JP2001219988A - Taping mechanism for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a taping mechanism for an electronic part provided with the superior supporting strength not generating transverse deflection or distortion even when an external force is exerted thereon during the storage and conveyance. SOLUTION: A section wider than the width of a lead between a part main body and a tape member is formed on a section adhesively clamped by the tape member at least on one lead, out of a plurality of leads extended from the part main body of the electronic part. The total area of the wide section is preferably in the range of 60-80% of a rectangular area provided with the lateral length forming the interval of the leads on both ends in the longitudinal direction of the tape member and the longitudinal length forming the width of an adhesive tape from the viewpoint of the balance between the taping efficiency and the supporting strength.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a taping mechanism for an electronic component in which leads extend from a component body, and more particularly, to a tape member in which leads are firmly adhered and held, so that the electronic components are free from side skew and twist. It relates to a taping mechanism.

[0002]

2. Description of the Related Art Lead type light emitting diodes (LED: Li
ght Emitting Diodes and small electronic components such as tantalum capacitors are stored and transported in a state where a large number of tapes are taped at predetermined intervals on a long tape member, and are mounted on an automatic mounting device called a mounter or insert machine. It is automatically attached to such as.

FIG. 6 shows a typical conventional example in which electronic parts are taped on a tape member. The electronic component 1 has a component body 11 in which a semiconductor element or the like is sealed with a resin, and two leads 12 and 13 extending from the bottom surface. Tape member 2
Is formed of a long, band-shaped mount 21 and an adhesive tape 22 narrower than that, and tape feed guide holes 23 are formed at regular intervals. When the adhesive tape 22 is adhered to the mount 21 by a taping machine (not shown), the leads 12 and 13 are sandwiched between the mount 21 and the adhesive tape 22, and the leads 12 and 13 are adhesively sandwiched between the mount 21 and the adhesive tape 22. The electronic component 1 is supported.

[0004]

In such a conventional taping mechanism, the supporting strength of the electronic component by the tape member is determined by the lengths of the leads 12 and 13 which are adhesively held between the backing sheet 21 and the adhesive tape 22. Therefore, when the leads 12 and 13 are taped such that the lower ends of the leads 12 and 13 exceed the lower ends of the adhesive tape 22 as shown in FIG.

However, in reality, when an external force is applied to the electronic component when the electronic component is stored and transported in a taped state, the electronic component may be laterally skewed or twisted even in a state where the supporting strength is strongest. For this reason, there has been a problem that the electronic component cannot be gripped by the automatic mounting device, or the electronic component cannot be accurately mounted on the printed circuit board.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and has been made in consideration of the above problems, and has been made in view of the above-described problems. Its purpose is to provide a mechanism.

[0007]

According to the present invention, a plurality of leads extending from a component body of an electronic component are taped and held by a tape member composed of a mount and an adhesive tape to support the electronic component. A mechanism, wherein a wide portion between the component body and the tape member, which is wider than the width of the lead, is formed at a portion of at least one of the leads where the lead is adhesively sandwiched. Is provided. If the width of the lead between the component body and the tape member is not constant, the width in the present invention means the narrowest width.

At this time, from the viewpoint of the taping efficiency and the supporting strength of the electronic component, the total area of the wide portion is defined by a rectangle in which the distance between leads at both ends in the longitudinal direction of the tape member is set to be horizontal and the width of the adhesive tape is set to be vertical. 60-80% of the area of
Is preferably within the range.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The present inventor has conducted intensive studies on how to tap an electronic component so that it does not cause sideways or twisting even when an external force is applied during storage and transportation. Although it is seemingly simple to increase the bonding area of the lead with the tape member, the present invention has been made based on a concept which has not been noticed at all until the present inventors know.

That is, a major feature of the present invention is that a portion having a width wider than the width of the lead between the component body and the tape member is formed in a portion where the lead is adhesively held by the tape member, The purpose of the present invention is to increase the bonding area of the lead in the above.

One embodiment of the taping mechanism of the present invention is shown in FIG. FIG. 1 is a state diagram where the electronic component 1 is taped. The electronic component 1 has a component main body 11 and two parallel leads 12 and 13 extending downward from the bottom of the component main body 11, and an intermediate portion between the leads 12 and 13 has an adhesive tape width l. Wide sections 14, 14 'are formed in which the lead width is increased in the lead opposing direction by the length section of. When the adhesive tape 21 is attached to the mount 21, the electronic component 1 is sandwiched therebetween so that the entire area of the wide portions 14, 14 ′ adheres to the adhesive tape 21.
The electronic components 1 are supported by holding the leads 12, 13 with the adhesive tape 22. FIG. 2 is a front view showing a state where the electronic component 1 is supported by the tape member 22. In the electronic component 1 of FIG. 2, the wide portions 14 and 14 ′ having a width m are formed on the leads in the length section of the adhesive tape width l, so that the leads and the adhesive tape are compared with the conventional taping in which the wide portions are not formed. And the area of adhesion increases by 1 × m. Due to the increase in the bonding area, the electronic component 1 is more strongly supported by the tape member 22.

Although the total area of the wide portion is not particularly limited,
It is preferable that the distance between the leads at both ends in the longitudinal direction of the tape member is the horizontal length, and the width of the adhesive tape is 60 to 80% of the area of the rectangle having the vertical length. More preferably, it is in the range of 65 to 75%. If the total area of the wide portion is larger than 80% of the area of the rectangle, the lead-side ends may come into contact with each other during storage, transportation, taping, and the like of the electronic component, and the storage efficiency of the electronic component may be deteriorated. On the other hand, if it is smaller than 60%, the effect of the present invention of strengthening the support of electronic components may not be sufficiently obtained. The area of a rectangle in which the interval between the leads at both ends in the longitudinal direction of the tape member is the horizontal length n and the width of the adhesive tape is the vertical length 1 is specifically shown as a hatched portion in FIG. FIG. 3A shows a case where there are two leads. FIG. 3B shows a case where there are four leads.

In manufacturing a lead to be described later, it is necessary to provide a gap of at least the thickness of the lead between adjacent wide portions. However, the width of the wide portion does not need to be equal for each lead. May be provided with a wide portion and not provided on the other. The shape and number of the wide portions are not limited, and may be appropriately determined in consideration of the shape and weight of the electronic component, the number of leads, and the like.

FIG. 4 shows another embodiment of an electronic component usable in the present invention. FIG. 4 is a front view of the electronic component, and a broken line indicates a position of the adhesive tape. The electronic component in FIG.
A wide portion 14 is formed in one lead 12 in the section of the adhesive tape width, and a wide portion is not formed in the other lead 13. The electronic component shown in FIG. 3B has wide portions 14, 1 having a width increased to the left and right of the lead in the section of the adhesive tape width.
4 ′. At this time, if the width p of the wide portion in the direction opposite to the lead opposing direction is increased and the side ends of the leads 12 and 13 are projected outside the outer edge of the component body 1 in plan view, the electronic component 1 is stored. The side ends of the leads come into contact with each other at the time of transport, taping, etc., and the storage efficiency of the electronic component becomes poor. It is desirable to be inside. Also, the electronic component shown in FIG. 3C has wide portions 14 and 14 ′ formed in a portion to be adhered with the adhesive tape 22 when the leads 12 and 13 are inserted only up to about half the width of the adhesive tape. .
The electronic component shown in FIG. 1D has a plurality of wide portions 14 and 14 ′ formed in the adhesive tape width section.

Although there is no particular limitation on the method of manufacturing the electronic component used in the present invention, it can be manufactured, for example, as follows. As shown in FIG. 5, a lead frame 10 in which a pair of leads 12 and 13 constituting an electronic component are connected at a predetermined interval is punched from a thin metal plate (FIG. 5A). At this time, the wide portions 14, 14 ′ are provided at predetermined positions of the leads 12, 13.
Are also formed at the same time. Divers 101 and 102 for connecting the leads in the lateral direction are formed at the middle and lower ends of the lead frame 10, respectively, to prevent the lead pairs from shifting during the formation of the sealing body. Lead frame 1
The shape of 0 can be made desired by adjusting the shape of the punching die.

Next, the electronic component 1 is a light emitting diode (LE).
In the case of D), for example, a conductive adhesive such as Ag paste is applied to the tip of one of the leads 12 of the pair of leads.
The ED element 3 is fixed, and the upper electrode of the LED element 3 and the tip of the other lead 13 are connected by a bonding wire 4 (FIG. 2B).

On the other hand, each concave portion 1 of a resin mold 103 made of polycarbonate or the like having a plurality of concave portions 104 provided at the same interval as the formation interval of the pair of leads 12 and 13.
04 is filled with a transparent thermosetting resin such as an epoxy resin (FIG. 3C). Next, LE of the lead frame 10
The part on which the D element 3 is mounted is inserted into the concave portion 104, and the thermosetting resin is heated and cured to seal the LED element 3 and at the same time to mount the component body 11 made of a rocket-shaped sealing body that functions as a lens. (FIG. 3D). Thereafter, the lead frame 10 is pulled out of the resin mold 103, and the tie bars 101 and 102 are cut and removed while leaving a necessary portion of the lead frame 10, thereby completing the electronic component 1 used in the present invention (FIG. 3E). In addition to such a manufacturing method, a sealed body may be formed by, for example, a transfer molding method.

The electronic component supported by the taping mechanism of the present invention is attached to an automatic mounting device or the like, and when mounted on a circuit board or the like, the lead is cut above the upper end of the tape member and separated from the tape member. Is carried to a predetermined position on the circuit board by a gripping arm of an automatic mounting device and mounted.

[0019]

According to the taping mechanism of the present invention, at least one of a plurality of leads extending from the component body of the electronic component, the component body and the tape are attached to the portion which is adhesively held by the tape member. Since the wide portion wider than the lead width between the members is formed, excellent supporting strength of the electronic component is exhibited, and there is no occurrence of lateral displacement or twisting even when an external force is applied during storage and transportation.

At this time, the total area of the wide portion is defined as the distance between the leads at both ends in the longitudinal direction of the tape member as the horizontal length,
60 to 8 of the rectangular area with the width of the adhesive tape as vertical
When it is in the range of 0%, the supporting strength of the electronic component can be improved without lowering the taping efficiency of the electronic component.

[Brief description of the drawings]

FIG. 1 is a diagram showing a state in which an electronic component is taped;

FIG. 2 is a front view of a state where the electronic component is supported by a tape member.

FIG. 3 is a diagram showing a rectangular area defined by the present invention.

FIG. 4 is a front view showing another embodiment of the wide portion.

FIG. 5 is a process chart showing an example of manufacturing an electronic component.

FIG. 6 is a state diagram showing a conventional taping.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Tape member 3 LED element 4 Bonding wire 10 Lead frame 11 Component main body 12, 13 Lead 14, 14 'Wide part 21 Mount 22 Adhesive tape 23 Tape feed guide hole

Claims (2)

[Claims] 1. A taping mechanism for supporting an electronic component by holding a plurality of leads extending from a component body of an electronic component by a tape member made of a mount and an adhesive tape, and supporting the electronic component, wherein at least one of the leads is provided. An electronic component taping mechanism, wherein a wide portion between the component body and the tape member, which is wider than the width of the lead, is formed in a portion of the book lead that is adhered and held. 2. The total area of the wide portion is in the range of 60 to 80% of the area of a rectangle in which the distance between the leads at both ends in the longitudinal direction of the tape member is the horizontal length and the width of the adhesive tape is the vertical length. Item 7. A taping mechanism according to Item 1.