JP2001216611A - Manufacturing method of recording/reproducing separation type magnetic head, and recoridng/ reproducing separation type magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a coil with good accuracy regarding a recording/reproducing separation type magnetic head having a magnetic circuit miniaturized to realize a high transfer speed. SOLUTION: In the method for manufacturing a recording/reproducing separation type magnetic head having lower and upper magnetic poles placed oppositely to each other by sandwiching a gap layer in a magnetic recording surface side to constitute a magnetic circuit, an insulating material provided between the lower and upper magnetic poles, and a coil film formed in a groove provided in the insulating material, at least in the step of forming the coil, the insulating material is covered with a polishing stopper film, a coil is formed in the groove provided in the non-magnetic insulating material, and the coil is polished to expose the polishing stopper film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a read / write separated magnetic head, and more particularly to a write head of a magnetoresistive effect type magnetic head having a lower magnetic pole, a magnetic gap layer, a coil and an upper magnetic pole layer formed on a substrate. About.

[0002]

2. Description of the Related Art A recording / reproducing separated magnetic head is a head provided with a recording head portion and a reproducing head portion separated from each other.
MR heads, GMR heads, TMR heads and the like are known. As one configuration of the recording head section, a gap layer is provided between the film-shaped lower magnetic pole and the upper magnetic pole, the upper magnetic pole and the lower magnetic pole are magnetically connected, and a coil layer is formed around the connection between the upper magnetic pole and the lower magnetic pole. There is known a thin film magnetic head which is provided and covers an upper magnetic pole with a protective layer.

FIG. 7 is an enlarged schematic diagram of a recording / reproducing separation type magnetic head provided on an end face of a slider. The separate read / write magnetic head includes a write head unit 110 and a read head unit 210 on a substrate 1 covered with an insulating film 2. The recording head unit 110 is configured by arranging a lower magnetic pole 15 and an upper magnetic pole 16 so as to face each other with a gap layer 18 interposed therebetween, and winding a coil 17 therebetween. In addition, the reproducing head section 210 is configured by disposing the reproducing element 14 between the lower shield 3 and the upper shield 15 (in the figure, the structure is also used as the upper shield and the lower magnetic pole). Further, the recording head unit and the reproducing head unit are connected to the outside via the lead-out terminal 19 and the terminal 11. The recording head and the reproducing head are made of a non-magnetic material 12 such as alumina.
It is protected by covering the whole. The substrate 1 has a floating surface or the like and serves as a slider.

Further, the recording / reproducing separation type magnetic head will be described simply as a magnetic head. For recording on a magnetic recording medium, a magnetic circuit is formed by a lower magnetic pole, a magnetic recording medium, and an upper magnetic pole, with a tip surface of a gap layer of a magnetic head facing the magnetic recording medium, and a magnetic field change generated by a coil is formed on the magnetic circuit. We go using. In the following description,
Only the recording head portion is mainly shown, and the reproducing head portion is omitted.

As a method of making the width of the lower magnetic pole equal to the width of the upper magnetic pole, a method in which a part of the lower magnetic pole 15 is cut by ion milling using the upper magnetic pole 16 as a mask to have the same track width is disclosed in Japanese Patent Laid-Open No. 10-143817. It is described in. Such a configuration is shown in the schematic diagram of FIG. FIG. 8A is a plan view of the magnetic head as viewed from the medium facing surface. A reproducing element 14 provided between the lower shield 3 and the upper shield 15 with an insulating film interposed therebetween, an upper magnetic pole 16 formed to have the same track width, a gap layer 18, and a projection having the same width as the gap layer. An upper shield 15 is provided.
FIG. 8B is a cross-sectional view taken in a direction perpendicular to the medium facing surface. The reference numerals in this cross-sectional view are the same as those in FIG.

[0006]

As the recording density increases, it is required to increase the data transfer speed of the magnetic head. To increase the data transfer speed, it is necessary to increase the rotation speed of the magnetic recording medium and increase the recording frequency of the magnetic head. 5400 to increase data transfer speed
The number of rotations has increased from rpm to more than 10,000 rpm. Accompanying this, the recording frequency was changed from 200 MHz to 50
A frequency exceeding 0 MHz is required.

To realize a high transfer speed, it is necessary to reduce the size of the magnetic circuit and reduce the inductance. In order to reduce the inductance, the coil is packed in a small area in order to reduce the number of turns of the coil and to reduce the size of the magnetic circuit. In the conventional plating method, a plating film is formed in a frame formed of a resist. However, when the size of the frame is reduced, the following problems occur, and it is difficult to accurately form the coil. A resist made of an organic material has insufficient strength, and there is a problem that the frame itself is distorted when the resist is made smaller than the current state. Therefore, a method of forming a frame with a stronger material, forming a plating film on the frame, and then polishing the plating film to make the plating film flat was studied.
However, in this method, it is difficult to set the dimensions when the plating film is polished, and the dimensional accuracy of the coil may be reduced due to excessive shaving.

Accordingly, the present invention solves the above-mentioned conventional problems and provides a method of manufacturing a recording / reproducing separation type magnetic head in which a coil is formed with high precision when the coil is formed by plating and then polished. It is an object of the present invention to provide a read / write separated magnetic head obtained by the method.

[0009]

A method of manufacturing a read / write separated magnetic head according to the present invention comprises a lower magnetic pole and an upper magnetic pole which constitute a magnetic circuit by being opposed to each other with a gap layer therebetween on a magnetic recording surface side. A method for manufacturing a separate read / write magnetic head having an insulating material (preferably a non-magnetic insulating material) provided between a lower magnetic pole and an upper magnetic pole and a coil formed in a groove provided in the insulating material. At least, the step of forming the coil includes coating the insulating material with a polishing stopper film, forming a coil in a groove provided in the insulating material, polishing the coil, and polishing the polishing stopper film. Is exposed.

Another method of manufacturing a separate read / write magnetic head according to the present invention comprises a lower magnetic pole and an upper magnetic pole which constitute a magnetic circuit by being opposed to each other with a gap layer therebetween on a magnetic recording surface side. A method for manufacturing a read / write separated magnetic head having a non-magnetic insulating material provided between magnetic poles and a coil formed in a groove provided in the non-magnetic insulating material, comprising: Providing an insulating material to the
Forming a stopper film for polishing on the upper surface of the insulating material, forming a groove for embedding a coil in the insulating material, and forming the underlying film for plating on the insulating material, Forming a copper plating film on the ground film by electroplating; polishing the copper plating film to expose a polishing stopper film to obtain a coil; removing the polishing stopper film; And providing a step of providing the upper magnetic pole to the upper magnetic pole.

According to another method of manufacturing a recording / reproducing separation type magnetic head of the present invention, a lower magnetic pole and an upper magnetic pole which constitute a magnetic circuit by being opposed to each other with a gap layer therebetween on a magnetic recording surface side are provided. A magnetic pole portion, a magnetic pole column, and a yoke portion, a coil held by an insulating material between the magnetic pole portion and the magnetic pole column, wherein the yoke portion has the same height on the upper surface of the magnetic pole portion and the upper surface of the magnetic pole column. A magnetic recording / reproducing separation type magnetic head which is magnetically connected by polishing the coil, the insulating material, the magnetic pole portion and the magnetic pole column simultaneously by chemical mechanical polishing (CMP) processing, and polishing each upper surface. It is characterized by being formed on substantially the same surface.

In the method of the present invention, the polishing stopper film may be made of a material selected from at least one of tantalum and silicon nitride.
Further, the polishing stopper film is a two-layer film including a first layer and a second layer, and the first layer is formed of nickel, chromium, copper,
A film composed of at least one of tantalum,
The second layer is silicon nitride, tantalum nitride, titanium nitride,
It can be a film made of at least one of titanium and tantalum. Further, in the manufacturing method of the present invention, the groove of the insulating material can be formed by plasma dry etching.

In the conventional method, a coil pattern is formed of photoresist, a coil is formed by electroplating, the photoresist of the coil pattern is removed, a plating seed film is removed, and a coil interlayer insulating material is filled. 1.3 μm height, 0.8 μm width in coil cross-sectional dimension, 0.
A high-density coil of about 4 μm is difficult to manufacture for the following reasons. The first reason is that 0.4 μm width and 1.3 μm
It is difficult to form the above photoresist pattern. Second, it is difficult to remove the plating seed film at the bottom of 0.4 μm width and 1.3 μm depth by ion milling and chemical etching. Third, 0.4 μm width and 1.
This is because it is difficult to fill the groove having a depth of 3 μm with the photoresist.

According to the coil formation of the present invention, since the photoresist frame is formed of a nonmagnetic insulating material such as alumina, a high-density coil having the above dimensions can be realized.
Accordingly, the front and rear lowermost insulating materials 39 and 40 are preferably made of alumina. In the plasma dry etching, there are ion milling and chemical etching, but there is a problem that neither of them can form a nearly vertical groove.
When forming grooves in the front and rear lowermost insulating materials 39 and 40 of alumina, one method of plasma dry etching, I, is used.
CP (Inductively Coupled Pl)
asma). By using a mixed gas containing boron chloride (BCl ₃ ) and chlorine gas (Cl ₂ ) as main components as an etching gas, a substantially vertical groove can be formed. By using alumina as the lowermost insulating material, the thermal conductivity is higher than that of the conventional photoresist, so that heat generated from the coil can be efficiently released to the outside.

The front and rear lowermost coils 4 of the present invention
2, 43, the upper surfaces of the front and rear lowermost coils are substantially flush with the front and rear lowermost insulating materials 39, 40. , It is necessary to insulate the upper surfaces of the front and rear lowermost coils 45 and 46. Since the portion of the rear lowermost coil 43 closest to the magnetic pole 41 is a portion for connecting the upper and lower coils, this portion does not include the upper and lower coil insulators 44. As long as the upper and lower coil insulating materials 44 are non-magnetic insulating materials, a photoresist baked material or a ceramic such as alumina may be used, but it is preferable to use alumina having high thermal conductivity.

The upper coil is formed by patterning a photoresist into a coil shape and forming a coil by electroplating. The reason why the method of forming the front and rear lowermost coils 42 and 43 is not adopted is as follows. The first reason is
That is, the shape of the substantially inverted U-shaped yoke portion 50 can be easily formed. In particular, it is important for the magnetic domain of the yoke 50 to be controlled that a smooth curved surface is formed between the connection between the magnetic pole portion 38 and the magnetic pole 41 and the flat portion on the coil. The simplest method is to use a surface that is softened and naturally formed when the photoresist is baked. The second reason is
This is because the upper surface of the rear upper coil 46 is higher than the upper surface of the rear upper insulating material 48 and direct contact with the protective film 51 is advantageous in terms of heat radiation. The third reason is that the upper surface of the front upper coil is covered with the front cap insulating material 49 and the yoke 50
This is because it is necessary to ensure insulation between the front and rear upper coils 45 and 46.

The front and rear upper coils 45 and 46 are formed by forming a non-magnetic metal by electroplating, removing the photoresist, and removing the electroplating seed film by ion milling, chemical etching, or the like. The upper-layer coil has a smaller number of coil turns than the lower-layer coil, so that the coil pitch can be increased. Therefore, the conventional method can be used. Front and rear upper insulating materials 47, 4
8 can be formed by filling a photoresist. However, since the photoresist also adheres to the upper surfaces of the front and rear upper coils 45 and 46, at least the front and rear upper coils 4 are baked using a plasma asher, a plasma dry etcher, or ion milling after baking.
It is preferable that the upper surfaces of the upper and lower insulating materials 5 and 46 are flush with or protrude from the upper surfaces of the front and rear upper insulating materials 47 and 48. The front upper layer coil 45 is formed by baking and hardening a front cap insulating material 49 to secure insulation from the yoke part 50.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a read / write separated magnetic head obtained according to the present invention. The method of manufacturing the read / write separated magnetic head will be described in detail with reference to cross-sectional views in the manufacturing steps of FIGS. (A) to (h) in FIG. 2 show a manufacturing process of the lower magnetic pole and the gap apex. (A) to (d) in FIG.
Is a manufacturing process of a magnetic pole part and a magnetic pole column. FIG. 3 (e)
4 (h) and 4 (a) to 4 (c) show a coil manufacturing process. FIGS. 5A to 5H show the steps of manufacturing the upper coil, the yoke, and the protective film. In each of the drawings, only the recording head unit is shown, omitting the description of the reproducing head unit. For the sake of clarity, the same reference numerals as in FIG. 1 are used as much as possible.

First, the configuration of the recording / reproducing separation type magnetic head will be described with reference to FIG. As shown in FIG. 1, the upper magnetic pole includes a magnetic pole portion 38 and a magnetic pole column 41 which are separated from each other, and a yoke portion 50 for magnetically coupling the magnetic pole portion 38 and the magnetic pole portion 38. In the gap layer 35
On the lower magnetic pole 34 below the gap layer 35. The yoke portion 50 is magnetically coupled at the same height on the upper surface of the magnetic pole portion 38 and the upper surface of the magnetic pole column 41. The gap depth of the conventional magnetic head is 250 to 250 nm using a non-magnetic insulating material provided mainly to cover the coil, mainly using a photoresist.
It was baked and cured at 300 ° C., and the top of the gap depth (hereinafter referred to as gap apex) was determined by the shape of the end. The present invention is characterized in that the gap apex is positioned by a projection provided on the lower magnetic pole.

Lower magnetic pole 3 with gap apex
Reference numeral 4 denotes two layers made of magnetic materials having different magnetic properties. The second lower magnetic pole layer 33 located on the gap layer side includes:
It is preferable that the saturation magnetic flux density is higher than that of the first lower magnetic pole layer 32 located on the reproducing element side. For example, the second lower magnetic pole layer 33 is made of a NiFeCo alloy (Ni 10 to 50 wt%, F
e, a material having a saturation magnetic flux density of 1.8 to 1.9 (T) such as 15 to 40 wt% and Co of 25 to 80 wt%, and the first lower magnetic pole layer 32 is made of a NiFe alloy (Ni 40 to 6).
A material having a saturation magnetic flux density of 1.5 to 1.6 (T), such as 0 wt% and Fe 60 to 40 wt%. The first lower magnetic pole layer 32 preferably has a higher electric resistance ρ than the second lower magnetic pole layer 33. The reason why a material having a higher saturation magnetic flux density than that of the first lower magnetic pole layer 32 is used for the second lower magnetic pole layer 33 is to provide a recording magnetic field sufficient for magnetization of a magnetic recording medium having a high coercive force.

The first and second lower magnetic pole layers 33 and 34 of the lower magnetic pole 34 can be formed by plating or sputtering. A magnetic material that is easily electroplated such as a NiFe alloy is formed by plating, and a magnetic material that is difficult to electroplate such as a CoTaZr alloy is formed by sputtering. Here, it is important that after the first lower magnetic pole layer 32 is formed, it is not exposed to the air before the second lower magnetic pole layer 33 is formed. First lower pole layer 3 by electroplating
When No. 2 is formed, plating for forming the second lower magnetic pole layer 33 is started in a state where the surface is wetted with pure water or the like without drying. In the case of sputtering, after the first lower magnetic pole layer 32 is formed, the second lower magnetic pole layer 32 is exposed to the atmosphere by breaking the vacuum of the sputter device so that the surface of the first lower magnetic pole layer 32 is not oxidized. It is important to form the pole layer 33. First lower pole layer 32 and second lower pole layer 3
This is because if an oxide layer is formed on the junction boundary of No. 3, the magnetic resistance increases and the recording characteristics of the magnetic head deteriorate.

The portion where the second lower magnetic pole layer 33 is cut is filled with a nonmagnetic insulating material having an electric resistance of 10 ³ to 10 ¹⁰ (Ω-cm). Examples of the filling insulating material 52 include oxides such as aluminum and silicon, carbides, nitrides, and the like. It is necessary that at least a material having a higher thermal conductivity than a photoresist is good and that it can be filled by sputtering. As will be described in detail in the next section, it is an important condition for forming a gap apex that filling by sputtering can be performed.

A front lowermost insulating material 39 and a rear lowermost insulating material 40 are formed so as to surround the magnetic pole portion 38 and the magnetic pole column 41, and an ICP (Inductively Coupled) is formed.
Using a dry etching apparatus such as dPlasma), a groove for forming the front and rear lowermost coils 42 and 43 is formed in the insulating material, and the groove is filled with a non-magnetic metal by electroplating or sputtering. Front and rear lowermost coils 4 by chemical mechanical wrap (CMP)
2, 43 upper surface, front and rear lowermost insulating materials 39, 40
, The upper surface of the magnetic pole portion 38, and the upper surface of the magnetic pole column 41 are formed substantially in the same plane. At this time, a polishing stopper film is formed on the front lowermost insulating material 39 and the rear lowermost insulating material 40 (not shown in FIG. 1).

Using CMP, the upper surfaces of the front and rear lowermost coils 42, 43 and the front and rear lowermost insulating materials 39, 4
Forming the upper surface of the magnetic pole portion 38, the upper surface of the magnetic pole portion 38, and the upper surface of the magnetic pole column 41 in substantially the same plane has the following advantages. The magnetic pole portion and the magnetic pole column are made of NiFe-based, NiFeCo-based metal material,
The coil is made of a metal material with low electrical resistance, such as copper, aluminum, gold, silver, etc., and the front and rear lowermost insulating materials are ceramics such as alumina. With the wrap solution dissolved in the solution,
This is because the unevenness is dragged when the upper layer coil is formed due to the unevenness. The grooves formed in the front and rear lowermost insulating materials 39 and 40 may be formed up to the filling insulating material 52. It goes without saying that the reaching of the groove to the lower magnetic pole layer 34 is a problem because insulation cannot be obtained.

As a method of forming the front and rear lower coils 42 and 43 by digging grooves in the front and rear lowermost insulating materials 39 and 40, electroplating and sputtering can be considered. Materials having low electric resistance include copper, aluminum, gold, silver and the like. Other than aluminum, it can be formed by electroplating or sputtering, but aluminum cannot be formed by electroplating, so there is no choice but to use sputtering or vacuum evaporation. In any case, even if these metals are formed not only in the groove but also on the upper surfaces of the front and rear lowermost insulating materials 39 and 40 constituting the groove, and even if the coils are short-circuited to each other. It doesn't matter. These front and rear lowermost insulating materials 3
This is because a portion where the metal or the coil attached to the upper surfaces of the components 9 and 40 is short-circuited next to each other can be removed by the CMP wrap.

Next, a method of manufacturing the lower magnetic pole and the gap apex will be described with reference to FIGS. First,
The first lower magnetic pole layer 32 and the second lower magnetic pole layer 33 were formed on the substrate on the reproduction side in the same sputtering apparatus. Here, illustration of the substrate and the reproducing side is omitted. The first lower magnetic pole layer 32 is made of NiFe (Ni 40 to 60 wt%, F
e, the second lower magnetic pole layer 33 is made of a NiFeCo alloy (Ni, 10 to 50 wt%, Fe
15 to 40 wt%, Co 25 to 80 wt%). The saturation magnetic flux density of the first lower magnetic pole layer 32 is 1.55
As (T), the electric resistance was 55 (μΩ-cm).
The saturation magnetic flux density of the second lower magnetic pole layer 33 was set to 1.8 (T), and the electric resistance was set to 28 (μΩ-cm). In the present embodiment, the film is formed using a sputtering apparatus, but it is also possible to use electroplating.

Although not shown in FIG. 2, a heat-dissipating nonmagnetic metal 31 is formed on the lower magnetic pole layer 34 on the side opposite to the ABS to eliminate the step of the lower magnetic pole layer 34. The heat-dissipating non-magnetic metal 31 not only eliminates the step on the anti-ABS side of the lower magnetic layer, but also has the effect of dissipating heat generated from the coil and the magnetic circuit.

A mushroom-type photoresist 53 is formed at a portion where the magnetic pole portion 38 and the magnetic pole column 41 are connected (FIG. 2).
b). Ion milling was performed using an ion milling device until the second lower magnetic pole layer 33 was removed (FIG. 2).
c). At least the second lower magnetic pole layer 33 needs to be removed, and a part of the first lower magnetic pole layer 32 may be removed. By rotating the substrate 1 on which the magnetic head is formed and tilting the substrate with respect to the ion incident direction,
The end of the second lower magnetic pole layer 33 is not formed vertically, but has an inclined shape. This tilt angle can be controlled by the size of the mushroom-type photoresist 53 and the substrate rotation angle. In this embodiment, the tilt angle is set to 45 degrees.

With the mushroom-type photoresist 53 remaining, an alumina-filled insulating material 52 was coated by sputtering (FIG. 2D). The filling insulating material 52 is formed not only on the upper surface of the mushroom-type photoresist 53 and the recessed portion of the second lower magnetic pole layer 33 but also under the shade of the mushroom-type photoresist 53 to form a film. However, mushroom type photoresist 5
It is important that the film is not formed up to the root of the third stem. The mushroom-type photoresist 53 is commonly used for removing the second lower magnetic pole layer 33 and forming the filling insulating material 52, so that the slope of the second lower magnetic pole layer 33 and the bulging portion of the end of the filling insulating material 52 are formed. Are self-aligned, and the gap apex 36 is formed with high accuracy. Fill insulation 52
Was set at 10 to 20 °.

Next, the mushroom type photoresist 53 was removed with an organic solvent (FIG. 2E). The filling insulating material 52 formed on the upper surface of the mushroom type photoresist 53 could be removed at the same time.

A photoresist 54 was formed on the portion where the pole pole 38 was to be formed (FIG. 2F). Alumina to be the gap layer 35 was formed by sputtering (FIG. 2-g). The photoresist 54 was removed with an organic solvent to leave a gap layer 35 on the lower magnetic pole 34 (FIG. 2H). For the gap layer 35, alumina as a non-magnetic material was used.
Since the gap layer was formed on the gap apex, the effective gap apex was at the point 37 shown in FIG.

Next, the steps of manufacturing the magnetic pole portion 38 and the magnetic pole column 41 will be described with reference to FIGS. With respect to the configuration shown in FIG. 2H, the magnetic pole portion 38 and the magnetic pole column 41 were formed by electroplating. A magnetic pole portion 38 was provided on the portion on the air bearing surface side of the second lower magnetic pole layer 33 via a recording gap, and a magnetic pole column 41 was directly joined to a portion of the second magnetic pole layer 33 to be a back contact. The plating film composition used was the same NiFeCo-based magnetic alloy as that of the second lower magnetic pole layer 33. At the time of forming a resist frame for electroplating, the magnetic pole portion having a track width of 0.8 μm is exposed with a resist using a 1: 5 reduction exposure machine of a stepper to obtain a track width of 0.5 μm.
For the magnetic pole portion of m, the resist was directly exposed using an electron beam (EB) machine. Regardless of the track width, the manufactured magnetic heads could all be kept within ± 5% of the track width nominal.

Subsequently, track trimming of the magnetic pole portion 38 was performed using an RIE apparatus. After the portion other than the track trimming was covered with the mask 52a, the lower magnetic pole was removed to a depth at which the second lower magnetic pole layer 33 was removed at least in the vicinity of the track width (FIG. 3-B). At this time, the magnetic pole portion 38 serving as a mask covering the track region of the lower magnetic pole is
It is cut to the height of the dotted line 38b. As an etching gas, a mixed gas mainly containing boron chloride (BCl ₃ ) and chlorine gas (Cl ₂ ) was used. By performing track trimming by RIE, as shown in FIG.
The thickness t2 is 95% of 1, and the uniformity of the thickness of the lower magnetic pole 34 is improved as compared with the conventional track trimming using ion milling.

After the filling insulating material 52 is sputtered (FIG. 3)
-B), the front lowermost insulating material 39 and the rear lowermost insulating material 40, which have been subjected to the CMP processing to the size indicated by the broken line AA ′ to flatten the filling insulating material, and the magnetic pole portion 38 and the magnetic pole column 41 A polished surface having the same upper surface was obtained (FIGS. 3C and 3D).

A tantalum film 55a having a thickness of 0.1 μm was formed by sputtering on the front surface of the polished surface including the upper surfaces of the magnetic pole portions 38 and the magnetic pole columns 41 (FIG. 3E). A photoresist was applied thereon, and patterning was performed in order to dig a groove for providing the front and rear lowermost coils 42 and 43, thereby obtaining a photoresist frame 55 (FIG. 3F). This frame 5
A groove was formed in the front lowermost insulating material 39 and the rear lowermost insulating material 40 by etching using No. 5 as a mask. (FIG. 3-g).
First, an ICP (Inductively-Carrying) using a fluorine-based etching gas to etch a Ta film is used.
plasma dry etching by combined plasma). After penetrating the Ta film, the etching gas was exchanged and the next etching was performed. Since alumina was used for the front and rear lowermost insulating materials 39 and 40, boron chloride (BCl 3) was used as the etching gas for the plasma dry etching. ₃ ) and a mixed gas of chlorine gas (Cl ₂ ) was used. The depth of the groove was 1.5 μm, the width was 0.8 μm, and the groove pitch was 1.2 μm. After the plasma dry etching was completed, the photoresist 55 was removed by a plasma asher process and an organic solvent process, and the front and rear lowermost insulating materials 39 and 40 were formed in a comb shape. The upper surfaces of these comb teeth were covered with a Ta film (FIG. 3).
h).

As a method of filling the grooves with a non-magnetic metal to be the front and rear lowermost coils 42 and 43, there are electroplating and sputtering. When the height of the coil exceeds 1 μm, electroplating is advantageous from the viewpoint of film forming speed. In this embodiment, electroplating of copper was performed. The seed film for electroplating may be formed only on the bottom of the groove, but the seed film is formed on the entire surface to simplify the process. Therefore, the copper film 42a was also electroplated on the upper surfaces of the front and rear lowermost insulating materials 39, 40 and the magnetic pole portion 38 and the pole column 41 (FIG. 4A). It is easy to see that the same is true even with a sputter. Next, the Ta film was exposed to the portion indicated by the broken line BB ′ to expose the Ta film, and copper films were formed on the coils 42 and 43 (FIG. 4B). Since the Ta film 55a, which is harder than the copper film 42a, has a lower CMP polishing rate, it functions substantially as a polishing stopper film. Furthermore, Ta
The film 55a also functions as a protective film for preventing the magnetic pole portion of CoNiFe from being corroded by the polishing slurry. Next, in order to form the upper surface of the magnetic pole part and the front and rear lowermost insulating materials, the front and rear lowermost coils, and the upper surfaces of the pole columns on the same surface, plasma dry etching was performed at a depth of about 0.2 μm. The Ta film 55a is removed, and the coil height is 1.3 μm.
m and a coil having a width of 0.8 μm were obtained (FIG. 4-c). In addition,
The cross-sectional dimension of the coil is the front lowermost layer coil 42, and the width and pitch of the rear lowermost coil 43 are designed to be large. If a method of selectively etching only the Ta film is used instead of the plasma dry etching, the upper surfaces of the front and rear lowermost coils are likely to slightly project. In plasma dry etching, the coil surface tends to be slightly dented. In order to adjust the conditions to obtain a flat surface with suppressed irregularities, it is preferable to use plasma dry etching. Note that it is also possible to achieve flattening by another method.
That is, at the time of the CMP processing of FIG. 4B, the polishing is performed so that the polished surfaces (referred to as coil surfaces) of the front lowermost layer coil 42 and the rear lowermost layer coil 43 are offset from the surface of the Ta film 55a. The depth do of this offset is set to be equal to or less than the thickness dt of the Ta film (FIG. 4-b2). When the Ta film is removed by plasma dry etching after providing this offset, C
The step between the -C 'plane and the coil plane can be made sufficiently small. When dt ≒ do, the Ta film 55a is more easily planarized by removing the Ta film 55a by selective etching.

When the upper surfaces of the front and rear lowermost coils 42 and 43 are exposed, the front and rear upper coils 45 and 46 cannot be formed as they are. Therefore, the upper and lower coil insulators 44 were formed so as to exclude the point where the upper and lower coils were connected in series (FIG. 5A). The upper and lower coil insulators 44 may be non-magnetic insulators. Photoresist was used as a material for easily forming the end shape of the upper and lower coil insulating materials into a gentle curved surface. After patterning the photoresist, it was cured by baking (heat treatment) at 230 ° C. When it is not necessary to make the ends of the upper and lower coil insulating members 44 have a gentle curved surface, it is preferable to use alumina having good heat conductivity.

The front and rear upper coils 45 and 46 are formed by forming a frame for obtaining a coil pattern with a photoresist 57 conventionally used, and forming copper in the frame by electroplating. . Subsequently, the frame is removed with an organic solvent to remove the front and rear upper coils 45 and 4.
6 was obtained (FIGS. 5-b-d).

A photoresist was filled around the front and rear upper coils 45 and 46, and baked at 230 ° C. to form front and rear upper insulating materials 47 and 48 (FIG. 6E). The front and rear upper insulating materials 47 and 48 do not cover the entire gap between the coils, but cover only about 2/3 of the coil height. However, since the resist also adhered to the upper surface of the coil, the photoresist adhered to the upper surface of the coil was removed using an asher. In the present embodiment, the rear upper-layer insulating material 48 is also added to the rear upper-layer coil 46. However, if the rear upper-layer coil pitch is large and the alumina of the protective film 51 can completely fill the space between the rear upper-layer coils 46, the rear upper-layer insulating It is not necessary to provide the member 48. The formation of the rear upper insulating material 48 to about ／ of the coil height may be performed only when there is a possibility that the alumina of the protective film 51 may not completely fill the rear upper coil 46.

Since the upper surface of the front upper coil 45 is exposed, the yoke 50 cannot be formed in this state. Therefore,
The front cap insulation 49 was covered. The front cap insulating material 49 was obtained by baking and curing the photoresist at 230 ° C. (FIG. 5F).

The yoke section 50 employs a method in which a yoke frame pattern is formed from a conventionally used photoresist and a magnetic film is formed by electroplating. In the present embodiment, the same NiFe-based alloy as that of the first lower magnetic pole layer 32 was used as a material for forming the yoke portion 50 (FIG. 5G).
By forming the yoke portion 50, the magnetic pole portion 38 and the yoke portion 50, the magnetic pole column 41, and the lower magnetic pole 34 are connected to form a magnetic circuit.

After the yoke portion 50 is formed, although not shown in the drawing, a lead-out terminal 1 for electrical connection to the outside is provided.
1 was formed, and a protective film 51 was formed on the entire surface by sputtering (FIG. 5H).

As described above, in the steps shown in FIGS. 2A to 5H, the lower magnetic pole of the present invention is composed of two layers of magnetic material, and the gap apex is formed by the convex portion of the lower magnetic pole. The second lower magnetic pole layer is formed to have the same width as the magnetic pole portion width (track width), the magnetic pole portion, the lowermost coil, and the magnetic pole column are formed on the same surface, and at least the upper surface of the rear upper coil is directly in contact with the protective film. A contacting recording head was formed.

[0044]

As described above, according to the present invention,
A narrow track width can be provided, the gap depth can be easily controlled, and coils and the like having high heat dissipation can be highly integrated. As a result, it is possible to reduce the size of the recording / reproducing separated magnetic head, to increase the capacity, and to increase the transfer speed.

[Brief description of the drawings]

FIG. 1 is a sectional view of a read / write separated magnetic head according to the present invention.

FIG. 2 is a process chart of one embodiment of the present invention.

FIG. 3 is a process chart of one embodiment of the present invention.

FIG. 4 is a process chart of one embodiment of the present invention.

FIG. 5 is a process chart of one embodiment of the present invention.

FIG. 6 is a schematic perspective view of one configuration of a read / write separated magnetic head.

7A and 7B are a plan view and a cross-sectional view of a conventional magnetic head viewed from a medium facing surface.

[Explanation of symbols]

Reference Signs List 1 substrate, 2 alumina, 3 lower shield, 11 lead terminal, 12 protective film, 14 reproducing element, 15 upper shield and lower magnetic pole, 16 upper magnetic pole, 17 coil, 18 gap layer, 19 terminal, 21 upper magnetic pole,
22 lower magnetic pole, 23 yoke, 110 recording head part, 210 reproducing head part, 30 upper shield, 31
Non-magnetic metal for heat dissipation, 32 1st lower magnetic pole layer, 33 2nd lower magnetic pole layer, 34 lower magnetic pole, 35 gap layer, 3
6 gap apex, 37 effective gap apex, 38 magnetic pole part, 38b line from which the magnetic pole part is cut off, 39 front lowermost insulating material, 40 rear lowermost insulating material, 41 magnetic pole pillar, 42 front lowermost coil, 42a
Copper film, 43 rear lowermost coil, 44 upper coil insulating layer, 45 front upper coil, 46 rear upper coil, 4
7 front upper insulating material, 48 rear upper insulating material, 49 front cap insulating material, 50 yoke part, 51 protective film, 5
2 Filled insulating material, 52a mask, 53 mushroom type photoresist, 54, 55 photoresist frame,
55a Ta film, 57 photoresist

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5D033 BA41 BB43 CA05 DA01 DA04 DA08 5D034 BA02 BB12

Claims (7)

[Claims] An insulating material provided between a lower magnetic pole and an upper magnetic pole, comprising a lower magnetic pole and an upper magnetic pole which constitute a magnetic circuit by being opposed to each other with a gap layer therebetween on a magnetic recording surface side;
A method for manufacturing a read / write separated magnetic head having a coil formed in a groove provided in the insulating material,
At least the step of forming the coil covers the insulating material with a polishing stopper film, forms a coil in a groove provided in the non-magnetic insulating material, and polishes the coil to form a polishing stopper film. A method for manufacturing a read / write separated magnetic head, comprising exposing the magnetic head. 2. An insulating material comprising: a lower magnetic pole and an upper magnetic pole that constitute a magnetic circuit by being opposed to each other with a gap layer therebetween on a magnetic recording surface side; and an insulating material provided between the lower magnetic pole and the upper magnetic pole;
A method for manufacturing a read / write separated magnetic head having a coil formed in a groove provided in the insulating material,
Providing an insulating material on the lower magnetic pole, forming a polishing stopper film on the upper surface of the insulating material, and forming a groove for burying a coil in the insulating material;
Forming a copper plating film by electroplating on the underlying film after providing a plating underlying film on the insulating material, and obtaining a coil by polishing the copper plating film to expose a polishing stopper film; and And removing the polishing stopper film; and providing the upper magnetic pole on the coil. 3. A magnetic recording surface comprising: a lower magnetic pole and an upper magnetic pole which are opposed to each other with a gap layer therebetween to form a magnetic circuit, wherein the upper magnetic pole comprises a separated magnetic pole portion, a magnetic pole column and a yoke portion, respectively. A magnetic recording / reproducing separation type magnetic head having a coil held by an insulating material between the magnetic pole portion and the pole column, wherein the yoke portion is magnetically connected at the same height on the upper surface of the magnetic pole portion and the upper surface of the pole column. Wherein the coil, the insulating material, the magnetic pole portion, and the magnetic pole column are simultaneously polished by a chemical mechanical polishing (CMP) process so that respective upper surfaces are substantially flush with each other. Manufacturing method of a magnetic head. 4. The method of manufacturing a read / write separated magnetic head according to claim 1, wherein the polishing stopper film is made of a material selected from at least one of tantalum and silicon nitride. A method for manufacturing a separate read / write magnetic head. 5. The method according to claim 1, wherein the polishing stopper film is a two-layer film including a first layer and a second layer. One layer is a film composed of at least one of nickel, chromium, copper, and tantalum, and the second layer is a film composed of at least one of silicon nitride, tantalum nitride, titanium nitride, titanium, and tantalum. A method for manufacturing a separate read / write magnetic head. 6. The method for manufacturing a read / write separation type magnetic head according to claim 1, wherein said groove of said non-magnetic insulating material is formed by plasma dry etching. Manufacturing method of a magnetic head. 7. A recording / reproducing separation type magnetic head manufactured by the manufacturing method according to claim 1.