JP2001223857A - Thin optical assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device miniaturized by reducing the size of an optical assembly and a method for miniaturizing the electronic device. SOLUTION: An electronic device 100 and a method for manufacturing the electronic device 100 are provided. The electronic device 100 has a substrate 110 to which at least first 185 and second 186 linear optical parts are fitted. The linear optical parts 185 and 186 have optical detection parts 205 and 206 and interface parts 225 and 226. The optical detection parts 205 and 206 are electrically connected to the interface parts 225 and 226. The optical detection parts 205 and 206 of the linear optical parts 185 and 186 are arranged along a first axis AA. At least one interface parts 225 of the first linear optical parts 185 is offset in a first direction 246 from the first axis AA. At least one interface part 226 of the second linear optical part 186 is offset in a second direction 244 different from the first direction 246. Since the optical parts 185 and 186 are arranged in such a way, the size of the electronic device 100 becomes small and the size of an arbitrary delivery incorporating the electronic device 100 becomes small.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a linear optical assembly, and more particularly, to a miniaturized linear optical assembly.

[0002]

2. Description of the Related Art A linear optical assembly is a device that converts a thin scan line portion of an image of an object into machine-readable image data, often referred to herein simply as image data. Image data representing a majority of the object is generated by moving the linear optical assembly relative to the object while the linear optical assembly generates image data representing a continuous scan line portion of the image of the object. Therefore, image data of an object is represented by a plurality of scanning lines in the same manner as an image display device represents an image of an object. The process of generating image data representing an image of an object is often referred to as imaging or scanning the object.

[0003] Linear optical assemblies are used in a variety of devices, such as optical scanning devices and facsimile devices. These devices are generally used to generate printed images, such as characters printed on paper. The image can then be reproduced by a linear optical device or peripheral processing device processing the image data in a conventional manner. For example, a facsimile machine generates image data representing characters printed on paper and sends the image data via a telephone line to another facsimile machine that reproduces an image of a character on another paper. In another example, the optical scanning device comprises:
Image data representing an object such as a character printed on paper is generated, and the image data is stored for processing. For example, the image data is used to change the image of the object or to transfer the image of the object by electronic means such as e-mail.

[0004] Linear optical assemblies generally include a light emitting device and a light detecting device in addition to a plurality of various electronic components. The light emitting device illuminates an object to be imaged, and the light detection device images the object. The electronic components serve to support the light emitting device and the light detecting device. The light emitting device is a line light source, such as, for example, a linear array of light emitting diodes, often simply referred to herein as LEDs. Photodetectors generally consist of a linear array of photodetectors (or photodetectors), often referred to herein simply as photodetectors. Photodetectors are generally grouped into individual photodetector segments, with each photodetector segment having a small linear array of photodetectors. Each photodetector segment has a photodetector and an interface, the photodetector has a linear array of photodetectors, and the interface includes connectors and the like for transmitting data from the photodetectors. Have. Thus, the light detection portion generates the image data, and the interface portion transfers the image data from the light detector segment.

[0005] Some linear optical assemblies have another two.
A three-dimensional photodetector array, often referred to herein simply as a navigator, that serves to determine the position of the linear optical assembly with respect to the object being imaged when generating image data. . The linear optics assembly can include, in addition to the navigator, LED, and photodetector, some other electronic components required to operate the linear optics assembly. For example, electronic components are needed to regulate the voltage and regulate the flow of image data from the photodetector.

[0006] To facilitate manufacturing and reduce costs, the aforementioned components that make up a linear optical assembly include:
Generally, they are located on a single printed circuit board. The photodetector segments are arranged to face the object being imaged. Further, the photodetector segments must be arranged such that the photodetecting portions constitute a linear array of continuous photodetectors adjacent to one another. Similarly, LED
Are positioned on the printed circuit board such that the photodetector segments illuminate the portion of the object being imaged.

In general, it is desirable to reduce the size of a device that uses a linear optical assembly. For example, in the case of a facsimile machine, the smaller the facsimile machine is, the smaller the space occupied on the desk is, which is essentially beneficial. In the case of an optical scanning device, the use of a small optical assembly allows the optical scanning device to be portable.

[0008]

However, placing the components (or components) that make up a linear optical assembly on a single printed circuit board tends to increase the size of the linear optical device. This is important due to the fact that the components that make up the linear optical device must be placed on a single printed circuit board so that they do not optically or electrically interfere with each other. Furthermore, the photodetector segments must be arranged linearly and next to each other. In the case of an LED, the light emitted from the LED cannot cross the navigator until the light is reflected from the object, otherwise the light will interfere with the light reflected from the object. Therefore, the size of a linear optical assembly is generally limited by the physical and optical properties of the components that make up the linear optical assembly.

[0009] Therefore, there is a need for a small linear optical assembly in which the components that make up the linear optical assembly are mounted on a single printed circuit board.

[0010]

SUMMARY OF THE INVENTION A miniaturized optical assembly is disclosed herein. The optical assembly can include a printed circuit board having a plurality of electronic and optoelectronic components mounted thereon. The optoelectronic component can include a linear array of linear photosensor segments and at least one two-dimensional photodetector. The electronic component can comprise a linear array of light emitting diodes (LEDs) and other components necessary for operation of the optoelectronic component. The components that make up the optical assembly can be electrically connected to the processor.

Each linear light sensor segment can have an interface and a light detector. The light detector may comprise a linear array of light detectors for converting a scan line portion of the image of the object into image data. The interface unit can connect the light detection unit to the printed circuit board.

The light sensor segments can be arranged on a printed circuit board such that the light detectors are linearly aligned along an axis. The interface portions of the individual light sensor segments can be oriented in either a first direction or a second direction opposite thereto. By directing the interface in different directions, the light sensor and
Segments can be arranged. Thereby, the size of the optical assembly can be reduced. For example, the interface units can be arranged so that there is a space between them. Other components that make up the optical assembly can be located in those spaces. By arranging components in those spaces, high density components can be located closer to the optical sensor than other areas of the printed circuit board. This can reduce the area of the printed circuit board and thus the optical assembly.

[0013]

1 to 4 show the steps of providing a substrate 110, a photodetector 200, and an interface 202 electrically connected to the photodetector 200. FIG.
Providing a plurality of optical components each comprising: a first optical component 1 of the plurality of optical components 180
85, the substrate 11 with its photodetector 205 positioned along a first axis and its interface 225 offset in a first direction 246 from the first axis.
And positioning the second optical component 186 of the plurality of optical components 180 along its first axis with its photodetector 206 positioned along the first axis.
26 is attached to the substrate 110 while being offset from the first axis in a second direction 244 different from the first direction 246.

FIGS. 1 to 4 show a substrate 1 as a whole.
10, at least one first linear optical component 185 attached to the substrate 110, and at least one second linear optical component 186 attached to the substrate 110, wherein at least one First optic 185 and at least one second optic 18
6 includes light detection units 205 and 206 and light detection units 205 and 2
Interface units 225, 2 electrically connected to
26 and at least one first linear optical component 1
85 light detectors 205 are aligned along a first axis, and at least one second linear optical component 186 light detectors 206 are aligned along a first axis and at least one first Interface portion 225 of the first linear optical component 185 is offset from the first axis in a first direction 246, and the interface portion 226 of at least one second linear optical component 186 has a second direction different from the first direction 246. The electronic device 100 consists of being offset from the first axis in the direction 244 of FIG.

1 to 4 show a substrate 1 as a whole.
10, a plurality of linear optical components 1 attached to a substrate 110, each of which includes a light detection unit 200 and an interface unit 202 electrically connected to the light detection unit 200.
80, wherein each of the plurality of linear optical components 810 has the first
Are aligned along an axis AA of at least a first optical component 185 and a second optical component 185 of the plurality of linear optical components 180.
Interfaces 225 and 228 of the optical component 188 of FIG.
Are offset from the first axis in a first direction 246 to define a first space therebetween, and at least a third optic 187 and a fourth optic 196 of the plurality of linear optics 180. Interface units 227 and 236
Is offset from the first axis in a second direction 244 to define a second space therebetween, wherein the first direction 246 is different from the second direction 244. Is shown.

Having generally described optical assembly 100, it will now be described in further detail. After briefly describing the conventional optical assembly, the optical assembly 1 will be described.
An outline and detailed description of 00 will be given. The optical assembly 100 described herein includes a hand-held optical scanning device 102.
(FIG. 1). However, the use of optical assembly 100 with scanning device 102 is for illustrative purposes only, and it is clear that optical assembly 100 can be used with other devices. For example, the optical assembly 100 can be used with a facsimile machine.

The optical assembly, including the optical assembly 100, generally converts a thin scan line portion of an image of an object into machine-readable image data (sometimes simply referred to herein as image data). In the present specification, the object is described as being the front surface 304 of the sheet 300 including the characters 302 printed on the front surface 304. However, the use of paper 300 is for illustrative purposes only, and it is clear that optical assembly 100 can convert images of other objects into image data.

The aforementioned scanning line portion 310 extends along a reference line BB on the front surface 304 of the sheet 300. To generate image data representing the entire sheet 300, the optical assembly 100 is moved relative to the surface 304 of the sheet 300 while generating image data for a continuous scan line portion 310 of the surface 304. Thus, the image data representing surface 304 is in the form of a continuous scan line portion 310.

Referring to FIG. 2, a plurality of linearly arranged photosensor segments 180 are attached to printed circuit board 110 and serve to image scan line portion 310 of surface 304 of FIG. be able to. Each light sensor segment 180 has a light detection unit 200 and an interface unit 202. Each light detection unit 200 includes a linear array of light detectors (not shown) that converts light into image data. This light represents the image of scan line portion 310 of FIG. The interface unit 202 may be a connector or the like that outputs image data in a serial format, and can serve to electrically connect the light detection unit 200 to the printed circuit board 110. Referring to FIG. 3, each light sensor segment 180 has a first side 182 and a second side 184. The serial output of the image data begins with the image data generated by the light detector closest to the first side 182 and ends with the image data generated by the light detector closest to the second side 184. .

In a conventional optical assembly, the light sensor segments 180 are arranged such that the first sides 182 all face the same direction. For example, the first side 182
All point in the negative x direction 248. Referring to FIG. 2, in a conventional optical assembly, the interface portions 202 are all oriented in the same direction. For example, the interface units 202 all face the positive y direction 244. Optical sensor segment 180 in conventional optical assembly
This arrangement allows the image data output from the light sensor segment 180 to be electronically connected together to produce image data that accurately represents the image of the scan line portion 310 of FIG. Processing can be simplified. However, this arrangement of optical sensor segments 180 includes the optical sensor segments 180 to accommodate the other components that make up a conventional optical assembly.
However, there is a drawback that the arrays cannot be arranged. As a result, the conventional optical assembly occupies a relatively large area.

Optical assembly 100 disclosed herein
Has a narrow width 124 and thus a small area, achieved by arranging the photosensor segments 180 to accommodate other components that make up the optical assembly 100. For example, some interface portions 202 face the positive y-direction 244 and the remaining interface portions 202 face the negative y-direction 246. For example, the second interface 226, the third interface 2
The 27th, twelfth interface 236, and thirteenth interface 237 face the positive y-direction 244 and are arranged along the reference axis BB. Similarly, the first interface 225, the fourth to eleventh interfaces 228 to 235, and the fourteenth interface 238 are connected to the negative y-direction 246.
And arranged along the reference axis CC. However, the light detector 200 remains linearly aligned along the reference axis AA. Optical assembly 1 shown in FIG.
00 has four light sensor segments 180 oriented in the positive y-direction 244 to accommodate the first navigator section 150 and the second navigator section 152. By arranging the photosensor segments 180 to accommodate other components that make up the optical assembly 100, the components can be made smaller, thereby reducing the size of the optical assembly 100.

An optical sensor pointing in the positive y-direction 244
The order of the image data output from the segment 180 is
The order of the image data output from the remaining light sensor segments 180 is reversed. To overcome this problem,
A processor not shown in FIG. 2 may reorder image data generated from light sensor segments 180 pointing in positive y direction 244 from the remaining light sensor segments 180 pointing in negative y direction 246. Electronically invert the generated image data. This inversion of the image data allows the image data generated by all photosensor segments 180 to be stitched together to form image data that accurately represents the image of scan line portion 310 of FIG.

Having generally described optical assembly 100, it will now be described in further detail.

As shown in FIG. 1, the optical assembly 100 described herein comprises a portable hand-held scanning device 10.
2 can be of the type used. The scanning device 102 (FIG. 1) generates image data representing the characters 302 printed on the front surface 304 of the paper 300. The process of generating image data representing an image of an object may be referred to as scanning or imaging the object. Scanning device 102
Indicates that scanning device 102 has a path 308 relative to surface 304
The surface 304 including the character 302 is imaged by imaging a continuous thin scan line portion 310 of the surface 304 as it is moved along.

Scanning device 1 including optical assembly 100
02 can be housed in the housing 104. The housing 104 can have a width 106 that can be smaller than a conventional scanning device. This small width 106 improves the portability of the scanning device 102. For example, when the width 106 is reduced, the scanning device 102 can be easily held in the user's hand. Reducing the width 106 makes the scanning device 102 easier to carry. For example, the scanning device 102 can be made small enough to fit into a user's pocket. The housing 104 is, for example, an injection molding unit made of polycarbonate containing 30% glass fibers.

For reference, the optical assembly 100, and thus the housing 104, includes a left side 116 and a right side 11
8 The left side surface 116 faces the negative x direction 248, the right side surface 118 faces the positive x direction 247, and the positive x direction 247.
The direction 247 and the negative x direction 248 are opposite to each other. The scanning line portion 310 has a positive x direction 247 and a negative x direction 24.
Positioning is performed along a reference line BB parallel to 8. Note that scan line portion 310 is generated by optical assembly 100. Thus, its position with respect to surface 304 depends on the position of scanning device 102 with respect to surface 304.

Referring to FIG. 2, optical assembly 100
Has a conventional printed circuit board 110 (sometimes referred to herein as a board) to which a plurality of components are electrically and mechanically attached. The printed circuit board 110 is
It has an upper side 112, a lower side 114, a left side 116 and a right side 118. These sides define the boundaries of surface 120. Width 124 between upper side 112 and lower side 114
There is. Width 124 is, for example, about 9.75 millimeters. Length 126 between left side 116 and right side 118
There is. Length 126 is, for example, about 123 millimeters. For purposes of illustration, the optical assembly 10 shown in FIG.
Note that the zero dimension has been greatly expanded.
As described below, the purpose of the optical assembly 100 is
24, and consequently, the width 106 (FIG. 1) of the scanning device 102.

The printed circuit board 110 has a plurality of lands (not shown) that serve to conduct current between various locations on the printed circuit board 110 and components. The connector 130 is connected to the lower surface 114 of the printed circuit board 110.
And electrically connect to the land. In addition, the connector 130 is mounted on the printed circuit board 1 near the lower surface 114.
10 is mechanically connected. The connector 130 has an end 132 opposite the lower surface 114 of the printed circuit board 110. A plurality of lands 134 are disposed in the connector 130 and may extend between the lands (not shown) and the end 132 in the printed circuit board 110. Each land 13
4 terminates in a conductor 136 located adjacent end 132. The conductor 136 functions as an electrical contact of the land 134. The connector 130 is connected to the optical assembly 100.
And serves to transmit data between the optical assembly 100 and peripheral devices not shown in FIG. Connector 130 is, for example, a conventional ribbon cable.

A plurality of electronic components can be mounted on the surface 120 of the printed circuit board 110. For explanation,
In the figure, only the first electronic component 140 and the second electronic component 142 are attached to the surface 120 of the printed circuit board 110. However, in general, more electronic components are mounted on the surface 120 of the printed circuit board 110. The electronic components 140 and 142 are, for example,
Surface mount capacitors, resistors or integrated circuits required for operation of optical assembly 100.

The surface 120 of the printed circuit board 110 has a first navigator unit 150 and a second navigator unit 152. The navigator units 150 and 152 each have a first
A conventional ground plane that functions as a shielding and mounting area for the navigator 154 and the second navigator 156 of FIG. The navigators 154, 156 comprise a two-dimensional photodetector array that ultimately functions to determine the position of the scanning device 102 of FIG. First navigator 154 and second navigator 15
6 may occupy a significant portion of the first navigator section 150 and the second navigator section 152. For illustrative purposes, the figures show a first navigator 154 and a second navigator 156.
Are the first navigator unit 150 and the second navigator unit 1
It is shown to occupy only 52 small areas.

The first navigator unit 150 includes an upper surface 15
8, a right side surface 160, a lower side surface 162, and a left side surface 164, and have a substantially rectangular shape. There is a height 166 between the upper side 158 and the lower side 162. Height 166 is, for example, about 6.0 millimeters. There is a width 168 between the left side 164 and the right side 160. Width 168 is, for example, about 8.0 millimeters. Second navigator unit 1
52 has the same shape and dimensions as the first navigator unit 150. The positions of the navigators 150 and 152 with respect to the printed circuit board 110 will be described later. The area of the surface 120 near the first navigator unit 150 and the second navigator unit 152 is configured to connect wiring from the first navigator 154 and the second navigator 156 to the land on the printed circuit board 110. be able to.

A plurality of linear photosensor arrays 180 (sometimes referred to herein simply as photosensor segments) may be mechanically and electrically mounted on surface 120 of printed circuit board 110. Optical sensor segment 180 may be, for example, Texas Ad, Plano, Texas.
Part Number TSL23 from vanced Optoelectronics Solutions, Inc.
It is of the type commercially available as 01. In FIG. 2, the optical assembly 100 includes a printed circuit board 110.
Is shown having fourteen optical sensor segments 180 attached to the same. The optical assembly 100 includes
Depending on the application of the optical assembly 100, it is possible to have more or less light sensor segments 180. In this specification, the individual optical sensor segments 180 are referred to as first to fourteenth segments and are represented by numerals 185 to 198, respectively.

The optical sensor segment 180 has a light detecting section 200 and an interface section 202. Therefore, the individual segments 185 to 198 are respectively referred to as first to fourteenth photodetectors in this specification, and
It has a light detection unit referenced by the numeral 8. Pixels in a linear array (not shown) are attached to each of the light detection units 205 to 218, and approximately 1
02 pixels can be attached. Pixels may be referred to herein as photodetectors. In addition to the light detection units 205 to 208, each segment 185 to 198
Are called first to fourteenth interfaces, respectively.
It may have an interface section referred to by numerals 225 to 238. The light detection unit 200 and the interface unit 202 can be electrically connected to each other. Each light sensor segment 180 includes an eighth segment 192
And a light detecting side 222 and an interface side 224 as indicated by the tenth segment 194. The distance between the light detection side 222 and the interface side 224 is, for example, about 1.0 millimeter.

Light detector 2 of light sensor segment 180
00 can be arranged linearly along the reference line AA. More specifically, the pixels on the light detection unit 200 can be linearly arranged along the reference line AA. As described above, a pixel is a photodetector that converts light into image data. Therefore, the reference line AA corresponds to the above-described scanning line portion 310 (FIG. 1) of the front surface 304 of the sheet 300 to be converted into image data.

The interface section 202 functions to electrically connect the light detecting section 200 to the land on the printed circuit board 110. The interface unit 202 is made of, for example, wiring (not shown) sealed in epoxy. Further, the interface unit 202 can include an electronic circuit necessary for transmitting image data. For example, an analog-digital converter can be arranged in the interface unit 202. Interface section 202
Provides power to the pixels and sends image data from the pixels to the printed circuit board 110. The interface unit 202 also serves to send instructions from the peripheral device, such as a processor, to the light sensor segment 180.

The interface unit 202 has a positive y direction 2
44 or the negative y-direction 246,
Here, the positive y direction 244 is opposite to the negative y direction 246. In order to more specifically describe the positive y direction 244 and the negative y direction 246, in the figure, the first interface 225 faces the negative y direction 246, and the second interface 226 displays the positive y direction 244. It is suitable. The pixels on the light detection unit 200 remain linearly arranged along the reference line AA regardless of the direction in which the interface unit 202 is facing.

In order to show the direction and orientation of the components arranged on the printed circuit board 110, in addition to the positive y direction 244 and the negative y direction 246, a positive x direction 247 and a negative x direction 248 are used. Can be used. Positive x direction 247 and negative x direction 248 are opposite to each other and positive y direction 2
44 and perpendicular to the negative y-direction 246. As described below, the positive x direction 247 and the negative x direction 248 can be used to indicate the output of the image data generated by the light sensor segment 180.

A plurality of LEDs 250 can be electrically and mechanically connected to the surface 120 of the printed circuit board 110. The optical assembly 100 shown in FIG. 2 has ten LEDs 250, referred to as first through tenth LEDs, respectively, and referenced by numerals 252-261. LED25
0 has a side surface 251 facing the upper surface 112 of the printed circuit board 110 as shown on the first LED 252. The LED 250 is connected to the surface 304 of the sheet 300 to be imaged.
Serves to illuminate the scan line portion 310 (FIG. 1). L
The ED 250 is for illustration only and the LED 2
50 can be replaced with other conventional lighting devices.

A plurality of optical baffles are connected to the printed circuit board 1
10 can be attached to the surface 120 to prevent external light from interfering with optical components located on the printed circuit board 110. The first baffle 271 is disposed near the lower surface 114 of the printed circuit board 110,
It extends from near the left side 116 to near the right side 118. The second baffle 272, the third baffle 273, and the fourth baffle 274 are connected to the first navigator unit 15.
It surrounds a zero and serves to reduce external light that may obstruct the first navigator 154. Fifth baffle 2
75, sixth baffle 276, and seventh baffle 2
Reference numeral 77 surrounds the second navigator unit 152 and serves to reduce external light that may interfere with the second navigator 156. These baffles have a baffle width of 284
A first side 280 of the baffle and a second side 282 of the baffle are spaced apart. Baffle width 284 is, for example, about 0.25 millimeters. These baffles are made of, for example, a polycarbonate thin film material and can be attached to surface 120 of printed circuit board 110 using an adhesive. Alternatively, a baffle can be mounted on the housing 104 (FIG. 1) so that when the printed circuit board 110 is placed in the housing 104, it interacts with components located on the printed circuit board 110.

The components mounted on the surface 120 of the printed circuit board 110 have been described. Next, the positional relationship between these components and the positional relationship between the components and the printed circuit board 110 will be described. Positive y direction 2
The interface side 224 of the optical sensor segment 180 facing 44 is the upper surface 11 of the printed circuit board 110.
2 at a distance 286. More specifically, the light sensor segment 180 oriented in the positive y direction 244
Second segment 186, third segment 187, twelfth
A segment 196 and a thirteenth segment 197. The LED 250 is generally connected to the interface unit 202.
Side 251 of the LED 250
Is a distance 2 from the upper surface 112 of the printed circuit board 110.
86 or more away. The light detection side 222 of the light sensor segment 180 facing the positive y-direction 244 is connected to the first side surface 280 of the third baffle 273 and the sixth baffle 276.
Is located at a distance 288 from. Distance 288 is, for example, about 0.25 millimeters. Third baffle 273
Baffle surface 282 and first navigator unit 150
There is a distance 290 between the upper surface 158 and the upper surface 158. Distance 290
Is, for example, about 0.25 millimeters. Similar distances exist for the sixth baffle 276 and the second navigator section 152. The lower surface 162 of the first navigator unit 150 and the first baffle surface 280 of the first baffle 271
There is a distance 292 between. Distance 292 is, for example, about 0.25 millimeters. A similar distance exists between the second navigator unit 152 and the first baffle 271. Second baffle surface 2 of first baffle 271
There is a distance 294 between 82 and lower surface 114 of printed circuit board 110. The distance 294 is, for example, about 0.25
Millimeters. Alternatively, the first baffle 27
1 can be placed on the lower surface 114 to eliminate the distance 294.

Accordingly, the width 124 of the printed circuit board 110 is the distance 286, the distance between the light detection side 222 and the interface side 224 of the optical sensor segment 180, the distance 288, the baffle width 284 of the third baffle 273,
Distance 290, height 166 of first navigator unit 150,
It is equal to the sum of the distance 292 and the baffle width 284 of the first baffle 271. In the case of the above example, the measured value of width 124 is approximately 9.75 millimeters.

The conventional optical assembly has a small width 12 as described herein with respect to the optical assembly 100.
4 cannot be achieved. The small width 124 of the optical assembly 100 is achieved, in part, by the use of baffles 271-278 and the orientation of the photosensor segments 180. Conventional optical assemblies, including those used with optical scanning devices, have a light baffle integrally formed within a housing. The housing is generally made of plastic or similar material, such that such light baffles tend to be relatively thick, and thus the housing tends to increase the width of the optical scanning device. By using a material such as a polycarbonate film, the baffles 271-2
The baffle width 284 of 78 is significantly smaller than a conventional optical baffle. When the baffle thickness 284 is small, the width 124 of the printed circuit board 110 is also small.

The orientation of the light sensor segments 180 improves the efficiency of the surface 120 of the printed circuit board 110. This improved efficiency is achieved by the printed circuit board 110.
Used to minimize the width 124 of the For example,
Second segment 186, third segment 187, twelfth
Segment 196 and thirteenth segment 197 are:
Pointed in the positive y-direction 244. The remaining light sensor segments 180 are directed in the negative y direction 246. This orientation of the light sensor segment 180 allows the light sensor
Within the linear array of segments 180, first navigator 150 and second navigator 152 are nested. In addition, this orientation allows the array of LEDs 250 to be present everywhere except where the light sensor segments 180 are pointing in the positive y-direction 244. These areas increase the distance between the LEDs 250. As described below, to illuminate the area of the surface 304 (FIG. 1) corresponding to the wide spacing between the LEDs 250 described above,
A non-imaging concentrator can be associated with the optical assembly 100. Non-imaging concentrators are sometimes referred to as light guides or diffusers.

Having described the major individual components that make up the optical assembly 100, their relationship to each other will now be described. Peripheral processing unit (processor) 35
Referring to FIG. 3, which is a schematic diagram of the optical assembly 100 with the optical sensor segment 180, the optical sensor segment 180 is electrically connected to the processor 350 via seven interface modules 378 and a plurality of data lines. The interface modules 378 are individually referred to as first to seventh interface modules, respectively, and 370
It is referred to by the number of ~ 376. The interface module 378 functions to group the image data generated by the light sensor segments 180 to facilitate transmission of the image data to the processor 350, as described below. The data lines are 1st to 1st respectively
It is called the fourteenth data line and is referred to by numerals 355-368.

First segment 185 and eighth segment 1
92 is a first data line 355 and an eighth data line 3 respectively.
62 electrically connects to the first interface module 370. The second segment 186 and the ninth segment 193 are respectively connected to the second data line 356 and the ninth segment.
The data line 363 is electrically connected to the second interface module 371. Third segment 187
And the tenth segment 194 are electrically connected to the third interface module 372 by the third data line 357 and the tenth data line 364, respectively. Fourth segment 188 and eleventh segment 195 are electrically connected to fourth interface module 373 by fourth data line 358 and eleventh data line 365, respectively. Fifth segment 189 and twelfth segment 1
96 is connected to the fifth interface module 37 via the fifth data line 359 and the twelfth data line 366, respectively.
4 is electrically connected. Sixth segment 190 and first
The three segments 197 are respectively connected to the sixth data line 360
And the thirteenth data line 367 for the sixth interface
It is electrically connected to the module 375. The seventh segment 191 and the fourteenth segment 198 are respectively
The data line 361 and the fourteenth data line 368 are electrically connected to the seventh interface module 376. The data lines 355 to 368 are electrically connected to the interface unit 202 (FIG. 2) of the optical sensor segment 180.
Are shown so that they are roughly connected.

Each of the interface modules 370-3
76 indicates a processor 3 via a plurality of interface lines.
50 is electrically connected. The interface lines are referred to herein as interface lines 380-386. Data lines 355-368 and interface lines 380-386 function to transmit image data from light sensor segment 180 to processor 350 in a conventional manner. They also function to send instructions from processor 350 to interface module 378 and photosensor segment 180 in a conventional manner.

FIG. 3 further shows that each light sensor segment 180 has a first side 182 and a second side 184. A photodetector (not shown) on photosensor segment 180 between first side 182 and second side 184
Can be arranged linearly. The image data output from each of the photosensor segments 180 starts with, for example, image data generated by a photodetector closest to the first side 182 and is generated by a photodetector closest to the second side 184. Series 2 ending with image data
Can be in hexadecimal format. The second segment 186, the third segment 187, the twelfth segment 196, and the thirteenth segment 197 are oriented such that their first sides 182 point in the positive x-direction 247. The remaining light sensor segments 180 are on their first side 18
2 are oriented in the negative x-direction 248. In a conventional optical assembly, the first sides 182 are all facing the same direction. As described later, the second segment 1
86, third segment 187, twelfth segment 19
The image data output from the sixth and thirteenth segments 197 are in reverse order to the image data output from the remaining light sensor segments 180.

Having described the components that make up the optical assembly 100, the operation will now be described.

With reference to FIG. 1, the description herein assumes that the optical assembly 100 is incorporated into a hand-held scanning device 102. The scanning device 102 controls the paper 30
The description will be made on the assumption that image data representing the surface 304 of 0 is generated. Generating image data representing an image of an object is often referred to as imaging or scanning the object. For an example of generating image data using an optical scanning device, see “HAND-HEL
Mc entitled `` D SCANNER HAVING ADJUSTABLE LIGHT PATH ''
Conica Patent No. 5,552,597, `` IMAGING DEVICE WITH B
Steinle Patent No. 5, entitled "EAM STEERING CAPABILITY"
Issue 646,394, `` EXPANDABLE HAND-HELD SCANNING DEVIC
No. 5,646,402 to Khovaylo et al., Entitled "E", all of which are incorporated herein by reference for all of their disclosures.

During the imaging process, the optical assembly 100
Generates image data representing a plurality of continuous scan line portions 310 on the front surface 304 of the paper 300. More specifically, the image data representing the scanning line portion 310 is
02 is generated when the object 02 is moved with respect to the front surface 304 of the sheet 300. For example, the scanning device 102
0 to follow path 308 on surface 304. Therefore, the image data is stored on the front surface 30 of the sheet 300.
4 that may cross diagonally 4
Represents Processor 350 (FIG. 3) uses conventional software to properly position the skewed scan line portions with respect to each other to properly reproduce the image of surface 304.

Referring to FIG. Optical assembly 100
Is placed in the housing 104 (FIG. 1) such that the surface 120 of the printed circuit board 110 faces the surface 304 of the paper 300. During the imaging process, the LEDs 250 emit light that illuminates the scan line portions 310 on the surface 304 of the paper 300. Note that there is a large space between the first LED 252 and the second LED 253 due to the orientation of the light sensor segment 180.
Between the ninth LED 260 and the tenth LED 261,
There is a similar large space. Also, the printed circuit board 11
The arrangement of the electrical components on the plane 120 of the
Note that 2 must be oriented so that it points in the positive y-direction 244. Thereby, the corresponding L
ED losses occur, leaving another gap between the LEDs, as described above.

The aforementioned space in the linear array of LEDs 250 results in non-uniform illumination of the surface 304 (FIG. 1) of the paper 300. Therefore, the optical assembly 100
Scan line portion 310 is not uniformly illuminated. Thus, the image of the scan line portion corresponding to the aforementioned space in the linear array of LEDs 250 is darkened in those areas. Thus, those regions of scan line portion 310 do not reflect the exact representation of surface 304 (FIG. 1). To overcome this problem associated with non-uniform illumination, the optical assembly 100 can be calibrated for non-uniform illumination or provided with a diffuser. Calibration requires imaging a uniform surface with a given reflectivity. Processor 350 (FIG. 3) analyzes the image data and adjusts the output of each photodetector so that the output of each photodetector has a predetermined value. This predetermined value corresponds to the reflectivity of a uniform surface having a predetermined reflectivity. Next, to account for non-uniform illumination, surface 304
Adjustments are made when reproducing the image of FIG.

Light diffuser (sometimes called a light guide)
Diffuses the light emitted from the LED 250 over the scan line portion 310 (FIG. 1) being imaged.
This diffused light provides more uniform illumination of surface 304 (FIG. 1). The diffuser can be used with the optical assembly 100 calibrated as described above to generate image data that more accurately represents the surface 304. However, the optical assembly 100 must be calibrated with an associated diffuser. Scanning device 102
An example of a diffuser that can be used for (Figure 1) is "CONT
ACT IMAGE SENSOR WITH LIGHT GUIDE, which is disclosed in US Patent Application No. 09/477205 to Bohn et al.
All the contents disclosed therein are incorporated herein by reference.

The image of scan line portion 310 (FIG. 1) of surface 304 reflects from surface 304 to light detector 200 of light sensor segment 180. A photodetector (not shown) on the photodetector 200 converts individual regions of the scanning line portion 310 (FIG. 1) into image data. Next, the image data is output from the light detection unit 200 to the interface unit 202 (FIG. 3). The interface unit 202 is electrically connected to a land (not shown) in the printed circuit board 110, and finally transmits image data to the connector 13 via the land 134.
0 to conductor 136 at end 132. The image data can then be sent to a peripheral processing device.

Having described the process of generating image data, the processing of image data will now be described. Hereinafter, an outline of processing of image data will be described. A more detailed description of the process follows this summary. Please refer to FIG.
As described above, the light sensor segment 180 is
Image data representing the scan line portion 310 of FIG. 4 (FIG. 1) is generated. Upon receiving a command from the processor 350,
The individual light sensor segments 180 transmit image data to the processor 3 via the interface module 378.
Output to 50. The image data output from each photosensor segment 180 is a data stream in the form of serial binary data. This data stream begins with image data generated from a light detector (not shown) closest to the first side 182 of each light sensor segment 180 and is closest to the second side 184. Ends with image data generated by a photodetector (not shown).
As described below, the processor 350 includes a second segment 186, a third segment 187, and a twelfth segment 19.
Since the orientations of the sixth and thirteenth segments 197 are opposite to the other light sensor segments 180, the order of the image data generated by these light sensor segments must be reversed. Next, the image data generated by all photosensor segments 180 is combined to generate image data representing scan line portion 310 (FIG. 1). Subsequently, the scanning device 102 (FIG. 1)
When moved relative to 4, this process is repeated.

Although the processing of the image data has been schematically described,
Next, the processing will be described in more detail. This process is further illustrated by the flow chart of FIG. The image data is processed by the processor 350 using the first segment 1
Begin by sending an instruction to the first interface module 370 to instruct the first interface module 370 to pass from 85 to the processor 350. The instruction is sent to the first segment 185, and the image data is sent from the first segment 185 to the first interface module 370 via the first data line 355 where the processor 3 via the first interface line 380.
Passed to 50. Next, processor 350 sends an instruction to first interface module 370 to instruct image data to be sent from eighth segment 192. The image data is sent to the first interface module 370 via the eighth data line 362,
Sent to processor 350 via 80. The processor 350 includes a first segment 185 and an eighth segment 19
2 is stored in a separate group for future processing. For example, future processing includes combining image data generated by first segment 185 with image data generated by second segment 186. Finally, the image data generated by all the light sensor segments 180 are combined. The combined image data is image data representing the entire length of scan line portion 310 (FIG. 1) of surface 304.

Similar instructions are sent to the remaining interface modules 378 to retrieve image data from the remaining light sensor segments 180. 2nd segment 186, 3rd segment 187, 12th segment 1
Image data generated by photosensor segments 180 other than 96 and thirteenth segment 197 are output from those segments in the positive x-direction 247. Image data generated by the second segment 186, the third segment 187, the twelfth segment 196, and the thirteenth segment 197 are output from those segments in the negative x direction 248. In other words, the second segment 186, the third segment 187, the twelfth segment 1
The order of the image data output from the 96th and 13th segments 197 is reversed from the order of the image data output from the remaining segments. The inversion of the image data in this manner is because these light sensor segments are oriented in the opposite direction to the other light sensor segments.

The image data output from each photosensor segment is stored in a separate group. Further, the image data generated by each photodetector is stored at a specific location within the appropriate group. In order to take account of the aforementioned inverted image data, the processor 350
Electronically reverses the order of the image data stored in the groups representing the second segment 186, the third segment 187, the twelfth segment 196, and the thirteenth segment 197. When the inversion is completed, the image data in all the groups have the same order. Next, the image data stored in all groups is combined to form scan line portion 310.
Image data representing (FIG. 1) can be configured. For example, the image data at the last position in one group is combined with the first position in an adjacent group. Next, the image data representing scan line portion 310 (FIG. 1) can be processed in a conventional manner. Referring to FIG.
When the scanning device 102 is moved relative to the surface 304,
The above process is repeated, and various scan line portions 310 of surface 304 are imaged.

During the imaging process, the first navigator 154
And the second navigator 156 are connected to the front surface 304 of the sheet 300.
Image data representing two regions (not shown) of FIG. 1 is generated. More specifically, the first navigator 15
Fourth and second navigators 156 generate image data representing slightly different features on surface 304 (FIG. 1). For example, the first navigator 154 and the second navigator 15
6 can generate image data representing the irregularities of the surface 304 (FIG. 1) caused by the pulp material used to make the paper 300. Processor 350
FIG. 3 receives the image data and determines the location of those different features relative to the first navigator 154 and the second navigator 156. As the scanning device 102 (FIG. 1) moves relative to the surface 304, the positions of those different features are determined by the first navigator 154 and the second navigator 1
Move to 56. Processor 350 (FIG. 3)
This movement is analyzed and related to the movement of the scanning device 102 relative to the surface 304. Accordingly, processor 350 (FIG. 3) can easily determine the position of optical assembly 100 (FIG. 1) relative to surface 304 during the imaging process. This positional information is used to determine the position of the scan line portions relative to each other to accurately reproduce an image of surface 304 (FIG. 1). An example of a navigator used with an optical scanner to determine the position of the optical scanner relative to a surface is described in NAVIGATION TECHNIQUE FOR
DETECTING MOVEMENT OF NAVIGATION SENSORS RELATIVE
US Patent No. 5,644,139 to Allen et al. Entitled `` TO ANOBJECT ''
Issue, “FREEHAND IMAGE SCANNING DEVICE WHICH COMPENS
A US Patent No. 5,578,813 to Allen et al. Entitled "ATES FOR NONLINEAR MOVEMENT". All the contents disclosed therein are incorporated herein by reference.

The baffles 271-277 reduce the amount of external light that may intersect the first navigator 154, the second navigator 156, and the light detector 200 of the light sensor segment 180, and ideally Lose. External light does not represent an image of surface 304 (FIG. 1), but when imaged, is processed as image data as if it represented an image of surface 304. The influx of extraneous light ultimately makes the image data representing surface 304 inaccurate.

First baffle 271, second baffle 2
72, third baffle 273 and fourth baffle 27
4 surrounds the first navigator section 150, whereby
External light that interferes with the first navigator 154 is reduced. Similarly, the first baffle 271 and the fifth baffle 2
75, sixth baffle 276 and seventh baffle 27
7 reduces external light that can obstruct the second navigator 156. More baffles can be attached to surface 120 of printed circuit board 110 to reduce external light from interfering with other components. For example, a baffle may be located between the light sensor segment 180 and the LED 250. However, with the addition of the baffle, the width
4 increases. As mentioned above, the baffle can be mounted on the printed circuit board 110 or the housing 104 (FIG. 1).

Having described one embodiment of the optical assembly 100, another embodiment will now be described. FIG. 2 is referred to again. The optical assembly 100 herein has fourteen light sensor segments 180, four of which are oriented in the opposite direction to the remaining light sensor segments 180. Described as It should be understood that the use of fourteen light sensor segments 180 is for illustration only, and that optical assembly 100 may have as many light sensor segments 180 as needed for a particular application. Also, other than the four light sensor segments 180 shown herein may be oriented opposite the remaining light sensor segments 180. For example, if additional space is needed for electronics on surface 120 between first navigator sections 150 and 152, the orientation of the light sensor segment between third segment 187 and twelfth segment 196 may be reversed. Then, those electronic components can be accommodated.

Referring to FIGS. 2 and 3, the orientation of the interface section 202 with respect to the printed circuit board 110 was controlled by the orientation of the optical sensor segment 180. As described above, the image data is processed taking into account the orientation of the light sensor segment 180. For example, the first
The order of the image data output from the segment 185 is opposite to the order of the image data generated by the second segment 186. Another embodiment of the optical assembly 100 eliminates the need to invert image data by using two different types of light sensor segments. The first type of light sensor segment has its interface facing in a first direction, and the second type of light sensor segment has its interface facing in a second direction. The first direction is opposite to the second direction. With respect to the example of FIG. 2, the first segment 185 is a first type of light sensor segment and the second segment 1
86 may be a second type of light sensor segment. Therefore, the first segment 185 and the second segment 185
Image data generated by both segments 186 is output in the same direction, for example, in the positive x-direction 247. In this embodiment, there is no need to process the image data to reverse the order of the image data generated by the opposing light sensor segments.

The aforementioned photosensor segment 180 can be manufactured by providing a photodetector 200 having dual connection pads (or redundant connection pads). For example, a linear array of photodetectors is attached to a conventional photodetector 200. The connection pads are located on only one side of the linear array of photodetectors. The interface section 202 electrically connects to a connection pad that establishes the orientation of the light sensor segment 180. However, the photodetectors can be manufactured with the same connection pads on both sides of the linear array of photodetectors. Thus, the interface section 202 can be mounted on either side of the linear array of photodetectors. Thereby, by selecting the connection pad to which the interface unit 202 is attached, the light sensor segment 1 is selected.
80 can be oriented in either direction.

Having described in detail the exemplary and presently preferred embodiments of the present invention, the concepts of the present invention may be embodied and utilized in various other ways. It will be understood that such variations are included, except to the extent limited by the prior art. In the following, exemplary embodiments comprising combinations of various constituent elements of the present invention will be described. 1. A method of manufacturing an electronic device (100), comprising: providing a substrate (110);
Providing a plurality of optical components (180), each comprising: an interface unit (202) electrically connected to the light detection unit (200); and a second one of the plurality of optical components (180). The first optical component (185) is provided on the substrate (110), and the photodetector (205) is provided on the first substrate (110).
Of the first axis (AA) from the first axis (AA).
And mounting the second optical component (186) of the plurality of optical components (180) on the substrate (110), and the photodetector (226) is mounted on the substrate (110). Aligned along a first axis (AA), said interface portion (226)
A second direction (24) different from the first direction (246)
1. A method comprising the step of: 4) mounting at an offset from said first axis. Attaching the first optical component (185) of the plurality of optical components (180) further comprises aligning the interface section (225) along a second axis (CC); Optical components (1
80) attaching the second optical component (186) further comprises aligning the interface section (226) along a third axis (BB), wherein the second axis (CC) Is substantially parallel to the third axis (BB) and the first axis (AA).
the method of. 3. A substrate (110) and at least one first linear optical component (188) attached to the substrate (110)
And at least one attached to the substrate (110).
And two second linear optical components (186), wherein the at least one first optical component (188) and the at least one second optical component (186) are each provided with a photodetector (205, 206). , The photodetector (205, 20)
6), which are electrically connected to (225,
226), wherein the light detection portion (205) of the at least one first linear optical component (188) is aligned along a first axis (AA) and the at least one second linear optical component (188) is aligned. The light detection unit (20) of the optical component (186)
6) are aligned along the first axis (AA) and the at least one first linear optical component (18)
8) wherein said interface portion (225) is offset from said first axis (AA) in said first direction (246) and said at least one second linear optical component (18).
7) The electronic device (100), wherein the interface unit (226) of (7) is offset from the first axis (AA) in a second direction (244) different from the first direction (246). . 4. The at least one first linear optical component (18
8) wherein the interface portion (225) of the at least one second linear optical component (186) is aligned along a second axis (CC); Aligned along axis (BB), wherein the second axis (CC) is aligned with the third axis (BB)
And substantially parallel to said first axis (AA),
Item 3. The device according to Item 3. 5. The at least one second optical component is the first optical component;
At least two second optical components (187, 196) having interface portions (227, 236) offset in said second direction (244) from the axis (AA) of said at least one first optical component. Optical parts (188)
Are at least two second optical components (187, 1).
96) and the interface portion (2) of the at least two second optical components (187, 196).
27, 236) wherein the space is defined between. 6. The apparatus of claim 5, further comprising at least one first electronic component (253) mounted to the substrate (110) and at least partially disposed within the space. 7. The device of claim 3, wherein the electronic device (100) is optically associated with an optical scanning device. 8. The substrate (11), which includes a substrate (110), a light detection unit (200), and an interface unit (202) electrically connected to the light detection unit (200).
0), a plurality of linear optics (180) attached to the plurality of linear optics (180), wherein each of the photodetectors (200) of the plurality of linear optics (180) is aligned along a first axis (AA). And at least an interface (225, 228) between the first optical component (185) and the second optical component (188) of the plurality of linear optical components (180) is
Offset from the first axis (AA) in a first direction (246) to define a first space therebetween;
At least a third optical component (186) of the plurality of linear optical components (180) and an interface part (226, 227) of a fourth optical component (187) are connected to the first axis (P).
A) offset in a second direction (244) from A) to define a second space therebetween, wherein the first direction (246) is different from the second direction (244). , An electronic device (100). 9. The at least a first optical component (185) and a second optical component (18) of the plurality of linear optical components (180).
8) wherein the interface portions (225, 228) are aligned along a second axis (CC) and the at least third optical component (186) and the fourth optical component (186) of the plurality of linear optical components (180) are aligned. The interfaces (226, 227) of the optical component (187) are aligned along a third axis (BB), and the second axis (CC) is aligned with the third axis (BB) and 9. The apparatus of claim 8, wherein said apparatus is substantially parallel to said first axis (AA). 10. The device of claim 8, wherein the electronic device (100) is optically associated with an optical scanning device.

[0066]

According to the present invention, the components constituting the optical assembly can be arranged at a high density on a single printed circuit board, whereby the size of the optical assembly and, therefore, the mounting of the optical assembly can be mounted. The size of the electronic device can be reduced.

[Brief description of the drawings]

FIG. 1 is a front perspective view of an optical scanning device including a miniaturized optical assembly.

FIG. 2 is a plan view of the optical assembly of FIG. 1;

FIG. 3 is a schematic diagram of the optical assembly of FIG. 1;

FIG. 4 is a flowchart illustrating a method of processing image data generated by the optical assembly of FIG.

[Explanation of symbols]

 Reference Signs List 100 electronic device 110 substrate 180, 185, 186, 188 optical component 200, 205, 206 photodetector 202, 225, 226 interface 244 second direction 246 first direction

Continued on the front page (72) Inventor David S. Oliver, South Francis Avenue 304, Milliken, 80543, Colorado, USA (72) Inventor Philip E. Jensen, 80512, Bellevue, Wrist Canyon, Colorado, United States of America・ Road ・ 12137

Claims (1)

[Claims] 1. A method for manufacturing an electronic device (100), comprising: providing a substrate (110); a photodetector (200); and electrically connected to the photodetector (200). Providing a plurality of optical components (180) each including an interface unit (202); and a first optical component (18) of the plurality of optical components (180).
5) on the substrate (110),
5) is aligned along a first axis (AA), the interface part (225) of which is aligned with the first axis (A).
A) mounting in a first direction (246) offset from A); and a second optical component (18) of the plurality of optical components (180).
6) on the substrate (110), and the photodetector (22).
6) is aligned along said first axis (AA);
The interface unit (226) is configured to move the first direction in a second direction (244) different from the first direction (246).
Mounting with offset from the axis of the body