JP2001226581A5 - - Google Patents

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JP2001226581A5
JP2001226581A5 JP2000041536A JP2000041536A JP2001226581A5 JP 2001226581 A5 JP2001226581 A5 JP 2001226581A5 JP 2000041536 A JP2000041536 A JP 2000041536A JP 2000041536 A JP2000041536 A JP 2000041536A JP 2001226581 A5 JP2001226581 A5 JP 2001226581A5
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Prior art keywords
flame retardant
polyamide
apatite
resin composition
type compound
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JP2000041536A
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Japanese (ja)
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JP2001226581A (en
JP4562842B2 (en
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Priority claimed from JP2000041536A external-priority patent/JP4562842B2/en
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Publication of JP2001226581A5 publication Critical patent/JP2001226581A5/ja
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Description

【特許請求の範囲】
【請求項1】(A)ポリアミド、ならびに(B)フェノールに不溶な有機物を含有し、リンに対する金属元素のモル比が1.3〜2.5であるアパタイト型化合物からなり、該有機物がアパタイト型化合物100重量部に対し0.5〜100重量部であるポリアミド複合体に、(C)非ハロゲン系難燃剤を配合してなるポリアミド樹脂組成物。
【請求項2】ポリアミド形成成分と、リンに対する金属元素のモル比が1.5〜2.0であるリン酸系金属化合物と非リン酸系金属化合物との混合物からなるアパタイト型化合物形成成分とを配合し、ポリアミドの重合反応およびアパタイト型化合物の合成反応を進行させて得られるポリアミド複合体に、非ハロゲン系難燃剤を配合してなるポリアミド樹脂組成物。
【請求項3】アパタイト型化合物が、平均粒子径にして0.001〜1μmであることを特徴とする請求項1あるいは2記載のポリアミド樹脂組成物。
【請求項4】アパタイト型化合物形成成分が、平均粒子径にして0.001〜10μmであることを特徴とする請求項2記載のポリアミド樹脂組成物。
【請求項5】非ハロゲン系難燃剤が、(a)リン系難燃剤、(b)無機化合物系難燃剤、(c)トリアジン系難燃剤、(d)シリコーン系難燃剤から選ばれる、少なくとも1種であることを特徴とする請求項1〜4記載の難燃性ポリアミド樹脂組成物。
【請求項6】 (A)ポリアミド100重量部に対して、(B)アパタイト型化合物0.5〜300重量部、(C)非ハロゲン系難燃剤1〜300重量部であることを特徴とする請求項1〜5いずれかに記載のポリアミド樹脂組成物。
[Claims]
1. An apatite-type compound containing (A) a polyamide and (B) a phenol-insoluble organic substance and having a molar ratio of a metal element to phosphorus of 1.3 to 2.5 , wherein the organic substance is apatite. A polyamide resin composition obtained by mixing (C) a non-halogen flame retardant with a polyamide composite in an amount of 0.5 to 100 parts by weight based on 100 parts by weight of a type compound.
2. A polyamide-forming component and an apatite-type compound-forming component comprising a mixture of a phosphate metal compound and a non-phosphate metal compound having a molar ratio of metal element to phosphorus of 1.5 to 2.0. A polyamide resin composition comprising a polyamide composite obtained by advancing a polymerization reaction of a polyamide and a synthesis reaction of an apatite type compound, and a non-halogen flame retardant.
3. The polyamide resin composition according to claim 1, wherein the apatite type compound has an average particle diameter of 0.001 to 1 μm.
4. The polyamide resin composition according to claim 2, wherein the apatite type compound-forming component has an average particle diameter of 0.001 to 10 μm.
5. The at least one non-halogen flame retardant selected from (a) a phosphorus flame retardant, (b) an inorganic compound flame retardant, (c) a triazine flame retardant, and (d) a silicone flame retardant. The flame-retardant polyamide resin composition according to claim 1, wherein the composition is a seed.
6. It is characterized in that (B) 0.5 to 300 parts by weight of an apatite type compound and (C) 1 to 300 parts by weight of a non-halogen flame retardant with respect to 100 parts by weight of polyamide (A). The polyamide resin composition according to claim 1.

すなわち本発明は、
(1)(A)ポリアミド、ならびに(B)フェノール溶媒に不溶な有機物を含有し、リンに対する金属元素のモル比が1.3〜2.5であるアパタイト型化合物からなり、該有機物がアパタイト型化合物100重量部に対し0.5〜100重量部であるポリアミド複合体に、(C)非ハロゲン系難燃剤を配合してなるポリアミド樹脂組成物、
(2)ポリアミド形成成分と、リンに対する金属元素のモル比が1.5〜2.0であるリン酸系金属化合物と非リン酸系金属化合物との混合物からなるアパタイト型化合物形成成分とを配合し、ポリアミドの重合反応およびアパタイト型化合物の合成反応を進行させて得られるポリアミド複合体に、非ハロゲン系難燃剤を配合してなるポリアミド樹脂組成物、
That is, the present invention
(1) An apatite-type compound containing (A) a polyamide and (B) an organic substance insoluble in a phenol solvent and having a molar ratio of a metal element to phosphorus of 1.3 to 2.5 , wherein the organic substance is an apatite-type A polyamide resin composition obtained by blending (C) a non-halogen flame retardant with a polyamide composite in an amount of 0.5 to 100 parts by weight based on 100 parts by weight of the compound;
(2) A polyamide-forming component and an apatite-type compound-forming component composed of a mixture of a phosphate metal compound and a non-phosphate metal compound in which the molar ratio of the metal element to phosphorus is 1.5 to 2.0. A polyamide resin composition obtained by blending a non-halogen flame retardant with a polyamide composite obtained by advancing a polymerization reaction of a polyamide and a synthesis reaction of an apatite type compound,

(3)アパタイト型化合物が、平均粒子径にして0.001〜1μmであることを特徴とする上記1あるいは2記載のポリアミド樹脂組成物、
(4)アパタイト型化合物形成成分が、平均粒子径にして0.001〜10μmであることを特徴とする上記2記載のポリアミド樹脂組成物、
(5)非ハロゲン系難燃剤が、(a)リン系難燃剤、(b)無機化合物系難燃剤、(c)トリアジン系難燃剤、(d)シリコーン系難燃剤から選ばれる、少なくとも1種であることを特徴とする上記1〜4記載の難燃性ポリアミド樹脂組成物。
(6)(A)ポリアミド100重量部に対して、(B)アパタイト型化合物0.5〜300重量部、(C)非ハロゲン系難燃剤1〜300重量部であることを特徴とする上記1〜5記載のポリアミド樹脂組成物、
である。以下、本発明について詳細に説明する。

(3) The polyamide resin composition according to the above (1) or (2), wherein the apatite type compound has an average particle diameter of 0.001 to 1 μm.
(4) The polyamide resin composition as described in (2) above, wherein the apatite-type compound-forming component has an average particle diameter of 0.001 to 10 μm.
(5) The non-halogen flame retardant is at least one selected from (a) a phosphorus flame retardant, (b) an inorganic compound flame retardant, (c) a triazine flame retardant, and (d) a silicone flame retardant. 5. The flame-retardant polyamide resin composition according to any one of the above items 1 to 4, wherein
(6) The above (1), wherein (A) 100 to 100 parts by weight of polyamide, (B) 0.5 to 300 parts by weight of an apatite type compound, and (C) 1 to 300 parts by weight of a non-halogen flame retardant. A polyamide resin composition according to any one of claims 1 to 5,
It is. Hereinafter, the present invention will be described in detail.

JP2000041536A 2000-02-18 2000-02-18 Flame retardant polyamide resin composition Expired - Fee Related JP4562842B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000041536A JP4562842B2 (en) 2000-02-18 2000-02-18 Flame retardant polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000041536A JP4562842B2 (en) 2000-02-18 2000-02-18 Flame retardant polyamide resin composition

Publications (3)

Publication Number Publication Date
JP2001226581A JP2001226581A (en) 2001-08-21
JP2001226581A5 true JP2001226581A5 (en) 2007-04-05
JP4562842B2 JP4562842B2 (en) 2010-10-13

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005139245A (en) * 2003-11-04 2005-06-02 Toray Ind Inc Polyamide resin composition
CN111057367B (en) * 2019-11-26 2022-09-06 浙江恒逸石化研究院有限公司 High-lasting flame-retardant nylon 6 and preparation method thereof
KR20210096723A (en) * 2020-01-28 2021-08-06 주식회사 엘지에너지솔루션 Flame retardant composite pad and method for manufacturing the same, secondary battery module and secondary battery pack including the same
CN113549321A (en) * 2021-07-22 2021-10-26 中广核俊尔(浙江)新材料有限公司 Black phosphorus flame-retardant polyamide composite material capable of achieving high-definition laser marking and resisting wet-heat precipitation and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8703160D0 (en) * 1987-02-11 1987-03-18 Bip Chemicals Ltd Polyamide compositions
JPH11106646A (en) * 1997-10-07 1999-04-20 Mitsubishi Eng Plast Corp Polyamide resin composition
JP3309901B2 (en) * 1998-01-07 2002-07-29 旭化成株式会社 Polyamide resin composition and method for producing the same
JP2000026721A (en) * 1998-07-15 2000-01-25 Showa Denko Kk Flame-retardant polyamide rein composition
JP2000044796A (en) * 1998-07-27 2000-02-15 Toray Ind Inc Flame-retardant polyamide resin composition

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