light-transmitting cylinder 31. Even when the photosensitive resin layer 37 described below is formed, the transparent conductive film 2b does not peel off, Can be kept on top. Further, in this state, the photosensitive resin layer 37 can be redispersed in an organic solvent such as alcohol, so that it can be discharged and removed together with a portion of the photosensitive resin which will become a through hole in a developing step of the photosensitive resin layer 37 described later. Finally, after “removal of the master block” and “development of the photosensitive resin layer” described later, 10 minutes in a thermostat.
The upper electrode (transparent conductive film) is fired at 0 to 180 ° C. to form the upper electrode 2 having a thickness of about 30 nm and a sheet resistance of about 2 × 10 ³ Ω / □. After the aforementioned drying step,
Proceeding to the “forming photosensitive resin layer” step, the photosensitive resin layer 37 is formed on the inner peripheral surface of the transparent conductive film as described below.

"Formation of photosensitive resin layer" Photosensitive insulating layer 3
As shown in FIG. 5 (b), an organic liquid photosensitive resin having a predetermined thickness (100) is formed on the inner peripheral surface of the transparent conductive film 2b as shown in FIG.
(about μm). In the first embodiment, as the photosensitive resin layer 37, a negative photosensitive resin (a photocurable resin) in which a portion irradiated with light is cured is used.
Therefore, the pattern shown in FIG. 4B is used as the light-shielding film pattern of the matrix 34.

As the negative photosensitive resin, for example, a polyvinyl cinnamic acid type, a polyamide type, an acrylate type, an epoxy resin type, an enthiol type, an unsaturated polyester type, an unsaturated polyurethane type, a silicone resin type and the like have been conventionally used. Although it is known, from the viewpoint of perforation properties, it is required to have an appropriate hardness after curing, the solubility of the uncured resin, the insolubility of the cured resin, and a wide allowable range of solubility. Further, if the curing of the resin proceeds under visible light, the workability deteriorates. Therefore, the wavelength range of light required for curing is preferably in an invisible range, for example, an ultraviolet range. In addition to these, the aforementioned transparent conductive film 2b
From the viewpoint of adhesion to the (upper electrode 2) and high insulating properties after curing, for example, when the epoxy-acrylate resin-based photo-curable liquid resin TSR-810 manufactured by Teijin Seiki is used, it is most preferable. Results were obtained. As the coating method, the coating method shown in FIGS. 13A to 13C is used. This resin is commercially available for shape confirmation by an optical molding process, and also has a feature of being excellent in rigidity after curing. In the case where the application method shown in FIG. 13A is employed a plurality of times, one cover mask 35 is formed in a plurality of application steps instead of forming / removing the cover mask 35 in each application step. Can be used in common.

"Pattern exposure to photosensitive resin layer"
As shown in FIG. 5C, the photosensitive light R is irradiated from outside the light-shielding film pattern 32 of the light-transmitting cylinder 31. Since the negative photosensitive resin layer 37 used here has a characteristic of being sensitive to light of a specific wavelength near 365 nm, an ultraviolet irradiation device ML-501C manufactured by Ushio Inc. having, for example, an ultra-high pressure mercury lamp of 500 W as a light source is used. Etc. can be used.
As the irradiation method, as described in Japanese Patent Application No. 11-245754, exposure is performed while rotating a matrix, or exposure is performed by a batch exposure method with a number of light sources arranged around. In the present photosensitive step, the photosensitive resin layer 37
In addition, a contrast between the non-photosensitive portion 37b and the photosensitive portion 37a corresponding to the light-shielding film pattern 32 and the light-transmitting portion 32b (see FIG. 4) is formed. By setting the entirety of the photosensitive resin layer 37 in a semi-cured state, the operation of “forming a photoconductive layer, a lower electrode layer, and a light-transmitting support layer” described below can be easily performed. The purpose is to prevent erosion from the coating liquid solvent. In the photolithography process, a phenomenon often occurs in which the resolution is reduced due to halation from the underlayer at the time of exposure, but in the present embodiment, the main exposure step is performed before forming the photoconductive layer 5 corresponding to the underlayer. Since this has been completed, this problem can be avoided.

Through the above-described photosensitive process, the photosensitive portion 37a is exposed to light from a light source (not shown). Generally, the intensity of the photosensitive light R to the photosensitive resin layer 37 decreases as it goes to the bottom of the resin due to absorption inside the resin. Therefore, the photosensitive surface layer of the resin is most exposed. As a result, the negative photosensitive resin is firmly bonded to the upper electrode 2 already formed on the inner peripheral wall of the light-transmitting cylinder 31, and the negative photosensitive resin as a whole is generated. Due to shrinkage during curing of the conductive resin,
Release from the transparent cylinder 31 is performed smoothly (release from the master mold will be described later). On the other hand, the resin in the portion that is not irradiated with the photosensitive light R (the non-photosensitive portion 37b) does not cure and thus does not bind to the transparent conductive film 2b and “developing the photosensitive resin layer”.
It is removed by the developing step described in (1).

[Formation of Photoconductive Layer, Lower Electrode Layer, and Translucent Support Layer] Next, as shown in FIG. 5D, the charge transport layer 5b and the charge transport layer 5b are formed on the inner peripheral surface of the photosensitive resin layer 37. The charge generation layers 5a are sequentially stacked. Here, as the charge generation layer 5a, for example, n-type titanyl phthalocyanine and polyvinyl butyral are used, and the thickness is set to 0.05 to 1 μm. As the charge transport layer 5b, a material containing polycarbonate as a binder resin, dissolved in a solvent such as tetrahydrofuran, and containing, for example, 20 to 40 wt% of a charge transport material disclosed in JP-A-7-168376 is used. The thickness is 1 to 30 μm. Note that, between the photosensitive resin layer 37 and the photoconductive layer 5 (the charge transport layer 5b), a method disclosed in JP-A-9-204 is used.
A float electrode may be provided as disclosed in JP-A-092. Although this electrode layer does not require translucency due to its characteristics,
The coating liquid and the layer forming method described in “Formation of upper electrode” can be used. In this case, a float electrode layer is formed on the inner wall surface of the photosensitive resin layer 37, and the charge transport layer 5b is formed on the inner wall surface.

In this embodiment, the case where the charge transport layer 5b and the charge generation layer 5a are sequentially laminated on the inner peripheral surface of the photosensitive resin layer 37 has been described. However, the present invention is not limited to this. A reverse-stacked photoconductive layer 5 in which a charge generation layer 5a and a charge transport layer 5b are sequentially stacked may be used. Further, instead of the function-separated type photoconductive layer 5 having both layers, a charge transport material and a charge are stored in an insulating polymer. The photoconductive layer 5 may have a single-layer structure in which a generating material is dispersed. Next, as shown in FIG. 6E, a lower electrode 6 made of a transparent conductive film is formed on the inner peripheral surface of the charge generation layer 5a in the photoconductive layer 5 by a transparent conductive film 2b.
Is formed by using the same material and method as used for forming. The purpose of forming the lower electrode 6 is to generate an electric field between the lower electrode 6 and the upper electrode 2. In the printing method using the porous photoreceptor according to the present invention, as shown in FIG. Exposure light 8 corresponding to image information emitted from
It reaches the photoconductive layer 5 via the lower electrode 6 and the translucent support 7. Therefore, in order to secure a sufficient image density, it is desirable that the transmittance of the lower electrode 6 layer and the translucent support is 60% or more in the wavelength range of the light from the light source 24, and 75
% Is more preferable. Here, the upper electrode 2
Since the transparent conductive film 2b for forming the above had the transmittance even in the wavelength region of the exposure light 8 corresponding to the image information, this was diverted. In addition, between the lower electrode 6 and the charge generation layer 5b, a thin (0.3 μm) made of an alcohol-soluble polyamide, a photocurable resin, a thermosetting resin, or the like is used for the purpose of improving adhesion and preventing charge injection. Degree) An undercoat layer may be provided.

After being kept in a constant temperature bath for a certain period of time and dried to evaporate the solvent contained in the coating liquid to be the lower electrode 6,
As shown in FIG. 6F, a light-transmitting support 7 is formed on the inner peripheral surface of the lower electrode 6 to hold the entire porous photoconductor 1. In order to achieve the above-described transmittance in both the lower electrode 6 and the light-transmitting support 7 layer, the transmittance of the present support 7 must be:
Preferably, it is 80% or more. As a material satisfying this transmittance and satisfying the function as a support, a thermoplastic resin is polycarbonate (PC).
And polymethyl methacrylate (PMMA). Examples of the thermosetting resin include diethylene glycol bisallyl carbonate and a sulfur-containing urethane resin. The photo-curable resin may be, for example, epoxy acrylate, urethane acrylate, polyester acrylate, or the like as a base monomer, a monofunctional acrylate or a polyfunctional acrylate mixed as a diluting monomer, and a resin mixed with a photoinitiator or the like. Can be. Examples of the coating method include a method of injecting and solidifying a thermoplastic resin dissolved or dissolved in a solvent, a method of forming a layer of a thermosetting resin or a photocurable resin, and then curing and polymerizing the layer. These resins are formed in a constant thickness on the inner wall of the lower electrode 6 by a coating method similar to the method shown in FIG. 13C, and at the same time, in the thermosetting resin, optical distortion is prevented from being generated. Therefore, the polymerization is carried out by heating at about 30 to 120 ° C. over about 15 to 30 hours. In the case of a photo-curable resin, also in this case, similarly to the above-described forming method, FIG.
At the same time as forming the coating film by the coating method shown in FIG. 1C, while rotating the porous photoreceptor, light is emitted from a tubular lamp embedded in the rotating shaft to cure the resin layer.

[Removal of Master Block] Next, the light-transmitting cylinder 31 is fixed so as not to be damaged. For example, a cylinder having an outer diameter slightly smaller than the inner diameter of the light-transmitting cylinder 31 is inserted into the light-transmitting cylinder 31. Then, the porous photoconductor 1 is extruded, and the porous photoconductor 1 is separated from the matrix 34 as shown in FIG. As described above, a feature of the present invention is that the matrix 34 can be repeatedly used as a mold.

[Development of Photosensitive Resin Layer] Finally, FIG.
As shown in (h), “Pattern exposure of photosensitive resin layer”
In the process, the photosensitive resin layer 37 in which the contrast between the photosensitive portion 37a and the non-photosensitive portion 37b is developed is developed.
Is removed to form the porous layer 4 having the through holes 4a. At the same time, the transparent conductive film 2 on the non-photosensitive portion 37b
b is removed to form an upper electrode having the fine holes 2a. This development is advantageously performed by a wet process. In this case, the photosensitive resin layer 37 is immersed in a container filled with the developer, and ultrasonic vibration is applied to efficiently remove the non-photosensitive resin. A spray developing method of discharging and jetting, an air brush developing method of spraying a mist-like developer with compressed air or the like can be used. When the above-described epoxy-acrylate resin-based TSR-810 (manufactured by Teijin Seiki) is used, the IP is developed by an air brush development method.
By spraying A (isopropyl alcohol) for 2 minutes, good development results were obtained. After the perforation, the developer remaining in the holes is dried by storing in a thermostat at 80 ° C. for 60 minutes, and it is confirmed with a microscope that the holes are well formed. Light irradiation and / or baking is performed again to cure the film. Finally, the upper electrode 2 is fired (as described above), and the manufacturing process of the porous photoconductor is completed.

Example 2 "Preparation of Master Block" FIGS. 7A to 8H are cross-sectional views in the order of steps in Example 2 of the present invention. This embodiment is similar to the first embodiment.
On the other hand, there is a difference that a positive type resin is used as a photosensitive resin for forming a porous layer, and there is basically no difference in other points. In the present embodiment, a matrix is formed in the same manner as in the first embodiment.
The light-shielding film pattern 32 shown in FIG.

[Formation of Transparent Conductive Film] Next, as shown in FIG. 7A, a transparent conductive film 2b is formed on the inner wall surface of the matrix 34 by using the same material and method as in the first embodiment. I do. FIG.
As shown in FIG. 5A, the light-shielding film pattern 32 in the matrix 34 is inverted from the pattern of the first embodiment shown in FIG.

[Formation of Photosensitive Resin Layer] After the transparent conductive film 2b is sufficiently dried, an organic liquid photosensitive resin layer 37 is formed on the inner peripheral surface thereof. Here, as the material of the photosensitive resin layer 37, a positive type liquid photoresist PMER resin for plating manufactured by Tokyo Ohka Co., Ltd. was used. In addition, an alkali-soluble novolak resin containing a photosensitive component such as phenol or cresol Quinonediazide group-containing compounds, in particular, naphthoquinone-1,2-diazidesulfonic acid esters of aromatic polyhydroxy compounds, are obtained by condensing an aromatic hydroxy compound such as xylenol and an aldehyde such as formaldehyde with an acidic catalyst. Those blended as components can be used. Also,
As a method for forming the resin layer, any of the methods shown in FIG. 13 can be applied. After the application step, prebaking is performed to volatilize the contained solvent. By this treatment, the bond between the photosensitive resin layer 37 and the transparent conductive film 2b is strengthened, and the separation of the porous photoreceptor from the matrix later is facilitated, and the photosensitive resin layer 37 is formed on the inner wall surface. Mixing with the formed photoconductive layer is prevented.

"Pattern exposure of photosensitive resin layer" Next, as shown in FIG. 7 (c), photosensitive light R is irradiated from the outside of the light-shielding film pattern 32 of the light-transmitting cylinder 31 as a matrix. The positive-type photosensitive resin layer 37 used here has a characteristic of being sensitive to light of a specific wavelength near 365 nm, and therefore, as a light source, for example, an ultraviolet irradiation device ML-501C manufactured by Ushio Inc. having a 500 W ultra-high pressure mercury lamp Etc. can be used. The irradiation method is the same as in the first embodiment. By this exposure step, the exposure of a portion that has been irradiated with light from a light source (not shown) progresses, and a photosensitive portion 37a and a non-photosensitive portion 37b are formed on the photosensitive resin layer 37.

[Formation of Photoconductive Layer, Lower Electrode Layer, and Translucent Support Layer, Removal of Master Mold] Next, as shown in FIGS. Similarly to the case, the photoconductive layer 5 including the charge transport layer 5b and the charge generation layer 5a, the lower electrode layer 6, and the porous support 7 are sequentially laminated on the inner wall surface of the photosensitive resin layer 37, and thereafter, As shown in FIG. 8G, the matrix 34 is removed.

[Development of Photosensitive Resin Layer] Next, FIG.
As shown in the figure, the photosensitive resin layer 37 in which the contrast between the photosensitive portion 37a and the non-photosensitive portion 37b is developed in the "pattern exposure of the photosensitive resin layer" step, the photosensitive portion 37a is removed, and the through hole 4a is removed. Is formed to form the porous layer 4. At the same time, the transparent conductive film 2b on the photosensitive portion 37a is removed, and an upper electrode having the fine holes 2a is formed. In this development step, the developer may be immersed in the developer, or the developer may be sprayed under a high pressure to spray the developer from the surface of the transparent conductive film 2b. After perforation, rinse with pure water to remove the developer adhering to the resin surface, store in a constant temperature bath at 80 ° C. for 60 minutes to dry the rinse liquid remaining in the holes, and form well holes. Is confirmed with a microscope, and if necessary, light irradiation or baking is performed again to further cure the photosensitive resin. Finally, the upper electrode 2 is fired (as described above) to complete the step of manufacturing the porous photoconductor.

[Example 3] "Preparation of master mold-formation of translucent support" FIGS. 9 (a) to 1
0 (h) is a sectional view of a third embodiment of the present invention in the order of steps. In this embodiment, a positive type photosensitive resin layer is used. Then, steps until the photosensitive resin layer 37 shown in FIG. 9B is formed are described in FIGS. 7A and 7B.
9 is performed in the same manner as in Example 2 shown in FIG.
The steps until the formation of the photoconductive layer 5, the lower electrode 6, and the translucent support 7 shown in FIG. 10E are described with reference to FIGS.
This is performed in the same manner as in the second embodiment shown in FIG.

"Pattern exposure of photosensitive resin layer" FIG.
After forming the translucent support 7 on the innermost surface as shown in (e), the exposure apparatus used in Examples 1 and 2 is used to form FIG.
As shown in (f), the photosensitive resin R is irradiated from the outside of the light-shielding film pattern 32 of the light-transmitting cylinder 31 which is the matrix, and the photosensitive resin layer 37 is exposed to the photosensitive portion 3 corresponding to the light-shielding film pattern 32.
7a-forms the contrast of the non-photosensitive portion 37b.

[Removal of the master mold and development of the photosensitive resin layer] After the photosensitive resin layer is exposed to light, the master mold 34 is removed by the same method as in Example 1 as shown in FIG. . Next, as shown in FIG. 10H, the photosensitive resin layer 37 is developed in the same manner as in Example 2, and the porous layer 4 having the through-holes 4a and the upper portion having the fine holes 2a are formed. The electrode 2 is formed. Finally, the upper electrode 2 is fired to complete the step of manufacturing the porous photoconductor.

Example 4 "Preparation of master, formation of transparent conductive film, formation of photosensitive resin layer" FIGS. 11A to 12H show Example 4 of the present invention.
FIG. In this embodiment, the photosensitive resin layer 3
A negative type is used for the material of No. 7. After forming a matrix having the same light-shielding film pattern 32 as in the case of the first embodiment, an upper electrode is formed on the inner wall surface thereof as shown in FIG. Transparent conductive film 2b is formed. Thereafter, as shown in FIG. 11B, a negative photosensitive material similar to that used in Example 1 was used.
The photosensitive resin layer 37 is formed by coating the inner surface of the transparent conductive film 2b in the same manner as in the previous embodiment.

"Pattern exposure of photosensitive resin layer" Next, as shown in FIG. 11C, the photosensitive resin layer 37 is exposed from the outside of the matrix 34 using the exposure apparatus used in the other embodiment. By irradiating the light R, a contrast between the photosensitive portion 37a and the non-photosensitive portion 37b is formed on the photosensitive resin layer 37.

[Development of Photosensitive Resin Layer] Next, FIG.
As shown in (d), "pattern exposure of photosensitive resin layer"
In the process, the photosensitive resin layer 37 in which the contrast between the photosensitive portion 37a and the non-photosensitive portion 37b is developed is developed.
Is removed to form the porous layer 4 having the through-holes 4a formed therein, and the transparent conductive film 2b on the photosensitive portion 37a is removed to form the upper electrode 2 having the fine holes 2a formed therein. In this developing step, the developing solution may be immersed in the developing solution, or the developing solution may be sprayed under high pressure to spray the developing solution from the inner surface side of the photosensitive resin layer 37. After perforation, rinse with pure water to remove the developer adhering to the resin surface, store in a constant temperature bath at 80 ° C. for 60 minutes to dry the rinse liquid remaining in the holes, and form well holes. Is confirmed with a microscope, and if necessary, light irradiation or baking is performed again to further cure the photosensitive resin.

[Formation of Photoconductive Layer, Lower Electrode Layer, and Translucent Support Layer, Removal of Master Mold] Next, as shown in FIG. 12E, the porous layer 4 (photosensitive resin layer 37 The photoconductive layer 5 composed of the charge transport layer 5b and the charge generation layer 5a is formed on the inner wall surface of (2). At this time, the spin coating method shown in FIG. 13C is not preferable as the coating method of the charge transport layer 5b.
The coating is performed using either (a) or (b). Further, as shown in FIGS. 12F and 12G, the lower electrode layer 6 and the light-transmitting support 7 are sequentially formed on the inner wall surface of the photoconductive layer 5 in the same manner as in the other examples. Laminate. afterwards,
As shown in FIG. 12H, the matrix 34 is removed. Then, finally, the upper electrode 2 is fired to complete the manufacturing process of the porous photoconductor.

The preferred embodiment has been described above.
The present invention is not limited to these embodiments, and can be appropriately modified without departing from the gist of the invention. For example, the photosensitive resin layer (porous layer 4) may be formed using a negative or positive photosensitive material by modifying the third and fourth embodiments.

[0047]

As described above, according to the present invention, each layer of the porous photoreceptor is laminated on the inner peripheral surface of a light-transmitting cylinder (master) having a light-shielding film pattern on the outer peripheral surface. Since the photosensitive resin for forming the porous layer, which is a constituent element, is exposed to light from the outer peripheral surface side of the matrix, the following effects can be obtained. Since it is only necessary to prepare a matrix that can be used a plurality of times, the cost, operation time, and the like are lower than a method using a metal mesh sleeve that requires one electroforming operation for each porous photoconductor. Can be greatly reduced. The hole loss that tends to occur in the metal mesh sleeve is reduced, and abnormal growth accompanying the electroforming operation is avoided, so that the yield can be improved. If only the pattern formed on the outer surface of the light-transmitting cylinder is changed, both the positive photosensitive resin and the negative photosensitive resin can be used as the porous layer, and the range of material selection can be widened. Since the master can be used multiple times, it becomes practically possible to pattern the light-shielding film on the master by the sequential drawing method, and the pattern arrangement is disturbed over the entire circumference. It is possible to prevent it from being done.

[Brief description of the drawings]

FIG. 1 is a perspective view of a porous photoreceptor manufactured according to the present invention.

FIG. 2 is a cross-sectional view of a porous photoreceptor manufactured according to the present invention.

FIG. 3 is a cross-sectional view in the order of steps for explaining a manufacturing step of a matrix used in the present invention.

FIG. 4 is a pattern diagram showing a relationship between a porous pattern of a porous photoreceptor according to the present invention and a matrix light-shielding film pattern used in the present invention.

FIG. 5 is a sectional view of a first embodiment of the present invention in the order of steps (part 1).

FIG. 6 is a sectional view (part 2) of the first embodiment of the present invention in the order of steps.

FIG. 7 is a cross-sectional view (part 1) illustrating a process order according to the second embodiment of the present invention.

FIG. 8 is a sectional view (part 2) of the second embodiment of the present invention in the order of steps.

FIG. 9 is a sectional view (No. 1) of the third embodiment of the present invention in the order of steps.

FIG. 10 is a sectional view (part 2) of the third embodiment of the present invention in the order of steps.

FIG. 11 is a sectional view (part 1) of a fourth embodiment of the present invention in the order of steps.

FIG. 12 is a sectional view (part 2) of a fourth embodiment of the present invention in the order of steps.

FIG. 13 is a cross-sectional view illustrating a method for applying a transparent conductive film in an example of the present invention.

FIG. 14 is a cross-sectional view of an image recording apparatus using a porous photoreceptor.

FIG. 15 is a cross-sectional view in the order of steps showing a manufacturing process of the prior art of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Porous photoreceptor 2 Upper electrode 2 'Upper electrode (metal mesh sleeve) 2a Micropore 2b Transparent conductive film 2c Transparent conductive coating liquid 4 Porous layer 4a Through hole 5 Photoconductive layer 5a Charge generation layer 5b Charge transport layer 6 Lower part Electrode 7 Translucent support 8 Exposure light 21 Image recording device 22 Conductive roller 23 Counter electrode 24 Light source 25 Regulator blade 26 Conductive particles 27 Recording medium 31 Transparent cylinder 32 Light-shielding film pattern 32a Light-shielding film 32b Light-transmitting portion 33 Resist resin film pattern 33a resist resin film 34 mother mold 35 cover mask 36 stage 37 photosensitive resin layer 37a photosensitive portion 37b non-photosensitive portion R photosensitive light

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsutomu Uesono 5-7-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (72) Inventor Yasuhiro Funayama 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation F term (reference) 2H068 AA03 AA09 AA10 AA21 AA37 AA45 AA54 BB59 EA43 FA11 FC06

Claims (14)

[Claims] 1. A cylindrical porous layer made of an organic photosensitive insulating material having a large number of micropores, and micropores formed on the outer peripheral surface of the porous layer and having the same pattern as the large number of micropores. A first electrode layer made of a transparent conductive film having holes, a photoconductive layer formed on the inner peripheral surface of the porous layer, and a second electrode formed of a transparent conductive film formed on the inner peripheral surface of the photoconductive layer. A porous photoconductor comprising: an electrode layer; and a light-transmitting support formed on an inner peripheral surface of the second electrode layer. 2. The porous photoconductor according to claim 1, wherein a float electrode layer is formed between the porous layer and the photoconductive layer. 3. The porous photoconductor according to claim 1, wherein an insulating thin film layer is formed between the photoconductive layer and the second electrode layer. 4. The micropores formed in the porous layer are continuously arranged at regular intervals in an axial direction and a circumferential direction.
3. The method for producing a porous photoreceptor according to any one of 3. 5. An insulating porous layer having micropores of the same pattern as said multiplicity of micropores formed on the surface of a first electrode layer having a multiplicity of micropores, comprising a second electrode layer and a photoconductive layer. (1) The method according to (1), wherein the plurality of the plurality of photoconductors are provided on the first main surface of a translucent temporary base material having a first main surface and a second main surface. Forming a light-shielding film having a pattern substantially corresponding to the fine holes; (2) a conductive layer for forming the first electrode layer on the second main surface of the temporary base; (3) exposing the resin insulating layer from the first main surface side of the temporary base material using the light-shielding film as a mask; and (4) exposing the resin insulating layer. The photoconductive layer on the resin insulating layer of
(5) forming the second electrode layer and the translucent support layer in this order; and (5) developing the resin insulating layer after removing the temporary base material, thereby forming the resin in the microporous portion. Removing the insulating layer and the conductive layer to form the porous layer and the first electrode layer. 6. An insulating porous layer having micropores in the same pattern as the plurality of micropores, wherein the first electrode layer having a multiplicity of micropores is formed on the surface. (1 ′) The method of manufacturing a porous photoreceptor laminated on a laminate of the above (1 ′), wherein the plurality of light-transmissive temporary substrates having a first main surface and a second main surface are provided on the first main surface. (2 ') forming a conductive layer for forming the first electrode layer on the second main surface of the temporary base material; Forming a photosensitive resin insulating layer, the photoconductive layer, the second electrode layer, and the translucent support layer in this order; and (3 ′) forming the first layer of the temporary base material. Exposing the resin insulation layer from the main surface side using the light-shielding film as a mask; and (4 ′) removing the temporary base material, By performing the development of the edge layer, the microporous portions wherein the resin insulating layer and the conductive layer is removed, and wherein the porous layer first
Forming a porous photoreceptor, comprising: forming an electrode layer. 7. An insulating porous layer having micropores in the same pattern as the multiplicity of micropores formed on the surface of a first electrode layer having a multiplicity of micropores, and a second electrode layer and a photoconductive layer (1 ") a translucent temporary base material having a first main surface and a second main surface, the method comprising: Forming a light-shielding film having a pattern substantially coincident with the large number of micropores on the first main surface; and (2 ″) forming a light-shielding film on the second main surface of the temporary base material. Forming a conductive layer for forming one electrode layer and a resin insulating layer having photosensitivity in this order; and (3 ″) using the light-shielding film as a mask from the first main surface side of the temporary base material. By exposing the resin insulation layer and developing the resin insulation layer, the resin insulation layer in front of the fine hole portion is developed. The conductive layer is removed, and the porous layer and the first
(4 ") forming the photoconductive layer, the second electrode layer, and the light-transmitting support layer on the porous layer in this order; (5") forming the electrode layer; Removing the temporary base material. 8. The step (1), the step (1 ′), or the step (1 ″), wherein a light shielding film is deposited on the first main surface of the temporary base material, The method according to any one of claims 5 to 7, further comprising a step of patterning the photoreceptor by photolithography. 9. The method according to claim 1, wherein the step (1), the step (1 ′), or the step (1 ″) includes forming a photographic emulsion layer on the first main surface of the temporary base material. 8. The method for producing a porous photoreceptor according to claim 5, wherein the step of exposing and developing is performed. 10. The pattern of the light-shielding film is formed by sequentially drawing each micropore shape on the first main surface of the temporary base material. The method for producing a porous photoreceptor according to the above. 11. The porous film according to claim 5, wherein the conductive layer has a transmittance of 60% or more in a wavelength range of light for sensitizing the resin insulating layer. For producing a photoconductor. 12. The method according to claim 5, wherein the temporary base is made of quartz glass. 13. The temporary base material has a cylindrical shape,
The method according to claim 5, wherein the first main surface is an outer surface, and the second main surface is an inner surface. 14. The method for producing a porous photoconductor according to claim 4, wherein the temporary base material is repeatedly used in a process for producing a plurality of porous photoconductors.