JP2001228211A - Manual prober for analyzing semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manual prober for analyzing a semiconductor reducing the effect of noise at the time of measurement and good in handleability or operability even in the case of a semiconductor sample requiring a light source in measurement. SOLUTION: In a manual prober having a probe arranging stage 4 and a sample stage 7a and bringing the measuring probe 17, attached to the probe mounting stage 4, into contact with the semiconductor sample 11 set on the sample stage 7a to measure an electric signal, at least a part of the probe mounting stage is formed of a conductive material and the ground terminal of the measuring probe 17 is connected to the probe mounting stage 4 comprising the conductive material to electrically connect the ground terminal of the measuring probe 17 to an external machinery through the probe mounting stage 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor analysis manual prober used for internal analysis of semiconductors such as an array substrate for a liquid crystal panel and a silicon IC.

[0002]

2. Description of the Related Art FIGS. 3 to 5 show a conventional manual prober for semiconductor analysis (hereinafter, "manual prober for semiconductor analysis" is referred to as "manual prober").

The conventional manual prober shown in FIGS. 3 and 4 has a probe setting stage 4 and a sample stage 7b, and a semiconductor sample 11 set on the sample stage 7b.
Then, the measurement probe 17 is brought into contact with the apparatus to supply power and measure various electric signals.

[0004] Specifically, a metal plate 6b is disposed on the upper surface of the probe installation stage 4, and the prober body 3 on which a plurality of measurement probes 17 are mounted is mounted on the metal plate 6b by magnetic force.

A sample stage 7b is arranged below the probe setting stage 4. When the semiconductor sample 11 is mounted on the sample stage 7b, the semiconductor sample 11 is held by the suction groove 12b formed on the sample stage 7b. Is vacuum-adsorbed and fixed.

[0006] In order to measure various electrical signals by bringing the needle 16 at the tip of the measurement probe 17 into contact with the target position of the semiconductor sample 11, a microscope attached via an arm 13 above the probe installation stage 4. The position of the measurement probe 17 and the sample stage 7b are aligned while looking at 1.

At this time, the microscope 1 has a focus adjusting knob 2
Is moved up and down. Further, each stage is moved in the direction of approaching and moving away from the microscope 1 by the probe setting stage height adjuster 5 provided on the probe setting stage 4 and the probe setting stage height adjuster 5 provided on the sample stage 7b. The measuring probe 17 is in the X direction,
It is configured to move in the Y and Z directions.

At the time of measurement, power is supplied from the measurement probe 17,
A plurality of signal wirings (cables) such as an electric signal line and a ground signal line 9b are drawn out and connected to a measuring instrument such as an oscilloscope or a power supply. Similarly, the ground signal line 9b is drawn from the semiconductor sample 11 and connected to a measuring instrument and a power supply.

When the semiconductor sample 11 is an array substrate for a liquid crystal panel, it is necessary to perform measurement in a form close to the actual use state with backside illumination as a measurement condition.
As shown in (2), the measurement is performed with the separately prepared light source 10b fixed on the sample stage 7b in advance.

Therefore, as described above, the sample stage 7b
The semiconductor sample 11 cannot be fixed by vacuum suction, and the semiconductor sample 11 is fixed on the light source 10b by taping or the like.

Thereafter, the heights of the probe setting stage 4 and the sample stage 7b are adjusted in the same manner as described above, the measuring probe 17 is set on the probe measuring stage 4, and the position is roughly determined. Focus adjustment knob 2
By turning to focus and move the tip of the needle 16 of the measurement probe 17 to the target point, various electric signals are measured.

[0012]

However, in the above-described conventional manual prober, since a plurality of ground signal lines 9b are routed from the semiconductor sample 11 and the measurement probe 17, they are connected to each other. This will interfere with sample handling.

The semiconductor sample 11 and the measurement probe 17
The wiring distance from to the various measuring instruments becomes longer, and it is easily affected by external noise. If the measurement is performed under the influence of noise as described above, an accurate result cannot be obtained.

In the case where an array substrate for a liquid crystal panel is evaluated and analyzed as the semiconductor sample 11, the semiconductor sample 11 is not subjected to vacuum suction, but to the light source 1 by taping or the like.
Since it is fixed at 0b, there is a problem that a positional shift is likely to occur. Further, since the light source 10b itself is fixed by taping or the like, there is a possibility of displacement.

When the semiconductor sample 11 fixed by taping is replaced, a process such as peeling off the tape is required each time. Further, since the light source 10b has a height, the fixed position of the semiconductor sample 11 is higher than usual, and the microscope 1 is hardly focused.

It is an object of the present invention to solve the above-mentioned problems, and to provide an analysis manual prober which can improve the handling operation of an apparatus and a semiconductor sample and reduce the influence of noise at the time of measurement.

Another object of the present invention is to provide a manual prober for analysis which is easy to handle and operate even for a semiconductor sample requiring a light source for measurement.

[0018]

A manual prober for semiconductor analysis according to the present invention is characterized in that some signals are wired via a probe installation stage.

According to the present invention, the operability and the quality of measurement can be improved, and the influence of noise at the time of measurement can be reduced.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor analysis manual prober according to a first aspect of the present invention has a probe installation stage and a sample stage, and has a semiconductor sample set on the sample stage attached to the probe installation stage. In a manual prober for measuring an electric signal by contacting a probe, at least a part of a probe installation stage is formed of a conductive material, and a ground terminal of the measurement probe is connected to the probe installation stage of a conductive material. The ground terminal of the measurement probe and an external device are electrically connected via a probe installation stage.

According to this configuration, since the ground terminal is provided near the semiconductor sample, the distance between the ground terminal of the measurement probe and the external device is shortened, and the number of wirings is reduced. And the handling error of the equipment and the semiconductor sample at the time of measurement can be reduced.

According to a second aspect of the present invention, there is provided a manual prober for semiconductor analysis according to the first aspect, wherein a ground terminal of a semiconductor sample is connected to the probe mounting stage made of a conductive material, and the semiconductor sample is passed through the probe mounting stage. A ground terminal of the sample and an external device are electrically connected.

According to a third aspect of the present invention, there is provided a manual prober for semiconductor analysis according to the first aspect, wherein a ground terminal of a shield box of a prober body to which a measurement probe is attached is connected to the probe installation stage made of a conductive material. And a ground terminal of the shield box and an external device are electrically connected via a probe installation stage.

According to a fourth aspect of the present invention, there is provided a manual prober for semiconductor analysis according to the first or second aspect.
A plurality of connection recesses are formed in a portion of the probe installation stage formed of a conductive material, and screws or pins are inserted into the connection recesses to connect a ground terminal of a measurement probe or a ground terminal of a semiconductor sample. It is characterized by having done.

According to a fifth aspect of the present invention, there is provided a manual prober for semiconductor analysis according to any one of the first to fourth aspects, wherein a hole in which a light source can be embedded is formed in the sample stage, and the light source is disposed in the hole. The semiconductor sample to be analyzed is irradiated from the back side.

According to this configuration, by incorporating the light source in the sample stage, it is possible to avoid the positional shift of the semiconductor sample and the retrofitted light source and the adjustment of the focal length of the microscope, which tend to occur when the light source is retrofitted on the sample stage.

Hereinafter, a manual prober for semiconductor analysis according to the present invention will be described based on specific embodiments. The same components as those in FIGS. 3 to 5 showing the above-described conventional example will be described with the same reference numerals.

In the manual prober according to the embodiment of the present invention shown in FIGS. 1 and 2, ground wiring is provided via a metal plate 6a on the upper surface of the probe installation stage 4 in order to reduce the influence of noise at the time of measurement. The sample stage 7a is specially configured to improve operability when a light source is used for measurement.

Specifically, the probe setting stage 4 includes:
A metal plate 6a is placed as a conductive material,
Screw holes 18 are formed in the outer peripheral portion of the metal plate 6a as a plurality of connection recesses, and the screws 14 made of a conductive material are inserted into the plurality of screw holes 18. Thereby, the metal plate 6a and the screw 14 can be used as a ground surface or a ground terminal.

On the probe setting stage 4, the measuring probe main body 3 is fixed to a metal plate 6a by magnetic force.
A plurality of measurement probes 1 provided on the measurement probe body 3
7, a measurement signal line and a ground signal line 9a are drawn out. The measurement signal line is connected to a measuring instrument such as an oscilloscope, and the ground signal line 9a is attached to the screw 14 of the metal plate 6a of the probe installation stage 4, that is, the ground terminal.

When a ground terminal is connected to one of the screws 14, the ground terminal of the measurement probe 17 is electrically connected to an external device via the probe installation stage 4.

As described above, by taking the ground terminal of the semiconductor sample 1 on the probe installation stage 4 which is grounded in advance, a good ground can be taken in the vicinity of the semiconductor sample 11.

As a result, the length of the ground signal line 9a can be reduced, the impedance of the ground signal line 9a can be reduced,
The effect of noise during measurement can be reduced. In addition, since the routing of the ground signal line 9a can be shortened, an accident caused by disordered routing of the wiring can be prevented, handling errors of the semiconductor sample and the measuring device can be reduced, and operability can be improved.

When the screw 14 is connected not only to the ground terminal of the measurement probe 17 but also to the ground terminal of the semiconductor sample 11 mounted on the sample stage 7a, the semiconductor sample is connected via the probe mounting stage 4. Eleven ground terminals are electrically connected to external devices.

Furthermore, if the ground terminal of the shield box of the prober body 3 to which the measurement probe 17 is attached is connected to the metal plate 6a and is electrically connected to an external device, more stable measurement against noise can be realized. .

When the above connection is made, the tip 16 attached to the measurement probe 17 is connected to the semiconductor sample 11.
The semiconductor sample 11 while watching the microscope 1 to feed power and measure various electrical signals by contacting the
The positioning of the probe 17 and the measuring probe 17 is performed in the same manner as in the conventional example.

When the semiconductor sample 11 to be analyzed is an array substrate for a liquid crystal panel, the sample stage 7a
Is configured as follows. Hole 15 enough to mount semiconductor sample 11 on the upper surface of sample stage 7a, that is, hole 1
A hole 15 whose diameter is smaller than the diameter of the semiconductor sample 11 is formed, and a light source 10a whose brightness can be adjusted is installed in the hole 15. The upper surface of the light source 10a arranged in the hole 15 is set at the same height as or lower than the upper surface of the sample stage 7a.

The semiconductor sample 11 is provided on the outer periphery of the hole 15.
Is formed to form a suction groove 12a for vacuum suction and fixing. With such a configuration, even when back irradiation is required for measurement, such as an array substrate for a liquid crystal panel, the semiconductor sample 11 can be irradiated from the back side because the light source 10a is embedded in the sample stage 7a. Measurement and analysis under conditions close to actual use.

Further, since the light source 10a is embedded in the sample stage 7a, the mounting height of the semiconductor sample 11 does not change, so that the focal length of the microscope 1 does not change much. It is not necessary to adjust the height of the sample stage 7a.

Even if the light source 10a is provided, the semiconductor sample 11 can be fixed by vacuum suction because the suction groove 12a is formed in the sample stage 7a so as to avoid the hole 15 as described above. As the position shift disappears,
Since it is not necessary to fix by taping as in the above-described conventional example, the displacement is less likely to occur, and the operability is improved because the process of peeling off the tape becomes unnecessary.

In the above embodiment, a screw hole is formed as a connection recess of a metal plate, and a screw 14 is inserted into the screw hole to form a ground pin. However, the present invention is not limited to this. Instead, the connection recess may have any shape, and a conductive pin or the like may be used instead of the screw.

In the above embodiment, the hole 15 is formed in the sample stage 7a and the light source 10a itself is embedded.
The present invention is not limited to this, and an optical fiber may be inserted into the hole 15 as an external light source to guide light from the external light source.

[0043]

As described above, according to the manual prober for semiconductor analysis of the present invention, at least a part of the probe installation stage is formed of a conductive material, and the ground terminal of the measurement probe is connected to the conductive material. By connecting to a probe installation stage and electrically connecting the ground terminal of the measurement probe and an external device via the probe installation stage, a ground terminal can be provided near the semiconductor sample, and the impedance of the ground signal line can be provided. And the number of wirings can be reduced.
As a result, the influence on noise during measurement can be reduced, and handling errors of equipment and semiconductor samples during measurement can be reduced.

Further, a hole in which a light source can be embedded is formed in the sample stage, and the light source is arranged in the hole to irradiate the semiconductor sample to be analyzed from the back surface side, so that the position of the semiconductor sample and the retrofit light source can be adjusted. A shift and a shift of the focal length of the microscope can be avoided.

[Brief description of the drawings]

FIG. 1 is a side view of a manual prober according to an embodiment of the present invention.

FIG. 2 is a plan view of a manual prober according to the embodiment of the present invention.

FIG. 3 is a side view of a conventional manual prober.

FIG. 4 is a plan view of a conventional manual prober.

FIG. 5 is a side view of another conventional manual prober.

[Explanation of symbols]

 Reference Signs List 3 prober body 4 probe setting stage 6a metal plate 7a sample stage 9a ground signal line 10a light source 11 semiconductor sample 14 screw 15 hole 17 measuring probe

Continued on front page F term (reference) 2G003 AA07 AB01 AF03 AG03 AG13 AG20 AH07 AH09 2G011 AA02 AA17 AC06 AC10 AC14 AC33 AE03 AF06 2G032 AB01 AB20 AD01 AE03 AE04 AE09 AF02 AF04 AK04 AL04 4M106 AA01 AA02 BA01 DD23

Claims (5)

[Claims] 1. A manual prober having a probe installation stage and a sample stage, and measuring an electric signal by bringing a measurement probe attached to the probe installation stage into contact with a semiconductor sample set on the sample stage. While forming at least a part of a conductive material, a ground terminal of the measurement probe is connected to the probe installation stage of a conductive material, and a ground terminal of the measurement probe via a probe installation stage. Manual prober for semiconductor analysis with electrical connection to external devices. 2. The semiconductor according to claim 1, wherein a ground terminal of the semiconductor sample is connected to the probe mounting stage made of a conductive material, and the ground terminal of the semiconductor sample is electrically connected to an external device via the probe mounting stage. Manual prober for analysis. 3. A ground terminal of a shield box of a prober body to which a measurement probe is attached is connected to the probe installation stage made of a conductive material, and a ground terminal of the shield box and an external device are connected via the probe installation stage. The manual prober for semiconductor analysis according to claim 1, which is electrically connected. 4. A plurality of connection recesses are formed in a portion of the probe installation stage formed of a conductive material, and screws or pins are inserted into the connection recesses to ground terminals or semiconductor samples of the measurement probe. The manual prober for semiconductor analysis according to claim 1, wherein the ground terminal is connected to the ground terminal. 5. The sample stage according to claim 1, wherein a hole in which a light source can be embedded is formed on the sample stage, and the light source is arranged in the hole to irradiate a semiconductor sample to be analyzed from the back side. Manual prober for semiconductor analysis described in 1.