JP2001215714A5 - - Google Patents

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Publication number
JP2001215714A5
JP2001215714A5 JP2000025548A JP2000025548A JP2001215714A5 JP 2001215714 A5 JP2001215714 A5 JP 2001215714A5 JP 2000025548 A JP2000025548 A JP 2000025548A JP 2000025548 A JP2000025548 A JP 2000025548A JP 2001215714 A5 JP2001215714 A5 JP 2001215714A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2000025548A
Other languages
Japanese (ja)
Other versions
JP2001215714A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000025548A priority Critical patent/JP2001215714A/en
Priority claimed from JP2000025548A external-priority patent/JP2001215714A/en
Publication of JP2001215714A publication Critical patent/JP2001215714A/en
Publication of JP2001215714A5 publication Critical patent/JP2001215714A5/ja
Abandoned legal-status Critical Current

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JP2000025548A 2000-02-02 2000-02-02 Radiation sensitive resin composition Abandoned JP2001215714A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000025548A JP2001215714A (en) 2000-02-02 2000-02-02 Radiation sensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000025548A JP2001215714A (en) 2000-02-02 2000-02-02 Radiation sensitive resin composition

Publications (2)

Publication Number Publication Date
JP2001215714A JP2001215714A (en) 2001-08-10
JP2001215714A5 true JP2001215714A5 (en) 2005-12-22

Family

ID=18551395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000025548A Abandoned JP2001215714A (en) 2000-02-02 2000-02-02 Radiation sensitive resin composition

Country Status (1)

Country Link
JP (1) JP2001215714A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295937B2 (en) * 2000-12-05 2009-07-15 株式会社Kri Active ingredient and photosensitive resin composition using the same
JP4534371B2 (en) * 2001-03-16 2010-09-01 Jsr株式会社 Radiation sensitive resin composition
JP2003186198A (en) * 2001-12-19 2003-07-03 Sony Corp Resist material and exposure method
JP2003186197A (en) * 2001-12-19 2003-07-03 Sony Corp Resist material and exposure method
JP3758669B2 (en) 2003-10-07 2006-03-22 日立化成工業株式会社 Radiation curable composition, storage method thereof, cured film forming method, pattern forming method, pattern using method, electronic component and optical waveguide
EP1672426A4 (en) 2003-10-07 2010-02-24 Hitachi Chemical Co Ltd Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide
JP4488215B2 (en) 2004-08-19 2010-06-23 信越化学工業株式会社 Resist composition and pattern forming method using the same
JP2006106311A (en) 2004-10-05 2006-04-20 Shin Etsu Chem Co Ltd Silicon-containing resist composition and method for forming pattern by using the same
JP4626758B2 (en) 2005-07-07 2011-02-09 信越化学工業株式会社 Silicon compound and silicone resin having fluorine-containing cyclic structure, resist composition using the same, and pattern forming method
JP4600678B2 (en) 2006-02-13 2010-12-15 信越化学工業株式会社 Resist composition and pattern forming method using the same
JP4687898B2 (en) 2006-03-14 2011-05-25 信越化学工業株式会社 Fluorine-containing silicon compound, silicone resin, resist composition using the same, and pattern forming method
JP4844695B2 (en) * 2010-04-28 2011-12-28 Jsr株式会社 Positive-type radiation-sensitive composition for discharge nozzle type coating method, interlayer insulating film for display element and method for forming the same

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