JP2001249233A - Optically connecting parts and their manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new optically connecting parts wherein optical fibers are wired in a two-dimensional plane as a designed wiring pattern and a positional deviation of the wired optical fiber hardly occurs and which are strong against destruction such as bending and to provide their manufacturing method. SOLUTION: In the optically connecting parts wherein plural optical fibers 4 each having a terminal part for being optically connected at its end are wired on a base 1 in a two-dimensional plane so that a wiring pattern having at least one crossing part is formed, the film of an adhesive layer 3 for fixing the optical fiber in the vicinity of the crossing part of the optical fiber is thicker than that in the other part and forms thick film parts A, B or an additional adhesive layer is provided in the crossing part of the optical fiber so as to mutually join respective crossing optical fibers by the adhesive to form the thick film part. A resin protective layer 2 is provided on the optical fiber and whereby the optical fiber is fixed and protected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device, an optical circuit package, and an optical connection device for interconnecting optical devices, components, and devices used for optical communication and optical information processing such as optical circuit devices. Optical wiring board) and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, in connection of a plurality of optical elements in an optical circuit package, between a plurality of optical circuit packages, or in optical connection of an optical circuit device on which the optical circuit package is mounted, an optical element or an optical circuit package is generally used. An optical connector is arranged at an end of an optical circuit device or the like and is connected to each other by an optical fiber. In this case, since the optical fibers need to be arranged with an extra length, for example, on the optical circuit package or inside and / or the back of the optical circuit device, complicated wiring by the optical fibers is formed in a bird's nest, Or at present, they are congested and occupy a large space. For an optical connection method that requires a great deal of space and connection labor for such complicated wiring, an optical fiber is arbitrarily wired on a two-dimensional plane to solve these problems easily. A method has been proposed. For example, as disclosed in Japanese Patent No. 2574611, there has been proposed an optical connection component that uses an adhesive-coated sheet or substrate and thereby fixes an optical fiber.

[0003] By the way, the optical connection component described in Japanese Patent No. 2574611 is manufactured by laying an optical fiber with an adhesive on a base material (base layer) or a fiber jacket to form a wiring pattern. Above,
An optical connection component is obtained by forming a protective layer by coating using a material similar to the material used for the base material. However, according to this method, as the number of optical fibers that are wired increases and the overlapping portion (crossover wiring) of the optical fibers in the formed wiring pattern increases, the area where the wired optical fibers contact the adhesive is increased. Less, so the fixing force of the optical fiber by the adhesive becomes weaker, and it is not possible to wire the optical fiber according to the wiring pattern, or even if it is possible to wire according to the wiring pattern immediately after wiring, There has been a problem that the optical fiber moves, causing the optical fiber in the wiring pattern to shift in position (collapse of the wiring pattern). Also, when the adhesive force by the adhesive is weak, the resistance to destruction upon deformation such as bending of the optical wiring board is significantly weakened, and further, when the optical fiber is displaced, micro-bending of the optical fiber occurs, There is a problem that the possibility of occurrence of light loss due to this increases.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art. That is, according to the present invention, it is possible to two-dimensionally wire an optical fiber according to a designed wiring pattern to a plurality of optical fiber wires wired congested as described above, and An object of the present invention is to provide a novel optical connection component which does not cause fiber displacement (disruption of a wiring pattern) and is resistant to destruction such as bending, and a method for manufacturing the same.

[0005]

According to a first optical connection component of the present invention, a plurality of optical fibers each having an end portion for optical connection at an end are formed with a wiring pattern having at least one crossing portion. And two-dimensionally wired on a base material via an adhesive layer as described above, and (a) near the intersection of the optical fibers on the adhesive layer, the thickness is larger than other portions. A thick film portion is formed so as to form a film, or (b) a thick film portion formed of an additional adhesive layer is formed at an intersection of the optical fibers so that the intersecting optical fibers are bonded to each other. It is characterized by being.

In the first optical connecting part of the present invention, the plurality of optical fibers wired in a two-dimensional plane are:
It is preferably fixed and protected by a resin protective layer.

According to the first method of manufacturing an optical connection component of the present invention, a plurality of optical fibers each having an end portion for optically connecting to an end portion are formed so that a wiring pattern having at least one intersection portion is formed. (2) two-dimensionally wiring on a base material via an adhesive layer, and then forming a resin protective layer thereon to fix the optical fiber. When wiring a plurality of optical fibers, a thick film portion made of an additional adhesive layer is formed with an adhesive near the intersection of the optical fibers on the adhesive layer, and then the optical fibers are wired. Features and
In the case of the above (b), after wiring some optical fibers via the adhesive layer, a thick film portion made of an additional adhesive layer by an adhesive is provided at least at an intersection portion on the optical fiber. Then, another optical fiber is wired so as to intersect at the thick film portion.

In the present invention, as a method for forming a thick film portion comprising an additional adhesive layer, an adhesive is applied on an adhesive layer having a constant film thickness on a base material or on a wired optical fiber. An additional adhesive layer may be formed so as to directly form a thick film portion by coating, or an adhesive layer is formed in a predetermined pattern on a peelable film, and is formed into a film having a constant thickness. It may be transferred onto an adhesive layer or onto a wired optical fiber to form a thick film portion comprising an additional adhesive layer. The use of the latter transfer method has the advantages that the time required for drying and solidifying the adhesive can be shortened, and that the factor of cost increase due to a decrease in product yield can be reduced.

In the present invention, the wired optical fiber can be fixed and protected by providing a resin protective layer thereon, or by attaching a substrate provided with an adhesive layer. it can.

A second optical connecting part according to the present invention is characterized in that an adhesive layer is formed such that a plurality of optical fibers each having an end portion for optically connecting to an end form a wiring pattern having at least one crossing portion. And two-dimensionally wired on the first resin protection layer via the first resin protection layer and fixed by the second resin protection layer, and (a) near the intersection of the optical fibers on the adhesive layer Wherein the thick film portion is formed so as to be thicker than the other portions, or (b) at the intersection of the optical fibers, the additional adhesive layer is formed such that the intersecting optical fibers are bonded to each other. A thick film portion is formed.

According to a second method for producing an optical connection component of the present invention, a releasable film is used as a temporary base material, and a plurality of optical fibers having an end portion for optically connecting to an end on the releasable film. After arranging the fiber in a two-dimensional plane via an adhesive layer so that a wiring pattern having at least one crossing portion is formed, and then forming a resin protective layer thereon and fixing the optical fiber, The method comprises peeling the peelable film and forming a resin protective layer on the exposed adhesive layer. In the case of the above (a), when wiring the plurality of optical fibers, the adhesive layer is formed. A thick film portion made of an additional adhesive layer is formed by an adhesive near the intersection of the optical fibers, and thereafter the optical fiber is wired. In the case of (b), the adhesive is used. Part through layers After wiring the optical fiber, a thick film portion made of an additional adhesive layer is formed with an adhesive at least at a portion where the optical fiber crosses, and then another optical fiber crosses the thick film portion. Wiring. Note that a flexible resin protective layer is used in place of the base material, an adhesive layer having a thick film portion is directly formed thereon in the same manner as described above, and a plurality of optical fibers are wired thereon, Furthermore, the optical fiber is protected by a resin protective layer,
It may be fixed.

The method of forming the thick film portion made of the additional adhesive layer can be performed in the same manner as in the case of manufacturing the first optical connection component.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an example of an optical fiber wiring pattern for explaining the present invention, and the numbers in the figure indicate the wiring order of the optical fibers. FIG.
And FIG. 3 is an explanatory view for explaining a state of formation of an adhesive layer in the first and second optical connection parts of the present invention. FIG. Where
The thick film portion A is newly provided with additional adhesive layers 3a and 3b.
FIG. 3 shows a case where the optical fiber is wired so as not to form a crossing portion on the adhesive layer on the base material, and then a desired position on the optical fiber is formed. Next, a case is shown in which additional adhesive layers 3c and 3d are newly provided to form thick film portions C and D, and another optical fiber is wired thereon.

FIG. 4 is a plan view of an example of the first optical connection component of the present invention, and FIG. 5 is a cross-sectional view taken along the line AA 'of FIG. 4, which is newly added on the adhesive layer. An example in which the adhesive layer is provided to partially increase the thickness of the adhesive layer is shown. 4 and 5, an adhesive layer 3 having thick film portions A and B whose thickness is partially increased as shown in FIG. 2 is provided on one surface of a base material 1 having a two-dimensional plane. In addition, a plurality of optical fibers 4 are wired in a two-dimensional plane via the adhesive layer. In addition, a thick film portion A is formed on a predetermined portion of the adhesive layer having a constant thickness provided on the base material by using an adhesive.
After providing the first and second optical fibers, the thick film portions A and B are formed using an adhesive, and then the second and third optical fibers are formed. A heavy or third optical fiber may be wired. These optical fibers 4 are fixed by a flexible resin protective layer 2 provided thereon. An end of the optical fiber 4 is a terminal portion 5 for optical connection, and an optical component 6, for example, an optical connector is connected. In addition,
The terminal part 5 and the optical component 6 may be integrated. 7
Is a weir provided for forming the resin protective layer.

FIG. 6 is a view showing another example of the first optical connection component of the present invention, and is a view showing a cross section corresponding to a cross section taken along line AA 'of FIG. The optical connecting part of FIG.
In this embodiment, an optical fiber is fixed and protected by attaching a substrate provided with an adhesive layer instead of the resin protective layer. That is, on one surface of the base material 1 having a two-dimensional plane, an adhesive layer 3 having thick film portions A and B whose thickness is partially increased as shown in FIG. A plurality of optical fibers 4 are wired in a two-dimensional plane via the layers. Then, a substrate 1 'having an adhesive layer 3' having a constant film thickness is adhered on the wired optical fiber. Also in this case, the optical fibers may be wired after the thick film portions A and B are provided at predetermined positions of the adhesive layer having a constant film thickness provided on the base material 1 using an adhesive. And
After wiring the first or second optical fiber,
Thick film portions A and B may be formed using an adhesive, and then a second or third optical fiber may be wired.

FIG. 7 is a view showing another example of the first optical connecting part of the present invention, and is a view showing a cross section corresponding to a cross section taken along line BB 'of FIG. The optical connection component in FIG. 7 is an optical connection component in which a base material is present on both surfaces of the resin protective layer, and a new adhesive layer is formed on a part of the optical fiber wired on the adhesive layer. , A thick film portion C as shown in FIG.
And D. That is, first, a first-layer optical fiber is wired on an adhesive sheet in which an adhesive layer having a constant thickness is formed on one surface of a base material 1 having a two-dimensional plane,
Next, an additional adhesive layer 3c is newly provided on the optical fiber at the position where the wiring crosses to form a thick film portion (corresponding to the thick film portion C in FIG. 3), and a second optical fiber is wired. Further, an additional adhesive layer 3d is newly provided on the optical fiber at the position where the third wiring intersects, thereby forming a thick film portion (corresponding to the thick film portion D in FIG. 3).
Then, a third optical fiber is wired. (Note that
In the case where a larger number of optical fibers are to be wired, the same operation as described above is repeated, so that a quadruple or more optical fiber multiplexed wiring is possible. The resin protective layer 2 is provided on the substrate on which the optical fiber 4 is wired as described above, and further, the optical fiber is wired on the upper surface of the resin protective layer via the adhesive layer 3 'in the same manner as described above. A substrate 1 'having 4' is stuck.

FIG. 8 is a view showing an example of the second optical connection component of the present invention, and is a view showing a cross section corresponding to a cross section taken along the line AA 'of FIG. The optical connection component in FIG. 8 is provided with a resin protective layer instead of the base material. That is,
A plurality of optical fibers 4 are two-dimensionally arranged on the resin protective layer 2a (first resin protective layer) via an adhesive layer 3 having a different thickness formed in the same manner as in FIG. The optical fibers 4 are fixed by a resin protection layer 2 (second resin protection layer). Note that 7
And 7 'are weirs.

In the first optical connecting part of the present invention, the flexible base material having a two-dimensional plane for supporting the wired optical fiber is not particularly limited.
For example, substrates used in ordinary electronic components and electric components, such as glass-epoxy resin composite substrates, polyester films, polyimide films, gels, rubbers, and foams of organic materials such as silicone or urethane resins. Anything can be used. Further, the optical connecting component of the present invention does not need to be flexible depending on the purpose of use, and may be rigid. For example, a substrate made of a rigid polymer material, a ceramic substrate, or the like can be used, and its shape may be any.

The optical fiber to be wired in the present invention is appropriately selected and used according to the application purpose of the optical connecting part. For example, a single mode optical fiber or a multi-mode optical fiber made of quartz or plastic is preferably used. You. Further, as the optical fiber, a carbon-coated optical fiber can be preferably used.

As the adhesive constituting the adhesive layer for wiring the optical fiber, any adhesive having an adhesive force for maintaining the shape of the optical fiber against the tension generated by bending the optical fiber to be wired can be used. Any type can be used, for example, various pressure-sensitive adhesives such as urethane, acrylic, epoxy, nylon, phenol, polyimide, vinyl, silicone, rubber, fluorinated epoxy, and fluorinated acrylic. Agents (adhesives), thermoplastic adhesives, and thermosetting adhesives can be used. A pressure-sensitive adhesive and a thermoplastic adhesive are preferably used from the viewpoint of ease of wiring the optical fiber.

When a resin protective layer is present in the first optical connection component of the present invention, the material constituting the resin protective layer is not particularly limited, but for example, a gel-like or rubber-like organic material , UV curable resin, electron beam curable resin,
A curable resin such as a thermosetting resin having flexibility, a thermoplastic resin having flexibility, or the like is used. More specifically, as a gel-like organic material, a silicone-based gel,
Acrylic resin gel, fluororesin gel, etc.,
As rubber-like organic materials, silicone rubber, urethane rubber, fluorine rubber, acrylic rubber, ethylene-
Acrylic rubber, SBR, BR, NBR, chloroprene rubber and the like can be mentioned. Examples of the flexible curable resin include an epoxy resin, an ultraviolet curable adhesive, and a silicone resin. Examples of the flexible thermoplastic resin include resins constituting a hot melt adhesive such as an acrylic resin such as polyvinyl acetate and ethyl methacrylate resin, a vinylidene chloride resin, a polyvinyl butyral resin, and a polyamide resin.

If necessary, a protective layer may be further provided on the resin protective layer of the optical connection part. When flexibility is not required much, the substrate may be the same as the substrate on which the optical fiber is wired, and a sheet or plate of an organic polymer material, ceramic or the like may be used. Further, when the optical connection component is required to be flexible, a silicone hard coat material or the like may be used as a protective layer that does not impair the flexibility.

In the second optical connection part of the present invention, the adhesive layer and the second resin protective layer for fixing the optical fiber are formed of the same material as described for the first optical connection part. Can be. Further, the first resin protective layer may be made of the same material as the second resin protective layer, or may be made of another synthetic resin.

In the first and second optical connection parts of the present invention, an optical fiber is usually pulled out from a desired position (port) on the end face of the optical connection part body for connection with an optical connector and terminated. A portion is formed, to which an optical connector is connected, or is fusion-spliced to an optical fiber connected to the optical connector. The optical connector connected to the optical connection component of the present invention is not particularly limited, but a single-core or multi-core small optical connector is preferably selected. For example, MPO optical connector, MT optical connector, MU optical connector, FPC optical connector (NTT R & D, Vol. 45)
No. 6, p. 589) or V-groove parts used for optical connection. The method of connecting the optical connector is not limited at all, and the terminal portion and the optical connector may be integrated.

Next, a method of manufacturing the first optical connection component of the present invention will be described. In the present invention, a first method for forming an adhesive layer and wiring an optical fiber is for producing the optical connection component according to the above-described embodiment (a), and includes a base material having a two-dimensional plane in advance. On one side, an adhesive layer of a certain thickness is formed by roll coating, bar coating, blade coating, or the like in a state where the adhesive is directly or dissolved in a solvent to form a coating solution, or the adhesive is previously peelable. An adhesive sheet having an adhesive layer formed on a film is adhered to the base material, and then the peelable film is removed to form an adhesive layer having a constant thickness on the base material. Next, spray coating, screen printing, dispenser is applied to a desired portion of the adhesive layer on the base material (in the vicinity of the position where the optical fiber intersects), directly or by dissolving the adhesive in a solvent to form a coating solution. An adhesive is partially applied by a method such as coating, casting, or ink jet, so that an adhesive layer having a thick film portion can be formed on a substrate. Or, on the release film, spray coating, screen printing, dispenser coating, casting, with the adhesive layer directly or dissolved in a solvent to form a coating solution
By preparing an adhesive pattern in which an adhesive is partially applied by ink jet or the like, and transferring the adhesive pattern onto the adhesive layer of the substrate on which the adhesive layer having a certain thickness is formed, An adhesive layer having a thick film portion may be formed.
In the above case, the wiring of the optical fiber may be performed after forming the adhesive layer having the film thickness portion, or the first optical fiber may be wired on the base material having the adhesive layer. After that, after forming a thick film portion for wiring the second optical fiber, the second optical fiber may be wired, and this operation may be repeated, thereby performing a two-dimensional planar operation. Multiple optical fibers can be wired to the same.

The second method is for producing the optical connection component of the above-mentioned embodiment (b), and has a constant film thickness on one surface of a base material having a two-dimensional plane as described above. An adhesive layer is formed, a first optical fiber is wired in a desired pattern on the adhesive layer, and a predetermined portion on the wired optical fiber (a portion where the second optical fiber crosses).
In the same manner as above, an adhesive is partially applied by a method such as spray coating, screen printing, dispenser coating, casting, ink jet, etc., and an adhesive layer is formed on the optical fiber. Wiring. By repeating the same operation, it is possible to obtain multiple wirings of optical fibers crossing three or more times.

The optical fibers may be wired by simultaneously performing the first and second methods. In the present invention, the thickness of the adhesive layer may be appropriately selected and used based on the diameter of the optical fiber to be wired.
mm, preferably 5 to 500 μm, more preferably 10
It is set in the range of ３００300 μm.

The optical fiber wired by the above-described first and second methods is set so that its end is pulled out so as to be an end portion for optically connecting to an optical connector or the like.

The optical fiber wired by the first and second methods is provided with a resin protective layer or bonded with another protective layer forming material to fix and protect the optical fiber. When the optical fiber is fixed and protected by providing a resin protective layer, the thickness of the resin protective layer is appropriately selected according to the diameter of the optical fiber to be wired and the number of overlapping layers so that the optical fiber is protected and fixed. do it. Usually, a thickness of (optical fiber diameter) × (number of overlapping fibers) or more is required. In addition, the thickness of the resin protective layer when the optical fiber is not wired, depending on the purpose of using the optical connection component,
The film may be appropriately selected and used at a film thickness that reduces the rigidity of the substrate, but is usually about 1 μm to 10 mm, preferably 10 μm to 5 mm, and more preferably 30 μm to 1 μm.
mm.

The simplest method of providing a resin protective layer for fixing and protecting an optical fiber wired on a base material is to provide a weir-like material at the periphery of the base material or in the vicinity of the periphery. This is a method in which a resin material is filled in the inner part of the object and solidified. For example, a method of dissolving a resin material in an appropriate solvent to form a coating liquid, dripping it and drying it, a method of dropping and solidifying the resin material in a state where the resin material is heated and melted, filling in a solid state, filling the resin material or The resin protective layer can be formed by a method in which the entire optical connection component is heated and melted and then solidified, or a method in which a resin material in a liquid state is dropped and cured by heating, room temperature, or humidified.

Usually, the weir-like material may be provided at or near the periphery of the substrate over the entire periphery thereof. However,
In the case where optical components such as an optical connector, an optical module, and an optical device are mounted near the periphery of the base material, when those optical components serve as a weir-like material, the optical component is mounted on a portion where the optical components are mounted. May not be provided with a weir.

The material constituting the weir-like material is not particularly limited, and may be appropriately selected according to the application purpose of the optical connection part. In particular, the material is made of organic fibers such as polyethylene, polypropylene, and nylon. A nonwoven fabric, a nonwoven fabric of glass fiber, and a sealing agent (filler) made of a silicone-based, epoxy-based, urethane-based, or acrylic-based resin are preferably used. As long as the weir-like material prevents the resin material filled inside from flowing out,
Its size and shape are not limited.

Further, a resin material for forming a resin protective layer is dropped on the wired optical fiber, and the optical fiber is wired on the resin protective layer via a base material or an adhesive layer in the same manner as described above. The base material may be stacked and integrated to form an optical connection component having two base materials. Furthermore, by preparing two or more optical connection parts of the present invention obtained as described above, and bonding their resin protective layers to each other via an adhesive layer, a large number of substrates are provided. A multi-stage optical wiring board can be obtained.

In the first optical connecting part of the present invention, when a resin protective layer for protecting and fixing the optical fiber is not provided, another protective layer forming material may be attached. That is, an optical connection component is produced by sticking a sheet or plate of an organic polymer material or a ceramic having an adhesive layer on the optical fiber wired by the first or second method. You can also.

Further, in the present invention, as an example of a method for producing the second optical connection component having no base material, a peelable film may be temporarily used as the base material. That is, an adhesive layer is provided on a peelable film by the same method as the first and second methods, and the wired optical fiber is protected and fixed by the resin protective layer as described above, and then peeled. After removing the conductive film, a resin protective layer made of the same or different resin material is formed on the exposed adhesive layer in the same manner as described above, and the optical fiber is fixed in a state where it is buried by the two resin protective layers. do it. In the above case, a plurality of optical fibers may be wired on the adhesive layer exposed by removing the peelable film, and a resin protective layer may be formed thereon in the same manner as described above. As another example of a method for producing the second optical connection component having no base material, a flexible resin protective layer is used instead of the base material, and a thick film is formed thereon directly in the same manner as described above. Forming an adhesive layer having a portion, wiring a plurality of optical fibers thereon,
The optical fiber may be protected and fixed with a resin protective layer made of the same or different resin material as described above. When the second optical connection component is created, the first and second methods may be performed simultaneously.

In the first and second optical connection parts manufactured as described above, an optical part such as an optical connector or an optical module is connected to the end of the drawn optical fiber. For example, an end portion of an optical fiber whose end face has been processed to be connected to an optical connector is connected to the optical connector, or an end face of the optical fiber fixed to the optical connector, and an end face of each optical fiber pulled out from the optical connection component. And fusion spliced.

[0037]

The present invention will be described below with reference to examples.
The present invention is not limited to this. Example 1 30% ethyl acetate of acrylic resin composed of n-butyl acrylate / methyl acrylate / acrylic acid / 2-hydroxyethyl methacrylate copolymer (= 82/15 / 2.7 / 0.3 (weight ratio)) To 100 parts of the solution, 1.0 part of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) was blended and mixed. The obtained coating solution for acrylic pressure-sensitive adhesive (adhesive) was roll-coated to a thickness of 12
One side of a 5 μm polyimide film is uniformly coated so that the film thickness after drying becomes 100 μm to form an acrylic adhesive layer, and the adhesive sheet (size: 100 mm × 60 mm)
mm). Next, on the adhesive layer of this adhesive sheet, as shown in FIG. 2, the above-mentioned adhesive coating liquid was applied by dispenser coating to the vicinity of the portion where the optical fibers intersect, thereby forming thick film portions A and B. Formed. That is, as for the thick film portion A near the portion where the optical fiber intersects the two layers and the three layers, the film thickness after drying is 250 μm (total = 35 μm).
0 μm), and for the thick film portion B, the above-mentioned adhesive coating solution is applied so that the film thickness after drying becomes 500 μm (total = 600 μm), and the thick film portion is formed. An adhesive sheet having an agent layer was produced. On top of the adhesive layer of this adhesive sheet, an optical fiber core (made by Furukawa Electric,
7 (diameter: 250 μm) were wired according to the numbers in the figure according to the wiring pattern of FIG. In this case, since the thickness of the adhesive layer before and after the place where the optical fibers intersect with each other in a double or triple manner is thick, the optical fibers can be wired according to the designed wiring pattern of FIG. Also, no displacement of the optical fiber occurred. In addition, although it was held in this temporarily fixed state for three days before being fixed by the resin protective layer, the pattern was not collapsed, and the wiring pattern as designed could be maintained.

Thereafter, a silicone-based filler (manufactured by Konishi Corporation, Bath Bond) was applied to the periphery of the polyimide film on which the optical fiber was wired, and the width was 1.5 mm and the height was 1 m.
m were formed. Next, a silicone gel coating solution (SE-188, manufactured by Dow Corning Toray Co., Ltd.)
0) was dropped, and the silicone resin gel was cured at 120 ° C. for 1 hour to form a resin protective layer, and the optical fiber was completely fixed by the resin protective layer to a thickness of 1.2 m.
m was prepared. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board was 18 mm in curvature of 20 mm.
When bent at 0 °, no damage was left on the optical wiring board and the optical fiber. When the loss of all connected optical fibers was measured, it was 0.3
dB or less. Also, for the fabricated optical wiring board,
When a high-temperature and high-humidity test left for 5000 hours at 75 ° C. and 90% RH and a temperature cycle test for 500 times at −40 ° C. to 75 ° C. were performed, both changes and fluctuations in light loss were 0.
It was 3 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 2 An adhesive sheet of a polyimide film having an acrylic adhesive layer having a thickness of 100 μm was prepared in the same manner as in Example 1.
Were produced. Next, the seven optical fibers shown in FIG. 1 were wired on one adhesive sheet as follows. First, the optical fibers shown in FIG. 1 were wired on the adhesive layer of the produced adhesive sheet. Next, in the same manner as in Example 1, an adhesive sheet having an adhesive layer on which a thick film portion was formed was produced. That is, the thick film portion A shown in FIG. 2 has a thickness after drying of 250 μm (total = 350 μm), and the thick film portion B has a dry film thickness of 500 μm (total = 600 μm). Thus, the same adhesive solution as in Example 1 was applied by dispenser coating to prepare an adhesive sheet having an adhesive layer having a thick film portion. Next, the optical fibers shown in FIG. 1 were wired on the produced adhesive sheet. In this case, the thickness of the adhesive layer before and after the place where the optical fibers intersect in a double or triple manner is thick, so that the optical fibers can be wired according to the designed wiring pattern of FIG. And the optical fiber was not displaced. In addition, the temporary fixing state was maintained for three days until another adhesive sheet was bonded and fixed, but the pattern was not collapsed and the wiring pattern as designed could be maintained.

Another adhesive sheet was stuck on the adhesive sheet on which the optical fiber was wired, to produce an optical wiring board having a thickness of about 1.2 mm. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board was 18 mm at a curvature of 40 mm.
When bent at 0 °, no damage was left on the optical wiring board and the optical fiber. When the loss of all connected optical fibers was measured, the loss including the connection loss of the optical connector was 0.8
dB or less. Also, for the fabricated optical wiring board,
When a high-temperature and high-humidity test left for 5000 hours at 75 ° C. and 90% RH and a temperature cycle test for 500 times at −40 ° C. to 75 ° C. were performed, both changes and fluctuations in light loss were 0.
It was 6 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 3 In the same manner as in Example 1, two adhesive sheets made of a polyimide film having an acrylic adhesive layer having a thickness of 100 μm were prepared. Next, the seven optical fibers shown in FIG. 1 were wired on each adhesive sheet as follows. First, the optical fibers shown in FIG. 1 were wired on the adhesive layer of the produced adhesive sheet. Next, thick film portions C and D were formed as shown in FIG. That is, the film thickness after drying is 10 μm on the wired optical fiber.
A thick film portion C was formed by dispenser coating using the same acrylic pressure-sensitive adhesive coating solution as in Example 1 so as to have a thickness of 0 μm, and then the optical fiber shown in FIG. 1 was wired. Further, in the same manner, a thick film portion D is formed by applying the same pressure-sensitive adhesive coating solution as in Example 1 by a dispenser coating so that the film thickness after drying becomes 100 μm. Thereafter, the optical fiber shown in FIG. 1 was wired. In the above case, the optical fiber is wired according to the designed wiring pattern of FIG. 1 by forming the adhesive layer at the intersection portion of the optical fiber where the optical fiber does not have an adhesive layer due to the double or triple crossing of the optical fiber. And the optical fiber was not displaced. In addition, although it was held in this temporarily fixed state for three days before being fixed by the resin protective layer, the pattern was not collapsed, and the wiring pattern as designed could be maintained.

Thereafter, a silicone rubber coating solution (KE45, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to the periphery of one of the polyimide films.
-T) to form a weir having a width of 2.5 mm and a thickness of 2 mm. Next, a silicone rubber coating solution (TSE399, manufactured by Toshiba Silicone Co., Ltd.) was dropped on the inside, and another polyimide film on which an optical fiber was similarly wired was covered from above, and the conditions were applied at 25 ° C. for 24 hours. A silicone resin is cured to form a resin protective layer, and the optical fiber is protected and fixed by the resin protective layer to a thickness of 2.
A 45 mm optical wiring board was produced. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board was 18 mm in curvature of 30 mm.
When bent at 0 °, no damage was left on the optical wiring board and the optical fiber. When the loss of all the connected optical fibers was measured, it was 0.5% including the connection loss of the optical connector.
dB or less. Also, for the fabricated optical wiring board,
When a high-temperature and high-humidity test left for 5000 hours at 75 ° C. and 90% RH and a temperature cycle test for 500 times at −40 ° C. to 75 ° C. were performed, both changes and fluctuations in light loss were 0.
It was 6 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 4 In place of the acrylic adhesive coating solution of Example 1, SD4
A silicone-based adhesive coating solution composed of 592 / BY24-741 / SRX212 / toluene (= 100 / 1.0 / 0.9 / 50 (weight ratio)) (both manufactured by Dow Corning Toray Co., Ltd.) was used. In the same manner as in Example 1 except that a 75 μm-thick silicone-based releasable film was used in place of the polyimide film of Example 1, an adhesive sheet having a silicone-based adhesive layer having a thick film portion (size of 100 mm × 60 mm), and an optical fiber was wired on the adhesive sheet according to the wiring pattern shown in FIG. In this case, the thickness of the adhesive layer before and after the place where the optical fibers intersect in a double or triple manner is thick, so that the optical fibers can be wired according to the designed wiring pattern of FIG. And the optical fiber was not displaced. In addition, 3
Although it was held in this temporarily fixed state for days, the wiring pattern as designed was maintained without pattern collapse.

Thereafter, the procedure of Example 1 was repeated, except that the silicone gel was dropped using a silicone rubber coating solution (TSE399, manufactured by Toshiba Silicone Co., Ltd.) instead of the silicone gel, and cured at 25 ° C. for 24 hours. A first resin protective layer was prepared in the same manner as in 1, and the optical fiber was protected and fixed by the resin protective layer. Next, the silicone-based releasable film on the back surface of the adhesive sheet on which the optical fiber is wired is peeled off, and a second layer is placed on the exposed silicone-based adhesive layer.
Was produced. That is, a silicone-based filler (manufactured by Konishi Corp., Bath Bond) was applied to the exposed periphery of the adhesive layer to form a weir having a width of 0.6 mm and a thickness of 0.3 mm. Next, a silicone rubber coating solution (TSE399, manufactured by Toshiba Silicone Co., Ltd.) was dropped on the inside,
The silicone rubber was cured at 25 ° C. for 24 hours to form a second resin protective layer, thereby producing an optical wiring board having a thickness of 1.4 mm. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board is 18 mm in curvature of 20 mm.
When bent at 0 °, no damage was left on the optical wiring board and the optical fiber. When the loss of all connected optical fibers was measured, including the connection loss of the optical connector, 0.4
dB or less. Also, for the fabricated optical wiring board,
When a high-temperature and high-humidity test left for 5000 hours at 75 ° C. and 90% RH and a temperature cycle test for 500 times at −40 ° C. to 75 ° C. were performed, both changes and fluctuations in light loss were 0.
It was 3 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 5 In the same manner as in Example 1, an adhesive sheet made of a polyimide film having an acrylic adhesive layer having a thickness of 100 μm was prepared. Then, using the same acrylic pressure-sensitive adhesive coating solution as in Example 1, an adhesive layer pattern corresponding to the thick film portions A and B in FIG. 2 was formed on the peelable film by dispenser coating. Formed. That is, the pattern corresponding to the thick film portion A is applied so that the film thickness after drying becomes 250 μm, and the pattern corresponding to the thick film portion B is applied so that the film thickness after drying becomes 500 μm. Was formed. The adhesive layer pattern of the releasable film was adhered to the above-mentioned adhesive sheet, and the releasable film was peeled off to obtain an adhesive sheet having an adhesive layer on which a thick film portion was formed.

Next, in the same manner as in Example 1, an optical fiber was wired according to the wiring pattern shown in FIG. In this case, the thickness of the adhesive layer before and after the place where the optical fibers intersect in a double or triple manner is thick, so that the optical fibers can be wired according to the designed wiring pattern of FIG. And the optical fiber was not displaced.
In addition, although it was held in this temporarily fixed state for three days before being fixed by the resin protective layer, the pattern was not collapsed, and the wiring pattern as designed could be maintained.

Thereafter, a silicone-based filler (manufactured by Konishi Co., Bus Bond) was applied to the periphery of the polyimide film on which the optical fiber was wired, and the width was 1.5 mm and the height was 1 m.
m were formed. Next, a silicone rubber coating solution (TSE399, manufactured by Toshiba Silicone Co., Ltd.) is dropped on the inside, and the silicone material is cured at 25 ° C. for 24 hours to form a resin protective layer. To complete an optical wiring board having a thickness of 1.2 mm. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board was 18 mm in curvature of 20 mm.
When bent at 0 °, no damage was left on the optical wiring board and the optical fiber. When the loss of all connected optical fibers was measured, the loss including the connection loss of the optical connector was 0.2
dB or less. Also, for the fabricated optical wiring board,
When a high-temperature and high-humidity test left for 5000 hours at 75 ° C. and 90% RH and a temperature cycle test for 500 times at −40 ° C. to 75 ° C. were performed, both changes and fluctuations in light loss were 0.
It was 3 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 6 An adhesive sheet having an adhesive layer having a thickness of 100 μm was prepared in the same manner as in Example 1, and the optical fibers shown in FIG. 1 were wired. Thereafter, an adhesive layer pattern having a pattern corresponding to the thick film portion C in FIG. 3 is applied on the release film by dispenser coating using the same acrylic adhesive application liquid as in Example 1. An adhesive layer pattern having a thickness of 100 μm after drying was formed. Then
The adhesive layer pattern on the releasable film was transferred onto an adhesive sheet on which the optical fibers were wired, and the optical fibers shown in FIG. 1 were wired. Further, in the same manner, an adhesive layer pattern having a pattern corresponding to the thick film portion D in FIG. 3 is applied by dispenser coating using the same acrylic adhesive coating liquid as in Example 1 on the release film. Then, an adhesive layer pattern having a thickness of 100 μm after drying was formed. Next, the adhesive layer pattern on the releasable film was transferred onto an adhesive sheet on which the above-mentioned optical fiber was wired, and thereafter, the optical fiber shown in FIG. 1 was wired. In this case, the thickness of the adhesive layer before and after the place where the optical fibers intersect double or triple becomes thicker, and the optical fibers intersecting double or triple overlaps with the adhesive layer. Because of this, the optical fiber can be wired according to the designed wiring pattern of FIG. 1, and the optical fiber does not displace. In addition, 3
Although it was held in this temporarily fixed state for days, the wiring pattern as designed was maintained without pattern collapse. Thereafter, an optical wiring board having a thickness of 1.2 mm was produced in the same manner as in Example 5. Next, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board was 18 mm with a curvature of 20 mm.
When bent at 0 °, no damage was left on the optical wiring board and the optical fiber. When the loss of all connected optical fibers was measured, the loss including the connection loss of the optical connector was 0.2
dB or less. Also, for the fabricated optical wiring board,
When a high-temperature and high-humidity test left for 5000 hours at 75 ° C. and 90% RH and a temperature cycle test for 500 times at −40 ° C. to 75 ° C. were performed, both changes and fluctuations in light loss were 0.
It was 3 dB or less, which proved that it could be sufficiently used as an optical connection part.

Comparative Example 1 In Example 1, an optical fiber was wired according to the wiring pattern shown in FIG. 1 on an adhesive sheet on which an acrylic adhesive having a constant film thickness of 100 μm was formed. It was wired according to the wiring pattern.
After a lapse of time, a floating from the adhesive layer is seen in the vicinity of the intersection of the optical fibers crossing three times, and similarly, after a lapse of 10 hours, in the vicinity of the intersection of the optical fibers crossing twice. As a result, the optical fiber wiring could not be maintained according to the designed wiring pattern. In this state, when the resin protective layer was formed in the same manner as in Example 1, the optical fiber (the optical fiber shown in FIG. 1) wired thirdly jumped out of the resin protective layer and formed the resin protective layer. The optical fiber could not be fixed sufficiently by the layers.

[0056]

As described above, in the optical connecting part of the present invention, particularly where the adhesive force is required, for example, the number of optical fibers to be wired is increased, and the optical fiber in the formed wiring pattern is increased. Where the overlap (intersection) is increased and the area where the wired optical fiber contacts the adhesive is reduced, the adhesive layer may be partially thickened or additional adhesive may be applied on the wired optical fiber. By forming the layer, it becomes a thick film portion, the fixing force of the optical fiber by the adhesive increases, and the optical fiber congested in a two-dimensional plane can be wired according to the designed wiring pattern, and the subsequent Neither does the displacement of the optical fiber with time (disruption of the wiring pattern) occur. Further, as described above, since the optical fiber is more firmly fixed on the adhesive layer, the fixing of the optical fiber by the resin protective layer is completed, and therefore, the bending such as bending of the optical wiring board, for example, the multiple There is no problem of destruction such that the optical fiber at the portion crossing the optical fiber jumps out of the resin protective layer, and the strength of the optical wiring board is increased by remarkably increasing the floating of the optical fiber. Furthermore, since the fixing of the optical fiber is completed, the occurrence of light loss or the like due to the macro bend of the optical fiber is reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an example of a wiring pattern of an optical fiber.

FIG. 2 is an explanatory view showing an example of a state of forming an adhesive layer in the optical connection component of the present invention.

FIG. 3 is an explanatory view showing another example of a state of forming an adhesive layer in the optical connection component of the present invention.

FIG. 4 is a plan view of an example of the optical connecting component of the present invention.

FIG. 5 is a cross-sectional view taken along line AA ′ of the optical connection component of FIG. 4;

FIG. 6 is a sectional view of another example of the optical connection component of the present invention.

FIG. 7 is a sectional view of another example of the optical connecting component of the present invention.

FIG. 8 is a sectional view of another example of the optical connection component of the present invention.

[Explanation of symbols]

1, 1 ': base material, 2, 2a: resin protective layer, 3, 3': adhesive layer, 3a, 3b, 3c, 3d: additional adhesive layer,
4, 4 'optical fiber, 5 terminal part, 6 optical components such as optical connector and optical module, 7, 7' weir-like object,
A, B, C, D: Thick film portion. ~: Wiring order of optical fiber.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takeshi Sukekawa 3-1 Yosombe-cho, Shizuoka-shi, Shizuoka Pref. In the Technical Research Laboratory of Hamakawa Paper Co., Ltd. (72) Inventor Tatsushi Kobayashi 3 Yosomope-cho, Shizuoka-shi, Shizuoka No. 1 Inside the Technical Research Laboratory of Hamakawa Paper Mill Co., Ltd. (72) Koichi Arishima 2-3-1 Otemachi, Chiyoda-ku, Tokyo Inside Nippon Telegraph and Telephone Co., Ltd. (72) Mamoru Hirayama Major, Chiyoda-ku, Tokyo 2-3-1, Machi-cho, Nippon Telegraph and Telephone Corporation F-term (reference) 2H001 BB20 BB27 DD21 KK18 2H038 BA06 CA52

Claims (8)

[Claims] A plurality of optical fibers each having an end portion for optically connecting to an end thereof are two-dimensionally formed on a base material via an adhesive layer so that a wiring pattern having at least one intersection portion is formed. In the optical connection component wired in a plane, (a) a thick film portion is formed near the intersection of the optical fibers on the adhesive layer so as to be thicker than other portions, or (B) An optical connecting part, wherein a thick film portion made of an additional adhesive layer is formed at an intersection of the optical fibers so that the optical fibers intersecting each other are bonded to each other. 2. The optical connection component according to claim 1, wherein the plurality of optical fibers wired in a two-dimensional plane are fixed and protected by a resin protection layer. 3. A first resin protective layer via an adhesive layer such that a plurality of optical fibers each having an end portion for optically connecting to an end are formed with a wiring pattern having at least one crossing portion. In the optical connection component wired two-dimensionally on the upper side and fixed by the second resin protective layer, (a) the thickness is larger than the other portion near the intersection of the optical fibers on the adhesive layer, A thick film portion is formed so as to form a film, or (b) a thick film portion formed of an additional adhesive layer is formed at an intersection of the optical fibers so that the intersecting optical fibers are bonded to each other. An optical connecting part, characterized in that: 4. The optical connection component according to claim 1, wherein the thick film portion comprises an additional adhesive layer formed by applying an adhesive. 5. A plurality of optical fibers each having an end portion for optically connecting to an end portion are provided on a base material via an adhesive layer such that a wiring pattern having at least one intersection portion is formed. 2. The optical connecting part according to claim 1, wherein the optical fiber is fixed in a three-dimensional plane, and a resin protective layer is formed thereon to fix the optical fiber. A film portion made of an additional adhesive layer is formed by an adhesive near the intersection of the optical fibers on the adhesive layer, and then the optical fiber is wired, or (b) through the adhesive layer. After wiring some optical fibers, a thick film portion made of an additional adhesive layer is formed with an adhesive at least at a portion that becomes an intersection on the optical fiber, and then another optical fiber is formed with the thick film portion. Wiring to cross A method for producing an optical connection component, comprising: 6. The production of an optical connection part according to claim 5, wherein the formation of the thick film portion comprising the additional adhesive layer is performed by transferring the adhesive layer formed in a pattern on the peelable film. Method. 7. A plurality of optical fibers each having an end portion for optically connecting to an end portion on an exfoliation film via an adhesive layer so that a wiring pattern having at least one intersection portion is formed. After wiring in a two-dimensional plane, then forming a resin protective layer thereon and fixing the optical fiber, peeling off the release film, forming a resin protective layer on the exposed adhesive layer. 4. The method of manufacturing an optical connecting part according to claim 3, wherein when the plurality of optical fibers are wired, (a) the additional adhesive layer is provided by an adhesive near an intersection of the optical fibers on the adhesive layer. After forming a film thickness part, and then wiring the optical fiber,
Or (b) after wiring some optical fibers via the adhesive layer, forming a thick film portion made of an additional adhesive layer with an adhesive at least at a location where the optical fiber crosses, Next, another optical fiber is wired so as to intersect at the thick film portion. 8. The production of an optical connection part according to claim 7, wherein the formation of the thick film portion comprising the additional adhesive layer is performed by transferring the adhesive layer formed in a pattern on the peelable film. Method.