JP2001230269A - Manufacturing method of built-in object of electronic circuit chip and component therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize easy handling of an electronic circuit chip when it is mounted in paper. SOLUTION: An electronic circuit chip 10 is mounted on a water-soluble sheet 20. The water-soluble sheet 20 is handled, the electronic circuit chip 10 is made to sink in liquid or semi-liquid paper 30 together with the water-soluble sheet 20. After the water-soluble sheet 20 is dissolved, the paper 30 is dried and set. As a result, a paper wherein the electronic circuit chip 10 alone is practically embedded is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for incorporating a small-sized electronic circuit chip into an object which takes a liquid or semi-liquid form in an intermediate step of the manufacture thereof.

[0002]

2. Description of the Related Art In recent years, as electronic circuit chips such as integrated circuit chips have become smaller and thinner, various uses of electronic circuit chips have been proposed.

For example, Japanese Patent Application Laid-Open No. 3-38396 discloses that a small electronic circuit chip for storing information is embedded in a portable plastic card together with an element for reading out information from the electronic circuit chip in a non-contact manner. A technology to do this has been proposed. Such a plastic card can be used, for example, as an electronic ID card capable of confirming personal identification information in a non-contact manner by storing personal identification information in an electronic circuit chip in advance.

As a technique for embedding an electronic circuit chip in a plastic card, Japanese Patent Laid-Open Publication No.
A technique of sandwiching an electronic circuit chip between two resin sheets and heating under pressure to form a plastic card has been proposed, for example, in JP-A-6-286379 / 75.

[0005]

The electronic circuit chip thus miniaturized and thinned generally has the strength against external force for the miniaturization and thinning. It is much weaker than a conventional electronic circuit chip. The low strength and the small size and thinness make it difficult to handle such an electronic circuit chip during mounting work.

[0006] In particular, the process of mounting an electronic circuit chip on an object is not performed by a facility having a high precision handling capability such as a facility for manufacturing an electronic circuit chip, but by a facility for manufacturing an object on which an electronic circuit chip is mounted. When it is necessary to perform the operation with equipment having a relatively low precision handling ability, it is difficult to handle the electronic circuit chip so as not to damage or incorrectly mount the electronic circuit chip.

The present invention has been made in view of the above circumstances, and an object of the present invention is to facilitate handling of an electronic circuit chip.

[0008]

In order to achieve the above object,
The present invention uses an electronic circuit chip component that is mounted on a base or an element that does not unnecessarily lose the mounting advantages of the electronic circuit chip due to its small size and thinness, and is configured. Then, the electronic circuit chip is built in the object.

For example, an electronic circuit chip component formed by mounting an electronic circuit chip on a base made of a material soluble in a liquid or semi-liquefied object is submerged in the liquid or semi-liquefied object. Then, after the base constituting the electronic circuit chip component is soluble in the object, the object is solidified.

[0010] Alternatively, the electronic circuit chip component is mounted on an element indispensable for forming an electric circuit with the electronic circuit chip, and the electronic circuit chip component is sunk into a liquid or semi-liquefied object. Then, the object is solidified.

According to such an electronic circuit chip component,
It is possible to maintain the advantages of mounting the electronic circuit chip due to its small size and thickness, and to handle the base or element together, so that the electronic circuit chip can be easily handled without imposing a load on the electronic circuit chip. Become. Therefore, for example, even in a facility having only a relatively low-precision handling capability, it is possible to reduce the risk of damaging the electronic circuit chip and the risk of incorrect mounting.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to an example in which an electronic circuit chip is mounted on paper (Japanese paper).

First, an electronic circuit chip according to the present embodiment will be described.

The electronic circuit chip 10 according to the present embodiment has a thin and substantially rectangular parallelepiped shape as shown in FIG. 1A, and has a silicon chip 4 as shown in FIG. In addition, an electronic circuit 1, a capacitor 2, and an antenna 3 functioning as a memory are formed.

Here, the electronic circuit 1, the capacitor 2 and the antenna 3 form a circuit as shown in FIG. This circuit induces a current in the antenna 3 from a radio wave given from the outside, accumulates the electric charge in the capacitor 2, and stores the electric charge in the electronic circuit 1 using the power obtained from the electric charge stored in the capacitor 2. The information is transmitted from the antenna 1 using radio waves. That is, by providing a radio wave to the electronic circuit chip 10, information stored in the electronic circuit 1 of the electronic circuit chip 10 can be read from outside without contact. Note that capacitor 2
May be formed using stray capacitance generated by a pattern forming the electronic circuit 1 and the antenna 3.

Hereinafter, a process of mounting the electronic circuit chip 10 on paper will be described.

In this embodiment, first, the electronic circuit chip 10
Is mounted on a water-soluble sheet having a surface larger than the wide surface of the electronic circuit chip 10 to produce an electronic circuit chip component 5 as shown in FIG.

FIG. 2A is a plan view of the electronic circuit chip component 5, and FIG. 2B is a sectional view of the electronic circuit chip component 5. In the figure, reference numeral 10 denotes an electronic circuit chip, and reference numeral 20 denotes a water-soluble sheet. As the water-soluble sheet 20, for example, a sheet having a thin and smooth surface such as a sheet in which starch is kneaded with gelatin, which is known as an oblate, is suitable.

The water-soluble sheet 20 of the electronic circuit chip 10 will now be described.
Attachment can be performed, for example, in the following steps.

That is, in the final step of manufacturing the electronic circuit chip 10, a dicing tape whose adhesiveness is reduced by ultraviolet irradiation is adhered to the lower surface of a silicon wafer on which a large number of circuits of FIG. 1C are already formed on a matrix. Then, the individual electronic circuit chips 10 are cut out by cutting the silicon wear.

Therefore, after the completion of this step, FIG.
As shown in (a), a large number of electronic circuit chips 10 cut out from a silicon wafer 100 by a dicing tape 101.
Are aligned and adhered on the matrix.

Then, first, ultraviolet rays are irradiated to lose the adhesiveness of the dicing tape 101, and then the individual electronic circuit chips 10 are sucked by the suction nozzle 102 (FIG. 3 (b-
1)) and lift the electronic circuit chip 10 (FIG. 3 (b-
2)) and then dropped onto a separately prepared water-soluble sheet 20 having an adhesive 104 applied to its upper surface (FIG. 3 (b-
3)). Thereby, the electronic circuit chip component 5 having the electronic circuit chip 10 mounted on the water-soluble sheet 20 (FIG. 3C)
Create This step is performed on each of the electronic circuit chips 10 cut out from the silicon wafer 100.

The water-soluble sheet 20 of the electronic circuit chip 10
Attachment can be performed, for example, in the following steps.

That is, after the adhesiveness of the dicing tape 101 is reduced by irradiating ultraviolet rays, the pointer 102 placed below the dicing tape 101 is moved to a position corresponding to each electronic circuit chip 10 ( FIG. 3 (d-
1)), the electronic circuit chip 10 is lifted by pushing up the dicing tape 101 with the pointer 102 (FIG. 3D-2), and the adhesive 104 is applied to the lower surface placed above the silicon wafer 100. The sheet is brought into contact with the water-soluble sheet 20. As a result, the electronic circuit chip component 5 having the electronic circuit chip 10 mounted on the water-soluble sheet 20 (FIG. 3)
(C)) is created. This process is performed on the silicon wafer 100
This is performed for each of the electronic circuit chips 10 cut out from.

The adhesive applied to the water-soluble sheet 20 is preferably water-soluble.

Since the electronic circuit chip component 5 thus produced is larger than the electronic circuit chip 10, handling by humans and machines is easier than in the case of handling the electronic circuit chip 10 alone. Further, by handling the portion of the water-soluble sheet 20 on which the electronic circuit chip 10 is not mounted, it is possible to prevent the electronic circuit chip 10 from being damaged during the handling.

After the electronic circuit chip component 5 has been prepared in this way, the electronic circuit chip 10 is mounted (built-in) on paper.

Mounting electronic circuit chip 10 on paper (built-in)
Before the liquid or semi-liquid plowed paper dries,
On this liquid or semi-liquid paper, electronic circuit chip parts 5
Is performed by dropping or pushing in the entire water-soluble sheet 20.

Specifically, for example, the following is performed.

That is, in a paper production line as shown in a top view in FIG. 4A and a sectional view in various places in FIG. ,
While flowing through the channel 201 on the gutter at a constant speed (FIG. 4 (b-
1)), the thickness is reduced by drying (FIG. 4 (b-3)), and thereafter, the paper is transferred from the flow path 201 onto the belt conveyor 202, and is transported by the belt conveyor 202 by the roller 203 to have a constant thickness. 30 (FIG. 4 (b-4)). In such a process, when the electronic circuit chip 10 is mounted (built-in) on the paper 30, at a place where the paper 30 is flowing at a constant speed in a liquid or semi-liquid state, a certain amount of At a time interval, the electronic circuit chip component 5 and the water-soluble sheet 2
The paper 30 is dropped so that the surface of 0 is parallel to the surface of the paper 30 (FIG. 4 (b-2)). The mechanism 204 that performs such processing is
A row or a plurality of rows are provided.

The electronic circuit chip components 5 dropped onto the paper 30 by such a mechanism 204 are arranged on the paper at regular intervals. Further, as shown in FIG. 5, the dropped electronic circuit chip component 5 sinks into the paper 30 by its weight,
Thereafter, as the viscosity of the paper 30 increases due to drying, the paper 30 stops at an appropriate position. Also, during this time, electronic circuit chip parts
The water-soluble sheet 20 constituting 5 dissolves and diffuses into the liquid or semi-liquid paper 30 and is scattered. Also, electronic circuit chips
The adhesive 104 that has adhered the water-soluble sheet 20 to the water-soluble sheet 20 also melts into the liquid or semi-liquid paper 30 and is scattered when the water-soluble adhesive is used. However, the temperature and viscosity of the paper 30 production line are separately managed so that the electronic circuit chip 10 stays at the appropriate sinking position.

Here, when the electronic circuit chip component 5 is dropped together with the water-soluble sheet 20 so that the surface of the water-soluble sheet 20 and the surface of the paper 30 are parallel, the electronic circuit chip 10 is dropped. The upper side or the lower side may be arbitrary as long as the electronic circuit chip 10 finally stops at an appropriate sinking position. However, depending on the conditions, when the electronic circuit chip 10 is dropped on the upper side of the water-soluble sheet 20, due to the influence of the surface tension of the paper 30 on the water-soluble sheet 20, the water-soluble sheet 20 does not sink inside the paper 30, Electronic circuit chip as a result
10 may remain on the paper 30.

Therefore, in such a case, it is preferable to drop the electronic circuit chip 10 under the water-soluble sheet 20. By doing so, the probability that at least the electronic circuit chip 10 can be sunk inside the paper 30 increases because the surface of the electronic circuit chip 10 is small and the influence of the surface tension of the paper 30 is small.

Now, in this way, the electronic circuit chip 10
Finally, when the paper 30 in which is embedded at regular intervals is completed, the paper 30 is cut. Thereby, a paper 30 sheet or a paper 30 card having a desired shape is obtained. Of course, the timing of dropping the electronic circuit chip components 5 on the paper 30 and the number of rows in which the electronic circuit chip components 5 are dropped can be determined by the shape of the paper 30 sheet or paper 30 card, or the shape of the paper 30.
It is determined according to the position where the electronic circuit chip 10 is embedded in the sheet or the paper 30 card.

The embodiment of the present invention has been described above.

As described above, according to the present embodiment, the electronic circuit chip 10 is used as the electronic circuit chip component 5 configured by mounting the electronic circuit chip 10 on the water-soluble sheet 20.
Can be handled. That is, handling of the electronic circuit chip 10 in each step such as transport of the electronic circuit chip 10 and mounting on the paper 30 is performed by handling the water-soluble sheet 20 having a surface larger than the wide surface of the electronic circuit chip 10. Can be. Therefore, handling of the electronic circuit chip 10 in each step can be facilitated. Further, such a water-soluble sheet 20 is made of paper.
The effect of the use of the water-soluble sheet 20 in the intermediate process on the product is minimized because it is atomized after mounting on 30.

In the above embodiment, it is preferable that the water-soluble sheet 20 is coated with a surfactant or the like in advance. After dropping or placing on the paper 30, the electronic circuit chip 10
The water-soluble sheet 20 to which is attached is easily sunk in the paper 30.

In the above embodiment, the water-soluble sheet
Although a flat plate is used as 20, in the flat plate shape, for example, in a handling method having only one portion of the water-soluble sheet 20, the surface of the water-soluble sheet 20 is made to face the paper 30 due to the bending strength of the material. May not be parallel. Also, due to the size of the surface, the water-soluble sheet 20
It may not be possible to sink to an arbitrary depth in the paper 30.

Therefore, as the shape of the water-soluble sheet 20, instead of the flat shape as shown in FIG. 2, a shape having a concave portion, for example, a shape in which a cone or a pyramid is inverted is used. It may be. Such a shape is less likely to be deformed than a planar shape, and is therefore easier to handle. At this time, the electronic circuit chip 10 is attached to the concave portion of the water-soluble sheet 20, and the electronic circuit chip component 5 is dropped on the paper 30 so that the concave portion is directed upward. And fall easily into the paper 30. Therefore, it is easy to control the mounting angle of the electronic circuit chip 10 on the paper 30. In this case, the mounting depth of the electronic circuit chip 10 can be controlled by changing the shape of the concave portion.

FIG. 6 shows an example of the water-soluble sheet 20 having such concave portions. FIG. 6A is a plan view of a modified example of the electronic circuit chip component 5, and FIG. 6B is a sectional view thereof. In this example, the water-soluble sheet 20 has a shape obtained by inverting a cone, and the electronic circuit chip 10 is mounted at the head of the concave portion.

FIG. 7 shows another example of the water-soluble sheet 20 having a concave portion. FIG. 7A shows an electronic circuit chip component.
FIG. 7B is a plan view of a modified example of FIG. 5, and FIG.
In this example, when the electronic circuit chip component 5 is sunk on the paper 30, the water-soluble sheet 20 is deformed by the weight of the electronic circuit chip 10, so that the electronic circuit chip 10 is located in the concave portion of the water-soluble sheet 20, A cut is provided in the square of the water-soluble sheet 20. In this way, the liquid paper 30 becomes a water-soluble sheet.
Since the electronic circuit chip component 5 easily flows into the area above the paper 20, the electronic circuit chip component 5 easily sinks into the paper 30. Note that the same effect can be obtained by providing a hole in the water-soluble sheet 20 instead of the cut.

Further, in the above embodiment, the electronic circuit chip 10 having the antenna 3 built therein is targeted. However, if the electronic circuit chip 10 not having the antenna 3 built therein is targeted, as shown in FIG. Alternatively, the antenna 3 may be formed in advance on the water-soluble sheet 20 by printing or pasting a metal foil, and the electronic circuit chip 10 may be mounted thereon to form the electronic circuit chip component 3. Good.

Further, if the electronic circuit chip 10 does not include both the antenna 3 and the capacitor 2, as shown in FIG. 9, without using the water-soluble sheet 20,
A capacitor 2 having a sufficiently large size is used for the electronic circuit chip 10, and the electronic circuit chip 10
And the antenna 3 may be attached. Here, FIG. 9A is a plan view of an electronic circuit chip component 5 in which the electronic circuit chip 10 and the antenna 3 are mounted on the capacitor 2, and FIG. 9B is a sectional view thereof.

Generally, a capacitor element is more resistant to loads such as bending than a semiconductor chip. Thus, when the electronic circuit chip 10 and the antenna 2 are mounted on the capacitor 2, the capacitor 2 can be handled by handling the electronic circuit chip. 10 can be handled without damage.

In the above description, the electronic circuit chip 10 is
Although the explanation has been given by taking the case of attaching an electronic circuit chip as an example,
The target on which the 10 is mounted need not be the paper 30, but may be any liquid or semi-liquid object. In this case, the above-described embodiment using the water-soluble sheet 20 can be similarly applied by using a sheet of a material that dissolves in the liquid or semi-liquid object instead of the water-soluble sheet 20.

For example, any object that can take a liquid or semi-liquid form, such as a synthetic resin or another paste, a liquid containing a solid, or a sol, is used for an electronic circuit chip.
It can be 10 wearing objects.

[0047]

As described above, according to the present invention, the handling of electronic circuit chips can be facilitated.

[Brief description of the drawings]

FIG. 1 is a diagram showing an electronic circuit chip 10 according to an embodiment of the present invention.

FIG. 2 is an electronic circuit chip component 5 according to the embodiment of the present invention.
FIG.

FIG. 3 is an electronic circuit chip component 5 according to the embodiment of the present invention.
FIG. 7 is a diagram for explaining a step of creating a.

FIG. 4 is an electronic circuit chip component 5 according to the embodiment of the present invention.
FIG. 4 is a view for explaining a process of mounting (incorporating) on a paper 30.

FIG. 5 is an electronic circuit chip component 5 according to the embodiment of the present invention.
FIG. 3 is a view for explaining a state in which sunk on paper 30.

FIG. 6 is a view showing a shape example of a water-soluble sheet 20 according to the embodiment of the present invention.

FIG. 7 is a diagram showing a shape example of a water-soluble sheet 20 according to the embodiment of the present invention.

FIG. 8 is an electronic circuit chip component 5 according to the embodiment of the present invention.
It is a figure which shows the modification of.

FIG. 9 is an electronic circuit chip component 5 according to an embodiment of the present invention.
It is a figure which shows the modification of.

[Description of Signs] 1 ... Electronic circuit 2 ... Capacitor 3 ... Antenna 5 ... Electronic circuit chip parts 10 ... Electronic circuit chip 20 ... Water-soluble sheet 30 ... Paper

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Dai Watanabe 1099 Ozenji, Aso-ku, Kawasaki-shi, Kanagawa Prefecture F-term in Hitachi, Ltd. System Development Laboratory 5F061 AA04 BA07 CA26 FA03

Claims (10)

[Claims] 1. A method of manufacturing a built-in electronic circuit chip, comprising: mounting an electronic circuit chip on a base made of a material soluble in a liquid or semi-liquefied object. A first step of submerging the component in the liquid or semi-liquefied object; and a step of solidifying the liquid or semi-liquefied object in which the electronic circuit chip component is submerged after the base is dissolved. 2. A method for manufacturing a built-in electronic circuit chip, comprising: 2. A method of manufacturing a built-in electronic circuit chip, comprising forming an electric circuit together with an electronic circuit chip and an electronic circuit chip on a base made of a material soluble in a liquid or semi-liquefied object. A first step of submerging the electronic circuit chip component configured with the element to be mounted on the liquid or semi-liquefied object, and the liquid or semi-liquefied A second step of solidifying the object after the base is dissolved, the method comprising the steps of: 3. The method for manufacturing a built-in electronic circuit chip according to claim 1, wherein the base has a shape including a recess, and the electronic circuit chip is located at a position of the recess in the base. A method for manufacturing a built-in electronic circuit chip, comprising: 4. The method according to claim 3, wherein the substrate is mounted on the substrate when the substrate is submerged in the liquid or semi-liquefied object. A plurality of cuts are provided so that the electronic circuit chip is deformed by the weight of (2) and the electronic circuit chip is located in the concave portion of the base. 5. The method for manufacturing a built-in electronic circuit chip according to claim 1, further comprising a third step of applying a surfactant to the substrate prior to the first step. A method for manufacturing a built-in electronic circuit chip, characterized in that: 6. A method of manufacturing a built-in electronic circuit chip, comprising: forming an electronic circuit chip component having an electronic circuit chip mounted on an element forming an electric circuit together with the electronic circuit chip in a liquid or semi-conductive state. A first step of submerging the liquefied object, a second step of solidifying the liquid or semi-liquefied object in which the electronic circuit chip component is submerged,
A method for manufacturing a built-in electronic circuit chip, comprising: 7. An electronic circuit chip component, comprising: a base made of a material soluble in a liquid or semi-liquefied object; and an electronic circuit chip mounted on the base. 8. A base made of a material soluble in a liquid or semi-liquefied object, an electronic circuit chip mounted on the base, and an element constituting an electric circuit together with the electronic circuit chip. An electronic circuit chip component characterized by the following. 9. The electronic circuit chip component according to claim 7, wherein a surfactant is applied to the base. 10. An electronic circuit chip component, comprising: an electronic circuit chip; and an element, on which the electronic circuit chip is mounted, forming an electric circuit together with the electronic circuit chip.