JP2001235703A - Actuator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an actuator having high impact resistance to the extent that a movable plate hardly deforms. SOLUTION: The actuator is equipped with a movable plate 102, a pair of torsion springs 104 extended from both sides of the movable plate 102 and a supporting part 106 for supporting the movable plate 102 through the torsion springs 104. The movable plate 102, torsion springs 104 and supporting part 106 are manufactured by the semiconductor manufacturing technology by using a SOI substrate 110 as a start wafer. The torsion spring 104 are mainly composed of a barrier layer (silicon layer) 116 and a polyimide layer 140. The silicon layer 116 has high rigidity and determines mainly the rigidity of the torsion spring 104. The polyimide layer 140 has high impact resistance, and covers a part of the periphery part of the movable part 102 and the supporting part 106 except the part of a driving electrode 126.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an actuator.

[0002]

2. Description of the Related Art Actuators are used, for example, for deflecting laser light. There are several driving principles.For example, when a current is applied to an electrostatic actuator using Coulomb force or a drive coil placed in a magnetic field, the interaction between the current and the magnetic field causes a force based on Fleming's left-hand rule. There is an electromagnetic drive type actuator that utilizes the fact that a voltage is generated in a drive coil, and a piezoelectric drive type actuator that uses a piezoelectric material whose length changes when a voltage is applied to the material.

Japanese Patent Application Laid-Open No. 7-175005 discloses an electromagnetically driven actuator. This actuator includes a flat movable plate manufactured by processing a silicon substrate, a pair of torsion bars for swingably supporting the movable plate, and a frame-shaped support portion for supporting the torsion bar. . A planar coil for generating a magnetic field when energized is provided at a peripheral portion of an upper surface of the movable plate, and a total reflection mirror is provided at a central portion of the upper surface surrounded by the planar coil. The support is provided with permanent magnets for interacting with the magnetic field generated by the planar coil.

[0004] Both ends of the planar coil are electrically connected to electrode terminals provided on a support portion via coil wiring extending over the torsion bar. The planar coil, the coil wiring, and the electrode terminals are simultaneously formed on the silicon substrate by electroforming. This electromagnetic actuator can be made extremely thinner and smaller than conventional ones.

[0005]

SUMMARY OF THE INVENTION However, Japanese Patent Application Laid-Open No. 7-1
The actuator of No. 75005 has a drawback that the impact resistance is low because the torsion bar is made of silicon.

[0006] In order to improve such a problem,
Japanese Patent Application Laid-Open No. Hei 10-123449 discloses an actuator in which a torsion bar is made of a polyimide layer to improve impact resistance.

However, in this actuator, the polyimide layer functioning as a torsion bar extends in a bridging manner between the movable plate and the silicon portion of the support, and covers the entire surface of the movable plate and almost the entire surface of the support. . For this reason, the movable plate may be deformed by the internal stress of the polyimide. Such deformation of the movable plate will deform the reflecting portion formed on the movable plate.

Further, the deformation of the movable plate shifts its center of gravity, causing a problem that desired driving characteristics cannot be obtained, or the center of gravity of the movable plate is displaced from the torsion bar torsion axis, and vibration to be suppressed is reduced. Or cause a mode to occur.

Further, in manufacturing using a semiconductor manufacturing apparatus, since the wafer is greatly deformed by the internal stress of the polyimide, for example, the wafer is not attracted to the wafer vacuum chucking jig, which causes a situation where smooth production is hindered. It is also a factor.

An object of the present invention is to provide an actuator having high impact resistance, in which a movable plate is hardly deformed.

[0011]

According to the present invention, there is provided an actuator comprising a movable plate, a support portion for swingably supporting the movable plate, and an elastic portion connecting the movable plate and the support portion. Includes high-rigidity members and high-impact-resistance members.The high-rigidity members mainly determine the rigidity of the elastic part, and the high-impact-resistance members exist only on the periphery of the movable plate or only a part thereof. I do.

Another actuator according to the present invention is an actuator including a movable plate, a support portion for swingably supporting the movable plate, and an elastic portion connecting the movable plate and the support portion, wherein the elastic portion has high rigidity. Including members and members with high impact resistance, the members with high rigidity mainly determine the rigidity of the elastic part,
A member having high impact resistance does not exist on the movable plate.

Still another actuator according to the present invention is:
In an actuator including a movable plate, a support portion that swingably supports the movable plate, and an elastic portion that connects the movable plate and the support portion, the elastic portion includes a member having high impact resistance, and has a high impact resistance. The member mainly determines the stiffness of the elastic portion, and a member having high impact resistance exists only on the peripheral portion of the movable plate or only a part thereof.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the actuator 1
00 is a movable plate 102 and a pair of elastic portions symmetrically extending from both sides of the movable plate 102, for example, a torsion spring 104;
The movable plate 102 includes a support portion 106 for supporting the movable plate 102 via the torsion spring 104, and a pair of permanent magnets 108 located on both sides of the movable plate 102 in parallel with the axis of the torsion spring 104.

The actuator 100 is secured by a means (not shown) for securing a gap in which the movable plate 102 can vibrate around the torsion spring 104, and the supporting portion 106 retains the actuator.

As shown in FIG. 2, the movable plate 102
It has a drive coil 122 that goes around inside. Although the illustrated drive coil 122 makes two turns, the number of turns is not limited to this, and another number of turns may be used. One end of the drive coil 122 communicates with a spring wire 124 extending through one torsion spring 104, and the spring wire 124 is electrically connected to a drive electrode 126 located on the support 106.

The other end of the drive coil 122 is connected to a jump line pad 128a. Jump line pad 128a
Communicates with the jump line pad 128b via a jump line 132 extending across the drive coil 122. The jump line pad 128b communicates with a spring line 124 extending through the other torsion spring 104, and the spring line 124 is electrically connected to a drive electrode 126 located on the support 106.

The spring line 124 passes through the center where the distortion is smallest with respect to the width q of the torsion spring 104 for the purpose of improving durability and reliability.

As shown in FIG. 3 and FIG.
2, the torsion spring 104 and the support 106 are formed by SOI (silicon) in which a substrate layer (silicon layer) 112, a buried silicon oxide film 114, and an active layer (silicon layer) 116 are sequentially stacked.
On insulator) The substrate 110 is manufactured by a semiconductor manufacturing technique using the start wafer as a start wafer. Therefore, it is manufactured with very high positional accuracy. As shown in FIG. 1, the permanent magnet 1 is placed on the support portion 106 of the structure thus manufactured.
08 is fixed with an adhesive or the like.

As shown in FIGS. 3 and 4, the drive coil 122, the spring wire 124, the drive electrode 126, and the jump line pads 128a and 128b are made of, for example, an aluminum layer and have a silicon oxide film 120 functioning as an insulating layer. Are formed on the active layer (silicon layer) 116 of the SOI substrate 110 through the intervening layer. These are covered with an insulating film 130 and protected from the atmosphere.

The jump line 132 is formed on the insulating film 130. The jump line 132 is covered with an insulating film 134 and protected from the atmosphere. The insulating film 130 and the insulating film 134 are formed of, for example, a silicon oxide film, a silicon nitride film, or the like.

In a portion corresponding to the torsion spring 104, an organic material layer such as a polyimide layer 1 is formed on the insulating film 130.
40 are formed. As shown in FIG. 2, the polyimide layer 140 covers a part of the support part 106 excluding the drive electrode 126 and a part of a peripheral part of the movable part 102.

As can be seen from FIG.
Are mainly the active layer (silicon layer) 11 of the SOI substrate 110
6 and a polyimide layer 140. The torsion spring 104 includes a spring wire 124, a silicon oxide film 120, and an insulating film 130 in addition to the above.

Although the silicon layer 116 has low impact resistance,
The rigidity is high and mainly determines the rigidity of the torsion spring 104. The polyimide layer 140 has low rigidity but high impact resistance. Thus, the torsion spring 104 mainly
Since it is composed of the silicon layer 116 having high rigidity and the polyimide layer 140 having high impact resistance, it has high rigidity and high impact resistance.

When the polyimide layer 140 becomes the point of application of the impact force when the actuator 100 falls,
Since the polyimide layer 140 absorbs the impact force, the impact is not easily transmitted to the silicon layer 106 having low impact resistance.

The factor that determines the resonance frequency for driving the movable plate 102 is dominated by the thickness of the active layer 116. In the manufacture of the actuator 100, the thickness of the wafer required for reasons such as handling may be larger than the thickness of the silicon layer 116 necessary for forming a torsion spring having desired characteristics. In such a case, using a silicon substrate having the required thickness makes the torsional spring too rigid to obtain a desired resonance frequency, but using an SOI substrate satisfies the required thickness. However, the portion of the torsion spring 104 can be thinned to an accurate thickness by semiconductor manufacturing technology, and a desired resonance frequency can be obtained.

As shown in FIG. 3 and FIG.
6 denotes a substrate layer (silicon layer) 112 of the SOI substrate 110, a buried silicon oxide film 114, and an active layer (silicon layer) 1
16, a silicon oxide film 120, a drive electrode 126,
It includes an insulating film 130 and a polyimide layer 140.

As shown in FIG. 2, FIG. 3, and FIG. 4, the movable portion 102 is a substrate layer (silicon layer) 1 of the SOI substrate 110.
12, a buried silicon oxide film 114, an active layer (silicon layer) 116, a silicon oxide film 120, a drive coil 122, jump line pads 128a and 128b, an insulating film 130, a jump line 132, and an insulating film 134. Contains. Further, the movable section 102 includes a polyimide layer 140 formed on a part of the periphery thereof.

The movable section 102 has a reflecting section 118 for reflecting light. The reflection unit 118 is configured by, for example, a polished surface of a substrate layer (silicon layer) 112 of the SOI substrate 110. This is suitable for saving processing time and materials for forming the reflection portion. For reflection of light of a semiconductor laser or the like having a wavelength of about 650 nm, an aluminum film having a higher reflectance than silicon as a material of the substrate layer for light of this wavelength may be formed by, for example, sputtering or vapor deposition. .

1 and 2, when a current is supplied to the drive electrode 126 and a current flows to the drive coil 122, the torsion spring is applied to the movable plate 102 by the interaction with the magnetic field generated by the permanent magnet 108. A torque about 104 is generated. If the current is an alternating current, the movable plate 102 reciprocates at a predetermined deflection angle around the torsion spring 104. The light reflected by the reflector 118 shown in FIGS. 3 and 4 is deflected according to the movement of the movable plate 102.

Hereinafter, a manufacturing process of the actuator will be described with reference to FIGS. The cross sections of the respective steps shown in FIGS. 5 and 6 are cross sections cut along the line B′-C in FIG.

Step 1 (FIG. 5A): SO having a substrate layer 112, a buried silicon oxide film 114, and an active layer 116
An I substrate 110 is prepared. Both the surface of the substrate layer 112 and the surface of the active layer 116 are polished and mirror-finished.

As shown in FIG. 7, one or more actuators are formed on one SOI substrate 110 according to the size. In the example shown in FIG. 7, one SOI
Although four actuators are formed on the substrate 110, the number is not limited to this. In addition, when as many actuators as possible are manufactured on one SOI substrate 110, efficient production can be achieved. 5 and 6, one actuator will be described.

Step 2 (FIG. 5B): A silicon oxide film 136 is formed on the surface of the substrate layer 112, and a silicon oxide film 120 is formed on the surface of the active layer 116 by, for example, an oxidation furnace.

Step 3 (FIG. 5C): The silicon oxide film 120 is removed by etching using a photolithography technique, except for the portion that becomes the movable plate 102, the portion that becomes the torsion spring 104, and the portion that becomes the support portion 106. At the same time, the silicon oxide film 136 is transferred from the portion to be the movable plate 102 to
Except for the portion that becomes 6, it is etched away.

Step 4 (FIG. 5D): Silicon oxide film 120
A film of aluminum is formed, for example, by a sputtering technique, and then patterned by a photolithography technique, so that the drive coil 122, the spring wire 124, and the drive electrode 1 are formed.
26 and jump line pads 128a and 128b.

Step 5 (FIG. 5E): For example, a plasma CVD (Chemical vapor deposit) is formed on the surface of the structure on the active layer side.
on) A silicon oxide film, a silicon nitride film, or the like is formed with an apparatus or a sputtering apparatus, and then patterned by photolithography to form an insulating film 130.
To form

Step 6 (FIG. 5F): On the insulating film 130,
For example, after a film is formed by using a sputtering apparatus, aluminum is patterned by a photolithography technique to form a jump line 132. After that, a silicon oxide film or a silicon nitride film is formed on the active layer side surface of the structure by, for example, a plasma CVD device or a sputtering device, and then patterned by a photolithography technique to form an insulating film 134.

Step 7 (FIG. 6A): A polyimide film is formed on the surface of the structure on the active layer side and patterned by photolithography to form a polyimide layer 140. Note that a film may be formed in a state where the polyimide is patterned by a printing method. Also, patterning may be performed using a jet printing system. At this time,
The portion to be the movable plate has no polyimide except for a part of the region around the movable plate.

Step 8 (FIG. 6 (b)): With respect to the active layer side surface of this structure, the portion to become the movable plate 102 and the torsion spring 1
The part which becomes 04 and the part which becomes the support part 106 are masked with a resist, for example, RIE (Reactive ion etching).
The active layer 116 is etched by the apparatus, and then the resist is removed. By this etching, the movable plate 102
And the active layer portion of the support portion 106 are separated except for the portion of the torsion spring 104.

Step 9 (FIG. 6C): With respect to the surface of the structure on the substrate layer side, the substrate layer 11 is formed from the back surface by the RIE apparatus.
2 is etched. At this time, it is desirable to use RIE having a sufficient etching selectivity between silicon oxide and silicon. Thus, etching can be performed using the silicon oxide film 136 as a mask without patterning the resist. In addition, at the end of the etching of the substrate layer 112, when the overetching is performed to completely remove the substrate layer 112, the buried silicon oxide film 114 is removed.
Therefore, the active layer 116 that should not be etched is not etched. Alternatively, the substrate layer 112 may be etched by crystal anisotropic etching of silicon using an alkaline etchant, for example, an aqueous solution of tetramethylammonium hydroxide. By this etching, the movable plate 102 and the substrate layer portion of the support portion 106 are separated.

Step 10 (FIG. 6D): The silicon oxide film 136 and the buried silicon oxide film 114 on the substrate layer side surface are simultaneously removed by RIE from the substrate layer side surface of this structure. Thus, the movable plate 102, the torsion spring 104, and the support portion 106 are formed, and the movable plate 102 is supported by the support portion 106 via the torsion spring 104.

Step 11 (not shown): The structure is diced and cut out from the SOI substrate wafer, and the permanent magnet 1
08 is mounted with, for example, an adhesive.

According to the present embodiment, an actuator having a torsion spring having both high rigidity made of silicon and high impact resistance made of polyimide can be obtained. Thus, an actuator having desired driving characteristics and high impact resistance is provided. Further, since the spring wire is formed inside the torsion spring, the stress applied to the spring wire when the torsion spring is twisted is smaller than that in the case where the spring wire is formed on the surface. As a result, the spring wire is less likely to be broken, so that an actuator having high reliability and a long life is provided.

In the actuator according to the present embodiment,
Since the polyimide is present only in a part of the area around the movable plate, the deformation of the reflecting portion due to the internal stress of the polyimide hardly occurs. In addition, since the region where the polyimide is formed is small, the substrate can be manufactured stably without warping.
In addition, since the polyimide layer also extends to a part of the periphery of the movable plate, a surface where the polyimide layer is supported on the movable plate is secured, and the polyimide layer holds the movable plate and reliably improves the impact resistance. It is assumed that Further, since the movable plate is not easily deformed, the center of gravity of the movable plate exists at a desired position, and the actuator performs a desired drive. At the time of manufacturing, the manner of deformation of the movable plate varies, and the driving characteristics of the actuator also vary, thereby suppressing a decrease in yield. Further, since the center of gravity of the movable plate is stably positioned near the plane including the torsion axis of the torsion spring, vibration modes to be suppressed are suppressed.

This embodiment can be modified as follows.

In the first modification shown in FIG. 8, the polyimide layer 140 extends all around the movable plate 102. For this reason, compared with the first embodiment, the torsion spring 104 has higher impact resistance because the contact area between the polyimide layer 140 and the movable plate 102 is larger.

In the second modification shown in FIG. 9, the polyimide layer 140 does not exist on the movable plate 102 at all. Thereby, the impact resistance is reduced as compared with the first embodiment, but the movable plate 102 is hardly deformed accordingly.

In the third modification shown in FIG.
The aluminum reflecting portion 1 is provided on the surface of the substrate layer 112 of the movable plate 102.
44 are provided. The aluminum reflecting portion 144 is located inside a region corresponding to the opposite portion except for the polyimide layer 140. The aluminum reflecting portion 144 is hardly warped, and a desired reflected light spot shape without distortion or the like can be obtained.

The concept of this modification may be applied to, for example, a configuration in which the substrate layer 112 is used as a reflector without providing the aluminum reflector 144. In this case, the portion used as the reflection portion may be located in a region corresponding to a portion where the polyimide layer 140 does not exist on the opposite surface of the movable plate 102.

In the fourth modification shown in FIG.
A semiconductor element, for example, C
CD (charge-coupled imaging device) and CMD (Charge
An image sensor 146 such as a Modulation device is formed. The imaging element 146 can be manufactured by applying a known semiconductor manufacturing technique between Step 1 and Step 2 in the above-described actuator manufacturing process. In this modification, since the image sensor 146 is movable, an image in a wide angle range can be taken. Since the movable plate 102 is hardly warped, a desired image without distortion or the like can be obtained.

The image pickup device is a substrate layer 112 of the movable plate 102.
Instead of being manufactured by a semiconductor manufacturing technique, the movable plate 102 may be fixed by an adhesive or the like. Movable plate 1
The fact that the movable plate 102 is hardly warped is also suitable for bonding, and the flat movable plate 102 enables stable and reliable fixing of the imaging element, and promotes improvement in durability and reliability.

Next, a second embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. This embodiment is similar to the first embodiment. Therefore, members equivalent to those of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

In this embodiment, the torsion spring 104 is
This is the same as the first embodiment except that the active layer 116 of the I-substrate 110 is not included. That is, the torsion spring 10
4 mainly comprises a polyimide layer 140, which mainly determines the rigidity of the torsion spring 104. The torsion spring 104 includes the polyimide wire 140 and the spring wire 12.
4, a silicon oxide film 120, and an insulating film 130.

Due to this structural feature, the polyimide layer 1
Reference numeral 40 denotes at least a part of the periphery of the movable plate 102. The area on which the polyimide is to be formed is small, preferably the minimum required, and the substrate is hardly warped and can be manufactured stably.

Polyimide is generally less rigid than silicon. Therefore, this embodiment is suitable when the desired resonance frequency is lower than that of the first embodiment. In addition, since polyimide has higher impact resistance than silicon, the torsion spring of the present embodiment has excellent impact resistance. Further, since the movable plate is not easily deformed, the center of gravity of the movable plate exists at a desired position, which is suitable for desired driving of the actuator. At the time of manufacturing, a decrease in yield due to variation in drive characteristics of the actuator due to variations in the manner of deformation of the movable plate is suppressed. Further, since the movable plate is not easily deformed, the center of gravity of the movable plate is usually located near a plane including the torsion axis of the torsion spring, so that the vibration mode to be suppressed is suppressed.

This embodiment can be modified as follows.

In the first modification shown in FIG.
A part of the surface of the substrate layer 112 of the movable plate 102 is
Functions as 8. The reflection part 118 is located inside a region corresponding to the opposite part except for the polyimide layer 140.

In this modification, a part of the surface of the substrate layer 112 is used as the reflection part 118, but a reflection film such as an aluminum reflection part may be separately provided in a region corresponding to the reflection part 118.

Although some embodiments have been described in detail with reference to the drawings, the present invention is not limited to the above-described embodiments, and all the embodiments can be performed without departing from the scope of the invention. Including the implementation of

For example, in the above-described embodiment, an electromagnetically driven actuator that generates and drives a force by the interaction of a magnetic field and a current has been described. However, the principle of generating a driving force is not limited to this. An actuator that obtains a driving force by a principle other than this, for example, Coulomb force or the like is also included.

In the above-described embodiment, the actuator in which the movable plate is supported by two torsion springs has been described. However, the present invention is not limited to this. For example, the movable plate may be supported by one torsion spring. It also includes a cantilever type actuator for supporting.

Further, in the above-described embodiment, the actuator using the torsion spring as the elastic member has been described. However, the present invention is not limited to this. For example, a flexible spring using the elasticity of the elastic member in the bending direction is used. , An actuator using a compression spring utilizing expansion and contraction of an elastic member, an actuator using a torsion flexure spring performing both torsion and flexure movement, and the like.

Therefore, the following can be said about the actuator of the present invention.

1. In a movable plate, a support portion that pivotally supports the movable plate, and an actuator that includes an elastic member that connects the movable plate and the support portion, an elastic material used for the elastic member is used only in a peripheral portion of the movable plate, Alternatively, an actuator having a structure provided only in a part of the peripheral portion.

(Corresponding Embodiments) All embodiments and modifications except the second modification of the first embodiment.

(Function and Effect) Since the movable plate is not easily deformed, the center of gravity of the movable plate exists at a desired position, and the actuator performs a desired drive.

Since the movable plate is not easily deformed, the center of gravity of the movable plate exists at a desired position, and the vibration mode to be suppressed is suppressed.

Improvement of yield.

The movable plate and the elastic member are securely joined.

2. A structure in which an elastic material used for an elastic member is not provided on a movable plate in an actuator including a movable plate, a support portion that pivotally supports the movable plate, and an elastic member that connects the movable plate and the support portion. Actuator.

(Corresponding Embodiment) A second modification of the first embodiment.

(Function and Effect) Since the movable plate is not deformed, the center of gravity of the movable plate exists at a desired position, and the actuator performs a desired drive.

Since the movable plate is not deformed, the center of gravity of the movable plate exists at a desired position, and the vibration mode to be suppressed is suppressed.

Improvement of yield.

3. 3. The actuator according to claim 1, wherein the elastic material used for the elastic member is a main material that determines the overall rigidity of the elastic member.

(Corresponding Embodiment) The second embodiment and its first modified example.

(Function and Effect) Even if the elastic member is made to have a desired thickness in order to make the actuator have desired driving characteristics, the movable plate is hardly deformed regardless of the thickness. It is located at a desired position and the actuator performs a desired drive.

Even if the elastic member is made to have a desired thickness in order to make the actuator have the desired driving characteristics, the movable plate is hardly deformed regardless of the thickness, so that the center of gravity of the movable plate is at a desired position. Exists and suppresses the vibration mode to be suppressed.

4. The elastic member is composed of an elastic material having high rigidity and an elastic material having high impact resistance, and the elastic material having the higher rigidity is configured to be a main material that determines the overall rigidity of the elastic member. The first characteristic is that by providing an elastic member having high impact resistance at the same time as having high driving properties, the first member has desired driving characteristics and impact resistance.
Item 4. The actuator according to any one of Items 3 to 3.

(Corresponding Embodiment) The first embodiment and first to fourth modified examples thereof.

(Effects) Even if a desired thickness is given to an elastic material having high impact resistance in order to obtain impact resistance, the movable plate is hardly deformed, so that the center of gravity of the movable plate exists at a desired position. Then, the actuator drives as desired.

Even if the elastic material having a high impact resistance is provided with a desired thickness in order to obtain impact resistance, the movable plate is hardly deformed, so that the center of gravity of the movable plate exists at a desired position and is suppressed. Suppress the vibration mode to be.

An actuator having desired driving characteristics and impact resistance is obtained.

5. Items 1 to 4 having an optical element on the movable plate
An actuator according to any one of the preceding claims.

(Corresponding Embodiment) All embodiments and their modifications.

(Function and Effect) Since the movable plate does not deform, the optical element does not deform, and the optical element can function as desired.

When the optical element is mounted on the movable plate, the surface of the movable plate for fixing the optical element is not deformed. Elements can be fixed.

6. The movable plate is provided with an optical element, and the periphery of the movable plate is a portion of the movable plate excluding a region where the optical element is provided, and the first and third surfaces are opposite surfaces of the movable plate.
Item 5. The actuator according to any one of Items 4 and 4.

(Corresponding Embodiment) Third and fourth modifications of the first embodiment and a first modification of the second embodiment.

(Function / Effect) Since the movable plate is hardly deformed, the optical element is not easily deformed, and the optical element can function as desired.

7. 7. The actuator according to claim 5, wherein the optical element is a reflection section.

(Corresponding Embodiment) All the embodiments and modifications except the fourth modification of the first embodiment.

(Function and Effect) Since the movable plate is hardly deformed, the reflecting portion is hardly deformed. A desired reflection image free from distortion and other defects is obtained.

8. 7. The actuator according to claim 5, wherein the optical element is a semiconductor optical element.

(Corresponding Embodiment) A fourth modification of the first embodiment.

(Function and Effect) Since the movable plate is hardly deformed, the semiconductor optical element is hardly deformed, and a desired image free from defects such as distortion is obtained.

9. 9. The actuator according to claim 8, wherein the semiconductor optical element is an image sensor.

(Corresponding Embodiment) A fourth modification of the first embodiment.

(Function and Effect) Since the movable plate is hardly deformed, the semiconductor optical element is hardly deformed, and a desired image free from defects such as distortion is obtained.

10. A first material in which the elastic material is an organic material;
Item 10. The actuator according to any one of items 9 to 9.

(Corresponding Embodiment) All embodiments and modifications.

(Function and Effect) A torsion spring having impact resistance can be obtained.

The elastic member is less likely to be damaged during driving due to peeling or the like, and the reliability of the actuator can be improved.

The movable plate is hardly deformed, and the optical element is hardly deformed.

11. Item 10. The actuator according to any one of Items 3 to 5, wherein the main elastic material that determines the overall rigidity of the elastic member is an organic material.

(Corresponding Embodiment) The second embodiment and its first modified example.

(Function and Effect) A torsion spring having impact resistance can be obtained.

The movable plate is hardly deformed, and the optical element is hardly deformed.

12. The actuator according to any one of Items 4 to 9, wherein the elastic material having high impact resistance is an organic material.

(Corresponding Embodiment) The first embodiment and its modifications.

(Function and Effect) A torsion spring having both impact resistance and desired characteristics can be obtained.

The elastic member is less likely to be damaged due to peeling or the like, and the reliability of the actuator can be improved.

13. 13. The actuator according to any one of Items 1 to 12, wherein the movable plate is formed of a semiconductor wafer.

(Corresponding Embodiments) All Embodiments

(Function and Effect) Since the semiconductor device is manufactured by the semiconductor manufacturing technology, a miniaturized product can be accurately mass-produced.

Since the silicon wafer is hardly deformed in the manufacturing process, it can be manufactured stably.

[0119]

According to the present invention, there is provided an actuator having high impact resistance, in which the movable plate is hardly deformed. As a result, an improvement in productivity is achieved, and an actuator excellent in drive characteristics and controllability is obtained. Further, the productivity of the actuator is also improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an actuator according to a first embodiment of the present invention.

FIG. 2 is a plan view in which a permanent magnet of the actuator shown in FIG. 1 is omitted.

FIG. 3 is a cross-sectional view of the actuator taken along line AA ′ of FIG. 2;

FIG. 4 is a sectional view of the actuator taken along line BB ′ of FIG. 2;

FIG. 5 shows a first half of a manufacturing process of the actuator shown in FIG. 1;

FIG. 6 shows a manufacturing step in the latter half of the actuator shown in FIG. 1 subsequent to the step shown in FIG. 5;

FIG. 7 schematically shows an actuator formed on one SOI substrate.

FIG. 8 is a plan view schematically showing a first modification of the first embodiment.

FIG. 9 is a plan view schematically showing a second modification of the first embodiment.

FIG. 10 is a cross-sectional view schematically showing a third modification of the first embodiment, and the cross-section corresponds to a cross-section taken along line BB ′ of FIG.

FIG. 11 is a cross-sectional view schematically showing a fourth modification of the first embodiment, and the cross section corresponds to a cross section cut along line BB ′ of FIG.

FIG. 12 is a sectional view schematically showing a second embodiment,
The cross section corresponds to a cross section cut along the line CB 'in FIG.

FIG. 13 is a cross-sectional view schematically showing a modification of the second embodiment, and the cross-section corresponds to a cross-section cut along line BB ′ in FIG.

[Explanation of symbols]

 Reference Signs List 102 movable plate 104 torsion spring 106 support 116 active layer (silicon layer) 140 polyimide layer

Claims (3)

[Claims] An actuator comprising a movable plate, a support portion for swingably supporting the movable plate, and an elastic portion connecting the movable plate and the support portion, wherein the elastic portion has a high rigidity and a high impact resistance. An actuator including a high member, wherein the member having high rigidity mainly determines the rigidity of the elastic portion, and the member having high impact resistance exists only in a peripheral portion of the movable plate or only a part thereof. 2. An actuator comprising a movable plate, a support portion for swingably supporting the movable plate, and an elastic portion connecting the movable plate and the support portion, wherein the elastic portion has a high rigidity and an impact resistance. An actuator including a high member, wherein the member having high rigidity mainly determines the rigidity of the elastic portion, and the member having high impact resistance does not exist on the movable plate. 3. An actuator including a movable plate, a support portion for swingably supporting the movable plate, and an elastic portion connecting the movable plate and the support portion, wherein the elastic portion includes a member having high impact resistance, An actuator in which a member having high impact resistance mainly determines the rigidity of the elastic portion, and the member having high impact resistance exists only in a peripheral portion of the movable plate or only a part thereof.