JP2001254182A - Method of preparing electroless plating catalyzing solution - Google Patents
Method of preparing electroless plating catalyzing solutionInfo
- Publication number
- JP2001254182A JP2001254182A JP2000066375A JP2000066375A JP2001254182A JP 2001254182 A JP2001254182 A JP 2001254182A JP 2000066375 A JP2000066375 A JP 2000066375A JP 2000066375 A JP2000066375 A JP 2000066375A JP 2001254182 A JP2001254182 A JP 2001254182A
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- Prior art keywords
- structural unit
- electroless plating
- mol
- polymer
- catalyst solution
- Prior art date
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、無電解メッキ触媒
液の調製方法に関するものであり、詳しくは無電解メッ
キ触媒液を調製するに際し、特定のカチオン性(共)重
合体を添加してパラジウムコロイドの被メッキ面への吸
着性を高め、その後の銅メッキ処理を改良することが可
能な無電解メッキ触媒液の調製方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for preparing a catalyst solution for electroless plating, and more particularly, to preparing a catalyst solution for electroless plating, adding a specific cationic (co) polymer to palladium. The present invention relates to a method for preparing an electroless plating catalyst solution capable of improving the adsorption of colloid to a surface to be plated and improving the subsequent copper plating treatment.
【0002】[0002]
【従来の技術】プリント配線板を製造する工程中、表裏
間に電流を流すためのスル−ホ−ルが作孔され、そのス
ル−ホ−ル表面に通電性を確保するため銅メッキがなさ
れる。通常、銅メッキ前処理としてパラジウムコロイド
と錫コロイドをスル−ホ−ル表面に吸着させるため、コ
ロイドの吸着性高める目的で従来カチオン性界面活性剤
が使用されてきたが、よりコロイド粒子の吸着率を向上
させようとカチオン性高分子が使用されようになった。
例えば、米国特許4、478、883号は無電解メッキ
施工の前処理として、アクリルアミド/β−メタクロイ
ルオキシエチルトリメチルアンモニウムメチル硫酸共重
合体水溶液に浸漬処理を行っている。この方法は、メッ
キ触媒液に直接カチオン性高分子を配合するのではない
ため、カチオン性高分子の劣化などは考慮する必要はな
い。無電解は通常、pH6〜10程度と中性からアルカ
リ性に調節するため、直接メッキ触媒液に配合する場合
には、カチオン性高分子の耐アルカリ性を考慮する必要
がある。上記のようカチオン性高分子処方はまだ完全に
確立されたわけではなく、種々検討しなければならない
条件があり、試行錯誤の段階にある。2. Description of the Related Art During a process of manufacturing a printed wiring board, a through hole is formed between a front surface and a back surface to allow a current to flow, and copper plating is performed on the surface of the through hole to ensure conductivity. You. Usually, a cationic surfactant has conventionally been used for the purpose of increasing the adsorbability of the colloid in order to adsorb the palladium colloid and the tin colloid on the surface of the sulfol as a pretreatment for copper plating. In order to improve the quality, cationic polymers have been used.
For example, in U.S. Pat. No. 4,478,883, immersion treatment is performed in an aqueous solution of acrylamide / .beta.-methacryloyloxyethyltrimethylammonium methylsulfuric acid copolymer as a pretreatment for electroless plating. In this method, since the cationic polymer is not directly mixed into the plating catalyst solution, it is not necessary to consider the deterioration of the cationic polymer. Since electroless is usually adjusted from pH 6 to about 10 from neutral to alkaline, it is necessary to consider the alkali resistance of the cationic polymer when directly blending it into the plating catalyst solution. As described above, the cationic polymer formulation has not been completely established yet, and there are various conditions to be examined, and it is in the stage of trial and error.
【0003】[0003]
【発明が解決しようとする課題】どのようなカチオン性
高分子を無電解触媒液に含有させたら均一で強固なメッ
キ膜が装着できるかを検討することが、本発明の課題で
ある。SUMMARY OF THE INVENTION It is an object of the present invention to examine what kind of cationic polymer is contained in an electroless catalyst solution so that a uniform and strong plating film can be mounted.
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
鋭意研究を重ねた結果、特定のカチオン性重合体を無電
解触媒液に含有させると上記課題が解決できることがわ
かり本発明に到達した。すなわち、本発明の請求項1の
発明は、下記(1)の構造単位を有する(共)重合体及
び/または(2)〜(3)の重縮合物のうち少なくとも
一種を添加することを特徴とする無電解メッキ触媒液の
調製方法である。 (1)ジアルキルアミノプロピル(メタ)アクリルアミ
ド構造単位、(メタ)アクリロイルアミノプロピルトリ
アルキルアンモニウム塩化物構造単位(アルキル基は、
いずれもメチルおよびエチル)、ジアリルジメチルアン
モニウム塩化物構造単位 (2)アルキルアミン/エピクロロヒドリン/ポリアル
キレンポリアミンおよび/またはアンモニア重縮合物
(アルキル基はメチル、エチルおよびベンジル)アルキ
ルアミン/エピクロロヒドリン重縮合物(アルキル基は
メチル、エチルおよびベンジル)As a result of intensive studies to solve the above problems, it has been found that the above problems can be solved by adding a specific cationic polymer to an electroless catalyst solution, and the present invention has been achieved. That is, the invention of claim 1 of the present invention is characterized in that at least one of a (co) polymer having the following structural unit (1) and / or a polycondensate of (2) to (3) is added. This is a method for preparing an electroless plating catalyst solution. (1) Dialkylaminopropyl (meth) acrylamide structural unit, (meth) acryloylaminopropyltrialkylammonium chloride structural unit (the alkyl group is
All are methyl and ethyl), diallyldimethylammonium chloride structural unit (2) alkylamine / epichlorohydrin / polyalkylenepolyamine and / or ammonia polycondensate (alkyl groups are methyl, ethyl and benzyl) alkylamine / epichloro Hydrin polycondensate (alkyl group is methyl, ethyl and benzyl)
【0005】請求項2の発明は、前記(共)重合体が、
ジアリルジメチルアンモニウム塩化物構造単位とビニル
アミン構造単位及び/またはビニルアミジン構造単位を
含有することを特徴とする請求項1に記載の無電解メッ
キ触媒液の調製方法である。According to a second aspect of the present invention, the (co) polymer comprises:
The method for preparing an electroless plating catalyst solution according to claim 1, comprising a diallyldimethylammonium chloride structural unit, a vinylamine structural unit and / or a vinylamidine structural unit.
【0006】請求項3の発明は、前記(共)重合体が、
ジアリルジメチルアンモニウム塩化物構造単位(aモル
%)と、ビニルアミン構造単位(bモル%)及び/また
はビニルアミジン構造単位(cモル%)を含有する重合
体であり、a,b,cがそれぞれ、30≦(a)≦9
0、10≦(b)≦70、0≦(c)≦60の範囲を有
することを特徴とする請求項1あるいは2に記載の無電
解メッキ触媒液の調製方法である。The invention according to claim 3 is that the (co) polymer comprises:
A polymer containing a diallyldimethylammonium chloride structural unit (a mol%) and a vinylamine structural unit (b mol%) and / or a vinylamidine structural unit (c mol%), wherein a, b, and c are 30 ≦ (a) ≦ 9
The method for preparing an electroless plating catalyst solution according to claim 1, wherein a range of 0, 10 ≦ (b) ≦ 70, and 0 ≦ (c) ≦ 60 is satisfied.
【0007】請求項4の発明は、前記(共)重合体が、
50〜100モル%のジアルキルアミノプロピル(メ
タ)アクリルアミド構造単位を有することを特徴とする
請求項1に記載の無電解メッキ触媒液の調製方法であ
る。According to a fourth aspect of the present invention, the (co) polymer comprises:
The method for preparing an electroless plating catalyst solution according to claim 1, wherein the method has a dialkylaminopropyl (meth) acrylamide structural unit of 50 to 100 mol%.
【0008】請求項5の発明は、前記(共)重合体が、
50〜100モル%の(メタ)アクリロイルアミノプロ
ピルトリアルキルアンモニウム塩化物単位を含有するこ
とを特徴とする請求項1に記載の無電解メッキ触媒液の
調製方法である。According to a fifth aspect of the present invention, the (co) polymer comprises:
The method for preparing an electroless plating catalyst solution according to claim 1, comprising 50 to 100 mol% of (meth) acryloylaminopropyltrialkylammonium chloride units.
【0009】請求項6の発明は、上記(1)の(共)重
合体の分子量が1万〜100万であることを特徴とする
請求項1〜5に記載の無電解メッキ触媒液の調製方法で
ある。The invention of claim 6 is the preparation of the electroless plating catalyst solution according to any one of claims 1 to 5, wherein the molecular weight of the (co) polymer (1) is 10,000 to 1,000,000. Is the way.
【0010】請求項7の発明は、パラジウムコロイドを
含有することを特徴とする請求項1〜6に記載の無電解
メッキ触媒液の調製方法である。[0010] The invention of claim 7 is the method for preparing an electroless plating catalyst solution according to any one of claims 1 to 6, which contains a palladium colloid.
【0011】[0011]
【請求項8】 pHが5.0〜11.0であることを特
徴とする請求項1〜7に記載の無電解メッキ触媒液の調
製方法である。8. The method according to claim 1, wherein the pH is from 5.0 to 11.0.
【0012】[0012]
【発明の実施の形態】(1)のジアルキルアミノプロピ
ル(メタ)アクリルアミド構造単位を有する(共)重合
体は、ジメチルアミノプロピル(メタ)アクリルアミド
あるいはジエチルアミノプロピル(メタ)アクリルアミ
ドの単独重合体、あるいは非イオン性単量体との共重合
体である。非イオン性単量体の例としては、(メタ)ア
クリルアミド、N,N−ジメチルアクリルアミド、酢酸
ビニル、アクリロニトリル、アクリル酸メチル、(メ
タ)アクリル酸2−ヒドロキシエチル、ジアセトンアク
リルアミド、N−ビニルピロリドン、N−ビニルホルム
アミド、N−ビニルアセトアミド、アクリロイルモルホ
リンなどがあげられる。共重合体中のジアルキルアミノ
プロピル(メタ)アクリルアミドのモル%としては、5
0〜100モル%であり、好ましくは80〜100モル
%である。50モル%以下では、効果が低く使用できな
い。BEST MODE FOR CARRYING OUT THE INVENTION The (co) polymer having a dialkylaminopropyl (meth) acrylamide structural unit of (1) is a homopolymer of dimethylaminopropyl (meth) acrylamide or diethylaminopropyl (meth) acrylamide, or a non-polymer. It is a copolymer with an ionic monomer. Examples of nonionic monomers include (meth) acrylamide, N, N-dimethylacrylamide, vinyl acetate, acrylonitrile, methyl acrylate, 2-hydroxyethyl (meth) acrylate, diacetone acrylamide, N-vinylpyrrolidone , N-vinylformamide, N-vinylacetamide, acryloylmorpholine and the like. The molar percentage of dialkylaminopropyl (meth) acrylamide in the copolymer is 5%.
It is 0 to 100 mol%, preferably 80 to 100 mol%. If it is less than 50 mol%, the effect is low and it cannot be used.
【0013】(1)の(メタ)アクリロイルアミノプロ
ピルトリアルキルアンモニウム塩化物構造単位を有する
(共)重合体の例としては、(メタ)アクリロイルアミ
ノプロピルトリメチルアンモニウム塩化物あるいは(メ
タ)アクリロイルアミノプロピルトリエチルアンモニウ
ム塩化物の単独重合体、あるいは非イオン性単量体との
共重合体である。非イオン性単量体の例としては、前記
と同様なものを使用する。また、共重合体中の(メタ)
アクリロイルアミノプロピルトリアルキルアンモニウム
塩化物のモル%としては、前記と同様に50〜100モ
ル%であり、好ましくは80〜100モル%である。Examples of (1) a (co) polymer having a (meth) acryloylaminopropyltrialkylammonium chloride structural unit include (meth) acryloylaminopropyltrimethylammonium chloride and (meth) acryloylaminopropyltriethyl. It is a homopolymer of ammonium chloride or a copolymer with a nonionic monomer. As examples of the nonionic monomer, those similar to the above are used. In addition, (meth) in the copolymer
The molar percentage of acryloylaminopropyltrialkylammonium chloride is 50 to 100 mol%, preferably 80 to 100 mol%, as described above.
【0014】(1)のジアリルジメチルアンモニウム塩
化物構造単位を有する(共)重合体は、ジアリルジメチ
ルアンモニウム塩化物の単独重合体あるいは前述の非イ
オン性単量体との共重合により合成することができる。
また、ジアリルジメチルアンモニウム塩化物構造単位を
有する重合体がビニルアミン構造単位を共存する重合体
を合成するには、N−ビニルホルムアミド共重合体を酸
あるいはアルカリにより加水分解し合成できる。共重合
体中のジアリルジメチルアンモニウム塩化物構造単位の
モル%は、50〜100モル%、好ましくは70〜10
0モル%であり、ビニルアミン構造単位のモル%は、0
〜50、好ましくは0〜30モル%である。さらに、ジ
アリルジメチルアンモニウム塩化物構造単位を有する重
合体がビニルアミン構造単位及び/またはビニルアミジ
ン構造単位を共存する重合体は、ジアリルジメチルアン
モニウム塩化物/N−ビニルホルムアミド/アクリロニ
トリル共重合体を酸により加水分解し合成できる。共重
合体中のジアリルジメチルアンモニウム塩化物構造単位
は10〜50モル%、ビニルアミジン構造単位は10〜
50モル%、ビニルアミン構造単位は0〜80モル%を
有し、好ましくは、ジアリルジメチルアンモニウム塩化
物構造単位20〜50モル%、ビニルアミジン構造単位
20〜50モル%、ビニルアミン構造単位0〜60モル
%である。The (co) polymer (1) having a diallyldimethylammonium chloride structural unit can be synthesized by homopolymerization of diallyldimethylammonium chloride or copolymerization with the above-mentioned nonionic monomer. it can.
Further, in order to synthesize a polymer in which a polymer having a diallyldimethylammonium chloride structural unit and a vinylamine structural unit coexist, an N-vinylformamide copolymer can be synthesized by hydrolysis with an acid or an alkali. The mol% of the diallyldimethylammonium chloride structural unit in the copolymer is 50 to 100 mol%, preferably 70 to 10 mol%.
0 mol%, and the mol% of the vinylamine structural unit is 0 mol%.
-50, preferably 0-30 mol%. Further, a polymer having a diallyldimethylammonium chloride structural unit and a vinylamine structural unit and / or a vinylamidine structural unit coexists is obtained by hydrolyzing a diallyldimethylammonium chloride / N-vinylformamide / acrylonitrile copolymer with an acid. Can be decomposed and synthesized. The diallyldimethylammonium chloride structural unit in the copolymer is 10 to 50 mol%, and the vinylamidine structural unit is 10 to 10 mol%.
50 mol%, the vinylamine structural unit has 0 to 80 mol%, preferably 20 to 50 mol% of diallyldimethylammonium chloride structural unit, 20 to 50 mol% of vinylamidine structural unit, and 0 to 60 mol of vinylamine structural unit. %.
【0015】これら(1)の(共)重合体の分子量とし
ては、1万〜100万である。1万以下では、パラジウ
ムコロイドの吸着性を向上させる効果が低く、また10
0万以上では、分子量が高すぎて均一な銅メッキ膜を施
工することができない。The molecular weight of the (co) polymer (1) is 10,000 to 1,000,000. If it is 10,000 or less, the effect of improving the adsorptivity of the palladium colloid is low.
If the molecular weight is more than 10,000, the molecular weight is too high to form a uniform copper plating film.
【0016】(2)のアルキルアミン/エピクロロヒド
リン重縮合物(アルキル基はメチル、エチルおよびベン
ジル)は、モノメチルアミン、モノエチルアミン、ジメ
チルアミンあるいはジエチルアミンとエピクロロヒドリ
ンとの重縮合物である。(2)の重縮合物の分子量とし
ては、600〜10000である。(3)のアルキルア
ミン/エピクロロヒドリン/ポリアルキレンポリアミン
および/またはアンモニア重縮合物(アルキル基はメチ
ル、エチルおよびベンジル)は、モノメチルアミン、モ
ノエチルアミン、ジメチルアミンあるいはジエチルアミ
ンとエピクロロヒドリンとの重縮合物をさらにポリアル
キレンポリアミンおよび/またはアンモニアを連結剤と
してと反応させ、分子量を上げたものである。ポリアル
キレンポリアミンとしては、ジエチレントリアミン、ト
リエチレンテトラミンあるいはペンタエチレンヘキサミ
ンなどがあげられる。(3)の重縮合物の分子量として
は、1万〜数万程度である。The alkylamine / epichlorohydrin polycondensate (2) (the alkyl group is methyl, ethyl and benzyl) is a polycondensate of monomethylamine, monoethylamine, dimethylamine or diethylamine with epichlorohydrin. is there. The molecular weight of the polycondensate of (2) is from 600 to 10,000. The alkylamine / epichlorohydrin / polyalkylenepolyamine and / or ammonia polycondensate (the alkyl group is methyl, ethyl and benzyl) of (3) can be obtained by mixing monomethylamine, monoethylamine, dimethylamine or diethylamine with epichlorohydrin. Is further reacted with a polyalkylene polyamine and / or ammonia as a linking agent to increase the molecular weight. Examples of the polyalkylene polyamine include diethylene triamine, triethylene tetramine, and pentaethylene hexamine. The molecular weight of the polycondensate of (3) is about 10,000 to tens of thousands.
【0017】本発明の無電解メッキ触媒液は、通常使用
されている触媒液と同様にパラジウムコロイド、金属銅
を含有し、これに場合によっては錫コロイドや界面活性
剤、その他前処理剤としての有機薬品が含有していても
差し支えない。触媒液のpHは通常6〜10程度に維持
されるので、カチオン正アクリルエステル類では加水分
解が激しく実用的ではない。それに較べ本発明で使用す
るカチオン性重合体は、分子内にエステル結合がないの
でアルカリ側においても加水分解の恐れが少なく安定で
ある。The electroless plating catalyst solution of the present invention contains a palladium colloid and metallic copper similarly to a commonly used catalyst solution, and optionally contains a tin colloid, a surfactant, and other pretreatment agents. Organic chemicals can be contained. Since the pH of the catalyst solution is generally maintained at about 6 to 10, cationic acrylic esters are not practical because of severe hydrolysis. On the other hand, the cationic polymer used in the present invention has no ester bond in the molecule, and therefore is less likely to be hydrolyzed on the alkali side and is stable.
【0018】プリント配線板積層を構成するポリイミド
樹脂、エポキシ樹脂、あるいはガラスは負電荷に帯電し
易いので、添加されたカチオン性重合体は、これら積層
板表面に吸着するものと推定される。そのためパラジウ
ムコロイドあるいは錫コロイドは、配線板への吸着性が
向上する。また、一部のカチオン性重合体は、上記コロ
イド粒子表面にも吸着し、表面が正電荷に帯電し、配線
板表面への吸着性が向上する。その後、無電解メッキ液
で処理すれば良好なメッキ膜が形成される。従って、ス
ル−ホ−ルなどのようなメッキ処理の施しにくい個所に
おいても均一で良好なメッキ膜を形成させることができ
る。Since the polyimide resin, epoxy resin, or glass constituting the printed wiring board laminate is easily charged to a negative charge, the added cationic polymer is presumed to be adsorbed on the surface of the laminate. For this reason, the palladium colloid or tin colloid improves the adsorptivity to the wiring board. Further, some cationic polymers are also adsorbed on the surface of the colloid particles, the surface is charged to a positive charge, and the adsorbability to the surface of the wiring board is improved. Thereafter, if a treatment with an electroless plating solution is performed, a good plating film is formed. Therefore, a uniform and good plating film can be formed even in a place where plating treatment is difficult, such as a through hole.
【0019】[0019]
【実施例】以下、実施例および比較例によって本発明を
さらに詳しく説明するが、本発明はその要旨を超えない
限り、以下の実施例に制約されるものではない。The present invention will be described in more detail with reference to the following Examples and Comparative Examples. However, the present invention is not limited to the following Examples unless it exceeds the gist thereof.
【0020】(合成例−1)温度計、攪拌機、窒素導入
管、ペリスタポンプ(SMP−21型、東京理化器械
製)に接続した単量体供給管およびコンデンサ−を備え
た500mLの4ツ口フラスコ内にジメチルジアリルア
ンモニウム塩化物(商品名DADMAC、65重量%
品,ダイソ−製)138.5g、イオン交換水161.
5gをしこみ反応器内の温度を50℃に保ち、30分間
窒素置換をした後、2、2−アゾビスアミジノプロパン
ニ塩化水素化物の10%水溶液2.7g(対単量体0.
3%)を添加し重合を開始させた。50℃に保ち反応を
継続し7時間後前記の2、2−アゾビスアミジノプロパ
ンニ塩化水素化物を2.7g追加し、さらに10時間反
応させ終了させた。重合後、コロイド滴定法によりカチ
オン当量を測定し、静的光散乱法による分子量測定装置
(大塚電子製、DLS−7000)によって重量平均分
子量を測定した。この重合物を試験品−1とする。結果
を表1に示す。(Synthesis Example 1) A 500 mL four-necked flask equipped with a thermometer, a stirrer, a nitrogen inlet tube, a monomer supply tube connected to a peristaltic pump (SMP-21, manufactured by Tokyo Rika Kikai), and a condenser. Dimethyl diallyl ammonium chloride (trade name DADMAC, 65% by weight)
138.5 g, ion-exchanged water 161.
5 g was injected, the temperature inside the reactor was kept at 50 ° C., and the atmosphere was replaced with nitrogen for 30 minutes. Then, 2.7 g of a 10% aqueous solution of 2,2-azobisamidinopropane dichloride (based on monomer 0.1%).
(3%) was added to initiate polymerization. The reaction was continued at 50 ° C., and after 7 hours, 2.7 g of 2,2-azobisamidinopropane dihydrochloride was added, and the reaction was further continued for 10 hours to complete the reaction. After the polymerization, the cation equivalent was measured by a colloid titration method, and the weight average molecular weight was measured by a molecular weight measuring apparatus (DLS-7000, manufactured by Otsuka Electronics Co., Ltd.) by a static light scattering method. This polymer is referred to as test sample-1. Table 1 shows the results.
【0021】(合成例−2)温度計、攪拌機、窒素導入
管、ペリスタポンプ(SMP−21型、東京理化器械
製)に接続した単量体供給管およびコンデンサ−を備え
た500mLの4ツ口フラスコ内にジメチルジアリルア
ンモニウム塩化物(商品名DADMAC、65重量%
品,ダイソ−製)55.7g、イオン交換水196.0
gおよび2、2−アゾビスアミジノプロパンニ塩化水素
化物の10%水溶液0.9g(使用全単量体に対し0.
15%)をそれぞれしこんだ。別にN−ビニルホルムア
ミド(三菱化学製)23.9gとイオン交換水23.9
gを混合した水溶液を調製した。原料混合物を攪拌しな
がら、温度を40℃に保ち窒素を流入させ30分間重合
を進行させた後前記N−ビニルホルムアミド水溶液を毎
分0.4gで2時間かけフラスコ内に供給した。供給終
了後のDADMACとN−ビニルホルムアミドのモル比
は40:60である。供給終了後、4時間で重合開始剤
溶液を1.2g追加した。重合開始から12時間後、保
温を中止し重合を停止した。その後、35%塩酸62.
5g(対N−ビニルホルムアミド100モル%)を添加
し、90℃で5時間加水分解を行い分子内に一級アミノ
基を生成させた。反応後、コロイド滴定法によりイオン
当量(meq/g)、一級および四級アミノ基を測定
し、静的光散乱法による分子量測定器(大塚電子製DL
S−7000)によって重量平均分子量を測定した。こ
れを試験品−2とする。結果は表1に示す。(Synthesis Example 2) A 500 mL four-necked flask equipped with a thermometer, a stirrer, a nitrogen inlet tube, a monomer supply tube connected to a peristaltic pump (SMP-21, manufactured by Tokyo Rika Kikai) and a condenser. Dimethyl diallyl ammonium chloride (trade name DADMAC, 65% by weight)
55.7 g, ion-exchanged water 196.0
g and 0.9 g of a 10% aqueous solution of 2,2-azobisamidinopropane dihydrochloride (0.1 g for all monomers used).
15%). Separately, 23.9 g of N-vinylformamide (manufactured by Mitsubishi Chemical) and 23.9 g of ion-exchanged water
g was mixed to prepare an aqueous solution. While stirring the raw material mixture, the temperature was maintained at 40 ° C., nitrogen was introduced thereinto, and the polymerization was allowed to proceed for 30 minutes. Then, the N-vinylformamide aqueous solution was supplied into the flask at a rate of 0.4 g / min for 2 hours. The molar ratio between DADMAC and N-vinylformamide after the end of the supply is 40:60. Four hours after the completion of the supply, 1.2 g of a polymerization initiator solution was added. Twelve hours after the start of the polymerization, the heat retention was stopped to stop the polymerization. Thereafter, 35% hydrochloric acid.
5 g (based on 100 mol% of N-vinylformamide) was added, and the mixture was hydrolyzed at 90 ° C. for 5 hours to generate a primary amino group in the molecule. After the reaction, the ion equivalent (meq / g), primary and quaternary amino groups are measured by a colloid titration method, and a molecular weight measuring device (DL made by Otsuka Electronics Co., Ltd.) is measured by a static light scattering method.
S-7000). This is designated as test sample-2. The results are shown in Table 1.
【0022】(合成例−3)温度計、攪拌機、窒素導入
管、ペリスタポンプ(SMP−21型、東京理化器械
製)に接続した単量体供給管およびコンデンサ−を備え
た500mLの4ツ口フラスコ内にジメチルジアリルア
ンモニウム塩化物(商品名DADMAC、65重量%
品,ダイソ−製)60.3g、イオン交換水190.3
gおよび2、2−アゾビスアミジノプロパンニ塩化水素
化物の10%水溶液1.5g(使用全単量体に対し0.
2%)をそれぞれしこんだ。別にN−ビニルホルムアミ
ド(三菱化学製)23.6g、アクリロニトリル12.
9g及びイオン交換水35.5gを混合した水溶液を調
製した。原料混合物を攪拌しながら、温度を40℃に保
ち窒素を流入させ30分間重合を進行させた後前記N−
ビニルホルムアミド/アクリロニトリル混合水溶液を毎
分0.59gで2時間かけフラスコ内に供給した。供給
終了後のDADMAC/N−ビニルホルムアミド/アク
リロニトリルとのモル比は30:35:35である。供
給終了後、4時間で重合開始剤溶液を1.2g追加し
た。重合開始から12時間後、保温を中止し重合を停止
した。その後、35%塩酸41.7(N−ビニルホルム
アミド100モル%)を添加し、90℃で5時間加水分
解を行い分子内に一級アミノ基を生成させた。反応後、
コロイド滴定法によりイオン当量(meq/g)、一級
および四級アミノ基を測定し、静的光散乱法による分子
量測定器(大塚電子製DLS−7000)によって重量
平均分子量を測定した。これを試験品−3する。結果は
表1に示す。(Synthesis Example-3) A 500 mL four-necked flask equipped with a thermometer, a stirrer, a nitrogen inlet tube, a monomer supply tube connected to a peristaltic pump (SMP-21, manufactured by Tokyo Rika Kikai) and a condenser. Dimethyl diallyl ammonium chloride (trade name DADMAC, 65% by weight)
Product, made by Daiso) 60.3 g, ion-exchanged water 190.3
g and 1.5 g of a 10% aqueous solution of 2,2-azobisamidinopropane dihydrochloride (0.1 g for all monomers used).
2%). Separately, 23.6 g of N-vinylformamide (manufactured by Mitsubishi Chemical) and acrylonitrile
An aqueous solution was prepared by mixing 9 g and 35.5 g of ion-exchanged water. While stirring the raw material mixture, the temperature was kept at 40 ° C., nitrogen was introduced and polymerization was allowed to proceed for 30 minutes.
A mixed aqueous solution of vinylformamide / acrylonitrile was fed into the flask at 0.59 g / min for 2 hours. The molar ratio of DADMAC / N-vinylformamide / acrylonitrile after the end of the supply is 30:35:35. Four hours after the completion of the supply, 1.2 g of a polymerization initiator solution was added. Twelve hours after the start of the polymerization, the heat retention was stopped to stop the polymerization. Thereafter, 41.7% of 35% hydrochloric acid (100 mol% of N-vinylformamide) was added, and the mixture was hydrolyzed at 90 ° C. for 5 hours to generate a primary amino group in the molecule. After the reaction,
The ion equivalent (meq / g), primary and quaternary amino groups were measured by a colloid titration method, and the weight average molecular weight was measured by a molecular weight measuring device (DLS-7000 manufactured by Otsuka Electronics) by a static light scattering method. This is designated as test sample-3. The results are shown in Table 1.
【0023】(合成例−4)温度計、攪拌機、窒素導入
管、ペリスタポンプ(SMP−21型、東京理化器械
製)に接続した単量体供給管およびコンデンサ−を備え
た500mLの4ツ口フラスコ内にジメチルアミノプロ
ピルアクリルアミド(興人製)75.0g、イオン交換
水225.0gしこみ反応器内の温度を50℃に保ち、
30分間窒素置換をした後、2、2−アゾビスアミジノ
プロパンニ塩化水素化物の10%水溶液3.75g対単
量体0.5%)を添加し重合を開始させた。50℃に保
ち反応を継続し7時間後前記の2−アゾビスアミジノプ
ロパンニ塩化水素化物水溶液3.75g追加し、さらに
10時間反応させ終了させた。重合後、コロイド滴定法
によりカチオン当量を測定し、静的光散乱法による分子
量測定装置(大塚電子製、DLS−7000)によって
重量平均分子量を測定した。この重合物を試験品−4と
する。結果を表1に示す。(Synthesis Example-4) A 500 mL four-necked flask equipped with a thermometer, a stirrer, a nitrogen inlet tube, a monomer supply tube connected to a peristaltic pump (SMP-21, manufactured by Tokyo Rika Kikai), and a condenser. 75.0 g of dimethylaminopropylacrylamide (produced by Kojin), 225.0 g of ion-exchanged water, and the temperature in the reactor was kept at 50 ° C.
After purging with nitrogen for 30 minutes, 3.75 g of a 10% aqueous solution of 2,2-azobisamidinopropane dichloride (0.55% of monomer) was added to initiate polymerization. The reaction was continued at 50 ° C., and after 7 hours, 3.75 g of the above-mentioned aqueous solution of 2-azobisamidinopropane dichloride was added, and the reaction was further continued for 10 hours to complete. After the polymerization, the cation equivalent was measured by a colloid titration method, and the weight average molecular weight was measured by a molecular weight measuring device (DLS-7000, manufactured by Otsuka Electronics Co., Ltd.) by a static light scattering method. This polymer is designated as test sample-4. Table 1 shows the results.
【0024】(合成例−5)合成例−4と同様な操作で
アクリロイルアミノプロピルトリメチルアンモニウム塩
化物の重合体を合成した。これを試験品−5とする。(Synthesis Example-5) A polymer of acryloylaminopropyltrimethylammonium chloride was synthesized in the same manner as in Synthesis Example-4. This is designated as Test Product-5.
【0025】(合成例−6)温度計、攪拌機、窒素導入
管、ペリスタポンプ(SMP−21型、東京理化器械
製)に接続した単量体供給管およびコンデンサ−を備え
た500mLの4ツ口フラスコ内に50%水溶液のジメ
チルアミン90.0g、イオン交換水97.8gをし込
んだ。そして反応器を氷水で冷却しながら温度を50℃
以下に保ちながらエピクロロヒドリン101.8gを1
時間かけ供給した。モル比は1:1.1である。その
後、5時間反応を行い終了した。これを試験品−6とす
る。(Synthesis Example-6) A 500 mL four-necked flask equipped with a thermometer, a stirrer, a nitrogen inlet tube, a monomer supply tube connected to a peristaltic pump (SMP-21, manufactured by Tokyo Rika Kikai), and a condenser. 90.0 g of a 50% aqueous solution of dimethylamine and 97.8 g of ion-exchanged water were put therein. Then, the temperature was reduced to 50 ° C. while cooling the reactor with ice water.
While keeping below, 101.8 g of epichlorohydrin
Supplied over time. The molar ratio is 1: 1.1. Thereafter, the reaction was performed for 5 hours, and the reaction was completed. This is designated as Test Product-6.
【0026】(合成例−7)次ぎに試験品−6の200
gを採取し、初めのエピクロロヒドリンのモル比に対し
5モル%のペンタエチレンヘキサミン13.3gを添加
した。40℃で反応を行い粘性の上昇が認められた時点
で塩酸を加え反応を終了させた。他の合成例と同様にカ
チオン当量と分子量を測定した。これを試験品−7とす
る。(Synthesis example-7) Next, 200 of test sample-6
g, and 13.3 g of pentaethylenehexamine of 5 mol% with respect to the initial molar ratio of epichlorohydrin was added. The reaction was carried out at 40 ° C., and when the viscosity increased, hydrochloric acid was added to terminate the reaction. The cation equivalent and the molecular weight were measured as in the other synthesis examples. This is designated as Test sample-7.
【0027】[0027]
【実施例】脱イオン水4500mlに塩化第二銅3.3
6g、及び塩化パラジウム0.44gを溶解する。その
後、水素化ホウ素ナトリウム2.5gを200mlの脱
イオン水に溶解した溶液を加える。パラジウムイオンに
続き銅イオンが還元され溶液は黒色に変化する。10分
間攪拌を継続したあと色の変化がなくなるのを確認した
後、pHを9.2に調整し脱イオン水を追加し全量を5
000mlとし、本発明の試作品−1〜7をこの調製し
た無電解メッキ触媒液に対液0.2%添加した。そして
口径0.2〜0.3mmのスル−ホ−ルを作孔処理した
ポリイミドとガラスの積層板からなるプリント配線板を
8分間浸漬した後、水洗し室温用無電解メッキ液に10
分間浸漬した。プリント配線板の表面及びスル−ホ−ル
内は均一で強固なメッキ膜が施された。EXAMPLE 3.3 Cupric chloride 3.3 in 4500 ml of deionized water
6 g and 0.44 g of palladium chloride are dissolved. Thereafter, a solution of 2.5 g of sodium borohydride in 200 ml of deionized water is added. Following the palladium ions, the copper ions are reduced and the solution turns black. After continuing to stir for 10 minutes, after confirming that the color change disappeared, the pH was adjusted to 9.2, deionized water was added, and the total amount was reduced to 5%.
The electroless plating catalyst solution thus prepared was added with 0.2% of the prototypes-1 to 7 of the present invention. Then, after dipping a printed wiring board composed of a laminate of polyimide and glass having a through hole formed with a through hole having a diameter of 0.2 to 0.3 mm for 8 minutes, it is washed with water and then dipped in an electroless plating solution for room temperature for 10 minutes.
Soak for minutes. A uniform and strong plating film was formed on the surface of the printed wiring board and in the through hole.
【0028】[0028]
【比較例】実施例と同様な操作で無電解メッキ触媒液の
調製および無電解メッキを行った。この場合は、本発明
のカチオン性高分子を添加せずメッキ触媒液を調製し
た。無電解メッキ触媒液浸漬後、無電解銅メッキを行っ
たが、スル−ホ−ル内の銅メッキが十分ではなく、一部
未処理の個所が存在した。COMPARATIVE EXAMPLE An electroless plating catalyst solution was prepared and electroless plating was performed in the same manner as in the example. In this case, a plating catalyst solution was prepared without adding the cationic polymer of the present invention. After immersion in the electroless plating catalyst solution, electroless copper plating was performed. However, copper plating in the through-hole was not sufficient, and some untreated portions were present.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C23C 18/38 C23C 18/38 // H05K 3/18 H05K 3/18 F Fターム(参考) 4J043 QB53 RA08 SA09 SB02 TA38 TB01 UB011 UB012 UB032 UB042 ZA22 ZB60 4J100 AG04Q AL03Q AL08P AL08Q AL09Q AM02Q AM15Q AM19Q AM21P AM21Q AN04Q AN14P AQ08Q BA10Q BA12Q BA18P BA30P BA31P BC79Q CA04 DA38 JA00 4K022 AA02 AA37 AA42 BA08 CA06 CA16 CA18 CA21 CA22 DA01 5E343 AA12 BB24 BB71 BB76 CC06 CC71 DD33 ER01 GG01 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C23C 18/38 C23C 18/38 // H05K 3/18 H05K 3/18 FF term (Reference) 4J043 QB53 RA08 SA09 SB02 TA38 TB01 UB011 UB012 UB032 UB042 ZA22 ZB60 4J100 AG04Q AL03Q AL08P AL08Q AL09Q AM02Q AM15Q AM19Q AM21P AM21Q AN04Q AN14P AQ08Q BA10Q BA12Q BA18P BA30P BA31P BC79Q CA04 A38A02 A04A38A01 CC71 DD33 ER01 GG01
Claims (8)
合体及び/または(2)〜(3)の重縮合物のうち少な
くとも一種を添加することを特徴とする無電解メッキ触
媒液の調製方法。 (1)ジアルキルアミノプロピル(メタ)アクリルアミ
ド構造単位、(メタ)アクリロイルアミノプロピルトリ
アルキルアンモニウム塩化物構造単位(アルキル基は、
いずれもメチルおよびエチル)、ジアリルジメチルアン
モニウム塩化物構造単位 (2)アルキルアミン/エピクロロヒドリン/ポリアル
キレンポリアミンおよび/またはアンモニア重縮合物
(アルキル基はメチル、エチルおよびベンジル)アルキ
ルアミン/エピクロロヒドリン重縮合物(アルキル基は
メチル、エチルおよびベンジル)1. An electroless plating catalyst solution comprising at least one of a (co) polymer having the following structural unit (1) and / or a polycondensate of (2) to (3): Preparation method. (1) Dialkylaminopropyl (meth) acrylamide structural unit, (meth) acryloylaminopropyltrialkylammonium chloride structural unit (the alkyl group is
All are methyl and ethyl), diallyldimethylammonium chloride structural unit (2) alkylamine / epichlorohydrin / polyalkylenepolyamine and / or ammonia polycondensate (alkyl groups are methyl, ethyl and benzyl) alkylamine / epichloro Hydrin polycondensate (alkyl group is methyl, ethyl and benzyl)
アンモニウム塩化物構造単位とビニルアミン構造単位及
び/またはビニルアミジン構造単位を含有することを特
徴とする請求項1に記載の無電解メッキ触媒液の調製方
法。2. The electroless plating catalyst solution according to claim 1, wherein the (co) polymer contains a diallyldimethylammonium chloride structural unit and a vinylamine structural unit and / or a vinylamidine structural unit. Preparation method.
アンモニウム塩化物構造単位(aモル%)と、ビニルア
ミン構造単位(bモル%)及び/またはビニルアミジン
構造単位(cモル%)を含有する重合体であり、a,
b,cがそれぞれ、30≦(a)≦90、10≦(b)
≦70、0≦(c)≦60の範囲を有することを特徴と
する請求項1あるいは2に記載の無電解メッキ触媒液の
調製方法。3. The (co) polymer contains a diallyldimethylammonium chloride structural unit (a mol%) and a vinylamine structural unit (b mol%) and / or a vinylamidine structural unit (c mol%). A polymer,
b and c are respectively 30 ≦ (a) ≦ 90 and 10 ≦ (b)
The method for preparing an electroless plating catalyst solution according to claim 1, wherein a range of ≦ 70 and 0 ≦ (c) ≦ 60 is satisfied.
%のジアルキルアミノプロピル(メタ)アクリルアミド
構造単位を有することを特徴とする請求項1に記載の無
電解メッキ触媒液の調製方法。4. The method for preparing an electroless plating catalyst solution according to claim 1, wherein the (co) polymer has 50 to 100 mol% of a dialkylaminopropyl (meth) acrylamide structural unit.
%の(メタ)アクリロイルアミノプロピルトリアルキル
アンモニウム塩化物単位を含有することを特徴とする請
求項1に記載の無電解メッキ触媒液の調製方法。5. The electroless plating catalyst solution according to claim 1, wherein the (co) polymer contains 50 to 100 mol% of (meth) acryloylaminopropyltrialkylammonium chloride units. Preparation method.
万〜100万であることを特徴とする請求項1〜5に記
載の無電解メッキ触媒液の調製方法。6. The (co) polymer of (1) having a molecular weight of 1
The method for preparing an electroless plating catalyst solution according to any one of claims 1 to 5, wherein the amount is from 10,000 to 1,000,000.
徴とする請求項1〜6に記載の無電解メッキ触媒液の調
製方法。7. The method according to claim 1, further comprising a palladium colloid.
徴とする請求項1〜7に記載の無電解メッキ触媒液の調
製方法。8. The method for preparing an electroless plating catalyst solution according to claim 1, wherein the pH is 5.0 to 11.0.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005206905A (en) * | 2004-01-23 | 2005-08-04 | Ebara Corp | Substrate treatment method and device, and treatment liquid |
JP2007098563A (en) * | 2005-09-07 | 2007-04-19 | Central Res Inst Of Electric Power Ind | Nanostructure and method for producing nanostructure |
JP2007262542A (en) * | 2006-03-29 | 2007-10-11 | Fujifilm Corp | Method for forming metal film, substrate for forming metal film, metal film laminate, method for forming metal pattern, substrate for forming metal pattern, metal pattern material, and coating liquid composition for forming polymer precursor layer |
KR20200019182A (en) * | 2017-06-16 | 2020-02-21 | 아토테크더치랜드게엠베하 | Electrolytic Deposition of Aqueous Acidic Copper Electroplating Baths and Copper Coatings |
-
2000
- 2000-03-10 JP JP2000066375A patent/JP4321793B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005206905A (en) * | 2004-01-23 | 2005-08-04 | Ebara Corp | Substrate treatment method and device, and treatment liquid |
JP2007098563A (en) * | 2005-09-07 | 2007-04-19 | Central Res Inst Of Electric Power Ind | Nanostructure and method for producing nanostructure |
JP2007262542A (en) * | 2006-03-29 | 2007-10-11 | Fujifilm Corp | Method for forming metal film, substrate for forming metal film, metal film laminate, method for forming metal pattern, substrate for forming metal pattern, metal pattern material, and coating liquid composition for forming polymer precursor layer |
KR20200019182A (en) * | 2017-06-16 | 2020-02-21 | 아토테크더치랜드게엠베하 | Electrolytic Deposition of Aqueous Acidic Copper Electroplating Baths and Copper Coatings |
KR102620336B1 (en) * | 2017-06-16 | 2024-01-02 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | Aqueous Acid Copper Electroplating Baths and Methods for Electrolytic Deposition of Copper Coatings |
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