JP2001217071A - Manufacturing method of organic el element - Google Patents
Manufacturing method of organic el elementInfo
- Publication number
- JP2001217071A JP2001217071A JP2000030199A JP2000030199A JP2001217071A JP 2001217071 A JP2001217071 A JP 2001217071A JP 2000030199 A JP2000030199 A JP 2000030199A JP 2000030199 A JP2000030199 A JP 2000030199A JP 2001217071 A JP2001217071 A JP 2001217071A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- laminate
- manufacturing
- inert liquid
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 17
- 239000012044 organic layer Substances 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 239000002250 absorbent Substances 0.000 claims description 3
- 230000002745 absorbent Effects 0.000 claims description 3
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 abstract description 10
- 239000002274 desiccant Substances 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 230000005525 hole transport Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、陰極と陽極とに挟
持され所定の発光をなす有機層を、外気から遮断する気
密容器内に収納する有機エレクトロルミネッセンス素子
（以下、有機ＥＬ素子という）の製造方法に関し、特
に、長期に渡り安定した発光特性が得られる有機ＥＬ素
子の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent device (hereinafter, referred to as an organic EL device) in which an organic layer which emits a predetermined light and is sandwiched between a cathode and an anode is housed in a hermetically sealed container which is shielded from the outside air. More particularly, the present invention relates to a method for manufacturing an organic EL device capable of obtaining stable light-emitting characteristics over a long period of time.
【０００２】[0002]
【従来の技術】有機ＥＬ素子１は、図４に示すように、
ガラス材料からなる支持基板（透光性の支持基板）２上
にＩＴＯ（indium tin oxide）等によって透明電極（陽
極）３を形成し、この透明電極３上に正孔注入層４，正
孔輸送層５，発光層６及び電子輸送層７を順次積層して
有機層８を形成し、この有機層８上にアルミ（Al）等の
非透光性の背面電極（陰極）９を形成し、有機層８を透
明電極３と背面電極９とによって挟持してなる積層体１
０を覆うようにガラス材料からなる凹部形状の封止キャ
ップ（封止部材）１１を支持基板２上に紫外線（以下、
ＵＶという）硬化性接着剤１２を介して気密的に配設す
ることで構成されるものである。2. Description of the Related Art As shown in FIG.
A transparent electrode (anode) 3 is formed by ITO (indium tin oxide) or the like on a supporting substrate (translucent supporting substrate) 2 made of a glass material, and a hole injection layer 4 and a hole transport are formed on the transparent electrode 3. Layer 5, light-emitting layer 6, and electron transport layer 7 are sequentially laminated to form an organic layer 8, and a non-translucent back electrode (cathode) 9 of aluminum (Al) or the like is formed on organic layer 8, A laminate 1 in which an organic layer 8 is sandwiched between a transparent electrode 3 and a back electrode 9
0, a sealing cap (sealing member) 11 made of a glass material and having a recessed shape made of a glass material
It is configured by airtightly arranging through a curable adhesive 12 (referred to as UV).
【０００３】このような有機ＥＬ素子１は、支持基板２
と封止キャップ１１とで気密容器１３を構成し、この気
密容器１３内に積層体１０を収納する収納空間Ｓを備え
ることで、積層体１０を外気から遮断する構造を得てい
る。この収納空間Ｓには、有機層８における薄膜材料の
劣化や変質が生じないように、水分を吸収する吸収剤を
含有する不活性液体からなる乾燥部材１４が封止キャッ
プ１１に形成された孔部１５を介して注入され、乾燥部
材１４を注入した後に、この孔部１５にエポキシ樹脂系
接着剤１６等を塗布し、孔部１５を塞ぐものである。
尚、このような構成の有機ＥＬ素子１としては、特開平
８−７８１５９号公報や特開平９−３５８６８号公報等
に開示されている。[0003] Such an organic EL element 1 comprises a support substrate 2
By forming a hermetic container 13 with the sealing cap 11 and providing a storage space S for accommodating the laminated body 10 in the hermetic container 13, a structure in which the laminated body 10 is shielded from the outside air is obtained. In this storage space S, a drying member 14 made of an inert liquid containing an absorbent for absorbing moisture is formed in the sealing cap 11 so that the thin film material in the organic layer 8 does not deteriorate or deteriorate. After being injected through the portion 15 and injecting the drying member 14, an epoxy resin adhesive 16 or the like is applied to the hole 15 to close the hole 15.
The organic EL device 1 having such a configuration is disclosed in Japanese Patent Application Laid-Open Nos. 8-78159 and 9-35868.
【０００４】[0004]
【発明が解決しようとする課題】このような構造の有機
ＥＬ素子１は、液状の乾燥部材１４を収納空間Ｓ内に注
入する場合に、注入用の孔部１５が必要となり、封止キ
ャップ１１の構造を複雑にするばかりでなく、製造工程
も煩雑にしてしまい、有機ＥＬ素子１としてのコストを
高くしてしまうといった問題点を有している。In the organic EL element 1 having such a structure, when the liquid drying member 14 is injected into the storage space S, an injection hole 15 is required, and the sealing cap 11 is required. In addition to complicating the structure, the manufacturing process is complicated and the cost of the organic EL element 1 is increased.
【０００５】そこで、本発明は、有機ＥＬ素子の構造を
簡素化し、低コストの有機ＥＬ素子が得られる有機ＥＬ
素子の製造方法を提供するものである。Accordingly, the present invention provides an organic EL device in which the structure of the organic EL device is simplified and a low-cost organic EL device is obtained.
It is intended to provide a method for manufacturing an element.
【０００６】[0006]
【課題を解決するための手段】本発明は、前記課題を解
決するため、少なくとも発光層を有する有機層を陽極と
陰極とで挟持した積層体を、外気から遮断する気密容器
内に配設する有機ＥＬ素子の製造方法であって、透光性
の支持基板上に前記積層体を形成する第１工程と、凹部
を有する封止部材を用意し、水分を吸収する吸収剤を含
有する不活性液体からなる乾燥部材を前記凹部に注入す
る第２工程と、前記封止部材の前記凹部と前記積層体と
が対向するように、前記封止部材上に前記支持基板を気
密的に配設し、前記積層体を収納する前記気密容器を形
成する第３工程と、を含むことを特徴とするものであ
る。According to the present invention, in order to solve the above-mentioned problems, a laminate in which at least an organic layer having a light emitting layer is sandwiched between an anode and a cathode is disposed in an airtight container which is shielded from the outside air. A method of manufacturing an organic EL device, comprising: a first step of forming the laminate on a light-transmitting support substrate; and an inert member containing a sealing member having a concave portion and absorbing a moisture. A second step of injecting a drying member made of a liquid into the concave portion, and hermetically disposing the support substrate on the sealing member so that the concave portion of the sealing member and the laminate face each other. And a third step of forming the hermetic container accommodating the laminated body.
【０００７】また、前記第２工程は、前記第２工程は、
前記不活性液体の熱膨張を吸収する熱膨張吸収空間を前
記気密容器内に形成するように前記不活性液体を注入し
てなるものである。[0007] The second step may include:
The inert liquid is injected so that a thermal expansion absorption space for absorbing the thermal expansion of the inert liquid is formed in the hermetic container.
【０００８】また、前記不活性液体の使用温度での体積
が、前記気密容器における前記積層体を収納する収納空
間の体積を超えないように、前記熱膨張吸収空間を形成
してなるものである。Further, the thermal expansion absorption space is formed so that the volume of the inert liquid at the use temperature does not exceed the volume of the storage space for storing the laminate in the airtight container. .
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づき説明するが、従来例と同一もしくは相当箇
所には同一符号を付してその詳細な説明は省く。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
【００１０】有機ＥＬ素子１７は、前述した有機ＥＬ素
子１と同様に、支持基板２上に透明電極３，有機層（正
孔注入層４，正孔輸送層５，発光層６及び電子輸送層
７）８及び背面電極９を順次積層して積層体１０を形成
し、この積層体１０を、支持基板２上にＵＶ硬化性接着
剤１２を介して凹部形状のガラス材料からなる封止キャ
ップ１８を気密的に配設することによって得られる気密
容器１３内に収納することで構成される。また、気密容
器１３における収納空間Ｓには、活性アルミナやケイソ
ウ土、活性炭等の吸着剤を含有する不活性液体(例えば
ダイキン工業（株）製、商品名デムナルＳ−２０)から
なる乾燥部材１４が所定量注入されている。The organic EL element 17 comprises a transparent electrode 3, an organic layer (a hole injection layer 4, a hole transport layer 5, a light emitting layer 6, and an electron transport layer) on a support substrate 2, similarly to the above-described organic EL element 1. 7) A laminated body 10 is formed by sequentially laminating 8 and the back electrode 9, and the laminated body 10 is placed on the supporting substrate 2 via a UV-curable adhesive 12 with a sealing cap 18 made of a concave glass material. Is housed in an airtight container 13 obtained by arranging airtightly. A drying member 14 made of an inert liquid containing an adsorbent such as activated alumina, diatomaceous earth, and activated carbon (for example, trade name Demnal S-20 manufactured by Daikin Industries, Ltd.) is provided in the storage space S of the airtight container 13. Is injected in a predetermined amount.
【００１１】乾燥部材１４は、気密容器１３内に前記不
活性液体の熱膨張を吸収する熱膨張吸収空間ＳＳを形成
するように所定量注入される。即ち前記不活性液体の使
用温度（有機ＥＬ素子１７の使用温度、例えば−１０℃
〜８０℃）での体積が、気密容器１３における積層体１
０を収納する収納空間Ｓの体積を超えないように熱膨張
吸収空間ＳＳを形成してなるものである。The drying member 14 is injected into the airtight container 13 in a predetermined amount so as to form a thermal expansion absorption space SS for absorbing the thermal expansion of the inert liquid. That is, the temperature at which the inert liquid is used (the temperature at which the organic EL element 17 is used, for example, −10 ° C.)
(80 ° C.), the volume of the laminate 1 in the hermetic container 13
The thermal expansion absorption space SS is formed so as not to exceed the volume of the storage space S for storing 0.
【００１２】前述した各部によって有機ＥＬ素子１７が
構成されるものであり、透明電極３及び背面電極９から
支持基板２に端部に夫々引き出し形成された電極端子部
（図示しない）に直流電圧を印加することによって、所
定の発光をなす。An organic EL element 17 is constituted by the above-described components. A DC voltage is applied from the transparent electrode 3 and the back electrode 9 to electrode terminals (not shown) formed at the ends of the support substrate 2 at the ends. By applying the light, predetermined light emission is performed.
【００１３】次に、図２及び図３を用いて本発明の実施
の形態における有機ＥＬ素子１７の製造方法を説明す
る。Next, a method of manufacturing the organic EL device 17 according to the embodiment of the present invention will be described with reference to FIGS.
【００１４】まず、透光性の支持基板２上に、透明電極
３，正孔注入層４，正孔輸送層５，発光層６及び電子輸
送層７を真空蒸着法にて順次積層して有機層８を形成
し、この有機層８上にアルミ（Al）等の非透光性の背面
電極（陰極）９を形成し、有機層８を透明電極３と背面
電極９とによって挟持してなる積層体１０を形成する
「積層体形成工程（第１工程）Ｓ１」。First, a transparent electrode 3, a hole injecting layer 4, a hole transporting layer 5, a light emitting layer 6, and an electron transporting layer 7 are sequentially laminated on a translucent support substrate 2 by a vacuum vapor deposition method. A layer 8 is formed, a non-light-transmitting back electrode (cathode) 9 made of aluminum (Al) or the like is formed on the organic layer 8, and the organic layer 8 is sandwiched between the transparent electrode 3 and the back electrode 9. “Laminated body forming step (first step) S1” for forming the laminated body 10.
【００１５】次に、サンドブラスト法やエッチング処理
の適宜方法によって形成される凹部１８ａを有する封止
キャップ１８を用意し、酸素濃度が１ｐｐｍ以下の窒素
雰囲気中において、封止キャップ１８の凹部１８ａに所
定量の乾燥部材１４を注入する「乾燥部材注入工程（第
２工程）Ｓ２」。Next, a sealing cap 18 having a concave portion 18a formed by an appropriate method such as a sand blasting method or an etching process is prepared, and is placed in the concave portion 18a of the sealing cap 18 in a nitrogen atmosphere having an oxygen concentration of 1 ppm or less. “Drying member injection step (second step) S2” for injecting a fixed amount of the drying member 14.
【００１６】次に、同雰囲気中において、封止キャップ
１８の支持基板２と接触する接触面１８ｂに、ＵＶ硬化
性接着剤１２を所定量塗布するとともに「接着剤塗布工
程Ｓ３」、封止キャップ１８の凹部１８ａと、支持基板
２上に形成された積層体１０とが対向するように、封止
キャップ１８の接触面１８ｂ上に支持基板２を配設し、
両部材の接合部にＵＶを照射することによって、封止キ
ャップ１８と支持基板２とを気密的に接合する「接合工
程（第３工程）Ｓ４」。Next, in the same atmosphere, a predetermined amount of the UV-curable adhesive 12 is applied to the contact surface 18b of the sealing cap 18 which comes into contact with the support substrate 2, and an "adhesive applying step S3" is performed. The support substrate 2 is disposed on the contact surface 18b of the sealing cap 18 so that the concave portion 18a of the seal 18 and the laminate 10 formed on the support substrate 2 face each other.
A “joining step (third step) S4” in which the sealing cap 18 and the support substrate 2 are hermetically joined by irradiating UV to a joint portion of both members.
【００１７】以上の各製造工程を経て、乾燥部材１４の
不活性液体の熱膨張を吸収する熱膨張吸収空間ＳＳを備
え、かつ従来のように乾燥部材１４の注入のための孔部
１５を備えない有機ＥＬ素子１７が得られるものであ
る。Through the above manufacturing steps, a thermal expansion absorption space SS for absorbing the thermal expansion of the inert liquid in the drying member 14 is provided, and a hole 15 for injecting the drying member 14 is provided as in the related art. No organic EL element 17 can be obtained.
【００１８】かかる有機ＥＬ素子１７の製造方法は、酸
素濃度が１ｐｐｍ以下の窒素雰囲気中において、乾燥部
材１４を封止キャップ１８の凹部１８ａに注入する乾燥
部材注入工程を採用することによって、従来のような孔
部１５を形成しなくとも積層体１０が配設される収納空
間Ｓ内に乾燥部材１４を注入することが可能となり、封
止キャップ１８の構造を簡素化することができ、有機Ｅ
Ｌ素子１７としてのコストを低減することが可能とな
る。The method of manufacturing the organic EL element 17 adopts a conventional drying member injection step of injecting the drying member 14 into the concave portion 18a of the sealing cap 18 in a nitrogen atmosphere having an oxygen concentration of 1 ppm or less. It is possible to inject the drying member 14 into the storage space S in which the laminated body 10 is disposed without forming such a hole 15, so that the structure of the sealing cap 18 can be simplified and the organic E
The cost as the L element 17 can be reduced.
【００１９】また、有機ＥＬ素子１７の製造方法は、積
層体１０を収納する収納空間Ｓに、乾燥部材１４の注入
量を調整することで熱膨張吸収空間ＳＳを形成するもの
で、乾燥部材１４の注入量は、有機ＥＬ素子１７の使用
温度における不活性液体の熱膨張を考慮し、前記不活性
液体の体積が気密容器１３の収納空間Ｓの体積を超えな
いように熱膨張吸収空間ＳＳを形成することから、前記
不活性液体に熱膨張が生じても接着剤１２による接合箇
所におけるシール剥離等の発生がなく収納空間Ｓにおけ
る気密性を良好に確保することが可能でありまた、本発
明の実施の形態のようにガラス材料から構成される気密
容器１３の割れの発生を確実に防止することが可能とな
る。In the method of manufacturing the organic EL element 17, the thermal expansion absorption space SS is formed by adjusting the injection amount of the drying member 14 in the storage space S for storing the laminated body 10. In consideration of the thermal expansion of the inert liquid at the temperature at which the organic EL element 17 is used, the thermal expansion absorption space SS is set so that the volume of the inert liquid does not exceed the volume of the storage space S of the airtight container 13. Due to the formation, even if thermal expansion occurs in the inert liquid, it is possible to ensure good airtightness in the storage space S without occurrence of seal peeling or the like at a joint portion by the adhesive 12. It is possible to reliably prevent the occurrence of cracks in the airtight container 13 made of a glass material as in the embodiment.
【００２０】尚、本発明の実施の形態では、封止キャッ
プ１８に凹部１８ａを一体に備えるものを示している
が、封止キャップを平板部とステム部（支持部）とから
構成し、前記平板部と前記ステム部とで凹部形状を得る
のであっても良い。In the embodiment of the present invention, the sealing cap 18 is provided integrally with the concave portion 18a. However, the sealing cap is composed of a flat plate portion and a stem portion (support portion). A concave shape may be obtained by the flat plate portion and the stem portion.
【００２１】[0021]
【発明の効果】本発明は、少なくとも発光層を有する有
機層を陽極と陰極とで挟持した積層体を、外気から遮断
する気密容器内に配設する有機ＥＬ素子の製造方法であ
って、透光性の支持基板上に前記積層体を形成する第１
工程と、凹部を有する封止部材を用意し、水分を吸収す
る吸収剤を含有する不活性液体からなる乾燥部材を前記
凹部に注入する第２工程と、前記封止部材の前記凹部と
前記積層体とが対向するように、前記封止部材上に前記
支持基板を気密的に配設し、前記積層体を収納する前記
気密容器を形成する第３工程と、を含むものであり、有
機ＥＬ素子の製造工程及び素子構造を簡素化することが
でき、低コストの有機ＥＬ素子を提供することが可能と
なる。According to the present invention, there is provided a method for producing an organic EL device in which a laminate in which at least an organic layer having a light emitting layer is sandwiched between an anode and a cathode is disposed in an airtight container which is shielded from the outside air. A first method for forming the laminate on an optical support substrate;
A step of preparing a sealing member having a concave portion, and injecting a drying member made of an inert liquid containing an absorbent that absorbs moisture into the concave portion; A third step of hermetically arranging the support substrate on the sealing member so as to face the body, and forming the hermetic container accommodating the laminate. The element manufacturing process and element structure can be simplified, and a low-cost organic EL element can be provided.
【００２２】また、前記気密容器内に、前記不活性液体
の熱膨張による体積変化を吸収する熱膨張吸収空間を備
えることにより、有機ＥＬ素子における接着剤による接
合箇所（支持基板と封止部材との接合部）の気密を良好
に確保するとともに、前記気密容器の割れの発生を確実
に防止することが可能となる。Further, by providing a thermal expansion absorption space for absorbing a volume change due to thermal expansion of the inert liquid in the hermetic container, a joining portion of the organic EL element by an adhesive (the supporting substrate and the sealing member are not connected to each other). And the airtight container can be reliably prevented from cracking.
【図１】本発明の実施の形態の有機ＥＬ素子を示す要部
断面図。FIG. 1 is a sectional view of a main part showing an organic EL element according to an embodiment of the present invention.
【図２】同上実施の形態の有機ＥＬ素子の製造方法を示
す図。FIG. 2 is a diagram showing a method for manufacturing the organic EL element of the embodiment.
【図３】同上実施の形態の有機ＥＬ素子の製造工程を示
す図。FIG. 3 is a view showing a manufacturing process of the organic EL element of the embodiment.
【図４】従来の有機ＥＬ素子を示す要部断面図。FIG. 4 is a sectional view of a main part showing a conventional organic EL element.
【符号の説明】 ２ 支持基板 ３ 透明電極（陽極） ４ 正孔注入層 ５ 正孔輸送層 ６ 発光層 ７ 電子輸送層 ８ 有機層 ９ 背面電極（陰極） １０ 積層体 １３ 気密容器 １４ 乾燥部材 １７ 有機ＥＬ素子 １８ 封止キャップ（封止部材） Ｓ 収納空間 ＳＳ 熱膨張吸収空間[Description of Signs] 2 Support substrate 3 Transparent electrode (anode) 4 Hole injection layer 5 Hole transport layer 6 Emitting layer 7 Electron transport layer 8 Organic layer 9 Back electrode (cathode) 10 Laminate 13 Airtight container 14 Drying member 17 Organic EL element 18 Sealing cap (sealing member) S Storage space SS Thermal expansion absorption space
Claims (3)
と陰極とで挟持した積層体を、外気から遮断する気密容
器内に配設する有機ＥＬ素子の製造方法であって、 透光性の支持基板上に前記積層体を形成する第１工程
と、凹部を有する封止部材を用意し、水分を吸収する吸
収剤を含有する不活性液体からなる乾燥部材を前記凹部
に注入する第２工程と、前記封止部材の前記凹部と前記
積層体とが対向するように、前記封止部材上に前記支持
基板を気密的に配設し、前記積層体を収納する前記気密
容器を形成する第３工程と、を含むことを特徴とする有
機ＥＬ素子の製造方法。1. A method of manufacturing an organic EL device, comprising: placing a laminate in which an organic layer having at least a light emitting layer is sandwiched between an anode and a cathode in an airtight container that is shielded from the outside air. A first step of forming the laminate on a substrate, and a second step of preparing a sealing member having a concave portion and injecting a drying member made of an inert liquid containing an absorbent for absorbing moisture into the concave portion. A third step of airtightly disposing the support substrate on the sealing member so that the concave portion of the sealing member and the laminate face each other, and forming the hermetic container accommodating the laminate. And a method for manufacturing an organic EL device.
張を吸収する熱膨張吸収空間を前記気密容器内に形成す
るように前記不活性液体を注入してなることを特徴とす
る請求項１に記載の有機ＥＬ素子の製造方法。2. The method according to claim 1, wherein in the second step, the inert liquid is injected so as to form a thermal expansion absorption space in the airtight container for absorbing thermal expansion of the inert liquid. Item 2. The method for producing an organic EL device according to Item 1.
前記気密容器における前記積層体を収納する収納空間の
体積を超えないように、前記熱膨張吸収空間を形成して
なることを特徴とする請求項２に記載の有機ＥＬ素子の
製造方法。3. The volume of the inert liquid at a use temperature is:
The method for manufacturing an organic EL device according to claim 2, wherein the thermal expansion absorption space is formed so as not to exceed a volume of a storage space for storing the laminated body in the airtight container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030199A JP2001217071A (en) | 2000-02-02 | 2000-02-02 | Manufacturing method of organic el element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030199A JP2001217071A (en) | 2000-02-02 | 2000-02-02 | Manufacturing method of organic el element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001217071A true JP2001217071A (en) | 2001-08-10 |
Family
ID=18555242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000030199A Pending JP2001217071A (en) | 2000-02-02 | 2000-02-02 | Manufacturing method of organic el element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001217071A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009139292A1 (en) | 2008-05-12 | 2009-11-19 | 財団法人山形県産業技術振興機構 | Organic el light emitting device and process for producing the organic el light emitting device |
| WO2009139291A1 (en) | 2008-05-12 | 2009-11-19 | 財団法人山形県産業技術振興機構 | Organic el panel manufacturing method and manufacturing device |
| JP2013065549A (en) * | 2011-08-26 | 2013-04-11 | Semiconductor Energy Lab Co Ltd | Light emitting module, light emitting device, method of manufacturing light emitting module, and method of manufacturing light emitting device |
| CN104393187A (en) * | 2014-11-17 | 2015-03-04 | 合肥鑫晟光电科技有限公司 | Package substrate and preparation method thereof and OLED (Organic Light Emitting Diode) display device |
| CN110635065A (en) * | 2019-09-26 | 2019-12-31 | 京东方科技集团股份有限公司 | Flexible display device, preparation method thereof and display device |
-
2000
- 2000-02-02 JP JP2000030199A patent/JP2001217071A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009139292A1 (en) | 2008-05-12 | 2009-11-19 | 財団法人山形県産業技術振興機構 | Organic el light emitting device and process for producing the organic el light emitting device |
| WO2009139291A1 (en) | 2008-05-12 | 2009-11-19 | 財団法人山形県産業技術振興機構 | Organic el panel manufacturing method and manufacturing device |
| US8563112B2 (en) | 2008-05-12 | 2013-10-22 | Yamagata Promotional Organization For Industrial Technology | Organic EL light-emitting device and method for manufacturing the organic EL light-emitting device |
| JP2013065549A (en) * | 2011-08-26 | 2013-04-11 | Semiconductor Energy Lab Co Ltd | Light emitting module, light emitting device, method of manufacturing light emitting module, and method of manufacturing light emitting device |
| US9577219B2 (en) | 2011-08-26 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting module, light-emitting device, method of manufacturing the light-emitting module, and method of manufacturing the light-emitting device |
| CN104393187A (en) * | 2014-11-17 | 2015-03-04 | 合肥鑫晟光电科技有限公司 | Package substrate and preparation method thereof and OLED (Organic Light Emitting Diode) display device |
| CN104393187B (en) * | 2014-11-17 | 2018-09-11 | 合肥鑫晟光电科技有限公司 | A kind of package substrate and preparation method thereof, OLED display |
| CN110635065A (en) * | 2019-09-26 | 2019-12-31 | 京东方科技集团股份有限公司 | Flexible display device, preparation method thereof and display device |
| CN110635065B (en) * | 2019-09-26 | 2022-08-12 | 京东方科技集团股份有限公司 | Flexible display device, preparation method thereof and display device |
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